Method for controlling vibration device and electronic device supporting the same

Abstract

According to an embodiment, an electronic device may be provided, the electronic device including: a vibration device; at least one processor electrically connected to the vibration device; and a memory to store instructions that, when executed by the at least one processor, cause the electronic device to: increase or decrease a vibration frequency of the vibration device during a predetermined period of time; obtaining a resonant frequency of the vibration device based on a signal output from the vibration device; the vibration frequency is determined as the driving frequency of the vibration device, and the vibration frequency enables the output of the vibration device at the temperature higher than the room temperature to be smaller than the output of the vibration device at the room temperature; and controlling the vibration device to be driven at the determined driving frequency. Various other embodiments are possible.

Description

Technical Field

[0001] The present disclosure relates to a method for controlling a vibration device and an electronic device for supporting the method. Background Art

[0002] According to the recent rapid development of electronic devices, electronic devices capable of performing wireless voice calls and providing various contents have become indispensable. The electronic devices provide various contents, such as remote controllers using near field communication and image capture using digital cameras installed therein, to meet the needs of users.

[0003] Specifically, in addition to content for stimulating vision and hearing, electronic devices have become capable of delivering more information by providing content for stimulating touch (e.g., vibration). The electronic device may include a vibration device, and the vibration device may include a damping foam for preventing excessive vibration inside the vibration device. The vibration device may further include an elastic member for supporting the vibration device by providing a restoring force when the vibration device vibrates.

[0004] For example, the vibration device may include a damping foam made of a polyurethane foam material. In the case where the vibration device vibrates or the external temperature of the electronic device increases, the temperature of the damping foam may also increase. In the case where the temperature of the damping foam made of the polyurethane foam material increases, the viscosity and stiffness of the damping foam may decrease. In the case where the stiffness of the damping foam decreases, the stress applied to the elastic member for supporting the inside of the vibration device may increase, and thus excessive vibration may occur in the vibration device. The vibration device including the damping foam made of the polyurethane foam material may be damaged due to excessive vibration when the temperature increases. Summary of the invention

[0005]

Technical solution

[0006] An embodiment of the present disclosure is to prevent damage to a vibration device at high temperature by measuring the resonance frequency of the vibration device at room temperature and determining the driving frequency of the vibration device based on the resonance frequency. However, the present disclosure is not limited to the above description.

[0007] According to an embodiment of the present disclosure, an electronic device may include a vibration device. The electronic device may include: at least one processor electrically connected to the vibration device. The electronic device may include: a memory storing instructions. When the instructions are executed by the at least one processor, the electronic device may increase or decrease the vibration frequency of the vibration device during a preconfigured time. When the instructions are executed by the at least one processor, the electronic device may obtain the resonant frequency of the vibration device based on a signal output from the vibration device when the vibration device vibrates at an increased or decreased vibration frequency. When the instructions are executed by the at least one processor, the electronic device may determine the vibration frequency as a driving frequency of the vibration device based on the resonant frequency, at which the output of the vibration device at a temperature higher than room temperature is less than the output of the vibration device at the room temperature. When the instructions are executed by the at least one processor, the electronic device may control the vibration device so that the vibration device operates at the determined driving frequency.

[0008] According to an embodiment of the present disclosure, an operation method of an electronic device may include an operation of increasing or decreasing a vibration frequency of a vibration device during a preconfigured time. The operation method of the electronic device may include an operation of acquiring a resonant frequency of the vibration device based on a signal output from the vibration device when the vibration device vibrates at an increased or decreased vibration frequency. The operation method of the electronic device may include an operation of determining a vibration frequency as a driving frequency of the vibration device based on the resonant frequency, at which the output of the vibration device at a temperature higher than room temperature is less than the output of the vibration device at the room temperature. The operation method of the electronic device may include an operation of controlling the vibration device so that the vibration device operates at the determined driving frequency.

[0009] Embodiments of the present disclosure may provide a non-transitory computer-readable recording medium storing instructions, wherein when the instructions are executed by at least one circuit of an electronic device, the instructions may be used to cause the at least one circuit to perform at least one operation. The at least one operation may include an operation of increasing or decreasing the vibration frequency of a vibration device during a preconfigured time. The at least one operation may include an operation of acquiring the resonant frequency of the vibration device based on a signal output from the vibration device when the vibration device vibrates at an increased or decreased vibration frequency. The at least one operation may include an operation of determining the vibration frequency as a driving frequency of the vibration device based on the resonant frequency, at which the output of the vibration device at a temperature higher than room temperature is less than the output of the vibration device at the room temperature. The at least one operation may include an operation of controlling the vibration device so that the vibration device operates at the determined driving frequency.

[0010] The technical solutions according to the embodiments of the present disclosure are not limited to the above-mentioned technical solutions, and those skilled in the art to which the present disclosure belongs can clearly understand other technical solutions not described from the following description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0012] Figure 2 is a view showing an example of a configuration of an electronic device according to an embodiment of the present disclosure.

[0013] Figure 3 is a view showing an example of a cross-section of a motor according to an embodiment of the present disclosure.

[0014] Figure 4 is a diagram showing a processor and a vibration device IC connected to different communication interfaces (eg, an I2C bus and an I2S bus) according to an embodiment of the present disclosure.

[0015] Figure 5 is a view showing an example of a software configuration of an electronic device according to an embodiment of the present disclosure.

[0016] Figure 6 is a graph indicating the vibration amount according to the vibration frequency of the vibration device according to the embodiment of the present disclosure at room temperature and at a temperature higher than room temperature.

[0017] Figure 7 is a view illustrating an example of a waveform of a signal output from a vibration device in response to a vibration frequency according to an embodiment of the present disclosure.

[0018] Figure 8 is a flow chart illustrating a method for controlling a vibration device according to an embodiment of the present disclosure.

[0019] Fig. 9 is a flowchart illustrating an example of an operation of acquiring a resonant frequency of a vibration device through an electronic device according to an embodiment of the present disclosure.

[0020] Fig.10 is a flowchart illustrating an example of an operation of determining, by an electronic device, a driving frequency of a vibration device according to an embodiment of the present disclosure.

[0021] Fig.11a is a view illustrating an example in which a vibration force is changed according to an operation of an electronic device according to an embodiment of the present disclosure.

[0022] Fig.11bis a view showing an example in which a driving voltage is changed according to an operation of an electronic device according to an embodiment of the present disclosure.

[0023] Fig.12 is a graph showing an example in which vibration force changes according to vibration frequency for each temperature according to an embodiment of the present disclosure.

[0024] Fig.13 is a flowchart illustrating an example of an operation of controlling a driving frequency of a vibration device based on acquisition of a driving temperature of the vibration device according to an embodiment of the present disclosure.

[0025] Fig.14 is a flowchart illustrating an example of an operation of controlling a driving voltage of a vibration device based on acquisition of a driving temperature of the vibration device according to an embodiment of the present disclosure.

[0026] Fig.15 is a flowchart illustrating an example of an operation of controlling a driving voltage of a vibration device so that the vibration device outputs a target vibration amount according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0027] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0028] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In an embodiment, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In embodiments, some of the above-described components (eg, the sensor module 176, the camera module 180, or the antenna module 197) may be implemented as a single component (eg, the display module 160).

[0029] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0030] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control, for example, at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0031] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0032] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0033] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0034] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0035] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0036] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an external electronic device (e.g., electronic device 102 (e.g., speaker or earphone) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0037] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0038] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0039] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0041] The camera module 180 may capture still images or moving images. According to embodiments, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module 188 may manage power supply to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as, for example, at least a portion of a power management integrated circuit (PMIC).

[0043] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM The wireless communication module 192 may communicate with the external electronic device 104 through a wireless communication network 194 (e.g., a wireless fidelity (Wi-Fi) direct connection, or an infrared data association (IrDA)) or a second network 199 (e.g., a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 may use user information (e.g., an international mobile subscriber identity (IMSI)) stored in the user identification module 196 to identify or authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199).

[0045] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0046] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed on or in a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0047] According to an embodiment, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0048] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0049] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the external electronic device 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In an embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0050] Figure 2 is a view showing an example of a configuration of the electronic device 200 according to an embodiment of the present disclosure.

[0051] Hereinafter, an electronic device 200 (eg, Figure 1 An example of a configuration of an electronic device 101).

[0052] Reference Figure 2 According to an embodiment, the electronic device 200 may include a vibration device 210 (eg, Figure 1 , a haptic module 179 in the vibrator IC 230, a processor 250 (eg, Figure 1 processor 120 in the embodiment of the present invention), temperature sensor 220 (e.g., Figure 1 sensor module 176 in), magnetic field sensor 240 (e.g., Figure 1 The sensor module 176 in the embodiment of the present invention) and the memory 260 including a plurality of modules 270 (eg, a resonance frequency acquisition module 272, a vibration data acquisition module 271, and a vibration device driver 273). Figure 2 , the electronic device 200 may be implemented to include more components or fewer components. For example, the electronic device 200 may be implemented to include the above reference Figure 1 Components of the electronic device 101 are described. In an embodiment, without using the temperature sensor 220 or the magnetic field sensor 240, the electronic device 200 may measure the resonant frequency of the vibration device 210 and determine the driving frequency of the vibration device 210 based on the measured resonant frequency.

[0053] In an embodiment, the "resonance frequency" may indicate a frequency that maximizes the intensity of the vibration amount output from the vibration device 210. In an embodiment, the "vibration frequency" may indicate a frequency input to the vibration device 210 to vibrate the vibration device 210. In an embodiment, the "driving frequency" may indicate a frequency that actually drives the vibration device 210. In an embodiment, the "room temperature" may be a temperature between about 10 degrees Celsius and 30 degrees Celsius, preferably a temperature between about 15 degrees Celsius and 25 degrees Celsius, and more preferably a temperature of about 20 degrees Celsius. In an embodiment, the electronic device 200 may determine (or set) as a driving frequency a vibration frequency at which the output of the vibration device 210 at a temperature higher than room temperature is less than the output of the vibration device at room temperature. In an embodiment of the present disclosure, it will be easily understood by those skilled in the art that in the case where the electronic device 200 changes the frequency from the determined (or set) driving frequency, "determining" may include "controlling, adjusting, changing and / or modifying". In an embodiment, the electronic device 200 may determine the magnitude of the output of the vibration device 210 by acquiring the vibration amount output from the vibration device 210. In the embodiments of the present disclosure, those skilled in the art will readily understand that "obtaining" may include "detecting, identifying, determining, sensing and / or confirming". In an embodiment, the electronic device 200 may determine the resonant frequency of the vibration device 210 measured at room temperature as the driving frequency of the vibration device 210. In an embodiment, the output of the vibration device 210 may depend on temperature. For example, the vibration device 210 may include a damping foam, preferably made of a polyurethane foam material. In the event that the temperature of the damping foam increases, the viscosity and stiffness of the damping foam may decrease. In the event that the stiffness of the damping foam decreases, excessive vibration may occur in the vibration device. Such excessive vibration may damage the vibration device 210, and therefore such excessive vibration should be prevented.

