Heat dissipation structure

Abstract

The invention discloses a heat dissipation structure, and the structure comprises at least two heat dissipation sheets, each heat dissipation sheet comprises a first edge part and a second edge part which intersects with or is opposite to the first edge part, and the first edge part of one of any two heat dissipation sheets is at least detachably connected with the second edge part of the other heat dissipation sheet; the bonding layer is provided with a first bonding face and a second bonding face opposite to the first bonding face, the first bonding face is bonded to at least one cooling fin, and the second bonding face is used for fixing the cooling fin to the heating element. According to the heat dissipation structure, the heat dissipation structure can be assembled and disassembled according to different operation scenes and operation requirements by arranging the at least two heat dissipation fins which are detachably connected, the whole heat dissipation structure is fixed, assembled and disassembled flexibly and reliably by arranging the bonding layer to be connected with the heating element, and the applicability of the heat dissipation structure is improved.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and more particularly to a heat dissipation structure. Background Art

[0002] In the current detection circuit of the server board, alloy resistor elements are widely used due to their specific electrical properties. When a large current passes through the alloy resistor element, a large amount of heat will be generated. Excessive temperature will change the characteristics of the alloy resistor element, affecting the current detection accuracy of the server board, and further affecting the performance and stability and reliability of the server.

[0003] In the related art, the heat dissipation of the alloy resistor element is achieved by a crimped heat sink, which is to fix the heat sink to the board through rubber columns and springs after processing holes on the board to dissipate the heat of the alloy resistor element on the board. In this way, the board needs to be processed, the installation and disassembly of the heat sink is complicated, and the flexibility is poor.

[0004] In summary, how to facilitate installation and disassembly of the heat dissipation structure of the alloy resistor element is a problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a heat dissipation structure that can be flexibly assembled and disassembled according to the heat dissipation requirements of the heating element, and the heat dissipation structure is fixed by bonding to avoid damage to other electronic components, thereby having good applicability.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] A heat dissipation structure, comprising:

[0008] At least two heat sinks, each heat sink comprising a first edge portion and a second edge portion intersecting or opposite to the first edge portion, wherein the first edge portion of one of any two heat sinks is at least detachably connected to the second edge portion of the other;

[0009] The adhesive layer has a first adhesive surface and a second adhesive surface arranged opposite to the first adhesive surface, the first adhesive surface is adhered to at least one of the heat sinks, and the second adhesive surface is used to fix the heat sink to the heating element.

[0010] On the other hand, the first edge portion and the second edge portion are arranged opposite to each other, and both ends of the first edge portion and the second edge portion are connected by a third edge portion;

[0011] Either one of the first edge portion and the second edge portion is provided with a card slot, and the other one is provided with a card connection portion that can be carded with the card slot.

[0012] On the other hand, of the two third edge portions connecting the first edge portion and the second edge portion at both ends, one is provided with the card slot, and the other is provided with the card connection portion.

[0013] On the other hand, the first edge portion and the second edge portion are arranged opposite to each other, and both ends of the first edge portion and the second edge portion are connected by a third edge portion;

[0014] The first edge portion and the second edge portion are both provided with a clamping portion, and the third edge portion is provided with a clamping groove that can be clamped with the clamping portion.

[0015] On the other hand, the first end of the first edge portion and the first end of the second edge portion intersect, and the second end of the first edge portion and the second end of the second edge portion are connected by a third edge portion;

[0016] One or two of the first edge portion, the second edge portion, and the third edge portion are provided with a card slot, and the others are provided with a card connection portion that can be carded with the card slot.

[0017] On the other hand, the adhesive layer has a hollow area and its edges do not exceed the first edge portion and the second edge portion. A heat conductor for contacting the heating element is arranged in the hollow area, and the heat conductor is thermal grease.

[0018] On the other hand, the heat sink includes a conducting portion close to the first adhesive surface and a heat dissipation portion away from the first adhesive surface, the heat dissipation portion is protrudingly provided with heat dissipation fins, and a plurality of groups of the heat dissipation fins are arranged to form a plurality of heat dissipation channels;

[0019] The heat dissipation channel corresponding to one of two adjacent heat dissipation fins may be connected to the heat dissipation channel corresponding to the other one.

[0020] On the other hand, the heat sink fin is a tree-like structure, which includes a main branch and a branch connected to the main branch, the branch is distributed between two main branches on the same heat sink, and the main branch is distributed between two branch on the same heat sink.

[0021] On the other hand, the branch portion includes a plurality of heat dissipation branches extending in a direction away from the main branch, the heat dissipation branches close to the main branch are located in the middle area of ​​the heat dissipation portion, and the width of the heat dissipation channel formed by the heat dissipation branches gradually decreases in a direction away from the main branch.

[0022] On the other hand, an insulating layer is arranged between the conductive part and the adhesive layer, and the insulating layer covers the plane of the conductive part.

