Electronic device including waterproof structure

Abstract

An electronic device according to an embodiment disclosed in this document may include a housing surrounding a display, a rear cover facing a front cover, and / or an interior space formed between the display and the rear cover. The housing may include a first housing including a first plate portion at least partially facing the display, and a first sidewall surrounding an edge of the first plate portion. The housing may include a second housing including a second plate portion coupled with the rear cover and a second sidewall surrounding an edge of the second plate portion and disposed to be spaced apart on an outer side of at least a portion of the first sidewall. A gap extending from a separation space between the first side wall and the second side wall may be formed between the first housing and the second housing. The first side wall may include a channel extending concavely in a peripheral direction of the electronic device with an upper portion thereof open toward the gap.

Description

Technical Field

[0001] The present disclosure relates to a waterproof structure provided in a portion of a housing and an electronic device including the waterproof structure. Background Art

[0002] The term "electronic device" may refer to a device that performs a specific function based on a setup program, such as a household appliance, an electronic scheduler, a portable multimedia player, a mobile communication terminal, a tablet PC, a video / audio device, a desktop PC / notebook PC, or a vehicle navigation system. For example, these electronic devices may output stored information as sound or images. With the increase in demand for mobile communications and the integration of electronic devices, various technologies are being developed to enhance the portability of electronic devices and improve the convenience of users using multimedia functions, etc. Summary of the invention

[0003] Technical Solution

[0004] An electronic device according to an embodiment disclosed herein may include a display, a front surface cover, a rear surface cover facing the front surface cover, and / or a shell around an internal space formed between the display and the rear surface cover. The shell may include a first shell, the first shell including a first plate portion at least partially facing the display and a first side wall around the periphery of the first plate portion. The shell may include a second shell and a second side wall, the second shell including a second plate portion coupled to the rear surface cover, the second side wall surrounding the periphery of the second plate portion and spaced apart from at least a portion of the first side wall on the outside. Between the first shell and the second shell, a gap may extend from the separation space between the first side wall and the second side wall. The first side wall may include a channel, the channel extending concavely along the peripheral direction of the electronic device in the form of an upper portion thereof opening to the gap. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment disclosed herein.

[0006] Figure 2 is a front perspective view of an electronic device according to an embodiment disclosed herein.

[0007] Figure 3 is a rear perspective view of an electronic device according to an embodiment disclosed herein.

[0008] Figure 4 is an exploded perspective view of an electronic device according to an embodiment disclosed herein.

[0009] Figure 5 is a diagram illustrating a waterproof structure of an electronic device according to an embodiment disclosed herein.

[0010] Figure 6 yes Figure 5 Enlarged view of part a in the middle.

[0011] Figure 7 It is along Figure 5 A cross-sectional view taken along line AA' in FIG.

[0012] Figure 8 It is along Figure 5 A cross-sectional view taken along line BB' in FIG.

[0013] Fig. 9 It is along Figure 5 A cross-sectional view taken along line CC'.

[0014] Fig.10 is a diagram illustrating a first housing and a channel of an electronic device according to an embodiment disclosed herein.

[0015] Fig.11 yes Fig. 9 Detail of part b.

[0016] Fig.12 is a view showing a portion of a second housing and a rib of an electronic device according to an embodiment disclosed herein.

[0017] Fig.13 yes Fig.12 Detailed view of section c.

[0018] Fig.14 2 is a view showing a first housing, a second housing, and a waterproof structure of an electronic device according to an embodiment disclosed herein.

[0019] Fig.15 yes Fig.14 An enlarged view of part e.

[0020] Fig.16 It is along Fig.15 A cross-sectional view taken along line D-D'.

[0021] Fig.17 yes Fig.14 An enlarged view of part f.

[0022] Fig.18 It is along Fig.17 A cross-sectional view taken along line EE'.

[0023] Fig.19 It is along Fig.18 A cross-sectional view taken along line F-F'. DETAILED DESCRIPTION

[0024] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0025] refer to Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0026] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0027] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0028] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0029] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0030] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0031] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing records. The receiver may be used to receive incoming calls. Depending on the embodiment, the receiver may be implemented as being separated from the speaker, or as part of the speaker.

[0032] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0033] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0034] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0035] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0036] The connection end 178 may include a connector, via which the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0038] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0039] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0040] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0041] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0042] The wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies, such as new radio (NR) access technologies. NR access technologies can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0043] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element, the radiating element being formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, for example, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0044] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0045] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0046] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be the same device as the electronic device 101, or a different type of device from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0047] In the following detailed description, the length direction, width direction and / or thickness direction of the electronic device may be mentioned. The length direction may be defined as the "Y-axis direction", the width direction may be defined as the "X-axis direction", and / or the thickness direction may be defined as the "Z-axis direction". In an embodiment, the direction of component orientation may be mentioned together with the orthogonal coordinate system shown in the accompanying drawings and the "negative / positive sign (- / +)". For example, the front surface of the electronic device or housing may be defined as the "surface oriented in the +Z direction", and the rear surface may be defined as the "surface oriented in the -Z direction". In an embodiment, the side surface of the electronic device or housing may include: an area oriented in the +X direction, an area oriented in the +Y direction, an area oriented in the -X direction, and / or an area oriented in the -Y direction. In another embodiment, the "X-axis direction" may include the "-X direction" and the "+X direction". It should be noted that these are based on the orthogonal coordinate system shown in the accompanying drawings for the convenience of concise description, and the description of these directions or components is not limited to the embodiments disclosed herein. For example, depending on whether the electronic device is in an unfolded state or a folded state, the direction of the aforementioned front surface or rear surface may change, and the aforementioned direction may be interpreted differently depending on the user's holding habits.

[0048] Figure 2 and Figure 3 The configuration of the electronic device 200 may be Figure 1 The configurations of the electronic devices 101 are completely or partially the same.

[0049] Figure 2 is a front perspective view of an electronic device according to an embodiment disclosed herein. Figure 3 is a rear perspective view of an electronic device according to an embodiment disclosed herein.

[0050] refer to Figure 2 and Figure 3 According to an embodiment, the portable electronic device 101 may include a housing 210, the housing 210 including a front surface 210A, a rear surface 210B, and a side surface 210C surrounding a space between the front surface 210A and the rear surface 210B. In an embodiment (not shown), the term "housing 210" may refer to a housing defining a portion of the housing 210. Figure 2 The front surface 210A of Figure 3The structure of some of the rear surface 210B and side surfaces 210C. According to an embodiment, at least a portion of the front surface 210A can be formed by a substantially transparent front surface plate portion 202 (e.g., a glass plate portion or a polymer plate portion including various coatings). The rear surface 210B can be provided by a rear surface cover 211. The rear surface cover 211 can be made of, for example, glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of two or more of these materials. The side surface 210C can be defined by a side surface frame structure (or "side wall") 218 ​​coupled to the front surface plate portion 202 and the rear surface cover 211 and including metal and / or polymer. In an embodiment, the rear surface cover 211 and the side surface frame structure 218 can be integrally formed and can include the same material (e.g., glass, a metal material such as aluminum, or ceramic).

