Gas cooling type high-power connecting rod

Abstract

Embodiments of a radio frequency (RF) power connection rod are provided herein. In some embodiments, an RF power connection rod includes a first connection rod having a first connection end, a first socket end opposite the first connection end, and a first hollow portion extending from the first connection end to the first socket end; the second connecting rod is provided with a second connecting end, a second socket end opposite to the second connecting end and a second hollow part extending from the second connecting end to the second socket end, and the second connecting end is adjustably coupled to the first connecting end in the axial direction of the second connecting rod; and wherein a gas flow path extends from one or more gas inlets of the first connecting rod, through the first hollow portion to the second hollow portion, to one or more gas outlets disposed through the second connecting rod; a first plug coupled to the first socket end; and a second plug coupled to the second socket end.

Description

Technical Field

[0001] Embodiments of the present disclosure relate generally to substrate processing equipment, and more particularly, to power connection bars for substrate processing equipment. Background Art

[0002] Power connectors are used in substrate processing equipment, for example, to couple power from a radio frequency (RF) power supply to a processing chamber. The substrate processing equipment may include an RF match that converts the complex circuit impedance of the RF power supply to a desired impedance and supplies RF energy from the RF power supply to the processing chamber via a power connector. High power can heat the power connector and cause arcs between parts due to high voltage differences, which can lead to safety hazards. Conventional power connectors are composed of copper strips to provide high power. However, copper strips have sharp edges, which can cause arcs.

[0003] Accordingly, the inventors provide embodiments of improved power connectors for use in substrate processing equipment. Summary of the invention

[0004] Embodiments of power connectors including radio frequency (RF) power connection rods are provided herein. In some embodiments, the RF power connection rod includes: a first connection rod having a first connection end, a first socket end opposite the first connection end, and a first hollow portion extending from the first connection end to the first socket end; a second connection rod having a second connection end, a second socket end opposite the second connection end, and a second hollow portion extending from the second connection end to the second socket end, wherein the second connection end is adjustably coupled to the first connection end along an axial direction of the second connection rod, and wherein a gas flow path extends from one or more gas inlets of the first connection rod, through the first hollow portion to the second hollow portion, to one or more gas outlets disposed through the second connection rod; a first plug coupled to the first socket end; and a second plug coupled to the second socket end.

[0005] In some embodiments, an RF (radio frequency) power connection rod for use with a processing chamber includes: a first connection rod having a first connection end, a first socket end opposite the first connection end, and a first hollow portion extending from the first connection end to the first socket end; a second connection rod having a second connection end, a second socket end opposite the second connection end, and a second hollow portion extending from the second connection end to the second socket end, wherein the second connection end is adjustably coupled to the first connection end along an axial direction of the second connection rod; a first plug rotatably coupled to the first socket end via an opening in the first socket end; and a second plug rotatably coupled to the second socket end via a second opening in the second socket end.

[0006] In some embodiments, a processing chamber includes: a chamber body having an interior volume therein; a substrate support disposed in the interior volume; an RF power source coupled to the chamber body; and an RF power connecting rod coupled to the RF power source to provide RF power to the substrate support, the RF power connecting rod including: a first connecting rod having a first connection end, a first socket end opposite the first connecting end, and a first hollow portion extending from the first connecting end to the first socket end; a second connecting rod having a second connection end, a second socket end opposite the second connecting end, and a second hollow portion extending from the second connecting end to the second socket end, wherein the second connecting end is adjustably coupled to the first connecting end along an axial direction of the second connecting rod, and wherein a gas flow path extends from one or more gas inlets of the first connecting rod, through the first hollow portion to the second hollow portion, to one or more gas outlets disposed through the second connecting rod; a first plug rotatably coupled to the first socket end; and a second plug rotatably coupled to the second socket end.

[0007] Other and further embodiments of the disclosure are described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Embodiments of the present disclosure, briefly summarized above and discussed in more detail below, may be understood by reference to the illustrative embodiments of the disclosure depicted in the accompanying drawings. However, the drawings illustrate only typical embodiments of the disclosure and are therefore not to be considered limiting of scope, as the disclosure may admit to other equally effective embodiments.

[0009] Figure 1 Depicted is a schematic diagram of a processing chamber in accordance with at least some embodiments of the present disclosure.

