Light emitting diode packaging structure and manufacturing method thereof

By increasing the thickness of the first gold layer and the coverage of the second gold layer in the light emitting diode packaging structure, and setting the nickel layer and palladium layer in appropriate locations, the problems of conductive line exposure and insufficient gold layer thickness are solved, and the reliability of the packaging structure and the bonding power of the gold-gold connection are improved.

CN119730509APending Publication Date: 2025-03-28TONG HSING ELECTRONICS IND LTD
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Patent Information

Application Number
CN202311239178.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-09-25
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

In the design, the existing light emitting diode packaging structure has conductive lines exposed to the outside world, which is prone to oxidation and corrosion, and the thickness of the gold layer is insufficient when gold-gold is connected, resulting in a decrease in the reliability of the packaging structure.

Method used

A light emitting diode packaging structure including a substrate, a conductive structure, a first gold layer, a second gold layer, a light emitting diode chip and a packaging layer are designed. The thickness of the first gold layer is greater than 1 micron, the second gold layer completely covers the second conductive structure, and a nickel layer and palladium layer are provided in appropriate locations to prevent atomic migration and diffusion.

Benefits of technology

By increasing the thickness of the first gold layer and the coverage of the second gold layer, the reliability of the light emitting diode packaging structure is enhanced, the conductive structure is prevented from oxidation and corrosion, and the bonding force of the gold-gold connection is improved.

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Abstract

The invention discloses a light emitting diode packaging structure and a manufacturing method thereof. The light emitting diode packaging structure comprises a substrate, a conductive structure, a first gold layer, a second gold layer, a light emitting diode chip and a packaging layer. The substrate has a first surface and a second surface opposite to each other. The conductive structure comprises a first conductive structure and a second conductive structure which are electrically connected. The first conductive structure is arranged on the first surface, and the second conductive structure is arranged on the second surface. The first gold layer is disposed on the first conductive structure, and the thickness of the first gold layer is greater than 1 micron. The second gold layer is arranged on the second conductive structure, and the second gold layer completely covers the second conductive structure. The light emitting diode chip is arranged on the first gold layer. The packaging layer is arranged on the first surface and wraps the first conductive structure, the first gold layer and the light emitting diode chip. The light emitting diode packaging structure provided by the invention has good reliability.
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