[0054] Hereinafter, an example of the configuration of the electronic device 200 according to the embodiment will be described.

[0055] In an embodiment, the vibration device 210 may vibrate by operating based on data (e.g., pulse width modulation (PWM) data) received from the vibration device IC 230. The vibration of the vibration device 210 may vibrate the electronic device 200 including the vibration device 210. The user may receive a vibration sensation through the vibration of the electronic device 200. Figure 3 The configuration of the vibration device 210 is described.

[0056] In an embodiment, the temperature sensor 220 may be electrically connected to the vibration device 210 and acquire a driving temperature of the vibration device 210. The temperature sensor 220 may transmit the acquired driving temperature to the module 270 (eg, the resonance frequency acquisition module 272).

[0057] In an embodiment, the vibration device IC 230 may control the vibration device 210 by using the processing circuit 310 so that the vibration device 210 generates vibrations. In an embodiment, the vibration device IC 230 may acquire (or generate) data (e.g., PWM data) for controlling the vibration device 210 based on processing at least one of a plurality of pieces of data received from the processor 250 through a plurality of communication interfaces (e.g., I2C bus and I2S bus) based on a program (e.g., firmware) stored in the memory 260 by using the processing circuit. In an embodiment, based on the driving frequency of the vibration device 210 received from the processor 250, the vibration device IC 230 may acquire (or generate) data (e.g., PWM data) corresponding to the driving frequency.

[0058] In an embodiment, the magnetic field sensor 240 may be electrically connected to the vibration device 210 and acquire the magnetic field strength output from the vibration device 210. The magnetic field sensor 240 may convert the acquired magnetic field strength into a voltage form. The magnetic field sensor 240 may transmit the magnitude of the converted voltage to the module 270 (e.g., the resonant frequency acquisition module 272).

[0059] In an embodiment, the processor 250 may include Figure 1 In the processor 120 in the embodiment, the processor 250 can control the overall operation to obtain the resonant frequency of the vibration device 210 and determine the driving frequency of the vibration device 210. In the embodiment, the processor 250 may include one or more processors to obtain the resonant frequency of the vibration device 210. Figures 3 to 15 Operations performed by the processor 250 for acquiring the resonance frequency and determining the driving frequency are described.

[0060] In an embodiment, the memory 260 may include Figure 1In the memory 130 in the embodiment, the memory 260 may store a module 270 (e.g., a vibration data acquisition module 271, a resonance frequency acquisition module 272, and a vibration device driver 273) for performing operations of acquiring the resonant frequency of the vibration device 210 and determining the driving frequency of the vibration device 210. In the embodiment, the memory 260 may store instructions. When the instructions are executed by the processor 250, the electronic device 200 may perform at least one operation. Figure 5 The module 270 stored in the memory 260 is described.

[0061] Figure 3 is a view showing an example of a cross-section of the motor 300 according to an embodiment of the present disclosure. Figure 3 The motor 300 will be described.

[0062] Reference Figure 3 , the motor 300 (eg, Figure 1 The tactile module 179 or Figure 2 The vibration device 210 in the embodiment may include a housing 310 , a weight 320 , a damping foam 330 , an elastic member 340 (eg, a spring), a magnet 350 , and a coil 360 .

[0063] In an embodiment, the housing 310 may support the exterior of the motor 300 and protect the internal components of the motor 300 from damage. The counterweight 320 may be fixed to the housing 310 by an elastic member 340. The counterweight 320 may perform linear movement due to the interaction between the magnetic field generated by the current flowing along the coil 360 and the magnet 350. The weight of the counterweight 320 is inversely proportional to the resonant frequency of the motor 300, and thus the weight of the counterweight 320 may be variously changed in consideration of the resonant frequency of the motor 300.

[0064] In an embodiment, the damping foam 330 may be disposed between the counterweight 320 and the elastic member 340, and contact between the counterweight 320 and the elastic member 340 may be prevented. In an embodiment, the damping foam 330 may be made of a polyurethane foam material. When the temperature rises, the stiffness of the damping foam 330 including the polyurethane foam material may be reduced, and thus the stress applied to the elastic member 340 may be increased. In the case where the stress applied to the elastic member 340 is excessively increased, the motor 300 may be damaged. In an embodiment, in order to prevent the motor 300 from being damaged at high temperatures, the electronic device 200 may acquire the resonant frequency of the motor 300, and determine the driving frequency of the motor 300 based on the acquired resonant frequency. The operations of the electronic device 200 related to the acquisition of the resonant frequency and the determination of the driving frequency will be described below.

[0065] In an embodiment, the motor 300 may resonate at a specific frequency. The motor 300 may resonate at a resonant frequency. For example, the resonant frequency of the motor 300 may correspond to a frequency that maximizes the amount of vibration of the motor 300 when the motor 300 vibrates. The resonant frequency of the motor 300 may be proportional to the spring constant of the elastic member 340 and inversely proportional to the weight of the counterweight 320. For example, as the stiffness of the elastic member 340 increases, the resonant frequency of the motor 300 may increase, and as the weight of the counterweight 320 increases, the resonant frequency of the motor 300 may decrease.

[0066] The elastic member 340 may elastically support the weight 320 to stably perform linear movement. The spring constant of the elastic member 340 is inversely proportional to the resonance frequency of the motor 300, and thus the stiffness of the elastic member 340 may be variously changed in consideration of the resonance frequency of the motor 300.

[0067] The magnet 350 may provide the weight 320 with a magnetic field generated by interacting with a current flowing along the coil 360 .

[0068] The coil 360 may receive current from a power supply device (e.g., a battery 189) and generate a magnetic field around the wire. The weight 320 may perform linear movement in a direction perpendicular to the direction of the current flowing along the coil 360 and the direction of the magnetic field of the magnet 350. Figure 3 , the motor 300 may be implemented to include more components or fewer components. For example, the motor 300 may be implemented to further include a metal pin (not shown) to further enhance the magnetic field generated by the magnet 350.

[0069] Reference Figure 3 , the motor 300 may be a horizontal linear vibration motor that vibrates by performing horizontal linear motion by the counterweight 320. In an embodiment, the vibration device 210 may include various types of vibration motors. For example, the vibration device 210 may include a vertical linear vibration motor that vibrates by performing vertical linear motion by the counterweight. Various types of vibration motors may have similar temperature dependence. In an embodiment, the various types of vibration motors include a damping foam 330. It is a well-known technology that the vibration device 210 can be implemented in various ways, without being limited to the above examples, and therefore a more detailed description will be omitted.

[0070] Figure 4 4 is a diagram showing the processor 250 and the vibration device IC 230 connected to different communication interfaces (eg, an I2C bus 401 and an I2S bus 402) according to an embodiment.

[0071] Hereinafter, the processor 250 and the vibration device IC 230 according to an embodiment will be described.

[0072] In an embodiment, the processor 250 may transmit data related to a driving signal of the vibration device 210 (eg, driving frequency and driving voltage) to the vibration device IC 230 through at least one of a plurality of buses (eg, an I2C bus 401 and an I2S bus 402 ).

[0073] In an embodiment, the vibration device IC 230 may include: a memory (not shown); a control circuit (not shown); a plurality of terminals 420, 430 and 440; and a processing circuit 410, which is implemented (or configured) to process a plurality of data received from the processor 250 and generate control data for driving the vibration device 210.

[0074] In an embodiment, the processing circuit 410 may include a digital signal processing (DSP) circuit, a circuit corresponding to a specific encoder (e.g., an encoder or a decoder), and / or an amplifier circuit for converting input data into data for generating vibration. In an embodiment, the data for vibration generation may include at least one of serial data (SDA) or open wave table (OWT) data. In an embodiment, the memory may store a program (e.g., firmware and / or software) for overall control of the vibration device IC 230. In an embodiment, the processor 250 may execute firmware to control the vibration device IC 230 to process multiple pieces of data acquired from the processor 250 by using the processing circuit 310. By processing the acquired multiple pieces of data, the vibration device IC 230 may acquire (or generate) data (e.g., PWM data) for driving the vibration device 210. When the electronic device 200 is started (or turned on), the firmware of the vibration device IC 230 may be executed. The vibration device IC 230 may drive the vibration device 210 (e.g., the motor 300) based on the acquired data (e.g., PWM data) for vibration generation. The vibration device 210 may vibrate in response to the data for vibration generation. In an embodiment, the vibration device IC 230 may transmit the generated data for vibration generation (e.g., PWM data) by connecting to the output terminal 440 of the vibration device 210, and the vibration device 210 (e.g., the motor 300) may be driven based on the received data (e.g., PWM data).

[0075] In an embodiment, the plurality of terminals 420, 430, and 440 may include terminals 420 and 430 connected to the plurality of communication interfaces 401 and 402 for connecting the processor 250 with the vibration device IC 230 and a terminal 440 for connecting the vibration device IC 230 with the vibration device 210. In an embodiment, referring to Figure 4, the plurality of communication interfaces 401 and 402 may include a plurality of buses (e.g., an inter-integrated circuit (I2C) bus 401 and an inter-integrated chip audio (I2S) bus 402). The plurality of terminals may include an I2C terminal 420 connected to the I2C bus 401 and an I2S terminal 430 connected to the I2S bus 402. The vibration device IC 230 may be electrically connected to the processor 250 via the I2C bus 401 connected to the I2C terminal 420 and the I2S bus 402 connected to the I2S terminal 430. The plurality of terminals may include an output terminal 440 connected to the vibration device 210. Data (e.g., PCM data) for driving the vibration device 210 may be transmitted via the output terminal 440.

[0076] In an embodiment, the I2C bus 401 may be a serial bus for transmitting and / or receiving data between the processor 250 and other electronic components (e.g., the vibration device IC 230) in the electronic device 200. In an embodiment, the I2C bus 401 may include two lines (not shown), and may include, for example, a serial clock (SCL) line and a serial data (SDA) line. A clock signal for synchronization may be output to the electronic component from the processor 250 via the SCL. Time data (e.g., SDA data) corresponding to the clock signal may be sent and / or received between the processor 250 and the electronic component via the SDA line. In an embodiment, the vibration device IC 230 may receive the driving frequency of the vibration device 210 via the I2C bus 401. In an embodiment, the received driving frequency may be the frequency of the driving signal for driving the vibration device 210 obtained (or generated) by the vibration device IC 230.