[0010] Figure 2 Depicted is an isometric view of an RF power connection rod in accordance with at least some embodiments of the present disclosure.

[0011] Figure 3 Depicted are schematic cross-sectional isometric views of RF power connection rods in accordance with at least some embodiments of the present disclosure.

[0012] For ease of understanding, the same reference numerals are used, where possible, to designate the same elements common to the drawings. The drawings are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated into other embodiments without further elaboration. DETAILED DESCRIPTION

[0013] Embodiments of power connectors including radio frequency (RF) power connecting rods are provided herein. The RF power connecting rod generally includes a connecting rod designed to connect an output sensor of an RF power supply to a processing chamber using a coaxially connected hollow rod, the hollow rod allowing the transmission of high power and current without changing the output and arcing. The RF power connecting rod advantageously provides better power handling via airflow, for cooling the connecting rod, by removing sharp edges to eliminate the possibility of arcing, and provides a compact design that efficiently utilizes space. The coaxial connection arrangement of the hollow rod advantageously allows for accommodating axial variations due to assembly tolerances.

[0014] Figure 1 A schematic diagram of a processing chamber 100 according to at least some embodiments of the present disclosure is depicted. In some embodiments, the processing chamber 100 is a plasma processing chamber, such as an etching processing chamber. However, other types of processing chambers configured for different processes may also be used or modified to be used with the embodiments of the RF power connection rod described herein.

[0015] In some embodiments, the processing chamber 100 is a vacuum chamber adapted to maintain a subatmospheric pressure within a chamber interior volume 120 during substrate processing. The processing chamber 100 includes a chamber body 106 covered by a lid 104 that surrounds a processing volume 119 located in an upper portion of the chamber interior volume 120. The processing chamber 100 may also include one or more shields 105 that circumscribe various chamber components to prevent undesirable reactions between these components and ionized processing materials. The chamber body 106 and lid 104 may be made of metal, such as aluminum. The chamber body 106 may be grounded to ground 115 via coupling.

[0016] The substrate support 124 is disposed within the chamber interior volume 120 to support and hold a substrate 122, such as, for example, a semiconductor wafer, or other substrate that can be held via an electrostatic chuck or vacuum clamping. For example, the substrate support 124 can generally include a pedestal 150 and a hollow support shaft 112 for supporting the pedestal 150. The pedestal 150 can include an electrostatic chuck 152 and a cooling plate 136, wherein the electrostatic chuck 152 has one or more electrodes 154 disposed therein. The hollow support shaft 112 provides a conduit to provide, for example, backside gas, process gas, fluid, coolant, power, etc. to the pedestal 150. The substrate support 124 can include a ceramic ring 187 disposed around the electrostatic chuck 152.

[0017] In some embodiments, the hollow support shaft 112 is coupled to a lifting mechanism 113, such as an actuator or a motor, which provides a lifting mechanism for the electrostatic chuck 152 to be in an upper processing position (eg, Figure 1The bellows assembly 110 is disposed about the hollow support shaft 112 and is coupled between the pedestal 150 and the bottom surface 126 of the processing chamber 100 to provide a flexible seal that allows the pedestal 150 to move vertically while preventing the loss of vacuum within the processing chamber 100. The bellows assembly 110 also includes a lower bellows flange 164 that contacts an O-ring 165 or other suitable sealing element that contacts the bottom surface 126 to help prevent the loss of chamber vacuum.

[0018] The hollow support shaft 112 provides a conduit for coupling a backside gas supply 141, a clamping power supply 140, and an RF source (e.g., an RF plasma power supply 170 and a bias power supply 117) to the pedestal 150. In some embodiments, the bias power supply 117 includes one or more RF bias power supplies. In some embodiments, the RF energy provided by the RF plasma power supply 170 may have a frequency of about 13 MHz or higher. The backside gas supply 141 is disposed outside the chamber body 106 and supplies a heat transfer gas to the electrostatic chuck 152. In some embodiments, the RF plasma power supply 170 and the bias power supply 117 are coupled to the pedestal 150 via respective RF matching networks (only the RF matching network 116 is shown). In some embodiments, the substrate support 124 may alternatively include AC, DC, or RF bias power.

