A positioning grinding system and method for semiconductor chip sample cross section

Abstract

The present invention discloses a positioning grinding system and method for a semiconductor chip sample cross section, wherein a target grinding position and grinding marks are arranged on the surface of the semiconductor chip sample to be ground; the grinding marks include a first grinding mark located on the first side of the target grinding position and a second grinding mark located on the second side of the target grinding position; the first grinding mark and the second grinding mark both include multiple rows of marking graphic groups arranged along a first direction; each row of marking graphic groups includes at least one marking graphic, and the number of marking graphics in two adjacent rows of marking graphic groups is different, an optical microscope is used to observe the grinding progress of the semiconductor chip sample to be ground in real time; and a grinding assembly is used to grind the semiconductor chip sample to be ground according to the target grinding position and the grinding marks. The positioning grinding system provided by the present invention provides multiple grinding marks on the surface of the semiconductor chip sample to be ground to remind the staff of the grinding progress in real time, so as to achieve precise positioning of mechanical grinding.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, and in particular to a positioning grinding system and method for a semiconductor chip sample cross section. Background Art

[0002] In semiconductor chip quality control, failure analysis, and competitive product analysis, chip cross-section structure analysis is often required, and the sample preparation quality of the chip cross section is very important. As semiconductor processes become smaller and smaller, the corresponding semiconductor chips and device sizes are also becoming smaller and smaller, so the grinding accuracy requirements for analyzing micro-nano chip structures are also getting higher and higher. Therefore, grinding the corresponding designated positions, especially the designated areas of sub-micron size, is very challenging.

[0003] Manual grinding can generally only be observed through an optical microscope (OM). For a specified position smaller than 1 micron, there is no reference and only a rough estimate can be made. It is easy to fail to grind in place or over-grind. Summary of the invention

[0004] The present invention provides a positioning grinding system and method for the cross section of a semiconductor chip sample. A plurality of grinding marks are set on the surface of the semiconductor chip sample. Through the grinding marks, the staff can observe and grind at the same time, and can make adjustments in real time to solve the technical problems of over-grinding or under-grinding.

[0005] According to a first aspect of the present invention, a positioning grinding system for a semiconductor chip sample cross section is provided, which is used for grinding a semiconductor chip sample. A target grinding position and grinding marks are arranged on the surface of the semiconductor chip sample to be ground; the grinding marks include a first grinding mark located on a first side of the target grinding position and a second grinding mark located on a second side of the target grinding position; the first grinding mark and the second grinding mark both include multiple rows of mark pattern groups arranged along a first direction; each row of the mark pattern groups includes at least one mark pattern, and the number of mark patterns in two adjacent rows of the mark pattern groups is different, and the first direction is parallel to the grinding direction; the positioning grinding system includes: an optical microscope and a grinding assembly;

[0006] The optical microscope is used to observe the grinding progress of the semiconductor chip sample to be ground in real time;

[0007] The grinding assembly is used to grind the semiconductor chip sample to be ground according to the target grinding position and the grinding mark.

[0008] Optionally, along the first direction, the number of the multiple rows of marking graphics increases or decreases sequentially.

[0009] Optionally, the multiple mark patterns in the first grinding mark close to the target grinding position and the multiple mark patterns in the second grinding mark close to the target grinding position are both on the extension line of the target grinding position along the second direction; wherein the second direction is perpendicular to the first direction.

[0010] Optionally, the size and shape of the marking graphics are the same.

[0011] Optionally, each side length or diameter of the marking pattern ranges from 1 μm to 100 μm.

[0012] Optionally, the marking pattern includes at least one of the following: a rectangle, a trapezoid and a circle.

[0013] Optionally, the grinding mark is generated by processing on the surface of the semiconductor chip sample to be ground by using a focused ion beam.

[0014] Optionally, a laser is also included;

[0015] The laser is used to mark the target grinding position.

[0016] Optionally, along the second direction, the minimum distance between the first grinding mark and the second grinding mark is greater than 100 μm, and the second direction is perpendicular to the first direction.

[0017] According to a second aspect of the present invention, a method for positioning and grinding a cross section of a semiconductor chip sample is provided, which is applicable to a positioning and grinding system for a cross section of a semiconductor chip sample as described in any one of the first aspects of the present invention, comprising:

[0018] Providing semiconductor chip samples to be ground;

[0019] Determining a target grinding position according to the semiconductor chip sample to be ground, and marking the target grinding position;

[0020] Generating a first grinding mark and a second grinding mark on both sides of the target grinding position respectively;

[0021] The semiconductor chip sample to be ground is ground according to the target grinding position, the first grinding mark and the second grinding mark.

