Cushion surface cleaning apparatus around cushion conditioner to achieve in-situ cushion adjustment

Abstract

The present disclosure relates to a pad surface cleaning system for use with an adjustment module to adjust a polishing surface of a polishing pad. The pad surface cleaning system may be used to spray the polished surface with a high pressure fluid spray to release debris from the polished surface. A pad surface cleaning system may also be used to remove loosened debris. Further, the pad surface cleaning system may isolate the conditioning disc from the polishing fluid to protect the conditioning disc from reacting with the polishing fluid.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to apparatus and methods for conditioning polishing pads. More specifically, embodiments of the present disclosure relate to a pad surface cleaning system for removing debris from a polishing pad and isolating the polishing disk from a polishing fluid. Background Art

[0002] A processing station for performing a polishing process such as a chemical mechanical planarization (CMP) or electrochemical mechanical planarization (ECMP) process uses a polishing pad and a polishing fluid to polish a substrate. The polishing surface of the polishing pad contacts the substrate and removes substrate fragments to planarize the substrate and smooth the surface of the substrate. The polishing fluid may be disposed between the polishing surface and the substrate to facilitate the removal of material. The polishing pad may have a rough surface to contact the substrate. Over time, the rough surface may become smooth, and the polishing pad may no longer planarize the substrate. Substrate fragments or abrasive particles from the polishing fluid may also become embedded or smeared into the polishing pad and cause less effective planarization or contamination of subsequent substrates polished by the polishing pad.

[0003] Conditioning pads are used with a polishing fluid to condition the polishing surface and remove embedded material. Conventional methods of conditioning polishing pads involve conditioning the polishing pad between polishing steps in isolation steps where no other polishing action occurs. Isolation steps can increase the time required to polish a substrate and reduce the availability of a processing station. The polishing fluid can degrade or corrode the conditioning pad, or the conditioning pad can further contaminate the embedded material or an insert of the conditioning pad that can become dislodged during conditioning.

[0004] Therefore, what is needed in the art is a device and method for solving the above-mentioned problems. Summary of the invention

[0005] The present disclosure generally relates to apparatus and methods for conditioning polishing pads. More specifically, embodiments of the present disclosure relate to a pad surface cleaning system for removing debris from a polishing pad and isolating the polishing disk from a polishing fluid.

[0006] Certain embodiments provide a polishing pad cleaning system for a substrate polishing process. The polishing pad cleaning system includes: an outer cleaning ring including an outer nozzle, wherein the outer nozzle is configured to be coupled to a first fluid source; an inner cleaning ring including an inner nozzle, wherein the inner nozzle is configured to be coupled to a second fluid source; and a vacuum ring, wherein the vacuum ring forms a vacuum port, and the vacuum port is configured to be fluidly coupled to a vacuum source. A conditioning disk is configured to be disposed within the polishing pad cleaning system and condition the polishing pad. The outer nozzle is configured to loosen debris from the substrate polishing process. The inner nozzle is configured to loosen debris from conditioning the polishing pad, and the vacuum ring is configured to remove debris loosened by the outer cleaning ring and the inner cleaning ring.

[0007] Other embodiments provide a conditioning system for conditioning a polishing pad. The conditioning system includes: a conditioning module including a conditioning arm and a conditioning head, wherein the conditioning head is configured to push a conditioning disk against the polishing pad, and a polishing pad cleaning system coupled to the conditioning arm. The polishing pad cleaning system includes: an outer cleaning ring including an outer nozzle configured to couple to a first fluid source; a vacuum ring including a vacuum port configured to couple to a vacuum source; and an inner cleaning ring including an inner nozzle configured to couple to a second fluid source.

[0008] Other embodiments provide a method for conditioning a polishing pad. The method includes positioning a conditioning disk relative to the polishing pad within a polishing pad cleaning system. The polishing pad cleaning system includes: an outer cleaning ring including an outer nozzle, wherein the outer nozzle is coupled to a first fluid source; an inner cleaning ring including an inner nozzle, wherein the inner nozzle is coupled to a second fluid source; and a vacuum ring, wherein the vacuum ring forms a vacuum port, the vacuum port being fluidly coupled to the vacuum source. The method further includes: flowing a fluid from the first fluid source through the outer nozzle to loosen debris from the polishing pad during a substrate polishing process; removing debris from the polishing pad through the vacuum port during a substrate polishing process by generating a negative pressure using the vacuum source; flowing a fluid from the second fluid source through the inner nozzle during a substrate polishing process to loosen debris from the polishing pad; and removing debris from the polishing pad through the vacuum port during a substrate polishing process by generating a negative pressure using the vacuum source. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order that the manner in which the above-mentioned features of the present disclosure can be understood in detail, the present disclosure briefly summarized above may be described in more detail by reference to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings illustrate only exemplary embodiments, and therefore the accompanying drawings should not be considered as limiting the scope of the present disclosure, as the present disclosure may admit of other equally effective embodiments.

[0010] Figure 1 Depicted is a top plan view of a processing station according to some embodiments.

[0011] Figure 2 Depicted is a schematic side view of a processing station according to some embodiments.

[0012] Figure 3 Depicted is a top view of a pad surface cleaning system according to some embodiments.

[0013] Figure 4A Depicted according to some embodiments Figure 3 Schematic side view of a pad surface cleaning system.

[0014] Figure 4B and Figure 4C Depicted according to some embodiments Figure 4ASchematic side view of a pad surface cleaning system.

[0015] Figure 5 Depicted is a schematic side view of a rotatable pad surface cleaning system according to some embodiments.

[0016] Figure 6A-6C Depicted are top plan views of various pad surface cleaning systems according to some embodiments.

[0017] Figure 7 Depicted is a top view schematic diagram of a pad surface cleaning system moving relative to a polishing fluid delivery point in accordance with some embodiments.

[0018] Figure 8 Depicted is a top view schematic diagram of a pad surface cleaning system and a polishing fluid delivery point moving relative to a polishing pad in accordance with some embodiments.

[0019] Fig. 9 Depicted is a functional block diagram of a system controller for a pad surface cleaning system according to some embodiments.

[0020] Fig.10 A flow chart of a method for conditioning a polishing pad according to some embodiments is depicted.

[0021] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0022] In the following description, many specific details are set forth to provide a more thorough understanding of the present disclosure. However, it will be apparent to those skilled in the art that some embodiments of the present disclosure may be implemented without one or more of these specific details. In other cases, well-known features are not described to avoid obscuring one or more embodiments of the present disclosure.

