Intelligent detection device and method for semiconductor processing equipment

Abstract

The invention provides an intelligent detection device and method for semiconductor processing equipment, and belongs to the technical field of semiconductor detection.The intelligent detection device comprises a delivery unit arranged on one side of a distribution unit, the distribution unit comprises two concave assembly seats, and power cylinders are rotationally connected between the inner walls of the front faces and the back faces of the assembly seats; and the two power cylinders are provided with a conveying belt, the front faces and the back faces of the two assembling bases are provided with bearing strips, the two bearing strips are provided with a detection frame, and the inner wall of the top of the detection frame is provided with a detection camera. According to the invention, the problems of low efficiency and high labor intensity due to the fact that the semiconductor parts are delivered on a production line during detection and how to place the semiconductor parts on the production line is generally manually added to the production line and delivered to a detection area are solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor detection, and in particular relates to an intelligent detection device and method for semiconductor processing equipment. Background Art

[0002] Semiconductor manufacturing is one of the most complex and technologically advanced manufacturing processes, which usually consists of more than 500 steps. These steps include synthesizing silicon wafers with silicon materials, manufacturing integrated circuits on the newly synthesized silicon wafers, and placing the integrated circuits into packages to produce usable products. In the semiconductor production process, it is necessary to effectively predict and detect product failures and defects, which can not only prevent sudden equipment damage, but also help improve productivity, reduce costs and repair time.

[0003] Semiconductors have different shapes, and sheet-shaped semiconductors are one of the main shapes. They are placed on the production line for delivery during inspection. However, how to place the semiconductors on the production line is generally to manually add the semiconductors to the production line and deliver them to the inspection area. This is not efficient and has high labor intensity. Therefore, an intelligent inspection device and method for semiconductor processing equipment are proposed. Summary of the invention

[0004] The present invention provides an intelligent detection device and method for semiconductor processing equipment, which aims to solve the problem that semiconductor parts are placed on the production line for delivery during detection. However, how to place semiconductor parts on the production line is generally to manually add semiconductor parts to the production line and deliver them to the detection area, which is not efficient enough and has high labor intensity.

[0005] An embodiment of the present invention provides an intelligent detection device for semiconductor processing equipment, comprising a delivery unit installed on one side of a delivery unit, the delivery unit comprising two concave assembly seats, a power cylinder is screwed between the front and back inner walls of the assembly seats, a transport belt is installed on the two power cylinders, support bars are installed on the front and back of the two assembly seats, an inspection frame is installed on the two support bars, a detection camera is installed on the top inner wall of the inspection frame, a motor 1 is fixedly connected to the front of the assembly seat on the left, and the power end of the motor 1 is fixedly connected to the front end of the power cylinder on the left. It is characterized in that the delivery unit comprises an assembly plate, both sides of the lower side of the assembly plate are fixedly connected to the supporting seats, and the upper side of the assembly plate is fixedly connected to a containing box, in which a plurality of semiconductor components are contained and placed, a delivery unit that is compatible with the containing box is installed on the assembly plate, and an adding unit that is compatible with the containing box is installed on the left side of the assembly plate.

[0006] Furthermore, the delivery unit includes a square opening 1 reserved on the left side of the assembly piece, an open hole is reserved on the top of the square opening 1, a square opening 2 is reserved on the right inner wall of the square opening 1, a linear driver 1 is fixedly connected between the upper inner wall and the lower inner wall of the square opening 2, a power end of the linear driver 1 extends into the square opening 1 and is fixedly connected to a right-angle traction rod, the top of the right-angle traction rod extends to the top of the assembly piece, a battery is fixedly connected between the upper inner wall and the lower inner wall of the square opening 2, the battery and the linear driver 1 are electrically connected, a through-opening 1 is reserved on the left inner wall of the accommodating box, a driving platform is installed in the through-opening 1, the right side of the right-angle traction rod extends into the through-opening 1 and is fixedly connected to the left side of the driving platform, the right side of the driving platform and the left inner wall of the accommodating box are in a straight line, and the right side of the driving platform and the lowest point The semiconductor component is fitted on the left side, and the lower inner wall of the square opening one is fixedly connected to the stop platform. The right side of the stop platform and the left side of the right-angle traction rod are displacement-fitted, and the left inner wall of the right-angle traction rod is fixedly connected to the constraint rod. The right inner wall of the square opening one reserves square opening three, and the right end of the constraint rod extends into the square opening three. A button is fixedly connected between the upper inner wall and the lower inner wall of the square opening three. A unloading port is reserved on the right inner wall of the accommodating box, and the upper inner wall of the unloading port is fixedly connected to the concave platform. A guide cylinder rotates between the front inner wall and the back inner wall of the concave platform, and the front of the concave platform is fixedly connected to motor two, and the motor two is connected to the battery. The power end of the motor two is fixedly connected to the front end of the guide cylinder, and the button is connected to motor two. The right inner wall of the accommodating box is fixedly connected to a guide plate installed at an angle, and the guide plate and the conveying belt are adapted to each other.