[0022] The present invention discloses a positioning grinding system for a semiconductor chip sample cross section, which is used for grinding semiconductor chip samples. The surface of the semiconductor chip sample to be ground is provided with a target grinding position and a grinding mark; the grinding mark includes a first grinding mark located on the first side of the target grinding position and a second grinding mark located on the second side of the target grinding position; the first grinding mark and the second grinding mark both include a plurality of rows of marking pattern groups arranged along a first direction; each row of marking pattern groups includes at least one marking pattern arranged at intervals, and the number of marking patterns in two adjacent rows of marking pattern groups is different, and the first direction is parallel to the grinding direction; the positioning grinding system includes: an optical microscope and a grinding assembly; the optical microscope is used to observe the grinding progress of the semiconductor chip sample to be ground in real time; the grinding assembly is used to grind the semiconductor chip sample to be ground according to the mark of the target grinding position and the grinding mark. The present invention provides a positioning grinding system for a semiconductor chip sample cross section, which sets a plurality of grinding marks on the surface of the semiconductor chip sample, and through the grinding marks, allows the staff to observe and grind at the same time during grinding, and can make adjustments in real time to solve the technical problem of over-grinding or under-grinding.

[0023] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a top view of a semiconductor chip sample to be ground in a positioning and grinding system for a semiconductor chip sample cross section provided by an embodiment of the present invention;

[0026] Figure 2 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention;

[0027] Figure 3 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention;

[0028] Figure 4 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention;

[0029] Figure 5 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention;

[0030] Figure 6 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention;

[0031] Figure 7 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention;

[0032] Figure 8 is a top view of a semiconductor chip sample to be ground before being ground provided by an embodiment of the present invention;

[0033] Fig. 9 is a side view of a semiconductor chip sample to be ground after being ground provided by an embodiment of the present invention;

[0034] Fig.10 The present invention provides a flow chart of a method for positioning and grinding a cross section of a semiconductor chip sample according to an embodiment of the present invention. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0036] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0037] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0038] Figure 1 is a top view of a semiconductor chip sample to be ground in a positioning grinding system for a semiconductor chip sample cross section provided by an embodiment of the present invention, with reference to Figure 1 , a positioning grinding system for a semiconductor chip sample cross section provided by an embodiment of the present invention is used for grinding a semiconductor chip sample, wherein a target grinding position 2 and a grinding mark 3 are arranged on the surface of the semiconductor chip sample 1 to be ground; the grinding mark 3 comprises a first grinding mark 31 located on a first side of the target grinding position 2 and a second grinding mark 32 located on a second side of the target grinding position 2; the first grinding mark 31 and the second grinding mark 32 both comprise a plurality of rows of marking pattern groups arranged along a first direction X; each row of the marking pattern group comprises at least one marking pattern a, and the number of marking patterns a in two adjacent rows of the marking pattern groups is different, and the first direction X is parallel to the grinding direction; the positioning grinding system comprises: an optical microscope (not shown in the figure) and a grinding assembly (not shown in the figure);

[0039] The optical microscope is used to observe the grinding progress of the semiconductor chip sample 1 to be ground in real time;

[0040] The grinding assembly is used to grind the semiconductor chip sample 1 to be ground according to the mark of the target grinding position 2 and the grinding mark 3 .

[0041] Specifically, in the field of semiconductor manufacturing, the surface of a semiconductor chip needs to achieve an extremely high degree of flatness. By grinding the semiconductor chip, uneven areas such as protrusions and depressions on the chip surface can be effectively removed, making the chip surface flatter and smoother. Therefore, it is necessary to grind the semiconductor chip sample. The embodiment of the present invention creatively sets a target grinding position 2 and a grinding mark 3 on the basis of the original semiconductor chip. The target grinding position 2 refers to the need to grind the cross section of the semiconductor chip sample 1 to be ground to a horizontal line flush with the target grinding position 2. The grinding mark 3 includes a first side of the target grinding position 2 (i.e., Figure 1 The first grinding mark 31 located on the left side of the target grinding position 2 (i.e. Figure 2 The second grinding mark 32 (on the right side of the middle), the first grinding mark 31 includes a plurality of rows of marking pattern groups arranged along the first direction X, each row of marking pattern groups includes at least one marking pattern a, and the number of marking patterns a in the marking pattern groups of two adjacent rows is different, that is, Figure 1In the first grinding mark 31, the number of the first row of mark graphics a is 3, the number of the second row of mark graphics a is 5, and the number of the third row of mark graphics a is 9. There may be more rows of mark graphic groups, and each row of mark graphic groups may have more mark graphics a. The embodiments of the present invention are not exhaustive here; wherein the first direction X is parallel to the grinding direction.

