Electronic device
By using deformed components and substrates in electronic equipment to form cooling channels, the complex and cost-effective cooling system in the prior art is solved, and the effect of simplifying the cooling system, improving sealing and heat dissipation efficiency is achieved.
Patent Information
- Application Number
- CN202411342455.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-26
- Filing Date
- 2024-09-25
- Publication Date
- 2025-03-28
AI Technical Summary
Existing electronic devices require complex castings or multi-piece welding heat sinks when cooling electronic components, resulting in complex and costly cooling systems.
A deformed member with a recessed portion is used to form a cooling channel to guide the cooling medium through the cooling channel through the cooling channel to cool the electronic components.
The cooling system of electronic equipment is simplified, the number of components is reduced, the sealing is improved, the cost is reduced, and the heat dissipation efficiency is improved.
Smart Images
Figure CN119730141A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to an electronic device having an electronic component and a mounting method for the electronic device. Background Art
[0002] In various electronic applications, it is necessary to dissipate heat from power electronic components using a liquid (usually cooling water). For this purpose, a heat sink installed in a housing is used, which in turn must be sealed relative to the environment.
[0003] In this case, complex castings or multi-part welded heat sinks with welded plates are usually used. In order to achieve the necessary precision, complex processing steps are usually required on complex castings or multi-part welded heat sinks. Summary of the invention
[0004] It may therefore be an object of the present invention to simplify the cooling of electronic components of an electronic device and to replace complex and cost-intensive heat sinks in a simple manner.
[0005] According to a first aspect of the present invention, an electronic device is provided, the electronic device comprising a substrate, wherein an electronic component is arranged on a first side of the substrate, and wherein a deformation component having a recess is arranged on a second side of the substrate opposite to the first side, wherein the deformation component and the substrate are combined in material, and the deformation component is shaped so that one or more cooling channels are formed in the region of the recess of the deformation component. A cooling medium, such as water, can be guided through the cooling channel for cooling the electronic component. Preferably, the substrate has an inlet and an outlet for the cooling medium.
[0006] In a preferred embodiment, the base plate is formed from metal and the deformation component is welded to the base plate at least in the region of the cooling channel formed by the one or more recesses.
[0007] In particular, the substrate is connected to a housing of the electronic device at the edge. The deformable component can advantageously form a cover of the housing. The substrate can advantageously be welded to the housing.
[0008] Thus, advantageously, a smaller number of components and a high tightness at the same time are achieved. Through the novel design of the combination of only the components that are absolutely necessary, a separate heat sink and thus a usually complex cover seal (usually a liquid seal) become superfluous. The structure with reduced components produces a number of advantages.
[0009] Components required in previous designs (e.g. seals, heat sinks) can be omitted and / or designed more simply. From a thermal point of view, this design offers the advantage that some heat transfer can be omitted compared to previous designs. Even in the case of an external heat sink, direct contact with electronic components (e.g. for connecting an electric motor) is still possible, since the cover is only installed after the base plate has been installed and electrical contact (e.g. with the stator wires of the electric motor) can thus be made between them.
[0010] In a preferred embodiment, a heat conducting medium, in particular a heat conducting adhesive, is arranged between the first side of the substrate and the electronic component. Thus, effective heat conduction from the electronic component through the substrate to the cooling medium is achieved. Alternatively, the electronic component can be welded to the substrate, for example.
[0011] The deformable component can preferably be designed as a deep-drawn component and in particular have a smaller material thickness than the substrate. This embodiment has the advantage that a cooling channel with a relatively small width can be realized. In the case of welding the deformable component to the substrate in the region of the recess, the surface on which the internal pressure acts can be designed to be as small as possible and thus the resulting forces acting on the substrate can also be reduced. The omission of the seal also reduces the forces acting on the substrate. By reducing the possibility of additional welds between the bonding channels, excessive deformation of the electronic device can be avoided as a whole.
[0012] A further advantage of this embodiment is that, in addition to the cooling channel, a recess can be formed for contact between the stator wire and the electronic component, which recess is in turn sealed with respect to the cooling channel by the weld seam.