[0019] The RF power connecting rod 184 may be used to couple RF power between any components of the process chamber 100. For example, the RF matching network 116 is coupled to the RF power connecting rod 184 to provide high power, such as 1 kW or more, to the process chamber 100. In some embodiments, the RF matching network 116 may be coupled to the output sensor 182 to supply RF power to the process chamber 100 via the RF power connecting rod 184. In some embodiments, the bias power supply 117, the RF matching network 116, and the RF power connecting rod 184 may be disposed in the housing 158.

[0020] The substrate elevator 130 may include lift pins 109 mounted on a platform 108 connected to a shaft 111 coupled to a second lift mechanism 132 for raising and lowering the substrate elevator 130 so that the substrate 122 can be placed on or removed from the electrostatic chuck 152. The electrostatic chuck 152 may include through holes for receiving the lift pins 109. In some embodiments, the ceramic ring 187 may include through holes for receiving the lift pins 109. A bellows assembly 131 is coupled between the substrate elevator 130 and the bottom surface 126 to provide a flexible seal that maintains the chamber vacuum during vertical movement of the substrate elevator 130.

[0021] In some embodiments, the electrostatic chuck 152 includes a gas distribution channel 138 extending from a lower surface of the electrostatic chuck 152 (e.g., the bottom surface of the cooling plate 136) to various openings in the upper surface of the electrostatic chuck 152. The gas distribution channel 138 is configured to provide a backside gas, such as nitrogen (N) or helium (He), to the top surface of the electrostatic chuck 152 to serve as a heat transfer medium. The gas distribution channel 138 is in fluid communication with the backside gas supply 141 via a gas conduit 142 to control the temperature and / or temperature distribution of the electrostatic chuck 152 during use.

[0022] The processing chamber 100 is coupled to and in fluid communication with a vacuum system 114, which includes a throttle valve (not shown) and a vacuum pump (not shown) for exhausting the processing chamber 100. The pressure within the processing chamber 100 can be adjusted by adjusting the throttle valve and / or the vacuum pump. The processing chamber 100 is also coupled to and in fluid communication with a process gas supply 118, which can supply one or more process gases to the processing chamber 100 for processing a substrate disposed therein.

[0023] In operation, for example, a plasma 102 may be generated in the chamber interior volume 120 to perform one or more processes. The plasma 102 may be generated by coupling power from a plasma power source (e.g., an RF plasma power source 170) to a process gas via one or more electrodes near or within the chamber interior volume 120 to ignite the process gas and generate the plasma 102. A bias power source is provided to the pedestal 150 from a bias power source (e.g., bias power source 117) to attract ions from the plasma toward the substrate 122.

[0024] Figure 2 An isometric view of an RF power connection rod 184 is depicted, in accordance with at least some embodiments of the present disclosure. Figure 3 A schematic cross-sectional isometric view of an RF power connection rod 184 according to at least some embodiments of the present disclosure is depicted. The RF power connection rod 184 generally includes a first connection rod 202 coupled to a second connection rod 204. The first connection rod 202 has a first connection end 212 and a first socket end 222 opposite the first connection end 212. In some embodiments, the first connection rod 202 includes a first hollow portion 302 extending from the first connection end 212 to the first socket end 222. In some embodiments, the first hollow portion 302 includes a first portion 324 and a second portion 328. In some embodiments, the first portion 324 is disposed between the second portion 328 and the first socket end 222. In some embodiments, the outer diameter of the second portion 328 is greater than the outer diameter of the first portion 324. The first connection rod 202 is made of a conductive material such as copper or brass.

[0025] The second connecting rod 204 has a second connecting end 214 and a second socket end 224 opposite the second connecting end 214. In some embodiments, the second connecting rod 204 includes a second hollow portion 306 extending from the second connecting end 214 to the second socket end 224. The second connecting end 214 is adjustably coupled to the first connecting end 212 along the axial direction 250 of the second connecting rod 204, allowing linear adjustment. The linear adjustment can be used to compensate for any tolerance issues during assembly. In some embodiments, the second connecting end 214 is disposed in the first hollow portion 302 to couple the first connecting rod 202 to the second connecting rod 204. In some embodiments, the outer diameter of the first portion 324 is substantially the same as the outer diameter of the second connecting rod 204. The second connecting rod 204 is made of a conductive material such as copper or brass.