[0023] The present disclosure relates to a pad surface cleaning system used with a conditioning module to condition a polishing surface of a polishing pad. The pad surface cleaning system can be used to spray the polishing surface with a high pressure fluid spray to loosen debris from the polishing surface. The pad surface cleaning system can also be used to remove the loosened debris. Further, the pad surface cleaning system can isolate a conditioning disc from a polishing fluid to protect the conditioning disc from reacting with the polishing fluid.

[0024] The methods and systems disclosed herein may provide features that overcome many of the disadvantages associated with conventional processing stations used to perform the above-described polishing processes. Example of a processing station for polishing

[0025] Figure 1 A top view of a processing station 100 is depicted in accordance with some embodiments. The processing station 100 is configured to perform a polishing process, such as a chemical mechanical planarization (CMP) or electrochemical mechanical planarization (ECMP) process, while also being configured to clean a polishing surface 102 of a polishing pad 104. The processing station 100 may be a stand-alone unit or part of a larger processing system.

[0026] The processing station 100 includes a substrate carrier head 106 (shown in phantom), a platform 108, a conditioning module 110, and a polishing fluid delivery assembly, such as a slurry delivery assembly 112. The platform 108, conditioning module 110, and slurry delivery assembly 112 may be mounted to a base 114 of the processing station 100.

[0027] The platform 108 supports the polishing pad 104. The platform 108 is rotated by a motor (not shown) such that the polishing pad 104 rotates relative to the substrate 116 held in the substrate carrier head 106 during processing. Thus, terms such as upstream, downstream, front, rear, inbound, outbound, before, and after should generally be interpreted appropriately relative to the movement or direction of the platform 108 and the polishing pad 104 supported thereon.

[0028] The substrate carrier head 106 is configured to hold the substrate 116 during processing and controllably urge the substrate 116 against the polishing surface 102 of the polishing pad 104. The substrate carrier head 106 may also rotate the substrate 116 during processing.

[0029] The conditioning module 110 is configured to condition the polishing pad 104 by opening the pores of the polishing pad 104. The conditioning module 110 includes a support assembly 136, a conditioning arm 121, a conditioning head 120, and a conditioning disk 118. The conditioning disk 118 may be a brush having bristles made of a polymer material or may have an abrasive surface including abrasive particles. In some embodiments, the conditioning disk 118 is a disk containing abrasive particles such as diamond. The conditioning head 120 is configured to hold the conditioning disk 118 during conditioning and controllably push the conditioning disk 118 against the polishing surface 102 of the polishing pad 104.

[0030] The adjustment disk 118 can be coupled to the adjustment head 120 by a passive mechanism, such as a magnet and a pneumatic actuator that utilizes the existing up and down movement of the adjustment arm 121. The adjustment disk 118 typically extends beyond the housing of the adjustment head 120 by about 0.2 mm to about 1 mm so as to contact the polishing surface 102. The adjustment disk 118 can be made of nylon, cotton, polymer, or other soft material that will not damage the polishing surface 102. Alternatively, the adjustment disk 118 can be made of a textured polymer or stainless steel with a rough surface, on which diamond particles are adhered or formed. The size of the diamond particles can range from about 30 microns to about 100 microns. The adjustment head 120 can also rotate the adjustment disk 118 during adjustment.

[0031] The conditioning module 110 is adapted to move the conditioning head 120, and thus the conditioning disk 118, from the edge of the diameter of the polishing pad 104 (e.g., the circumference of the polishing pad 104) to at least a portion of the radius of the polishing pad 104 in a linear, arcuate, or sweeping motion. Specifically, the support assembly 136 can position the conditioning head 120. The movement of the conditioning head 120 can be configured such that the entire surface of the polishing pad is conditioned. The slurry delivery assembly 112 is configured to deliver a polishing medium such as a fluid or slurry 123 to the polishing pad 104 while the substrate 116 is polished on the polishing surface 102. As will be appreciated by those skilled in the art, the polishing pad 104 can include any features that will retain the slurry 123, such as holes and / or polishing pad grooves present in the polishing pad 104. The slurry delivery assembly 112 includes a polishing fluid delivery arm, such as a slurry delivery arm 122 that can be located in front of or behind the substrate carrier head 106. The slurry delivery arm 122 delivers the slurry 123 to the polishing surface 102. The slurry delivery arm 122 and carrier head 106 may similarly move in a linear, arcuate, or sweeping motion.

[0032] The system controller 190 may direct various operations of the processing station 100, such as controlling the movement of the processing station 100. For example, the system controller 190 may move the platform 108, the adjustment arm 121, and the slurry delivery arm 122 and control the positions of the platform 108, the adjustment arm 121, and the slurry delivery arm 122 so that the polishing pad 104 is adjusted and the substrate 116 is polished. Fig. 9 The system controller 190 is discussed further.

[0033] In some embodiments, the slurry delivery assembly 112 is not moved during all or a portion of the operation of the processing station 100 , such as during conditioning of the polishing pad 104 .

[0034] Figure 2A schematic side view of a processing station 100 is depicted in accordance with some embodiments. The polishing pad 104 is disposed on or supported on a surface of a platform 108, which rotates the polishing pad 104 and the polishing surface 102 during processing. The platform 108 can rotate about a first rotation axis 231. The slurry delivery arm 122 distributes a fluid flow to the processing station 100. For example, the slurry delivery arm 122 can distribute the slurry 123 to the rotating polishing pad 104 at a continuous or variable feed rate.

[0035] The adjustment module 110 further includes an adjustment base 237 mounted to the base 114. The adjustment arm 121 has a distal end coupled to the adjustment head 120 and a proximal end coupled to the adjustment base 237, such as through the support assembly 136. The adjustment base 237 can rotate the adjustment arm 121 about the second rotation axis 233 to position the adjustment head 120, for example, to sweep the adjustment head 120 across the polishing surface 102 to adjust the polishing surface 102.

[0036] The adjustment head 120 can be used to restore the polishing performance of the polishing surface 102, for example, by rotating the polishing pad 104 about a third rotation axis 235 of the adjustment head 120. The third rotation axis 235 can be located at the center or central position of the adjustment head 120. The adjustment head 120 can further provide a controllable pressure or downforce to controllably press the adjustment head 120 against the polishing surface 102. In one embodiment, the downforce can be in a range between about 0.5 lbf (22.2 N) and about 14 lbf (62.3 N), for example, between about 1 lbf (4.45 N) and about 10 lbf (44.5 N). The adjustment head 120 generally rotates and / or moves laterally in a manner that sweeps across the polishing surface 102. In some embodiments, the adjustment head 120 can have a further range of motion to move the adjustment head 120 away from the platform 108 when not in use. Example of a pad surface cleaning system

[0037] Figure 3 A top view of a pad surface cleaning system 340 is depicted, according to some embodiments.