[0013] In a possible embodiment, the housing can have an additional heat sink, wherein the cooling channels conduct the cooling medium from the electronic component to the heat sink. In this case, known embodiments of heat sinks can be used, for example metal heat sinks with cooling fins. Such heat sinks can be placed on the deformable component or can be placed on the housing separately from the deformable component. Other possible embodiments can provide that the deformable component forms the heat sink and / or the substrate has an exposed section, the heat sink is placed on the exposed section or the heat sink is constructed on the exposed section.
[0014] According to a second aspect of the present invention, a method for installing an electronic device according to the first aspect is provided. The method comprises the following steps:
[0015] a) mounting the electronic component on a first side of the substrate, wherein in particular a heat conducting medium is arranged between the substrate and the electronic component;
[0016] b) mounting the deformation component on the second side of the substrate, in particular such that at least one recess of the deformation component forms a passage between the inlet and outlet openings of the substrate,
[0017] c) welding the deformation component to the base plate adjacent to the recessed portion, so that a sealed closed area is formed between the second side surface of the base plate and the deformation component configured as a cooling channel,
[0018] d) Optionally: the deformation element is circumferentially welded to the base plate and / or the housing.
[0019] For example, the electronic device can be designed as part of an inverter for an electric motor and can be installed in a motor vehicle. In this case in particular, it may be advantageous to provide the following intermediate step after step a) and before step b) of the installation method:
[0020] a1) Install the base plate onto the motor.
[0021] a2) Make electrical contact between the stator wires of the motor and the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Embodiments of the present invention are described in detail with reference to the accompanying drawings.
[0023] Figure 1a ) shows a cross-sectional view through an edge region of an electronic device according to the prior art,
[0024] Figure 1b ) shows a cross-sectional view through an edge region of an electronic device according to a first embodiment of the present invention,
[0025] Figure 2a )and Figure 2b ) shows an electronic device according to a second embodiment of the present invention, the electronic device has a housing,
[0026] Figure 3 shows a cross-sectional view through an electronic device according to a third embodiment of the present invention,
[0027] Figure 4a)-Figure 4e) Different embodiments of the deformation element according to the invention and possible combinations with a heat sink are shown. DETAILED DESCRIPTION
[0028] In the following description of exemplary embodiments of the present invention, identical elements are denoted by identical reference numerals, wherein a repeated description of these elements is omitted where necessary. The figures merely schematically illustrate the subject matter of the present invention.
[0029] Figure 1a) shows a cross-sectional view through the edge region of an electronic device 100 according to the prior art. A group of electronic components 5 is fixed to the first side 12 of the metal substrate 10 by means of a solder layer 15. The cover 20 is arranged on the side 14 of the substrate 10 opposite to the first side 12 and is thermally connected to the substrate 10 by means of a heat conducting material 17. A channel 25 for a cooling medium 40 is formed in the cover 20. The channel 25 is sealed relative to the substrate 10 by means of an insert 22. According to this embodiment, all surfaces between the channel 25 and the insert 22 and between the insert 22 and the substrate 10 must be sealed.
[0030] Figure 1b ) shows a cross-sectional view through an edge region of an electronic device 1 according to a first embodiment of the present invention.
[0031] A group of electronic components 5 are fixed on the first side 12 of the metal substrate 10 via a heat conducting layer 16. A deformation component 30 is arranged on the side 14 of the substrate 10 opposite to the first side 12. The deformation component 30 has a recess 36. In the region of the recess 36, the deformation component 30 is sealed and welded to the substrate along a surrounding weld seam 32. Therefore, the recess 36 forms a cooling channel 35, through which a cooling medium 40, such as water, can be guided to dissipate heat from the electronic components 5.
[0032] It can be identified that according to Figure 1a ) compared to the prior art, the electronic device 1 has a simplified structure with fewer components and a simplified and therefore safer sealing process. Figure 1a ) compared to the prior art, the electronic device 1 has less heat transfer between the electronic component 5 to be dissipated and the cooling medium 40, so that more effective heat dissipation can be performed.
[0033] Figure 2a )and Figure 2b ) shows an electronic device 1 according to a second embodiment of the present invention in a perspective view, and the electronic device has a housing 50. Figure 2a ) shows a housing 50 without a cover. The substrate 10 arranged in the housing 50 and the electronic components 5 arranged on the side 12 of the substrate 10 pointing toward the interior of the housing are identified. The substrate 10 has an inlet opening 42 and an outlet opening 44 for introducing and removing a cooling medium.
