Laser grooving equipment for wafer processing

Abstract

The invention discloses wafer processing laser grooving equipment in the technical field of wafer laser processing, which comprises a case, a feeding assembly, a driving assembly, a material guiding assembly and a material collecting box, the feeding assembly is arranged on the case, the feeding assembly comprises a bottom plate, a support frame, a conveying shaft, a conveying belt and a partition plate, the bottom plate is arranged on the case, the support frame is arranged on the bottom plate, and the conveying shaft is arranged on the support frame. The supporting frame is arranged on the bottom plate, the conveying shaft is rotationally arranged on the supporting frame, the conveying belt is arranged on the conveying shaft in a sleeving mode, the multiple sets of partition plates are arranged on the conveying belt in a linear array mode, the driving assembly is arranged on the machine box and used for pushing round crystal blanking after grooving is completed, and the material guiding assembly is arranged on the machine box. The material collecting box is movably arranged on the machine box. Therefore, in the process of grooving the round crystal, rapid and efficient blanking of the round crystal is completed, chippings generated by machining are synchronously pushed off in the round crystal pushing-off process, the efficiency is improved, and the product quality during round crystal machining is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of round wafer laser processing, and in particular to a round wafer laser grooving device. Background Art

[0002] As a round, thin, solid-state electronic material, the wafer is mainly made of high-purity silicon or other semiconductor materials, and plays an indispensable and basic role in the production of integrated circuits in the semiconductor manufacturing industry. Grooving technology, especially laser grooving technology, uses lasers to accurately carve grooves on the surface of the wafer, significantly improving the efficiency and accuracy of subsequent cutting and processing, and has become a highlight in advanced manufacturing processes.

[0003] However, in the current wafer laser slotting processing technology, the loading and unloading links still face challenges. Although high-tech manipulators can achieve precise positioning and stable operation, their high cost and cumbersome debugging process limit their widespread application. In contrast, manual operation has lower costs, but limited efficiency and is difficult to meet the urgent needs of large-scale production.

[0004] What is even more difficult is that a large amount of debris is generated during the laser slotting process. These debris not only stubbornly adhere to various parts of the equipment, but are also extremely difficult to clean. The residual debris not only threatens the normal operation of the equipment, but may also cause a chain reaction on the subsequent wafer slotting process, such as reduced processing accuracy, increased equipment wear, etc., seriously affecting production efficiency and product quality. Summary of the invention

[0005] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.

[0006] To this end, the purpose of the present invention is to propose a laser grooving equipment for round wafer processing, which can complete the rapid and efficient dropping of round wafers during the process of grooving the round wafers, and simultaneously push away the debris generated by the processing during the process of pushing the round wafers down, thereby improving efficiency and ensuring product quality during round wafer processing.

[0007] To achieve the above-mentioned purpose, the present invention proposes a laser grooving equipment for round wafer processing, comprising a chassis, a feeding assembly, a driving assembly, a material guiding assembly and a material collecting box, wherein the feeding assembly is arranged on the chassis, and the feeding assembly comprises a base plate, a support frame, a conveying shaft, a conveyor belt and a partition, wherein the base plate is arranged on the chassis; the support frame is arranged on the base plate; the conveying shaft is rotatably arranged on the support frame; the conveyor belt is sleeved on the conveying shaft; the partitions are multiple groups, and multiple groups of the partitions are linearly arrayed on the conveyor belt; the driving assembly is arranged on the chassis, and the driving assembly is used to push the round wafers that have completed grooving to fall; the material guiding assembly is arranged on the chassis, and the material guiding assembly is used to limit the round wafers to be grooved; the material collecting box is movably arranged on the chassis.

[0008] The wafer processing laser grooving equipment of the present invention can quickly and efficiently drop the wafer during the grooving process, and can simultaneously push away the debris generated during the wafer pushing process, thereby improving efficiency and ensuring product quality during wafer processing.

