Transmission and storage integrated heat dissipation device

Abstract

The transmission and storage integrated heat dissipation device is suitable for heat dissipation of electronic components and comprises a heat dissipation shell with a variable cross-section structure, a non-interval heat transmission and heat dissipation type phase change structure is arranged in the heat dissipation shell, and the phase change structure can reduce heat transmission resistance and improve heat absorption efficiency of power components. And the heat dissipation efficiency of the electronic component is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic component heat dissipation devices, and in particular relates to a transmission and storage integrated heat dissipation device. Background Art

[0002] At present, for high-power electronic devices installed in a closed and narrow space and working in a short-term mode, the main heat dissipation method is to transfer the heat generated during operation to the phase change heat storage cold plate through the metal structure installed on the device, absorb heat through the phase change of the internal material of the cold plate, and store the heat for a short time to ensure that the temperature of the device is in a normal state during operation. As the device develops towards high power and high density, the metal structure installed on the device in the traditional heat dissipation method has poor heat transfer performance, and is installed and fixed to the phase change heat storage cold plate by assembly. There is a large thermal resistance on the heat transfer path. At the same time, the heat storage material of the cold plate itself has poor heat transfer performance and the utilization rate of the energy storage material is poor, so that the overall heat transfer performance cannot meet the heat dissipation requirements of high-power devices, that is, the heat dissipation efficiency of electronic components is low. Summary of the invention

[0003] In view of this, the present invention provides a heat dissipation device integrated with transmission and storage, which solves the technical problem that the existing structure causes low heat dissipation efficiency of electronic components.

[0004] A heat dissipation device with integrated transmission and storage is suitable for heat dissipation of electronic components, comprising a heat dissipation shell with a variable cross-section structure, wherein a phase change structure of non-interval heat transfer and heat dissipation is arranged in the heat dissipation shell, and the phase change structure can reduce heat transfer resistance and improve heat absorption efficiency of power components.

[0005] The technical beneficial effects of the present invention are:

[0006] A phase change structure with no gaps in heat transfer and heat dissipation, which can reduce the heat transfer thermal resistance and improve the heat absorption efficiency of power components, integrates and embeds the heat transfer and heat storage structures, eliminates the heat transfer thermal resistance, improves the phase change utilization rate of the phase change heat storage material, strengthens the heat exchange capacity between heat transfer and energy storage, and enhances the overall heat transfer and heat dissipation work efficiency and performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1 A schematic diagram for forming a first liquid region and a first gas region;

[0009] Figure 2A schematic diagram of forming a second liquid region and a second gas region, wherein:

[0010] 1. heat dissipation housing; 2. micro flow channel pipeline; 3. second phase change material; 21. first liquid area; 22. first gas area; 23. second liquid area; 24. second gas area. DETAILED DESCRIPTION

[0011] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0012] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.

[0013] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present disclosure, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0014] like Figure 1 to Figure 2 The integrated heat transfer and storage device shown is suitable for heat dissipation of electronic components, and includes a heat dissipation shell 1 with a variable cross-section structure. A phase change structure with seamless heat transfer and heat dissipation is arranged in the heat dissipation shell 1. The phase change structure can reduce the heat transfer thermal resistance and improve the heat absorption efficiency of power components.

[0015] As a specific embodiment provided in the present case, the heat dissipation shell 1 is arranged in a T-shaped structure, such as a T-shaped structure with a circular cross-section, and is partially arranged in a hollow area. Preferably, the bottom end is arranged in a hollow structure, and the hollow area is filled with a first phase change material in a non-spaced manner. The first phase change material is used to absorb heat and is a solid-liquid phase change conversion type material. Preferably, the phase change structure is integrally formed with the heat dissipation shell 1 through an additive process, and the first phase change material, for example, is paraffin or alkane or other.

[0016] Furthermore, the phase change structure includes a micro-channel pipeline 2 arranged in a serpentine structure, the micro-channel pipeline 2 is filled with a second phase change material 3, the second phase change material 3 is a gas-liquid phase change conversion type material, for example, acetone liquid, and the heat dissipation shell 1 is made of Al Si 10Mg material, the small end of the heat dissipation shell 1 is a solid structure, and the large end is provided with a hollow area.

[0017] Generally, the liquid inlet and outlet of the micro-channel pipeline 2 are flush with the small end face of the heat dissipation shell 1, and are sealed after filling the second phase change material 3. In addition, the mounting shell of the electronic components or power components has a groove that docks with the small end of the heat dissipation shell 1, that is, the closer the heat dissipation shell 1 is to the electronic components, the higher the heat it needs to absorb.

[0018] As a specific embodiment provided in this case, part of the micro-channel pipeline 2 is embedded in the second phase change material 3, and the other part is embedded in the small end of the heat dissipation housing 1. The structure is preferably formed by an additive process.

[0019] As the heat generated by electronic components changes, such as Figure 1 As shown, the second phase change material 3 in the micro-channel pipeline 2 forms a first liquid area 21 and a first gas area 22, and the first liquid area 21 and the first gas area 22 form a staggered structure, or a section of the first gas area 22 is formed between the adjacent first liquid areas 21 in the flow direction of the micro-channel pipeline 2. When the temperature reaches a certain level, and when the second phase change material 3 absorbs part of the heat in the micro-channel pipeline 2, the second phase change material 3 can be transformed into a "gas-liquid" interval distribution form, that is, as shown in FIG. Figure 2 shown.