[0051] refer to Figure 2 According to an embodiment, the front surface plate portion 202 may include two first edge regions 210D on opposite sides of the long sides, the two first edge regions 210D being bent from the front surface 210A toward the rear surface cover 211 and extending seamlessly. Figure 3 According to an embodiment, the rear surface cover 211 may include two second edge areas 210E on opposite sides of the long side, and the two second edge areas 210E are bent from the rear surface 210B to the front surface plate portion 202 and extend seamlessly. In an embodiment, the front surface plate portion 202 (or the rear surface cover 211) may include only one of the first edge areas 210D (or the second edge areas 210E). In an embodiment, some of the first edge areas 210D or the second edge areas 210E may not be included. For example, when viewed from the side of the electronic device 101, the side surface frame structure 218 may have a first thickness (or width) on the side surface that does not include the first edge area 210D or the second edge area 210E. For example, when viewed from the side of the electronic device 101, the side surface frame structure 218 may have a second thickness that is thinner than the first thickness on the side surface that includes the first edge area 210D or the second edge area 210E.

[0052] According to an embodiment, the electronic device 101 may include a display 201, audio modules 203, 207, and 214 (eg, Figure 1 audio module 170 in the example), sensor module (e.g., Figure 1 sensor module 176 in), camera modules 205, 212 and 213 (e.g., Figure 1 , a camera module 180 in the example, a key input device 217 (eg, Figure 1 150) and connector holes 208 and 209 (e.g., Figure 1In an embodiment, in the electronic device 101, at least one component (eg, the connector hole 209) may be omitted, or other components may be additionally included.

[0053] According to an embodiment, the display 201 may be visually exposed through, for example, a large portion of the front surface plate portion 202. In an embodiment, at least a portion of the display 201 may be visually exposed through the front surface plate portion 202 defining the front surface 210A and the first edge region 210D. In an embodiment, the periphery of the display 201 may be formed to be substantially the same shape as the periphery of the adjacent front surface plate portion 202. In an embodiment (not shown), the distance between the periphery of the display 201 and the periphery of the front surface plate portion 202 may be substantially constant so as to expand the visually exposed area of ​​the display 201.

[0054] According to an embodiment, the surface of the housing 210 (or the front surface plate portion 202) may include a screen display area provided when the display 201 is visually exposed. For example, the screen display area may include the front surface 210A and the first edge area 210D.

[0055] In an embodiment (not shown), the screen display area (e.g., the front surface 210A and the first edge area 210D) of the display 201 may have a recess or opening disposed in a portion thereof, and may include at least one of an audio module 214, a sensor module (not shown), a light emitting element (not shown), and a camera module 205 aligned with the recess or opening. According to an embodiment (not shown), the rear surface of the screen display area of ​​the display 201 may include at least one of an audio module 214, a sensor module (not shown), a camera module 205, a fingerprint sensor (not shown), and a light emitting element (not shown). According to an embodiment (not shown), the display 201 may be coupled to a touch-sensitive circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer configured to detect an electromagnetic field type stylus, or the display 201 may be disposed adjacent to them. According to an embodiment, at least some of the key input devices 217 may be disposed in the first edge area 210D and / or the second edge area 210E.

[0056] According to an embodiment, the audio module 203, 207 and 214 may include, for example, a microphone hole 203 and speaker holes 207 and 214. A microphone configured to obtain external sound may be placed in the microphone hole 203, and in an embodiment, multiple microphones may be placed to detect the direction of the sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a communication receiver hole 214. In an embodiment, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without the speaker holes 207 and 214. The audio module 203, 207 or 214 is not limited to the above structure, and various changes may be made in design by installing only some audio modules or by adding new audio modules according to the structure of the electronic device 101.

[0057] According to an embodiment, the sensor module (not shown) may generate, for example, an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 101. The sensor module (not shown) may include, for example, a first sensor module (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the front surface 210A of the housing 210, and / or a third sensor module (e.g., an HRM sensor) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on the rear surface 210B of the housing 210. In an embodiment (not shown), the fingerprint sensor may be disposed not only on the front surface 210A (e.g., the display 201) of the housing 210, but also on the rear surface 210B. The electronic device 101 may further include at least one of the following sensor modules (not shown): a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor. The sensor module is not limited to the above-mentioned structure, and may be variously changed in design according to the structure of the electronic device 101, for example, by installing only some sensor modules or by adding new sensor modules.

[0058] According to an embodiment, the camera modules 205, 212 and 213 may include, for example, a front camera module 205 disposed on the front surface 210A of the electronic device 101, a rear camera module 212 disposed on the rear surface 210B and / or a flash 213. The camera modules 205 and 212 may include one or more lenses, an image sensor and / or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In an embodiment, two or more lenses (for example, an infrared camera lens, a wide-angle lens and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 101. The camera modules 205, 212 and 213 are not limited to the above-mentioned structures, and various changes may be made in design according to the structure of the electronic device 101, for example, by installing only some camera modules or by adding new camera modules.

[0059] According to an embodiment, the electronic device 101 may include a plurality of camera modules (e.g., dual cameras or triple cameras) having different properties (e.g., fields of view) or functions, respectively. For example, a plurality of camera modules 205 and 212 including lenses having different fields of view may be provided, and the electronic device 101 may control the change of the fields of view of the camera modules 205 and 212 performed therein based on the user's selection. For example, at least one of the plurality of camera modules 205 and 212 may be a wide-angle camera, and at least one of the other camera modules may be a telephoto camera. Similarly, at least one of the plurality of camera modules 205 and 212 may be a front camera, and at least one of the other camera modules may be a rear camera. In addition, the plurality of camera modules 205 and 212 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time of flight (TOF) camera or a structured light camera). According to an embodiment, the IR camera may be operated as at least a part of a sensor module. For example, a TOF camera may be operated as at least a part of a sensor module (not shown) for detecting the distance of an object.

[0060] According to an embodiment, the key input device 217 may be provided on the side surface 210C of the housing 210. In an embodiment, the electronic device 101 may not include some or all of the above-mentioned key input devices 217, and the key input device 217 not included may be implemented in another form (such as a soft key) on the display 201. In an embodiment, the key input device may include a sensor module 216 provided on the rear surface 210B of the housing 210.

[0061] According to an embodiment, a light emitting element (not shown) may be provided, for example, on the front surface 210A of the housing 210. The light emitting element (not shown) may provide, for example, state information of the electronic device 101 in an optical form. In an embodiment, the light emitting element (not shown) may provide, for example, a light source associated with the operation of the front camera module 205. The light emitting element (not shown) may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0062] According to an embodiment, the connector holes 208 and 209 may include, for example, a first connector hole 208 capable of accommodating a connector configured to send power and / or data to / receive power and / or data from an external electronic device (e.g., a USB connector) and a second connector hole (e.g., a headphone jack) 209 capable of accommodating a connector configured to send audio signals to / receive audio signals from an external electronic device.

[0063] According to an embodiment, some of the camera modules 205 and 212 and / or some of the sensor modules (not shown) may be disposed to be exposed to the outside through at least a portion of the display 201. For example, the camera module 205 may include a pinhole camera disposed inside a hole or recess disposed in the rear surface of the display 201. According to an embodiment, the camera module 212 may be disposed inside the housing 210 so that the lens is exposed to the rear surface 210B of the electronic device 101. For example, the camera module 212 may be disposed on a printed circuit board (e.g., Figure 4 240 in the printed circuit board).

[0064] According to an embodiment, the camera module 205 and / or the sensor module may be arranged from the internal space of the electronic device 101 to the front surface plate portion 202 of the display 201 to contact the external environment through the transparent area. In addition, some sensor modules 204 may be arranged in the internal space of the electronic device to perform their functions without being visually exposed through the front surface plate portion 202.

[0065] Figure 4 is an exploded perspective view of an electronic device 101 according to an embodiment disclosed herein.