[0009] In addition, the wafer processing laser slotting equipment proposed in the application may also have the following additional technical features:

[0010] Specifically, the driving assembly includes a driving box, a rotating shaft, a pushing mechanism, a guiding mechanism, a chassis, a material hole, a lifting mechanism, a debris collection mechanism and a unloading mechanism, wherein the driving box is arranged on the chassis, and a laser cutting device and a driving component are provided in the driving box; the rotating shaft is arranged at the output end of the driving component; the pushing mechanism is arranged on the rotating shaft, and the pushing mechanism is arranged above the material guiding assembly; the guiding mechanism is arranged on the rotating shaft; the chassis is arranged in the chassis; the material holes are divided into multiple groups, and the multiple groups of material holes are respectively opened on the chassis; the lifting mechanism is movably arranged in the material hole; the debris collection mechanism is arranged on the chassis; the unloading mechanism is arranged in the chassis, and the unloading mechanism is located below the material hole.

[0011] Specifically, the pushing mechanism includes a positioning shaft, an outer pushing plate and a guide groove, wherein the positioning shaft is arranged on the rotating shaft; the outer pushing plate is arranged on the positioning shaft; and the guide groove is opened on the outer pushing plate.

[0012] Specifically, the guide mechanism includes an outer frame, a movable pressure plate, a reset component, a fixed shaft, a movable collar, a scraper plate and a connecting frame, wherein the outer frame is arranged on the rotating shaft; the movable pressure plate is movably arranged in the outer frame; the two ends of the reset component are respectively connected to the outer frame and the movable pressure plate; the fixed shaft is arranged on the outer frame; the movable collar is rotatably arranged on the fixed shaft; the scraper plate is arranged on the movable collar; and the two ends of the connecting frame are respectively connected to the movable pressure plate and the scraper plate.

[0013] Specifically, the lifting mechanism includes a movable push rod, an arc-shaped concave plate, a protrusion and a buffer component, wherein the movable push rod is movably arranged in the chassis; the arc-shaped concave plate is opened on the movable push rod; the protrusion is arranged in the arc-shaped concave plate; one end of the buffer component is arranged on the bottom wall of the movable push rod, and the other end of the buffer component is connected to the inner wall of the chassis.

[0014] Specifically, the debris collection mechanism includes a debris collection trough and a debris collection barrel, wherein the debris collection trough is respectively opened on the material guide assembly and the chassis; the debris collection barrel is movably arranged on the chassis, and the debris collection barrel is arranged below the debris collection trough.

[0015] Specifically, the unloading mechanism includes a through pipe, a material baffle plate and a material collection trough, wherein the through pipe is arranged on the bottom wall corresponding to the material hole; the material collection trough is arranged in the chassis; the material baffle plate is arranged on the material collection trough, and the material collection box is movably arranged in the material collection trough.

[0016] Specifically, the material guiding assembly includes a processing platform, a support rod frame and a limiting mechanism, wherein the processing platform is arranged on the chassis; the support rod frame is arranged on the processing platform; and the limiting mechanism is arranged on the support rod frame.

[0017] Specifically, the limiting mechanism includes a hollow sleeve, a guide plate and a guide tube, wherein the hollow sleeve is arranged on the support frame; the guide plates are multiple groups, and the multiple groups of guide plates are arranged in a circular array in the hollow sleeve; the guide tube is arranged in the hollow sleeve, and the guide tube is located on the bottom wall of the guide plate.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0020] Figure 1 It is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the structure of the drive assembly of the present invention;

[0022] Figure 3 It is a structural schematic diagram of the material pushing mechanism of the present invention;

[0023] Figure 4 It is a schematic diagram of the structure of the guide mechanism of the present invention;

[0024] Figure 5 It is a schematic diagram of the structure of the lifting mechanism of the present invention;

[0025] Figure 6 This is a schematic diagram of the structure of the material guide assembly of the present invention;

[0026] Figure 7 It is a schematic diagram of the structure of the limiting mechanism of the present invention.

