Nickel plate leveling process

Abstract

The invention discloses a nickel plate leveling process which comprises an adhesive layer and a nickel plate, a protective film is arranged on the adhesive layer of the adhesive layer, and the leveling process comprises the following steps: (1) cutting the protective film of the adhesive layer in the width direction at a position which is h away from one end in the length direction of the adhesive layer, and tearing off the small section of the protective film; (2) one end of a nickel plate is adhered to the adhesive layer with the protective film torn off, and the adhesive layer and the nickel plate are mutually flattened; (3) tearing off the remaining protective film of the adhesive layer; and (4) gradually bonding the nickel plate and the bonding layer in the direction from one bonding end to the other bonding end in the step (2). According to the nickel plate leveling process, bubbles entering the space between the nickel plate and the adhesive layer are reduced, and the nickel plate forming effect is smoother.

Description

Technical Field

[0001] The present invention relates to the technical field of leveling equipment, and more specifically, to a nickel plate leveling process. Background Art

[0002] The nickel plate currently used for laser film application is a thin-layer sheet structure with a rectangular structure. One side of the nickel plate is bonded to the double-sided tape. The protective film on one side of the double-sided tape is torn off and then the nickel plate is bonded. During bonding, the double-sided tape is placed horizontally on the table, and the nickel plate is bonded to the double-sided tape from top to bottom. Due to the unevenness of the nickel plate itself and its own gravity, the tension in the middle is insufficient. During bonding, air is easily introduced between the nickel plate and the double-sided tape to form bubbles, causing the nickel plate to become uneven and distorted. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a nickel plate flattening process to reduce the entry of bubbles between the nickel plate and the adhesive layer, so that the nickel plate forming effect is smoother.

[0004] In order to achieve the above object, the present invention adopts the following technical scheme: a nickel plate leveling process, including an adhesive layer, a nickel plate, an adhesive layer of the adhesive layer is provided with a protective film, and the leveling steps are:

[0005] ① At a distance h from one end of the adhesive layer in the length direction, cut the protective film of the adhesive layer in the width direction and tear off the small section of the protective film;

[0006] ② Bond one end of the nickel plate to the adhesive layer of the torn protective film, and press the adhesive layer and the nickel plate flat against each other;

[0007] ③Tear off the remaining protective film of the adhesive layer;

[0008] ④ Gradually bond the nickel plate to the adhesive layer along the direction from one end bonded in step ② to the other end.

[0009] The present invention is further configured such that the h value is 8 cm-10 cm.

[0010] The present invention is further configured such that, in step ②, the adhesive layer and the nickel plate are both arranged vertically, and the bonding ends of the adhesive layer and the nickel plate are located at the bottom.

[0011] The present invention is further configured such that, in step ④, the adhesive layer is arranged obliquely, and the bonding end of the adhesive layer and the nickel plate in step ② is at a high position.

[0012] The present invention is further configured to include a leveling device, which includes a back plate, the back plate includes a connecting portion, the connecting portion is equipped with a rotating shaft, the rotating shaft passes through the connecting portion, the rotating shaft can rotate along its own axis to drive the connecting portion to rotate synchronously, the back plate is provided with a planar portion, the planar portion can be bonded with an adhesive layer, and the rotation of the connecting portion can make the planar portion be in a vertical state or in an inclined state.

[0013] The present invention is further configured as follows: a fixed plate is installed on the back plate, the fixed plates are located at both ends of the length direction of the plane part, a shaft body 1 is installed between the two fixed plates, a movable module is installed on the shaft body 1, the movable module can move axially along the shaft body 1, a connecting plate 1 is installed on the connecting plate 1, a driving component 2 is installed on the output end of the driving component 2, the movable plate is installed on the movable plate, a main rod is installed on the main rod, a sleeve rod is installed, the sleeve rod can move in a direction perpendicular to the plane part, and the sleeve rod is located at one end where the adhesive layer is bonded to the nickel plate in step ②.

[0014] The present invention is further configured such that a fixing plate is installed with a fixing rod, the fixing rod is installed with a slider, the slider is installed with a driving component 1, the slider is provided with a clamping plate surface, and the output end of the driving component 1 and the clamping plate surface clamp the nickel plate away from one end of the sleeve rod.