[0023] The heat dissipation structure provided by the present invention comprises: at least two heat sinks and an adhesive layer, wherein the heat sink comprises a first edge portion and a second edge portion intersecting with or opposite to the first edge portion, and the first edge portion of any two heat sinks is detachably connected to at least the second edge portion of the other heat sink, that is, the heat dissipation structure can be flexibly assembled and disassembled according to actual heat dissipation requirements and actual operating conditions; the adhesive layer comprises a first adhesive surface and a second adhesive surface arranged opposite to the first adhesive surface, wherein the first adhesive surface is adhered to at least one heat sink to be fixed on the heat sink, and the second adhesive surface is used to adhere to a heating element to fix the heat sink as a whole on the heating element, so as to reliably and effectively dissipate heat for the heat dissipation element, and this bonding method does not require reprocessing of the electronic components, and the heat dissipation structure is simple and convenient to install and disassemble, has strong flexibility, and has good applicability.

[0024] The beneficial effects of the present invention are as follows: by providing at least two detachably connected heat sinks, the assembly and disassembly of the heat dissipation structure can be met according to different operating scenarios and operating requirements; by providing an adhesive layer and a heating element connection, the overall heat dissipation structure can be fixed, assembled and disassembled flexibly and reliably, thereby improving the applicability of the heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the heat dissipation structure provided by the present invention;

[0027] Figure 2 This is a schematic diagram of the application of the heat dissipation structure provided by the present invention;

[0028] Figure 3 A schematic diagram of the first structure of the heat sink provided by the present invention;

[0029] Figure 4 A second structural schematic diagram of the heat sink provided by the present invention;

[0030] Figure 5 A third structural schematic diagram of the heat sink provided by the present invention;

[0031] Figure 6 for Figure 5 A schematic diagram of assembly and disassembly of a corresponding heat sink;

[0032] Figure 7 for Figure 5Another schematic diagram of assembly and disassembly of the corresponding heat sink;

[0033] Figure 8 A fourth structural schematic diagram of the heat sink provided by the present invention;

[0034] Fig. 9 This is a fifth structural schematic diagram of the heat sink provided by the present invention;

[0035] Fig.10 This is a schematic diagram of the heat sink fins and heat sink installation provided by the present invention.

[0036] Figure 1-Figure 10 , the reference numerals include:

[0037] 1-heat sink; 2-adhesive layer; 3-heat conductor; 4-board; 5-alloy resistor element; 11-first edge portion; 12-second edge portion; 13-third edge portion; 14-clamping portion; 15-card slot; 16-heat sink fin; 161-main branch; 162-heat sink branch; 163-heat sink channel; 111-conduction portion; 112-heat sink portion. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] The core of the present invention is to provide a heat dissipation structure, which is equipped with at least two detachably connected heat sinks to meet the assembly and disassembly of the heat dissipation structure according to different working scenarios and working requirements. By setting an adhesive layer and a heating element connection to fix the overall heat dissipation structure, the assembly and disassembly are flexible and reliable, thereby improving the applicability of the heat dissipation structure.

[0040] The heat dissipation structure provided by the present invention can be applied in many fields and can be used for reliable and flexible heat dissipation of heating elements in different fields. In communication equipment such as base stations, it dissipates heat for electronic components and improves equipment stability. In consumer electronic products, such as notebooks, tablets, etc., heat sinks can be customized to meet the requirements of lightness and high performance. In the server field, it can also be applied to the heat dissipation of resistors and non-alloy resistors of other packaging specifications. In the field of industrial control, automated control systems and power electronic equipment, it improves system stability. In the field of new energy, the battery management system and motor controller of electric vehicles, as well as the inverter, controller and other components of solar power generation systems, can all use the heat sink of the present invention to provide efficient heat dissipation guarantees.

[0041] Taking the heat dissipation structure used for heat dissipation of the alloy resistor element 5 on the board 4 as an example, the distribution relationship of the board 4, the alloy resistor element 5, and the heat sink 1 is as follows: Figure 2 It should be noted that the heat sink 1 covers all edges of the alloy resistor element 5 to ensure reliable heat dissipation effect.

[0042] Taking a specific implementation as an example, if the heat sink 1 is a quadrilateral, the length and width of the heat sink 1 are slightly larger than the package size of the alloy resistor element 5, ensuring that the surface of the alloy resistor element 5 is completely covered to achieve the maximum heat dissipation contact area and ensure reliable and effective heat dissipation of the alloy resistor element 5. Slightly larger means as follows: if the package size of the alloy resistor element 5 is 6.35mmx3.18mm, the length of the heat sink 1 is designed to be 7.98mm±0.1mm, and the width is 4.86mm±0.1mm.

[0043] As for the thickness of the heat sink 1, it can be optimized according to the heat dissipation requirements and the thermal conductivity of the material. On the premise of meeting the use requirements, a thin design is preferably adopted to reduce space occupancy while ensuring sufficient heat dissipation capacity.