[0027] As shown in the figure: 10, chassis; 20, feeding assembly; 201, bottom plate; 202, support frame; 203, conveying shaft; 204, conveyor belt; 205, partition; 30, driving assembly; 301, driving box; 302, rotating shaft; 303, pushing mechanism; 3031, positioning shaft; 3032, outer pushing plate; 3033, guide groove; 304, guiding mechanism; 3041, outer frame; 3042, movable pressure plate; 3043, reset component; 3044, fixed shaft; 3045, movable collar; 3046, scraper plate; 3047, connecting frame; 305, Chassis; 306, material hole; 307, lifting mechanism; 3071, movable ejector; 3072, arc-shaped concave plate; 3073, convex block; 3074, buffer component; 308, crushed material collecting mechanism; 3081, crushed material collecting trough; 3082, crushed material collecting cylinder; 309, unloading mechanism; 3091, through pipe; 3092, material baffle plate; 3093, material collection trough; 40, material guide assembly; 401, processing platform; 402, support rod frame; 403, limit mechanism; 4031, hollow sleeve; 4032, guide plate; 4033, guide tube; 50, material collection box. DETAILED DESCRIPTION

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limitations of the present invention. On the contrary, embodiments of the present invention include all changes, modifications and equivalents that fall within the spirit and connotation of the appended claims.

[0029] The wafer processing laser grooving equipment according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0030] like Figure 1-7 As shown, the wafer processing laser grooving equipment according to the embodiment of the present invention includes a chassis 10 , a feeding assembly 20 , a driving assembly 30 , a material guiding assembly 40 and a material collecting box 50 .

[0031] The feeding assembly 20 is disposed on the chassis 10 , and the feeding assembly 20 includes a bottom plate 201 , a support frame 202 , a conveying shaft 203 , a conveyor belt 204 and a partition 205 .

[0032] The bottom plate 201 is arranged on the chassis 10, the support frame 202 is arranged on the bottom plate 201, and the conveying shaft 203 is rotatably arranged on the support frame 202. The conveying belt 204 is sleeved on the conveying shaft 203, and the partitions 205 are multiple groups, and the multiple groups of partitions 205 are linearly arrayed on the conveying belt 204.

[0033] It should be noted that a support frame 202 is provided on the bottom plate 201, a driving motor is provided on the support frame 202, a conveying shaft 203 is provided on the output end of the driving motor, the driving motor is operated by controlling the switch and the power supply connection, and the driving motor drives the conveying shaft 203 to rotate through the reducer, thereby driving the conveyor belt 204 to rotate. The wafers to be laser grooved are placed on the conveyor belt 204, and the wafers are separated by the partitions 205, so that the wafers are processed one by one during the conveying process.

[0034] Furthermore, in order to ensure that the round wafer to be grooved on the conveyor belt 204 slides into the limiting mechanism 403 on the processing platform 40, the conveyor belt 204 is arranged close to the limiting mechanism 403, and the conveyor belt 204 and the top wall of the limiting mechanism 403 are located in the same horizontal plane.

[0035] The driving assembly 30 is arranged on the chassis 10 , and is used to push the slotted round wafers to fall. The material guiding assembly 40 is arranged on the chassis 10 , and is used to limit the round wafers to be slotted. The material collecting box 50 is movably arranged on the chassis 10 .

[0036] It should be noted that the driving assembly 30 pushes the wafers dropped on the material guide assembly 40 during operation, pushes the slotted wafers down during the pushing process, and continuously processes the wafers that have not been slotted. The slotted wafers drop into the collection box 50 for easy collection and placement.

[0037] Specifically, the processing steps of laser grooving a wafer are as follows: placing the wafer to be grooved on the conveyor belt 204, and the wafers are placed on the conveyor belt 204 and separated by the partition 205, and then the wafers are transported and dropped on the material guide assembly 40. The wafer is grooved by the driving assembly 30, and after the grooving is completed, the processed wafer is pushed down and falls into the collection box 50, so that the processed wafers can be collected and taken out conveniently.

[0038] In one embodiment of the present invention, Figure 2 As shown, the driving assembly 30 includes a driving box 301 , a rotating shaft 302 , a material pushing mechanism 303 , a guiding mechanism 304 , a chassis 305 , a material hole 306 , a lifting mechanism 307 , a crushed material collecting mechanism 308 and a material discharging mechanism 309 .