[0038] The pad surface cleaning system 340 may be used to clean the polishing surface 102 and / or to isolate the polishing disk 108 from the slurry 123 ( Figure 1 and Figure 2 ). The pad surface cleaning system 340 includes an outer cleaning ring 342 having an outer nozzle 344, a vacuum ring 346 having a vacuum port 347, and an inner cleaning ring 348 having an inner nozzle 350. Figure 3In the illustrated embodiment, the pad surface cleaning system 340 completely surrounds the adjustment disk 118 and does not rotate with the adjustment disk 118. For example, the adjustment disk 118 can rotate about the third rotation axis 235, while the pad surface cleaning system 340 does not rotate. In other words, the pad surface cleaning system 340 can remain stationary or fixed relative to the third rotation axis 235. The pad surface cleaning system 340 can be coupled to the adjustment arm 121 so that the adjustment module 110 ( Figure 1 and Figure 2 ) moves the pad surface cleaning system 340 with the conditioning disk 118. The pad surface cleaning system 340 may be positioned downstream of the slurry delivery arm 122 ( Figure 1 ), and the substrate carrier head 106 can be positioned downstream of the pad surface cleaning system 340.

[0039] The outer cleaning ring 342 and the inner cleaning ring 348 spray fluid onto the polishing surface 102 to remove debris. The debris may include the substrate 116 ( Figure 1 ) or pieces of the polishing pad 104 or polishing disk 118 that are removed or dislodged during the conditioning process. The outer cleaning ring 342 can also be used to isolate the polishing disk 108 from the slurry 123 by diluting, reducing, or eliminating the amount of slurry 123 that contacts the polishing disk 118. The vacuum ring 346 can remove or suck up the debris and slurry 123 (or diluted slurry 123) before they contact the polishing disk 118. Dilution or removal of the slurry 123 can reduce the acidity of the slurry 123 and prevent the slurry 123 from chemically reacting, corroding, or attacking the polishing disk 118, which may include stainless steel. Protecting the polishing disk 118 can extend the life of the polishing disk 118, which can, for example, reduce operating costs by reducing the amount of polishing disk 118 consumed, and thereby reduce the number of polishing stations 100 ( Figure 1 ) Downtime required to replace the polishing pad 118. Diluting the slurry 123 can reduce the density of the slurry 123 and allow the vacuum ring 346 to remove the diluted slurry 123 more easily than the slurry 123.

[0040] The outer nozzle 344 of the outer cleaning ring 342 delivers a high pressure fluid spray to the polishing surface 102 to remove debris (such as byproducts from the polishing process) and dilute or remove the slurry 123. Removing debris prevents the polishing disk 118 from moving or smearing debris on the polishing surface 102, which helps prevent debris from getting stuck or embedded in the polishing surface 102. Debris embedded in the polishing surface 102 may scratch the substrate 116 or become embedded in the substrate 116 during the polishing process, which may result in additional processing or scrapping of the polished substrate 116. The outer nozzle 344 is coupled to a first fluid source 354 (such as a water or deionized water source) through a first fluid delivery line 355 and sprays fluid from the first fluid source 354. In the depicted embodiment, the outer nozzle 344 is positioned around the diameter of the outer cleaning ring 342. In some embodiments, the outer nozzle 344 may be positioned at different diameters or angular positions of the outer cleaning ring 342.

[0041] The inner nozzle 350 of the inner cleaning ring 348 delivers a high pressure fluid spray to the polishing surface 102 in a similar manner to the outer nozzle 344 to remove debris, such as byproducts from the conditioning process. The inner nozzle 350 is coupled to a second fluid source 356 (such as a water or deionized water source) through a second fluid delivery line 357 and sprays fluid from the second fluid source 356. In the depicted embodiment, the inner nozzle 350 is positioned around the diameter of the inner cleaning ring 348. In some embodiments, the inner nozzle 350 can be positioned at different diameters or angular positions of the inner cleaning ring 348. In some embodiments, the high pressure flow rate of the water or deionized water source through the outer nozzle 344 and the inner nozzle 350 can be a flow rate of greater than 1 liter per minute.

[0042] The vacuum port 347 of the vacuum ring 346 is coupled to a vacuum source 358 via a vacuum line 359. The vacuum source 358 can be any system capable of creating a vacuum through the vacuum line 359 or drawing fluid from the vacuum port 347, such as a Venturi system or a vacuum pump. Thus, the vacuum ring 346 can utilize the Venturi effect or negative pressure to remove debris and slurry through the vacuum port 347. In the depicted embodiment, the vacuum port 347 is a cylindrical opening (e.g., a hollow cylinder or tube) formed by the vacuum ring 346 and along the radius of the vacuum ring 346. For example, the radius of the vacuum port 347 can follow the radius of the vacuum ring 346, or the center point of the vacuum port 347 can be approximately co-located with the center point of the vacuum ring 346.

[0043] The pad surface cleaning system 340 can operate based on two zones: A and B. Zones A and B are separated by a zone boundary line 352. In the depicted embodiment, the zone boundary line 352 is a straight line extending between the center of the polishing pad 104 (e.g., the third rotational axis 235) and the edge of the diameter of the polishing pad 104, and is therefore orthogonal to (e.g., perpendicular to) the edge of the diameter of the polishing pad 104, such as 90 degrees + / - 5 degrees, such as 90 degrees + / - 2 degrees, such as 90 degrees + / - 1 degree, such as 90 degrees + / - 0.5 degrees, such as 90 degrees + / - 0.25 degrees. In some embodiments, the zone boundary line 352 can be orthogonal to the linear velocity direction of the polishing pad 104. The zone boundary line 352 can move with the pad surface cleaning system 340, such as in embodiments where the polishing disk 118 moves in a linear, arcuate, or sweeping motion. In such embodiments, the zone boundary line 352 can remain orthogonal to the edge of the diameter of the polishing pad 104.