[0077] In an embodiment, the I2S bus 402 may be a serial bus for audio data transmission and / or audio data reception between the processor 250 and other electronic components (e.g., the vibration device IC 230) in the electronic device 200. The audio data may include PCM data. In an embodiment, the I2S bus 402 may include three lines (not shown) and may include, for example, a serial clock line (SCK), a field selection line (WS), and a serial data line (SD). The clock signal for synchronization may be output to the electronic component from the processor 250 via SCK. The field selection signal may be sent to the processor 250 and the electronic component via WS. The audio data may be sent to the electronic component from the processor 250 via SD. In this case, the transmission may be unidirectional. For example, A2H data and / or ACH data may be transmitted to the vibration device IC 230 from the processor 250 via the I2S bus 402.

[0078] In an embodiment, the type of data transmitted through the I2C bus 401 and the type of data transmitted through the I2S bus 402 may be different from each other.

[0079] In an embodiment, the data received through the I2C bus 401 and the data received through the I2S bus 402 may also include various types of data signals for driving the vibration device 220. For example, in addition to audio data (e.g., PCM data), the data type that can be transmitted through the I2S bus 402 may also include a data type that can be obtained based on other types of content other than audio (such as image data).

[0080] Figure 5 is a view showing an example of a software configuration of the electronic device 200 according to the embodiment.

[0081] Hereinafter, the processor 250 and a program (eg, Figure 2 Module 270 in).

[0082] In an embodiment, the processor 250 may include Figure 1 In the processor 120 in the embodiment. In an embodiment, the at least one processor may include a processor 250 and a vibration device IC 230.

[0083] In an embodiment, the module 270 (eg, Figure 2 The resonant frequency acquisition module 272, the vibration data acquisition module 271, and the vibration device driver 273 in the embodiment of the present invention can be implemented in the form of an application, a program, a computer code, an instruction, a routine, a process, software, firmware, or a combination of at least two thereof that can be executed by the processor 250. For example, the module 270 can be implemented as Figure 1 In an embodiment, module 270 may correspond to Figure 1 140 in the program. For example, in the case of executing module 270 (e.g., resonant frequency acquisition module 272, vibration data acquisition module 271, and vibration device driver 273), processor 250 may perform operations corresponding to each module. In an embodiment of the present disclosure, the description of "module execution operation" may be understood as processor 250 performing operations corresponding to the module according to the execution of the module. At least a portion of module 270 (e.g., resonant frequency acquisition module 272, vibration data acquisition module 271, and vibration device driver 273) may include multiple programs. Module 270 is not limited to the above examples. In an embodiment, at least a portion of module 270 may be implemented in the form of hardware (e.g., processing circuit 410).

[0084] In an embodiment, the vibration data acquisition module 271 may be implemented to acquire (or generate) data for vibration generation in the case of an event for providing vibration in the electronic device 200. The vibration data acquisition module 271 may be implemented to control the processor 250 to transmit the data for vibration generation to the vibration device IC 230 via the I2C bus 401. In an embodiment, an event (hereinafter referred to as a "vibration event") is an event pre-configured for vibration generation in the electronic device 200, and may be an event implemented to generate vibrations with specific attributes (e.g., a specific size or a specific pattern). The pattern may be the size of the vibration over time. In an embodiment, a module (not shown) for managing events (e.g., a window manager) may manage information about vibration events.

[0085] Reference Figure 5 In an embodiment, the vibration data acquisition module 271 may include a vibrator service module 511 , a vibrator HAL module 512 , and an input force feedback (InputFF) driver 513 .

[0086] In an embodiment, the vibrator service module 511 can obtain at least one of a value indicating a vibration size and a value indicating a vibration effect based on the occurrence of a vibration event related to an application (e.g., a notification application or a phone call application) based on at least one function (e.g., an application programming interface (API)).

[0087] In an embodiment, the vibrator HAL module 512 may transmit at least one of the acquired value indicating the vibration magnitude and the value indicating the vibration effect to an InputFF driver 513 implemented in a kernel (e.g., a Linux kernel). In an embodiment, the vibrator HAL module 512 may acquire a resonant frequency (or driving frequency) value of the vibration device 210 stored in the EFS partition 500. The vibrator HAL module 512 may transmit the acquired resonant frequency value of the vibration device 210 to an InputFF driver 513 implemented in a kernel (e.g., a Linux kernel). The InputFF driver 513 may transmit the resonant frequency value to the vibration device driver 273, so that the processor 250 transmits the acquired resonant frequency value to the vibration device 210 through the I2C bus 301. In an embodiment, the vibrator HAL module 512 may transmit the acquired resonant frequency value of the vibration device 210 to the vibration device driver 273. The vibrator HAL module 512 may request the vibration device driver 273 to drive the vibration device 210 so that the vibration device 210 vibrates according to the driving frequency stored in the EFS partition 500 .

[0088] In an embodiment, the InputFF driver 513 may send or receive instructions for resonant frequency calibration with the vibration device driver 273. The InputFF driver 513 may trigger the f included in the resonant frequency acquisition module 272. 0 The calibration application 521 acquires (or measures) the resonant frequency of the vibration device 210 . The InputFF driver 513 may acquire the resonant frequency of the vibration device 210 acquired by the resonant frequency acquisition module 272 through the vibrator HAL 512 .

[0089] The EFS partition 500 is a storage device (eg, Figure 1 The resonant frequency acquisition module 272 may be a part of the internal memory 136 in the memory 136, and may store the resonant frequency (or driving frequency) of the vibration device 210 acquired by the resonant frequency acquisition module 272. In an embodiment, the operation of the resonant frequency acquisition module 272 acquiring the resonant frequency of the vibration device 210 may be referred to as "resonant frequency calibration".

[0090] In an embodiment, the resonant frequency acquisition module 272 may be implemented to acquire (or generate) the resonant frequency of the vibration device 210 by communicating with the InputFF driver 513. The resonant frequency acquisition module 272 may be implemented to determine the vibration frequency as the driving frequency of the vibration device 210 based on the acquired resonant frequency, wherein the output of the vibration device 210 at a temperature higher than room temperature is less than the output of the vibration device at room temperature at the vibration frequency. The resonant frequency acquisition module 272 may be implemented to control the processor 250 to transmit the resonant frequency (or driving frequency) to the vibration device IC 230 through the I2C bus 401.

[0091] Reference Figure 5 In an embodiment, the resonant frequency acquisition module 272 may include f 0 Calibration application 521. For example, when the InputFF driver 513 triggers the resonant frequency calibration, f 0 The calibration application 521 may execute firmware for calibration.

[0092] f 0 The calibration application 521 may acquire the resonant frequency by performing calibration for increasing or decreasing the vibration frequency of the vibration device 210. 0 The calibration application 521 may increase or decrease the vibration frequency of the vibration device 210 within a preconfigured time (e.g., a scanning time), and may acquire the resonant frequency of the vibration device 210 based on a signal (e.g., back electromotive force, impedance, or magnetic field) output from the vibration device 210 when the vibration device 210 vibrates at the increased or decreased vibration frequency. 0The calibration application 521 may obtain a vibration frequency for maximizing the magnitude of the vibration amount output from the vibration device 210 as a resonant frequency when the vibration device 210 vibrates at an increasing or decreasing vibration frequency. In an embodiment, when the vibration device 210 vibrates at an increasing or decreasing vibration frequency, f 0 The calibration application 521 may acquire a vibration frequency for maximizing the magnitude of the back electromotive force output from the vibration device 210 as the resonant frequency. 0 The calibration application 521 may acquire a vibration frequency that maximizes the magnitude of the magnetic field output from the vibration device 210 as a resonance frequency by using the magnetic field sensor 240 when the vibration device 210 vibrates at an increasing or decreasing vibration frequency. 0 The calibration application 521 may store the acquired resonance frequency in the EFS partition 500 .

[0093] The resonance frequency acquisition module 272 may determine a vibration frequency at which the output of the vibration device 210 at a temperature higher than room temperature is less than the output of the vibration device at room temperature as the driving frequency of the vibration device 210 based on the acquired resonance frequency, and store the determined driving frequency in the EFS area 500. Figure 6 A detailed example of the resonance frequency acquisition module 272 determining the driving frequency of the vibration device 210 is described.

[0094] In an embodiment, the resonance frequency acquisition module 272 may determine (or adjust) the driving frequency or driving voltage of the vibration device 210 in response to the acquisition of the driving temperature of the vibration device 210 .

[0095] In an embodiment, the resonant frequency acquisition module 272 may acquire the driving temperature of the vibration device 210. For example, the resonant frequency acquisition module 272 may acquire the driving temperature of the vibration device 210 by using the temperature sensor 220 when the vibration device 210 vibrates. The resonant frequency acquisition module 272 may determine the driving frequency change value of the vibration device 210 based on a pre-stored table (or "frequency table") including frequencies for each temperature. For example, the resonant frequency acquisition module 272 may refer to a table including frequencies for each temperature pre-stored in the memory 260 in response to the acquisition of the driving temperature. The table including frequencies for each temperature may correspond to data representing the relationship between the driving frequency for each temperature and the vibration amount of the vibration device 210 in the form of a table. In the case where a vibration frequency less than the resonant frequency of the vibration device 210 at room temperature is determined as the driving frequency, the resonant frequency acquisition module 272 may determine the driving frequency so that the driving frequency decreases in proportion to the increase in the driving temperature relative to the room temperature. In this example, the difference between the determined driving frequency and the resonant frequency of the vibration device 210 at room temperature may be inversely proportional to the difference between the driving temperature and the room temperature. The resonant frequency acquisition module 272 can control the vibration device 210 so that the vibration device 210 is driven at the driving frequency to which the determined driving frequency change value has been applied. In an embodiment, the resonant frequency acquisition module 272 can transmit the driving frequency to which the determined driving frequency change value has been applied to the vibration device IC 230. The vibration device IC 230 can acquire (or generate) a driving signal of the vibration device 210 based on the acquired driving frequency. The vibration device 210 can vibrate at the driving frequency according to the acquired driving signal. Even at high temperatures, the resonant frequency acquisition module 272 can keep the vibration force of the vibration device 210 constant by reducing the driving frequency in proportion to the increase in the driving temperature of the vibration device 210.