[0044] The heat dissipation structure includes at least two heat sinks 1, and at least two includes two, three, four, five, etc. The specific number of heat sinks 1 can be flexibly selected according to the actual heat dissipation requirements and actual space conditions, and is not limited. Through the flexible combination of the heat sinks 1, heat conduction sharing is achieved, forming an overall heat dissipation network, and ensuring reliable and effective heat dissipation of the alloy resistor element 5.

[0045] The heat sink 1 includes a first edge portion 11 and a second edge portion 12 intersecting or opposite to the first edge portion 11. The intersection here refers to the intersecting connection between the first edge portion 11 and the second edge portion 12, while the opposite means that the first edge portion 11 and the second edge portion 12 are arranged in parallel.

[0046] The situation where the first edge portion 11 and the second edge portion 12 intersect is as follows Fig. 9 and Fig.10 As shown, the first edge portion 11 and the second edge portion 12 are opposite to each other. Figure 3 , Figure 4 , Figure 5 The heat sink 1 can be in the shape of a triangle, a quadrilateral, a pentagon, a hexagon, etc., or a shape with six sides such as an L shape, without any specific limitation.

[0047] In specific applications, at least two heat sinks 1 can be flexibly assembled and disassembled according to operational requirements. For example, when a heat sink 1 fails, it can be directly removed from the heat dissipation structure and replaced with a new heat sink 1, which is convenient for maintenance and replacement. For example, when multiple alloy resistor elements 5 are provided or a single area is relatively large, it is necessary to increase the number of heat sinks 1 to increase the heat dissipation area of ​​the heat dissipation structure, and then assemble the heat sink 1 according to actual conditions as needed. When multiple alloy resistor elements 5 are connected in parallel, the heat dissipation structure can be flexibly combined according to the parallel resistor layout through the detachable connection between the heat sinks 1, so as to realize heat conduction sharing, form an overall heat dissipation network, improve flexibility, and be better suitable for board component layout.

[0048] The first edge portion 11 of any two heat sinks 1 is at least detachably connected to the second edge portion 12 of the other heat sink 1 .

[0049] If the heat dissipation structure includes two heat sinks 1, the first implementation is as follows: the first edge portion 11 of one of the two heat sinks 1 is connected to the second edge portion 12 of the other. The corresponding structure of the heat sink 1 can be found in Figure 5 , Figure 8 , Fig. 9 In this way, the first edge portions 11 of the two heat sinks 1 have the same structure, and the corresponding second edge portions 12 also have the same structure, but the different structures of the first edge portions 11 and the second edge portions 12 can form a snap-fitting relationship to reliably assemble the two heat sinks 1 .

[0050] If the heat dissipation structure includes two heat sinks 1, another embodiment is as follows: the first edge portion 11 of one of the two heat sinks 1 is detachably connected to the first edge portion 11 and the second edge portion 12 of the other heat sink 1. In this case, the structure of the corresponding heat sink 1 is as follows: Figure 3 As shown, the engaging structure provided on the first edge portion 11 of one of the two heat sinks 1 can be engaged with the first edge portion 11 and the second edge portion 12 of the other heat sink 1 . In this case, the engaging structure is provided at the corners of the heat sink 1 .

[0051] The above three embodiments only list the forms of assembling two heat sinks 1. If the number of heat sinks 1 is increased, they can be connected according to the snap-fit ​​structure on the heat sink 1. No detailed description is given. No matter how many heat sinks 1 there are, they can be connected in a detachable manner to form a heat dissipation structure with good integrity, and can meet the disassembly operation of the heat dissipation structure, thereby improving the flexibility of the use of the heat dissipation structure.

[0052] The adhesive layer 2 has a first adhesive surface and a second adhesive surface arranged opposite to the first adhesive surface. The first adhesive surface is adhered to at least one heat sink 1, and the second adhesive surface is used to adhere to a heating element. When applied to heat dissipation of the alloy resistor element 5 on the board 4, the heating element is specifically the alloy resistor element 5.

[0053] When the heating element is specifically an alloy resistor element 5, the alloy resistor element 5 is arranged between the board 4 and the heat dissipation structure, and the heat dissipation structure is fixed to the board 4 by the adhesive layer 2, so that the heat dissipation structure can be limited so that the heat dissipation structure is relatively fixed above the alloy resistor element 5. Here, the upper part is Figure 2 Referring to the upper and lower directions.

[0054] The heat dissipation structure is fixed by bonding, without the need for welding or hole alignment and connection. The installation and fixing is simple and convenient. If the layout of the server board is adjusted, the heat dissipation structure can be directly removed manually. After removal, its own position can be flexibly adjusted according to the actual situation to avoid interference caused by the adjustment of the board layout. There is no need to reassemble the heat dissipation structure. It only needs to paste the adhesive layer 2 on the board 4, which is more flexible. In addition, if the heat sink 1 fails, no special welding equipment is required. The old heat sink 1 can be torn off and replaced with a new one. The operation is simple and will not damage the surrounding components, which improves the convenience of maintenance and replacement. During the life cycle of the server board, if the heat sink 1 needs to be upgraded, it can be easily achieved, reducing maintenance costs and time.

