Electronic device

Abstract

The invention discloses an electronic device which comprises a flexible substrate, an electronic unit and an outer cover. The flexible substrate has a first portion and a second portion. The electronic unit is disposed on the flexible substrate. The outer cover is disposed on the electronic unit, and the outer cover includes a first layer. The first layer is retracted from an edge of the first portion by a first distance and from an edge of the second portion by a second distance, and the second distance is different from the first distance.

Description

Technical Field

[0001] The invention relates to an electronic device, in particular to an electronic device with a flexible substrate. Background Art

[0002] In recent years, electronic devices have developed flexible, foldable or bendable features, allowing them to be used in various types of objects. In existing flexible electronic devices, organic materials are usually used as their outer covers to maintain the flexible features. However, although the organic outer cover can be flexible, the flexible electronic device needs to display an appearance or image through the organic outer cover, so the flexible electronic device has the problem of poor display quality. Summary of the invention

[0003] An object of the present invention is to provide an electronic device.

[0004] An embodiment of the present invention provides an electronic device, which includes a flexible substrate, an electronic unit, and an outer cover. The flexible substrate has a first portion and a second portion. The electronic unit is disposed on the flexible substrate. The outer cover is disposed on the electronic unit, and the outer cover includes a first layer. The first layer retreats a first distance from an edge of the first portion and retreats a second distance from an edge of the second portion, and the second distance is different from the first distance. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 FIG. 1 is a side view of an electronic device in a folded state according to a first embodiment of the present invention.

[0006] Figure 2 FIG. 1 is a schematic top view of an electronic device in a flattened state according to a first embodiment of the present invention.

[0007] Figure 3 The electronic device of some embodiments of the present invention is shown along Figure 2 A schematic cross-sectional view of the section line A-A'.

[0008] Figure 4 The electronic device of some embodiments of the present invention is shown along Figure 2 Schematic cross-sectional view of section line BB'.

[0009] Figure 5 The electronic device of some embodiments of the present invention is shown along Figure 2 Schematic cross-sectional view of section line C-C'.

[0010] Figure 6 The electronic device of some embodiments of the present invention is shown along Figure 2 Schematic cross-sectional view of the section line D-D'.

[0011] Figure 7The electronic device of some embodiments of the present invention is shown along Figure 2 Schematic cross-sectional view of section line E-E'.

[0012] Figure 8 The electronic devices of some embodiments of the present invention correspond to Figure 2 A schematic cross-sectional view of the section line A-A'.

[0013] Fig. 9 FIG. 1 is a side view of an electronic device mounted on an object according to a second embodiment of the present invention.

[0014] Fig.10 FIG. 1 is a schematic top view of an electronic device in a flattened state according to a second embodiment of the present invention.

[0015] Fig.11 Shown along Fig.10 Schematic cross-sectional view of section line F-F'.

[0016] Fig.12 Shown along Fig.10 Schematic cross-sectional view of section line G-G'.

[0017] Fig.13 The electronic device of some embodiments of the present invention is shown along Fig.10 Schematic cross-sectional view of the section line H-H'.

[0018] Fig.14 The electronic device of some embodiments of the present invention is shown along Fig.10 A schematic cross-sectional view of the section line II'.

[0019] Fig.15 The electronic device of some embodiments of the present invention is shown along Fig.10 Schematic cross-sectional view of the section line J-J'.

[0020] Fig.16 FIG. 1 is a schematic top view of an electronic device in a flattened state according to a third embodiment of the present invention.

[0021] Fig.17 The electronic device according to the third embodiment of the present invention is shown along Fig.16 Schematic cross-sectional view of section line K-K' and section line L-L'.

[0022] Fig.18 Shown are cross-sectional schematic views of electronic devices in a flattened state according to some embodiments of the present invention.

[0023] Fig.19 Shown is a schematic cross-sectional view of a portion of an outer cover corresponding to one of the curved surface areas in some embodiments of the present invention in a flattened state.

[0024] Fig. 20Shown is a schematic cross-sectional view of a portion of an outer cover corresponding to one of the curved surface areas in some embodiments of the present invention in a flattened state.

[0025] Fig.21 The electronic device of some embodiments of the present invention corresponds to the following example in a flattened state: Fig.16 Partial cross-sectional schematic diagram of section line K-K' and section line M-M'.

[0026] Fig. 22 FIG. 4 is a schematic top view of an electronic device in a flattened state according to a fourth embodiment of the present invention.

[0027] Fig.23 FIG. 4 is a side view of an electronic device according to a fifth embodiment of the present invention.

[0028] Explanation of reference numerals: 1, 2, 3a, 3b, 3c, 4, 5-electronic device; 10-object; 12-flexible substrate; 12a-first organic layer; 12b, 48b-inorganic layer; 12c-second organic layer; 14-electronic unit; 14a-circuit layer; 14b-electronic element; 14b1-first electronic element; 14b2-second electronic element; 14c-encapsulation layer; 14d-planar layer; 14T-transistor; 164, 165, 16, 161, 162, 163-outer cover; 16a-first layer; 16b-second layer; 16c-third layer; 16d, 16e, 16f-adhesive layer; 16g-coating layer; 18-circuit board; 20-support film; 20a, 20b-block; 20c-gap; 22-pad; 24, 28, 32, 36, 40, 42-insulating layer; 26-semiconductor; 30, 34, 38, 44-conductive layer; 46-protective member; 48-dam structure; 48a-organic layer; 50-anti-crack structure; 54-encapsulation glue; 56,52-notch; 60-block structure; 62-routing; AA-display area; BS-back side; D1-first direction; D2-second direction; E1,E2,E3,E4,E5,E6,E7,E8,E9,E10,E11,E12-edge; EL1,EL2-electrode; FA-folding axis; G-gate; LL-light-emitting layer; LS-shading pattern; OP1,OP2,OP3,OP4,OP5-opening; P1-first part ; P2-the second part; PT1, PT2-pattern; R1-bending area; R2-non-folding area; R3-folding area; R4-flat area; R51, R52-curved area; R52a-sub-curved area; R6-corner area; S1-front side; S21, S22-side curved surface; S3-corner surface; ST1, ST2-microstructure; T1, T2, T3-thickness; T4-total thickness; TD-top-down direction; W1, W2, W6, W7, W3, W4, W5, W8-distance. DETAILED DESCRIPTION

[0029] The content of the present invention is described in detail below in conjunction with specific embodiments and drawings. In order to make the content of the present invention clearer and easier to understand, the following drawings may be simplified schematic diagrams, and the elements therein may not be drawn to scale. Moreover, the number and size of each element in the drawings are only for illustration and are not intended to limit the scope of the present invention.

[0030] Certain words are used throughout the present specification and the appended claims to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names, and it is not intended to distinguish between components that have the same function but different names. In the present specification and claims, the words "including" and "comprising" are open-ended words and should be interpreted as "including but not limited to...".

[0031] The ordinal numbers used in the specification and claims, such as "first", "second", etc., to modify the elements of the claims, do not themselves mean or represent any previous ordinal numbers of the claimed elements, nor do they represent the order of one claimed element and another claimed element, or the order in the manufacturing method. The use of the ordinal numbers is only used to clearly distinguish a claimed element with a certain name from another claimed element with the same name.

[0032] The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only used to refer to the directions of the accompanying drawings. Therefore, the directional terms used are used to illustrate and not to limit the present invention.

[0033] In addition, when an element or a film layer is referred to as being on or above another element or another film layer, or is referred to as being connected to another element or another film layer, it should be understood that the element or film layer is directly located on another element or another film layer, or is directly connected to another element or film layer, or there may be other elements or film layers between the two (indirectly). But on the contrary, when an element or a film layer is referred to as being "directly" "on" another element or film layer or "directly connected to" another element or film layer, it should be understood that there is no intervening element or film layer between the two. In addition, the terms "electrically connected" or "coupled" include any direct and indirect electrical connection means.

[0034] In the present invention, the terms "about", "substantially", "roughly" or "the same" generally indicate a range within 20%, within 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5% of a given value. The numbers given here are approximate numbers, that is, in the absence of specific description of "about", "substantially", "roughly" or "the same", the meanings of "about", "substantially", "roughly" or "the same" may still be implied.