[0015] The present invention is further configured such that the shaft body 1 is also equipped with a connecting plate 2, the connecting plate 2 is equipped with a support rod, the support rod and the sleeve rod are arranged in parallel and the distance between the two does not exceed 15 cm, and the nickel plate bypasses the side of the support rod away from the plane part and extends between the sleeve rod and the plane part.

[0016] The present invention is further configured such that a sleeve is sleeved on the outer wall of the sleeve rod, the main rod includes extension rods located at both axial ends, the sleeve rod is located on both sides of the main rod, the extension rods are inserted into the sleeve rod, the sleeve rod is provided with a groove body, the sleeve rod is sleeved with a spring three, and the axial ends of the spring three are respectively abutted against the groove body wall and the main rod, so that the sleeve rod can open the sleeve outward along the axial direction of the main rod.

[0017] The present invention is further configured such that the leveling device also includes a second bottom plate, the upper end surface of the second bottom plate is a horizontal plane, and the back plate is also provided with an inclined portion, which can fit the upper end surface of the second bottom plate to make the plane portion in an inclined state.

[0018] In summary, the present invention has the following beneficial effects:

[0019] Since the nickel plate is set vertically, the concave phenomenon caused by local gravity when the nickel plate is laid flat is eliminated, making it easier to control the nickel plate for pasting and convenient to operate. The support rod can prevent the nickel plate that has not been rolled by the main rod and the sleeve rod from contacting the adhesive layer, and the nickel plate remains in a tensioned state to prevent bubbles from being generated between the nickel plate and the adhesive layer during rolling. Moreover, the adhesive layer and the nickel plate are both tilted downward to the left, and the rolling is carried out from top to bottom. At the point where the nickel plate is about to be rolled, the nickel plate is naturally close to the adhesive layer under the action of gravity, reducing the gas between the nickel plate and the adhesive layer, so that the phenomenon of bubbles entering the nickel plate and the adhesive layer can be reduced after the nickel plate and the adhesive layer are bonded. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A cross-sectional view of an embodiment Figure 1 ;

[0021] Figure 2 A cross-sectional view of an embodiment Figure 2 ;

[0022] Figure 3 for Figure 2 The enlarged view of point A in the middle;

[0023] Figure 4 It is a schematic diagram of the assembly cross section of the main rod and the sleeve rod in the embodiment;

[0024] Figure 5 for Figure 4 The enlarged view of point B in the middle;

[0025] Figure 6 A cross-sectional view of an embodiment Figure 3 .

[0026] Figure numerals: back plate 1, plane part 11, inclined part 12, connecting part 13, fixed seat 2, rotating shaft 21, fixed plate 3, shaft body 1 31, fixed rod 32, slider 321, splint plate surface 3211, limiting ring 322, spring 1 323, spring 2 324, driving component 1 325, moving module 33, connecting plate 1 331, connecting plate 2 332, side plate 1 3321, support rod 3322, driving component 2 4, moving plate 41, side plate 2 411, main rod 5, extension rod 51, spring 3 52, sleeve rod 6, trough body 61, cushion sleeve 7, bottom plate 1 8, bottom plate 2 81, adhesive layer 9, nickel plate 91, pressing block 10. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] like Figure 1-Figure 6 As shown, this embodiment discloses a nickel plate leveling process, including an adhesive layer 9 and a nickel plate 91. The adhesive layer of the adhesive layer 9 is provided with a protective film. The nickel plate 91 is a rectangular sheet structure. The adhesive layer 9 is a double-sided adhesive. The adhesive layer 9 has the same area as the nickel plate 91. The specific leveling steps are:

[0029] ① Such as Figure 2 , Figure 3 As shown, the adhesive layer 9 and the nickel plate 91 are both arranged vertically. At a distance h from one end (i.e., the lower end) of the adhesive layer 9 in the length direction, where the h value is 8cm-10cm, the protective film of the adhesive layer 9 is cut along the width direction (i.e., the direction of the dotted line L), and the small section of the protective film is torn off.