[0007] Furthermore, the adding unit includes a second linear drive fixedly connected to the left side of the assembly piece, two right-angle rods are fixedly connected to the left side of the second linear drive, a displacement table is slidably installed on the two right-angle rods, a third linear drive is inserted on the left side of the displacement table, a power end of the third linear drive is fixedly connected to the adding piece, a constraint piece is fixedly connected to the left side of the adding piece, the displacement table is slidably installed on the constraint piece, the constraint piece is between the two right-angle rods, cavities are reserved on the inner walls on both sides of the adding piece, the lower inner wall of the cavity is open, a supporting rod is screwed between the front inner wall and the back inner wall of the cavity, a blocking platform is fixedly connected to the supporting rod, and the two blocking The sides of the blocks that are close to each other extend into the additional sheet, and a disk with reserved teeth is fixedly connected to the supporting rod, and the disk is located on the front side of the matching blocker. The sides of the two disks that are away from each other bite a sheet body two with reserved teeth, and square openings four are reserved on both sides of the top of the additional sheet, and square rods are slidably installed in the square openings four. The upper ends of the sheet body two extend into the matching square openings four and are fixedly connected to the bottom of the square rod, and the upper ends of the two square rods extend to the top of the additional sheet and are fixedly connected to a displacement rod, and the right side of the additional sheet is fixedly connected to a linear drive four, and the power end of the linear drive four is fixedly connected to the bottom side of the displacement rod.

[0008] Furthermore, the front inner wall and the back inner wall of the assembly seat are fixedly connected to a slewing bearing, the front end and the back end of the power cylinder are fixedly connected to a rotating rod, the inner wall of the slewing bearing and the surrounding wall of the matching rotating rod are fixedly connected, and the power end of the motor and the front end of the rotating rod on the left are fixedly connected.

[0009] Furthermore, the front inner wall and the back inner wall of the concave table are fixedly connected to the second swivel bearing, the front end and the back end of the guide tube are fixedly connected to the second rotating rod, the inner wall of the second swivel bearing is fixedly connected to the peripheral wall of the second rotating rod, and the power end of the second motor is fixedly connected to the front end of the second rotating rod at the front.

[0010] Furthermore, the front inner wall and the back inner wall of the through opening 1 are respectively connected to the front and back displacements of the driving platform.

[0011] Furthermore, an insertion opening is reserved on the right side of the translation platform, and an inner wall of the insertion opening is fixedly connected to an outer wall of the linear drive three.

[0012] Furthermore, a square cavity 1 is reserved on the right side of the displacement platform, and the inner wall of the square cavity 1 is slidably connected to the outer wall of the constraint plate. Two square cavities 2 are reserved on the top of the displacement platform, and the square cavity 1 is between the two square cavities 2. The inner wall of the square cavity 2 is slidably connected to the outer wall of the matching right-angle rod.

[0013] Furthermore, a connecting plate is fixedly connected to the left side of two supporting seats on the left among the four supporting seats, and the left side of the connecting plate is fixedly connected to the right side of the second linear drive.

[0014] An intelligent detection method for semiconductor processing equipment comprises the following steps:

[0015] S1: During the delivery and inspection of semiconductor parts, the linear drive is operated. During the operation of the linear drive, its power end pulls the right-angle pulling rod to move to the right. The right-angle pulling rod pulls the driving platform to move to the right and drives the semiconductor parts at the lowest position. Under this pulling reason, the semiconductor parts are slowly moved to the unloading port, so that the upper side of the semiconductor parts and the lower side of the guide tube are in contact with each other;

[0016] S2: The right-angle traction rod moves to the right and also pulls the restraint rod to slide to the right in the square opening 3. The restraint rod moves to the right until it fits with the left side of the button. In this way, the button makes the motor 2 operate. The power end of the motor 2 pulls the guide cylinder to rotate. The guide cylinder rotates and pulls the semiconductor component to move to the right. The semiconductor component slowly leaks out of the unloading port to the right and moves along the slope of the guide piece to the top of the conveyor belt.

