Nickel plate leveling process

Abstract

The present invention discloses a nickel plate flattening process, comprising an adhesive layer and a nickel plate. The adhesive layer of the adhesive layer is provided with a protective film. The flattening steps are as follows: ① cutting the protective film of the adhesive layer along the width direction at a distance h from one end of the adhesive layer in the longitudinal direction, and tearing off the small section of the protective film; ② bonding one end of the nickel plate to the adhesive layer with the torn protective film, and flattening the adhesive layer and the nickel plate; ③ tearing off the remaining protective film of the adhesive layer; ④ gradually bonding the nickel plate and the adhesive layer in a direction from one end bonded in step ② toward the other end. The present invention provides a nickel plate flattening process, which reduces the entry of bubbles between the nickel plate and the adhesive layer, and achieves a smoother nickel plate molding effect.

Description

Technical Field

[0001] The present invention relates to the technical field of leveling equipment, and more particularly to a nickel plate leveling process. Background Art

[0002] The nickel plate currently used for laser film application is a thin-layer sheet structure with a rectangular structure. One side of the nickel plate is bonded to the double-sided tape. The protective film on one side of the double-sided tape is torn off and then bonded to the nickel plate. During bonding, the double-sided tape is placed horizontally on the table, and the nickel plate is bonded to the double-sided tape from top to bottom. Due to the unevenness of the nickel plate itself and its own gravity, the tension in the middle position is insufficient. During bonding, air easily enters between the nickel plate and the double-sided tape to form bubbles, causing the nickel plate to become uneven and distorted. Summary of the Invention

[0003] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art and provide a nickel plate leveling process to reduce the entry of bubbles between the nickel plate and the adhesive layer, so that the nickel plate forming effect is smoother.

[0004] In order to achieve the above object, the present invention adopts the following technical solution: a nickel plate leveling process, comprising an adhesive layer, a nickel plate, an adhesive layer of the adhesive layer being provided with a protective film, and the leveling steps are as follows:

[0005] ① At a distance h from one end of the adhesive layer in the length direction, cut the protective film of the adhesive layer along the width direction and tear off the small section of protective film;

[0006] ②Glue one end of the nickel plate to the adhesive layer of the torn protective film, and press the adhesive layer and the nickel plate flat against each other;

[0007] ③Tear off the remaining protective film on the adhesive layer;

[0008] ④ Gradually bond the nickel plate to the adhesive layer along the direction from one end bonded in step ② to the other end.

[0009] The present invention is further configured such that the h value is 8cm-10cm.

[0010] The present invention is further configured such that, in step ②, the adhesive layer and the nickel plate are both arranged vertically, and the bonding ends of the adhesive layer and the nickel plate are located at the bottom.

[0011] The present invention is further configured such that, in step ④, the adhesive layer is arranged obliquely, and the adhesive end of the adhesive layer and the nickel plate in step ② is at a high position.

[0012] The present invention is further configured to include a leveling device, which includes a back plate, the back plate includes a connecting part, the connecting part is equipped with a rotating shaft, the rotating shaft passes through the connecting part, the rotating shaft can rotate along its own axis to drive the connecting part to rotate synchronously, the back plate is provided with a flat part, the flat part can be bonded to the adhesive layer, and the rotation of the connecting part can make the flat part be in a vertical state or in an inclined state.

[0013] The present invention is further configured such that the back plate is installed with a fixed plate, the fixed plates are located at both ends of the length direction of the plane part, a shaft body 1 is installed between the two fixed plates, the shaft body 1 is installed with a movable module, the movable module can move axially along the shaft body 1, the movable module is installed with a connecting plate 1, the connecting plate 1 is installed with a driving component 2, the output end of the driving component 2 is installed with a movable plate, the movable plate is installed with a main rod, the main rod is installed with a sleeve rod, the sleeve rod can move in a direction perpendicular to the plane part, and the sleeve rod is located at one end where the adhesive layer is bonded to the nickel plate in step ②.