[0055] For example, for the heat dissipation of a single alloy resistor element 5, the heat sink 1 can be easily adjusted to the pasting position according to the server board layout and the position of the alloy resistor element 5, and the combination method is flexible. For multiple alloy resistor elements 5 connected in parallel, the combination method of the heat sink 1 can be flexibly selected according to the heating situation of each alloy resistor element 5, and when the parallel resistor layout changes, the heat dissipation structure can be easily reassembled or disassembled.

[0056] In a specific implementation method, the adhesive layer 2 is specifically polyurethane adhesive, and when not in use, the second adhesive surface is sealed on the heat sink 1 by plastic to prevent the adhesive layer from being contaminated or deteriorated. When in use, the plastic can be torn off for pasting.

[0057] By bonding the heat sink 1 to the board 4, it is ensured that the heat sink 1 will not loosen under vibration and temperature changes during the operation of the server. The bonding strength of the polyurethane glue used as the adhesive layer 2 has been tested and can withstand a tensile force of at least 10N in the vertical direction without falling off, ensuring the reliability of the heat dissipation structure installation.

[0058] In this embodiment, the first adhesive surface of the adhesive layer 2 is adhered to at least one heat sink 1, that is, the heat dissipation structure as a whole may have only one adhesive layer 2, or each heat sink 1 may be provided with an adhesive layer 2. More specifically, after two heat sinks 1 are assembled, the adhesive layer 2 may be laid on the bottom of each heat sink 1 to reliably connect with the board 4, or the adhesive layer 2 provided on a heat sink 1 may be connected with the board 4. It should be noted that if the first adhesive surface of the adhesive layer 2 is only adhered to one heat sink 1, the snap-fit ​​structure corresponding to the first edge portion 11 and the second edge portion 12 of at least two heat sinks 1 has good reliability and will not be easily separated due to server vibration.

[0059] In this embodiment, the first edge portion 11 of one of any two heat sinks 1 is detachably connected to at least the second edge portion 12 of the other heat sink 1 . The detachable connection may be achieved by means of snap connection, buckle connection, etc.

[0060] In the heat dissipation structure provided by the present invention, the first edge portion 11 of one of any two heat sinks 1 is detachably connected to the second edge portion 12 of at least the other, that is, the heat dissipation structure can be flexibly assembled and disassembled according to the actual heat dissipation requirements of the heating element and the actual operating conditions; the adhesive layer 2 has a first adhesive surface and a second adhesive surface arranged opposite to the first adhesive surface, wherein the first adhesive surface is adhered to at least one heat sink 1 to be fixed on the heat sink 1, and the second adhesive surface is used to adhere to the heating element to fix the heat sink 1 as a whole on the heating element, so as to reliably and effectively dissipate heat from the heat dissipation element. This bonding method does not require reprocessing of the electronic components, and the heat dissipation structure is simple and convenient to install and disassemble, has strong flexibility, and has good applicability.

[0061] The above heat dissipation structure can be assembled without welding, the pasting position can be adjusted according to the structural layout and the resistor position, and the heat sink 1 can be replaced easily. The heat dissipation structure can be flexibly selected and combined according to the heating conditions of the heating elements and layout changes.

[0062] On the basis of the above embodiment, the first edge portion 11 and the second edge portion 12 are arranged opposite to each other, and both ends of the first edge portion 11 and the second edge portion 12 are connected by the third edge portion 13. Figure 5 , Figure 6 , Figure 7 The heat sink 1 is a quadrilateral as a whole, and the first edge portion 11 and the second edge portion 12 in the quadrilateral are two edges arranged opposite to each other, and the third edge portion 13 is formed by connecting the first edge portion 11 and the second edge portion 12 to form an overall quadrilateral structure.

[0063] One of the first edge portion 11 and the second edge portion 12 is provided with a clamping slot 15 , and the other is provided with a clamping portion 14 that can be clamped with the clamping slot 15 .

[0064] If the heat dissipation structure includes two heat sinks 1 , the two heat sinks 1 are assembled directly by engaging the clamping portion 14 of the first edge portion 11 of one heat sink 1 with the second edge portion 12 of the other heat sink 1 .

[0065] If the heat dissipation structure includes four heat sinks 1, Figure 6 and Figure 7 The assembly method is indicated by the arrows, and the four heat sinks 1 are reliably assembled by engaging the four heat sinks 1 through the matching engagement relationship between the card slots 15 and the card connection parts 14. In this method, the four heat sinks 1 are connected in sequence to form a heat dissipation structure.