[0042] A positioning grinding system for a semiconductor chip sample cross section provided by an embodiment of the present invention comprises: an optical microscope and a grinding assembly;

[0043] The grinding progress of the semiconductor chip sample 1 to be ground is observed in real time through an optical microscope. When the staff is about to grind to the target grinding position 2, an electron microscope can be used for observation to make the grinding more accurate. The optical microscope and the electron microscope can enable the staff to understand the grinding degree of the semiconductor chip sample 1 to be ground in real time to avoid the problem of insufficient grinding or grinding beyond the target grinding position 2.

[0044] The grinding component may include a wafer grinder, a chemical mechanical grinder, a compound semiconductor material grinder, a double-sided grinder, etc. The embodiment of the present invention does not limit this. As long as the device can accurately grind the semiconductor chip sample 1 to be grinded, it is within the protection scope of the embodiment of the present invention. The grinding component is used to grind the semiconductor chip sample 1 to be grinded according to the target grinding position 2 and the grinding mark 3.

[0045] The positioning grinding system for the cross section of a semiconductor chip sample provided by an embodiment of the present invention sets multiple grinding marks on the surface of the semiconductor chip sample. The grinding marks allow workers to observe while grinding and make real-time adjustments to solve technical problems of over-grinding or under-grinding.

[0046] Figure 2 FIG. 1 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention, with reference to FIG. Figure 1 or Figure 2 Optionally, along the first direction X, the number of the multiple rows of marking graphics a increases or decreases sequentially.

[0047] For details, please refer to Figure 1 , along the first direction X, the number of marking patterns a in each row increases successively, for example, the number of marking patterns a in the first row is 3, the number of marking patterns a in the second row is 5, and the number of marking patterns a in the third row is 9; or, referring to Figure 2, along the first direction X, the number of marking graphics a in each row decreases successively, for example, the number of marking graphics a in the first row is 9, the number of marking graphics a in the second row is 5, and the number of marking graphics a in the third row is 3; the embodiments of the present invention are not exhaustive, and the advantage of arranging multiple rows of marking graphics in an "equilateral triangle" or "inverted triangle" as a whole is that it can remind the staff step by step that the positioning target grinding position 2 is gradually approaching, and the marking graphics a in the last row enable the cross-section grinding to stop accurately at the target grinding position 2.

[0048] Figure 3 FIG. 1 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention, with reference to FIG. Figure 3 Optionally, the side length or diameter of the marking graphic a ranges from 1 μm to 100 μm.

[0049] Specifically, if the size of the marking pattern a is too large, it is beneficial for optical microscope observation and alignment, but it is not conducive to controlling the precision of grinding to the target. For example, when the target size is less than 0.5 μm, the target is basically invisible to the optical microscope. When establishing the marking pattern a on the plane, the bottom edge or top edge of the marking pattern a needs to be aligned with the target position, and the bottom edges of the marking patterns a on both sides are kept in a straight line (such as Figure 3 As shown), this method can be produced by a focused ion beam (FIB) marking method and observed by a scanning electron microscope (SEM). When the size of a single mark pattern a is 100μm, the grinder needs a resolution of 1 / 200 of the size of the mark pattern a to determine whether the target has been ground in place, which is still difficult. If the size of a single mark pattern a is 5μm, the grinder only needs a resolution of 1 / 10 of the size of the mark pattern a to determine whether the target has been ground in place, which will make grinding positioning much easier. However, if the size of a single mark pattern a is too small, it will be difficult to find the mark pattern a under an optical microscope, so it is necessary to balance the size of the mark pattern a.

[0050] Continue to refer Figure 1 and Figure 3 Optionally, the multiple mark graphics a on the side close to the target grinding position 2 in the first grinding mark 31 and the multiple mark graphics a on the side close to the target grinding position 2 in the second grinding mark 32 are both on the extension line of the target grinding position 2 along the second direction Y; wherein the second direction Y is perpendicular to the first direction X.