[0039] The drive box 301 is arranged on the chassis 10, and a laser cutter and a drive component are arranged in the drive box 301, and the rotating shaft 302 is arranged at the output end of the drive component. The pushing mechanism 303 is arranged on the rotating shaft 302, and the pushing mechanism 303 is arranged above the material guide assembly 40, and the guide mechanism 304 is arranged on the rotating shaft 302. The chassis 305 is arranged in the chassis 10, and the material holes 306 are multiple groups, and the multiple groups of material holes 306 are respectively opened on the chassis 305, and the lifting mechanism 307 is movably arranged in the material holes 306. The crushed material collection mechanism 308 is arranged on the chassis 305, and the unloading mechanism 309 is arranged in the chassis 10, and the unloading mechanism 309 is located below the material holes 306.

[0040] It should be noted that the laser cutting device provided in the drive box 301 described in this embodiment is the prior art, and the driving component is a stepping motor, which is operated by controlling the switch and the power supply connection. The operation of the driving component drives the rotating shaft 302 to rotate. During the rotation of the rotating shaft 302, the guide mechanism 304 is driven to rotate synchronously. When the guide mechanism 304 rotates, it cooperates with the lifting mechanism 307 to make the slotted wafer fall downward, and then the wafer falls from the material guide assembly 40 and the material hole 306 into the unloading mechanism 309 and slides into the collection box 50.

[0041] Furthermore, the pusher mechanism 303 is movably arranged on the surface of the processing platform 401, and the guide mechanism 304 is movably arranged on the surface of the chassis 305, and the angle between the pusher mechanism 303 and the guide mechanism 304 is set according to the position of the laser grooving of the wafer, so as to ensure that the whole set of steps of the wafer grooving processing, pushing down the processed parts and cleaning up the debris run smoothly and accurately.

[0042] In one embodiment of the present invention, Figure 3 As shown, the pushing mechanism 303 includes a positioning shaft 3031 , an outer pushing plate 3032 and a guide groove 3033 .

[0043] The positioning shaft 3031 is disposed on the rotating shaft 302 , the outer push plate 3032 is disposed on the positioning shaft 3031 , and the guide groove 3033 is provided on the outer push plate 3032 .

[0044] It should be noted that the positioning shaft 3031 and the rotating shaft 302 are overlapped and fixed together, and the push plate 3032 is an incomplete circular plate. The outer diameter of the push plate 3032 is the same as the outer diameter of the material guide assembly 40, and the guide groove 3033 is an arc groove opened on the push plate 3032, and the inner diameter of the arc groove is the same as the outer diameter of the round crystal to be processed.

[0045] In one embodiment of the present invention, Figure 4 As shown, the guide mechanism 304 includes an outer frame 3041 , a movable pressure plate 3042 , a reset component 3043 , a fixed shaft 3044 , a movable collar 3045 , a scraper plate 3046 and a connecting frame 3047 .

[0046] The outer frame 3041 is arranged on the rotating shaft 302, the movable pressing plate 3042 is movably arranged in the outer frame 3041, and the two ends of the reset component 3043 are respectively connected to the outer frame 3041 and the movable pressing plate 3042. The fixed shaft 3044 is arranged on the outer frame 3041, and the movable collar 3045 is rotatably arranged on the fixed shaft 3044. The scraper plate 3046 is arranged on the movable collar 3045, and the two ends of the connecting frame 3047 are respectively connected to the movable pressing plate 3042 and the scraper plate 3046.

[0047] It should be noted that the rotating shaft 302 synchronously drives the outer frame 3041 to rotate during the rotation process, and the reset component 3043 is a reset spring. The bottom wall of the movable pressing plate 3042 is provided with a rounded corner. The movable pressing plate 3042 will first cooperate with the lifting mechanism 307 during the rotation process. During the lifting and lowering movement of the lifting mechanism 307, the slotted wafer is pushed on the material guide assembly 40. During the lifting and lowering process of the movable pressing plate 3042, the scraper plate 3046 is driven to move synchronously through the connecting frame 3047. After passing through the lifting mechanism 307, the scraper plate 3046 slides down and fits on the chassis 305. As the rotating shaft 302 rotates, the scraper plate 3046 scrapes off the debris dropped when the wafer is slotted and collects it in the debris collection mechanism 308.

