Power electronic component substrate packaging device

Abstract

The invention provides a power electronic component substrate packaging device, and relates to the technical field of substrate packaging equipment. The power electronic component substrate packaging device comprises supporting legs, the top ends of the multiple supporting legs are fixedly connected with a supporting plate, a clamping and positioning mechanism is arranged at the position, close to the center, in the multiple supporting legs, a pushing mechanism is arranged at the bottom end of the clamping and positioning mechanism, a packaging mechanism is arranged at the top end of the supporting plate, and the supporting plate is fixedly connected with the supporting plate. The clamping and positioning mechanism comprises a bottom plate, and first motors are arranged on the two sides of the outer wall of the bottom plate correspondingly. According to the power electronic component substrate packaging device, a substrate of a power component can be automatically packaged, manual packaging is not needed any more, the efficiency is improved, the glue solution is heated, the situation that the glue solution is condensed and cannot drop down is prevented, and the product quality is improved. And the function of quickly air-drying the packaged substrate is also achieved, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of substrate packaging equipment, in particular to a power electronic component substrate packaging device. Background Art

[0002] The substrate is the basic material for manufacturing PCB. Generally speaking, the substrate is a copper-clad laminate. In the manufacturing of single-sided and double-sided printed boards, hole processing, chemical copper plating, electroplating copper, etching and other processing are selectively performed on the copper-clad laminate (CCL) to obtain the required circuit pattern. The manufacturing of another type of multi-layer printed boards is also based on the inner core thin copper-clad laminate as the base. The conductive pattern layer and the prepreg are alternately laminated and bonded together through a one-time lamination to form more than 3 layers of conductive pattern layer interconnection. It has three functions of conduction, insulation and support. The performance, quality, processability in manufacturing, manufacturing cost, manufacturing level, etc. of the printed board depend to a large extent on the substrate material. In the packaging process of the substrate, glue is often needed to package the substrate.

[0003] Most of the existing power component substrate packaging uses manual glue dripping to package the substrate, which has a slow working efficiency and is prone to the packaging glue dripping and deviation. At the same time, due to the condensation of the glue, the glue cannot be dripped out, affecting the production efficiency of the substrate. Therefore, those skilled in the art provide a power electronic component substrate packaging device to solve the problems raised in the above background technology. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the present invention provides a power electronic component substrate packaging device, which can automatically package the substrate of the power component, eliminating the need for manual packaging, thereby improving efficiency. The device also has the function of heating the glue to prevent the glue from condensing and dripping, and also has the function of quickly air-drying the packaged substrate, thereby improving production efficiency.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a power electronic component substrate packaging device, comprising support feet, a plurality of support feet having tops fixedly connected to support plates, a clamping and positioning mechanism disposed at the center of the plurality of support feet, a material pushing mechanism disposed at the bottom end of the clamping and positioning mechanism, and a packaging mechanism disposed at the top end of the support plate;

[0008] The clamping and positioning mechanism comprises a base plate, first motors are arranged on both sides of the outer wall of the base plate, the output ends of the first motors are fixedly connected to rotating rods, one side of the outer walls of the two rotating rods is fixedly connected to driving wheels, the outer walls of the two driving wheels are meshed with toothed belts, and the inner walls of the two toothed belts are meshed with driven wheels at one end away from the driving wheels;

[0009] Through the above technical solution, the first motor drives the driving wheel to rotate, thereby causing the toothed belt to rotate, and the toothed belt drives the driven wheel to rotate, so that both the driven wheel and the driving wheel drive the transmission block to slide.

[0010] Preferably, one side of the outer wall of the two driving wheels and the driven wheel is fixedly connected with a threaded rod, the outer walls of the plurality of threaded rods are threadedly connected with a transmission block, and one end of the plurality of threaded rods is rotatably connected with a limit block;

[0011] Through the above technical solution, the transmission block is set to slide, which drives the clamping plate to slide and clamps the substrate, making it convenient for subsequent glue packaging and preventing deviation from affecting glue coating.