[0096] In an embodiment, the resonant frequency acquisition module 272 may determine the driving voltage change value of the vibration device 210 based on a pre-stored table (or "voltage table") including voltages for each temperature. In an embodiment, the resonant frequency acquisition module 272 may refer to a table including voltages for each temperature pre-stored in the memory 260 in response to the acquisition of the driving temperature. The table including voltages for each temperature may correspond to data representing the relationship between the driving frequency for each temperature and the driving voltage of the vibration device 210 in the form of a table. In the case where a vibration frequency less than the resonant frequency of the vibration device 210 at room temperature is determined as the driving frequency, the resonant frequency acquisition module 272 may determine the driving frequency so that the driving voltage decreases in proportion to the increase in the driving temperature relative to the room temperature. The resonant frequency acquisition module 272 may control the vibration device 210 so that the vibration device 210 is driven according to the driving voltage to which the determined driving voltage change value has been applied. In an embodiment, the resonant frequency acquisition module 272 may transmit the driving voltage to which the determined driving voltage change value has been applied to the vibration device IC 230. The vibration device IC 230 may acquire (or generate) a driving signal of the vibration device 210 based on the acquired driving voltage. The vibration device 210 may vibrate at the driving voltage according to the acquired driving signal. Even at high temperatures, the resonance frequency acquisition module 272 may keep the vibration force of the vibration device 210 constant by reducing the driving voltage in proportion to the increase in the driving temperature of the vibration device 210.

[0097] In an embodiment, the resonant frequency acquisition module 272 may determine (or adjust) the driving voltage of the vibration device 210 in response to the acquisition of the driving temperature of the vibration device 210 and the vibration amount output from the vibration device 210. The resonant frequency acquisition module 272 may acquire the driving temperature of the vibration device 210. In an embodiment, the resonant frequency acquisition module 272 may acquire the driving temperature of the vibration device 210 by using the temperature sensor 220 when the vibration device 210 vibrates. The resonant frequency acquisition module 272 may determine the driving voltage change value of the vibration device 210 based on a pre-stored table including a voltage for each temperature. In an embodiment, the resonant frequency acquisition module 272 may refer to a table including a voltage for each temperature pre-stored in the memory 260 in response to the acquisition of the driving temperature. In the case where a vibration frequency less than the resonant frequency of the vibration device 210 at room temperature is determined as the driving frequency, the resonant frequency acquisition module 272 may determine (or adjust) the driving frequency so that the driving voltage decreases in proportion to the increase in the driving temperature relative to the room temperature. The resonance frequency acquisition module 272 may acquire the vibration amount output from the vibration device 210 in response to the driving voltage to which the determined driving voltage change value has been applied. For example, the resonance frequency acquisition module 272 may acquire the vibration amount output from the vibration device 210 by using an acceleration sensor (not shown) (e.g., Figure 1The sensor module 176 in the vibration device 210) obtains an electrical signal caused by the vibration of the vibration device 210, and obtains the vibration amount of the vibration device 210 based on the electrical signal. In an embodiment, the resonant frequency acquisition module 272 can obtain the back electromotive force or impedance of the vibration device 210 and obtain the vibration amount. The resonant frequency acquisition module 272 can determine the driving voltage for causing the vibration device 210 to output the target vibration amount based on the acquired vibration amount. In an embodiment, when the vibration amount of the vibration device 210 increases compared with the target vibration amount, the resonant frequency acquisition module 272 can reduce the driving voltage of the vibration device 210 in proportion to the increase of the vibration amount relative to the target vibration amount. The resonant frequency acquisition module 272 can transmit the reduced driving voltage to the vibration device IC 230. The vibration device IC 230 can obtain (or generate) a driving signal of the vibration device 210 based on the acquired driving voltage. The vibration device 210 can vibrate with the driving voltage according to the acquired driving signal. Even at a high temperature, the resonance frequency acquisition module 272 may maintain the vibration force of the vibration device 210 to be constant by reducing the driving voltage in proportion to an increase in the vibration amount of the vibration device 210 .

[0098] In an embodiment, the vibration device driver 273 may be implemented to control the processor 250 to transmit predetermined data to the vibration device IC 230 through multiple communication interfaces (e.g., I2C bus 401 and I2S bus 402). In an embodiment, the vibration device driver 273 may be implemented in the form of a multi-function device (MFD) driver. In an embodiment, the vibration device driver 273 may configure the resonant frequency (or driving frequency) obtained from the vibration data acquisition module 271 (e.g., vibrator HAL module 512) as the driving frequency of the vibration device 210. In an embodiment, the vibration device driver 273 may store instructions to enable the processor 250 to transmit the resonant frequency (or driving frequency) of the vibration device 210 obtained from the vibration data acquisition module 271 (e.g., Inputff driver 513) to the vibration device IC 230 through the I2C bus 401. In an embodiment, the vibration device IC 230 may drive the vibration device 210 based on the driving frequency of the vibration device 210 obtained from the processor 250, so that the vibration device 210 vibrates at the driving frequency.

[0099] Figure 6 is a graph indicating the vibration amount according to the vibration frequency of the vibration device 210 according to the embodiment at room temperature and at a temperature higher than room temperature.

[0100] Reference Figure 6 , a graph 600 of the vibration amount output from the vibration device 210 according to the vibration frequency at room temperature and a graph 610 of the vibration amount output from the vibration device 210 according to the vibration frequency at high temperature are shown. In an embodiment, the resonance frequency f at high temperature2 Can be lower than the resonant frequency f at room temperature 0 . Maximum vibration at high temperature G 2 Can be greater than the maximum vibration G at room temperature 0 In an embodiment, the high temperature is higher than the room temperature, and may correspond to a temperature condition that causes damage to the vibration device 210 due to the vibration device 210 vibrating at a maximum vibration amount.

[0101] Reference Figure 6 The curve 600 of the vibration amount output from the vibration device 210 at room temperature is shown in FIG. 6 . In the embodiment, the vibration device 210 is output at a resonant frequency f at room temperature. 0 In the case of vibration, the maximum vibration output G 0 In the embodiment, the maximum vibration amount G of the vibration device 210 at high temperature is 2 It can be greater than the maximum vibration amount G of the vibration device 210 at room temperature 0 .

[0102] In an embodiment, the electronic device 200 (eg, the processor 250) uses the resonance frequency acquisition module 272 to obtain a frequency f lower than the resonance frequency at room temperature. 1 When the driving frequency of the vibration device 210 is determined, the vibration device 210 at room temperature can output a vibration amount G corresponding to the determined driving frequency. 1 '. Even at high temperatures, the frequency f 1 When the vibration device 210 is driven, the vibration device 210 can output a vibration amount G greater than that output at room temperature at a high temperature. 1 'Vibration amount G1.

[0103] In an embodiment, the electronic device 200 (eg, the processor 250) may generate a signal based on the resonant frequency f of the vibration device 210. 0 , the vibration frequency (for example, the resonant frequency f 0 ) is determined as the driving frequency of the vibration device 210, at which the output of the vibration device 210 at a temperature higher than room temperature (for example, G 0 ') is less than the output G at room temperature 0 In an embodiment, the processor 250 obtains the resonant frequency f of the vibration device 210 at room temperature by using the resonant frequency acquisition module 272. 0 When the driving frequency f is lower than the driving frequency f determined for the vibration device 210, the vibration device 210 may output the same driving frequency f as the determined driving frequency f at room temperature. 0 The corresponding vibration G 0 The vibration device 210 resonates at the room temperature at a resonant frequency f even at high temperatures. 0When driven, the vibration device 210 can output a vibration amount G at a high temperature that is smaller than that at room temperature. 0 The vibration amount G 0 '. In an embodiment, the processor 250 will be greater than the resonant frequency f 0 When the frequency is determined as the driving frequency of the vibration device 210, even if the temperature is higher than the room temperature, the vibration device 210 can output a maximum vibration amount G less than the room temperature. 0 In an embodiment, the electronic device 200 (eg, the processor 250) may prevent the vibration device 210 from being damaged due to an increase in the amount of vibration at a high temperature by controlling the vibration device 210 to vibrate at a determined driving frequency.

[0104] Figure 7 is a view showing an example of a waveform of a signal output from a vibration device in response to a vibration frequency according to an embodiment of the present disclosure.

[0105] In the following, reference is made to Figure 7 , an example of the electronic device 200 (e.g., the processor 250) acquiring the resonant frequency of the vibration device 210 by using a frequency sweep method will be described. In an embodiment, the “frequency sweep method” may be to acquire the resonant frequency of the vibration device 210 by continuously increasing or decreasing the vibration frequency of the vibration device 210 (e.g., Figure 6 f 0 ). In an embodiment, the frequency scanning method may include an up-scan method or a down-scan method. In an embodiment, the “up-scan method” may be a method for obtaining the resonant frequency of the vibration device 210 by continuously increasing the vibration frequency of the vibration device 210. The “down-scan method” may be a method for obtaining the resonant frequency of the vibration device 210 by continuously reducing the vibration frequency of the vibration device 210. In an embodiment, due to the response time of the vibration device 210, the resonant frequency measured by the up-scan method or the down-scan method may be different from the actual resonant frequency (for example, Figure 6 f 0 ) is different. For example, the resonant frequency measured by the up-scan method may be a value greater than the actual resonant frequency of the vibration device 210 (eg, Figure 6 f 0 )’s value frequency.

[0106] In the embodiment, when the vibration frequency of the vibration device 210 increases from time t 1 To time t 2 When increasing or decreasing continuously, you can Figure 7700 indicating the voltage supplied to the vibration device 210 and the waveform 710 indicating the vibration amount output from the vibration device 210. In an embodiment, the "sweep time" may be the time during which the vibration device 210 vibrates according to the increasing or decreasing vibration frequency. For example, from time t 1 To time t 2 The time t may be referred to as a “scanning time”. The scanning time may be changed in consideration of at least one of an error in the measured resonant frequency of the vibration device 210 and a total time required for the resonant frequency measurement operation. In an embodiment, the scanning time may be changed from the time t 1 To time t 2 The magnitude of the voltage supplied to the vibration device 210 is kept constant regardless of the vibration frequency of the vibration device 210. In an embodiment, the time t 1 It can be the time point to start the frequency scan. 1 The vibration frequency input to the vibration device 210 may correspond to a preconfigured minimum vibration frequency (eg, Figure 6 f min ) or a preconfigured maximum vibration frequency (e.g. Figure 6 f max ). In an embodiment, time t 2 It can be the time point to end the frequency scan. 2 The vibration frequency input to the vibration device 210 may correspond to the maximum vibration frequency (eg, Figure 6 f max ) or minimum vibration frequency (e.g. Figure 6 f min In an embodiment, by using the up-scan method, the electronic device 200 (eg, the processor 250) may 1 To time t 2 During the time period t, the vibration frequency of the vibration device 210 is increased from the minimum frequency to the maximum frequency, and a resonant frequency for maximizing the vibration amount of the vibration device 210 is obtained. In an embodiment, by using the down scanning method, the electronic device 200 (for example, the processor 250) can be in the range of t from the time t 1 To time t 2 The vibration frequency of the vibration device 210 is reduced from the maximum frequency to the minimum frequency during the time period of the vibration device 210, and a resonant frequency for maximizing the vibration amount of the vibration device 210 is obtained. In an embodiment, when the vibration frequency of the vibration device 210 increases or decreases, the vibration amount output from the vibration device 210 may have a maximum value at a time point when a specific vibration frequency (peak value) is input. In an embodiment, the vibration frequency (peak value) for maximizing the magnitude of the vibration amount output from the vibration device 210 may be a resonant frequency (e.g., Figure 6 f 0 ).