[0014] The present invention is further configured such that one of the fixed plates is installed with a fixed rod, the fixed rod is installed with a slider, the slider is installed with a driving component 1, the slider is provided with a splint surface, and the output end of the driving component 1 and the splint surface clamp the nickel plate away from one end of the sleeve rod.

[0015] The present invention is further configured such that the shaft body 1 is also equipped with a connecting plate 2, the connecting plate 2 is equipped with a support rod, the support rod and the sleeve rod are arranged parallel to each other and the distance between the two does not exceed 15 cm, the nickel plate bypasses the side of the support rod away from the plane part and extends between the sleeve rod and the plane part.

[0016] The present invention is further configured such that a gasket is sleeved on the outer wall of the sleeve rod, the main rod includes extension rods located at both axial ends, the sleeve rod is located on both sides of the main rod, the extension rods are inserted into the sleeve rod, the sleeve rod is provided with a groove body, and the sleeve rod is sleeved with a spring three, the axial ends of the spring three respectively abut against the groove body wall and the main rod, so that the sleeve rod can push the gasket outward along the axial direction of the main rod.

[0017] The present invention is further configured such that the leveling device also includes a second bottom plate, the upper end surface of the second bottom plate is a horizontal plane, and the back plate is also provided with an inclined portion, which can fit the upper end surface of the second bottom plate to make the flat portion in an inclined state.

[0018] In summary, the present invention has the following beneficial effects:

[0019] Since the nickel plate is set vertically, the concave phenomenon caused by the local gravity when the nickel plate is placed flat is eliminated, making it easier to control the nickel plate for pasting and convenient operation. The support rod can prevent the nickel plate that has not been rolled by the main rod and the sleeve rod from contacting the adhesive layer, and the nickel plate remains in a tensioned state to prevent bubbles from being generated between the nickel plate and the adhesive layer during rolling. Moreover, the adhesive layer and the nickel plate are both tilted to the left and downward, and the rolling is carried out from top to bottom. At the point where the nickel plate is about to be rolled, the nickel plate is naturally close to the adhesive layer under the action of gravity, reducing the gas between the nickel plate and the adhesive layer, thereby reducing the occurrence of bubbles entering the nickel plate and the adhesive layer after they are bonded. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A cross-sectional view of an embodiment Figure 1 ;

[0021] Figure 2 A cross-sectional view of an embodiment Figure 2 ;

[0022] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0023] Figure 4 Schematic diagram of the assembly cross section of the main rod and the sleeve rod in the embodiment;

[0024] Figure 5 for Figure 4 Enlarged view of point B in the middle;

[0025] Figure 6 A cross-sectional view of an embodiment Figure 3 .

[0026] Figure numerals: back plate 1, plane part 11, inclined part 12, connecting part 13, fixed seat 2, rotating shaft 21, fixed plate 3, shaft body 1 31, fixed rod 32, slider 321, splint plate surface 3211, limiting ring 322, spring 1 323, spring 2 324, driving component 1 325, movable module 33, connecting plate 1 331, connecting plate 2 332, side plate 1 3321, support rod 3322, driving component 2 4, movable plate 41, side plate 2 411, main rod 5, extension rod 51, spring 3 52, sleeve rod 6, groove body 61, gasket 7, bottom plate 1 8, bottom plate 2 81, adhesive layer 9, nickel plate 91, pressing block 10. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] like Figures 1-6 As shown, this embodiment discloses a nickel plate leveling process, including an adhesive layer 9 and a nickel plate 91. The adhesive layer of the adhesive layer 9 is provided with a protective film. The nickel plate 91 is a rectangular sheet structure. The adhesive layer 9 is a double-sided tape. The adhesive layer 9 and the nickel plate 91 have the same area. The specific leveling steps are:

[0029] ① Such as Figure 2 、 Figure 3 As shown, the adhesive layer 9 and the nickel plate 91 are both arranged vertically. At a distance h from one end (i.e., the lower end) of the adhesive layer 9 in the longitudinal direction, where the h value is 8cm-10cm, the protective film of the adhesive layer 9 is cut along the width direction (i.e., the direction of the dotted line L), and the small section of the protective film is torn off.