[0035] It should be understood that the following embodiments can replace, reorganize, or mix features in multiple different embodiments to complete other embodiments without departing from the spirit of the present invention. The features between the embodiments can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0036] In the present invention, the length, thickness, width, height, distance and area can be measured by an optical microscope (OM), an electron microscope (such as a scanning electron microscope (SEM)) or other methods, but are not limited thereto.

[0037] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the present invention belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present invention, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present invention.

[0038] According to an embodiment of the present invention, the electronic device may include a display device, a splicing device, a touch electronic device, a sensing device, a curved electronic device or a non-rectangular electronic device, but is not limited thereto. The electronic device may, for example, include a liquid crystal, a light emitting diode, fluorescence, phosphorescence, other suitable display media, or a combination of the foregoing, but is not limited thereto. The display device may be a non-self-luminous display device or a self-luminous display device. The electronic device may include an electronic unit, and the electronic unit may be a passive component or an active component, such as a capacitor, a resistor, an inductor, a diode, a transistor, etc. The diode may include a light-emitting diode (LED) or a photodiode. The light-emitting diode may, for example, include an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro LED or a quantum dot light-emitting diode (quantum dot LED), but is not limited thereto. The splicing device may, for example, be a display splicing device, but is not limited thereto. It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto. In addition, the electronic device may be a bendable or flexible electronic device. In addition, the appearance of the electronic device may be a rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device may have a peripheral system such as a drive system, a control system, a light source system, a shelf system, etc. to support the display device or the splicing device. For the convenience of description, the following description will be based on the state of the electronic device as a display device, but the present invention is not limited to this.

[0039] Figure 1 FIG. 1 is a side view of an electronic device in a folded state according to a first embodiment of the present invention. Figure 2 FIG. 2 is a schematic top view of an electronic device in a flattened state according to a first embodiment of the present invention. Figure 1 and Figure 2As shown, the electronic device 1 includes a flexible substrate 12, an electronic unit 14, and an outer cover 16. The flexible substrate 12 may have a first portion P1 and a second portion P2. The electronic unit 14 is disposed on the flexible substrate 12, and the outer cover 16 is disposed on the electronic unit 14. In addition, the outer cover 16 includes a first layer 16a, wherein the first layer 16a retreats a distance W1 from an edge E1 of the first portion P1 and retreats a distance W2 from an edge E2 of the second portion P2. For example, the distance W1 may be the distance between an edge E3 of the first layer 16a corresponding to the edge E1 of the first portion P1 and an edge E1 of the first portion P1 when the electronic device 1 is flattened, and the distance W2 may be the distance between another edge E4 of the first layer 16a corresponding to the edge E2 of the second portion P2 and an edge E2 of the second portion P2 when the electronic device 1 is flattened. The distance W2 may be different from the first distance W1, so that the stress on the first layer 16a can be reduced, thereby reducing the possibility of cracking or damage to the first layer 16a during the manufacturing process or during user use. In order to clearly show the relationship between the flexible substrate 12 and the outer cover 16, Figure 2 The electronic unit 14 is omitted, but the present invention is not limited thereto.

[0040] The first portion P1 and the second portion P2 may be any two portions of the flexible substrate 12. In one embodiment, the first portion P1 is a non-bending portion of the flexible substrate 12, and the second portion P2 is a portion of the flexible substrate 12 that is bent relative to the first portion P1 toward the back side BS of the first portion P1. In some embodiments, when the second portion P2 is bent relative to the first portion P1 toward the back side BS of the first portion P1 when the electronic device 1 is in use, the distance W1 and the distance W2 may be distances measured along the same direction (e.g., the first direction D1) of the electronic device 1 in a flattened state. It should be noted that the first portion P1 may be folded along the folding axis FA, so that the first portion P1 has a partial area that is folded toward the back side BS of the first portion P1. In the present invention, the terms "bend" and "fold" have different meanings, wherein the radius of curvature of the bending area R1 is smaller than the radius of curvature of the folding area R3.

[0041] In one embodiment, the electronic device 1 may further include a circuit board 18, which is joined to the second part P2, but is not limited thereto. The circuit board 18 may, for example, be adjacent to the edge E2 of the second part P2 and electrically connected and joined to the electronic unit 14 disposed on the second part P2. When assembling the electronic device 1, the second part P2 of the flexible substrate 12 may be bent to the back side BS of the first part P1, so that the second part P2 may include a bending area R1. The portion of the electronic unit 14 disposed on the second part P2 may also, for example, be bent to the back side BS of the first part P1 along with the second part P2, thereby reducing the width occupied by the second part P2, thereby reducing the border width of the electronic device 1. In the present invention, the second part P2 being bent to the back side BS of the first part P1 may refer to at least a portion of the second part P2 overlapping with the first part P1 in the top-view direction TD of the electronic device 1.

[0042] The back side BS of the first part P1 may be, for example, the side of the first part P1 facing away from the outer cover 16. In order to reduce the crack damage of the first layer 16a when the second part P2 is bent to the back side BS of the first part P1, the distance W2 may be greater than the distance W1. The ratio of the distance W2 to the distance W1 may, for example, range from 1.5 to 1000 (i.e., 1.5≤ratio of the distance W2 to the distance W1≤1000). It should be noted that when the ratio of the distance W2 to the distance W1 is too small, that is, when the distance W1 is close to the distance W2, the edge E4 of the first layer 16a adjacent to the circuit board 18 will be subjected to greater stress when the second part P2 is bent to the back side of the first part P1, or the edge E3 of the first layer 16a away from the circuit board 18 will be too far away from the edge E1 of the first part P1 and cannot provide sufficient protection for the electronic unit 14. When the ratio of the distance W2 to the distance W1 is too large, the edge E4 of the first layer 16a adjacent to the circuit board 18 cannot provide sufficient protection for the electronic unit 14. The distance W1 may be, for example, greater than or equal to 0.03 mm and less than or equal to 0.6 mm (i.e., 0.03 mm ≤ distance W1 ≤ 0.6 mm). The distance W2 may be, for example, greater than or equal to 1 mm and less than or equal to 30 mm (i.e., 1 mm ≤ distance W2 ≤ 30 mm). In one embodiment, the difference between the distance W2 and the distance W1 may be, for example, greater than or equal to 0.4 mm (mm) and less than or equal to 30 mm (i.e., 0.4 mm ≤ the difference between the distance W2 and the distance W1 ≤ 30 mm). In this case, the electronic device 1 may be applied to a handheld device, such as a mobile phone, a tablet or other suitable device, but is not limited thereto. The circuit board 18 may, for example, include a flexible circuit board or other suitable circuit elements. In some embodiments, a chip or other suitable element may be selectively provided on the circuit board 18, but is not limited thereto.

[0043] like Figure 1As shown, the first portion P1 may include at least one non-folding region R2 and a folding region R3, wherein the folding region R3 is disposed on one side of the non-folding region R2, so that the electronic device 1 may be a foldable device, but is not limited thereto. In one embodiment, the number of non-folding regions R2 may be two, and the folding region R3 may be located between the non-folding regions R2. The bending region R1 may connect to one side of the non-folding region R2 opposite to the folding region R3, but is not limited thereto. Figure 1 In the embodiment of the present invention, the folding area R3 may, for example, extend along the second direction D2, so that the electronic device 1 can be folded along the folding axis FA parallel to the second direction D2, but is not limited thereto. The second direction D2 may, for example, be perpendicular to the first direction D1, but is not limited thereto. In the present invention, the folding area R3 may be defined as a portion where the flexible substrate 12 will be bent when the electronic device 1 is in a folded state, and the non-folding area R2 may be defined as a portion where the flexible substrate 12 will be flat when the electronic device 1 is in a folded state, and the folding area R3 is disposed between two non-folding areas R2.

[0044] The outer cover 16 may be a single-layer structure or a multi-layer structure. Figure 1 and Figure 2 As shown, when the outer cover 16 is a single-layer structure, the outer cover 16 may be composed of a first layer 16a, but is not limited thereto. The first layer 16a may include, for example, glass or other suitable inorganic materials to enhance the display quality of the electronic device 1. In this embodiment, the first layer 16a may be glass, but is not limited thereto. The thickness of the first layer 16a (e.g. Figure 3 The thickness T1 shown may be, for example, less than or equal to 100 micrometers (μm), so that the first layer 16a may have a flexible or bendable property. It is worth noting that when cracks occur at the edge of glass with a thickness of less than 100 μm, the glass is prone to large-scale shattering. By retreating the first layer 16a from the edge E1 of the first part P1 by a distance W1 and from the edge E2 by a distance W2, the generation of cracks in the first layer 16a can be reduced. Moreover, by making the distance W1 smaller than the distance W2, the generation of cracks in the first layer 16a due to the bending of the second part P2 can be further reduced, thereby reducing the damage to the first layer 16a. When the damage to the first layer 16a is reduced, the first layer 16a may be allowed to be provided in the electronic device 1 to enhance the display texture of the electronic device 1.