[0034] Figure 2b) shows the same electronic device 1, wherein a deformation component 30 is arranged on the outward side 14 of the substrate 10, and the deformation component simultaneously serves as a cover of the housing 50. The deformation component 30 has a recess 36 extending from the inlet opening 42 along the electronic component 5 to the outlet opening 44 of the substrate 10, so that a cooling medium, such as water, can be guided through the intermediate space between the substrate 30 and the recess 36 of the deformation component, thereby forming a cooling channel. For sealing, the deformation component is welded 32 circumferentially at least in the area around the recess 36.
[0035] To produce the electronic device 1, the electronic components 5 are mounted only on a metal substrate 10 ("baseplate") (instead of being mounted on a processed heat sink as in the prior art), for example, a direct bonded copper ceramic substrate (DBC) can be welded or glued to a stamped aluminum plate. For gluing, a thermally conductive paste (thermal interface material = TIM) is preferably used directly below the heat source. The base plate 10 is also provided with two openings, which form an inlet 42 and an outlet 44 for the cooling medium after being installed in the housing 50.
[0036] The metal deformation part 30 is then installed as a housing cover, which in a particularly advantageous embodiment is produced as a shell-shaped part, for example by deep drawing. Its recessed area 36 now forms a channel between the inlet 42 and the outlet 44. The channel is then welded around the base plate 10, so that a sealed closed area, i.e. a cooling channel, is formed between the carrier plate 10 and the housing cover 30. During operation, a cooling medium flows through the cooling channel and transfers the waste heat of the electronic component 5 introduced via the base plate 10 to a cooler (not shown, see FIG. 4 ).
[0037] In the last step, the housing cover is now welded circumferentially to the housing edge, thereby achieving a sealing of the housing interior relative to the environment without the need for additional seals.
[0038] Particularly advantageous is the increased structural rigidity due to welding. Since the internal pressure in the cooling channel only causes deformations over a relatively small cooling channel width or deformations are still reduced due to the increased rigidity of the structural assembly, very small deformations occur in the area of the electronic components.
[0039] Figure 3 A cross-sectional view through an electronic device 1 according to a further embodiment of the invention is shown. The electronic device 1 has a substrate 10, on which two groups of electronic components 5, 5' are arranged on a first side 12 of the substrate. The substrate 10 has two notches 17, 18 for passing contact wires 62, 63 and a lead frame 65, wherein the lead frame 65 and / or the contact wires 62, 63 are in contact with the electronic components 5, 5'. The substrate is arranged in a housing 50.
[0040] A deformation component 30 is arranged on the side surface 14 of the substrate 10 opposite to the first side surface 12. The deformation component 30 has a plurality of recesses 36, 37, 38. The recesses 36 are arranged directly above the electronic components 5, 5' and together with the substrate 10 form a cooling channel 35 through which a cooling medium 40 (for example, water) can be guided. The recesses 37, 38 are used to protect the through-holes or lead frames 65 and the contact wires 62, 63.
[0041] For sealing, the deformation element 30 is welded in the region of the depression 36 along a weld seam 32. Furthermore, the deformation element 30 is welded to the housing 50 at its edge along a weld seam 33.
[0042] The weld seams 32 , 33 can be produced in particular by laser welding.
[0043] Figure 4a) to Figure 4e) 1 shows different embodiments or combinations and arrangements of the electronic device 1 in the housing 50 according to the present invention, wherein the deformation components 30 according to the present invention are respectively provided and Figure 4b) to Figure 4e) An additional heat sink is provided.
[0044] In accordance with Figure 4a ), the substrate 10 is completely covered by the deforming component 30. Thus, the deforming component 30 forms a complete cover of the housing 50. The deforming component 30 forms a plurality of parallel fins 39, which can be part of a cooling channel, for example, and improve the heat dissipation of the cooling medium.
[0045] In accordance with Figure 4b ), the deforming member 30 has a cutout 31. The substrate 10 forms a plurality of heat sinks 11 on the second side 14, which protrude to the outside through the cutout 31 and cause additional cooling of the electronic component 5. The heat sink 11 is formed integrally with the substrate 10.