[0030] ② Maintaining the vertical position of the adhesive layer 9 and the nickel plate 91, adhere the lower end of the nickel plate 91 to the adhesive layer 9 from which the protective film has been removed, flattening the adhesive layer 9 and the nickel plate 91. The vertical position of the nickel plate 91 eliminates the concavity caused by local gravity when the nickel plate 91 is laid flat, making it easier to control the nickel plate 91 during adhesion and facilitating operation. Since the bonding point is located at the lower end of the nickel plate 91, the upper portion of the nickel plate 91 easily separates from the adhesive layer 9 during adhesion, facilitating the subsequent tearing of the protective film of the adhesive layer 9.

[0031] ③ Tear off the remaining protective film of the adhesive layer 9.

[0032] ④ Such as Figure 6 As shown, the adhesive layer 9 is tilted, the right side of the adhesive layer 9 is at a high position, and the right side of the adhesive layer 9 is the bonding end in step ②. The nickel plate 91 is gradually bonded to the adhesive layer 9 along the tilted downward direction of the adhesive layer 9.

[0033] like Figure 1 、 Figure 6 As shown, the nickel plate leveling process includes a leveling device, which includes a support plate 1 and a fixed base 2. The support plate 1 includes a connecting portion 13, and the connecting portion 13 is equipped with a rotating shaft 21. The rotating shaft 21 passes through the connecting portion 13 and is connected with a key. The rotating shaft 21 can rotate along its own axis to drive the connecting portion 13 to rotate synchronously. The rotating shaft 21 is hinged at both ends and is respectively mounted on the fixed base 2. The rotating shaft 21 is driven to rotate by a connected motor.

[0034] The back plate 1 is provided with a flat surface 11, which can be bonded to the adhesive layer 9. Fixed bonding points are set on the flat surface 11. The glue only needs to fix the adhesive layer 9 on the flat surface 11 and prevent it from falling off in a vertical state. After the leveling process is completed, the glue can be directly removed. The connection part 13 can be rotated to make the flat surface 11 in a vertical state or in an inclined state. Specifically, Figure 1 In the middle, after the connecting portion 13 rotates, the bottom of the back plate 1 abuts against the bottom plate 8, and the plane portion 11 is in a vertical state; Figure 6 In the figure, the leveling device further comprises a bottom plate 81, the upper end surface of the bottom plate 81 is a horizontal plane, and the back plate 1 is further provided with an inclined portion 12, which can fit the upper end surface of the bottom plate 81 to make the plane portion 11 in an inclined state.

[0035] like Figure 1 As shown, the back plate 1 is installed with fixed plates 3, which are located at both ends of the plane part 11 in the length direction. A shaft body 31 is installed between the two fixed plates 3, and a movable module 33 is installed on the shaft body 31. The movable module 33 can move axially along the shaft body 31. Figure 1In the illustrated position, the upper fixed plate 3 is mounted with a fixing rod 32, which is inserted into the fixed plate 3 and has its lower end extending out of the fixed plate 3. A slider 321 is mounted on the fixed rod 32. A spring 1 323 and a spring 2 324 are respectively abutted against the slider 321 at both ends of the slider 321 along the axis of the fixed rod 32. The upper end of the spring 2 324 abuts the fixed plate 3, while its lower end abuts the slider 321. The upper end of the spring 1 323 abuts the slider 321, while its lower end abuts a limit ring 322, which is mounted on the bottom of the fixed rod 32.

[0036] like Figure 1 As shown, the slider 321 is installed with a driving component 325, which is a cylinder. The slider 321 is provided with a splint surface 3211. The output end of the driving component 325 is connected to a splint. The splint and the splint surface 3211 can clamp the upper end of the nickel plate 91. The splint and the splint surface 3211 are both long strips.

