Temperature control apparatus, substrate processing apparatus, and temperature control method

Abstract

Provided are a temperature control apparatus, a substrate processing apparatus, and a temperature control method that improve the system and responsiveness of temperature control. A temperature control device for controlling the temperature of a temperature adjustment unit by circulating a fluid through the temperature adjustment unit, the temperature control device being provided with: a first temperature adjustment unit for adjusting the fluid to a first temperature; a second temperature adjustment unit that adjusts the fluid adjusted to the first temperature to a second temperature; a first temperature adjustment flow path provided between the first temperature adjustment unit and the second temperature adjustment unit; a second temperature adjustment flow path provided between the second temperature adjustment unit and the temperature adjustment unit; and a return flow path provided between the temperature adjustment unit and the first temperature adjustment unit.

Description

Technical Field

[0001] The present disclosure relates to a temperature control device, a substrate processing device and a temperature control method. Background Art

[0002] For example, a temperature control device is disclosed, which includes: a temperature control part that circulates a fluid; a heating flow path that heats the fluid and circulates the fluid in the temperature control part; a cooling flow path that cools the fluid and circulates the fluid in the temperature control part; a bypass flow path that circulates the fluid in the temperature control part without passing through the heating flow path and the cooling flow path; and a regulating unit that regulates the flow ratio of the fluid output from the heating flow path, the cooling flow path, and the bypass flow path to the temperature control part via a confluence part, where the heating flow path, the cooling flow path, and the bypass flow path merge.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-276439 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] In one aspect, the present disclosure provides a temperature control apparatus, a substrate processing apparatus, and a temperature control method that improve the accuracy of temperature control.

[0008] Solutions for solving problems

[0009] In order to solve the above-mentioned problem, a temperature control device is provided. According to one embodiment, the temperature control device controls the temperature of the temperature control part by circulating a fluid in the temperature control part. The temperature control device comprises: a first temperature adjustment part, which adjusts the fluid to a first temperature; a second temperature adjustment part, which adjusts the fluid adjusted to the first temperature to a second temperature; a first temperature adjustment flow path, which is arranged between the first temperature adjustment part and the second temperature adjustment part; a second temperature adjustment flow path, which is arranged between the second temperature adjustment part and the temperature adjustment part; and a return flow path, which is arranged between the temperature adjustment part and the first temperature adjustment part.

[0010] Effects of the Invention

[0011] According to one aspect, a temperature control device, a substrate processing device, and a temperature control method that improve the accuracy of temperature control can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is an example of a structural diagram of a plasma processing system.

[0013] Figure 2 This is an example of a structural diagram of a plasma processing device.

[0014] Figure 3 This is an example of an overall configuration diagram of the temperature control module according to the first embodiment.

[0015] Figure 4 This is an example of an overall configuration diagram of a temperature control module according to a reference example.

[0016] Figure 5 This is a graph showing an example of temperature change of the heat transfer fluid.

[0017] Figure 6 This is an example of an overall configuration diagram of a temperature control module according to the second embodiment.

[0018] Figure 7 This is an example of an overall configuration diagram of a temperature control module according to the third embodiment. DETAILED DESCRIPTION

[0019] Hereinafter, various exemplary embodiments will be described in detail with reference to the accompanying drawings. In addition, the same reference numerals are given to the same or corresponding parts in each of the drawings.

[0020] use Figure 1 to Figure 2 The plasma processing system (substrate processing system) will be described. Figure 1 This is an example of a structural diagram of a plasma processing system. Figure 2 FIG. 1 is an example of a structural diagram of the plasma processing apparatus 1 .

[0021] like Figure 1 As shown, in one embodiment, a plasma processing system includes a plasma processing device 1 and a control unit 2. The plasma processing device 1 includes a plasma processing chamber 10, a substrate support portion 11, and a plasma generating portion 12. The plasma processing chamber 10 has a plasma processing space. In addition, the plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space, and at least one gas exhaust port for exhausting gas from the plasma processing space. The gas supply port is connected to the gas supply portion 20 described later, and the gas exhaust port is connected to the exhaust system 40 described later. The substrate support portion 11 is arranged in the plasma processing space, and the substrate support portion 11 has a substrate supporting surface for supporting a substrate.

[0022] The plasma generating unit 12 is configured to generate plasma from at least one processing gas supplied into the plasma processing space. The plasma formed in the plasma processing space may be a capacitively coupled plasma (CCP; Capacitively Coupled Plasma), an inductively coupled plasma (ICP; Inductively Coupled Plasma), an ECR plasma (Electron-Cyclotron-resonance plasma: electron cyclotron resonance plasma), a helicon wave plasma (HWP: Helicon Wave Plasma) or a surface wave plasma (SWP: Surface Wave Plasma), etc. In addition, various types of plasma generating units including an AC (Alternating Current: alternating current) plasma generating unit and a DC (Direct Current: direct current) plasma generating unit may be used. In one embodiment, the AC signal (AC power) used in the AC plasma generating unit has a frequency in the range of 100kHz to 10GHz. Thus, the AC signal includes an RF (Radio Frequency: radio frequency) signal and a microwave signal. In one embodiment, the RF signal has a frequency in the range of 200kHz to 150MHz.

[0023] The control unit 2 processes computer executable commands that cause the plasma processing device 1 to perform various processes described in the present disclosure. The control unit 2 can be configured to control the various elements of the plasma processing device 1 to perform various processes described herein. In one embodiment, a part or all of the control unit 2 can be included in the plasma processing device 1. The control unit 2 can also include a computer 2a, for example. The computer 2a can include, for example, a processing unit (CPU: Central Processing Unit) 2a1, a storage unit 2a2, and a communication interface 2a3. The processing unit 2a1 can be configured to perform various control actions based on a program stored in the storage unit 2a2. The storage unit 2a2 can include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface 2a3 can communicate with the plasma processing device 1 via a communication line such as a LAN (Local Area Network).