[0012] Preferably, one side of the plurality of transmission blocks is fixedly connected to a connecting frame, one side of two of the connecting frames is fixedly connected to two spring rods, and one end of the plurality of spring rods away from the connecting frame is fixedly connected to a clamping plate;

[0013] Through the above technical solution, the substrate can be fixed by providing a clamping plate.

[0014] Preferably, the packaging mechanism includes a controller fixed to the top of the support plate, one side of the outer wall of the controller is fixedly connected to two transmission lines, one end of the two transmission lines away from the controller is fixedly connected to a heating shell and penetrated with an air guide port, the inner wall of the heating shell is fixedly connected to a heating coil, the inner wall of the heating coil is fixedly connected to a heat conduction pipe, one end of the heat conduction pipe is fixedly connected to a heat conduction head, the other end of the heat conduction pipe is fixedly connected to a heat conduction terminal, and one end of the heat conduction head penetrates with an air guide port;

[0015] Through the above technical solution, the controller controls the current to be transmitted to the heating coil, and the heating coil is used to heat the heat pipe and the thermal head, so that the glue in the heat pipe will not condense due to the temperature and affect the subsequent glue coating and packaging. The glue is applied through the thermal head to package the substrate.

[0016] Preferably, a compression pump is fixedly connected to the top of the support plate at a side away from the controller, a transmission air duct is fixedly connected to the output end of the compression pump, an air guide port is fixedly connected to the end of the transmission air duct away from the compression pump, a plurality of air outlets are fixedly connected to the bottom end of the air guide port, and the plurality of air outlets are located on the outer wall of the heat conducting head;

[0017] Through the above technical solution, the external air is compressed by a compression pump and transmitted to the air guide port through a transmission air duct. The compressed air is diverted through the air guide port and discharged through multiple air outlets to air-dry the substrate after coating with glue, thereby accelerating the production efficiency of the substrate and preventing glue from dripping and affecting the appearance of the substrate.

[0018] Preferably, the outer wall of the air guide port is fixedly connected to a fixing plate, the outer wall of the fixing plate is fixedly connected to a plurality of connecting legs, and one end of the plurality of connecting legs away from the fixing plate is fixedly connected to the bottom plate;

[0019] Through the above technical solution, the air guide port is fixed by providing a fixing plate.

[0020] Preferably, the pushing mechanism comprises a box body, the inner bottom end surface of the box body is fixedly connected to a second motor, and the output end of the second motor is fixedly connected to a transmission rod;

[0021] Through the above technical solution, the power electronic component substrate is placed on the push plate, and the transmission rod is driven to rotate by the second motor, so that the push plate can slide up and down.

[0022] Preferably, one end of the transmission rod away from the second motor is threadedly connected to a sliding rod, the top end of the sliding rod is fixedly connected to a push plate, and the bottom end of the push plate is fixedly connected to a plurality of limit rods;

[0023] Through the above technical solution, the power electronic component substrate is placed on the push plate, and the second motor drives the transmission rod to rotate, so that the transmission rod drives the sliding rod and the push plate to slide up and down, so that the substrate can be upward for packaging.

[0024] Preferably, S1: placing the power electronic component substrate on the push plate, and driving the transmission rod to rotate by the second motor, so that the transmission rod drives the sliding rod and the push plate to slide up and down, so that the substrate can be upward for packaging.

[0025] S2: The first motor drives the driving wheel to rotate, thereby rotating the toothed belt, and the toothed belt drives the driven wheel to rotate, so that both the driven wheel and the driving wheel drive the transmission block to slide, thereby driving the clamping plate to slide, clamping the substrate, facilitating subsequent glue packaging, and preventing deviation from affecting glue coating.

[0026] S3: The controller controls the current to be transmitted to the heating coil, and the heating coil is used to heat the heat pipe and the heat conducting head, so that the glue in the heat conducting tube will not condense due to the temperature and affect the subsequent glue coating and packaging. The glue is applied through the heat conducting head to package the substrate.