[0048] In one embodiment of the present invention, Figure 5 As shown, the lifting mechanism 307 includes a movable lifting rod 3071 , an arc-shaped concave plate 3072 , a protrusion 3073 and a buffer component 3074 .

[0049] Among them, the movable top rod 3071 is movably arranged in the chassis 305, the arc-shaped concave plate 3072 is opened on the movable top rod 3071, the protrusion 3073 is arranged in the arc-shaped concave plate 3072, one end of the buffer component 3074 is arranged on the bottom wall of the movable top rod 3071, and the other end of the buffer component 3074 is connected to the inner wall of the chassis 305.

[0050] It should be noted that an arc-shaped concave plate 3072 is provided on the movable push rod 3071 , and a protrusion 3073 in the arc-shaped concave plate 3072 is located above the top wall of the bottom plate 305 , and a chamfer tangent to the bottom wall of the movable pressure plate 3042 is provided on the top wall of the protrusion 3073 .

[0051] In one embodiment of the present invention, Figure 2 As shown, the debris collection mechanism 308 includes a debris collection trough 3081 and a debris collection cylinder 3082 .

[0052] The debris collecting trough 3081 is respectively opened on the material guiding assembly 40 and the bottom plate 305 , the debris collecting barrel 3082 is movably arranged on the bottom plate 305 , and the debris collecting barrel 3082 is arranged below the debris collecting trough 3081 .

[0053] It should be noted that the debris generated after the wafer processing falls from the debris collection trough 3081 and is collected by the debris collection barrel 3082, so that the debris can be easily collected and cleaned up.

[0054] In one embodiment of the present invention, Figure 2 As shown, the unloading mechanism 309 includes a through pipe 3091 , a material blocking plate 3092 and a material collecting trough 3093 .

[0055] Among them, the through pipe 3091 is arranged on the bottom wall of the corresponding material hole 306, the material collecting trough 3093 is arranged in the chassis 10, the material blocking plate 3092 is arranged on the material collecting trough 3093, and the material collecting box 50 is movably arranged in the material collecting trough 3093.

[0056] It should be noted that after the grooving is completed, the round wafer falls downward from the through pipe 3091 , and the material baffle plate 3092 is provided as an inclined plate, so the round wafer slides on the material baffle plate 3092 and continues to slide into the collecting trough 3093 .

[0057] In one embodiment of the present invention, Figure 6 As shown, the material guiding assembly 40 includes a processing platform 401 , a support rod frame 402 and a limiting mechanism 403 .

[0058] The processing platform 401 is disposed on the chassis 10 , the support rod frame 402 is disposed on the processing platform 401 , and the limiting mechanism 403 is disposed on the support rod frame 402 .

[0059] It should be noted that the limiting mechanisms 403 are provided in multiple groups, and the number of the limiting mechanisms 403 is set according to the size of the specific wafer to be processed.

[0060] In one embodiment of the present invention, Figure 7 As shown, the limiting mechanism 403 includes a hollow sleeve 4031 , a guide plate 4032 and a guide tube 4033 .

[0061] Among them, the hollow sleeve 4031 is set on the support rod frame 402, the guide plates 4032 are multiple groups, and the multiple groups of guide plates 4032 are arranged in a circular array in the hollow sleeve 4031. The guide tube 4033 is set in the hollow sleeve 4031, and the guide tube 4033 is located on the bottom wall of the guide plate 4032.

[0062] It should be noted that there are multiple sets of guide plates 4032, and the guide plates 4032 are tilted, and the tilt angle of the guide plates 4032 is set according to the outer diameter of the wafer to be grooved. The inner diameter of the guide tube 4033 is smaller than the outer diameter of the wafer.

[0063] Specifically, the steps of grooving the wafer to be processed are:

[0064] The round wafer to be slotted is placed on the conveyor belt 204, and the round wafer is placed on the conveyor belt 204 and separated by the partition 205, and then the round wafer is transported and falls on the limiting mechanism 403, at which time the movable push rod 3071 is pushed up by the reset component 3043, and the bottom wall of the round wafer is pushed to the same level as the top wall of the processing platform 401. Then the driving component in the driving box 301 is operated, and when the driving component is in operation, it drives the rotating shaft 302 to rotate, and the rotating shaft 302 drives the guide mechanism 304 to rotate, and the movable pressing plate 3042 in the guide mechanism 304 moves and abuts against the protrusion 3073, then the movable push rod 3071 moves down to make the round wafer fall into the hollow sleeve 4031, and the round wafer is slotted by the laser cutting device.