[0044] The regions A and B are arranged such that region A includes the outer cleaning ring 342, the vacuum ring 346, and the portion of the inner cleaning ring 348 positioned over the inlet portion of the polishing pad 104, such as the portion of the polishing pad 104 moving toward the region boundary line 352. Region B includes the outer cleaning ring 342, the vacuum ring 346, and the portion of the inner cleaning ring 348 positioned over the outlet portion of the polishing pad 104, such as the portion of the polishing pad 104 moving away from the region boundary line 352.

[0045] The portion of the vacuum port 347 located in region A is positioned downstream of the outer nozzle 344 located in region A. The portion of the vacuum port 347 located in region B is positioned downstream of the inner nozzle 350 located in region B. Positioning the portion of the vacuum port 347 in region A downstream of the outer nozzle 344 allows the vacuum ring 346 to recover fluid from the first fluid source 354, using the carrier head 106 ( Figure 1 ) polishing substrate 116 ( Figure 1 ) and the debris generated by the slurry 123 ( Figure 2 ) or spent slurry 123. Positioning a portion of vacuum port 347 in region B downstream of inner nozzle 350 allows vacuum ring 346 to recover fluid from second fluid source 356 and debris from conditioning polishing surface 102 using conditioning disk 118.

[0046] The system controller 190 can control the pad surface cleaning system 340 based on the position of the pad surface cleaning system 340. For example, the system controller 190 can control the supply of fluid from the first fluid source 354 and the second fluid source 356 (collectively referred to as rinsing fluid) and the vacuum source 358 based on the position of the pad surface cleaning system 340 relative to the slurry delivery arm 122. In some embodiments, the system controller 190 can stop supplying the rinsing fluid when a portion of the pad surface cleaning system 340 is within a radius of the polishing pad 104 occupied by the slurry 123 delivery point of the slurry delivery arm 122. This prevents dilution or removal of the newly applied slurry 123. Referring to FIG. Figure 7 and Figure 8 Control of flushing fluid is discussed further.

[0047] The configuration of the pad surface cleaning system 340 (eg, attached to the conditioning arm 121 and connected to the system controller 190) allows the pad surface cleaning system 340 to be operated in situ or in conjunction with the processing station 100 ( Figure 1 ) simultaneously. For example, pad surface cleaning system 340 can be used with conditioning head 120 and conditioning disk 118 to condition polishing surface 102 while carrier head 106 is polishing a substrate. Simultaneous conditioning and polishing can advantageously reduce operating costs and reduce processing time for substrate 116.

[0048] although Figure 1-Figure 3 The polishing pad 104 is shown rotating clockwise and the conditioning disk 118 is shown rotating counterclockwise, but the pads 104 and 118 can rotate differently. In some embodiments, the polishing pad 104 can rotate counterclockwise and the conditioning disk 118 can rotate clockwise. In some embodiments, the pads 104 and 118 can rotate in the same direction, such as both clockwise or both counterclockwise.

[0049] In some embodiments, the pad surface cleaning system 340 is disposed on a different arm than the conditioning arm 121. In some embodiments, the pad surface cleaning system 340 is located downstream of the slurry delivery arm 122 and the conditioning head 120.

[0050] In some embodiments, at least one of the outer nozzle 344 and the inner nozzle 350 may occupy both regions A and B. Such a nozzle may operate as part of region A or region B, or may operate as part of both regions A and B.

[0051] In some embodiments, the first fluid source 354 and the second fluid source 356 include different fluids. In some embodiments, the first fluid source 354 and the second fluid source 356 include the same fluid. In some embodiments, the outer purge ring 342 may include outer nozzles 344 only in region A, and the inner purge ring 348 may include inner nozzles 350 only in region B.

[0052] In some embodiments, the pad surface cleaning system 340 does not use areas A and B. In such embodiments, fluid from the first fluid source 354 may be supplied to all outer nozzles 344 , and fluid from the second fluid source 356 may be supplied to all inner nozzles 350 .

[0053] In some embodiments, vacuum port 347 may include converging or diverging portions. In some embodiments, vacuum port 347 may include multiple vacuum ports disposed in or formed by vacuum ring 346. For example, multiple vacuum ports may be positioned around the diameter of vacuum ring 346.

[0054] Figure 4A Depicted according to some embodiments Figure 3 Schematic side view of the pad surface cleaning system 340 in FIG. Specifically, Figure 4A A cross-sectional view of the pad surface cleaning system 340 is shown with one of the outer nozzles 344, one of the inner nozzles 350, and the vacuum port 347 cut away. The first and second fluid delivery lines 355, 357, and the vacuum line 359 are coupled to the adjustment arm 121 by mounting brackets 460, such as clips, zip ties, brackets, or straps. In the illustrated embodiment, the outer nozzle 344 and the inner nozzle 350 are cylinders connected to the first and second fluid delivery lines 355, 357 through passages in the outer and inner cleaning rings 342, 348. The passages may be referred to as the outer cleaning ring passages and the inner cleaning ring passages. The vacuum port 347 forms a cylindrical cutout in the vacuum ring 346 and includes a passage in the vacuum ring 346 that connects to the vacuum line 359. The passages may be referred to as vacuum annular passages.

[0055] In the illustrated embodiment, the outer cleaning ring 342, the vacuum ring 346, and the inner cleaning ring 348 are shown as separate components and can be coupled or joined together, such as by press-fitting the inner cleaning ring 348 into the vacuum ring 346 and allowing the vacuum ring 346 to enter the outer cleaning ring 342. Of course, it is contemplated that the outer cleaning ring 342, the vacuum ring 346, and the inner cleaning ring 348 can be connected together using various other fastening members, including but not limited to various adhesives, various mechanical fasteners, or welding. In some embodiments, the outer cleaning ring 342, the vacuum ring 346, and the inner cleaning ring 348 can be formed integrally. For example, the outer cleaning ring 342, the vacuum ring 346, and the inner cleaning ring 348 can be machined from a billet of a single material, molded or printed as a single piece, welded or bonded together, or otherwise joined together as a single object.

[0056] Figure 4B and Figure 4C Depicted according to some embodiments Figure 4A Schematic side view of the pad surface cleaning system 340 in FIG. Specifically, Figure 4B The separation distance from the outer nozzle 344 and the vacuum port 347 to the polishing surface 102 is shown. Figure 4C The separation distance from the inner nozzle 350 and the vacuum port 347 to the polishing surface 102 is shown.