[0045] The electronic unit 14 may include any type of electronic element. For example, the electronic element may include a display element, a light emitting element, a sensing element, an antenna, or other types of elements. The electronic unit 14 of this embodiment may refer to the following embodiments, but is not limited thereto.

[0046] In the present embodiment, the electronic device 1 may further selectively include a support film 20, which is disposed on the back side BS of the flexible substrate 12 facing away from the electronic unit 14, but is not limited thereto. The support film 20 may be flexible and have a higher hardness than the flexible substrate 12. For example, when the support film 20 and the flexible substrate 12 include the same material, the thickness of the support film 20 may be greater than the thickness of the flexible substrate 12. Alternatively, the support film 20 and the flexible substrate 12 may include different materials. The support film 20 and the flexible substrate 12 may respectively include organic materials. The organic material may, for example, include polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), rubber, ABS resin (acrylonitrilebutadiene styrene, ABS), other suitable materials, or a combination of the above materials. Figure 1 In the figure, the thickness of the support film 20 and the thickness of the flexible substrate 12 are for illustration only and are not intended to be limiting.

[0047] Figure 3 The electronic device of some embodiments of the present invention is shown along Figure 2 A schematic cross-sectional view of the section line A-A'. Figure 3 As shown, in some embodiments, the support film 20 may selectively include blocks 20a and blocks 20b separated from each other, and the gap 20c between the blocks 20a and 20b may overlap the bending area R1 in the top-view direction TD of the electronic device 1, so that when the portion of the electronic device 1 corresponding to the bending area R1 is bent, the stress generated by the support film 20 on the first layer 16a can be reduced, thereby reducing the crack damage of the first layer 20.

[0048] exist Figure 3 In the embodiment of FIG. 1 , the block 20a may be disposed on the side of the second portion P2 facing away from the electronic unit 14. When the electronic device 1 is flattened, the block 20a may overlap a portion of the circuit board 18 in the top view direction TD. The block 20a may be used to support a portion of the second portion P2 and the electronic unit 14 and the circuit board 18 thereon.

[0049] The block 20b may be disposed on a side of the first portion P1 facing away from the electronic unit 14 to support the electronic unit 14 on the first portion P1. When viewed along the top view direction TD of the electronic device 1, the first layer 16a may retreat a distance W6 from the edge E5 of the block 20b adjacent to the circuit board 18, and the first layer 16a may retreat a distance W7 from the edge E6 of the block 20b away from the circuit board 18, and the distance W6 may be greater than the distance W7, so that the stress on the edge E4 of the first layer 16a when the second portion P2 is bent to the back side BS of the first portion P1 can be reduced, thereby reducing the damage of the first layer 16a. The ratio of the distance W6 to the distance W7 may be, for example, greater than 1 and less than or equal to 10 (i.e., 1<ratio of the distance W6 to the distance W7≤10). For example, the distance W6 may be greater than 30 μm and less than or equal to 10000 μm (i.e., 30 μm < distance W6 ≤ 10000 μm), and the distance W7 may be greater than or equal to 30 μm and less than or equal to 1000 μm (i.e., 30 μm ≤ distance W7 ≤ 1000 μm). In one embodiment, the difference between the distance W6 and the distance W7 may be, for example, greater than 0 μm and less than or equal to 2000 μm (i.e., 0 μm < the difference between the distance W6 and the distance W7 ≤ 2000 μm), but is not limited thereto. When the distance W6 is greater than 0 μm, friction between the first layer 16a and the housing during the assembly process can be avoided, thereby reducing the chance of damage to the first layer 16a.

[0050] It should be noted that if Figure 3 As shown, either the distance W1 or the distance W2 may be greater than the thickness T1 of the first layer 16a to reduce the cracking of the first layer 16a. For example, the thickness T1 of the first layer 16a may be greater than or equal to 5μm and less than or equal to 100μm (i.e., 5μm≤thickness T1 of the first layer 16a≤100μm). The distance W1 may, for example, be greater than or equal to 30μm and less than or equal to 600μm (i.e., 30μm≤distance W1≤600μm) or greater than or equal to 50μm and less than or equal to 400μm (i.e., 50μm≤distance W1≤400μm). It should be noted that when the electronic device 1 is in a flattened state, the thickness T1 of the first layer 16a at different positions may be nearly consistent. In this case, the thickness T1 of the first layer 16a may be measured at any position of the electronic device 1 except the edge.

[0051] In addition, if Figure 3 As shown, the circuit board 18 may be electrically connected to the electronic unit 14 via the pads 22 . Figure 3 The pad 22 is for illustration only, but is not limited thereto. In some embodiments, the pad 22 may also be disposed in the electronic unit 14, for example. Figure 3 For other parts of the electronic device, reference may be made to the above or below embodiments and will not be described in detail herein.

[0052] Figure 4The electronic device of some embodiments of the present invention is shown along Figure 2 A schematic cross-sectional view of the section line BB', and Figure 5 The electronic device of some embodiments of the present invention is shown along Figure 2 The schematic cross-sectional view of the section line C-C'. Figure 4 and Figure 5 As shown, in some embodiments, the outer cover 16 may further include a second layer 16b disposed on the first layer 16a. Figure 4 and Figure 5 In the embodiment, the outer cover 16 may further include a third layer 16c disposed under the first layer 16a, but is not limited thereto.

[0053] Since the first layer 16a is disposed between the second layer 16b and the third layer 16c, the first layer 16a can be protected by the second layer 16b and the third layer 16c. The first layer 16a may include an inorganic material, and the second layer 16b and the third layer 16c may include an organic material, but are not limited thereto. The second layer 16b and the third layer 16c may include, for example, PI, PC, PET, PMMA, rubber, ABS resin, or other suitable materials.

[0054] like Figure 4 and Figure 5 As shown, the outer cover 16 may further include an adhesive layer 16d, an adhesive layer 16e, and an adhesive layer 16f, wherein the second layer 16b is attached to the first layer 16a through the adhesive layer 16f, the third layer 16c is attached to the first layer 16a through the adhesive layer 16e, and the third layer 16c may be attached to the electronic unit 14 through the adhesive layer 16d, but is not limited thereto. The adhesive layer 16d, the adhesive layer 16e, and the adhesive layer 16f may include, for example, acrylate materials or other suitable materials.

[0055] In some embodiments, the outer cover 16 may optionally not include the third layer 16c (eg Fig. 20 as shown) or does not include the second layer 16b and the third layer 16c at the same time (e.g. Figure 1 or Figure 3 In this case, the outer cover 16 may selectively not include the adhesive layer 16d or not include both the adhesive layer 16d and the adhesive layer 16f.

[0056] exist Figure 4 and Figure 5In the embodiment, the edge E4 of the first layer 16a may not be aligned with the edge E5 of the second layer 16b adjacent to the edge E4 in the top-view direction TD. In this case, the first layer 16a may retreat from the edge E5 of the second layer 16b by a distance W3, and the range of the distance W3 is, for example, 30μm to 600μm (i.e., 30μm≤first distance W1≤600μm), so that the edge E4 of the first layer 16a can be protected by the second layer 16b during the manufacturing process (e.g., assembly process or other processes) or use to reduce crack damage. In some embodiments, the edge E5 of the second layer 16b may or may not be aligned with the edge E2 of the flexible substrate 12 in the top-view direction TD, but is not limited thereto. In some embodiments, the edge E4 of the first layer 16a may not be aligned with the edge E6 of the third layer 16c adjacent to the edge E4 in the top-view direction TD, and the first layer 16a may retreat from the edge E6 of the third layer 16c by a distance, but is not limited thereto.