[0030] ② Keep the vertical position of the adhesive layer 9 and the nickel plate 91 unchanged, adhere the lower end of the nickel plate 91 to the adhesive layer 9 of the torn protective film, and press the adhesive layer 9 and the nickel plate 91 flat against each other. Since the nickel plate 91 is set vertically, the concave phenomenon caused by the local gravity when the nickel plate 91 is laid flat is eliminated, making it easier to control the nickel plate 91 for pasting and convenient operation. Since the bonding point is located at the lower end of the nickel plate 91, the upper nickel plate 91 is easily separated from the adhesive layer 9 during bonding, which is convenient for the subsequent tearing operation of the adhesive layer 9 protective film.

[0031] ③ Tear off the remaining protective film of the adhesive layer 9.

[0032] ④ Such as Figure 6 As shown, the adhesive layer 9 is tilted, the right side of the adhesive layer 9 is at a high position, and the right side of the adhesive layer 9 is the bonding end in step ②. The nickel plate 91 is gradually bonded to the adhesive layer 9 along the tilted downward direction of the adhesive layer 9.

[0033] like Figure 1 , Figure 6 As shown, the nickel plate flattening process includes a flattening device, which includes a backing plate 1 and a fixing seat 2. The backing plate 1 includes a connecting portion 13, and the connecting portion 13 is provided with a rotating shaft 21. The rotating shaft 21 passes through the connecting portion 13 and is connected with a key. The rotating shaft 21 can rotate along its own axis to drive the connecting portion 13 to rotate synchronously. Both ends of the rotating shaft 21 are hingedly mounted on the fixing seat 2, and the rotating shaft 21 is driven to rotate by connecting a motor.

[0034] The back plate 1 is provided with a plane portion 11, and the plane portion 11 can be bonded with the adhesive layer 9. Fixed bonding points are set on the plane portion 11. The glue only needs to fix the adhesive layer 9 on the plane portion 11 and prevent it from falling off in a vertical state. After the leveling process is completed, the glue can be directly removed. The connection portion 13 can be rotated to make the plane portion 11 in a vertical state or in an inclined state. Specifically, Figure 1 In the embodiment, after the connecting portion 13 rotates, the bottom of the backing plate 1 abuts against the bottom plate 8, and the plane portion 11 is in a vertical state; Figure 6 In the figure, the leveling device further comprises a bottom plate 81, the upper end surface of the bottom plate 81 is a horizontal plane, and the back plate 1 is further provided with an inclined portion 12, which can fit the upper end surface of the bottom plate 81 to make the plane portion 11 in an inclined state.

[0035] like Figure 1 As shown, the backing plate 1 is installed with a fixing plate 3, and the fixing plates 3 are located at both ends of the plane portion 11 in the length direction. An axle body 31 is installed between the two fixing plates 3, and the axle body 31 is installed with a moving module 33, and the moving module 33 can move axially along the axle body 31. Figure 1In the shown position, the fixing plate 3 located at the top is equipped with a fixing rod 32, the fixing rod 32 is inserted into the fixing plate 3, and the lower end of the fixing rod 32 extends out of the fixing plate 3. The fixing rod 32 is equipped with a slider 321, and the slider 321 is respectively abutted with a spring 1 323 and a spring 2 324 at both ends of the axial direction of the fixing rod 32, the upper end of the spring 2 324 abuts the fixing plate 3, and the lower end abuts the slider 321, the upper end of the spring 1 323 abuts the slider 321, and the lower end abuts the limit ring 322, and the limit ring 322 is installed at the bottom of the fixing rod 32.

[0036] like Figure 1 As shown, the slider 321 is installed with a driving component 325, the driving component 325 is a cylinder, the slider 321 is provided with a clamping plate surface 3211, the output end of the driving component 325 is connected with a clamping plate, the clamping plate and the clamping plate surface 3211 can clamp the upper end of the nickel plate 91, and the clamping plate and the clamping plate surface 3211 are both long strips.