[0065] After the wafer slotting is completed, the driving component is operated again, the rotating shaft 302 is operated again, and the movable push rod 3071 is moved upward and reset through the buffer component 3074, and the movable push rod 3071 pushes the wafer after processing to the surface of the processing platform 401. During the rotation of the rotating shaft 302, the push plate 3032 is synchronously driven to rotate, and the guide groove 3033 moves during the movement of the wafer after slotting, and slides from the material hole 306 with the wafer after slotting, and slides onto the material blocking plate 3092 through the interconnected through pipe 3091, and the wafer slides into the collection groove 3093. The wafer slides into the collection box 50 for storage, and then the above steps are repeated to perform slotting processing on subsequent wafers.

[0066] The debris generated during the wafer slotting process falls on the processing platform 401, and the debris is pushed from the processing platform 401 to the chassis 305 through the outer push plate 3032. The subsequent rotating shaft 302 drives the outer frame 3041 to rotate synchronously during the rotation process. The bottom wall of the movable pressing plate 3042 is provided with a rounded corner. The movable pressing plate 3042 will first cooperate with the lifting mechanism 307 during the rotation process. During the lifting and lowering movement of the lifting mechanism 307, the slotted wafer is pushed on the material guide assembly 40. During the lifting and lowering process of the movable pressing plate 3042, the scraper plate 3046 is driven to move synchronously through the connecting frame 3047. After passing through the lifting mechanism 307, the scraper plate 3046 slides down and fits onto the chassis 305. As the shaft 302 rotates, the scraper plate 3046 scrapes off the debris that falls when the wafer is grooving and collects it in the debris collecting barrel 3082. After the debris is collected, the debris collecting barrel 3082 is disassembled to clean the debris of the mobile phone.

[0067] In summary, the laser grooving equipment for wafer processing in the embodiment of the present invention can quickly and efficiently drop the wafer during the grooving process, and simultaneously push away the debris generated during the wafer dropping process, thereby improving efficiency and ensuring product quality during wafer processing.

[0068] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and deform the above embodiments within the scope of the present invention.

Claims

1. A wafer processing laser grooving device, characterized in that: It comprises a chassis (10), a feeding assembly (20), a driving assembly (30), a material guiding assembly (40) and a material collecting box (50), wherein: The feeding assembly (20) is arranged on the chassis (10), and comprises a bottom plate (201), a support frame (202), a conveying shaft (203), a conveyor belt (204) and a partition (205), wherein: The bottom plate (201) is arranged on the chassis (10); The support frame (202) is arranged on the bottom plate (201); The conveying shaft (203) is rotatably arranged on the supporting frame (202); The conveyor belt (204) is sleeved on the conveying shaft (203); The partitions (205) are in multiple groups, and the multiple groups of partitions (205) are arranged in a linear array on the conveyor belt (204); The driving component (30) is arranged on the chassis (10), and the driving component (30) is used to push the slotted round wafer to fall; The material guide component (40) is arranged on the chassis (10), and the material guide component (40) is used to limit the position of the round wafer to be grooved; The material collecting box (50) is movably arranged on the machine box (10).

2. The wafer processing laser grooving equipment according to claim 1, characterized in that: The driving assembly (30) comprises a driving box (301), a rotating shaft (302), a material pushing mechanism (303), a guiding mechanism (304), a chassis (305), a material hole (306), a lifting mechanism (307), a crushed material collecting mechanism (308) and a material discharging mechanism (309), wherein: The drive box (301) is arranged on the chassis (10), and a laser cutting device and a drive component are arranged in the drive box (301); The rotating shaft (302) is arranged at the output end of the driving component; The material pushing mechanism (303) is arranged on the rotating shaft (302), and the material pushing mechanism (303) is arranged above the material guiding component (40); The guide mechanism (304) is arranged on the rotating shaft (302); The chassis (305) is arranged in the chassis (10); The material holes (306) are multiple groups, and the multiple groups of material holes (306) are respectively opened on the bottom plate (305); The lifting mechanism (307) is movably arranged in the material hole (306); The debris collection mechanism (308) is arranged on the chassis (305); The unloading mechanism (309) is arranged in the chassis (10), and the unloading mechanism (309) is located below the material hole (306).