[0107] In an embodiment, in order to prevent the vibration device 210 from being damaged at high temperatures, the electronic device 200 (e.g., the processor 250) may acquire (or measure) the resonant frequency of the vibration device 210 at room temperature, and determine the driving frequency of the vibration device 210 based on the acquired resonant frequency. In an embodiment, the resonant frequency of the vibration device 210 may be a resonant frequency measured under a temperature different from room temperature (e.g., a temperature at which a user usually uses the electronic device 200).

[0108] Figure 8 is a flow chart 800 illustrating a method for controlling the vibration device 210 according to an embodiment of the present disclosure.

[0109] In an embodiment, Figure 8 The operations shown in are not limited to the order described and can be performed in various orders. Figure 8 More or fewer operations may be performed as shown.

[0110] In an embodiment, in operation 801, the electronic device 200 may increase or decrease the vibration frequency of the vibration device 210 during a predetermined time (e.g., scanning time). In an embodiment, the electronic device 200 (e.g., the processor 250) transmits the vibration frequency value to the vibration device IC 230 through the communication interface (e.g., the I2C bus 401), so that the vibration frequency of the vibration device 210 is continuously increased or decreased. The vibration device IC 230 may acquire (or generate) a signal by using the processing circuit 410, and provide the acquired signal to the vibration device 210, so that the vibration device 210 vibrates at the vibration frequency. In an embodiment, the electronic device 200 (e.g., the processor 250) may increase the vibration frequency of the vibration device 210 from a preconfigured minimum vibration frequency f min Continuously increases to a pre-configured maximum vibration frequency f max In an embodiment, the electronic device 200 (eg, the processor 250) may increase the vibration frequency of the vibration device 210 from a preconfigured maximum vibration frequency f max Continuously decreases to a pre-configured minimum vibration frequency f min .

[0111] In an embodiment, in operation 803, when the vibration device 210 vibrates at an increasing or decreasing vibration frequency, the electronic device 200 may acquire the resonant frequency of the vibration device 210 based on a signal (e.g., back electromotive force, impedance, or magnetic field) output from the vibration device 210. In an embodiment, when the vibration device 210 vibrates at an increasing or decreasing vibration frequency, the electronic device 200 (e.g., the processor 250) may acquire the vibration frequency that maximizes the vibration amount output from the vibration device 210 as the resonant frequency of the vibration device 210. In an embodiment, when the vibration device 210 vibrates at an increasing or decreasing vibration frequency, the electronic device 200 (e.g., the processor 250) may acquire the vibration frequency for maximizing the magnitude of the back electromotive force output from the vibration device 210 as the resonant frequency. In an embodiment, when the vibration device 210 vibrates at an increasing or decreasing vibration frequency, the electronic device 200 (e.g., the processor 250) may acquire the vibration frequency that maximizes the magnitude of the magnetic field output from the vibration device 210 as the resonant frequency by using the magnetic field sensor 240.

[0112] In an embodiment, in operation 805, the electronic device 200 may determine a vibration frequency as a driving frequency of the vibration device 210 based on the acquired resonance frequency, at which the output of the vibration device 210 at a temperature higher than room temperature is less than the output of the vibration device at room temperature. For example, the electronic device 200 (e.g., the processor 250) may determine the vibration frequency at which the vibration device 210 outputs at a temperature higher than room temperature as a driving frequency of the vibration device 210 based on the acquired resonance frequency. 0 To the maximum vibration frequency f max In an embodiment, the electronic device 200 (for example, the processor 250) may determine a vibration frequency greater than the resonant frequency obtained by the up-scan method as the driving frequency of the vibration device 210, and store the determined driving frequency in the memory 260 (for example, Figure 5 The “upward scanning method” may be a method for acquiring the resonance frequency of the vibration device 210 by continuously increasing the vibration frequency of the vibration device 210. In an embodiment, the electronic device 200 (e.g., the processor 250) may determine a vibration frequency greater than the resonance frequency acquired by the downward scanning method as the driving frequency of the vibration device 210, and store the determined driving frequency in the memory 260 (e.g., Figure 5 Considering the resonant frequency measured by the down-scan method relative to the actual resonant frequency (e.g., Figure 6 f 0 ), the electronic device 200 (eg, the processor 250) may set a value greater than the actual resonant frequency of the vibration device 210 (eg, Figure 6 f 0) is determined as the driving frequency of the vibration device 210. The down-scan method may be a method for acquiring the resonance frequency of the vibration device 210 by continuously reducing the vibration frequency of the vibration device 210.

[0113] In an embodiment, in operation 807, the electronic device 200 may control the vibration device 210 so that the vibration device 210 is driven at a determined driving frequency. For example, the electronic device 200 (e.g., the processor 250) may transmit the driving frequency value to the vibration device IC 230 through a communication interface (e.g., the I2C bus 401), so that the vibration device 210 vibrates at the driving frequency. The vibration device IC 230 may acquire (or generate) a signal by using the processing circuit 410, and provide the acquired signal to the vibration device 210, so that the vibration device 210 vibrates at the driving frequency. In the case where the vibration device 210 vibrates at the driving frequency according to the acquired signal, even if the temperature rises to above room temperature, the vibration amount of the vibration device 210 may be output as less than the maximum vibration amount at room temperature, so that the vibration device 210 may be prevented from being damaged.

[0114] In an embodiment, when the resonant frequency of the vibration device 210 is obtained whenever the electronic device 200 (e.g., the processor 250) is started (or turned on), the user may receive unexpected vibrations. Due to the resonant frequency calibration, the startup time of the electronic device 200 may be delayed. In an embodiment, the electronic device 200 (e.g., the processor 250) may be implemented to obtain the resonant frequency of the vibration device 210 through an independent process by using the resonant frequency acquisition module 272. For example, the electronic device 200 (e.g., the processor 250) can obtain the resonant frequency of the vibration device 210 during the process of replacing a damaged or defective vibration device 210 or during the process of replacing a printed board assembly including a vibration device IC.

[0115] Fig. 9 900 is a flowchart illustrating an example of an operation of acquiring a resonance frequency of a vibration device 210 by the electronic device 200 according to an embodiment of the present disclosure.

[0116] In an embodiment, the electronic device 200 (eg, the processor 250) may execute firmware for calibration (eg, f 0 The calibration application 521) is used to acquire the resonance frequency of the vibration device 210, and the acquired resonance frequency is stored in the memory 260 (eg, the EFS partition 500).

[0117] In an embodiment, Fig. 9 The operations shown in are not limited to the order described and can be performed in various orders. In addition, according to the embodiment, the operations can be performed in a variety of orders. Fig. 9 More or fewer operations may be performed as shown.

[0118] In an embodiment, in operation 901, the electronic device 200 may execute firmware for calibration. For example, the electronic device 200 (eg, the processor 250) may execute firmware (eg, f 0 The calibration application 521) is loaded into the memory 260.

[0119] In an embodiment, in operation 903, the electronic device 200 may acquire a resonant frequency by performing calibration for increasing or decreasing the vibration frequency of the vibration device 210. In an embodiment, the electronic device 200 (e.g., the processor 250) may increase or decrease the vibration frequency of the vibration device 210 within a preconfigured time (e.g., a scanning time), and may acquire the resonant frequency of the vibration device 210 based on a signal (e.g., back electromotive force, impedance, or magnetic field) output from the vibration device 210 when the vibration device 210 vibrates at the increased or decreased vibration frequency. In an embodiment, when the vibration device 210 vibrates at the increased or decreased vibration frequency, the electronic device 200 (e.g., the processor 250) may acquire a vibration frequency for maximizing the magnitude of the vibration amount output from the vibration device 210 as the resonant frequency. In an embodiment, when the vibration device 210 vibrates at the increased or decreased vibration frequency, the electronic device 200 (e.g., the processor 250) may acquire a vibration frequency for maximizing the magnitude of the back electromotive force output from the vibration device 210 as the resonant frequency. In an embodiment, when the vibration device 210 vibrates at an increasing or decreasing vibration frequency, the electronic device 200 (eg, the processor 250 ) may acquire a vibration frequency that maximizes the magnitude of the magnetic field output from the vibration device 210 as a resonant frequency by using the magnetic field sensor 240 .

[0120] In an embodiment, in operation 905, the electronic device 200 (e.g., the processor 250) may store the acquired resonance frequency in the memory 260 (e.g., the EFS partition 500). In an embodiment, the electronic device 200 may determine the driving frequency of the vibration device 210 based on the acquired resonance frequency, and store the determined driving frequency in the memory 260 (e.g., the EFS partition 500). For example, the electronic device 200 (e.g., the processor 250) may determine the vibration frequency as the driving frequency of the vibration device based on the resonance frequency acquired by the up-scan method or the resonance frequency acquired by the down-scan method, at which the output of the vibration device 210 at a temperature higher than room temperature is less than the output at room temperature. The electronic device 200 (e.g., the processor 250) may store the determined driving frequency in the memory 260 (e.g., the EFS partition 500).

[0121] In an embodiment, the electronic device 200 (e.g., the processor 250) may transmit the driving frequency of the vibration device 210 to the vibration device IC 230 by executing a vibration device driver (e.g., the vibrator driver 273) and firmware (e.g., the vibrator HAL module 512), so that the vibration device 210 is driven at the determined driving frequency.

[0122] Fig.10 1000 is a flowchart illustrating an example of an operation of determining, by the electronic device 200 , a driving frequency of the vibration device 210 , according to an embodiment.

[0123] In an embodiment, Fig.10 The operations shown in are not limited to the order described and can be performed in various orders. In addition, according to the embodiment, the operations can be performed in a variety of orders. Fig.10 More or fewer operations may be performed as shown.

[0124] In an embodiment, in operation 1001, the electronic device 200 may execute a vibration device driver (e.g., a vibrator driver 273) and a firmware (e.g., a vibrator HAL module 512). For example, the electronic device 200 (e.g., the processor 250) may load a vibration device driver (e.g., a vibration device driver 273) stored in the memory 260 and a firmware (e.g., a vibrator HAL module 512) for transmitting vibration data to the vibration device driver 273. In an embodiment, in operation 1003, the electronic device 200 (e.g., the processor 250) may control the firmware (e.g., the vibrator HAL module 512) to obtain a resonant frequency (or driving frequency) value stored in the memory 260 and input the resonant frequency (or driving frequency) value to the vibration device driver (e.g., the vibration device driver 273). In an embodiment, in operation 1005, the electronic device 200 (e.g., the processor 250) may control the vibration device driver (e.g., the vibrator driver 273) to configure the resonant frequency (or driving frequency) for the vibration device IC 230.