[0046] In accordance with Figure 4c ), the deformable component 30 has a cutout 31. A separate heat sink 70 is placed on the substrate 10 in the region of the cutout 31. The heat sink 70 can lead to additional cooling of the electronic component 5. The heat sink 70 can be fixed to the substrate 10, for example, by a thermally conductive adhesive.
[0047] In accordance with Figure 4d ), the substrate 10 is completely covered by the deformable component 30. Therefore, the deformable component 30 forms a complete cover of the housing 50. A separate heat sink 71 is placed on the deformable component 30. In this example, the heat sink 71 almost completely covers the surface of the deformable component 30. The heat sink 71 can lead to additional cooling of the electronic component 5 and / or facilitate heat dissipation of the cooling medium in the channel.
[0048] In accordance with Figure 4e ), the deformation component 30 has a cutout 31. A separate heat sink 72 is placed on the substrate 10 in the region of the cutout 31. The heat sink 72 is wider than the cutout 31 and also covers at least a portion of the surface of the deformation component 30. Therefore, the heat sink 72 can lead to additional cooling of the electronic component 5 and / or facilitate the heat dissipation of the cooling medium in the channel 35. The heat sink 72 can be fixed to the substrate 10, for example, by a thermally conductive adhesive.
Claims
1. An electronic device (1), comprising a substrate (10), wherein: An electronic component (5, 5') is arranged on a first side surface (12) of the substrate (10), and a deformation component (30) with a recess (36, 37, 38) is arranged on a second side surface (14) of the substrate (10), wherein the deformation component (30) and the substrate (10) are materially bonded, and the deformation component (30) is shaped so that at least one cooling channel (35) is formed through at least one recess (36) of the deformation component (30), and a cooling medium (40) can be guided through the cooling channel for cooling the electronic component (5, 5').
2. The electronic device (1) according to claim 1, characterized in that: The base plate (10) has an inlet (42) and an outlet (44) for a cooling medium (40).
3. The electronic device (1) according to any one of the preceding claims, characterized in that The base plate (10) is formed of metal, and the deformation component (30) is welded to the base plate (10) at least in the region of a cooling channel (35) formed by a recess (36) or a plurality of recesses.
4. The electronic device (1) according to any one of the preceding claims, characterized in that A heat conducting medium (16), in particular a heat conducting adhesive, is arranged between the first side (12) of the substrate (10) and the electronic component (5).
5. An electronic device according to any one of the preceding claims, characterized in that The deformation component (30) is designed as a deep-drawn component and has a smaller material thickness than the base plate (10).
6. The electronic device (1) according to any one of the preceding claims, characterized in that The deformation component (30) is configured as a partial or complete cover of a housing (50) of the electronic device (1).
7. The electronic device (1) according to claim 6, characterized in that: The deformable component (30) is welded to the shell (50).
8. The electronic device (1) according to claim 6 or 7, characterized in that: The electronic device (1) has an additional heat sink (11, 38, 70, 71, 72), wherein the cooling channel conducts the cooling medium from the electronic component to the heat sink, and wherein the heat sink is in particular connected to the housing (50) and / or the substrate (10).
9. A method for installing an electronic device (1) according to any one of claims 1 to 8, the method comprising the following steps: a) mounting the electronic component (5, 5') on a first side (12) of the substrate (10), wherein in particular a heat conducting medium (16) is arranged between the substrate (10) and the electronic component (5, 5'); b) mounting the deformation component (30) on the second side (14) of the base plate (10), in particular such that at least one recess (36) of the deformation component forms a passage between an inlet hole (42) and an outlet hole (44) of the base plate, c) welding the deformation component (30) to the base plate adjacent to the recess (36), so that a sealed closed area is formed between the second side surface (14) of the base plate (10) and the deformation component (30) configured as a cooling channel (35).
10. The method according to claim 9, characterized in that With the additional steps: d) circumferentially welding the deformation component (30) to the base plate and / or the housing (50).
11. The method according to claim 9 or 10, characterized in that: After step a) and before step b), the following intermediate steps are provided: a1) installing the substrate onto the motor, a2) Making electrical contact between the stator wires of the electric machine and the electronic components.