[0024] Next, a configuration example of a capacitively coupled plasma processing apparatus as an example of the plasma processing apparatus 1 will be described. Figure 2 As shown, the capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. In addition, the plasma processing apparatus 1 includes a substrate support unit 11 and a gas introduction unit. The gas introduction unit is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas introduction unit includes a shower head 13. The substrate support unit 11 is disposed in the plasma processing chamber 10. The shower head 13 is disposed above the substrate support unit 11. In one embodiment, the shower head 13 constitutes at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the shower head 13, the side wall 10a of the plasma processing chamber 10, and the substrate support unit 11. The side wall 10a is grounded. The shower head 13 and the substrate support unit 11 are electrically insulated from the shell of the plasma processing chamber 10.

[0025] The substrate support portion 11 includes a main body 111 and a ring assembly 112. The main body 111 has a central area (substrate support surface) 111a for supporting a substrate (wafer) W and an annular area (ring support surface) 111b for supporting the ring assembly 112. The annular area 111b of the main body 111 surrounds the central area 111a of the main body 111 when viewed from above. The substrate W is arranged on the central area 111a of the main body 111, and the ring assembly 112 is arranged on the annular area 111b of the main body 111 in a manner that surrounds the substrate W on the central area 111a of the main body 111. In one embodiment, the main body 111 includes a base and an electrostatic holding disk (holding disk: chuck). The base includes a conductive member. The conductive member of the base functions as a lower electrode. The electrostatic holding disk is arranged on the base. The upper surface of the electrostatic holding disk has a substrate support surface 111a. The ring assembly 112 includes one or more annular members. At least one of the one or more annular members is an edge ring. In addition, the substrate support portion 11 may include a temperature control module 100 configured to adjust at least one of the electrostatic holding disk, the ring assembly 112, and the substrate W to a target temperature (see below). Figure 3 ), but the figure is omitted. The temperature control module 100 may include a heater, a heat transfer fluid, a flow path 16 (see below) Figure 3 ) or a combination thereof. A heat transfer fluid such as salt water or gas flows in the flow path 16. In addition, the substrate support portion 11 may include a heat transfer gas supply portion configured to supply a heat transfer gas between the back surface of the substrate W and the substrate support surface 111a.

[0026] The shower head 13 is configured to introduce at least one processing gas from the gas supply part 20 into the plasma processing space 10s. The shower head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b and a plurality of gas introduction ports 13c. The processing gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s from the plurality of gas introduction ports 13c. In addition, the shower head 13 includes a conductive member. The conductive member of the shower head 13 functions as an upper electrode. In addition, the gas introduction part may include one or more side gas injection parts (SGI: Side Gas Injector) in addition to the shower head 13, and the one or more side gas injection parts are installed in one or more openings formed in the side wall 10a.

[0027] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one process gas from the respective gas sources 21 to the shower head 13 via the respective flow controllers 22. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. In addition, the gas supply unit 20 may include at least one flow modulation device for modulating or pulsing the flow of at least one process gas.

[0028] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is configured to provide at least one RF signal (RF power) such as a source RF signal and a bias RF signal to the conductive member of the substrate support 11 and / or the conductive member of the shower head 13. Thus, plasma is formed from at least one processing gas supplied to the plasma processing space 10s. Therefore, the RF power supply 31 can function as at least a part of the plasma generating unit 12. In addition, by providing the bias RF signal to the conductive member of the substrate support 11, a bias potential can be generated on the substrate W to attract ion components in the formed plasma to the substrate W.

[0029] In one embodiment, the RF power supply 31 includes a first RF generating unit 31a and a second RF generating unit 31b. The first RF generating unit 31a is configured to be coupled to the conductive member of the substrate support 11 and / or the conductive member of the shower head 13 via at least one impedance matching circuit, and generates a source RF signal (source RF power) for generating plasma. In one embodiment, the source RF signal has a frequency in the range of 13 MHz to 150 MHz. In one embodiment, the first RF generating unit 31a may be configured to generate a plurality of source RF signals having different frequencies. The generated one or more source RF signals are provided to the conductive member of the substrate support 11 and / or the conductive member of the shower head 13. The second RF generating unit 31b is configured to be coupled to the conductive member of the substrate support 11 via at least one impedance matching circuit, and generates a bias RF signal (bias RF power). In one embodiment, the bias RF signal has a frequency lower than that of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 400 kHz to 13.56 MHz. In one embodiment, the second RF generator 31b may also be configured to generate a plurality of bias RF signals having different frequencies. The generated one or more bias RF signals are provided to the conductive member of the substrate support 11. In addition, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0030] In addition, the power supply 30 may include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generating unit 32a and a second DC generating unit 32b. In one embodiment, the first DC generating unit 32a is configured to be connected to the conductive member of the substrate support 11 and generate a first DC signal. The generated first DC signal is applied to the conductive member of the substrate support 11. In one embodiment, the first DC signal may also be applied to other electrodes such as electrodes in an electrostatic holding disk. In one embodiment, the second DC generating unit 32b is configured to be connected to the conductive member of the shower head 13 and generate a second DC signal. The generated second DC signal is applied to the conductive member of the shower head 13. In various embodiments, the first DC signal and the second DC signal may also be pulsed. In addition, the first DC generating unit 32a and the second DC generating unit 32b may be provided in addition to the RF power supply 31, or the first DC generating unit 32a may be provided to replace the second RF generating unit 31b.

[0031] The exhaust system 40 can be connected to a gas outlet 10e, for example, provided at the bottom of the plasma processing chamber 10. The exhaust system 40 can include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is adjusted by the pressure regulating valve. The vacuum pump can include a turbomolecular pump, a dry pump, or a combination thereof.

[0032] Next, use Figure 3 A temperature regulation module (temperature control device) 100 according to the first embodiment will be described. Figure 3 This is an example of an overall configuration diagram of the temperature regulation module 100 according to the first embodiment.

[0033] The temperature control module 100 includes a cooler 50 , a temperature adjustment module 60 , and a temperature control unit 15 including a flow path 16 .