[0066] refer to Figure 4 According to the electronic device 101 (eg, Figures 1 to 3 The electronic device 101 in the embodiment may include: a display 220 (eg, Figure 2The display 201 and the front surface plate portion 202 in the first housing 230 (e.g., a bracket), a printed circuit board 240 (e.g., a PCB, a flexible PCB (FPCB) or a rigid flexible PCB (RFPCB)), a battery (not shown) (e.g., Figure 1 The battery 189 in the housing 250 (eg, the rear structure W), the antenna (not shown) (eg, Figure 1 The antenna module 197 in the back surface cover 260 (eg, Figure 2 The rear surface cover 211 in the embodiment of the present invention), the waterproof structure 270, the key assembly 281 (for example, Figure 2 and Figure 3 The electronic device 101 may further include a key input device 217 in the display and a storage medium tray 282. The electronic device 101 may also include a camera module (eg, camera modules 205, 212, and 213).

[0067] In an embodiment, in the electronic device 101 , at least one of the above components may be omitted, or other components may be additionally included. Figure 4 The configuration of the electronic device 101 may be Figure 2 and / or Figure 3 The configuration of the electronic device 101 is completely or partially the same or similar, and redundant description will be omitted below.

[0068] In an embodiment, the first housing 230 may include a first side wall 231 and a first plate portion 232. As an example, refer to Figure 7 For convenience, the first side wall 231 and the first plate portion 232 may be based on Figure 7 According to an embodiment, the first side wall 231 may form at least a portion of the exterior of the electronic device 101 (eg, Figure 2 and Figure 3 For example, the configuration of the first side wall 231 may be similar to Figure 2The configuration of the side surface frame structure 218 in the embodiment is the same or similar. For example, the first shell 230 can be made of a metal material and / or a non-metallic (e.g., polymer) material. According to an embodiment, the first side wall 231 can be together with the second side wall 251 of the second shell 250 described below, surrounding the internal space formed between the first plate portion 232 and the second plate portion 252 of the electronic device 101. For example, components including electrical components and / or electronic components (e.g., a printed circuit board 240 and / or a battery (not shown)) can be arranged in the internal space. According to an embodiment, the first side wall 231 can be formed along the periphery (or periphery) of the first plate portion 232. According to an embodiment, the first side wall 231 may include: a (1-1)th side wall 231a (a side wall in the +Y direction) disposed at an upper end of the electronic device (forming a portion of the upper end), a (1-2)th side wall 231b (a side wall in the -Y direction) disposed at a lower end of the electronic device (forming a portion of the lower end), a (1-3)th side wall 231c (a side wall in the -X direction), and / or a fourth side wall 231d (a side wall in the +X direction).

[0069] According to an embodiment, the first board portion 232 may be disposed inside the electronic device 101 and may be connected to the first side wall 231 or may be integrally formed with the first side wall 231. According to an embodiment, one surface (e.g., the front surface or the surface in the +Z direction) of the first board portion 232 may at least partially face the display 220. For example, the display 220 may be coupled to the first side wall 231 and / or the first board portion 232. According to an embodiment, the printed circuit board 240 may be disposed on the other surface of the first board portion 232, the other surface facing away from the surface on which the display 220 is disposed.

[0070] According to an embodiment, a processor (e.g., Figure 1 processor 120 in the processor 120), memory (e.g., Figure 1 The memory 130 in the first board portion 232) and / or the interface (e.g., the interface 177) may be mounted on the printed circuit board 240. The processor may include, for example, at least one of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to an embodiment, the printed circuit board 240 may include a flexible printed circuit board type radio frequency cable (FRC). For example, the printed circuit board 240 may be provided on at least a portion of the first board portion 232 and may be electrically connected to the antenna module (e.g., Figure 1 The antenna module 197 in the embodiment of the present invention) and the communication module (eg, Figure 1 The communication module 190 in FIG.

[0071] Depending on the embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0072] According to an embodiment, the interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect, for example, the electronic device 101 to an external electronic device 101, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0073] According to an embodiment, the battery (not shown) is a device that supplies power to at least one component of the electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable storage battery, or a fuel cell. At least a portion of the battery (not shown) may be disposed on a substantially same plane as, for example, the printed circuit board 240. The battery (not shown) may be integrally disposed inside the electronic device 101, or may be detachably disposed on the electronic device 101.

[0074] In an embodiment, the second housing 250 may include a second side wall 251 and a second plate portion 252. In an embodiment, the second side wall 251 and the second plate portion 252 may be integrally formed. Figure 7 For convenience, the second side wall 251 and the second plate portion 252 may be based on Figure 7 . For example, the second board portion 252 may be disposed inside the electronic device 101. According to an embodiment, the second housing 250 may be disposed between the printed circuit board 240 and the antenna (not shown). For example, on one surface of the second board portion 252 (e.g., the front surface or the surface in the +Z direction), the printed circuit board 240 and / or the battery (not shown) may be disposed, and on another surface (e.g., the rear surface or the surface in the -Z direction), the antenna (not shown) may be disposed. For example, the second housing 250 may be made of a metal material and / or a non-metallic (e.g., polymer) material.

[0075] According to an embodiment, the second side wall 251 may be formed along the periphery (or circumference) of the second plate portion 252. For example, the configuration of the second side wall 251 may be similar to that of the second plate portion 252. Figure 2 In an embodiment, the second side wall 251 may be together with the first side wall 231 of the first housing 230 to surround the internal space formed between the first plate portion 232 and the second plate portion 252 of the electronic device 101. For example, the second side wall 251 may be together with the first side wall 231 to form the exterior of the electronic device 101 (e.g., Figure 2 and Figure 3 For example, the second side wall 251 and the first side wall 231 may define a gap therebetween (eg, Figure 6The gap G1 in the middle), but may form a side surface substantially connected to the outside (e.g., Figure 2 and Figure 3 According to an embodiment, the second side wall 251 may include: a (2-1)th side wall (251a) (a side wall in the +Y direction) provided at an upper end (forming a portion of the upper end) of the electronic device, a (2-2)th side wall 251b (a side wall in the -Y direction) provided at a lower end (forming a portion of the lower end) of the electronic device, a (2-3)th side wall 251c (a side wall in the -X direction), and / or a (2-4)th side wall 251d (a side wall in the +X direction).

[0076] In an embodiment, the key assembly 281 (e.g., Figure 2 and 3 The key input device 217 in the electronic device 101 and / or the storage medium tray 282 may be disposed on a side surface of the electronic device 101 (eg, Figure 2 and Figure 3 For example, the key assembly 281 and / or the storage medium tray 282 may be disposed on the left side surface and the right side surface (eg, Figure 2 and Figure 3 The inside of the side surface 210C).

[0077] In an embodiment, the key assembly 281 may be disposed on a side surface of the electronic device 101 (eg, Figure 2 and Figure 3 According to an embodiment, the (1-4) side wall 231d and / or the (2-4) side wall 251d may include an accommodation area (not shown) that is partially deleted or perforated to accommodate the key assembly 281. For example, the key assembly 281 (e.g., Figure 2 and Figure 3 A portion of the key input device 271 in the (2-4) side wall 251d may enclose the accommodation area (not shown) while being exposed to the outside of the electronic device 101, and may form a portion of the exterior of the electronic device 101 together with the (2-4) side wall 251d. The remaining portion of the key assembly 281 may be disposed within the (2-4) side wall 251d.