[0057] In some embodiments, the edge E4 of the first layer 16a, the edge E5 of the second layer 16b adjacent to the edge E4, and the edge E6 of the third layer 16c adjacent to the edge E2 may not be aligned with each other in the top-view direction TD, but are not limited thereto. In some embodiments, at least two of the edge E4 of the first layer 16a, the edge E5 of the second layer 16b adjacent to the edge E4, and the edge E6 of the third layer 16c adjacent to the edge E4 may also be aligned with each other in the top-view direction TD. In some embodiments, the edge E6 of the third layer 16b may or may not be aligned with the edge E2 of the flexible substrate 12 in the top-view direction TD, but are not limited thereto.

[0058] In some embodiments, at least one edge of the third layer 16c may be aligned with the edge corresponding to the adhesive layer 16d in the top-view direction TD, at least one edge of the first layer 16a may be aligned with the edge corresponding to the adhesive layer 16e in the top-view direction TD, and / or at least one edge of the second layer 16b may be aligned with the edge corresponding to the adhesive layer 16f in the top-view direction TD, but is not limited thereto. In some embodiments, the edge of the first layer 16a may not be aligned with the edge corresponding to the adhesive layer 16e, and / or the edge of the second layer 16b may not be aligned with the edge corresponding to the adhesive layer 16f.

[0059] In some embodiments, the outer cover 16 may further selectively include a coating layer 16g disposed on the second layer 16b to protect the components and film layers thereunder. The coating layer 16g may include an organic material, such as PMMA, PC, or other suitable materials. The thickness of the coating layer 16g may be, for example, less than 10 μm. In some embodiments, the coating layer 16g may be, for example, a hard coating layer.

[0060] The flexible substrate 12 may be a single-layer structure or a multi-layer structure. Figure 4As shown, the flexible substrate 12 may be, for example, a multilayer structure, and include a first substrate 12a, an inorganic layer 12b, and a second substrate 12c, wherein the inorganic layer 12b is sandwiched between the first substrate 12a and the second substrate 12c, so that the flexible substrate 12 has the function of blocking water vapor and / or oxygen, but is not limited thereto. The first substrate 12a and the second substrate 12c may, for example, include organic materials. The inorganic layer 12b may, for example, include silicon oxide, silicon nitride, or other suitable materials. In some embodiments, when the flexible substrate 12 is a single-layer structure, the flexible substrate 12 may be composed of an organic material, but is not limited thereto.

[0061] like Figure 4 and Figure 5 As shown, the electronic unit 14 may include a circuit layer 14a and an electronic component 14b, wherein the circuit layer 14a may be disposed on the flexible substrate 12, and the electronic component 14b may be disposed on the circuit layer 14a and coupled to the circuit layer 14a. The circuit layer 14a may be, for example, a film layer including active components or passive components, for receiving external signals and driving the electronic component 14b according to the external signals, so that the electronic component 14b generates outputs accordingly, such as emitting light or emitting radio frequency electromagnetic waves. The electronic component 14b may, for example, include a light-emitting component or other suitable components. The light-emitting component may, for example, include an inorganic light-emitting diode or an organic light-emitting diode, but is not limited thereto. In this article, the electronic component 14b is taken as an example of a light-emitting component, but is not limited thereto. In this case, when viewed along the top-view direction TD, the distribution area of ​​the electronic component 14b may be used as the display area AA. In some embodiments, the electronic component 14b may include a light sensor, a blood oxygen detector, a heartbeat detector, a blood pressure detector, a diode, other suitable components or a combination of the above components, but the present invention is not limited thereto.

[0062] In some embodiments, the electronic unit 14 may further include an insulating layer 24 disposed between the flexible substrate 12 and the circuit layer 14a. The insulating layer 24 may be used as a buffer layer of the electronic device 1 to reduce the impact of moisture and / or oxygen on the circuit layer 14a and / or the electronic element 14b.

[0063] For example, the circuit layer 14a may further include a plurality of transistors 14T, at least one transistor 14T may be coupled to at least one electronic element 14b and serve as a driving element and / or a switching element of the electronic element 14b, but the present invention is not limited thereto. Figure 4 In the embodiment, the electronic components 14b may be coupled to the corresponding transistors 14T, but are not limited thereto. The circuit layer 14a may include at least one semiconductor layer, multiple insulating layers, and multiple conductive layers to form transistors 14T, signal lines, traces, capacitors, electrodes, and / or other circuit components. Figure 4In the embodiment of the present invention, the insulating layer may include an insulating layer 28, an insulating layer 32, and an insulating layer 36, and the conductive layer may include a conductive layer 30, a conductive layer 34, and a conductive layer 38, and the insulating layer 28, the conductive layer 30, the insulating layer 32, the conductive layer 34, the insulating layer 36, and the conductive layer 38 may be formed in sequence, but are not limited thereto. The insulating layer 32 and the insulating layer 36 may, for example, have through holes, so that the electrode of the conductive layer 34 may be electrically connected to the transistor 14T through the through holes of the insulating layer 32, and the electrode of the conductive layer 38 may be electrically connected to the corresponding electrode of the conductive layer 34 through the through holes of the insulating layer 36, and / or electrically connected to the corresponding electrode of the conductive layer 30 through the through holes of the insulating layer 32 and the insulating layer 36, but are not limited thereto. The number of insulating layers and conductive layers and the layout structure of the wire layer are not limited to each other. Figure 4 It is limited and can be adjusted according to actual needs. Figure 4 The structure of the circuit layer 14 shown is exemplary, and the present invention is not limited thereto.

[0064] exist Figure 4 and Figure 5 In the circuit layer 14, the transistor 14T is a top-gate thin film transistor as an example, but not limited thereto. In this case, the transistor 14T may include a gate G and a semiconductor 26, wherein the two end portions of the semiconductor 26 may be doped with dopants to serve as a source region and a drain region respectively, and the portion of the semiconductor 26 between the source region and the drain region may serve as a channel region of the transistor 14T, and the insulating layer 28 may serve as a gate insulating layer of the transistor 14T. The material of the semiconductor 26, for example, includes silicon or metal oxide, such as a low temperature polysilicon (LTPS) semiconductor or an amorphous silicon (a-Si) semiconductor, an indium gallium zinc oxide (IGZO) semiconductor or other suitable semiconductor, but not limited thereto. In some embodiments, the semiconductors 26 of different transistors 14T may include different materials, for example, the semiconductor 26 of one transistor 14T includes a low temperature polysilicon semiconductor, and the semiconductor 26 of another transistor 14T includes a metal oxide semiconductor, but not limited thereto.

[0065] In some embodiments, the electronic unit 14 may further include an insulating layer 40 and an insulating layer 42, which are sequentially disposed on the circuit layer 14a and have a plurality of openings OP1 for respectively disposing corresponding electronic components 14b. For example, the openings OP1 may be used to define the positions of pixels or sub-pixels of the electronic device 1, and the insulating layer 40 may be referred to as a pixel definition layer, but is not limited thereto. In some embodiments, the electronic unit 14 may selectively not include the insulating layer 42, but is not limited thereto.

[0066] In one embodiment, the electronic unit 14 may further include a conductive layer 44 disposed on the insulating layer 42. The electrodes or traces of the conductive layer 44 may be used, for example, to electrically connect the components in the circuit layer 14a to external components or to electrically connect different parts in the circuit layer 14a, but is not limited thereto. In some embodiments, the electronic unit 14 may further selectively include a plurality of protective members 46, which are respectively disposed on the corresponding electronic components 14b to protect the electronic components 14b. The protective members 46 may, for example, be respectively disposed in the corresponding openings OP1, but are not limited thereto. The protective members 46 may, for example, include optical adhesive, UV curing adhesive, or other suitable materials.

[0067] In some embodiments, the insulating layer 24, the insulating layer 28, the insulating layer 32, the insulating layer 36, the insulating layer 40 and the insulating layer 42 may respectively include a single-layer structure or a multi-layer structure, and may include any suitable organic material or inorganic material. The organic material may include, for example, PMMA, epoxy, siloxane, silica gel, other suitable materials or a combination of the above materials. The inorganic material may include silicon nitride, silicon oxide, liquid glass, glass glue, titanium oxide, aluminum oxide, other suitable materials or a combination of the above materials. In some embodiments, when the insulating layer 24, the insulating layer 28, the insulating layer 32, the insulating layer 36, the insulating layer 40 and the insulating layer 42 are multi-layer structures, they may each include a stacked structure of multiple layers of inorganic materials or multiple layers of organic materials, or a structure of alternating stacks of inorganic materials / organic materials, but the present invention is not limited thereto. The conductive layer 30 , the conductive layer 34 , the conductive layer 38 , and the conductive layer 44 may respectively include metal or other suitable conductive materials.