[0034] The temperature control module 100 controls the temperature of the temperature control section 15 by circulating a heat transfer fluid (e.g., salt water, etc.) in a flow path 16 formed in the temperature control section 15. In other words, the temperature control module 100 controls the temperature of the temperature control section 15 by circulating a heat transfer fluid between the flow path 16 formed in the temperature control section 15 and the cooler 50. The flow path 16 has an inlet 17 and an outlet 18. The temperature control section 15 may be, for example, a substrate support section 11. In this case, the temperature control module 100 controls the temperature of at least one of the electrostatic holding disk, the ring assembly 112, and the substrate W arranged near the substrate support section 11 to a desired temperature (target temperature) by controlling the temperature of the substrate support section 11 (temperature control section 15). In addition, the temperature control section 15 is not limited to the substrate support section 11, and may be, for example, an upper electrode or a side wall 10a of the plasma processing chamber 10.

[0035] Heat is input to the temperature control unit 15 from, for example, plasma generated in the plasma processing chamber 10 (see Figure 3 The heat transfer fluid is supplied from the inlet 17 of the flow path 16 to the temperature regulating unit 15, and heat exchange is performed between the heat transfer fluid flowing through the flow path 16 and the temperature regulating unit 15, thereby cooling the temperature regulating unit 15 and heating the heat transfer fluid. The outlet 18 of the flow path 16 is connected to one end of the return flow path 80. The other end of the return flow path 80 is connected to the cooler 50 (the first temperature regulating unit 51 described later). The heat transfer fluid ejected from the outlet 18 of the flow path 16 flows into the cooler 50 via the return flow path 80.

[0036] The cooler 50 includes a first temperature adjustment unit 51, a tank 52, and a pump 53. The other end of the return flow path 80 is connected to one end (upstream side) of the first temperature adjustment unit 51. The other end (downstream side) of the first temperature adjustment unit 51 is connected to one end (inflow side) of the tank 52 via the flow path 71. The other end (outflow side) of the tank 52 is connected to one end (intake side) of the pump 53 via the flow path 72. The other end (discharge side) of the pump 53 is connected to one end of the flow path 73.

[0037] The first temperature adjustment unit 51 is, for example, a cooling device (refrigerator) for cooling a heat transfer fluid, and is used to adjust the temperature of the heat transfer fluid to a first temperature. The tank 52 stores the heat transfer fluid cooled to the first temperature by the first temperature adjustment unit 51. The pump 53 circulates the heat transfer fluid between the flow path 16 of the temperature adjustment unit 15 and the cooler 50. The pump 53 ejects the heat transfer fluid cooled to the first temperature stored in the tank 52 to the temperature adjustment module 60 via the flow path 73.

[0038] In addition, Figure 3 In the figure, the tank 52 is set to be disposed on the downstream side of the first temperature adjustment part 51 and the upstream side of the pump 53, but the invention is not limited thereto. The tank 52 may also be a structure disposed on the upstream side of the first temperature adjustment part 51 and the pump 53. That is, the structure may be as follows: the other end of the return flow path 80 is connected to one end (inflow side) of the tank 52, the other end (outflow side) of the tank 52 is connected to one end (upstream side) of the first temperature adjustment part 51 via the flow path, and the other end (downstream side) of the first temperature adjustment part 51 is connected to one end (intake side) of the pump 53 via the flow path.

[0039] In addition, it is preferred that the tank 52 is Figure 3 As shown in the figure, it is arranged on the downstream side of the first temperature adjustment part 51. Therefore, for example, even if the temperature of the heat transfer fluid ejected from the first temperature adjustment part 51 fluctuates (changes), the heat transfer fluid stored in the tank 52 can absorb the temperature fluctuation, thereby reducing the temperature fluctuation of the heat transfer fluid ejected from the cooler 50.

[0040] The temperature adjustment module 60 includes a second temperature adjustment section 61 and a flow ratio adjustment section 62. The other end of the flow path 73 is connected to the inflow port of the branch section 74. The branch section 74 has one inflow port and two outflow ports. One outflow port of the branch section 74 is connected to one end (upstream side) of the second temperature adjustment section 61 via the flow path 75. The other end (downstream side) of the second temperature adjustment section 61 is connected to one inflow port of the confluence section 78 via the flow path 76.

[0041] The second temperature adjustment section 61 heats or cools the heat transfer fluid (heat transfer fluid adjusted to the first temperature) ejected from the cooler 50 to adjust the temperature of the heat transfer fluid to the second temperature. Moreover, the flow path 76 supplies the heat transfer fluid adjusted to the second temperature to the flow path 16 of the temperature adjustment section 15 via the confluence section 78 and the flow path 79. In addition, the second temperature adjustment section 61 can be a heating device for heating the heat transfer fluid (first temperature < second temperature), or a cooling device for cooling the heat transfer fluid (first temperature > second temperature). In addition, with respect to the second temperature adjustment section 61, a device with a smaller capacity (cooling capacity, heating capacity) than the first temperature adjustment section 51 can be used. In other words, with respect to the second temperature adjustment section 61, a device smaller than the first temperature adjustment section 51 can be used. In addition, the flow paths 71, 72, 73, and 75 provided between the first temperature adjustment section 51 and the second temperature adjustment section 61 can also be referred to as the first temperature adjustment flow path. A heat transfer fluid of the first temperature flows in the first temperature adjustment flow path. In addition, the flow path 76 provided between the second temperature adjustment unit 61 and the temperature adjustment unit 15 may be referred to as a second temperature adjustment flow path. The heat transfer fluid at the second temperature flows through the second temperature adjustment flow path.

[0042] The other outflow port of the branch portion 74 is connected to the other inflow port of the confluence portion 78 via the bypass flow path 77. That is, the bypass flow path 77 branches from the first temperature regulating flow path at the branch portion 74 and merges with the second temperature regulating flow path at the confluence portion 78.