[0037] like Figure 2 、 Figure 3 As shown, the mobile module 33 is installed on the shaft body 1 31, and the mobile module 33 can move along the shaft body 1 31. The mobile module 33 is installed with a connecting plate 1 331, and the connecting plate 1 331 is installed with a driving component 2 4. The driving component 2 4 is a cylinder, and the output end of the driving component 2 4 is installed with a moving plate 41. Figure 4 The movable plate 41 includes two side plates 411 on both sides. A main rod 5 is installed between the two side plates 411. The main rod 5 and the sleeve rod 6 form a long cylindrical structure. The outer wall of the sleeve rod 6 is covered with a cushion sleeve 7. The cushion sleeve 7 wraps the outer wall of the main rod 5 and the sleeve rod 6. Figure 4 As shown, the main rod 5 is also equipped with a pressing block 10 to press the cushion cover 7 tightly.

[0038] The main rod 5 includes an extension rod 51 at both ends of the axial direction, and a sleeve rod 6 is located on both sides of the main rod 5. The extension rod 51 is inserted into the sleeve rod 6. The sleeve rod 6 is provided with a groove 61. The sleeve rod 6 is covered with a spring 52. The axial ends of the spring 52 are respectively in contact with the wall of the groove 61 and the main rod 5. Figure 6 As shown, when the plane portion 11 is in an inclined state, the main rod 5 and the sleeve rod 6 roll in a downward direction along the plane portion 11. Since the cushion sleeve 7 is made of soft material, once it is subjected to force and arches during the rolling process, it will cause the nickel plate 91 to wrinkle during the bonding process with the adhesive layer 9. Therefore, the main rod 5 and the sleeve rod 6 are arranged so that the sleeve rod 6 can push the cushion sleeve 7 outward along the axial direction of the main rod 5 to prevent the cushion sleeve 7 from arching, thereby ensuring that the nickel plate 91 is more flat when bonding with the adhesive layer 9.

[0039] like Figure 3As shown, the shaft body 31 is also equipped with a connecting plate 2 332, and the connecting plate 2 332 includes a side plate 1 3321 located on both sides, and a support rod 3322 is installed between the two side plates 1 3321. The support rod 3322 is arranged parallel to the sleeve rod 6 and the distance between the two is not more than 15 cm. The support rod 3322 is set away from the plane part 11, and the deviation distance is 5 cm. The bottom of the nickel plate 91 bypasses the support rod 3322 away from the plane part 11 and extends between the sleeve rod 6 and the plane part 11. Under the drive of the driving component 2 4, the sleeve rod 6 can move to the left in a direction perpendicular to the plane part 11. The main rod 5 and the sleeve rod 6 press the nickel plate 91 against the adhesive layer 9 and roll it back and forth through the movable module 33 to achieve the bonding of the adhesive layer 9 and the nickel plate 91 in step ②.

[0040] Figure 2 、 Figure 3 In the middle, since the top of the nickel plate 91 is suspended, the nickel plate 91 above the main rod 5 and the sleeve rod 6 is stretched to the right by the support rod 3322. Figure 6 In the embodiment, when the operation of step ④ is completed, the support rod 3322 can prevent the nickel plate 91 that has not been rolled by the main rod 5 and the sleeve rod 6 from contacting the adhesive layer 9, and the nickel plate 91 is kept in a tensioned state, thereby preventing bubbles from being generated between the nickel plate 91 and the adhesive layer 9 during rolling. Moreover, the adhesive layer 9 and the nickel plate 91 are both tilted downward to the left, and the rolling is carried out from top to bottom. At the point where the nickel plate 91 is about to be rolled, the nickel plate 91 is naturally close to the adhesive layer 9 under the action of gravity, reducing the gas between the nickel plate 91 and the adhesive layer 9, thereby reducing the occurrence of bubbles entering the nickel plate 91 and the adhesive layer 9 after the nickel plate 91 and the adhesive layer 9 are bonded.

[0041] At the end of rolling, the nickel plate 91 is released from the splint and the splint surface 3211, and the nickel plate 91 is manually bonded to complete the final section. After completion, the bonded nickel plate 91 and the adhesive layer 9 are removed and the next operation is performed.