[0027] S4: The external air is compressed by a compression pump and transmitted to the air guide port through the transmission air duct. The compressed air is diverted through the air guide port and discharged through multiple air outlets to air-dry the substrate after the glue is applied, thereby speeding up the production efficiency of the substrate and preventing glue from dripping and affecting the appearance of the substrate.

[0028] Working principle: The device places the power electronic component substrate on the push plate, and drives the transmission rod to rotate through the second motor, so that the transmission rod drives the sliding rod and the push plate to slide up and down, so that the substrate can be upward for packaging, and the first motor drives the driving wheel to rotate, so that the toothed belt rotates, and the toothed belt drives the driven wheel to rotate, so that the driven wheel and the driving wheel both drive the transmission block to slide, so as to drive the clamping plate to slide, and clamp the substrate, and control the current to be transmitted to the heating coil through the controller, and heat the heat pipe and the heat conducting head through the heating coil, and apply glue through the heat conducting head to package the substrate, and compress the external air through the compression pump and transmit it to the air guide port through the transmission air duct, and the compressed air is diverted through the air guide port and discharged through multiple air outlets to air-dry the substrate after the glue is applied.

[0029] (III) Beneficial effects

[0030] The present invention provides a power electronic component substrate packaging device, which has the following beneficial effects:

[0031] 1. The present invention provides a power electronic component substrate packaging device, which drives the driving wheel to rotate through a first motor, thereby rotating the toothed belt, and drives the driven wheel to rotate through the toothed belt, so that both the driven wheel and the driving wheel drive the transmission block to slide, thereby driving the clamping plate to slide, clamping the substrate, facilitating subsequent glue packaging, and preventing deviation from affecting glue coating.

[0032] 2. The present invention provides a power electronic component substrate packaging device, which controls the current to be transmitted to the heating coil through a controller, and heats the heat pipe and the heat conductive head through the heating coil, so that the glue in the heat conductive tube will not condense due to the temperature and affect the subsequent glue coating and packaging. The glue is coated through the thermal conductive head to package the substrate.

[0033] 3. The present invention provides a power electronic component substrate packaging device, which compresses external air through a compression pump and transmits it to an air guide port through a transmission air duct, diverts the compressed air through the air guide port, and discharges it through multiple air outlets to air-dry the substrate after coating with glue, thereby accelerating the production efficiency of the substrate and preventing glue from dripping and affecting the appearance of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is an axonometric diagram of the present invention;

[0035] Figure 2 It is a schematic diagram of the structure of the clamping and positioning mechanism of the present invention;

[0036] Figure 3 It is a structural schematic diagram of the material pushing mechanism of the present invention;

[0037] Figure 4 It is a schematic diagram of the packaging mechanism structure of the present invention;

[0038] Figure 5 This is a schematic diagram of the air outlet connection structure of the present invention;

[0039] Figure 6 This is a schematic diagram of the connection structure of the controller of the present invention;

[0040] Figure 7 This is a schematic diagram of the heating coil connection structure of the present invention.

[0041] Among them, 1. support foot; 11. support plate; 2. clamping and positioning mechanism; 21. bottom plate; 22. first motor; 23. rotating rod; 24. driving wheel; 25. toothed belt; 26. driven wheel; 27. threaded rod; 28. transmission block; 29. ​​limit block; 210. connecting frame; 211. spring rod; 212. clamping plate; 3. packaging mechanism; 31. controller; 32. transmission line; 33. heating shell; 34. heat-conducting terminal; 35. heat-conducting head; 36. compression pump; 37. transmission air duct; 38. air guide port; 39. air outlet; 310. fixing plate; 311. connecting foot; 312. heating coil; 313. heat-conducting pipe; 4. pushing mechanism; 41. box body; 42. second motor; 43. transmission rod; 44. sliding rod; 45. pushing plate; 46. limit rod. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. In the description of this application, it should be noted that the terms used here are only for describing specific implementations, and are not intended to limit the exemplary implementations according to the present application. For ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and devices known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the techniques, methods and devices should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0043] Embodiment 1:

[0044] like Figure 1-5 As shown, an embodiment of the present invention provides a power electronic component substrate packaging device, comprising a supporting foot 1, a supporting plate 11 is fixedly connected to the top of a plurality of supporting feet 1, a clamping and positioning mechanism 2 is arranged at a center position inside the plurality of supporting feet 1, a pushing mechanism 4 is arranged at the bottom end of the clamping and positioning mechanism 2, and a packaging mechanism 3 is arranged at the top end of the supporting plate 11;

[0045] The clamping and positioning mechanism 2 includes a base plate 21, and first motors 22 are provided on both sides of the outer wall of the base plate 21. The output ends of the first motors 22 are fixedly connected to rotating rods 23, and one side of the outer walls of the two rotating rods 23 is fixedly connected to driving wheels 24. The outer walls of the two driving wheels 24 are meshed with toothed belts 25, and the inner walls of the two toothed belts 25 are meshed with driven wheels 26 at one end away from the driving wheels 24. The driving wheels 24 are driven to rotate by the first motor 22, thereby rotating the toothed belts 25, and the driven wheels 26 are driven to rotate by the toothed belts 25, so that both the driven wheels 26 and the driving wheels 24 drive the transmission block 28 to slide.

[0046] Embodiment 2: One side of the outer wall of the two driving wheels 24 and the driven wheel 26 is fixedly connected with a threaded rod 27, and the outer walls of the multiple threaded rods 27 are threadedly connected with a transmission block 28, and one end of the multiple threaded rods 27 is rotatably connected to the limit block 29. By setting the transmission block 28 to slide, the clamping plate 212 is driven to slide, and the substrate is clamped to facilitate the subsequent glue packaging and prevent the occurrence of deviation that affects the glue coating. One side of the multiple transmission blocks 28 is fixedly connected with a connecting frame 210, and one side of the two connecting frames 210 is fixedly connected with two spring rods 211. The multiple spring rods 211 are fixedly connected with a clamping plate 212 at one end away from the connecting frame 210. By setting the clamping plate 212, the substrate can be fixed, and the packaging mechanism 3 includes The controller 31 is fixed to the top of the support plate 11, and one side of the outer wall of the controller 31 is fixedly connected to two transmission lines 32, and one end of the two transmission lines 32 away from the controller 31 is fixedly connected to the heating shell 33 and penetrated with an air guide port 38, and the inner wall of the heating shell 33 is fixedly connected to the heating coil 312, and the inner wall of the heating coil 312 is fixedly connected to the heat pipe 313, and one end of the heat pipe 313 is fixedly connected to the heat conducting head 35, and one end of the heat conducting head 35 penetrates the air guide port 38, and the other end of the heat conducting pipe 313 is fixedly connected to the heat conducting terminal 34, and the current is controlled by the controller 31 to be transmitted to the heating coil 312, and the heat conducting pipe 313 and the heat conducting head 35 are heated by the heating coil 312, so that the glue in the heat conducting pipe 313 is not The subsequent glue coating and packaging will be affected by condensation of temperature. Glue is applied through the thermal head 35 to package the substrate. A compression pump 36 is fixedly connected to the side of the top of the support plate 11 away from the controller 31. The output end of the compression pump 36 is fixedly connected to a transmission air duct 37. An end of the transmission air duct 37 away from the compression pump 36 is fixedly connected to an air guide port 38. A plurality of air outlets 39 are fixedly connected to the bottom end of the air guide port 38, and the plurality of air outlets 39 are located on the outer wall of the thermal head 35. External air is compressed by the compression pump 36 and transmitted to the air guide port 38 through the transmission air duct 37. The compressed air is diverted through the air guide port 38 and discharged through the plurality of air outlets 39 to air-dry the substrate after the glue is applied, thereby improving the production efficiency of the substrate. Speed ​​up, prevent glue from dripping and affecting the appearance of the substrate, the outer wall of the air guide 38 is fixedly connected to a fixing plate 310, and the outer wall of the fixing plate 310 is fixedly connected to a plurality of connecting feet 311, and one end of the plurality of connecting feet 311 away from the fixing plate 310 is fixedly connected to the bottom plate 21, and the air guide 38 is fixed by setting the fixing plate 310, and the pushing mechanism 4 includes a box body 41, and the inner bottom end surface of the box body 41 is fixedly connected to a second motor 42, and the output end of the second motor 42 is fixedly connected to a transmission rod 43, and the power electronic component substrate is placed on the pushing plate 45, and the transmission rod 43 is driven by the second motor 42 to rotate, so that the pushing plate 45 can slide up and down, and the end of the transmission rod 43 away from the second motor 42 is threadedly connected to a sliding rod 44,The top of the sliding rod 44 is fixedly connected with a push plate 45, and the bottom of the push plate 45 is fixedly connected with a plurality of limit rods 46. The power electronic component substrate is placed on the push plate 45, and the transmission rod 43 is driven to rotate by the second motor 42, so that the transmission rod 43 drives the sliding rod 44 and the push plate 45 to slide up and down, so that the substrate can be upward for packaging. S1: The power electronic component substrate is placed on the push plate 45, and the transmission rod 43 is driven to rotate by the second motor 42, so that the transmission rod 43 drives the sliding rod 44 and the push plate 45 to slide up and down, so that the substrate can be upward for packaging.