[0068] like Figure 4 As shown, the electronic unit 14 may also include an encapsulation layer 14c, which is disposed on the circuit layer 14a and the electronic component 14b to reduce the influence of moisture and / or oxygen on the transistor 14T, the electronic component 14b, the electrode and / or the wiring of the circuit layer 14a. The encapsulation layer 14c may include a single-layer structure or a multi-layer structure, and may include any suitable organic material or inorganic material. The encapsulation layer 14c may, for example, include PI or other suitable materials. In some embodiments, the electronic unit 14 may also include a flat layer 14d, which is disposed on the encapsulation layer 14c and has a flat upper surface to help fit with the outer cover 16. The flat layer 14d may, for example, include an organic material or other suitable materials.

[0069] It should be noted that, in some embodiments, the portion of the flat layer 14d adjacent to the edge E2 of the flexible substrate 12 may be removed to expose the pads of the circuit layer 14a (not shown), so that the circuit board ( Figure 1 or Figure 2 The circuit board 18 shown can be joined and electrically connected to the pads to further electrically connect to other components in the circuit layer 14a. The electronic device 1 can also optionally include a packaging glue disposed on the junction between the circuit board 18 and the pads, but is not limited thereto. In order to clearly show the electronic unit 14, Figure 4 The structure of the circuit board and the pad is omitted, but the invention is not limited thereto.

[0070] like Figure 4 and Figure 5 As shown, the electronic unit 14 may include, for example, at least one dam structure 48, which is disposed between the edge (e.g., edge E2) of the flexible substrate 12 and the electronic component 14b in the top view direction TD, and is used to prevent the encapsulation layer 14c from overflowing to the outside of the dam structure 48 during formation. When viewed from the top view direction TD, the dam structure 48 may, for example, surround the transistor 14T and the electronic component 14b of the circuit layer 14a. Figure 4 In an embodiment, the electronic unit 14 may include two dam structures 48, which are arranged in sequence between the electronic component 14b and the edge of the flexible substrate 12. The dam structure 48 may, for example, include a stack of an organic layer 48a and an inorganic layer 48b. The organic layer 48a may, for example, include the same material as a film layer in the electronic unit 14, be formed by the same process, or be formed by the same organic layer. The inorganic layers 48b of different dam structures 48 may, for example, be connected to each other, but are not limited to this. In some embodiments, the inorganic layer 48b may, for example, include a single-layer structure or a multi-layer structure. In some embodiments, the electronic unit 14 may include different film layers and components depending on the type of the electronic device 1. In some embodiments, the number of dam structures 48 is not limited to 1. Figure 4 is limited to, and can be at least one.

[0071] In some embodiments, the electronic unit 14 may further selectively include a crack stop structure 50 disposed in the insulating layer of the electronic unit 14. The crack stop structure 50 may be used to prevent cracks at the edges of the insulating layer of the electronic unit 14 from extending into the display area AA. Viewed along the top view direction TD, the crack stop structure 50 may be disposed between the dam structure 48 and the edge of the flexible substrate 12 (for example, edge E1 or edge E2). The crack stop structure 50 may, for example, be a groove or an opening in at least one insulating layer extending to the edge of the adjacent flexible substrate 12, wherein a groove refers to a structure that does not penetrate the insulating layer, and an opening refers to a structure that penetrates the insulating layer. Figure 4In the embodiment, the crack prevention structure 50 may be an opening of the insulating layer 32, but is not limited thereto. In some embodiments, the crack prevention structure 50 may, for example, penetrate the insulating layer 32 and the insulating layer 28 or penetrate the insulating layer 32, the insulating layer 28 and the insulating layer 24, but is not limited thereto. Figure 4 and Figure 5 In the embodiment, the flat layer 14d can be selectively disposed in the crack prevention structure 50. In some embodiments, the number of the crack prevention structures 50 is not limited to Figure 4 is limited to, and can be at least one.

[0072] It is worth noting that the first layer 14a can cover the display area AA in the top-view direction TD, thereby reducing the texture abnormality at the edge of the screen of the electronic device 1. Figure 4 and Figure 5 In the embodiment, the first layer 14a may partially overlap or cover the dam structure 48 in the top view direction TD to reduce damage to the dam structure 48, thereby improving the protection of the circuit layer 14a and the electronic components 14b. In some embodiments, the first layer 14a may not overlap the anti-crack structure 50 in the top view direction TD, but is not limited thereto. In some embodiments, the first layer 14a may also overlap the dam structure 48 and the anti-crack structure 50 at the same time, but is not limited thereto. In some embodiments, Figure 4 and Figure 5 Other parts of the electronic device may adopt the above or below embodiments, and thus will not be described in detail herein.

[0073] Figure 6 The electronic device of some embodiments of the present invention is shown along Figure 2 A schematic cross-sectional view of the section line D-D', and Figure 7 The electronic device of some embodiments of the present invention is shown along Figure 2 The schematic cross-sectional view of the section line E-E'. Figure 2 As shown, Figure 6 The structure shown is the portion of the electronic device 1 corresponding to the folding area R3. Figure 7 The structure shown is the portion of the electronic device 1 corresponding to the non-folding region R2. The first layer 16a may have at least one notch 52, which is disposed on the folding region R3 and faces the edge E9 of the flexible substrate 12, so as to reduce the damage of the portion of the first layer 16a located in the folding region R3 when the electronic device 1 is folded. In this embodiment, the first layer 16a may have two notches 52, which face two opposite edges E9 of the flexible substrate 12 respectively.

[0074] like Figure 6 and Figure 7As shown, the first layer 16a retreats a distance W4 from the edge E9 of the folding region R3 and retreats a distance W5 from the edge E9 of the non-folding region R2, wherein the distance W4 is greater than the distance W5. That is, when viewed from the top direction TD, the distance W4 between the edge E7 of the folding region R3 and the edge E8 of the first layer 16a located in the folding region R3 may be greater than the distance W5 between the edge E7 of the non-folding region R2 and the edge E9 of the first layer 16a located in the non-folding region R2.

[0075] exist Figure 6 In the embodiment, the edge of the first layer 16a may not be aligned with the edge of the adhesive layer 16e, but the present invention is not limited thereto. Figure 6 and Figure 7 In some embodiments, the edge of the second layer 16b adjacent to the edge E9 of the folding region R3 may be flush with the edge E9 in the top view direction TD or not, but is not limited thereto. In some embodiments, the edge of the third layer 16c adjacent to the edge E9 of the folding region R3 may be flush with the edge E9 in the top view direction TD or not, but is not limited thereto. In some embodiments, the first layer 16a may not have the notch 52, but is not limited thereto. In some embodiments, Figure 6 and Figure 7 Other parts of the electronic device may adopt the above or below embodiments, and thus will not be described in detail herein.

[0076] Please refer to Figure 8 , which shows the electronic devices corresponding to some embodiments of the present invention Figure 2 A schematic cross-sectional view of the section line A-A'. Figure 8 As shown, the flexible substrate 12 may include a cross-folding region R3 and a non-folding region R2. For the convenience of explanation, Figure 8 The circuit board and the bending area are omitted, but not limited to this. Figure 8 In the embodiment of the present invention, the support film 20 may have an opening OP2, which overlaps with the folding area R3 of the flexible substrate 12 in the top-view direction TD. The opening OP2 can help reduce the stress of the portion corresponding to the folding area R3 when the electronic device 1 is folded. In some embodiments, the first layer 16a can overlap with the opening OP2 in the top-view direction TD, thereby improving the consistency of the display texture of the electronic device 1.

[0077] exist Figure 8 In the embodiment of the present invention, the electronic component 14b may include an organic light emitting diode, but is not limited thereto. For example, the electronic component 14b may include an electrode EL1, a light emitting layer LL, and an electrode EL2, which are sequentially disposed on the insulating layer 36, wherein the electrode EL1 may be electrically connected to the electrode of the conductive layer 34 through the through hole of the insulating layer 36, and further electrically connected to the transistor 14T. In some embodiments, the electrodes EL2 of different electronic components 14b may be formed by the same conductive layer, but is not limited thereto. In some embodiments, Figure 8The electronic component 14b can also be replaced by the electronic component of the above-mentioned embodiment.