[0043] The bypass flow path 77 supplies the heat transfer fluid (heat transfer fluid adjusted to the first temperature) ejected from the cooler 50 to the flow path 16 of the temperature adjustment unit 15 via the confluence portion 78 and the outgoing flow path 79 without passing through the flow path 75, the second temperature adjustment unit 61, and the flow path 76. The heat transfer fluid at the first temperature flows in the bypass flow path 77.

[0044] That is, in the temperature adjustment module 60 , a temperature difference is formed between the heat transfer fluid adjusted to the second temperature and flowing through the flow path 76 and the heat transfer fluid adjusted to the first temperature and flowing through the bypass flow path 77 .

[0045] The confluence portion 78 has two inflow ports and one outflow port. The inflow port of the confluence portion 78 is connected to the flow path 76 and the bypass flow path 77, respectively. The flow path 76 and the bypass flow path 77 merge at the inflow port of the confluence portion 78, and the outflow port of the confluence portion 78 is connected to the outflow flow path 79. The confluence portion 78 is provided with a flow ratio adjustment portion 62. The flow ratio adjustment portion 62 has a flow control valve 621 provided on the flow path 76 and a flow control valve 622 provided on the bypass flow path 77.

[0046] The opening degree (opening area) of the flow control valves 621 and 622 is controlled by the control unit 2. Thus, the flow ratio (mixing ratio) of the heat transfer medium at the second temperature from the flow path 76 and the heat transfer fluid at the first temperature from the bypass flow path 77 can be adjusted. Thus, the temperature of the heat transfer fluid circulating in the flow path 16 of the temperature regulating unit 15 can be controlled.

[0047] In addition, the flow ratio adjustment unit 62 is described as having flow control valves 621 and 622, but the invention is not limited thereto. The flow ratio adjustment unit 62 may also be a structure having a valve (e.g., a flow control valve, an on-off valve, etc.) provided in at least one of the flow path 76 and the bypass flow path 77. In addition, the flow ratio adjustment unit 62 may also be a structure having a valve (e.g., a mixing valve, etc.) provided in the confluence portion 78 of the flow path 76 and the bypass flow path 77.

[0048] The outgoing flow path 79 is used to circulate the heat transfer fluid from the outflow port of the merging portion 78 to the inlet 17 of the flow path 16 of the temperature adjustment portion 15 .

[0049] The return flow path 80 is provided between the temperature regulating unit 15 and the cooler 50 , and is used to circulate the heat transfer fluid from the outlet 18 of the flow path 16 of the temperature regulating unit 15 to the cooler 50 .

[0050] In addition, a temperature sensor 81 for detecting the temperature of the heat transfer fluid is provided in the flow path 73. A temperature sensor 82 for detecting the temperature of the heat transfer fluid is provided in the flow path 76. A temperature sensor 83 for detecting the temperature of the heat transfer fluid is provided in the bypass flow path 77. In addition, either the temperature sensor 81 or the temperature sensor 83 may be provided. A temperature sensor 84 for detecting the temperature of the heat transfer fluid is provided on the downstream side of the confluence portion 78 (to the flow path 79). A temperature sensor 85 for detecting the temperature of the heat transfer fluid is provided in the return flow path 80. The temperatures detected by the temperature sensors 81 to 85 are input to the control unit 2.

[0051] The control unit 2 controls the cooler 50. For example, the control unit 2 controls the output of the first temperature adjustment unit (refrigerator) 51 based on the temperature of the heat transfer fluid detected by the temperature sensor 85.

[0052] In addition, the control unit 2 controls the temperature adjustment module 60 so that the temperature of the heat transfer fluid supplied to the temperature adjustment unit 15 becomes a desired temperature. For example, the control unit 2 controls the flow ratio adjustment unit 62 so that the temperature of the heat transfer fluid after the confluence detected by the temperature sensor 84 becomes a predetermined temperature. In addition, the control unit 2 may control the flow ratio adjustment unit 62 based on the temperature of the heat transfer fluid before the confluence detected by the temperature sensor 83 (or the temperature sensor 81) (first temperature) and the temperature of the heat transfer fluid before the confluence detected by the temperature sensor 82 (second temperature). That is, the control unit 2 controls the flow control valves 621 and 622 to adjust the flow ratio (mixing ratio) of the heat transfer medium at the second temperature from the flow path 76 and the heat transfer fluid at the first temperature from the bypass flow path 77, thereby controlling the temperature of the heat transfer fluid supplied to the temperature adjustment unit 15. In addition, the control unit 2 controls the output of the second temperature adjustment unit 61.

[0053] Here, use Figure 4 A temperature control module 100X according to a reference example will be described. Figure 4 1 is an example of an overall structural diagram of a temperature control module 100X involved in a reference example. The temperature control module 100X involved in the reference example has a cooler 50 and a temperature control unit 15 having a flow path 16. That is, in the temperature control module 100X involved in the reference example, the flow path 73 is connected to the outgoing flow path 79, and the temperature control module 100X controls the temperature of the temperature control unit 15 by circulating a heat transfer fluid between the flow path 16 formed in the temperature control unit 15 and the cooler 50. The other structures are the same, and the description is omitted.

[0054] Figure 5 1 is a graph showing an example of temperature change of a heat transfer fluid. The temperature change of the heat transfer fluid in the temperature control module 100X according to the reference example is shown by the dotted line. In addition, the temperature change of the heat transfer fluid in the temperature control module 100 according to the present embodiment is shown by the dotted line.

[0055] Here, the case where the amount of heat input to the temperature adjustment unit 15 increases will be described as an example. That is, the temperature of the heat transfer fluid in the return flow path 80 increases compared to a normal state.

[0056] In the temperature control module 100X according to the reference example, the control unit 2 controls the first temperature adjustment unit 51 so as to increase the cooling capacity, thereby controlling the temperature of the heat transfer fluid supplied to the temperature control unit 15. Figure 5 In the temperature transient state shown in FIG. 1 , the control of the first temperature adjustment unit 51 may not be able to keep up, resulting in temperature fluctuations (overshoot, undershoot). Figure 5 In the example shown, undershoot occurs in the temperature control (see the dotted line) of the temperature control module 100X according to the reference example.