[0125] In an embodiment, in operation 1007, the electronic device 200 (e.g., the processor 250) may control the firmware 512 (e.g., the vibrator HAL module 512) to request the vibration device driver 273 (e.g., the vibrator driver 273) for the vibration of the vibration device 210. Based on the request, the vibration device driver 273 may control the vibration device IC 230 to obtain (or generate) a driving signal according to the configured resonant frequency (or driving frequency) to drive the vibration device 210. In the case where the vibration device 210 vibrates at the resonant frequency (or driving frequency), even if the temperature rises to be higher than the room temperature, the output vibration amount of the vibration device 210 may be less than the maximum vibration amount at the room temperature, and thus the vibration device 210 may be prevented from being damaged.

[0126] Fig.11a is a view illustrating an example in which a vibration force is changed according to an operation of an electronic device according to an embodiment of the present disclosure.

[0127] Fig.11b is a view showing an example in which a driving voltage is changed according to an operation of an electronic device according to an embodiment of the present disclosure.

[0128] Hereinafter, changes in the vibration amount and the driving voltage due to the operation of the electronic device 200 according to the embodiment will be described.

[0129] Reference Fig.11a In the first to fourth samples #1, #2, #3 and #4, the vibration device 210 is less than the resonance frequency f 0 Fixed drive frequency f 1 In the case of vibration, there may be a deviation between the upper limit 1110_a, 1111_a, 1113_a and 1115_a of the vibration amount and the lower limit 1100_a, 1101_a, 1103_a and 1105_a of the vibration amount. In an embodiment, below the resonant frequency (e.g., Figure 6 f 0 ) with a fixed drive frequency f 1 Can be Figure 6 The frequency f 1 For example, a fixed drive frequency f below the resonant frequency 1 It can have a value of 150 Hz. Fixed drive frequency f 1 The value of is not limited to the above example. Fig.11a In the embodiment, the vibration device 210 of the first to fourth samples #1, #2, #3 and #4 is at a resonance frequency f 0 In the case of vibration, the upper limits 1110_a, 1111_a, 1113_a, and 1115_a of the vibration amount may be reduced by 1117, and the lower limits 1100_a, 1101_a, 1103_a, and 1105_a of the vibration amount may be increased by 1107. In an embodiment, since the motor (e.g., Figure 3 The resonant frequencies measured for the first to fourth samples #1, #2, #3, and #4 at room temperature may have different values. In an embodiment, the resonant frequency measured for each sample may be different from the resonant frequency of the elastic member (e.g., Figure 3 The resonant frequency f is proportional to the square root of the stiffness of the elastic member 340 in the motor 300 and inversely proportional to the square root of the mass of the motor 300. 0In the case of vibration, the deviation between the upper limits 1110_b, 1111_b, 1113_b and 1115_b of the vibration amount and the lower limits 1100_b, 1101_b, 1103_b and 1105_b can be significantly reduced. In an embodiment, the resonant frequency of the vibration device 210 may include the actual resonant frequency of the vibration device 210 (e.g., Figure 6 f 0 ) and the resonant frequency obtained by the up-scan method. In an embodiment, the electronic device 200 (eg, the processor 250) may provide a compensation voltage to the vibration device 210 so that the vibration device 210 is at the resonant frequency f 0 Or driving frequency f 1 When vibrating, the output is a vibration amount within a predetermined range.

[0130] Reference Fig.11b , the vibration device 210 in the first to fourth samples #1, #2, #3, and #4 is lower than the resonant frequency (eg, Figure 6 f 0 ) with a fixed drive frequency f 1 In the case of vibration, there may be a deviation between the upper limits 1120_a, 1121_a, 1123_a, and 1125_a and the lower limits 1130_a, 1131_a, 1133_a, and 1135_a of the driving voltage. For the efficiency of the vibration device 210 of the first to fourth samples #1, #2, #3, and #4, when the vibration device 210 is lower than the resonant frequency (for example, Figure 6 f 0 ) with a fixed drive frequency f 1 In the case of vibration, the driving voltage at the lower limits 1130_a, 1131_a, 1133_a and 1135_a of the vibration force may be excessively increased. 0 In the case of vibration, the driving voltage difference between the vibration force upper limit 1120_b, 1121_b, 1123_b and 1125_b and lower limit 1130_b, 1131_b, 1133_b and 1135_b samples can be significantly reduced 1127 and 1137.

[0131] In the embodiments, reference Fig.11a and Fig.11b , when using the resonant frequency f 0 Rather than being less than f 0 Fixed drive frequency f 1 When the temperature is above room temperature, more stable vibration, more stable driving voltage and / or less current consumption may be possible. These effects may occur even if the temperature is above room temperature.

[0132] Fig.12is a graph showing an example in which vibration force changes according to vibration frequency for each temperature according to an embodiment of the present disclosure.

[0133] Reference Fig.12 In an embodiment, as the temperature change increases from room temperature, the resonant frequency of the vibration device 210 may become lower and the maximum vibration amount may increase. In an embodiment, referring to the vibration amount curve 1200 of the vibration device 210 relative to the vibration frequency at room temperature and each of the vibration amount curves 1210, 1220, 1230, 1240, and 1250 of the vibration device 210 relative to the vibration frequency at temperatures higher than the room temperature by predetermined temperatures ΔT, 2ΔT, 3ΔT, 4ΔT, and 5ΔT, as the temperature increases, the maximum vibration amount of the vibration device 210 may increase and the resonant frequency may decrease.

[0134] In an embodiment, the electronic device 200 may increase the frequency (eg, Figure 6 f 0 ) is determined as the driving frequency of the vibration device 210 at room temperature to prevent the vibration device 210 from being damaged due to excessive increase in vibration amount at high temperature. In an embodiment, the relationship between the vibration frequency and the vibration amount for each temperature can be pre-stored in the memory 260.

[0135] Although not shown in the drawings, the driving voltage of the vibration device 210 may have a specific relationship according to the driving frequency for each temperature, and the relationship between the driving voltage and the driving frequency for each temperature may be pre-stored in the memory 260 .

[0136] Fig.13 1300 is a flowchart illustrating an example of an operation of controlling a driving frequency of the vibration device 210 based on acquisition of a driving temperature of the vibration device 210 according to an embodiment of the present disclosure.

[0137] In an embodiment, the electronic device 200 (eg, the processor 250 ) may determine (or adjust) the driving frequency of the vibration device 210 in response to the acquisition of the driving temperature of the vibration device 210 .

[0138] According to an embodiment, Fig.13 The operations shown in are not limited to the order described and can be performed in various orders. In addition, according to the embodiment, the operations can be performed in a variety of orders. Fig.13 More or fewer operations may be performed as shown.

[0139] In an embodiment, in operation 1301, the electronic device 200 may acquire a driving temperature of the vibration device 210. For example, the electronic device 200 (eg, the processor 250) may acquire the driving temperature of the vibration device 210 by using the temperature sensor 220 when the vibration device 210 vibrates.

[0140] According to an embodiment, in operation 1303, the electronic device 200 may determine the driving frequency change value of the vibration device 210 based on a pre-stored table including frequencies for each temperature (or "frequency table"). For example, the electronic device 200 (e.g., the processor 250) may acquire a table including frequencies for each temperature pre-stored in the memory 260 in response to the acquisition of the driving temperature. The table including frequencies for each temperature may correspond to Fig.12 The table format shown represents data on the relationship between the driving frequency for each temperature and the vibration amount of the vibration device 210. In the case where a vibration frequency less than the resonant frequency of the vibration device 210 at room temperature is determined as the driving frequency, the electronic device 200 (e.g., the processor 250) may adjust the driving frequency so that the driving frequency decreases in proportion to an increase in the driving temperature relative to the room temperature.

[0141] In an embodiment, in operation 1305, the electronic device 200 may control the vibration device so that the vibration device 210 is driven at a driving frequency to which the determined driving frequency change value has been applied. For example, the electronic device 200 (e.g., the processor 250) may transmit the driving frequency to which the determined driving frequency change value has been applied to the vibration device IC 230. The vibration device IC 230 may acquire (or generate) a driving signal of the vibration device 210 based on the acquired driving frequency. The vibration device 210 may vibrate at the driving frequency according to the acquired driving signal. Even at high temperatures, the electronic device 200 (e.g., the processor 250) may keep the vibration force of the vibration device 210 constant by reducing the driving frequency in proportion to the increase in the driving temperature of the vibration device 210.

[0142] Fig.14 1400 is a flowchart illustrating an example of an operation of controlling a driving voltage of the vibration device 210 based on acquisition of a driving temperature of the vibration device 210 according to an embodiment of the present disclosure.

[0143] In an embodiment, Fig.14 The operations shown in are not limited to the order described and can be performed in various orders. In addition, according to the embodiment, the operations can be performed in a variety of orders. Fig.14 More or fewer operations may be performed as shown.

[0144] In an embodiment, the electronic device 200 (eg, the processor 250 ) may determine (or adjust) the driving voltage of the vibration device 210 in response to the acquisition of the driving temperature of the vibration device 210 .

[0145] In an embodiment, in operation 1401, the electronic device 200 may acquire a driving temperature of the vibration device 210. For example, the electronic device 200 (eg, the processor 250) may acquire the driving temperature of the vibration device 210 by using the temperature sensor 220 when the vibration device 210 vibrates.

[0146] In an embodiment, in operation 1403, the electronic device 200 may determine the driving voltage change value of the vibration device 210 based on a pre-stored table (or "voltage table") including voltages for each temperature. For example, the electronic device 200 (e.g., the processor 250) may acquire a table including voltages for each temperature pre-stored in the memory 260 in response to acquisition of the driving temperature. As described above with reference to Fig.12 As described above, the table including the voltage for each temperature may correspond to data representing in a table the relationship between the driving frequency for each temperature and the driving voltage of the vibration device 210. In the case where a vibration frequency less than the resonant frequency of the vibration device 210 at room temperature is determined as the driving frequency, the electronic device 200 (e.g., the processor 250) may determine the driving frequency so that the driving voltage decreases in proportion to an increase in the driving temperature relative to the room temperature.