[0078] exist Figure 8 In the embodiment, the electronic unit 14 may selectively include a shading pattern LS disposed on the encapsulation layer 14c, and the shading pattern LS may correspond to the insulating layer 40 in the top-view direction TD, but is not limited thereto. If the material of the shading pattern LS includes metal, the shading pattern LS may be used as a touch pattern to sense touch events. In some embodiments, the electronic unit 14 may further include an insulating layer 14e disposed between the shading pattern LS and the flat layer 14d and between the dam structure 48 and the flat layer 14d, but is not limited thereto. In some embodiments, Figure 8 Other parts of the electronic device 1 may adopt the above or below embodiments, and thus will not be described in detail herein.

[0079] Please refer to Fig. 9 , which is a side view schematic diagram of an electronic device disposed on an object according to a second embodiment of the present invention. Fig. 9 As shown, the object 10 may have a front surface S1, two side curved surfaces S21, two side curved surfaces S22, and four corner surfaces S3, wherein the side curved surfaces S21, the side curved surfaces S22, and the corner surfaces S3 may constitute the side surfaces of the object 10. The object 10 may be, for example, a handheld device, such as a mobile phone, a tablet, or other suitable devices. For example, when the electronic device 2 is a display device, the side curved surfaces S21 may be the left and right sides of the object 10 when the object 10 is held in the hand, and the side curved surfaces S22 may be the upper and lower sides of the object 10.

[0080] The electronic device 2 of this embodiment can be, for example, disposed on the front surface S1 and the side surface of the object 10. For example, the first portion P1 of the electronic device 2 can include a flat region R4, a curved region R51, a curved region R52, and a corner region R6, wherein the curved region R51 is disposed on the upper and lower sides of the flat region R4, respectively, the curved region R52 is disposed on the left and right sides of the flat region R4, and the corner region R6 is disposed between adjacent curved regions R51 and R52. The flat region R4, the curved region R51, the curved region R52, and the corner region R6 can be attached to the front surface S1, the side curved surface S21, the side curved surface S22, and the corner surface S3, respectively, so that the electronic device 2 can surround the side surface of the object 10. Since the curved region R51, the curved region R52, and the corner region R6 can be disposed on the side curved surface S21, the side curved surface S22, and the corner surface S3, respectively, a non-planar surface can be provided. For example, the Gaussian curvature of the flat area R4, the curved area R51, and the curved area R52 may be 0, while the corner area R6 may have a Gaussian curvature that is not equal to 0. In the present invention, the "Gaussian curvature of the corner area R6 is not equal to 0" means that the corner area R6 is a region with a spherical surface. For example, the Gaussian curvature of the corner area R6 may be greater than 0. The Gaussian curvature referred to in the present invention may be obtained by, for example, using a scanning device and 3D analysis software (for example, Geomagic Design X 3D or other suitable software, but not limited thereto), scanning the surface of the object 10 and establishing a 3D model. After analysis, an objective Gaussian curvature value of the appearance of the object 10 may be obtained, thereby obtaining the Gaussian curvature of the first portion P1 disposed on the object 10.

[0081] Please refer to Fig.10 , which is a top view schematic diagram of an electronic device in a flattened state according to a second embodiment of the present invention. Fig.10 As shown, in the electronic device 2 of the present embodiment, the first layer 16a may cover the flat area R4 and not cover the curved area R51, the curved area R52 and the corner area R6 of the first portion P1, so that the first layer 16a may not be disposed on a curved surface, thereby reducing the damage of the first layer 16a. In this case, the first layer 16a may not cover the second portion P2, but is not limited thereto. In the present invention, an element "covering" another element may refer to the element overlapping the other element in the top view direction TD of the electronic device 2.

[0082] It should be noted that the second portion P2 of this embodiment and the circuit board 18 may be similar to Figure 2 The second portion P2 is connected to the circuit board 18, and when the electronic device 2 is assembled, the second portion P2 can be bent to the back side of the first portion P1 (for example, Fig.11 The back side BS), therefore, the second part P2 and the circuit board 18 can be referred to above and will not be described in detail here.

[0083] Please refer to Fig.11 and Fig.12 , Fig.11 Shown along Fig.10 A schematic cross-sectional view of the section line F-F', and Fig.12 Shown along Fig.10 The cross-sectional view of the section line G-G' is shown in FIG. Figure 10 to Figure 12 As shown, since edge E1 is the edge of the curved area R51 of the first portion P1 away from the circuit board 18, and edge E9 is the edge of one of the curved areas R51 of the first portion P1, edge E1 and edge E9 may correspond to the upper curved surface and the right curved surface (or the left curved surface) of the object 10 respectively. Figure 10 to Figure 12 In the embodiment, the first layer 16a may retreat from the edge E1 of the first portion P1 by a distance W1 and retreat from the other edge E9 of the first portion P1 by a distance W8, and the distance W1 is not equal to the distance W8. For example, the distance W1 may be greater than the distance W8, so that the portion of the electronic device 2 adjacent to the left curved surface and the right curved surface of the object 10 may be covered by more of the first layer 16a, thereby improving the display texture of the portion of the electronic device 2 adjacent to the left curved surface and the right curved surface of the object 10.

[0084] exist Fig.11 In the embodiment of , when the first layer 16a does not cover the curved region R51, the electronic component 14b may include at least one first electronic component 14b1 and at least one second electronic component 14b2, wherein the first electronic component 14b1 may be disposed on the flat region R4, and the second electronic component 14b2 may be disposed on the curved region R51. Fig.12 In the embodiment, when the first layer 16a does not cover the curved area R52, the electronic component 14b may include at least one first electronic component 14b1 and at least one second electronic component 14b2, wherein the first electronic component 14b1 may be disposed on the flat area R4, and the second electronic component 14b2 may be disposed on the curved area R51. In some embodiments, the electronic component 14b may be selectively not disposed on the curved area R51 and / or the curved area R52. In some embodiments, other parts of the electronic device 2 may be similar to or the same as the above-mentioned embodiment, and may refer to the above-mentioned or following embodiments, so no further details are given here.

[0085] Please refer to Fig.13 , which shows that some embodiments of the electronic device of the present invention are along Fig.10 A schematic cross-sectional view of the section line H-H', wherein Fig.13 The electronic device shown may be, for example, in a state of being attached to an object. Fig.13As shown, in some embodiments, the adhesive layer 16f and the adhesive layer 16e may extend into the curved region R52, so that the adhesive layer 16f and the adhesive layer 16e may cover at least one edge (e.g., edge E8) of the first layer 16a, thereby reducing the cracking of the first layer 16a. In this way, the total thickness T4 of the adhesive layer 16f and the adhesive layer 16e in the flat region R4 (i.e., the sum of the thickness T2 of the adhesive layer 16f and the thickness T3 of the adhesive layer 16e) may be less than the total thickness of the adhesive layer 16f and the adhesive layer 16e in the curved region R52. The total thickness T2 of the adhesive layer 16f and the adhesive layer 16e may be the total thickness of the adhesive layer 16f and the adhesive layer 16e in the top view direction TD measured after the curved region R52 is flattened.

[0086] In some embodiments, the edge E8 of the first layer 16a may be, for example, a semi-arc surface facing the second layer 16b (eg, Fig.13 The edge E8 shown in the figure may be chamfered, have a semi-arc surface facing the third layer 16c, or have a chamfered or semi-circular surface (such as Fig.15 The edge E8 shown in the figure can reduce the stress at the edge corner of the first layer 16a, thereby reducing crack damage, and this situation can be applied to any of the above or below embodiments. In some embodiments, Fig.13 The other parts of the electronic device may be similar or identical Figure 10 to Figure 12 For the embodiments of the present invention, reference may be made to the above or below embodiments, and therefore no further details will be given here.