[0057] In contrast, in the temperature control module 100 according to the first embodiment, the control unit 2 controls the first temperature control unit 51 to increase the cooling capacity, thereby controlling the temperature of the heat transfer fluid. In addition, the control unit 2 controls the temperature of the heat transfer fluid supplied to the temperature control unit 15 by controlling the output of the second temperature control unit 61 and the flow ratio adjustment unit 62 (flow control valves 621 and 622). Therefore, in the case of Figure 5 In the temperature transition state shown, even if the control of the first temperature adjustment unit 51 cannot keep up and temperature fluctuation occurs, the temperature of the heat transfer fluid can be adjusted by the temperature adjustment module 60, so that the temperature fluctuation can be suppressed. For example, when the temperature of the heat transfer fluid flowing through the bypass flow path 77 becomes lower than the specified temperature (undershoot occurs), the heat transfer fluid flowing through the bypass flow path 77 is mixed with the heat transfer fluid flowing through the flow path 76, so that the temperature of the heat transfer fluid supplied to the temperature adjustment unit 15 can be close to the specified temperature. In this way, undershoot can be suppressed. Figure 5 In the illustrated example, undershoot is suppressed in the temperature control (see the solid line) of the temperature regulation module 100 according to the first embodiment.

[0058] In addition, even in a normal state, the temperature of the heat transfer fluid flowing to the flow path 79 varies slightly. Therefore, there is a risk that the temperature of the heat transfer fluid ejected from the cooler 50 also varies slightly. In contrast, in the temperature control module 100 according to the first embodiment, the temperature of the heat transfer fluid supplied to the temperature control unit 15 can be set to a desired temperature by the temperature adjustment module 60. Therefore, the accuracy of the temperature control of the heat transfer fluid supplied to the temperature control unit 15 can be improved.

[0059] In addition, the responsiveness of the temperature control of the heat transfer fluid by the temperature adjustment module 60 can be made faster than the responsiveness of the temperature control of the heat transfer fluid by the first temperature adjustment unit 51. Thus, temperature fluctuation (overshoot, undershoot) can be quickly suppressed.

[0060] In addition, regarding the second temperature adjustment section 61, a device that is smaller and has lower output than the first temperature adjustment section 51 can be used. As a result, it is possible to suppress the enlargement of the temperature control module 100. For example, it may be a structure in which the temperature difference formed by the second temperature adjustment section 61 (the temperature difference between the temperature of the temperature sensor 83 and the temperature of the temperature sensor 82) is smaller than the temperature difference formed by the first temperature adjustment section 51 (the temperature difference between the temperature of the temperature sensor 85 and the temperature of the temperature sensor 81). In addition, it may be a structure in which the flow rate of the heat transfer fluid flowing through the second temperature adjustment section 61 is smaller than the flow rate of the heat transfer fluid flowing through the first temperature adjustment section 51. In addition, it may be a structure in which the product of the temperature difference and the flow rate in the second temperature adjustment section 61 is smaller than the product of the temperature difference and the flow rate in the first temperature adjustment section 51.

[0061] In addition, Figure 3 In the above description, the first temperature adjustment unit 51 is a cooling device and the second temperature adjustment unit 61 is a heating device, but the present invention is not limited thereto. Alternatively, the first temperature adjustment unit 51 is a cooling device and the second temperature adjustment unit 61 is a cooling device. Thus, for example, the overshoot of the temperature of the heat transfer fluid can be suppressed. In addition, the second temperature adjustment unit 61 can also be configured to selectively heat or cool the heat transfer fluid.

[0062] In addition, Figure 3 In the embodiment, the case where the heat transfer fluid is circulated to cool the temperature regulating part 15 is described as an example, but the invention is not limited thereto. It is also possible to use a structure where the heat transfer fluid is circulated to heat the temperature regulating part 15. In this case, the first temperature regulating part 51 may be a heating device. In addition, the second temperature regulating part 61 may be a cooling device or a heating device. Thus, the temperature fluctuation of the heat transfer fluid supplied to the temperature regulating part 15 can be suppressed.

[0063] Furthermore, although the temperature adjustment module 60 has been described as including the bypass flow path 77 , the flow ratio adjustment unit 62 , and the flow path 76 having the second temperature adjustment unit 61 , the present invention is not limited thereto.

[0064] use Figure 6 The temperature control module 100 according to the second embodiment will be further described. Figure 6 This is an example of an overall configuration diagram of the temperature regulation module 100 according to the second embodiment.

[0065] The temperature control module 100 includes a cooler 50, a temperature adjustment module 60A, and a temperature control unit 15 having a flow path 16. The cooler 50 is different from the cooler 50 of the temperature control module 100 according to the first embodiment (see Figure 3 ) similarly has a first temperature adjustment unit 51, a tank 52 and a pump 53.

[0066] The temperature adjustment module 60A has a second temperature adjustment section 61A, a third temperature adjustment section 61B, and a flow ratio adjustment section 62. The other end of the flow path 73 is connected to the inflow port of the branch section 74. The branch section 74 has one inflow port and three outflow ports. The first outflow port of the branch section 74 is connected to one end (upstream side) of the second temperature adjustment section 61A via the flow path 75A. The other end (downstream side) of the second temperature adjustment section 61A is connected to the first inflow port of the confluence section 78 via the flow path 76A. The second outflow port of the branch section 74 is connected to one end (upstream side) of the third temperature adjustment section 61B via the flow path 75B. The other end (downstream side) of the third temperature adjustment section 61B is connected to the second inflow port of the confluence section 78 via the flow path 76B.

[0067] The second temperature adjustment unit 61A heats the heat transfer fluid (heat transfer fluid adjusted to the first temperature) ejected from the cooler 50 to control (adjust) the temperature of the heat transfer fluid to the second temperature (first temperature < second temperature). Furthermore, the flow path 76A supplies the heat transfer fluid adjusted to the second temperature to the flow path 16 of the temperature adjustment unit 15 via the confluence portion 78 and the outgoing flow path 79.