[0047] S2: The first motor 22 drives the driving wheel 24 to rotate, thereby causing the toothed belt 25 to rotate, and the toothed belt 25 drives the driven wheel 26 to rotate, so that both the driven wheel 26 and the driving wheel 24 drive the transmission block 28 to slide, thereby driving the clamping plate 212 to slide, and clamping the substrate to facilitate subsequent glue packaging and prevent deviation from affecting glue coating.

[0048] S3: The controller 31 controls the current to be transmitted to the heating coil 312, and the heating coil 312 heats the heat pipe 313 and the heat conducting head 35, so that the glue in the heat conducting tube 313 will not condense due to the temperature and affect the subsequent glue coating and packaging. The glue is coated through the heat conducting head 35 to encapsulate the substrate.

[0049] S4: The external air is compressed by the compression pump 36 and transmitted to the air guide port 38 through the transmission air duct 37. The compressed air is diverted through the air guide port 38 and discharged through multiple air outlets 39 to air-dry the substrate after the glue is applied, thereby speeding up the production efficiency of the substrate and preventing glue from dripping and affecting the appearance of the substrate.

[0050] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A power electronic component substrate packaging device, comprising a support foot (1), characterized in that: The top ends of the plurality of support legs (1) are fixedly connected to a support plate (11); a clamping and positioning mechanism (2) is arranged at a central position inside the plurality of support legs (1); a material pushing mechanism (4) is arranged at the bottom end of the clamping and positioning mechanism (2); a packaging mechanism (3) is arranged at the top end of the support plate (11); the clamping and positioning mechanism (2) comprises a bottom plate (21); first motors (22) are arranged on both sides of the outer wall of the bottom plate (21); the output ends of the first motors (22) are fixedly connected to rotating rods (23); and two A driving wheel (24) is fixedly connected to one side of the outer wall of the rotating rod (23); the outer walls of the two driving wheels (24) are meshed with toothed belts (25); the inner walls of the two toothed belts (25) are meshed with driven wheels (26) at one end away from the driving wheels (24); threaded rods (27) are fixedly connected to one side of the outer walls of the two driving wheels (24) and the driven wheel (26); the outer walls of the plurality of threaded rods (27) are threadedly connected to transmission blocks (28); and one end of the plurality of threaded rods (27) is rotatably connected to a limiting block (29).