[0026] In some embodiments, the conductive member 332 is disposed between the first connecting rod 202 and the second connecting rod 204 to facilitate coupling the first connecting rod 202 to the second connecting rod 204. In some embodiments, the conductive member 332 is annular. The conductive member 332 can advantageously maintain a good electrical connection between the first connecting rod 202 and the second connecting rod 204. In some embodiments, the conductive member 332 is a biasable conductive member that provides a constant spring pressure between the first connecting rod 202 and the second connecting rod 204 to maintain a good electrical connection. In some embodiments, the biasable conductive member includes a plurality of contact surfaces, and a plurality of shielding bodies are disposed between the plurality of contact surfaces.

[0027] The housing 158 may include many process chamber components in close proximity. Sharp corners or edges of the power connector may cause undesirable arcing. Therefore, the first connecting rod 202 and the second connecting rod 204 generally include rounded features and minimal sharp edges to advantageously reduce or prevent arcing between the RF power connecting rod 184 and other process chamber components. The rounded features also advantageously allow the process chamber components to be arranged closer to the RF power connecting rod 184 due to the reduced arcing tendency, thereby reducing the footprint of the housing 158.

[0028] The RF power connecting rod 184 may be heated due to the high power transmitted therethrough. The RF power connecting rod 184 may advantageously include a gas flow path 308 for cooling during use and facilitates the delivery of high RF power to the processing chamber. In some embodiments, the first connecting rod 202 and the second connecting rod 204 define a gas flow path 308 passing therethrough. In some embodiments, the gas flow path 308 extends from one or more gas inlets 314 of the first connecting rod 202, through the first hollow portion 302 to the second hollow portion 306, to one or more gas outlets 318 disposed through the second connecting rod 204. In some embodiments, the one or more gas inlets 314 consist of two inlets. In some embodiments, the one or more gas outlets 318 consist of two outlets. A gas supply 310 may be coupled to the one or more gas inlets 314 to provide cooling gas. The cooling gas may be air, an inert gas, or the like.

[0029] The first plug 220 is coupled to the first socket end 222. In some embodiments, the first plug 220 includes a first plate 242 and a first tube 244 extending from the first plate 242. In some embodiments, the first socket end 222 includes an opening 248 extending therethrough for the first plug 220. For example, in some embodiments, the first plug 220 is rotatably coupled to the first socket end 222 via the first tube 244 extending through the opening 248 and rotatable within the opening 248. In some embodiments, one or more first retaining rings 315 are disposed between the first plug 220 and the first socket end 222 to hold the assembly of the first plug 220 and the first socket end 222 together.

[0030] The second plug 226 is coupled to the second socket end 224. In some embodiments, the second plug 226 is rotatably coupled to the second socket end 224 via a second opening 342 in the second socket end 224. In some embodiments, the second plug 226 includes a second plate 262 and a second tube 348 extending from the second plate 262. In some embodiments, the second tube 348 extends into the second opening 342. In some embodiments, one or more second retaining rings 325 are disposed between the second tube 348 and the second socket end 224 to hold the assembly of the second plug 226 and the second socket end 224 together. In some embodiments, the one or more first retaining rings 315 and the one or more second retaining rings 325 are made of stainless steel.

[0031] In some embodiments, the second plate 262 includes one or more holes for fastening the RF power connection rod 184 to the output sensor 182. In some embodiments, the second plate 262 includes a post 232 extending from a side of the second plate 262 opposite the second tube 348. In some embodiments, a vent screw 230 extends through the post 232 to facilitate airflow through the second socket end 224, thereby cooling the second socket end 224 and the output sensor 182 connected to the second socket end 224.

[0032] In some embodiments, the housing 252 is coupled to the first socket end 222. The housing 252 is made of an insulator and is configured to facilitate coupling the RF power connection rod 184 to the processing chamber 100, such as to the housing 158, the chamber body 106, or (multiple) other chamber components. In some embodiments, the housing 252 is made of a plastic material. In some embodiments, the housing 252 includes a bottom plate 206 and a wall 264 extending from the bottom plate 206. The first plate 242 of the first plug 220 may include an opening 236 for fastening the first plug 220 to the housing 252. The housing 252 may include an opening 272 for fastening the housing 252 to a chamber component. In some embodiments, the opening 272 is disposed in the bottom plate 206.