[0087] Please refer to Fig.14 and Fig.15 , Fig.14 The electronic device of some embodiments of the present invention is shown along Fig.10 A schematic cross-sectional view of the section line I-I', and Fig.15 The electronic device of some embodiments of the present invention is shown along Fig.10 A schematic cross-sectional view of the section line J-J', wherein Fig.14 and Fig.15 The electronic device shown may be, for example, in a state of being attached to an object. Fig.14 and Fig.15 As shown, in some embodiments, the second layer 16b may include a pattern PT1 disposed on the corner region R6, and the third layer 16c may include a pattern PT2 disposed on the corner region R6, wherein the depth of the pattern PT1 may be less than the depth of the pattern PT2. With this design, the electronic device 2 may have a larger deflection amplitude when disposed on the corner surface of an object, so that it can conform to the surface of the object corresponding to the corner region R6 (for example, Fig. 9 Since the pattern PT2 closer to the flexible substrate 12 has a greater depth, the portion of the third layer 16c corresponding to the corner region R6 can be allowed to be more stretched, thereby improving the degree of adherence of the electronic device to the corner surface.

[0088] The pattern PT1 may include a plurality of microstructures ST1, and the microstructures ST1 may be grooves recessed from the surface of the second layer 16b facing the flexible substrate 12 into the second layer 16b or openings penetrating the second layer 16b, but is not limited thereto. The pattern PT2 may include a plurality of microstructures ST2, and the microstructures ST2 may be grooves recessed from the surface of the third layer 16c facing the flexible substrate 12 into the third layer 16c or openings penetrating the third layer 16c, but is not limited thereto. Fig.14 and Fig.15 In the embodiment, the pattern PT1 and the pattern PT2 may both be grooves, and the width of the groove in the direction along the section line (e.g., the first direction D1) may decrease as the depth increases, for example, the cross-sectional shape of the groove is an inverted V shape, but is not limited thereto. In some embodiments, the groove may have the same width in the direction along the section line as the depth varies, but is not limited thereto. In one embodiment, the adhesive layer 16f may be further disposed in the microstructure ST1, but is not limited thereto.

[0089] like Fig.14 As shown, a portion of the electronic unit 14 may extend to the corner region R6 of the flexible substrate 12. In other words, the electronic components (eg Fig.21 The electronic component 14b) disposed on the corner region R6 can be disposed on the corner region R6 so that the portion of the electronic device corresponding to the corner region can also display an image, but is not limited thereto. In some embodiments, Fig.14 and Fig.15 The other parts of the electronic device may be similar or identical Figure 10 to Figure 12 For the embodiments of the present invention, reference may be made to the above or below embodiments, and therefore no further details will be given here.

[0090] Please refer to Fig.16 and Fig.17 , Fig.16 FIG. 1 is a schematic top view of an electronic device in a flattened state according to a third embodiment of the present invention, and Fig.17 The electronic device according to the third embodiment of the present invention is shown along Fig.16 A schematic cross-sectional view of the section line K-K' and the section line L-L', wherein Fig.17 The electronic device shown may be, for example, in a state of being attached to an object. Fig.16 and Fig.17 As shown, the electronic device 3 of this embodiment is Fig.10The difference between the electronic device 2 of the embodiment is that the first layer 16a of the present embodiment can cover the flat area R4, the curved area R52 and the curved area R51, and does not cover the corner area R6 of the flexible substrate 12. Since the Gaussian curvature of the flat area R4, the curved area R52 and the curved area R51 of the flexible substrate 12 is 0, the stress of the first layer 16a disposed thereon can be reduced, thereby reducing the damage of the first layer 16a. By extending the first layer 16a to the curved area R52 and the curved area R51, the display texture of the portion of the electronic device 3 corresponding to the curved area R52 and the curved area R51 can be improved and / or the protection of the portion of the electronic unit 14 disposed on the curved area R52 and the curved area R51 can be improved. In some embodiments, in addition to not covering the corner area R6 , the first layer 16 a may selectively not cover at least one curved area R51 and / or at least one curved area R52 , and cover other curved areas R51 and / or curved areas R52 , but is not limited thereto.

[0091] like Fig.17 As shown, the first layer 16a may cover the curved area R52 while retreating a distance from the edge E9 of the flexible substrate 12. In other words, the edge E8 of the first layer 16a may not be aligned with the edge E9 of the flexible substrate 12. In some embodiments, the edge of the adhesive layer 16f may not be aligned with the edge corresponding to the adhesive layer 16e, but is not limited thereto. Since the first layer 16a does not extend to the corner area R6, the adhesive layer 16f and the adhesive layer 16e disposed on the corner area R6 may contact each other and may cover the edge of the first layer 16a located on the curved area R51 (or the curved area R52).

[0092] exist Fig.17 In the embodiment of the present invention, the cross-sectional shape of the microstructure ST1 of the pattern PT1 and the microstructure ST2 of the pattern PT2 along the section line (e.g., the first direction D1) may be, for example, a rectangle or other suitable shape, but is not limited thereto. In this case, the adhesive layer 16e may be disposed in the microstructure ST2, but is not limited thereto. In some embodiments, Fig.16 and Fig.17 The other parts of the electronic device 3 may be similar or identical Figure 10 to Figure 12 For the embodiments of the present invention, reference may be made to the above or below embodiments, and therefore no further details will be given here.

[0093] Please refer to Fig.18 , which is a cross-sectional schematic diagram of an electronic device in a flattened state according to some embodiments of the present invention. Fig.18 As shown, in the outer cover 16 of the electronic device 3a, the cross-sectional shapes of the microstructure ST1 of the pattern PT1 and the microstructure ST2 of the pattern PT2 along the same section line direction may have different cross-sectional shapes. For example, the cross-sectional shape of the groove of the microstructure ST1 is an inverted V shape, while the cross-sectional shape of the groove of the microstructure ST2 is a rectangle, but it is not limited thereto.

[0094] In the outer cover 16 of the electronic device 3b, the second layer 16b may not have the pattern PT1, and the third layer 16c may have the pattern PT2. In the electronic device 3b, the microstructure ST2 of the pattern PT2 may be an opening that penetrates the third layer 16c, and the adhesive layer 16e may be disposed in the opening. The cross-sectional shape of the microstructure ST2 along the same section line direction may be, for example, an inverted V shape or other suitable shapes. In some embodiments, the microstructure ST2 may be a groove that does not penetrate the third layer 16c, but is not limited thereto.

[0095] In the outer cover 16 of the electronic device 3c, when the second layer 16b may not have the pattern PT1, the microstructure ST2 of the third layer 16c may be an opening penetrating the third layer 16c. In this case, the adhesive layer 16e may be disposed in the opening. The cross-sectional shape of the microstructure ST2 along the same section line direction may be, for example, a rectangle or other suitable shape. In some embodiments, Fig.18 Any one of the outer covers 16 of the electronic device 3a, the electronic device 3b and the electronic device 3c may be applicable to the above or below-mentioned embodiments.

[0096] Please refer to Fig.19 , which is a cross-sectional schematic diagram of a portion of the outer cover corresponding to one of the curved surface areas in some embodiments of the present invention in a flattened state. Fig.19 As shown, in the outer cover 161, the edge E10 of the first layer 16a, the edge of the adhesive layer 16f and the edge of the adhesive layer 16e may not be aligned with each other. In one embodiment, the edge of the adhesive layer 16e may be retreated from the edge of the first layer 16a by a distance, but is not limited thereto.

[0097] In the outer cover 162 , with the edge of the adhesive layer 16e retreated a distance from the edge E10 of the first layer 16a , the adhesive layer 16f may extend between the first layer 16a and the third layer 16e to protect the edge of the first layer 16a .

[0098] In the outer cover 163, when the edge E8 of the first layer 16a is retreated from the edge E11 of the second layer 16b, the outer cover 163 may further include a packaging glue 54, which is disposed on the edge E10 of the first layer 16a to protect the first layer 16a. For example, the packaging glue 54 may fill the recess formed by the retreat of the first layer 16a, and the packaging glue 54 may selectively extend to the edge E11 of the second layer 16b and / or the edge E12 of the third layer 16c.

[0099] Please refer to Fig. 20 , which is a cross-sectional schematic diagram of a portion of the outer cover corresponding to one of the curved surface areas in some embodiments of the present invention in a flattened state. Fig. 20As shown, the outer cover 164 and the outer cover 165 may not include a third layer. In this case, the first layer 16a can be directly attached to the electronic unit (for example, the electronic unit 14 of any of the above or below embodiments). In the outer cover 165, the adhesive layer 16f can further cover the edge E10 of the first layer 16a, thereby protecting the first layer 16a.

[0100] In some embodiments, Fig.19 The outer cover 161, the outer cover 162 and the outer cover 163 and Fig. 20 Any one of the outer cover 164 and the outer cover 165 may be applicable to the above or below embodiments.