[0068] The third temperature adjustment unit 61B cools the heat transfer fluid (heat transfer fluid adjusted to the first temperature) ejected from the cooler 50 to control (adjust) the temperature of the heat transfer fluid to the third temperature (first temperature>third temperature). Furthermore, the flow path 76B supplies the heat transfer fluid adjusted to the third temperature to the flow path 16 of the temperature adjustment unit 15 via the confluence portion 78 and the outgoing flow path 79.

[0069] In addition, for the second temperature adjustment section 61A and the third temperature adjustment section 61B, a device with a smaller capacity (cooling capacity, heating capacity) than the first temperature adjustment section 51 can be used. In other words, for the second temperature adjustment section 61A and the third temperature adjustment section 61B, a device smaller than the first temperature adjustment section 51 can be used. In addition, the flow paths 71, 72, 73, 75A, and 75B provided between the first temperature adjustment section 51 and the second temperature adjustment section 61A and the third temperature adjustment section 61B are also referred to as first temperature adjustment flow paths. A heat transfer fluid of a first temperature flows in the first temperature adjustment flow path. In addition, the flow path 76A provided between the second temperature adjustment section 61A and the temperature adjustment section 15 is also referred to as a second temperature adjustment flow path. A heat transfer fluid of a second temperature flows in the second temperature adjustment flow path. In addition, the flow path 76B provided between the third temperature adjustment section 61B and the temperature adjustment section 15 is also referred to as a third temperature adjustment flow path. A heat transfer fluid of a third temperature flows in the third temperature adjustment flow path.

[0070] The third outflow port of the branch portion 74 is connected to the third inflow port of the confluence portion 78 via the bypass flow path 77. That is, the bypass flow path 77 branches from the first temperature regulating flow path at the branch portion 74 and merges with the second temperature regulating flow path and the third temperature regulating flow path at the confluence portion 78.

[0071] The bypass flow path 77 supplies the heat transfer fluid (heat transfer fluid adjusted to the first temperature) ejected from the cooler 50 to the flow path 16 of the temperature adjustment unit 15 via the confluence portion 78 and the outgoing flow path 79 without passing through the flow path 75A, the second temperature adjustment unit 61A, and the flow path 76A, and without passing through the flow path 75B, the third temperature adjustment unit 61B, and the flow path 76B. The heat transfer fluid at the first temperature flows in the bypass flow path 77.

[0072] That is, in the temperature adjustment module 60A, a temperature difference is formed between the heat transfer fluid adjusted to the second temperature flowing through the flow path 76A, the heat transfer fluid adjusted to the third temperature flowing through the flow path 76B, and the heat transfer fluid adjusted to the first temperature flowing through the bypass flow path 77 .

[0073] The confluence portion 78 has three inflow ports and one outflow port. The inflow port of the confluence portion 78 is connected to the flow path 76A, the flow path 76B, and the bypass flow path 77, respectively. The flow paths 76A, the flow paths 76B, and the bypass flow path 77 merge at the inflow port of the confluence portion 78, and the outflow port of the confluence portion 78 is connected to the outflow path 79. The confluence portion 78 is provided with a flow ratio adjustment portion 62. The flow ratio adjustment portion 62 has a flow control valve 621A provided in the flow path 76A, a flow control valve 621B provided in the flow path 76B, and a flow control valve 622 provided in the bypass flow path 77.

[0074] The opening degrees (opening areas) of the flow control valves 621A, 621B, and 622 are controlled by the control unit 2. Thus, the flow ratio (mixing ratio) of the heat transfer medium at the second temperature from the flow path 76A, the heat transfer medium at the first temperature from the flow path 76B, and the heat transfer fluid at the first temperature from the bypass flow path 77 can be adjusted. Thus, the temperature of the heat transfer fluid circulating in the flow path 16 of the temperature regulating unit 15 can be controlled.

[0075] In addition, the flow ratio adjustment unit 62 is described as having the flow control valves 621A, 621B, and 622, but the invention is not limited thereto. The flow ratio adjustment unit 62 may also be a structure having a valve (e.g., a flow control valve, an on-off valve, etc.) provided in at least one of the flow paths 76A, 76B and the bypass flow path 77. In addition, the flow ratio adjustment unit 62 may also be a structure having a valve (e.g., a mixing valve, etc.) provided in the confluence portion 78 of the flow paths 76A, 76B and the bypass flow path 77.

[0076] In addition, a temperature sensor 82A for detecting the temperature of the heat transfer fluid is provided in the flow path 76A. A temperature sensor 82B for detecting the temperature of the heat transfer fluid is provided in the flow path 76B. A temperature sensor 83 for detecting the temperature of the heat transfer fluid is provided in the bypass flow path 77. A temperature sensor 84 for detecting the temperature of the heat transfer fluid is provided on the downstream side of the confluence portion 78 (to the flow path 79).

[0077] According to the temperature control module 100 involved in the second embodiment, it is possible to suppress fluctuations (overshoot, undershoot) in the temperature of the heat transfer fluid supplied to the temperature control unit 15. For example, when the temperature of the heat transfer fluid flowing through the bypass flow path 77 becomes lower than a predetermined temperature (undershoot occurs), the temperature of the heat transfer fluid supplied to the temperature control unit 15 can be made close to the predetermined temperature by mixing the heat transfer fluid flowing through the bypass flow path 77 with the heat transfer fluid flowing through the flow path 76A. In addition, for example, when the temperature of the heat transfer fluid flowing through the bypass flow path 77 becomes higher than a predetermined temperature (overshoot occurs), the temperature of the heat transfer fluid supplied to the temperature control unit 15 can be made close to the predetermined temperature by mixing the heat transfer fluid flowing through the bypass flow path 77 with the heat transfer fluid flowing through the third temperature control flow path 73B. Therefore, the accuracy of the temperature control of the heat transfer fluid supplied to the temperature control unit 15 can be improved.