[0051] Specifically, refer to Figure 1 and Figure 3In the first grinding mark 31, in the first direction X, a plurality of marking patterns a (i.e. Figure 1 The bottom row of multiple marking patterns a in the first grinding mark 31 is located on the extension line of the target grinding position 2 along the second direction Y; in the second grinding mark 32, multiple marking patterns a (i.e. Figure 1 The bottom row of multiple marking graphics a) in the first grinding mark 32 is also located on the extension line of the target grinding position 2 along the second direction Y. This arrangement can ensure that the staff can accurately grind to the target grinding position 2 of the semiconductor chip sample 1 to be ground.

[0052] Optional, reference Figure 1-Figure 3 , the size and shape of the marker figure a are the same.

[0053] Specifically, the sizes and shapes of the plurality of marking patterns a located in the first grinding mark 31 and the second grinding mark 32 are the same so that the staff can better observe the grinding progress of the semiconductor chip sample 1 to be ground.

[0054] Figure 4 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention, Figure 5 FIG. 1 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention, with reference to FIG. Figure 1 , Figure 4 and Figure 5 Optionally, the marking graphic a includes at least one of the following: a rectangle, a trapezoid and a circle.

[0055] Specifically, in the positioning and grinding system for the cross section of a semiconductor chip sample provided by the embodiment of the present invention, the marking pattern a of the semiconductor chip sample 1 to be ground can be one of a rectangle, a trapezoid and a circle.

[0056] Optionally, the grinding mark 3 is generated by processing on the surface of the semiconductor chip sample 1 to be ground by using a focused ion beam.

[0057] Specifically, the focused ion beam is a microdissection instrument that uses an electric lens to focus an ion beam into a very small size, and generates a plurality of marking patterns a on the surface of the semiconductor chip sample 1 to be ground by the focused ion beam.

[0058] Optionally, the positioning grinding system further includes a laser;

[0059] The laser is used to mark the target grinding position 2.

[0060] Specifically, the semiconductor chip sample cross-section positioning grinding system provided in an embodiment of the present invention also includes a laser, which is used to mark the target grinding position 2 on the surface of the semiconductor chip sample 1 to be ground, so that the staff can clearly and accurately observe the target grinding position 2 in the field of view of the optical microscope.

[0061] Figure 6 FIG. 1 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention, with reference to FIG. Figure 6 Optionally, along the second direction Y, a minimum distance L between the first grinding mark 31 and the second grinding mark 32 is greater than 100 μm, and the second direction X is perpendicular to the first direction Y.

[0062] Figure 7 FIG. 1 is a top view of a semiconductor chip sample to be ground in another semiconductor chip sample cross-section positioning grinding system provided by an embodiment of the present invention, with reference to FIG. Figure 7 Specifically, in the positioning grinding system for the cross-section of a semiconductor chip sample provided in an embodiment of the present invention, the minimum distance L between the first grinding mark 31 and the second grinding mark 32 in the semiconductor chip sample 1 to be ground is greater than 100 μm, corresponding to a maximum tilt angle α of approximately 5.7 degrees. The estimated minimum resolution angle is one-third of it, that is, 1.5 degrees, which is much more accurate than grinding the sample without any reference. Therefore, the angle resolution of the tilt depends on the single mark pattern a and the distance between the first grinding mark 31 and the second grinding mark 32.

[0063] Figure 8 is a top view of a semiconductor chip sample to be ground before being ground provided by an embodiment of the present invention. Fig. 9 is a side view of a semiconductor chip sample to be ground after grinding provided by an embodiment of the present invention, with reference to Figure 8 and Fig. 9 The positioning grinding system for the semiconductor chip sample cross section provided by the embodiment of the present invention can achieve the following beneficial effects:

[0064] 1. Before the cross-section positioning grinding, add the marking pattern positioning method, use multiple rows of marking patterns to accurately locate the grinding depth and angle, so that the grinding personnel can quickly and accurately grind to the specified position, especially the positioning grinding of advanced chip processes.

[0065] 2. The marking patterns are divided into multiple rows with progressive numbers, which can align the grinding angle and depth so that the target grinding position can be accurately located using the relative position of the marking patterns.

[0066] 3. According to the size of the designated position, the size of the marked graphic, and the spacing between the same icons on both sides of the target area, the target grinding position can be accurately identified.

[0067] Fig.10 is a flow chart of a method for positioning and grinding a semiconductor chip sample cross section provided by an embodiment of the present invention, with reference to Fig.10 According to the same inventive concept, an embodiment of the present invention further provides a method for positioning and grinding a cross section of a semiconductor chip sample, which is applicable to a positioning and grinding system for a cross section of a semiconductor chip sample in any of the above-mentioned inventive embodiments, comprising:

[0068] S1. Provide a semiconductor chip sample to be ground.