[0078] According to an embodiment, the storage medium tray 282 may be provided on a side surface (eg, Figure 2 and Figure 3 The storage medium may be disposed on the storage medium tray 282. The "storage medium" may include a memory card such as an SD card (e.g., Figure 1The external memory 138 in the electronic device 101 or the user identification module (SIM) card. According to an embodiment, the (1-3) side wall 231c and / or the (2-3) side wall 251c may include a mounting area (not shown) that is partially deleted or perforated to accommodate the storage medium tray 282. For example, a portion of the storage medium tray 282 may form a portion of the exterior of the electronic device 101 together with the (2-3) side wall 251c while enclosing the mounting area (not shown). The remaining portion of the storage medium tray 282 may be disposed inside the (2-3) side wall 251c via the mounting area (not shown).

[0079] According to an embodiment, an antenna may be provided between the rear surface cover 260 and a battery (not shown). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device, or wirelessly transmit and receive power required for charging. In an embodiment, the antenna structure may be formed by a portion or combination of the first side wall 231 and / or the first plate portion 232.

[0080] According to an embodiment, the rear surface cover 260 may define a rear surface (eg, Figure 3 at least a portion of the rear surface 210B).

[0081] Figure 5 is a diagram illustrating a waterproof structure of an electronic device according to an embodiment disclosed herein. Figure 6 yes Figure 5 Enlarged view of part a in the middle. Figure 7 It is along Figure 5 A cross-sectional view taken along line AA' in FIG. Figure 8 It is along Figure 5 A cross-sectional view taken along line BB' in FIG. Fig. 9 It is along Figure 5 A cross-sectional view taken along line CC'.

[0082] refer to Figures 5 to 9 In an embodiment, the first housing 230 and the second housing 250 may be arranged such that the first plate portion (eg, Figure 4 The first plate portion 232 in the embodiment of the present invention and the second plate portion (e.g., Figure 4 According to an embodiment, the first housing 230 and the second housing 250 may enclose a display (eg, Figure 4 The internal space (or the internal space of the electronic device) is defined between the display 220 of the display 220 and the rear surface cover 260. For example, various internal components such as electrical components and / or electronic components (e.g., printed circuit board 240 and / or battery (not shown)) can be disposed in the “internal space”.

[0083] In an embodiment, the first housing 230 and the second housing 250 can be manufactured separately and coupled to form a housing assembly. For example, the first housing 230 and / or the second housing 250, including the sidewalls 231 and 251, can correspond to the coupling area between the two housings. According to an embodiment, the first housing 230 and the second housing 250 can be positioned so that the sidewalls 231 and 251 and the portions extending from the sidewalls 231 and 251 of the plate portions 232 and 252 are arranged to have an air gap between them. For example, the air gap can be referred to as "gap G1" (e.g., assembly gap G1). For example, "gap G1" can be formed by the first sidewall 231, the first plate portion 232, the second sidewall 251 and / or the second plate portion 252. For example, the gap G1 can be formed along the entire or partial periphery of the electronic device 101 (or the periphery of the first housing 230 and / or the second housing 250). For example, the "gap G1" may form a path from a separation space between the two side walls 231 and 251 to the internal space of the electronic device 101, wherein an external fluid (e.g., water W) initially enters the electronic device 101 from the separation space. For example, the internal space of the electronic device 101 may be connected to an external fluid of the electronic device 101 through the gap G1. For example, the gap G1 may serve as part of an air-vent. For example, the gap G1 may be connected to an area formed as a penetration or recessed area in the first side wall 231 and / or the second side wall 251, such as a microphone hole (e.g., Figure 2 and Figure 3 Microphone hole 203 in the middle), speaker hole (e.g., Figure 2 speaker holes 207 and 214 in the housing), connector holes (e.g., Figure 2 and Figure 3 208 and 209 in the display 200), and / or a through hole for accommodating the key assembly 281 or the storage medium tray 282. However, the configuration of the housings 230 and 250 and the gap G1 is not limited to the above description. For example, the first housing 230 and the second housing 250 may be configured as an integral single housing member, and the "gap G1" may refer to the gap G1 provided between the housing member and the display 220.

[0084] refer to Figure 5 and Figure 6In an embodiment, the two side walls 231 and 251 may at least partially overlap each other. For example, when viewed from the length direction (Y-axis direction) of the electronic device 101, the two side walls 231 and 251 may at least partially overlap each other. According to an embodiment, a surface of a portion of the first side wall 231 may form a portion of the exterior of the electronic device 101 together with the second side wall 251, while another portion may be disposed inside the electronic device 101. For example, another portion of the first side wall 231 may overlap with at least a portion of the second side wall 251, and may be disposed below the second side wall 251 (in the -Z-axis direction).

[0085] In an embodiment, the electronic device 101 may include an audio hole 291 located on one side surface. For example, the audio hole 291 may be a microphone hole (eg, Figure 2 and Figure 3 Microphone hole 203 in the middle), external speaker hole (e.g., Figure 2 and Figure 3 ), or an external receiver hole (e.g., Figure 2 and Figure 3 According to an embodiment, the audio hole 291 may be formed through the first side wall 231 and / or the second side wall 251.

[0086] refer to Figure 5 In an embodiment, the electronic device 101 (eg, Figure 1 , Figure 2 , Figure 3 and / or Figure 4 The waterproof structure 270 of the electronic device 101 in the embodiment may include: one or more channels 271 and 272 provided in the first shell 230 , and one or more ribs 276 and 277 provided in the first shell 230 and / or the second shell 250 .

[0087] In an embodiment, one or more channels 271 and 272 may be provided in the first housing 230 (eg, Figure 4 According to an embodiment, one or more ribs 276 and 277 may be provided in the first housing 230 and / or the second housing 250 (eg, Figure 4 In the second shell 250).

[0088] In an embodiment, a state of the electronic device 101 with a high frequency of use may be referred to as a "basic state" of the electronic device 101. For example, the "basic state" may refer to a state in which the upper side wall (the (1-1)th side wall 231a and / or the (2-1)th side wall 251a) of the electronic device 101 is substantially directed upward and the display 220 is substantially directed forward. For example, external water W may flow into a gap G1 formed in the peripheral direction of the electronic device 101. In the basic state of the electronic device 101, among portions of the gap G1, the upper side wall (the (1-1)th side wall 231a and / or the (2-1)th side wall 251a) of the electronic device 101 is most likely to come into contact with water W outside the electronic device 101. For example, in the basic state of the electronic device 101, water W (such as rainwater) falling in the direction of gravity may flow into the gap G1 between the (1-1)th side wall 231a and the (2-1)th side wall 251a.

[0089] refer to Figures 5 to 9 , according to an embodiment, channels 271 and 272 may be provided on the (1-1)th side wall 231a of the first housing 230 (e.g., the first side wall 231). In an embodiment, channels 271 and 272 may include a first channel 271 and a second channel 272 spaced apart from each other on the surface of the (1-1)th side wall 231a of the first housing 230 (e.g., the first side wall 231). In an embodiment, channels 271 and 272 may be grooves or depressions recessed in the surface of the first side wall 231. In an embodiment, channels 271 and 272 may be connected to the gap G1 in the form of opening to the gap G1. For example, channels 271 and 272 may refer to spaces recessed in the surface of the first side wall 231 and surrounded by these surfaces. According to an embodiment, channels 271 and 272 may substantially face the surface of the second side wall 251 located above it (in the +Y direction). In an embodiment, channels 271 and 272 may also be provided in the second housing 250 (e.g., the second side wall 251). For example, the channels 271 and 272 may be formed in the first sidewall 231 and / or the second sidewall 251. For example, when the channels 271 and 272 are formed in the second sidewall 251, the channels may be referred to as recessed surfaces of the second sidewall 251 and spaces surrounded by these surfaces.