[0037] like Figure 2 , Figure 3 As shown, the mobile module 33 is installed on the shaft body 1 31, and the mobile module 33 can move along the shaft body 1 31. The mobile module 33 is installed with a connecting plate 1 331, and the connecting plate 1 331 is installed with a driving component 2 4. The driving component 2 4 is a cylinder, and a moving plate 41 is installed at the output end of the driving component 2 4. Figure 4 The movable plate 41 includes two side plates 411 on both sides, and a main rod 5 is installed between the two side plates 411. The main rod 5 and the sleeve rod 6 form a long cylindrical structure. The outer wall of the sleeve rod 6 is covered with a cushion sleeve 7, and the cushion sleeve 7 wraps the outer wall of the main rod 5 and the sleeve rod 6. Figure 4 As shown, the main rod 5 is also equipped with a pressing block 10 to press the cushion sleeve 7 tightly.

[0038] The main rod 5 includes an extension rod 51 at both ends of the axial direction, and a sleeve rod 6 is located at both sides of the main rod 5. The extension rod 51 is inserted into the sleeve rod 6. The sleeve rod 6 is provided with a groove body 61. The sleeve rod 6 is sleeved with a spring 3 52. The axial ends of the spring 3 52 are respectively in contact with the wall surface of the groove body 61 and the main rod 5. Figure 6 As shown, when the plane portion 11 is in an inclined state, the main rod 5 and the sleeve rod 6 roll in a downward direction along the plane portion 11. Since the cushion sleeve 7 is made of soft material, once it is subjected to force and arches during the rolling process, it will cause the nickel plate 91 to have wrinkles during the bonding process with the adhesive layer 9. Therefore, the main rod 5 and the sleeve rod 6 are arranged so that the sleeve rod 6 can push the cushion sleeve 7 outward along the axial direction of the main rod 5 to prevent the cushion sleeve 7 from arching, thereby ensuring that the nickel plate 91 is more flat when bonded with the adhesive layer 9.

[0039] like Figure 3As shown, the shaft body 31 is also equipped with a connecting plate 332, and the connecting plate 332 includes a side plate 3321 located on both sides, and a support rod 3322 is installed between the two side plates 3321. The support rod 3322 is arranged in parallel with the sleeve rod 6 and the distance between the two does not exceed 15 cm. The support rod 3322 is set away from the plane part 11, and the deviation distance is 5 cm. The bottom of the nickel plate 91 bypasses the support rod 3322 away from the plane part 11 and extends between the sleeve rod 6 and the plane part 11. Under the drive of the driving component 2 4, the sleeve rod 6 can move to the left in a direction perpendicular to the plane part 11. The main rod 5 and the sleeve rod 6 abut the nickel plate 91 against the adhesive layer 9 and roll back and forth through the moving module 33 to achieve the bonding of the adhesive layer 9 and the nickel plate 91 in step ②.

[0040] Figure 2 , Figure 3 In the embodiment, since the top of the nickel plate 91 is suspended, the nickel plate 91 above the main rod 5 and the sleeve rod 6 is stretched to the right by the support rod 3322. Figure 6 In the process, when the operation of step ④ is completed, the support rod 3322 can prevent the nickel plate 91 that has not been rolled by the main rod 5 and the sleeve rod 6 from contacting the adhesive layer 9, and the nickel plate 91 is kept in a tensioned state to prevent bubbles from being generated between the nickel plate 91 and the adhesive layer 9 during rolling. Moreover, the adhesive layer 9 and the nickel plate 91 are both tilted downward to the left, and the rolling is performed from top to bottom. At the point where the nickel plate 91 is about to be rolled, the nickel plate 91 is naturally close to the adhesive layer 9 under the action of gravity, reducing the gas between the nickel plate 91 and the adhesive layer 9, so that the phenomenon of reducing bubbles entering the nickel plate 91 and the adhesive layer 9 after the nickel plate 91 and the adhesive layer 9 are bonded can be achieved.

[0041] At the final stage of rolling, the nickel plate 91 is released from the clamp and the clamp plate surface 3211, and the nickel plate 91 is manually operated to complete the bonding of the final section. After completion, the bonded nickel plate 91 and the adhesive layer 9 are removed and the next operation is performed.

[0042] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A nickel plate leveling process, characterized in that: It comprises an adhesive layer (9) and a nickel plate (91), wherein the adhesive layer of the adhesive layer (9) is provided with a protective film, and the leveling steps are as follows: ① Cutting the protective film of the adhesive layer (9) along the width direction at a distance h from one end of the adhesive layer (9) in the length direction, and tearing off the small section of the protective film; ② bonding one end of the nickel plate (91) to the adhesive layer (9) with the protective film torn off, and pressing the adhesive layer (9) and the nickel plate (91) flat against each other; ③ Tear off the remaining protective film of the adhesive layer (9); ④ Gradually bond the nickel plate (91) to the adhesive layer (9) along the direction from one end to the other end in step ②.