[0147] In an embodiment, in operation 1405, the electronic device 200 may control the vibration device 210 so that the vibration device 210 is driven according to the driving voltage to which the determined driving voltage change value has been applied. For example, the electronic device 200 (e.g., the processor 250) may transmit the driving voltage to which the determined driving voltage change value has been applied to the vibration device IC 230. The vibration device IC 230 may acquire (or generate) a driving signal of the vibration device 210 based on the acquired driving voltage. The vibration device 210 may vibrate with the driving voltage according to the acquired driving signal. Even at high temperatures, the electronic device 200 (e.g., the processor 250) may keep the vibration force of the vibration device 210 constant by reducing the driving voltage in proportion to the increase in the driving temperature of the vibration device 210.

[0148] Fig.15 1500 is a flowchart illustrating an example of an operation of controlling a driving voltage of a vibration device so that the vibration device 210 outputs a target vibration amount according to an embodiment of the present disclosure.

[0149] In an embodiment, the electronic device 200 (eg, the processor 250 ) may determine (or adjust) a driving voltage of the vibration device 210 in response to acquisition of a driving temperature of the vibration device 210 and a vibration amount output from the vibration device 210 .

[0150] In an embodiment, Fig.15The operations shown in are not limited to the order described and can be performed in various orders. In addition, according to the embodiment, the operations can be performed in a variety of orders. Fig.15 More or fewer operations may be performed as shown.

[0151] In an embodiment, in operation 1501, the electronic device 200 may acquire a driving temperature of the vibration device 210. For example, the electronic device 200 (eg, the processor 250) may acquire the driving temperature of the vibration device 210 by using the temperature sensor 220 when the vibration device 210 vibrates.

[0152] In an embodiment, in operation 1503, the electronic device 200 may determine the driving voltage change value of the vibration device 210 based on a pre-stored table including voltages for each temperature. For example, the electronic device 200 (e.g., the processor 250) may acquire a table including voltages for each temperature pre-stored in the memory 260 in response to acquisition of the driving temperature. In the case where a vibration frequency less than the resonant frequency of the vibration device 210 at room temperature is determined as the driving frequency, the electronic device 200 (e.g., the processor 250) may determine the driving frequency so that the driving voltage decreases in proportion to an increase in the driving temperature relative to the room temperature.

[0153] In an embodiment, in operation 1505, the electronic device 200 may acquire the vibration amount output from the vibration device 210 in response to the driving voltage having applied the determined driving voltage change value. For example, the electronic device 200 (e.g., the processor 250) may acquire an electrical signal caused by the vibration of the vibration device 210 by using an acceleration sensor (not shown) (e.g., the sensor module 176), and acquire the vibration amount of the vibration device 210 based on the electrical signal. In an embodiment, the electronic device 200 (e.g., the processor 250) may acquire the back electromotive force or impedance of the vibration device 210 and acquire the vibration amount.

[0154] In an embodiment, in operation 1507, the electronic device 200 may determine a driving voltage for causing the vibration device 210 to output a target vibration amount based on the acquired vibration amount. For example, in the case where the vibration amount of the vibration device 210 increases compared to the target vibration amount, the electronic device 200 (e.g., the processor 250) may reduce the driving voltage of the vibration device 210 in proportion to the increase in the vibration amount relative to the target vibration amount. The electronic device 200 (e.g., the processor 250) may transmit the reduced driving voltage to the vibration device IC 230. The vibration device IC 230 may acquire (or generate) a driving signal of the vibration device 210 based on the acquired driving voltage. The vibration device 210 may vibrate with the driving voltage according to the acquired driving signal. Even at high temperatures, the electronic device 200 (e.g., the processor 250) may keep the vibration force of the vibration device 210 constant by reducing the driving voltage in proportion to the increase in the vibration amount of the vibration device 210.

[0155] Embodiments may provide an electronic device (eg, Figure 2 The electronic device 200 in the embodiment includes: a vibration device (eg, Figure 2 a vibration device 210 in the vibrating device 210); at least one processor (e.g., Figure 2 , which is electrically connected to the vibration device (e.g., Figure 2 210); and a memory (eg, Figure 1 Memory 130 and / or Figure 2 The electronic device (e.g., Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment of the present invention increases or decreases the vibration device (e.g., Figure 2 The vibration frequency of the vibration device 210 in the electronic device (for example, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When executed by the processor 250 in the electronic device (for example, Figure 2 The electronic device 200 in the embodiment is based on the vibration device (eg, Figure 2 When the vibration device 210 in the embodiment vibrates at an increasing or decreasing vibration frequency, the vibration device (e.g., Figure 2 The signal output by the vibration device 210 in the embodiment of the present invention is used to obtain the signal output by the vibration device (for example, Figure 2 The electronic device (e.g., Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When executed by the processor 250 in the electronic device (for example, Figure 2 The electronic device 200 in the embodiment of the present invention determines the vibration frequency as a vibration device (eg, Figure 2 The driving frequency of the vibration device 210 in the embodiment of the present invention is as follows: Figure 2 The output of the vibration device 210 in the embodiment of the present invention at a temperature higher than room temperature is less than the output at room temperature. The electronic device (for example, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment controls the vibration device (eg, Figure 2 The vibration device 210 in the embodiment of the present invention is configured such that the vibration device (eg, Figure 2 The vibration device 210) in the embodiment is driven at a determined driving frequency.

[0156] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment continuously increases the vibration frequency from a preconfigured minimum vibration frequency to a preconfigured maximum vibration frequency.

[0157] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the vibrating device (eg, Figure 2 When the vibration device 210 in the embodiment vibrates at an increasing or decreasing vibration frequency, the vibration device (e.g., Figure 2 The vibration frequency that maximizes the magnitude of the back electromotive force output by the vibration device 210) is used as the resonant frequency.

[0158] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment further comprises: a magnetic field sensor (eg, Figure 2 The magnetic field sensor 240 in the embodiment is configured to receive magnetic field from the vibration device (e.g., Figure 2 The vibrating device 210 in the embodiment of the present invention converts the magnetic field strength output by the vibrating device 210 into a voltage form. The electronic device (for example, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment obtains the magnetic field sensor (eg, Figure 2 The vibration frequency at which the magnitude of the voltage converted by the magnetic sensor 240 is maximized is used as the resonant frequency.

[0159] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment stores the acquired driving frequency in the memory (eg, Figure 2 In the memory 260).

[0160] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in FIG. 1 determines a vibration frequency within a range from the acquired resonance frequency to a pre-configured maximum vibration frequency as the driving frequency.

[0161] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment obtains the vibration device (for example, Figure 2 The electronic device (e.g., Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment of the present invention obtains the vibration device (eg, Figure 2 The driving frequency change value of the vibration device 210 in the electronic device (for example, Figure 2The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment controls the vibration device (eg, Figure 2 The vibration device 210 in the embodiment of the present invention is configured such that the vibration device (eg, Figure 2 The vibration device 210 in FIG. 2 is driven at a driving frequency to which the acquired driving frequency change value has been applied.

[0162] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment obtains the vibration device (for example, Figure 2 The electronic device (e.g., Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment of the present invention obtains the vibration device (eg, Figure 2 The electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment controls the vibration device (eg, Figure 2 The vibration device 210 in the embodiment of the present invention is configured such that the vibration device (eg, Figure 2 The vibration device 210 in FIG. 1 is driven according to the driving voltage to which the acquired driving voltage change value has been applied.

[0163] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment of the present invention obtains a driving voltage from a vibration device (eg, Figure 2 The vibration amount output by the vibration device 210).

[0164] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment determines, based on the acquired vibration amount, to make the vibration device (eg, Figure 2 The vibration device 210 in the embodiment outputs a driving voltage of a target vibration amount.

[0165] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment controls the vibration device (eg, Figure 2 The vibration device 210 in the embodiment of the present invention is configured such that the vibration device (eg, Figure 2 The vibration device 210 in the embodiment is driven according to the determined driving voltage.

[0166] Embodiments may provide the electronic device (eg, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment of the present invention adjusts the driving frequency when a vibration frequency less than the resonance frequency is determined as the driving frequency, so that the driving frequency decreases in proportion to the increase of the driving temperature relative to the room temperature. The electronic device (for example, Figure 2 The electronic device 200 in the embodiment of the present invention, wherein the instruction is executed by the at least one processor (e.g., Figure 2 When the processor 250 in the electronic device executes, the electronic device (for example, Figure 2 The electronic device 200 in the embodiment controls the vibration device (eg, Figure 2 The vibration device 210 in the embodiment of the present invention is configured such that the vibration device (eg, Figure 2 The vibration device 210) is driven at the adjusted driving frequency.

[0167] An electronic device (eg, Figure 2 The method of operating the electronic device 200 in the embodiment may include increasing or decreasing the vibration device (eg, Figure 2 The electronic device (e.g., Figure 2The operation method of the electronic device 200 in the embodiment may include: based on the vibration device (for example, Figure 2 When the vibration device 210 in the embodiment vibrates at an increasing or decreasing vibration frequency, the vibration device (e.g., Figure 2 The signal output by the vibration device 210 in the embodiment of the present invention is used to obtain the signal output by the vibration device (for example, Figure 2 The electronic device (e.g., Figure 2 The method of operating the electronic device 200 in the embodiment may include: determining the vibration frequency as a vibration device (eg, Figure 2 The vibration device 210 in the embodiment of the present invention is operated at a driving frequency at which the vibration device (e.g., Figure 2 The output of the vibration device 210 in the electronic device at a temperature higher than room temperature is less than the output at room temperature. Figure 2 The operation method of the electronic device 200 in the embodiment may include: controlling the vibration device (for example, Figure 2 The vibration device 210 in the embodiment of the present invention is configured such that the vibration device (eg, Figure 2 The vibration device 210 in the embodiment is driven to operate at a determined driving frequency.

[0168] In an embodiment, the operation of increasing or decreasing the vibration frequency may include an operation of continuously increasing the vibration frequency from a preconfigured minimum vibration frequency to a preconfigured maximum vibration frequency.

[0169] In an embodiment, the operation of obtaining the resonant frequency of the vibration device may include: obtaining the resonant frequency of the vibration device (for example, Figure 2 When the vibration device 210 in the embodiment vibrates at an increasing or decreasing vibration frequency, the vibration device (e.g., Figure 2 The vibration device 210 in the embodiment operates at a vibration frequency that maximizes the magnitude of the back electromotive force outputted therefrom as the resonant frequency.

[0170] In an embodiment, obtaining the vibration device (eg, Figure 2 The operation of measuring the resonant frequency of the vibration device 210 in the embodiment may include: obtaining the resonance frequency of the vibration device 210 in the embodiment of the present invention by the magnetic field sensor (for example, Figure 2 The magnetic field sensor 240 in the vibrating device (eg, Figure 2 The magnetic field strength output by the vibration device 210) is converted into a voltage form.

[0171] In an embodiment, the electronic device (e.g., Figure 2 The operating method of the electronic device 200 in the embodiment may further include: storing the acquired driving frequency in a memory (eg, Figure 2Operations in the memory 260).