3. The wafer processing laser grooving equipment according to claim 2, characterized in that: The pushing mechanism (303) comprises a positioning shaft (3031), an outer pushing plate (3032) and a guide groove (3033), wherein: The positioning shaft (3031) is arranged on the rotating shaft (302); The push plate (3032) is arranged on the positioning shaft (3031); The guide groove (3033) is provided on the push plate (3032).

4. The wafer processing laser grooving equipment according to claim 2, characterized in that: The guide mechanism (304) comprises an outer frame (3041), a movable pressure plate (3042), a reset component (3043), a fixed shaft (3044), a movable collar (3045), a scraper plate (3046) and a connecting frame (3047), wherein: The outer frame (3041) is arranged on the rotating shaft (302); The movable pressing plate (3042) is movably arranged in the outer frame (3041); Two ends of the resetting component (3043) are respectively connected to the outer frame (3041) and the movable pressing plate (3042); The fixed shaft (3044) is arranged on the outer frame (3041); The movable collar (3045) is rotatably disposed on the fixed shaft (3044); The scraper plate (3046) is arranged on the movable collar (3045); The two ends of the connecting frame (3047) are respectively connected to the movable pressing plate (3042) and the scraper plate (3046).

5. The wafer processing laser grooving equipment according to claim 2, characterized in that: The lifting mechanism (307) comprises a movable lifting rod (3071), an arc-shaped concave plate (3072), a convex block (3073) and a buffer component (3074), wherein: The movable push rod (3071) is movably arranged in the chassis (305); The arc-shaped concave plate (3072) is provided on the movable ejector rod (3071); The convex block (3073) is arranged inside the arc-shaped concave plate (3072); One end of the buffer component (3074) is arranged on the bottom wall of the movable top rod (3071), and the other end of the buffer component (3074) is connected to the inner wall of the chassis (305).

6. The wafer processing laser grooving equipment according to claim 2, characterized in that: The debris collection mechanism (308) comprises a debris collection trough (3081) and a debris collection cylinder (3082), wherein: The scrap material collecting trough (3081) is respectively provided on the material guiding assembly (40) and the bottom plate (305); The debris collecting cylinder (3082) is movably disposed on the chassis (305), and the debris collecting cylinder (3082) is disposed below the debris collecting trough (3081).

7. The wafer processing laser grooving equipment according to claim 2, characterized in that: The unloading mechanism (309) comprises a through pipe (3091), a material blocking plate (3092) and a material collecting trough (3093), wherein: The through pipe (3091) is arranged on the bottom wall corresponding to the material hole (306); The collecting trough (3093) is arranged in the chassis (10); The material baffle plate (3092) is arranged on the material collecting trough (3093), and the material collecting box (50) is movably arranged in the material collecting trough (3093).

8. The wafer processing laser grooving equipment according to claim 1, characterized in that: The material guiding assembly (40) comprises a processing platform (401), a support rod frame (402) and a limiting mechanism (403), wherein: The processing platform (401) is arranged on the chassis (10); The support rod frame (402) is arranged on the processing platform (401); The limiting mechanism (403) is arranged on the supporting rod frame (402).

9. The wafer processing laser grooving equipment according to claim 8, characterized in that: The limiting mechanism (403) comprises a hollow sleeve (4031), a guide plate (4032) and a guide tube (4033), wherein: The hollow sleeve (4031) is arranged on the support rod frame (402); The guide plates (4032) are in multiple groups, and the multiple groups of guide plates (4032) are arranged in a circular array inside the hollow sleeve (4031); The guide tube (4033) is disposed in the hollow sleeve (4031), and the guide tube (4033) is located on the bottom wall of the guide plate (4032).

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