[0033] In some embodiments, the first plug 220 includes a third tube 256 extending from the first plate 242 on a side of the first plate 242 opposite the first tube 244. In some embodiments, the third tube 256 extends through an opening 254 through a wall 264 of the housing 252. In some embodiments, the housing 252 includes an access tube 266 extending from a rear surface 268 of the wall 264 to provide access to the first plug 220 for electrical coupling. In some embodiments, the bottom plate 206 of the housing 252 includes a groove 270 corresponding to the shape of the first socket end 222 for facilitating rotational movement of the first socket end 222 relative to the housing 252.

[0034] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof.

Claims

1. A radio frequency (RF) power connecting rod, comprising: a first connecting rod, the first connecting rod having a first connecting end, a first socket end opposite to the first connecting end, and a first hollow portion extending from the first connecting end to the first socket end; a second connecting rod having a second connecting end, a second socket end opposite the second connecting end, and a second hollow portion extending from the second connecting end to the second socket end, wherein the second connecting end is adjustably coupled to the first connecting end along an axial direction of the second connecting rod, and wherein a gas flow path extends from one or more gas inlets of the first connecting rod, through the first hollow portion to the second hollow portion, to one or more gas outlets disposed through the second connecting rod; a first plug coupled to the first socket end; as well as A second plug is coupled to the second socket end. 2 . The RF power connecting rod of claim 1 , wherein the second connecting end is disposed in the first hollow portion to couple the first connecting rod to the second connecting rod.

3. The RF power connecting rod of claim 2, further comprising a conductive member disposed between the first connecting rod and the second connecting rod to facilitate coupling the first connecting rod to the second connecting rod.

4. The RF power connection rod of claim 2, wherein the first hollow portion comprises a first portion and a second portion, wherein the first portion is disposed between the second portion and the first socket end, and wherein an outer diameter of the second portion is greater than an outer diameter of the first portion.

5. The RF power connecting rod of claim 1, further comprising a housing coupled to the first socket end, the housing being made of an insulator and configured to facilitate coupling the RF power connecting rod to a processing chamber.

6. The RF power connecting rod of claim 5, wherein the housing is made of a plastic material.

7. The RF power connecting rod of any one of claims 1 to 6, wherein the first socket end and the second socket end each include an opening extending therethrough.

8. The RF power connecting rod of any one of claims 1 to 6, wherein the first connecting rod and the second connecting rod are made of copper or brass.

9. The RF power connection rod of any one of claims 1 to 6, further comprising one or more first fixing rings disposed between the first plug and the first socket end, and one or more second fixing rings disposed between the second plug and the second socket end.

10. The RF power connecting rod of any one of claims 1 to 6, wherein the second plug comprises a second plate and a second tube extending from the second plate.

11. The RF power connecting rod of any one of claims 1 to 6, wherein the first plug is coupled to the first socket end via an opening in the first socket end, and wherein the second plug is coupled to the second socket end via a second opening in the second socket end.

12. The RF power connecting rod of any one of claims 1 to 6, wherein a gas flow path extends from one or more gas inlets of the first connecting rod, through the first hollow portion to the second hollow portion, to one or more gas outlets disposed through the second connecting rod.

13. The RF power connecting rod of any one of claims 1 to 6, wherein the first end of the first plug extends through the first socket end and the second end of the first plug is coupled to a housing configured to facilitate coupling the RF power connecting rod to a processing chamber.

14. The RF power connecting rod according to any one of claims 1 to 6, further comprising: one or more first fixing rings, the one or more first fixing rings being disposed between the first plug and the first socket end; one or more second fixing rings, the one or more second fixing rings being disposed between the second plug and the second socket end; as well as A biasable conductive member is disposed between the first connecting bar and the second connecting bar to facilitate coupling the first connecting bar to the second connecting bar.

15. A processing chamber comprising: a chamber body having an interior volume therein; a substrate support disposed within the interior volume; as well as The RF power connection bar of any one of claims 1 to 6, the RF power connection bar being coupled to the substrate support to provide RF power from an RF power source to the substrate support.

16. The processing chamber of claim 15, further comprising the RF power supply coupled to the chamber body and the RF power connection rod.

17. The processing chamber of claim 15, wherein the RF power connection rod is coupled to the RF power source via an RF match.

18. The processing chamber of claim 15, wherein the first socket end and the second socket end each include an opening extending therethrough.

19. The processing chamber of claim 15, wherein the RF power connection rod is disposed in a housing.

20. The processing chamber of claim 16, further comprising an output sensor coupled to the second connecting bar.

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