[0057] The outer nozzle 344 is positioned at a first spacing distance (h1) from the polishing surface 102. The vacuum port 347 is positioned at a second spacing distance (h2) from the polishing surface 102. The inner nozzle 350 is positioned at a third spacing distance (h3) from the polishing surface 102. As shown, the first spacing distance (h1) is greater than the third spacing distance (h3), and the third spacing distance (h3) is greater than the second spacing distance (h2). Using the second spacing distance (h2) as the shortest distance positions the vacuum port 347 closer to the polishing surface 102 than the outer nozzle 344 and the inner nozzle 350, which can allow the vacuum port 347 to recover debris and slurry 123 ( Figure 2 ) do not interfere with the flow path from the outer purge ring 342 and the inner purge ring 348 through the vacuum port 347. The second spacing distance (h2) may also require a smaller vacuum pressure from the vacuum source 358 than if the second spacing distance (h2) is larger. The first spacing distance (h1) and the third spacing distance (h3) may be based on the outer nozzle 344 and the inner nozzle 350. For example, the first and third spacing distances (h1) and (h3) may depend on the inlet diameter, outlet diameter, or throat diameter of the nozzles 344 and 350, or the desired impact velocity of the flushing fluid, wherein the velocity of the flushing fluid may depend on the distance traveled by the flushing fluid from the outer nozzle 344 and the inner nozzle 350. The first spacing distance (h1) and the third spacing distance (h3) may also depend on the desired cross-section of the flushing fluid upon impact (e.g., the diameter of a cone spray pattern or the width of a flat fan spray pattern), wherein the cross-section may increase or decrease with increasing distance from the outer nozzle 344 and the inner nozzle 350. In some embodiments, the spacing distance (h1) may be between 10-100 mm. In some embodiments, the spacing distance (h2) may be less than or equal to 10 mm. In some embodiments, the spacing distance (h3) may be between 10-100 mm. In some embodiments, any one or all of the spacing distances (h1), (h2), and (h3) may be equal to each other.

[0058] Despite Figure 3-4C 344 and the inner nozzle 350 are shown as cylinders, but the outer nozzle 344 and the inner nozzle 350 can be convergent nozzles or convergent-divergent nozzles. In some embodiments, the outer nozzle 344 and the inner nozzle 350 can be veejet nozzles, N2 / DI atomizer nozzles, or a combination thereof.

[0059] although Figure 1-4C The circular platform 108 and circular polishing pad 104 in a rotary polisher are shown, but the polishing pad surface cleaning system 340 can be used with other polishing methods and designs. In some embodiments, the polishing pad 104 can be a conveyor belt moving on rollers, and the platform 108 can not rotate and remain stationary, such as in a linear polisher. In some embodiments, the platform 108 can rotate while moving around the first rotation axis 231 ( Figure 2 ) moves on an orbit, such as in an orbital polishing machine.

[0060] Figure 5 A schematic side view of a rotatable pad surface cleaning system 540 is depicted in accordance with some embodiments.

[0061] Except as noted, the adjustment module 510 is similar to the Figure 1-4A Conditioning module 110 discussed. Conditioning module 510 includes an adjustment arm 521 coupled to an adjustment head 520 via a rotary union 562 or manifold. Adjustment head 520 rotates or turns conditioning disk 118. Rotatable pad surface cleaning system 540 is similar to pad surface cleaning system 340 except as noted. Rotatable pad surface cleaning system 540 completely surrounds conditioning disk 118 and rotates with polishing disk 118. Rotatable pad surface cleaning system 540 includes an outer cleaning ring 542 having an outer nozzle 544, a vacuum ring 546 having a vacuum port 547, and an inner cleaning ring 548 having an inner nozzle 550. The outer nozzle 544 is coupled to a first fluid source 354 via a first fluid delivery line 355, the inner nozzle 550 is coupled to a second fluid source 356 via a second fluid delivery line 357, and the vacuum port 547 is coupled to a vacuum source 358 via a vacuum line 359.

[0062] The first fluid delivery line 355, the second fluid delivery line 357, and the vacuum line 359 run through the rotary joint 562 to fluidly couple the fixed first fluid source 354, the second fluid source 356, and the vacuum source 358 to the rotating outer cleaning ring 342, the inner cleaning ring 348, and the vacuum ring 346, respectively. The rotary joint 562 rotates relative to the adjustment arm 521. The rotatable pad surface cleaning system 540 includes areas A and B and about Figure 3 The zone boundary line 352 in question. Zones A and B do not rotate with the rotatable pad surface cleaning system 540, but rather the zone boundary line 352 remains orthogonal to the edge of the diameter of the polishing pad 104. The system controller 190 can control which nozzle or nozzles 544 and 550 of the outer cleaning ring 542 and the inner cleaning ring 548 are used based on the zone in which each corresponding nozzle 544 and 550 is located. Additional Examples of Pad Surface Cleaning Systems

[0063] Figure 6A-6C Depicted are top plan views of different pad surface cleaning systems 640 (e.g., 640A, 640B, and 640C) according to some embodiments. Specifically, Fig. 6A A rectangular pad surface cleaning system 640A is shown that is similar to the pad surface cleaning system 340 except as noted.

[0064] Rectangular pad surface cleaning system 640A includes an outer cleaning ring 642A having an outer nozzle 644A, a vacuum ring 646A having a vacuum port 647A, and an inner cleaning ring 648A having an inner nozzle 650A. Outer cleaning ring 642A, vacuum ring 646A, and inner cleaning ring 648A each have a rectangular shape, wherein inner cleaning ring 648A is nested within vacuum ring 646A, and vacuum ring 646A is nested within outer cleaning ring 642A. Rectangular pad surface cleaning system 640A includes regions A and B and region boundary lines 652A, which are in accordance with the embodiment of the present invention. Figure 3 The discussed regions A and B and region boundary line 352 are used in a similar manner.

[0065] The rectangular pad surface cleaning system 640A may be used with the conditioning module 110 or 510, which may move the rectangular pad surface cleaning system 640A in a linear, arcuate, or sweeping motion with the conditioning head 120 or 520. The rectangular pad surface cleaning system 640A may completely surround the conditioning disk 118.

[0066] In the depicted embodiment, two sides of the rectangular pad surface cleaning system 640A are substantially parallel to the zone boundary line 652A, such as within 5 degrees, such as within 3 degrees, such as within 1 degree, such as within 0.5 degrees. In some embodiments, the rectangular pad surface cleaning system 640A may not have sides that are positioned substantially parallel to the zone boundary line 652A. In some embodiments, the two sides of the rectangular pad surface cleaning system 640A may be parallel to each other, but not parallel to the zone boundary line 652A. Although with respect to Fig. 6A Rectangles are discussed, but other polynomial shapes may be used with the rectangular pad surface cleaning system 640A, such as squares, pentagons, octagons, and the like.