[0090] refer to Figure 6 The channels 271 and 272 may redirect the flow of water W toward the inner space of the electronic device 101 along the peripheral direction of the electronic device 101. Figures 7 to 9, the air resistance of the gap G1 in the portion leading from the channels 271 and 272 to the internal space of the electronic device 101 may be greater than the air resistance at the position of the channels 271 and 272. For example, water W introduced from outside the electronic device 101 may flow into and reach the channels 271 and 272 through the gap G1, and may be guided to flow along the channels 271 and 272 having relatively small air resistance, rather than continuing to flow into the internal space of the electronic device 101 through the channels 271 and 272. For example, all or only a portion of the introduced water W may flow into the channels 271 and 272. For example, water W moving toward the internal space instead of entering the channels 271 and 272 may be blocked by the ribs 276 and 277, which will be described later.

[0091] refer to Figure 5 and Figure 6 According to an embodiment, the first channel 271 extends along the surface of the (1-1)th side wall 231a and may be bent or curved by the structure of the first side wall 231. For example, at least a portion of the first channel 271 may extend in the width direction (X-axis direction) of the electronic device 101. For example, the first channel 271 may be partially interrupted by the first through-region 235 formed through the (1-1)th side wall 231a. For example, water W introduced into the first through-region 235 or the surrounding gap G1 of the first through-region 235 may flow in one direction (e.g., +X direction) along the first channel 271 connected to one side of the first through-region 235. For example, water W introduced into the gap G1 of the first through-region 235 or the adjacent first through-region 235 may flow in the opposite direction (e.g., -X direction) along the first channel 271 connected to the first through-region 235 pointing to the other side opposite to the one side.

[0092] According to an embodiment, the second channel 272 may be disposed on a surface of the (1-1)th side wall 231a and may be spaced apart from the first channel 271. Fig. 9 In an embodiment, the first side wall 231 may be formed such that some areas around the audio hole 291 (in the -Y direction) are lower than other areas (eg, see Figure 8 ). In an embodiment, the (1-1)th side wall 231a around the audio hole 291 may have an offset shape (e.g., a step shape), and the step closer to the rear surface cover 260 may be formed lower (in the -Y direction). For example, the gap G1 between the (1-1)th side wall 231a around the audio hole 291 and the second side wall 251 (or the gap G1 around the audio hole 291) may be formed to be inclined toward the internal space as a whole. Therefore, the gap G1 around the audio hole 291 may be more easily submerged than the gap G1 in other portions having a smaller inclination or substantially parallel to the thickness direction (Z-axis direction) of the electronic device 101.

[0093] According to an embodiment, the first channel 271 and the second channel 272 for supplementing the water blocking function of the first channel 271 may be provided on the surface of the first side wall 231 around the audio hole 291. For example, the step of the (1-1) side wall 231a forming the second channel 272 may be positioned lower than (closer in the -Y direction) the step forming the first channel 271. For example, the second channel 272 may be provided closer to the inside of the electronic device 101 than the first channel 271 of the gap G1. For example, the second channel 272 may be provided closer to the second plate portion 252 of the second housing 250 and the rear surface cover 260 than the first channel 271. For example, when considering the length of the path leading to the internal space of the electronic device 101 along the gap G1, the path in the second channel 272 may be shorter than the path in the first channel 271. For example, the second channel 272 may be closer to the internal space of the electronic device 101 than the first channel 271. However, the position, shape and / or number of the channels 271 and 272 are not limited to the disclosure including the drawings. For example, depending on the structure of the shells 230 and 250 and the relationship with the internal configuration arranged in the internal space, the position and / or shape can be changed and can be additionally set in the shells 230 and 250 (for example, the first side wall 231, the first plate portion 232, the second side wall 251 and / or the second plate portion 252).

[0094] According to an embodiment, at least a portion of the water W introduced into the first channel 271 may move toward the inside of the electronic device 101 along the gap G1 around the audio hole 291, and may be partially or completely blocked by the second rib 277 (described below) located between the first channel 271 and the second channel 272. All or part of the water W that is not blocked by the second rib 277 may be blocked by the second channel 272.

[0095] refer to Figure 5 , the second channel 272 extends along the surface of the (1-1)th side wall 231a, and may be bent or curved by the structure of the first side wall 231. For example, at least a portion of the second channel 272 may extend parallel to (e.g., substantially parallel to) the width direction (X-axis direction) of the electronic device 101 and / or the first channel 271. For example, the second channel 272 may be bent to avoid the audio hole 291. For example, the width of at least a portion of the second channel 272 in the thickness direction (Z-axis direction) of the electronic device 101 may be greater than the width of the first channel 271.

[0096] In an embodiment, the ribs 276 and 277 may include at least one first rib 276 disposed on the first sidewall 231 of the first housing 230 and at least one second rib 277 disposed on the second sidewall 251 of the second housing 250 .

[0097] In an embodiment, the ribs 276 and 277 may protrude from the first side wall 231 or the second side wall 251, and may close at least a portion of the gap G1. For example, when considering the length of the path leading to the internal space of the electronic device 101 along the gap G1, the path in the ribs 276 and 277 may be shorter than the path in the first channel 271, and the path in the second channel 272 may be shorter than the path in the ribs 276 and 277. For example, the ribs 276 and 277 may be disposed closer to the internal space of the electronic device 101 than the first channel 271, and farther away from the internal space of the electronic device 101 than the second channel 272.

[0098] For example, the ribs 276 and 277 may be disposed between the inner space of the electronic device 101 and the first channel 271. For example, the ribs 276 and 277 may additionally block water W that has not flowed into the first channel 271, thereby preventing or mitigating flooding of the inner space of the electronic device 101.

[0099] Fig.10 is a diagram illustrating a first housing and a channel of an electronic device according to an embodiment disclosed herein. Fig.11 yes Fig. 9 Detail of part b. Fig.12 is a view showing a portion of a second housing and a rib of an electronic device according to an embodiment disclosed herein. Fig.13 yes Fig.12 Detailed diagram of section c.

[0100] Fig.10 and Fig.11 The first housing 230 in the embodiment may be referred to as Figures 5 to 9 The first housing 230 is shown. Fig.12 and Fig.13 The second housing 250 in the embodiment may be referred to as Figures 5 to 9 The second housing 250 is shown. Fig.10 and Fig.11 The first channel 271 may be referred to as Figures 5 to 9 The first channel 271. Fig.10 and Fig.11 The second channel 272 may be referred to as Figure 5 and Fig. 9 The second channel 272. Fig.11 The first rib 276 may be referred to as Figure 5 The first rib 276. Fig.12 The second rib 277 in may be referred to as Figure 5 and Figures 7 to 9 The second rib 277.

[0101] refer to Fig.10In an embodiment, the waterproof structure 270 may include a first channel 271 and a second channel 272 disposed in a central portion of the (1-1)th wall 231a of the first wall 231. However, the shapes and arrangements of the first channel 271 and the second channel 272 are not limited to the above description. For example, the first channel 271 and / or the second channel 272 may further extend from a central portion of a surface of the (1-1)th side wall 231a in a width direction (e.g., an X-axis direction) of the electronic device 101. For example, the first channel 271 and / or the second channel 272 may be formed on a surface of the (1-1)th side wall 231a, the (1-2)th side wall 231b, the (1-3)th side wall 231c, and / or the (1-4)th side wall 231d. For example, the first channel 271 may extend from a central portion of the (1-1)th side wall 231a to a portion of the (1-3)th side wall 231c and / or the (1-4)th side wall. However, the position, shape and / or number of the channels 271 and 272 are not limited to the disclosure including the drawings. For example, depending on the structure of the housings 230 and 250 and the relationship with the internal configuration arranged in the internal space, the position and / or shape may be changed and may be additionally provided in the housings 230 and 250 (e.g., the first side wall 231, the first plate portion 232, the second side wall 251 and / or the second plate portion 252).