[0066] Regardless of the specific assembly form mentioned above, the detachable connection between two or more heat sinks 1 is achieved through the snap-fitting relationship, which can simplify the assembly and disassembly process and improve the overall flexibility and applicability of the heat dissipation structure.

[0067] In this embodiment, the shapes of the card slot 15 and the card connection portion 14 are not limited, and can be round, square or irregular, without too much restriction. Similarly, the number of the card slot 15 and the card connection portion 14 is not limited, and two or three can be set. If a certain card connection portion 14 or card slot 15 fails, the other card connection portions 14 and card slots 15 can still ensure normal operation, ensure a reliable card connection relationship, and ensure the reliability and stability of the heat dissipation structure as a whole.

[0068] In this embodiment, the third edge portion 13 may or may not be provided with a slot 15 or a snap-on portion 14, depending on the actual assembly form of the heat sink. If the slot 15 and the snap-on portion 14 of the first edge portion 11 and the second edge portion 12 can meet the assembly requirements of the heat dissipation structure, there is no need to process the third edge portion 13.

[0069] On the basis of any of the above embodiments, of the two third edge portions 13 connecting the first edge portion 11 and the second edge portion 12 , one is provided with a clamping groove 15 , and the other is provided with a clamping portion 14 .

[0070] Please refer to Figure 5 , Figure 6 , Figure 7 A card slot 15 and a card connection portion 14 are also provided on the third edge portion 13, so that the four heat sinks 1 can form a more flexible assembly relationship. Each heat sink 1 can be connected to two adjacent heat sinks 1, so that the heat dissipation structure assembled by multiple heat sinks 1 is more flexible and the applicability of the heat dissipation structure is improved.

[0071] like Figure 6 and Figure 7As shown, under the premise that the heat dissipation structure includes four heat sinks 1, the heat sinks 1 can be spliced ​​in the direction indicated by the arrows to form a square heat dissipation structure, which meets the demand of forming a square heat dissipation part.

[0072] Under the premise that the heat dissipation structure includes three heat sinks 1, they can be connected in pairs and then connected to the remaining heat sink 1. The heat dissipation structure can be assembled flexibly and will not be described in detail.

[0073] Based on any of the above embodiments, the first edge portion 11 and the second edge portion 12 are arranged opposite to each other, and both ends of the first edge portion 11 and the second edge portion 12 are connected by the third edge portion 13; a clamping portion 14 is provided on the first edge portion 11 and the second edge portion 12, and a clamping groove 15 that can be clamped with the clamping portion 14 is provided on the third edge portion 13.

[0074] Please refer to Figure 4 When the heat sink 1 is assembled, taking two heat sinks 1 as an example, the snap-fit ​​portion 14 on the first edge portion 11 of one heat sink 1 is connected to the snap-fit ​​groove 15 on the third edge portion 13 of the other heat sink 1 to form a snap-fit ​​fit; or, the snap-fit ​​portion 14 on the second edge portion 12 of one heat sink 1 is connected to the snap-fit ​​groove 15 on the third edge portion 13 of the other heat sink 1 to form a snap-fit ​​fit.

[0075] In this way, the heat sink 1 can form a square structure as a whole to meet the heat dissipation requirements of the square alloy resistor element 5 .

[0076] In this embodiment, the shapes of the card slot 15 and the card connection portion 14 are not limited, and can be round, square or irregular, without too much restriction. Similarly, the number of the card slot 15 and the card connection portion 14 is not limited, and two or three can be set. If a certain card connection portion 14 or card slot 15 fails, the other card connection portions 14 and card slots 15 can still ensure normal operation, ensure a reliable card connection relationship, and ensure the reliability and stability of the heat dissipation structure as a whole.

[0077] On the basis of any of the above embodiments, the first end of the first edge portion 11 intersects with the first end of the second edge portion 12, and the second end of the first edge portion 11 and the second end of the second edge portion 12 are connected through the third edge portion 13. Figure 8 and Fig. 9 The heat sink 1 is triangular in shape as a whole, and two heat sinks 1 can be assembled to form a quadrilateral structure. This form of heat sink 1 can be suitable for the needs of smaller heat dissipation areas or more irregular heat dissipation areas, and can ensure reliable heat dissipation effects without occupying too much space.

[0078] Please refer to Figure 8 and Fig. 9, one or two of the first edge portion 11, the second edge portion 12, and the third edge portion 13 are provided with a slot 15, and the others are provided with a snap-fitting portion 14 that can snap-fit ​​with the slot 15. Based on the above conditions, the distribution of the slots 15 and the snap-fitting portions 14 on the three edge portions is limited to meet the snap-fitting relationship of two or more heat sinks 1, and the effect of flexible assembly and disassembly can be achieved according to actual heat dissipation requirements.