[0067] Figure 6B A semi-circular pad surface cleaning system 640B is shown which is similar to the pad surface cleaning system 340 except as noted.

[0068] The semicircular pad surface cleaning system 640B includes an arcuate (e.g., semicircular) outer cleaning ring 642B having an outer nozzle 644B and a corresponding first vacuum ring 646Ba having a vacuum port 647Ba. The semicircular pad surface cleaning system 640B also includes an arcuate inner cleaning ring 648B having an inner nozzle 650B and a corresponding second vacuum ring 646Bb having a vacuum port 647Bb. The first vacuum ring 646Ba has a semicircular shape, which is nested inside and downstream of the outer cleaning ring 642B. The second vacuum ring 646Bb has a semicircular shape, which is nested outside and downstream of the inner cleaning ring 642B. The first vacuum ring 646Ba extends through the outer cleaning ring 642B to capture the fluid sprayed by the outermost outer nozzle 644B. ​​The second vacuum ring 646Bb extends through the inner cleaning ring 648B to capture the fluid sprayed by the outermost outer nozzle 644B.

[0069] The semicircular pad surface cleaning system 640B may be used with the conditioning module 110 or 510 and may move with the conditioning head 120 or 520 in a linear, arcuate, or sweeping motion.

[0070] Semicircular pad surface cleaning system 640B includes regions A and B and region boundary line 652B, which is in accordance with the Figure 3 The regions A and B discussed above and the region boundary line 352 are used in a similar manner. In the depicted embodiment, the outer purge ring 642B and the first vacuum ring 646Ba are positioned in region A, and the inner purge ring 648B and the second vacuum ring 646Bb are positioned in region B. In some embodiments, the outer purge ring 642B and the inner purge ring 648B may be positioned in both regions A and B, such as being mostly positioned in one region and partially positioned in the other region.

[0071] Figure 6C A flat bar pad surface cleaning system 640C is shown that is similar to the pad surface cleaning system 340 except as noted.

[0072] The flat strip pad surface cleaning system 640C includes an outer cleaning ring 642C having an outer nozzle 644C and a corresponding first vacuum ring 646Ca having a vacuum port 647Ca. The flat strip pad surface cleaning system 640C further includes an inner cleaning ring 648C having an inner nozzle 650C and a corresponding second vacuum ring 646Cb having a vacuum port 647Cb. The outer cleaning ring 642C and the inner cleaning ring 648C are both rectangular in shape and are generally parallel to each other. The polishing disc 118 is positioned between the outer cleaning ring 642C and the inner cleaning ring 648C.

[0073] The first vacuum ring 646Ca has a rectangular shape and is located downstream of and adjacent to (eg, coupled to) the outer purge ring 642C. The second vacuum ring 646Cb has a rectangular shape and is located downstream of and adjacent to the inner purge ring 648C.

[0074] The flat bar pad surface cleaning system 640C may be used with the conditioning module 110 or 510 and may move with the conditioning head 120 or 520 in a linear, arcuate, or sweeping motion.

[0075] In some embodiments, the outer cleaning ring 642C and the inner cleaning ring 648C may not be substantially parallel to each other. For example, each of the outer cleaning ring 642C and the inner cleaning ring 648C may be aligned with a radial line extending from a center point of the polishing pad 104 to an edge of a diameter of the polishing pad 104 .

[0076] Figure 7 A schematic top view of a pad surface cleaning system 740 is depicted moving relative to a polishing fluid delivery point 724 in accordance with some embodiments. Specifically, Figure 7 It is shown how the pad surface cleaning system 740 may be controlled based on the position of the pad surface cleaning system 740 relative to the polishing fluid delivery point 724 .

[0077] Except as noted, pad surface cleaning system 740 is similar to pad surface cleaning system 340 ( Figure 3-4C ). The pad surface cleaning system 740 includes an outer cleaning ring and an inner cleaning ring (not shown) and a vacuum ring (not shown) having vacuum ports 747 (shown as vacuum port 747A in a first position and vacuum port 747B in a second position). The polishing fluid delivery point 724 is such as about Figure 1-4C The polishing fluid of the slurry 123 discussed contacts the point of the polishing surface 102 of the polishing pad 104. As the polishing pad 104 rotates, the polishing fluid can be dispersed in the dispersion path 725. The vacuum port 747 can be coupled to a vacuum source (not shown) that provides negative pressure when the vacuum port 747 is not above the dispersion path 725 (as shown on the page). For example, when the vacuum port 747A is located within the dispersion path 725, such as when the vacuum port 747A is in the first position, the vacuum source may not provide negative pressure. When the vacuum port 747 is located outside the dispersion path 725, such as when the vacuum port 747B is in the second position, the vacuum source can provide negative pressure. The system controller 190( Figure 3 ) can be used as Fig. 9 The described pad surface cleaning system uses 912 to control the vacuum source.

[0078] In the depicted embodiment, the diverging path 725 follows a radius of the polishing pad 104. In some embodiments, the diverging path 725 may not be a radius, such as embodiments with a linear or orbital polisher.

[0079] Figure 8 A schematic top view of a pad surface cleaning system 740 and a polishing fluid delivery point 824 moving relative to a polishing pad 104 is depicted in accordance with some embodiments. Figure 8 It is shown how the pad surface cleaning system 740 may be controlled based on the position of the pad surface cleaning system 740 relative to the polishing fluid delivery point 824 .

[0080] As the polishing pad 104 rotates, the polishing fluid can be applied to the polishing pad 104 at several locations, such as along a path from an edge of a diameter of the polishing pad 104 to at least a portion of a radius of the polishing pad 104. For example, the polishing fluid can be dispersed at a polishing fluid delivery point 824A at an outer location, a polishing fluid delivery point 824B at an inner location, or a polishing fluid delivery point at a location between the outer location and the inner location. As the polishing pad 104 rotates, the polishing fluid can be dispersed in a dispersion path 825 (e.g., an outer dispersion path 825A or an inner dispersion path 825B).