[0102] According to an embodiment, in a basic state of the electronic device 101 (the upper end sidewalls (the (1-1)th sidewall 231a and the (2-1)th sidewall 251a) of the electronic device 101 face upward), at least a portion of the water W that has flowed into the gap G1 may flow into the first channel 271 and / or the second channel 272. For example, the water W that has flowed into the first channel 271 may flow in the peripheral direction of the electronic device 101. For example, the water W that has flowed into the first channel 271 and / or the second channel 272 may accumulate in the first channel 271 and then be evaporated or released again through any path of the gap G1. For example, the water W that has flowed into the first channel 271 may flow along the first channel 271 and then flow downward along the gap G1 between the (1-3)th sidewall 231c and the (2-3)th sidewall 251c connected to the first channel 271 and / or the gap G1 between the (1-4)th sidewall 231d and the (2-4)th sidewall 251d. For example, in the basic state of the electronic device 101, water W flowing along the gap G1 between the left and right side walls 231c, 231d, 251c, and 251d is guided in the gravity direction (-Y direction), and thus does not penetrate into the electronic device 101 where internal components (such as a printed circuit board (e.g., Figure 4 In the internal space of the printed circuit board 240)).

[0103] refer to Fig.11 In an embodiment, the first rib (eg, Figure 5and Figure 8 The first rib 276 in the (1-1) side wall 231a may be formed to protrude on a portion of the (1-1) side wall 231a. For example, the first rib 276 may be formed on a portion of the core area 253 of the first side wall 231 facing the second side wall 251 described below (e.g., the surface in the +Z direction). According to an embodiment, the first rib 276 may be arranged to be closer to the second plate portion 252 and / or the back cover than the first channel 271 and / or the second channel 272. For example, when considering the length of the path leading to the interior space of the electronic device 101 along the gap G1, the path in the first rib 276 may be shorter than the path in the first channel 271 and / or the second channel 272. For example, the first rib 276 may be closer to the interior space of the electronic device 101 than the first channel 271 and / or the second channel 272. For example, the first rib 276 may protrude toward the second shell 250 (e.g., the second plate portion 252). For example, the first rib 276 may block at least a portion of the gap G1 between the first side wall 231 and the second housing 250 (e.g., the second plate portion 252) facing each other. For example, the first rib 276 may have a protruding shape to substantially contact or slightly separate from the second plate portion 252 facing the first rib.

[0104] refer to Fig.13 In an embodiment, the second sidewall 251 may include an undercut core region 253 located at the center of the (2-1)th sidewall 251a. For example, the core region 253 may be located in a surface of the (2-1)th sidewall 251a facing the (1-1)th sidewall 231a (e.g., a surface in the -Y direction). For example, the core region 253 may have an average thickness (thickness in the Z-axis direction) that is thinner than other regions of the second sidewall 251. For example, components of the electronic device 101 may be arranged in the core region 253. For example, components of the electronic device 101 (such as an audio module (e.g., Figure 2 and Figure 3 203, 207 and 214) and / or a camera module (e.g., Figure 2 and Figure 3 The camera modules 205, 212, and 213 in the embodiment of the present invention may be arranged at least partially in the core area 253. For example, the ... Figure 5 and Fig. 9 The audio port 291 in the communication receiver (e.g., Figure 1 The audio module 170 in the core area 253 may be arranged in the core area 253. According to an embodiment, since the components of the electronic device 101 are arranged, it may be difficult to form ribs (eg, the second ribs 277) in the core area 253. For example, the first rib 276 (eg, Figure 5 and Figure 8The first rib 276 in the figure may be formed in a partial region of the (1-1)th side wall 231 a facing the core region 253 .

[0105] refer to Fig.12 and Fig.13 In an embodiment, the second rib 277 (eg, Figure 5 and Figures 7 to 9 The second rib 277 may protrude in a portion of the (2-1) side wall 251a. According to an embodiment, the second rib 277 may be provided on a surface of the (2-1) side wall 251a facing the (1-1) side wall 231a (e.g., a surface in the -Y direction). In an embodiment, the second rib 277 may extend along the (2-1) side wall 251a, but may be interrupted in some areas depending on the structure of the (2-1) side wall 251a. For example, the second rib 277 may be provided on opposite sides of the core area 253 other than the core area 253 of the (2-1) side wall 251a.

[0106] The position, shape and / or number of the ribs 276 and 277 of the above-described embodiment are not limited to the description of the present disclosure including the drawings. For example, depending on the structure of the housings 230 and 250 and the relationship with the internal configuration arranged in the internal space, the position and / or shape may be changed and may be additionally provided in the housings 230 and 250 (e.g., the first side wall 231, the first plate portion 232, the second side wall 251 and / or the second plate portion 252).

[0107] Fig.14 2 is a diagram illustrating a first housing 230 , a second housing 250 , and a waterproof structure of an electronic device 101 according to an embodiment disclosed herein. Fig.15 yes Fig.14 An enlarged view of part e. Fig.16 It is along Fig.15 A cross-sectional view taken along line D-D'. Fig.17 yes Fig.14 An enlarged view of part f. Fig.18 It is along Fig.17 A cross-sectional view taken along line EE'. Fig.19 It is along Fig.18 A cross-sectional view taken along line F-F'.

[0108] Figures 14 to 19 The configuration of the first housing 230 may be Figures 5 to 9 and / or Fig.10 and Fig.11 The configuration of the first housing 230 is completely or partially the same. Figures 14 to 19 The configuration of the second housing 250 may be Figures 5 to 9 and / or Fig.12 and Fig.13The configuration of the second housing 250 is completely or partially the same. Fig.14 The configuration of the waterproof structure 270 can be Figure 5 The configuration of the waterproof structure 270 is completely or partially the same. Figures 14 to 19 The configuration of the first channel 271 can be Figures 5 to 9 and / or Fig.10 and Fig.11 The configuration of the first channel 271 is completely or partially the same. Fig.14 and Fig.17 The configuration of the second channel 272 can be Figure 5 and Fig. 9 The second channel 272 and / or Fig.12 and Fig.13 The configuration of the second channel 272 is completely or partially the same. Fig.14 , Fig.15 and Fig.17 The configuration of the first rib 276 may be Figure 5 and Figure 8 The first rib 276 and / or Fig.11 The configuration of the first ribs 276 is completely or partially the same. Figures 14 to 16 The configuration of the second rib 277 can be Figure 5 and Figures 7 to 9 and / or Fig.12 and Fig.13 The configuration of the second rib 277 is completely or partially the same.

[0109] refer to Figures 14 to 19 The first channel 271 of the waterproof structure 270 may be formed on the first side wall 231 (eg, Fig.10 and Fig.11 The first side wall 231 in the (1-1) side wall 231a (for example, Fig.10 and Fig.11 On the (1-1) side wall 231a), formed on the entire electronic device 101 (for example, Figure 4 For example, at least a portion of the first channel 271 may extend concavely along the width direction (eg, the X-axis direction) on the (1-1)-th side wall 231a.