[0079] In a specific embodiment, under the premise that the heat sink 1 includes a first edge portion 11, a second edge portion 12 and a third edge portion 13, each edge portion may be provided with a clamping portion 14 and a clamping groove 15, and the clamping portion 14 and the clamping groove 15 on a certain edge portion are respectively clamped with the clamping groove 15 and the clamping portion 14 on other edge portions to ensure the reliable and firm connection between the heat sinks 1 and the reliability of the heat dissipation operation.

[0080] Based on any of the above embodiments, the heat sink 1 is connected to the board 4 by using a punch-free method using polyurethane glue. When not in use, the polyurethane glue is sealed with plastic to prevent contamination and deterioration. The bonding method avoids affecting the alloy resistor element 5 and surrounding components, and there is no need to reserve operating space, thus saving space inside the board.

[0081] If polyurethane glue is used as adhesive layer 2, please refer to Figure 1 The adhesive layer 2 has a hollow area and its edge does not exceed the first edge portion 11 and the second edge portion 12. A heat conductor 3 for contacting the alloy resistor element 5 is arranged in the hollow area. By filling the heat conductor 3 in the hollow area of ​​the adhesive layer 2 on the heat sink 1, the heat of the alloy resistor element 5 can be reliably transferred out, the heat conduction efficiency is guaranteed, and the heat sink 1 can reliably and effectively dissipate the heat of the alloy resistor element 5.

[0082] Furthermore, the heat sink 1 is made of aluminum alloy material with high thermal conductivity to improve the heat conduction capability. The heat conductor 3 is thermal grease, which has high thermal conductivity and can fill the tiny gap between the heat sink and the resistor, further enhancing the heat conduction efficiency, and working together with the polyurethane glue used to bond the board 4 on the heat sink 1 and the heat sink 1 made of aluminum alloy to ensure effective heat conduction and reliable and effective heat dissipation of the alloy resistor element 5.

[0083] Based on any of the above embodiments, the heat sink 1 includes a conducting portion 111 close to the first adhesive surface and a heat dissipation portion 112 away from the first adhesive surface. Heat dissipation fins 16 are protruding from the heat dissipation portion 112, and several groups of heat dissipation fins 16 are arranged to form multiple groups of heat dissipation channels 163.

[0084] There is no limit to the height and spacing of the heat dissipation fins 16 , and the design can be based on the need to increase the heat dissipation area within a limited space and ensure the heat dissipation effect.

[0085] The heat dissipation fins 16 are arranged perpendicular to the board 4 to meet the actual situation of air flowing from bottom to top. The heat of the alloy resistor element 5 is discharged through multiple groups of heat dissipation channels 163 formed by arranging several groups of heat dissipation fins 16, ensuring the reliable operation of the alloy resistor element 5.

[0086] In this embodiment, the specific arrangement shape of the heat dissipation fins 16 can be fin-shaped, wavy-shaped, or other shapes, as long as the heat dissipation area is maximized to ensure reliable and effective heat dissipation of the alloy resistor element 5.

[0087] In this embodiment, the forms of the multiple groups of heat dissipation channels 163 may be consistent or inconsistent, without specific limitation, as long as the air with heat on the alloy resistor element 5 can be easily dissipated outward through the heat dissipation channels 163.

[0088] The heat dissipation channel 163 corresponding to one of the two adjacent heat sinks 1 can be connected to the heat dissipation channel 163 corresponding to the other. If the heat dissipation fins 16 are in a tree-like structure, after two or more heat sinks 1 are assembled, multiple connected heat dissipation channels 163 can be formed. The combined multiple heat dissipation channels 163 are in a tree-like structure, and heat is conducted and collected from the multiple connected heat dissipation channels 163 of the alloy resistor element 5, and then dissipated to the surrounding environment, effectively utilizing the overall heat dissipation capacity of the tree-like structure, avoiding the situation of local overheating of the alloy resistor element 5, and ensuring the reliable operation effect of the alloy resistor element 5.

[0089] Based on any of the above embodiments, please refer to Fig.10 The heat sink fin 16 is a tree-like structure, which includes a main branch 161 and a branch connected to the main branch 161 . The branch is distributed between two main branches 161 on the same heat sink 1 . The main branch 161 is distributed between two branch on the same heat sink 1 .

[0090] like Fig.10 For example, three groups of heat sink fins 16 are arranged on the heat sink 112, which are the first heat sink fin, the second heat sink fin, and the third heat sink fin. The vertical branch of the second heat sink fin is distributed between the main branch 161 of the first heat sink fin and the main branch 161 of the third heat sink fin, and the main branch 161 of the second heat sink fin is distributed between the vertical branch of the first heat sink fin and the vertical branch of the third heat sink fin. Through this arrangement, the heat sink area of ​​the heat sink 1 can be dispersed to ensure that heat can be dissipated in each area, ensuring reliable and effective heat dissipation of the alloy resistor element 5.