[0081] When the vacuum port 747 (shown as the vacuum port 747C in the third position and the vacuum port 747D in the fourth position) is not above the dispersion path 825 (as shown on the page) (shown as the outer dispersion path 825A or the inner dispersion path 825B), the vacuum source can provide negative pressure. For example, when the vacuum port 747 is located in the dispersion path 825, such as when the vacuum port 747C is in the third position or when the vacuum port 747D is in the fourth position, the vacuum source may not provide negative pressure. When the vacuum port 747 is located outside the dispersion path 825, such as when the vacuum port 747 is located between the third position and the fourth position, the vacuum source can provide negative pressure. Therefore, the polishing fluid delivery point 824 can be coordinated with the movement of the vacuum port 747 to ensure that the vacuum source provides negative pressure when the vacuum port 747 is located outside the outer position and the inner position of the polishing pad 104.

[0082] In some embodiments, the polishing fluid is delivered from the slurry delivery arm 122 ( Figure 1 ) dispersion, the slurry delivery arm 122 moves along a path from the edge of the diameter of the polishing pad 104 to at least a portion of the radius of the polishing pad 104.

[0083] although Figure 7 and Figure 8The vacuum source and vacuum port 747 are described, but in some embodiments, when the outer nozzle and / or the inner nozzle are located above the dispersion paths 725 and 825, the fluid from the first fluid source and / or the fluid from the second fluid source may not be provided. Example System Controller for a Pad Surface Cleaning System

[0084] Fig. 9 Depicted is a system for cleaning a pad surface (e.g., Figure 3-Figure 8 1. Functional block diagram of a system controller 190 of a pad surface cleaning system 340, 540, 640, and 740 in FIG.

[0085] The system controller 190 includes a processor 920 (e.g., a central processing unit (CPU)) in data communication with a memory 910, an input device 930, and an output device 940. Although described separately, it should be understood that the functional blocks described with respect to the system controller 190 need not be separate structural elements. For example, the processor 920 and the memory 910 are embodied in a single chip. The processor 920 can be a general-purpose processor, a digital signal processor ("DSP"), an application-specific integrated circuit ("ASIC"), a field programmable gate array ("FPGA"), or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any suitable combination thereof designed to perform the functions described in the present disclosure. The processor can also be implemented as a combination of computing devices, for example, a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors combined with a DSP core, or any other such configuration.

[0086] The processor 920 may be coupled via one or more buses to read information from or write information to the memory 910. The processor may additionally or alternatively include memory, such as processor registers. The memory 910 may include a processor cache, including a multi-level hierarchical cache, where different levels have different capacities and access speeds. The memory 910 may also include a random access memory (RAM), other volatile storage devices, or non-volatile storage devices. The storage may include a hard drive, flash memory, etc. The memory 910 may also include a pad surface cleaning system application 912, which is used to control the vacuum source, the first fluid source, and the second fluid source, such as Figure 7 and Figure 8912 may be code executable by processor 920. In various cases, memory is referred to as a computer-readable storage medium. A computer-readable storage medium is a non-transitory device capable of storing information and is distinguishable from a computer-readable transmission medium such as an electronic transient signal capable of carrying information from one location to another. A non-transitory computer-readable medium includes computer-executable instructions that, when executed by a processing system, cause the processing system to perform the instructions described above. Fig.10 The method described includes: flowing a fluid from a first fluid source through an outer nozzle to loosen debris from a substrate polishing process, removing debris from the substrate polishing process through a vacuum port by creating negative pressure using a vacuum source, flowing a fluid from a second fluid source through an inner nozzle to loosen debris generated when conditioning a polishing pad, and removing debris generated when conditioning a polishing pad through a vacuum port by creating negative pressure using a vacuum source. Computer readable media described in the present disclosure may generally refer to computer readable storage media.

[0087] Processor 920 may also be coupled to input device 930 and output device 940 to receive input from and provide output to, respectively, a user of system controller 190. Suitable input devices include, but are not limited to, a keyboard, buttons, keys, switches, a pointing device, a mouse, a joystick, a remote control, an infrared detector, a bar code reader, a scanner, a camera (which may be coupled with video processing software to, for example, detect hand gestures or facial gestures), a motion detector, or a microphone (which may be coupled with audio processing software to, for example, detect voice commands). Input device 930 may include a position sensor, such as an encoder, to sense the pad surface cleaning system 340, 540, 640, and 740 ( Figure 3-Figure 8 ) and / or slurry delivery arm 122 ( Figure 1 and Figure 2 ) position. Suitable output devices include, but are not limited to: adjusting base 237 ( Figure 2 ), a motor attached to the slurry delivery arm 122, and visual output devices (including displays and printers), audio output devices (including speakers, headphones, earphones, alarms), an additive manufacturing machine, and tactile output devices. Example Method of Conditioning a Polishing Pad

[0088] Fig.10 A flow chart is depicted of a method 1000 for conditioning a polishing pad in accordance with some embodiments.

[0089] Method 1000 may be performed using any suitable processing station, such as Figure 1 and Figure 2 The processing station 100 discussed. The processing station 100 includes Figure 3-6CThe pad surface cleaning system 340, 540, 640 or 740 described in.

[0090] At operation 1002, method 1000 includes positioning a conditioning disk relative to a polishing pad within a polishing pad cleaning system, as described above with reference to Figure 3-4C In some embodiments, the polishing pad cleaning system includes an outer cleaning ring including an outer nozzle, an inner cleaning ring including an inner nozzle, and a vacuum ring. The outer nozzle is coupled to a first fluid source, the inner nozzle is coupled to a second fluid source, and the vacuum ring forms a vacuum port that is fluidically coupled to the vacuum source.

[0091] At operation 1004, method 1000 includes flowing a fluid from a first fluid source through an outer nozzle to loosen debris from a polishing pad during a substrate polishing process, as described above with reference to Figure 3-6C described.

[0092] At operation 1006, method 1000 includes removing debris from the polishing pad during the substrate polishing process through the vacuum port by using a vacuum source to generate negative pressure, as described above with reference to Figure 3-Figure 8 described.

[0093] At operation 1008, method 1000 includes flowing a fluid from a second fluid source through the inner nozzle to loosen debris from the polishing pad during a substrate polishing process, as described above with reference to Figure 3-6C described.

[0094] At operation 1010, the method 1000 includes removing debris from a polishing pad during a substrate polishing process through a vacuum port by using a vacuum source to generate negative pressure, as described above with reference to Figure 3-Figure 8 described.

[0095] In some embodiments, debris from a substrate polishing process is generated by polishing a substrate using a polishing pad.