2. A nickel plate flattening process according to claim 1, characterized in that: The h value is 8cm-10cm.

3. A nickel plate flattening process according to claim 1, characterized in that: In step ②, the adhesive layer (9) and the nickel plate (91) are both arranged vertically, and the bonding ends of the adhesive layer (9) and the nickel plate (91) are located at the bottom.

4. A nickel plate flattening process according to claim 1, characterized in that: In step ④, the adhesive layer (9) is arranged at an angle, and the bonding ends of the adhesive layer (9) and the nickel plate (91) in step ② are at a high position.

5. A nickel plate flattening process according to claim 1, characterized in that: The invention also comprises a leveling device, wherein the leveling device comprises a backing plate (1), the backing plate (1) comprises a connecting portion (13), the connecting portion (13) is provided with a rotating shaft (21), the rotating shaft (21) passes through the connecting portion (13), the rotating shaft (21) can rotate along its own axis to drive the connecting portion (13) to rotate synchronously, the backing plate (1) is provided with a plane portion (11), the plane portion (11) can be bonded to the adhesive layer (9), and the connecting portion (13) can be rotated so that the plane portion (11) is in a vertical state or in an inclined state.

6. A nickel plate flattening process according to claim 5, characterized in that: The support plate (1) is provided with a fixing plate (3), and the fixing plates (3) are located at both ends of the plane portion (11) in the length direction. An axis body (31) is provided between the two fixing plates (3). The axis body (31) is provided with a movable module (33), and the movable module (33) can move axially along the axis body (31). The movable module (33) is provided with a connecting plate (331), and the connecting plate (331) is provided with a driving component (4). The output end of the driving component (4) is provided with a moving plate (41), and the moving plate (41) is provided with a main rod (5), and the main rod (5) is provided with a sleeve rod (6), and the sleeve rod (6) can move in a direction perpendicular to the plane portion (11). The sleeve rod (6) is provided at one end where the adhesive layer (9) and the nickel plate (91) are bonded in step ②.

7. A nickel plate flattening process according to claim 6, characterized in that: One of the fixing plates (3) is installed with a fixing rod (32), the fixing rod (32) is installed with a slider (321), the slider (321) is installed with a driving component 1 (325), the slider (321) is provided with a clamping plate surface (3211), and the output end of the driving component 1 (325) and the clamping plate surface (3211) clamp the nickel plate (91) away from the end of the sleeve rod (6).

8. A nickel plate flattening process according to claim 6, characterized in that: The shaft body (31) is also provided with a connecting plate (332), and the connecting plate (332) is provided with a support rod (3322). The support rod (3322) is arranged parallel to the sleeve rod (6) and the distance between the two does not exceed 15 cm. The nickel plate (91) bypasses the support rod (3322) and is away from the side of the plane part (11) and extends between the sleeve rod (6) and the plane part (11).

9. A nickel plate flattening process according to claim 6, characterized in that: The outer wall of the sleeve rod (6) is sleeved with a cushion sleeve (7); the main rod (5) comprises extension rods (51) located at two axial ends; the sleeve rod (6) is located at two sides of the main rod (5); the extension rods (51) are inserted into the sleeve rod (6); the sleeve rod (6) is provided with a groove body (61); the sleeve rod (6) is sleeved with a spring three (52); the axial ends of the spring three (52) are respectively in contact with the wall surface of the groove body (61) and the main rod (5), so that the sleeve rod (6) can open the cushion sleeve (7) outward along the axial direction of the main rod (5).

10. A nickel plate flattening process according to claim 5, characterized in that: The leveling device also includes a second bottom plate (81), the upper end surface of the second bottom plate (81) is a horizontal plane, and the backing plate (1) is also provided with an inclined portion (12), and the inclined portion (12) can fit the upper end surface of the second bottom plate (81) to make the plane portion (11) in an inclined state.

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