[0091] In this embodiment, the form of the branch portion is not limited, and the branch portion may have one, two, or more branches, and the design may be specifically made in combination with actual heat dissipation requirements.

[0092] Based on any of the above embodiments, the branch portion includes a plurality of heat dissipation branches 162 extending in a direction away from the main branch 161 , and the number of the heat dissipation branches 162 gradually decreases in a direction away from the main branch 161 , and the width of the corresponding heat dissipation channel 163 becomes smaller and smaller.

[0093] The heat dissipation branch 162 of the main branch 161 close to the main branch 161 is located in the middle area of ​​the heat dissipation part 112. The width of the heat dissipation channel 163 formed by the heat dissipation branch 162 in the middle area is the largest, while the width of the heat dissipation channel 163 formed by the heat dissipation branches 162 in other areas is getting smaller and smaller. This is based on the fact that the heat generation area of ​​the alloy resistor element 5 is mostly concentrated in the middle area, and this arrangement form ensures efficient and rapid heat dissipation of the alloy resistor element 5.

[0094] By limiting the specific form of the branch portion in this embodiment, the heat dissipation area of ​​the heat sink 1 at the middle position is relatively larger, and the heat dissipation areas at the two sides are relatively smaller. This is based on the fact that the heat generated in the middle of the alloy resistor element 5 during specific operation is much greater than the heat generated on the two sides or edges. By specifically arranging the structure of the heat dissipation fins 16, fast and efficient heat dissipation of the alloy resistor element 5 is guaranteed, and the reliable and effective operation of the heat dissipation structure is guaranteed.

[0095] Based on any of the above embodiments, please refer to Figure 1 An insulating layer is arranged between the conductive part 111 and the adhesive layer 2 , and the insulating layer covers the plane of the conductive part 111 .

[0096] After the heat sink 1 is processed, an insulating layer is attached or coated on the plane of the conductive part 111, and then connected to the adhesive layer 2 on the insulating layer. The insulating layer covers the plane of the conductive part to ensure that the heat sink 1 will not contact the board 4, avoid short circuit of the board 4, and ensure safety and reliability.

[0097] In a specific embodiment, the insulating layer includes but is not limited to an epoxy resin coating. The epoxy resin has good insulating properties, and its insulation resistance can reach more than 1MΩ, which can effectively prevent the heat sink 1 from short-circuiting with surrounding circuit components. At the same time, the insulating coating made of epoxy resin can be added with different fillers to improve thermal conductivity, ensure good thermal conductivity, and will not have a negative impact on the heat dissipation performance of the heat sink 1. Under the premise of ensuring insulation, the heat dissipation efficiency of the heat sink 1 can still meet the heat dissipation requirements of the alloy resistor element 5.

[0098] Regarding the insulating coating of epoxy resin material, fillers from different fillers can be added. The specific fillers can be as follows: adding aluminum oxide particles or adding silver nanoparticles or adding silicon nitride. Among them, the method of adding silver nanoparticles can be directly by adding Al2O3 with silver nanoparticles. By adding additives to form a composite structure layer of the insulating layer, the thermal conductivity of the insulating coating can be improved. While ensuring the insulation effect, it can not affect the heat dissipation and can promote the heat dissipation process generated by the alloy resistor element 5.

[0099] When the heat sink 1 is specifically manufactured, a high-thermal conductivity aluminum alloy material is cut into a basic shape of the heat sink 1 that is slightly larger than the alloy resistor element 5 using high-precision cutting equipment, with the error controlled within ±0.05mm; the heat sink fins 16 are punched out using a precision mold to ensure that their height and spacing meet the design requirements, with the stamping mold accuracy reaching ±0.02mm; then, after the heat conductor 3 is filled in the middle of the heat sink 1, an adhesive layer 2 is applied around the bottom and sealed with plastic.

[0100] When the heat sink 1 is used, for heat dissipation of a single alloy resistor element 5, determine its position on the board 4, and use a positioning tool to ensure the accuracy within ±0.1mm. Tear off the plastic seal of the adhesive layer 2, place the heat sink 1 above the alloy resistor element 5, make the heat conductor 3 contact the alloy resistor element 5, press the center to apply a specific pressure and maintain it for a certain time, so that the adhesive layer 2 is reliably bonded to the board 4 to fix the heat sink 1.

[0101] When multiple alloy resistor elements 5 are connected in parallel, the corresponding heat dissipation structure is selected according to the heating situation. After the operation is performed in the pasting manner of a single alloy resistor element 5, the first edge portion 11, the second edge portion 12, and the third edge portion 13 of the heat sink 1 are used to form a heat dissipation channel for the entire multiple alloy resistor elements 5, thereby ensuring the heat dissipation effect of the multiple alloy resistor elements 5. In actual application, a thermal imager can be used to detect whether the heat conduction is normal to determine whether the heat sink 1 corresponding to the multiple alloy resistor elements 5 is reliably installed and whether a reliable heat dissipation effect is achieved.