[0101] Please refer to Fig.21 , which shows the electronic device of some embodiments of the present invention in a flat state corresponding to Fig.16 A partial cross-sectional view of the section line K-K' and the section line M-M'. Fig.21 As shown, the electronic device 3 of some embodiments is Fig.11 and Fig.12 The difference of the embodiment is that the first layer 16a can extend onto the curved area of ​​the flexible substrate 12. Since the other parts of the flexible substrate 12, the electronic unit 14 and the outer cover 16 corresponding to the section line K-K' can be similar or identical Fig.11 and Fig.12 Therefore, please refer to the above and will not go into details here.

[0102] like Fig.21 As shown, the corner region R6 of the flexible substrate 12 may have a patterned structure. For example, the corner region R6 may have an opening OP3, wherein the size of the opening OP3 may change as the flexible substrate 12 is stretched, so that the corner region R6 may have a Pusson's ratio less than 0, for example, to help the portion of the electronic device 3 corresponding to the corner region R6 to fit the corner surface of the object.

[0103] exist Fig.21In the embodiment of the present invention, the insulating layer 24, the insulating layer 28, the insulating layer 32, the insulating layer 36 and the insulating layer 40 may have an opening OP4, corresponding to the opening OP3 of the corner area R6, so as to facilitate the stretching or deformation of the portion of the electronic device 3 corresponding to the corner area R6. The insulating layer 42 may extend into the opening OP4 and the opening OP3, and the encapsulation layer 14c may be disposed in the opening OP4. In some embodiments, the electronic unit 14 may include a plurality of block structures 60, which may be respectively disposed on the corner area R6. In other words, the film layer on the corner area R6 may be patterned to form a block structure 141. Each block structure 60 may, for example, include an insulating layer 24, a circuit layer 14a, an insulating layer 40 and an electronic component 14b. The insulating layer 42 may extend between the block structures 60, for example, may contact the corner area R6. In addition, the conductive layer 44 may include a trace 62, which is disposed in the insulating layer 42 and extends between the block structures 60 to electrically connect different block structures 60. In some embodiments, the number of the electronic component 14 b in each block structure 60 may be at least one, but is not limited thereto.

[0104] like Fig.21 As shown, the electronic device 3 may further include a support film 20 disposed on the back side BS of the flexible substrate 12. The support film 20 may selectively include an opening OP5 to help stretch the portion of the electronic device 3 corresponding to the corner region R6. In some embodiments, Fig.21 The other parts of the electronic device 3 may be similar or identical Fig.16 and Fig.17 For the embodiments of the present invention, please refer to the above, so no further details will be given here.

[0105] Fig. 22 FIG. 4 is a schematic top view of an electronic device in a flattened state according to a fourth embodiment of the present invention. Fig. 22 As shown, the electronic device 4 of this embodiment is Fig.16 The difference between the electronic device 3 and the electronic device 4 is that the electronic device 4 may have a folding axis FA, so that the electronic device 4 can be folded along the folding axis FA. Fig. 22 In the embodiment, the electronic device 4 may include a notch 56, which is disposed in the curved area R52, and the notch 56 may separate the curved area R52 into two sub-curved areas R52a. In addition, the film layers (for example, the electronic unit and the outer cover 16 including the first layer 16a) located on different sub-curved areas R52a will also be separated into two parts. When the electronic device 4 is folded along the folding axis FA, the two parts R4a of the flat area R4 may be folded in the directions opposite to the top-view direction TD, that is, folded in a face-to-face manner with the surfaces of the two parts R4a facing the electronic unit. Since the curved area R52a is attached to the object in a manner bent toward the top-view direction TD, the problem of the sub-curved area R52a being unable to be folded can be avoided by the notch 56. In some embodiments, Fig. 22The other parts of the electronic device 4 may adopt any of the above embodiments, so please refer to the above, and will not be described in detail here.

[0106] Fig.23 FIG. 2 is a side view of an electronic device according to a fifth embodiment of the present invention. Fig.23 As shown, the two parts of the electronic device 5 of this embodiment can be folded and fixed in a face-to-face manner with the back side BS of the flexible substrate 12 to form a double-sided electronic device, such as a double-sided display device. In some embodiments, the electronic device 5 can also be fixed with the back side BS of the flexible substrate 12 curled inward to form a columnar or wraparound electronic device, such as a columnar or wraparound display device, so that the electronic device 5 can display images in multiple directions. Fig.23 Other parts of the electronic device 5 may be the same as or similar to any of the above embodiments, so please refer to the above and will not be described in detail here.

[0107] In summary, in the electronic device of the present invention, the first layer retreats a distance from one edge of the first part and another distance from the other edge, and the distance may be different from the other distance, so that the first layer can be reduced from cracks due to the bending of the second part, thereby reducing the damage to the first layer. In this case, it is allowed to set the first layer in the electronic device to improve the display quality of the electronic device and / or improve the reliability of the electronic device. In addition, the first layer can be set in the folding area or curved area of ​​the flexible substrate to improve the display quality of the non-planar part of the electronic device.

[0108] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electronic device, characterized in that: include: A flexible substrate having a first portion and a second portion; an electronic unit, disposed on the flexible substrate; as well as an outer cover, disposed on the electronic unit, and the outer cover includes a first layer; The first layer retreats a first distance from an edge of the first portion and retreats a second distance from an edge of the second portion, and the second distance is different from the first distance.

2. The electronic device according to claim 1, wherein: The invention also includes a circuit board which is connected to the second part, and the second distance is greater than the first distance.

3. The electronic device according to claim 1, wherein: The ratio of the second distance to the first distance ranges from 1.5 to 1000.

4. The electronic device according to claim 1, wherein: The outer cover also includes a second layer disposed on the first layer.

5. The electronic device as claimed in claim 4, characterized in that: The first layer retreats from an edge of the second layer by a third distance, and the third distance ranges from 30 micrometers to 600 micrometers.

6. The electronic device as claimed in claim 4, characterized in that: The first layer includes an inorganic material, and the second layer includes an organic material.

7. The electronic device as claimed in claim 4, characterized in that: The outer cover also includes a coating layer disposed on the second layer.

8. The electronic device as claimed in claim 1, wherein: The thickness of the first layer is less than or equal to 100 micrometers.

9. The electronic device as claimed in claim 1, wherein: The first layer is glass.

10. The electronic device according to claim 1, wherein: The second portion is bent to a back side of the first portion.

11. The electronic device according to claim 10, wherein: The first portion includes a flat area and a first curved area. The electronic unit includes a first electronic component and a second electronic component. The first electronic component is disposed on the flat area, and the second electronic component is disposed on the first curved area.

12. The electronic device according to claim 11, wherein: The first layer covers the flat area and does not cover the first curved area.

13. The electronic device according to claim 11, wherein: The first layer covers the flat area and the first curved area.

14. The electronic device according to claim 11, wherein: The first portion further includes a second curved area and a corner area between the first curved area and the second curved area. The electronic unit further includes a third electronic component disposed on the corner area, and the corner area has a Gaussian curvature that is not equal to zero.

15. The electronic device according to claim 14, wherein: The first layer covers the flat area, the first curved area, and the second curved area, but does not cover the corner area.

16. The electronic device as claimed in claim 14, characterized in that: The first layer covers the flat layer but does not cover the first curved area, the second curved area, and the corner area.

17. The electronic device as claimed in claim 14, characterized in that: The outer cover also includes a second layer arranged on the first layer and a third layer arranged under the first layer, the second layer includes a first pattern arranged on the corner area, the third layer includes a second pattern arranged on the corner area, and the depth of the first pattern is less than the depth of the second pattern.

18. The electronic device according to claim 11, wherein: The outer cover further includes a second layer disposed on the first layer and a third layer disposed under the first layer, the second layer is attached to the first layer through a first adhesive layer, and the third layer is attached to the first layer through a second adhesive layer.

19. The electronic device as claimed in claim 18, characterized in that: The total thickness of the first adhesive layer and the second adhesive layer on the flat area is smaller than the total thickness of the first adhesive layer and the second adhesive layer on the first curved area.

20. The electronic device as claimed in claim 1, wherein: The first portion includes a folding area and a non-folding area, the first layer retreats a fourth distance from the edge of the folding area and retreats a fifth distance from the edge of the non-folding area, wherein the fourth distance is greater than the fifth distance.

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