[0020] When the pressure in the micro-channel pipeline 2 changes and the second phase change material 3 changes phase, as shown in FIG. Figure 2As shown, the first liquid area 21 undergoes a phase change and is converted into the second gas area 24, and the first gas area 22 undergoes a phase change and is converted into the second liquid area 23. It should be pointed out that the structural morphology transformation is that the heat generation value of the electronic components continues to increase, the pressure in the pipeline continues to change, and the second phase change material 3 continuously absorbs heat, causing the first liquid area 21 in the micro-channel pipeline 2 to transform into a "liquid-gas-liquid-gas" morphology transformation, and the first gas area 22 to transform into a "gas-liquid-gas-liquid" morphology transformation, which can adapt to the change of heat in a maximized form and absorb heat with maximum efficiency, ensuring that the electronic components can work normally and increasing the absorption efficiency of the heat generated by the electronic components.

[0021] It should be pointed out that: in traditional heat transfer and heat storage devices, the heat transfer unit and the heat storage unit are mechanically installed and are independent of each other, and the thermal resistance in the heat transfer direction is large. At the same time, the heat transfer metal plate structure for installing the devices in the heat transfer unit is mostly aluminum alloy, which is light in weight, but the thermal conductivity of the material itself cannot meet the demand for rapid heat transfer. The internal structure of the heat storage unit is a multi-microarray cylindrical structure, which cannot fully and quickly transfer heat to the heat storage material evenly and ensure that the energy storage material fully absorbs heat and changes phase, resulting in low heat transfer and heat storage efficiency of the overall device. Preferably, the second phase change material 3 is arranged in a network structure, and the network structure is preferably a skin-rib beam-lattice comprehensive structure, which can eliminate the heat transfer thermal resistance and improve the phase change utilization rate of the phase change heat storage material.

[0022] Furthermore, the micro-channel pipeline 2 is a structurally symmetrical pipeline, and can also be arranged in an asymmetric structure. The specific arrangement is determined by the structure of the heat dissipation shell 1, and the first phase change material is arranged in a network-like heat storage structure to ensure that the heat transfer of the micro-channel pipeline 2 and the heat storage of the first phase change material are integrated and embedded, eliminating thermal resistance and enhancing the overall heat transfer efficiency and performance. The shape of the second phase change material 3 in the heat transfer of the micro-channel pipeline 2 can maximize heat absorption and heat transfer to the second phase change material 3. The flow channel extends from the hot end to the energy storage structure. The network structure of the heat storage structure strengthens the heat exchange capacity between heat transfer and energy storage, and enhances the overall heat transfer work efficiency and performance.

[0023] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A heat dissipation device with integrated transmission and storage, suitable for heat dissipation of electronic components, characterized in that: A heat dissipation shell with a variable cross-section structure is provided, wherein a phase change structure of non-interval heat transfer and heat dissipation is provided in the heat dissipation shell, and the phase change structure can reduce heat transfer resistance and improve heat absorption efficiency of power components.

2. The integrated heat dissipation device for transmission and storage according to claim 1, characterized in that: The heat dissipation housing is provided with a T-shaped structure, and is partially provided with a hollow area. The hollow area is filled with a first phase change material in a non-spaced manner. The first phase change material is used for absorbing heat and is a solid-liquid phase change conversion type material.

3. The integrated heat dissipation device for transmission and storage according to claim 2, characterized in that: The phase change structure is integrally formed with the heat dissipation housing through an additive process.

4. The integrated heat dissipation device for transmission and storage according to claim 2, characterized in that: The phase change structure comprises a micro flow channel pipeline arranged in a serpentine structure, the micro flow channel pipeline is filled with a second phase change material, and the second phase change material is a gas-liquid phase change conversion type material.

5. The integrated heat dissipation device for transmission and storage according to claim 4, characterized in that: The heat dissipation shell is made of AlSi10Mg material, the small end of the heat dissipation shell is a solid structure, and the large end is provided with the hollow area.

6. The integrated heat dissipation device for transmission and storage according to claim 5, characterized in that: The liquid inlet and the liquid outlet of the micro channel pipeline are flush with the small end surface of the heat dissipation housing, and are sealed after being filled with the second phase change material.

7. The integrated heat dissipation device for transmission and storage according to claim 6, characterized in that: The micro-channel pipeline is partially embedded in the second phase change material, and the other part is embedded in the small end of the heat dissipation housing, wherein, As the heat generated by the electronic components changes, the second phase change material in the micro-channel pipeline forms a first liquid area and a first gas area, and the first liquid area and the first gas area form a staggered structure, or a section of the first gas area is formed between adjacent first liquid areas in the flow direction of the micro-channel pipeline; When the pressure in the microchannel changes and the second phase change material changes phase, the first liquid area changes phase and is converted into the second gas area, and the first gas area changes phase and is converted into the second liquid area, thereby increasing the efficiency of absorbing heat generated by electronic components.

8. The integrated heat dissipation device for transmission and storage according to claim 7, characterized in that: The first phase change material is paraffin or alkane, and the second phase change material is arranged in a network structure.

9. The integrated heat dissipation device for transmission and storage according to claim 7, characterized in that: The second phase change material is acetone liquid.

10. The integrated heat dissipation device for transmission and storage according to claim 7, characterized in that: The micro flow channel pipeline is a pipeline with a symmetrical structure.

Images