2. A power electronic component substrate packaging device according to claim 1, characterized in that: A connecting frame (210) is fixedly connected to one side of the plurality of transmission blocks (28), two spring rods (211) are fixedly connected to one side of two of the connecting frames (210), a clamping plate (212) is fixedly connected to one end of the plurality of spring rods (211) away from the connecting frame (210), and the packaging mechanism (3) comprises a controller (31) fixed to the top of the support plate (11), two transmission lines (32) are fixedly connected to one side of the outer wall of the controller (31), and the two transmission lines (32) The end away from the controller (31) is fixedly connected to a heating shell (33) and penetrated with an air guide port (38); the inner wall of the heating shell (33) is fixedly connected to a heating coil (312); the inner wall of the heating coil (312) is fixedly connected to a heat conduction pipe (313); one end of the heat conduction pipe (313) is fixedly connected to a heat conduction head (35); the other end of the heat conduction pipe (313) is fixedly connected to a heat conduction terminal (34); and one end of the heat conduction head (35) penetrates with an air guide port (38).

3. A power electronic component substrate packaging device according to claim 2, characterized in that: A compression pump (36) is fixedly connected to the side of the top of the support plate (11) away from the controller (31), the output end of the compression pump (36) is fixedly connected to a transmission air duct (37), the end of the transmission air duct (37) away from the compression pump (36) is fixedly connected to an air guide port (38), the bottom end of the air guide port (38) is fixedly connected to a plurality of air outlets (39), and the plurality of air outlets (39) are located on the outer wall of the heat conducting head (35), the outer wall of the air guide port (38) is fixedly connected to a fixing plate (310), the outer wall of the fixing plate (310) is fixedly connected to a plurality of connecting legs (311), and the ends of the plurality of connecting legs (311) away from the fixing plate (310) are fixedly connected to the bottom plate (21).

4. The power electronic component substrate packaging device according to claim 1, characterized in that: The material pushing mechanism (4) comprises a box body (41), the inner bottom end surface of the box body (41) is fixedly connected to a second motor (42), and the output end of the second motor (42) is fixedly connected to a transmission rod (43).

5. A power electronic component substrate packaging device according to claim 4, characterized in that: One end of the transmission rod (43) away from the second motor (42) is threadedly connected to a sliding rod (44), the top end of the sliding rod (44) is fixedly connected to a push plate (45), and the bottom end of the push plate (45) is fixedly connected to a plurality of limit rods (46).

6. The power electronic component substrate packaging device according to claim 1, characterized in that: The packaging steps of the power electronic component substrate packaging device are as follows: Step 1: Place the power electronic component substrate on the push plate (45), and use the second motor (42) to drive the transmission rod (43) to rotate, so that the transmission rod (43) drives the sliding rod (44) and the push plate (45) to slide up and down, so that the substrate can be upward for packaging. Step 2: The first motor (22) drives the driving wheel (24) to rotate, thereby causing the toothed belt (25) to rotate, and the toothed belt (25) drives the driven wheel (26) to rotate, so that the driven wheel (26) and the driving wheel (24) both drive the transmission block (28) to slide, thereby driving the clamping plate (212) to slide, clamping the substrate, facilitating subsequent glue packaging, and preventing deviation from affecting glue coating. Step 3: The controller (31) controls the current to be transmitted to the heating coil (312), and the heating coil (312) is used to heat the heat pipe (313) and the heat conducting head (35), so that the glue in the heat conducting pipe (313) will not condense due to the temperature and affect the subsequent glue coating and packaging. The glue is coated through the heat conducting head (35) to encapsulate the substrate. Step 4: The external air is compressed by a compression pump (36) and transmitted to the air guide port (38) through the transmission air duct (37). The compressed air is diverted through the air guide port (38) and discharged through multiple air outlets (39) to air-dry the substrate after the glue is applied, thereby accelerating the production efficiency of the substrate and preventing glue from dripping and affecting the appearance of the substrate.

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