[0102] For the heat dissipation structure determined in the above embodiment, in terms of heat dissipation efficiency, the heat sink 1 is optimized to be made of aluminum alloy material, filled with a heat conductor 3, and the heat conductor 3 contacts the heating element to perform reliable heat transfer, so as to effectively improve the heat dissipation efficiency. In terms of installation flexibility, the pasting position of the heat sink 1 of a single heating element can be flexibly adjusted and replaced conveniently; when multiple heating elements are connected in parallel, the heat dissipation structure can be flexibly combined according to the changes in heat generation and layout, solving the problem of poor flexibility of the traditional method. In terms of space occupancy, the heat sink is assembled in the form of welding-free and pasted with polyurethane glue. There is no need to reserve space for welding operations. The heat sink structure is compact and can be assembled, which can better adapt to the layout of electronic components and save space. In terms of maintenance and replacement, the heat sink 1 can be replaced without special equipment when it fails, without damaging surrounding components, and is easy to upgrade, reducing maintenance costs and time.

[0103] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0104] The above is a detailed introduction to a heat dissipation structure provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation structure, characterized in that: The heat dissipation structure comprises: At least two heat sinks (1), the heat sinks (1) comprising a first edge portion (11) and a second edge portion (12) intersecting with or opposite to the first edge portion (11), the first edge portion (11) of one of the two heat sinks (1) being at least detachably connected to the second edge portion (12) of the other; The adhesive layer (2) comprises a first adhesive surface and a second adhesive surface arranged opposite to the first adhesive surface, the first adhesive surface being adhered to at least one of the heat sinks (1), and the second adhesive surface being used to fix the heat sink (1) to the heating element.

2. The heat dissipation structure according to claim 1, characterized in that: The first edge portion (11) and the second edge portion (12) are arranged opposite to each other, and both ends of the first edge portion (11) and the second edge portion (12) are connected via a third edge portion (13); Either the first edge portion (11) or the second edge portion (12) is provided with a card slot (15), and the other is provided with a card connection portion (14) that can be carded with the card slot (15).

3. The heat dissipation structure according to claim 2, characterized in that: Of the two third edge portions (13) connecting the first edge portion (11) and the second edge portion (12) at both ends, one is provided with the card slot (15) and the other is provided with the card connection portion (14).

4. The heat dissipation structure according to claim 1, characterized in that: The first edge portion (11) and the second edge portion (12) are arranged opposite to each other, and both ends of the first edge portion (11) and the second edge portion (12) are connected via a third edge portion (13); A clamping portion (14) is provided on both the first edge portion (11) and the second edge portion (12), and a clamping groove (15) capable of being clamped with the clamping portion (14) is provided on the third edge portion (13).

5. The heat dissipation structure according to claim 1, characterized in that: The first end of the first edge portion (11) and the first end of the second edge portion (12) intersect, and the second end of the first edge portion (11) and the second end of the second edge portion (12) are connected via a third edge portion (13); One or both of the first edge portion (11), the second edge portion (12) and the third edge portion (13) are provided with a card slot (15), and the others are provided with a card connection portion (14) that can be carded with the card slot (15).

6. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: The adhesive layer (2) has a hollow area and the edges do not exceed the first edge portion (11) and the second edge portion (12); a heat conductor (3) for contacting the heating element is arranged in the hollow area; the heat conductor (3) is thermally conductive silicone grease.

7. The heat dissipation structure according to claim 1, characterized in that: The heat sink (1) comprises a conducting portion (111) close to the first adhesive surface and a heat dissipation portion (112) away from the first adhesive surface, the heat dissipation portion (112) being protrudingly provided with heat dissipation fins (16), and a plurality of groups of heat dissipation fins (16) being arranged to form a plurality of groups of heat dissipation channels (163); The heat dissipation channel (163) corresponding to one of the two adjacent heat dissipation fins (1) can be connected to the heat dissipation channel (163) corresponding to the other one.

8. The heat dissipation structure according to claim 7, characterized in that: The heat sink fin (16) is a tree-like structure, comprising a main branch (161) and a branch connected to the main branch (161), the branch being distributed between two main branches (161) on the same heat sink (1), and the main branch (161) being distributed between two branched parts on the same heat sink (1).

9. The heat dissipation structure according to claim 8, characterized in that: The tree branch portion comprises a plurality of heat dissipation branches (162) extending in a direction away from the main branch (161); the heat dissipation branches (162) close to the main branch (161) are located in a central area of ​​the heat dissipation portion (112); and the width of the heat dissipation channel (163) formed by the heat dissipation branches (162) gradually decreases in a direction away from the main branch (161).

10. The heat dissipation structure according to claim 9, characterized in that: An insulating layer is provided between the conducting part (111) and the adhesive layer (2), and the insulating layer covers the plane of the conducting part (111).

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