[0096] In some embodiments, flowing fluid from a first fluid source, removing debris from the substrate polishing process, flowing fluid from a second fluid source, and removing debris from the conditioned polishing pad are performed simultaneously while polishing the substrate using the polishing pad.

[0097] Some embodiments further include rotating the polishing pad. Some embodiments further include dispensing polishing fluid onto the polishing pad. Some embodiments further include moving the polishing pad cleaning system and the conditioning disk across the surface of the polishing pad, wherein negative pressure is generated using a vacuum source when the vacuum port is located outside of a dispersion path for the polishing fluid. Some embodiments further include moving a polishing fluid delivery arm across the polishing pad such that the polishing fluid is applied at several locations on the polishing pad.

[0098] Despite the combination Figure 1-Figure 8The operations of method 1000 are described, but those skilled in the art will understand that any system configured to perform the operations of method 1000 in any order falls within the scope of the embodiments described in the present disclosure.

[0099] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope of the disclosure, and the scope of the same is determined by the claims that follow.

Claims

1. A polishing pad cleaning system for substrate polishing, the polishing pad cleaning system comprising: an outer cleaning ring comprising an outer nozzle, wherein the outer nozzle is configured to be coupled to a first fluid source; an inner cleaning ring comprising an inner nozzle, wherein the inner nozzle is configured to be coupled to a second fluid source; as well as a vacuum ring, wherein the vacuum ring forms a vacuum port configured to be fluidly coupled to a vacuum source, in: a conditioning disk configured to be disposed within the polishing pad cleaning system and to condition the polishing pad, The outer nozzle is configured to loosen debris from a polishing process of the substrate, The inner nozzle is configured to loosen debris from conditioning the polishing pad, and The vacuum ring is configured to remove the debris loosened by the outer purge ring and the inner purge ring.

2. The polishing pad cleaning system of claim 1, wherein the inner cleaning ring is disposed within the vacuum ring, and the vacuum ring is disposed within the outer cleaning ring.

3. The polishing pad cleaning system of claim 1, wherein the outer nozzle, the inner nozzle, and the vacuum port are each positioned around an arc, a semicircle, or a circle.

4. The polishing pad cleaning system of claim 1, wherein the outer cleaning ring, the vacuum ring, and the inner cleaning ring are integrally formed.

5. The polishing pad cleaning system of claim 1 , wherein the vacuum ring comprises a first vacuum ring and a second vacuum ring, the first vacuum ring being positioned downstream of and adjacent to the outer cleaning ring, and the second vacuum ring being positioned downstream of and adjacent to the inner cleaning ring.

6. The polishing pad cleaning system of claim 1, wherein the vacuum port is positioned downstream of the outer nozzle and the inner nozzle.

7. The polishing pad cleaning system of claim 1, wherein: The polishing pad cleaning system includes a first area, a second area, and a boundary line separating the first area and the second area. The boundary line is orthogonal to the edge of the polishing pad, and The outer nozzle is configured to loosen debris in the first region, and the inner nozzle is configured to loosen debris in the second region.

8. The polishing pad cleaning system of claim 1, wherein the second fluid source is the same as the first fluid source.

9. The polishing pad cleaning system of claim 1, wherein the polishing pad cleaning system is configured to surround the conditioning disk.

10. A conditioning system for conditioning a polishing pad, the conditioning system comprising: an adjustment module, comprising an adjustment arm and an adjustment head, wherein the adjustment head is configured to push an adjustment disk against the polishing pad; as well as A polishing pad cleaning system coupled to the conditioning arm, wherein the polishing pad cleaning system comprises: an outer cleaning ring including an outer nozzle configured to be coupled to a first fluid source; a vacuum ring comprising a vacuum port configured to be coupled to a vacuum source; and An inner cleaning ring includes an inner nozzle configured to be coupled to a second fluid source.

11. The conditioning system of claim 10, wherein the conditioning head is configured to rotate the conditioning disk about an axis of rotation of the conditioning head, and the pad cleaning system remains stationary relative to the axis of rotation of the conditioning head.

12. The conditioning system of claim 10, wherein the conditioning head is configured to rotate the conditioning disk and the polishing pad cleaning system about an axis of rotation of the conditioning head.

13. The polishing pad cleaning system of claim 10, wherein the outer nozzle, the inner nozzle, and the vacuum port are each positioned about an arc, a semicircle, or a circle.

14. The polishing pad cleaning system of claim 10, wherein the vacuum ring comprises a first vacuum ring and a second vacuum ring, the first vacuum ring being positioned downstream of and adjacent to the outer cleaning ring, and the second vacuum ring being positioned downstream of and adjacent to the inner cleaning ring.

15. The polishing pad cleaning system of claim 10, wherein the vacuum port is positioned downstream of the outer nozzle and the inner nozzle.

16. A method for conditioning a polishing pad, comprising: positioning a conditioning disk relative to a polishing pad within a polishing pad cleaning system, wherein the polishing pad cleaning system comprises: an outer cleaning ring comprising an outer nozzle, wherein the outer nozzle is coupled to a first fluid source; an inner cleaning ring comprising an inner nozzle, wherein the inner nozzle is coupled to a second fluid source; and a vacuum ring, wherein the vacuum ring forms a vacuum port, the vacuum port being fluidly coupled to a vacuum source; flowing a fluid from the first fluid source through the outer nozzle to loosen debris from the polishing pad during a substrate polishing process; removing the debris from the polishing pad through the vacuum port during the substrate polishing process by generating negative pressure using the vacuum source; flowing fluid from the second fluid source through the inner nozzle to loosen debris from the polishing pad during the substrate polishing process; and By generating negative pressure using the vacuum source, the debris is removed from the polishing pad through the vacuum port during the substrate polishing process.

17. The method of claim 16, wherein the debris from the substrate polishing process is generated by polishing a substrate using the polishing pad.

18. The method of claim 17, wherein flowing the fluid from the first fluid source, removing the debris from the polishing pad, flowing the fluid from the second fluid source, and removing the debris from the polishing pad are performed simultaneously while polishing a substrate using the polishing pad.

19. The method of claim 16, further comprising: rotating the polishing pad; dispensing a polishing fluid onto the polishing pad; as well as The polishing pad cleaning system and the conditioning disk are moved across a surface of the polishing pad, wherein negative pressure is generated using the vacuum source when the vacuum port is located out of a dispersion path for the polishing fluid.

20. The method of claim 19, further comprising: The polishing fluid delivery arm is moved across the polishing pad so that the polishing fluid is applied at a plurality of locations on the polishing pad.

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