[0172] In an embodiment, a vibration device (e.g., Figure 2 The vibration device 210 in FIG. 2 is determined to have a vibration frequency at which the output at a temperature higher than room temperature is less than the output at room temperature (for example, Figure 2 The operation of adjusting the driving frequency of the vibration device 210 in the embodiment may include: determining a vibration frequency within a range from the acquired resonance frequency to a pre-configured maximum vibration frequency as the driving frequency.

[0173] In an embodiment, the electronic device (e.g., Figure 2 The method for operating the electronic device 200 in the embodiment may further include: obtaining the vibration device (for example, Figure 2 In an embodiment, the electronic device (e.g., Figure 2 The operating method of the electronic device 200 in the embodiment may further include: obtaining the vibration device (for example, Figure 2 The electronic device (e.g., Figure 2 The method for operating the electronic device 200 in the embodiment may further include: controlling the vibration device (for example, Figure 2 The vibration device 210 in the embodiment of the present invention is configured such that the vibration device (eg, Figure 2 An operation in which the vibration device 210 in the embodiment is driven at a driving frequency to which the acquired driving frequency change value has been applied.

[0174] In an embodiment, the electronic device (e.g., Figure 2 The method for operating the electronic device 200 in the embodiment may further include: obtaining the vibration device (for example, Figure 2 In an embodiment, the electronic device (e.g., Figure 2 The operating method of the electronic device 200 in the embodiment may further include: obtaining the vibration device (for example, Figure 2 The electronic device (e.g., Figure 2 The method for operating the electronic device 200 in the embodiment may further include: controlling the vibration device (for example, Figure 2 The vibration device 210 in the embodiment of the present invention is configured such that the vibration device (eg, Figure 2 An operation in which the vibration device 210 in the embodiment is driven according to the driving voltage to which the acquired driving voltage change value has been applied.

[0175] In an embodiment, the electronic device (e.g., Figure 2 The method for operating the electronic device 200 in the embodiment may further include: obtaining a driving voltage from the vibration device (eg, Figure 2 In an embodiment, the electronic device (e.g., Figure 2 The method for operating the electronic device 200 in the embodiment may further include: determining, based on the acquired vibration amount, a method for causing the vibration device (eg, Figure 2 The vibration device 210 in the electronic device outputs a driving voltage of a target vibration amount. Figure 2 The method for operating the electronic device 200 in the embodiment may further include: controlling the vibration device (for example, Figure 2 The vibration device 210 in the embodiment of the present invention is configured such that the vibration device (eg, Figure 2 The vibration device 210 in the embodiment is driven according to the determined driving voltage.

[0176] In the case where a vibration frequency lower than the resonance frequency is determined as the driving frequency, the electronic device (eg, Figure 2 The operating method of the electronic device 200 in the embodiment may further include: adjusting the driving frequency so that the driving frequency decreases in proportion to an increase in the driving temperature relative to the room temperature.

[0177] The electronic device (e.g., Figure 2 The method for operating the electronic device 200 in the embodiment may further include: controlling the vibration device (for example, Figure 2 The vibration device 210 in the embodiment of the present invention is configured such that the vibration device (eg, Figure 2 The vibration device 210 in the embodiment is driven according to the adjusted driving frequency.

[0178] The electronic device according to an embodiment of the present disclosure may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0179] It should be understood that the embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the noun corresponding to the item in the singular form may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0180] As used in conjunction with embodiments of the present disclosure, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0181] The embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and run the at least one instruction. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0182] According to an embodiment, the method according to an embodiment of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0183] According to an embodiment, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some of the multiple entities may be separately arranged in different components. According to an embodiment, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components before integration. According to an embodiment, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

[0184] In addition, the structure of the data used in the embodiments of the present disclosure can be recorded in a non-transitory computer-readable recording medium by various means. The computer-readable recording medium may include recording media such as magnetic recording media (e.g., ROM, floppy disk, hard disk, etc.) and optical reading media (e.g., CD-ROM, DVD, etc.).

[0185] Although the present disclosure has been specifically shown and described with reference to the exemplary embodiments of the present disclosure, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims. Therefore, the disclosed embodiments should be considered in an illustrative sense rather than a restrictive sense. It should be understood that the scope of the present disclosure falls within the appended claims rather than in the detailed description, and all changes within the scope of equivalence are included in the present disclosure.

Claims

1. An electronic device (101; 200), comprising: Vibration device (179; 210; 300); at least one processor (120; 250) electrically connected to the vibration device (179; 210; 300); and Memory, storage instructions, Wherein, when the instructions are executed by the at least one processor (120; 250), the electronic device (101; 200): increasing or decreasing the vibration frequency of the vibration device (179; 210; 300) during a preconfigured time period; obtaining a resonant frequency of the vibration device (179; 210; 300) based on a signal output from the vibration device (179; 210; 300) when the vibration device (179; 210; 300) vibrates at an increased or decreased vibration frequency; Based on the acquired resonance frequency, determining a vibration frequency as a driving frequency of the vibration device (179; 210; 300), at which the output of the vibration device (179; 210; 300) at a temperature higher than room temperature is smaller than the output at the room temperature; as well as The vibration device (179; 210; 300) is controlled so that the vibration device (179; 210; 300) is driven at the determined driving frequency.

2. The electronic device (101; 200) according to claim 1, wherein: The instructions, when executed by the at least one processor (120; 250), cause the electronic device (101; 200) to continuously increase the vibration frequency from a preconfigured minimum vibration frequency to a preconfigured maximum vibration frequency.

3. The electronic device (101; 200) according to claim 1 or claim 2, wherein: The instructions, when executed by the at least one processor (120; 250), cause the electronic device (101; 200) to obtain, as the resonant frequency, a vibration frequency that maximizes the magnitude of a back electromotive force output from the vibration device (179; 210; 300) when the vibration device (179; 210; 300) vibrates at an increasing or decreasing vibration frequency.

4. The electronic device (101; 200) according to any one of claims 1 to 3, further comprising: A magnetic field sensor (176; 240) configured to convert the magnetic field intensity output from the vibration device (179; 210; 300) into a voltage form, Wherein, when the instructions are executed by the at least one processor (120; 250), the electronic device (101; 200) obtains the vibration frequency that maximizes the magnitude of the voltage converted by the magnetic field sensor (176; 240) as the resonant frequency.

5. The electronic device (101; 200) according to any one of claims 1 to 4, wherein: When the instructions are executed by the at least one processor (120; 250), the electronic device (101; 200) stores the acquired driving frequency in the memory (130; 260).

6. The electronic device (101; 200) according to any one of claims 1 to 5, wherein: When the instructions are executed by the at least one processor (120; 250), the electronic device (101; 200) determines a vibration frequency within a range from the acquired resonance frequency to a preconfigured maximum vibration frequency as the driving frequency.

7. The electronic device (101; 200) according to any one of claims 1 to 6, wherein: The instructions, when executed by the at least one processor (120; 250), cause the electronic device (101; 200): Obtaining a driving temperature of the vibration device (179; 210; 300); acquiring a driving frequency change value of the vibration device (179; 210; 300) based on the driving temperature and a pre-stored table including frequencies for each temperature; and The vibration device (179; 210; 300) is controlled so that the vibration device (179; 210; 300) is driven at a driving frequency to which the acquired driving frequency change value has been applied.

8. The electronic device (101; 200) according to any one of claims 1 to 7, wherein: The instructions, when executed by the at least one processor (120; 250), cause the electronic device (101; 200): Obtaining a driving temperature of the vibration device (179; 210; 300); acquiring a driving voltage change value of the vibration device (179; 210; 300) based on the driving temperature and a pre-stored table including voltages for each temperature; as well as The vibration device (179; 210; 300) is controlled so that the vibration device (179; 210; 300) is driven according to the driving voltage to which the acquired driving voltage change value has been applied.

9. The electronic device (101; 200) according to any one of claims 1 to 8, wherein: The instructions, when executed by the at least one processor (120; 250), cause the electronic device (101; 200): acquiring the amount of vibration output from the vibration device (179; 210; 300) in response to application of a drive voltage having the acquired drive voltage change value; Determining a driving voltage that causes the vibration device (179, 210, 300) to output a target vibration amount based on the acquired vibration amount; as well as The vibration device (179; 210; 300) is controlled so that the vibration device (179; 210; 300) is driven according to the determined driving voltage.

10. The electronic device (101; 200) according to any one of claims 1 to 9, wherein: The instructions, when executed by the at least one processor (120; 250), cause the electronic device (101; 200): In a case where a vibration frequency lower than the resonance frequency is determined as the driving frequency, adjusting the driving frequency so that the driving frequency decreases in proportion to an increase in the driving temperature relative to the room temperature; as well as The vibration device (179; 210; 300) is controlled so that the vibration device (179; 210; 300) is driven at an adjusted driving frequency.

11. An operating method of an electronic device (101, 200), the operating method comprising: increasing or decreasing the vibration frequency of the vibration device (179; 210; 300) during a preconfigured time period; obtaining a resonant frequency of the vibration device (179; 210; 300) based on a signal output from the vibration device (179; 210; 300) when the vibration device (179; 210; 300) vibrates at an increased or decreased vibration frequency; Based on the acquired resonance frequency, determining a vibration frequency as a driving frequency of the vibration device (179; 210; 300), at which the output of the vibration device (179; 210; 300) at a temperature higher than room temperature is smaller than the output at the room temperature; as well as The vibration device (179; 210; 300) is controlled so that the vibration device (179; 210; 300) is driven at the determined driving frequency.

12. The operating method according to claim 11, wherein: The step of increasing or decreasing the vibration frequency comprises: The vibration frequency is continuously increased from a preconfigured minimum vibration frequency to a preconfigured maximum vibration frequency.

13. The operating method according to claim 11 or claim 12, wherein: The step of obtaining the resonant frequency of the vibration device (179; 210; 300) comprises: The vibration frequency that maximizes the magnitude of the back electromotive force output from the vibration device (179; 210; 300) when the vibration device (179; 210; 300) vibrates at an increasing or decreasing vibration frequency is obtained as the resonant frequency.

14. The operating method according to any one of claims 11 to 13, wherein: The step of obtaining the resonant frequency of the vibration device (179; 210; 300) includes: obtaining a vibration frequency that maximizes the magnitude of a voltage converted by a magnetic field sensor (176; 240) as the resonant frequency, wherein the magnetic field sensor (176; 240) is configured to convert the magnetic field intensity output from the vibration device (179; 210; 300) into a voltage form.

15. The operating method according to any one of claims 11 to 14, further comprising: The acquired driving frequency is stored in the memory (130; 260).

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