[0042] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, various improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A nickel plate leveling process, characterized in that: It comprises an adhesive layer (9) and a nickel plate (91), wherein the adhesive layer of the adhesive layer (9) is provided with a protective film, and the leveling steps are as follows: ① Cutting the protective film of the adhesive layer (9) along the width direction at a distance h from one end of the adhesive layer (9) in the length direction, and tearing off the small section of the protective film; ② Adhere one end of the nickel plate (91) to the adhesive layer (9) with the protective film torn off, and flatten the adhesive layer (9) and the nickel plate (91) against each other; ③ Tear off the remaining protective film of the adhesive layer (9); ④ Gradually bonding the nickel plate (91) to the adhesive layer (9) along the direction from one end to the other end bonded in step ②; The device further comprises a leveling device, wherein the leveling device comprises a backing plate (1), the backing plate (1) comprises a connecting portion (13), the connecting portion (13) is provided with a rotating shaft (21), the rotating shaft (21) passes through the connecting portion (13), the rotating shaft (21) can rotate along its own axis to drive the connecting portion (13) to rotate synchronously, the backing plate (1) is provided with a plane portion (11), the plane portion (11) can be bonded to the adhesive layer (9), and the connecting portion (13) can be rotated to make the plane portion (11) be in a vertical state or in an inclined state; The support plate (1) is provided with a fixed plate (3), the fixed plate (3) is located at both ends of the length direction of the plane portion (11), a shaft body (31) is provided between the two fixed plates (3), the shaft body (31) is provided with a movable module (33), the movable module (33) can move axially along the shaft body (31), the movable module (33) is provided with a connecting plate (331), the connecting plate (331) is provided with a driving component (4), the output end of the driving component (4) is provided with a movable plate (41), the movable plate (41) is provided with a main rod (5), the main rod (5) is provided with a sleeve rod (6), the sleeve rod (6) can move in a direction perpendicular to the plane portion (11), and the sleeve rod (6) is provided at one end where the adhesive layer (9) and the nickel plate (91) are bonded in step ②; The outer wall of the sleeve rod (6) is sleeved with a gasket (7); the main rod (5) includes extension rods (51) located at both ends of the axial direction; the sleeve rod (6) is located on both sides of the main rod (5); the extension rod (51) is inserted into the sleeve rod (6); the sleeve rod (6) is provided with a groove body (61); the sleeve rod (6) is sleeved with a spring three (52); the axial ends of the spring three (52) are respectively in contact with the wall surface of the groove body (61) and the main rod (5), so that the sleeve rod (6) can open the gasket (7) outward along the axial direction of the main rod (5).

2. A nickel plate leveling process according to claim 1, characterized in that: The h value is 8cm-10cm.

3. A nickel plate leveling process according to claim 1, characterized in that: In step ②, the adhesive layer (9) and the nickel plate (91) are both arranged vertically, and the bonding ends of the adhesive layer (9) and the nickel plate (91) are located at the bottom.

4. A nickel plate leveling process according to claim 1, characterized in that: In step ④, the adhesive layer (9) is arranged at an angle, and the bonding ends of the adhesive layer (9) and the nickel plate (91) in step ② are at a high position.

5. A nickel plate leveling process according to claim 1, characterized in that: One of the fixing plates (3) is installed with a fixing rod (32), the fixing rod (32) is installed with a slider (321), the slider (321) is installed with a driving component (325), the slider (321) is provided with a clamping plate surface (3211), and the output end of the driving component (325) and the clamping plate surface (3211) clamp the nickel plate (91) away from one end of the sleeve rod (6).

6. A nickel plate leveling process according to claim 1, characterized in that: The shaft body (31) is also equipped with a connecting plate (332), and the connecting plate (332) is equipped with a support rod (3322). The support rod (3322) is arranged parallel to the sleeve rod (6) and the distance between the two does not exceed 15 cm. The nickel plate (91) bypasses the support rod (3322) away from the side of the plane part (11) and extends between the sleeve rod (6) and the plane part (11).

7. A nickel plate leveling process according to claim 1, characterized in that: The leveling device further comprises a second bottom plate (81), the upper end surface of the second bottom plate (81) being a horizontal plane, and the backing plate (1) is further provided with an inclined portion (12), the inclined portion (12) being able to fit the upper end surface of the second bottom plate (81) so that the plane portion (11) is in an inclined state.

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