[0078] use Figure 7 The temperature control module 100 according to the third embodiment will be further described. Figure 7 This is an example of an overall configuration diagram of the temperature regulation module 100 according to the third embodiment.

[0079] The temperature control module 100 includes a flow path 16 of a temperature control unit 15, a cooler 50, and a temperature adjustment module 60B. The cooler 50 is different from the cooler 50 of the temperature control module 100 according to the first embodiment (see Figure 3 ) similarly has a first temperature adjustment unit 51, a tank 52 and a pump 53.

[0080] The temperature adjustment module 60B has a second temperature adjustment section 61. The other end of the flow path 73 is connected to one end (upstream side) of the second temperature adjustment section 61 via the flow path 75C. The other end (downstream side) of the second temperature adjustment section 61 is connected to the flow path 79 via the flow path 76C. In addition, the flow paths 71, 72, 73, and 75C provided between the first temperature adjustment section 51 and the second temperature adjustment section 61 are also referred to as first temperature adjustment flow paths. A heat transfer fluid at a first temperature flows in the first temperature adjustment flow path. In addition, the flow path 76C provided between the second temperature adjustment section 61 and the temperature adjustment section 15 is also referred to as a second temperature adjustment flow path. A heat transfer fluid at a second temperature flows in the second temperature adjustment flow path.

[0081] According to the temperature control module 100 of the third embodiment, even if the temperature of the heat transfer fluid discharged from the cooler 50 fluctuates, the temperature can be adjusted by the second temperature adjustment unit 61 and supplied to the temperature control unit 15. Therefore, the accuracy of temperature control of the heat transfer fluid supplied to the temperature control unit 15 can be improved.

[0082] The embodiments disclosed above include the following aspects, for example.

[0083] (Note 1)

[0084] A temperature control device controls the temperature of a temperature control section by circulating a fluid in the temperature control section, the temperature control device comprising:

[0085] a first temperature adjustment unit, which adjusts the fluid to a first temperature;

[0086] a second temperature adjustment unit for adjusting the fluid adjusted to the first temperature to a second temperature;

[0087] a first temperature adjustment flow path, which is disposed between the first temperature adjustment part and the second temperature adjustment part;

[0088] A second temperature adjustment flow path provided between the second temperature adjustment portion and the temperature adjustment portion; and

[0089] A return flow path is provided between the temperature adjustment part and the first temperature adjustment part.

[0090] (Note 2)

[0091] The temperature control device according to Supplementary Note 1 further comprises:

[0092] a bypass flow path provided between the first temperature adjustment portion and the temperature adjustment portion, the bypass flow path supplying the fluid adjusted to the first temperature to the temperature adjustment portion without passing through the second temperature adjustment portion;

[0093] a flow ratio adjusting unit that adjusts a flow ratio between the fluid supplied from the second temperature regulating flow path to the temperature regulating unit and the fluid supplied from the bypass flow path to the temperature regulating unit; and

[0094] A control unit controls the flow ratio adjustment unit.

[0095] (Note 3)

[0096] The temperature control device according to Supplementary Note 2 comprises:

[0097] a confluence portion at which the second temperature adjustment flow path and the bypass flow path merge; and

[0098] a temperature detection unit, which is arranged at the confluence portion and is used to detect the temperature of the fluid,

[0099] The control unit adjusts the flow rate ratio of the flow rate ratio adjustment unit based on the temperature of the fluid detected by the temperature detection unit.

[0100] (Note 4)

[0101] In the temperature control device described in Supplement 2 or Supplement 3,

[0102] The flow ratio adjustment unit includes a valve provided in at least one of the second temperature adjustment flow path and the bypass flow path.

[0103] The control unit adjusts the flow rate ratio of the fluid by controlling the valve.

[0104] (Note 5)

[0105] In the temperature control device described in any one of Supplement 1 to Supplement 4,

[0106] The first temperature adjustment unit is a cooling device for cooling the fluid.

[0107] The second temperature adjustment unit is a heating device that heats the fluid.

[0108] (Note 6)

[0109] In the temperature control device described in any one of Supplement 1 to Supplement 4,

[0110] The first temperature adjustment unit is a heating device for heating the fluid.

[0111] The second temperature adjustment unit is a cooling device that cools the fluid.

[0112] (Note 7)

[0113] In the temperature control device described in any one of Supplement 1 to Supplement 4,

[0114] The first temperature adjustment unit and the second temperature adjustment unit are cooling devices for cooling the fluid.

[0115] The second temperature is a temperature lower than the first temperature.

[0116] (Note 8)

[0117] In the temperature control device described in any one of Supplement 1 to Supplement 4,

[0118] The first temperature adjustment unit and the second temperature adjustment unit are heating devices for heating the fluid.

[0119] The second temperature is a temperature higher than the first temperature.

[0120] (Note 9)

[0121] In the temperature control device described in any one of Supplementary Notes 1 to 8,

[0122] A tank for storing the fluid is provided between the first temperature adjustment section and the second temperature adjustment section.

[0123] (Note 10)

[0124] In the temperature control device described in any one of Supplementary Notes 1 to 8,

[0125] The tank includes a tank for storing the fluid between the temperature adjustment unit and the first temperature adjustment unit.

[0126] (Note 11)

[0127] A substrate processing device,

[0128] A temperature control device according to any one of Supplementary Notes 1 to 10 is provided.

[0129] (Note 12)

[0130] In the substrate processing apparatus described in Supplementary Note 11,

[0131] The temperature adjustment section is a placement section on which a substrate is placed.

[0132] (Note 13)

[0133] A temperature control method is a temperature control method of a temperature control device.