[0110] According to an embodiment, the gap G1 formed between the first housing 230 and the second housing 250 may be formed on all or part of the periphery of the electronic device 101 (or the periphery of the first housing 230 and / or the second housing 250). For example, the gap G1 formed between the (1-1) side wall 231a and the (2-1) side wall 251a (or the second plate portion 252) (for example, Figures 6 to 9The gap G1) may extend between the (1-3)th side wall 231c and the (2-3)th side wall 251c (or the second plate portion 252) and / or between the (1-4)th side wall 231d and the (2-4)th side wall 251d (or the second plate portion 252).

[0111] refer to Figures 14 to 19 In an embodiment, the second rib 277 may be formed from the (2-1) side wall 251a (eg, Fig.12 The (2-1) side wall 251a) extends to the (2-3) side wall 251c (for example, Fig.12 The (2-3) side wall 251c) and / or the (2-4) side wall 251d (for example, Fig.12 In an embodiment, the first channel 271 may extend concavely between opposite ends (opposite ends in the X-axis direction) of the (1-3) side wall 231c along the length of the (1-3) side wall 231c. According to an embodiment, the first channel 271 may extend from the (1-1) side wall 231a of the first side wall 231 to the (1-3) side wall 231c (for example, Fig.10 The (1-3) side wall 231c) and / or the (1-4) side wall 231d (for example, Fig.10 At least a portion of the (1-4)th side wall 231d).

[0112] refer to Fig.15 and Fig.16 In an embodiment, the (1-3) side wall 231c of the first shell 230 and the (2-3) side wall 251c of the second shell 250 overlapping each other may include a mounting area that is partially removed or penetrated to accommodate the storage medium tray 282. For example, the mounting area may be connected to the gap G1. Fig.15 , the (1-3) side wall 231c and the (2-3) side wall 251c may not overlap each other around the installation area where the storage medium tray 282 is placed. For example, the peripheral portion may have a short path to the internal space of the electronic device 101 formed along the gap G1 and may be relatively easy to be flooded. For example, at least one channel (e.g., the first channel 271) and a rib (e.g., the second rib 277) that supplements the water blocking function of the channel may be arranged around the installation area. However, the position, shape and / or number of the first channel 271, the first rib 276 and / or the second rib 277 are not limited to those described above. For example, the (1-3) side wall 231c may also include a first rib 276 (not shown) located in the portion forming the installation area.

[0113] refer to Figures 17 to 19In an embodiment, the (1-4) side wall 231d of the first shell 230 and the (2-4) side wall 251d of the second shell 250 overlapping each other may include a receiving area that is partially deleted or penetrated to receive the key assembly 281. For example, the receiving area may be connected to the gap G1. Fig.18 and Fig.19 , the (1-4) side wall 231d and the (2-4) side wall 251d may not overlap around the receiving area where the key assembly 281 is placed. For example, with other parts (e.g., Fig.18 ) compared to the accommodation area (e.g. Fig.19 ) can form a shorter path along the gap G1 to the internal space of the electronic device 101. For example, the side wall may further include at least one rib (not shown) extending around the accommodation area in parallel to the first channel 271. For example, the (2-3) side wall 251c may further include a second rib 277 (not shown) located in the portion forming the accommodation area. For example, the (1-3) side wall 231c may further include a first rib 276 (not shown) located in the portion forming the accommodation area.

[0114] The electronic device including the above-mentioned waterproof structure (e.g., channels and ribs) and / or housing according to the embodiments disclosed herein is not limited to the above-mentioned embodiments and drawings, and it is clear to a person skilled in the art that various replacements, modifications and changes can be made within the technical scope disclosed herein.

[0115] The above reference Figures 5 to 19 The position, shape and / or number of the described channels 271 and 272 are not limited to the disclosure including the drawings. For example, depending on the structure of the housings 230 and 250 and the relationship with the internal configuration arranged in the internal space, the position and / or shape can be changed and can be additionally set in the housings 230 and 250 (e.g., the first side wall 231, the first plate portion 232, the second side wall 251 and / or the second plate portion 252). For example, the channels 271 and 272 can be designed to avoid certain structures or internal configurations of the first side wall 231 and the second side wall 251. For example, the position and / or shape (e.g., width, depth, length) of the channels 271 and 272 can be changed or further set to enhance the water blocking function of some structures or internal configurations of the first side wall 231 and the second side wall 251.

[0116] The above reference Figures 5 to 19The position, shape and / or number of the ribs 276 and 277 described are not limited to the disclosure including the accompanying drawings. For example, depending on the structure of the housings 230 and 250 and the relationship with the internal configuration arranged in the internal space, the position and / or shape can be changed and can be additionally set in the housings 230 and 250 (e.g., the first side wall 231, the first plate portion 232, the second side wall 251 and / or the second plate portion 252). For example, the ribs 276 and 277 can be designed to avoid certain structures of the first side wall 231 and the second side wall 251. For example, the position and / or shape (e.g., width, depth, length) of the ribs 276 and 277 can be changed or further set to enhance the water blocking function of some structures or internal configurations of the first side wall 231 and the second side wall 251.

[0117] The housing of an electronic device may generally include a plurality of components assembled together, such as a front surface housing and a rear surface housing. Typically, a lifting phenomenon or an assembly gap may occur between the assembled front surface housing and the rear surface housing. For example, the assembly gap may be connected from the outer surface of the electronic device to the internal space enclosed by the housing. As a result, an external fluid (e.g., water) may penetrate into the internal space of the electronic device through the assembly gap. Since electronic components such as printed circuit boards that are susceptible to flooding are arranged in the internal space of the electronic device, it is necessary to implement a waterproof structure that blocks the gap in the housing. Typically, a method of arranging a strip-shaped barrier member (e.g., a sponge) inside the rear housing facing the front housing along the peripheral direction can be applied. However, the method of attaching a separate barrier member to the housing may increase the number of components and require additional processes, such as attachment and compression of shielding members, which may increase the total cost.

[0118] The embodiments disclosed herein can realize the flood-proof function of the internal structure of the electronic device by integrally forming a waterproof structure in the corresponding coupling areas of the two shells, without requiring a separate process of attaching a waterproof member (such as a sponge) to the gap formed along the coupling area between the two shells. In an embodiment, the waterproof structure can be integrally formed in each of the coupling areas of the two shells, and the waterproof member (such as a sponge) can be attached to the gap formed along the coupling area between the two shells.

[0119] The problems to be solved by the embodiments disclosed herein are not limited to the above description, and various extensions may be made without departing from the spirit and scope disclosed herein.

[0120] The electronic device 101 according to the embodiment disclosed herein may include a display ( Figure 2 201 and / or Figure 4 , Figure 7 and Figure 8 220), the rear surface cover facing the front surface cover ( Figure 4 , Figure 7 and Figure 8 260) and / or a housing surrounding an internal space defined between the display and the rear surface cover. The housing may include a first housing ( Figure 4 , Fig.10 and Fig.14 230), the first housing includes: a first plate portion ( Figure 4 , Figure 7 , Figure 8 , Fig.10 and Fig.11 232), and a first side wall ( Figure 4 and Fig.10 231 in). The housing may include a second housing ( Figure 4 , Fig.12 and Fig.14 250), the second housing includes: a second plate portion ( Figure 4 , Figure 7 , Figure 8 , Fig.12 and Fig.13 252 in), and a second side wall ( Figure 4 and Fig.12 251 in the figure). Between the first shell and the second shell, the gap can extend from the separation space between the first side wall and the second side wall. The first side wall may include a channel ( Figures 14 to 19 271 of , or Figure 5 , Fig. 9 and Fig.11 272), the channel extends concavely along the peripheral direction of the electronic device in the form of an upper opening toward the gap.