[0069] Specifically, the semiconductor chip sample to be ground is as follows: Figure 1 or Figure 2 shown.

[0070] S2. Determine a target grinding position according to the semiconductor chip sample to be ground, and mark the target grinding position.

[0071] Specifically, the semiconductor chip sample to be ground is observed through an optical microscope to determine the target grinding position, and the target grinding position is marked, so as to facilitate observation with the optical microscope and grinding of the semiconductor chip sample to be ground.

[0072] S3. Generate a first grinding mark and a second grinding mark on both sides of the target grinding position respectively.

[0073] Specifically, a laser is used to generate a first grinding mark and a second grinding mark on both sides of the target grinding position on the surface of the semiconductor chip sample to be ground, so that the staff can determine the grinding progress at this time in real time through the first grinding mark and the second grinding mark, and make timely adjustments.

[0074] S4, grinding the semiconductor chip sample to be ground according to the target grinding position, the first grinding mark and the second grinding mark.

[0075] Specifically, under the observation and operation of the optical microscope and the grinding assembly, the semiconductor chip sample is ground to the target grinding position along the first direction X according to the target grinding position, the first grinding mark and the second grinding mark.

[0076] A method for positioning and grinding a semiconductor chip sample cross section provided by an embodiment of the present invention can achieve the same technical effect as a system for positioning and grinding a semiconductor chip sample cross section in any of the above-mentioned invention embodiments, and the embodiments of the present invention are not described in detail herein.

[0077] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A positioning grinding system for a semiconductor chip sample cross section, characterized in that: Used for grinding a semiconductor chip sample, the surface of the semiconductor chip sample to be ground is provided with a target grinding position and a grinding mark; the grinding mark comprises a first grinding mark located on a first side of the target grinding position and a second grinding mark located on a second side of the target grinding position; The first grinding mark and the second grinding mark each include a plurality of rows of marking pattern groups arranged along a first direction; Each row of the marking pattern group includes at least one marking pattern, the number of marking patterns in two adjacent rows of the marking pattern groups is different, and the first direction is parallel to the grinding direction; The positioning grinding system includes: an optical microscope and a grinding assembly; The optical microscope is used to observe the grinding progress of the semiconductor chip sample to be ground in real time; The grinding assembly is used to grind the semiconductor chip sample to be ground according to the target grinding position and the grinding mark.

2. The positioning grinding system for a semiconductor chip sample cross section according to claim 1, characterized in that: Along the first direction, the number of the multiple rows of marking patterns increases or decreases sequentially.

3. The positioning grinding system for a semiconductor chip sample cross section according to claim 2, characterized in that: The multiple mark patterns in the first grinding mark close to the target grinding position and the multiple mark patterns in the second grinding mark close to the target grinding position are both located on the extension line of the target grinding position along the second direction; wherein the second direction is perpendicular to the first direction.

4. The semiconductor chip sample cross-section positioning grinding system according to claim 2, characterized in that: The size and shape of the marking graphics are the same.

5. The positioning grinding system for a semiconductor chip sample cross section according to claim 2, characterized in that: The side length or diameter of each of the marking patterns ranges from 1 μm to 100 μm.

6. The positioning grinding system for a semiconductor chip sample cross section according to claim 2, characterized in that: The marking pattern includes at least one of the following: a rectangle, a trapezoid and a circle.

7. The positioning grinding system for a semiconductor chip sample cross section according to claim 1, characterized in that: The grinding mark is generated by processing on the surface of the semiconductor chip sample to be ground by a focused ion beam.

8. The positioning grinding system for a semiconductor chip sample cross section according to claim 1, characterized in that: Also includes lasers; The laser is used to mark the target grinding position.

9. The positioning grinding system for a semiconductor chip sample cross section according to claim 2, characterized in that: Along a second direction, a minimum distance between the first grinding mark and the second grinding mark is greater than 100 μm, and the second direction is perpendicular to the first direction.

10. A method for positioning and grinding a cross section of a semiconductor chip sample, characterized in that: A positioning grinding system for a semiconductor chip sample cross section according to any one of claims 1 to 9, comprising: Providing semiconductor chip samples to be ground; Determining a target grinding position according to the semiconductor chip sample to be ground, and marking the target grinding position; Generating a first grinding mark and a second grinding mark on both sides of the target grinding position respectively; The semiconductor chip sample to be ground is ground according to the target grinding position, the first grinding mark and the second grinding mark.

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