[0134] The temperature control device comprises: a first temperature adjustment part, which adjusts a fluid to a first temperature; a second temperature adjustment part, which adjusts the fluid adjusted to the first temperature to a second temperature; a first temperature adjustment flow path, which is arranged between the first temperature adjustment part and the second temperature adjustment part; a second temperature adjustment flow path, which is arranged between the second temperature adjustment part and the temperature adjustment part; a bypass flow path, which is arranged between the first temperature adjustment part and the temperature adjustment part, and is used to supply the fluid adjusted to the first temperature to the temperature adjustment part without passing through the second temperature adjustment flow path; a return flow path, which is arranged between the temperature adjustment part and the first temperature adjustment part; and a flow ratio adjustment part, which adjusts the flow ratio of the fluid supplied from the second temperature adjustment flow path to the temperature adjustment part and the fluid supplied from the bypass flow path to the temperature adjustment part. The temperature control device controls the temperature of the temperature adjustment part by circulating the fluid in the temperature adjustment part.

[0135] In the temperature control method, the flow rate ratio is controlled to control the temperature of the fluid flowing in the temperature adjustment section.

[0136] In addition, the present invention is not limited to the configurations listed in the above embodiments, the combinations with other elements, etc. These aspects can be changed within the scope not departing from the gist of the present invention and can be appropriately determined according to the application mode.

[0137] In addition, this application claims priority based on Japanese Patent Application No. 2022-139488 filed on September 1, 2022, and all the contents of these Japanese Patent Applications are incorporated into this application by reference.

[0138] Description of Reference Numerals

[0139] 1: plasma processing device; 2: control unit; 10: plasma processing chamber; 10a: side wall; 11: substrate support unit; 51: first temperature adjustment unit; 52: tank; 53: pump; 60: temperature adjustment module; 61: second temperature adjustment unit; 62: flow ratio adjustment unit; 621, 622: flow control valves; 71, 72, 73, 75: flow path (first temperature adjustment flow path); 74: branching part; 76: flow path (second temperature adjustment flow path); 77: bypass flow path; 78: confluence part; 79: outgoing flow path; 80: return flow path; 81-85: temperature sensor (temperature detection unit); 100: temperature adjustment module (temperature control device).

Claims

1. A temperature control device for controlling the temperature of a temperature control section by circulating a fluid in the temperature control section, the temperature control device comprising: a first temperature adjustment unit, which adjusts the fluid to a first temperature; a second temperature adjustment unit for adjusting the fluid adjusted to the first temperature to a second temperature; a first temperature adjustment flow path, which is disposed between the first temperature adjustment part and the second temperature adjustment part; A second temperature adjustment flow path provided between the second temperature adjustment portion and the temperature adjustment portion; and A return flow path is provided between the temperature adjustment part and the first temperature adjustment part.

2. The temperature control device according to claim 1, wherein: The temperature control device also has: a bypass flow path provided between the first temperature adjustment portion and the temperature adjustment portion, the bypass flow path supplying the fluid adjusted to the first temperature to the temperature adjustment portion without passing through the second temperature adjustment portion; a flow ratio adjusting unit that adjusts a flow ratio between the fluid supplied from the second temperature regulating flow path to the temperature regulating unit and the fluid supplied from the bypass flow path to the temperature regulating unit; and A control unit controls the flow ratio adjustment unit.

3. The temperature control device according to claim 2, wherein: The temperature control device comprises: a confluence portion at which the second temperature adjustment flow path and the bypass flow path merge; and a temperature detection unit, which is arranged at the confluence portion and is used to detect the temperature of the fluid, The control unit adjusts the flow rate ratio of the flow rate ratio adjustment unit based on the temperature of the fluid detected by the temperature detection unit.

4. The temperature control device according to claim 2 or 3, wherein: The flow ratio adjustment unit includes a valve provided in at least one of the second temperature adjustment flow path and the bypass flow path. The control unit adjusts the flow rate ratio of the fluid by controlling the valve.

5. The temperature control device according to any one of claims 1 to 3, wherein: The first temperature adjustment unit is a cooling device for cooling the fluid. The second temperature adjustment unit is a heating device that heats the fluid.

6. The temperature control device according to any one of claims 1 to 3, wherein: The first temperature adjustment unit is a heating device for heating the fluid. The second temperature adjustment unit is a cooling device that cools the fluid.

7. The temperature control device according to any one of claims 1 to 3, wherein: The first temperature adjustment unit and the second temperature adjustment unit are cooling devices for cooling the fluid. The second temperature is a temperature lower than the first temperature.

8. The temperature control device according to any one of claims 1 to 3, wherein: The first temperature adjustment unit and the second temperature adjustment unit are heating devices for heating the fluid. The second temperature is a temperature higher than the first temperature.

9. The temperature control device according to any one of claims 1 to 3, wherein: A tank for storing the fluid is provided between the first temperature adjustment section and the second temperature adjustment section.

10. The temperature control device according to any one of claims 1 to 3, wherein: A tank for storing the fluid is provided between the temperature adjustment unit and the first temperature adjustment unit. 11 . A substrate processing apparatus comprising the temperature control device according to claim 1 .

12. The substrate processing apparatus according to claim 11, wherein: The temperature adjustment section is a placement section on which a substrate is placed.

13. A temperature control method, which is a temperature control method of a temperature control device, The temperature control device comprises: a first temperature adjustment part, which adjusts a fluid to a first temperature; a second temperature adjustment part, which adjusts the fluid adjusted to the first temperature to a second temperature; a first temperature adjustment flow path, which is arranged between the first temperature adjustment part and the second temperature adjustment part; a second temperature adjustment flow path, which is arranged between the second temperature adjustment part and the temperature adjustment part; a bypass flow path, which is arranged between the first temperature adjustment part and the temperature adjustment part, and is used to supply the fluid adjusted to the first temperature to the temperature adjustment part without passing through the second temperature adjustment flow path; a return flow path, which is arranged between the temperature adjustment part and the first temperature adjustment part; and a flow ratio adjustment part, which adjusts the flow ratio of the fluid supplied from the second temperature adjustment flow path to the temperature adjustment part and the fluid supplied from the bypass flow path to the temperature adjustment part. The temperature control device controls the temperature of the temperature adjustment part by circulating the fluid in the temperature adjustment part. In the temperature control method, the flow rate ratio is controlled to control the temperature of the fluid flowing in the temperature adjustment section.

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