[0121] In an embodiment, the channel may be concavely formed in a portion of a surface of the first side wall facing the second side wall.

[0122] In an embodiment, air resistance of the gap in an area closer to the inner space may be greater than air resistance in an area where the channel is located.

[0123] In an embodiment, the channel may be bent to avoid at least one through-region formed in a portion of the first side wall.

[0124] In an embodiment, the channel may include a plurality of channels, the plurality of channels including a first channel ( Figures 14 to 19 271 in the figure) and a second channel ( Figure 5 , Fig. 9 and Fig.11 272).

[0125] In an embodiment, the second channel may be configured such that a path length of the second channel between the separation space and the inner space is relatively shorter than a path length of the second channel in other regions of the first side wall.

[0126] In an embodiment, the second channel may extend at least partially parallel to the first channel.

[0127] In an embodiment, at least one of the first sidewall or the second sidewall may include at least one rib 276 or 277 that protrudes into the gap and extends in a peripheral direction of the electronic device.

[0128] In an embodiment, the ribs may be located closer to the interior space than the channels.

[0129] In an embodiment, the channel and the rib may extend parallel to each other in at least a portion of the periphery of the electronic device.

[0130] In an embodiment, the channel may include a plurality of channels including a first channel and a second channel located closer to the inner space than the first channel. The second channel may be disposed between the first channel and the rib.

[0131] In an embodiment, the channel may include at least one channel formed on one surface of the first sidewall, and the rib may include at least one rib formed on a surface of the second sidewall facing one surface of the first sidewall.

[0132] In an embodiment, the first sidewall may include a first rib spaced apart from the channel, and the second sidewall may include a plurality of second ribs.

[0133] In an embodiment, the first rib and the second rib may each extend parallel to at least a portion of the channel and may not overlap each other in at least a partial region.

[0134] In an embodiment, the electronic device may further include a printed circuit board 240 disposed in the internal space.

[0135] The electronic device 101 according to the embodiment disclosed herein may include a display ( Figure 2 201 and / or Figure 4 , Figure 7 and Figure 8 220), the rear surface cover facing the front surface cover ( Figure 4 , Figure 7 and Figure 8 260) and / or a housing surrounding an internal space defined between the display and the rear surface cover. The housing may include a first side wall ( Figure 4 and Fig.10 The first shell (231) Figure 4 , Fig.10 and Fig.14 230), the first shell at least partially faces the display and forms a part of the side wall. The shell may include a second side wall ( Figure 4 and 12 The second shell (251) Figure 4 , Fig.12 and Fig.14 250), the second shell at least partially faces the rear surface cover and forms the rest of the side wall, and the second side wall is spaced apart from the first side wall on the outside. Between the first shell and the second shell, a gap may extend from the separation space between the first side wall and the second side wall. The first side wall may include a channel ( Figures 14 to 19 271 of , or Figure 5 , Fig. 9 and Fig.11 272), the channel extends concavely along the peripheral direction of the electronic device in the form of an upper opening toward the gap.

[0136] In an embodiment, the channel may be concavely formed in a portion of a surface of the first side wall facing the second side wall.

[0137] In an embodiment, at least one of the first sidewall or the second sidewall may include at least one rib 276 or 277 protruding into the gap and extending in a peripheral direction of the electronic device.

[0138] In an embodiment, the channel and the rib may extend parallel to each other in at least a portion of the periphery of the electronic device.

[0139] In an embodiment, the channel may include a plurality of channels including a first channel and a second channel located closer to the inner space than the first channel. The second channel may be disposed between the first channel and the rib.

[0140] According to the embodiments disclosed herein, in addition to the process of assembling the housing, no additional process of attaching or pressing the waterproof member to the housing is required. Therefore, compared with the general method of attaching the waterproof member to the housing separately, the number of components in the electronic device can be reduced, the assembly process can be simplified, and the total cost can be reduced accordingly.

[0141] Effects obtained from the embodiments disclosed herein are not limited to the above-described effects, and various extensions may be made within a range not departing from the spirit and scope disclosed herein.

[0142] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0143] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or replacement forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrases in the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding parts from another part, and do not limit the parts in other aspects (e.g., importance or order). It will be understood that regardless of whether the term "operably" or "communicatively" is present, if an element (e.g., a first element) is referred to as being "coupled with another element (e.g., a second element)", "coupled to another element (e.g., the second element)", "connected with another element (e.g., the second element)" or "connected to another element (e.g., the second element)", it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0144] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0145] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0146] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0147] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be detachably arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

Claims

1. An electronic device, comprising: Display (201; 220); A rear surface cover (260), the rear surface cover facing the display; as well as Housing (210; 230 and 250), the housing surrounds an internal space formed between the display and the rear surface cover, Wherein, the housing comprises: A first housing (230) comprising a first panel portion (232) at least partially facing the display and a first side wall (231) surrounding a periphery of the first panel portion; and a second housing (250) comprising a second plate portion (252) coupled to the rear surface cover and a second side wall (251) surrounding a periphery of the second plate portion and spaced apart from at least a portion of the first side wall on an outer side, wherein, between the first shell and the second shell, a gap (G1) extends from a separation space between the first side wall and the second side wall, and The first side wall includes at least one channel (271, 272), which is connected to the gap and extends concavely along the peripheral direction of the electronic device.

2. The electronic device according to claim 1, wherein: The channel is concavely formed in a portion of a surface of the first side wall facing the second side wall.

3. The electronic device according to claim 1 or 2, wherein: The air resistance of the gap in a region closer to the internal space is greater than the air resistance in a region where the passage is located.

4. The electronic device according to any one of claims 1 to 3, wherein: The channel is bent to avoid at least one through-region formed in a portion of the first side wall.

5. The electronic device according to any one of claims 1 to 4, wherein: The channel includes a plurality of channels, the plurality of channels including a first channel (271) and a second channel (272), the second channel being located closer to the internal space than the first channel.

6. The electronic device according to claim 5, wherein: The second passage is configured such that a path length of the second passage between the separation space and the inner space is relatively shorter than a path length of the second passage in other regions of the first side wall.

7. The electronic device according to claim 5 or 6, wherein: The second channel extends at least partially parallel to the first channel.

8. The electronic device according to any one of claims 1 to 7, wherein: At least one of the first side wall or the second side wall includes at least one rib (276, 277) that protrudes into the gap and extends along a peripheral direction of the electronic device.

9. The electronic device according to claim 8, wherein: The rib is located closer to the interior space than the channel.

10. The electronic device according to claim 8 or 9, wherein: The channel and the rib extend parallel to each other in at least a partial area of ​​the periphery of the electronic device.

11. The electronic device according to any one of claims 8 to 10, wherein: The first side wall includes a plurality of channels, the plurality of channels including a first channel and a second channel, the second channel being located closer to the interior space than the first channel, and Wherein, the second channel is arranged between the first channel and the rib.

12. The electronic device according to any one of claims 8 to 11, wherein: The at least one channel is formed on one surface of the first side wall, and the at least one rib is formed on a surface of the second side wall facing the one surface of the first side wall.

13. The electronic device according to any one of claims 8 to 12, wherein: The first sidewall includes a first rib spaced apart from the channel, and the second sidewall includes a plurality of second ribs.

14. The electronic device according to claim 13, wherein: The first rib and the second rib each extend parallel to at least a portion of the channel and do not overlap each other in at least a partial area.

15. The electronic device according to any one of claims 1 to 14, further comprising a printed circuit board (240) disposed in the internal space.

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