[0017] S3: Let the motor 1 operate, the power end of the motor 1 pulls the left power cylinder to rotate, the left power cylinder pulls the right power cylinder to rotate via the conveyor belt, the two power cylinders together pull the conveyor belt to run the delivery, the conveyor belt pulls the semiconductor parts above to move to the detection area, and then they are detected by the detection camera;

[0018] S4: As the linear drive moves back, it pulls the driving platform toward the edge of the group and separates from the semiconductor component at the lowest position. As the driving platform moves toward the left to the through port, all the semiconductor components at the lowest position are moved out of the container box, releasing the obstruction to the semiconductor components that are in contact with it. At this time, the semiconductor component at the lowest position in the container box, due to the weight of the body, moves downward to contact the lower inner wall of the container box, and the stacked semiconductor components move downward in sequence. The linear drive in operation then moves to drive the semiconductor component at the lowest position to be delivered, thereby achieving the goal of self-delivery inspection. During the self-delivery period, the running conveyor belt then delivers the semiconductor components to the inspection, thereby achieving the goal of sequential inspection of the semiconductor components.

[0019] S5: As the detection continues, the number of semiconductor components in the receiving box gradually decreases. When semiconductor components need to be added to the receiving box, the semiconductor components are stacked into the adding sheet in order, and the two blocking stations block the semiconductor components in the adding sheet.

[0020] S6: Then let the linear drive 2 operate, the power end of the linear drive 2 pulls the translation platform to move upwards between the two right-angle rods, the translation platform pulls the linear drive 3 to move upwards, the linear drive 3 pulls the adding piece to move upwards, after the adding piece moves upwards until its bottom and the top of the containing box are in a straight line, let the linear drive 3 run, the power end of the linear drive 3 pulls the adding piece to move toward the right, the adding piece pulls the constraint piece to move in the square cavity 1, and during the time when the adding piece moves toward the right to the top of the containing box, let the linear drive 3 stop running;

[0021] S7: Then, the linear drive 4 is operated, and the power end of the linear drive 4 pulls the displacement rod to move upward, and the displacement rod pulls the two square rods and the matching square openings 4 to move upward, and the square rod pulls the matching supporting rod to rotate, and the supporting rod pulls the matching blocking platform to rotate, and the two blocking platforms move in directions away from each other and release the blocking of the semiconductor components, so that the semiconductor components in the added sheet are slowly moved into the containing box due to the weight of the body, and the purpose of adding semiconductor components is achieved;

[0022] S8: At this time, the linear drive 4 can be operated, the movement direction can be reversed, the two blocking platforms can be rotated in a direction close to each other to form a straight line, the linear drive 4 can be stopped, and then the linear drive 3 can be reversed to make the adding piece move to the left and deviate from the containing box, and then the linear drive 2 can be reversed to make the adding piece move downward and return to the original position, so as to provide conditions for adding semiconductor parts later.

[0023] The beneficial effects of the present invention are:

[0024] The present invention is conducive to achieving the goal of automatically sending semiconductor components into inspection one by one, reducing the labor intensity of operators, making inspection more efficient, and is conducive to automatically sending semiconductor components into the containing box, which is convenient for use.

[0025] Other features and advantages of the present invention will be described in the following description, and partly become obvious from the description, or be understood by practicing the present invention. The objectives and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0027] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0028] Figure 2is a schematic diagram of a cross-sectional structure of an embodiment of the present invention;

[0029] Figure 3 for Figure 2 Schematic diagram of the structure at X;

[0030] Figure 4 for Figure 2 Schematic diagram of the structure at Y;

[0031] Figure 5 A schematic diagram of a structure of adding a semiconductor component according to an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the structure of a containing box according to an embodiment of the present invention;

[0033] Reference numerals: 11, support bar; 111, detection frame; 112, detection camera; 1211, transport belt; 1212, power cylinder; 1213, motor 1; 1214, guide plate; 12, assembly plate; 13, storage box; 14, square mouth 1; 15, square mouth 2; 16, linear drive 1; 17, battery; 18, right-angle traction rod; 19, restraint rod; 120, square mouth 3; 121, button; 122, square mouth 4; 123, stop table; 124, Through port one; 125, driving platform; 126, unloading port; 127, concave platform; 128, guide cylinder; 129, motor two; 130, linear actuator two; 131, right-angle rod; 132, displacement platform; 133, linear actuator three; 134, constraint plate; 135, adding plate; 136, displacement rod; 137, square rod; 138, linear actuator four; 139, cavity; 140, blocking platform; 141, supporting rod; 142, disk; 143, sheet two. DETAILED DESCRIPTION

[0034] In order to make the objectives, technical solutions and advantages of the technical solutions of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of specific embodiments of the present invention. The same figure marks in the drawings represent the same components. It should be noted that the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Reference Figure 1-6An embodiment of the present invention proposes an intelligent detection device for semiconductor processing equipment, including a delivery unit installed on one side of the delivery unit, the delivery unit includes two concave assembly seats, a power cylinder 1212 is screwed between the front and back inner walls of the assembly seats, a transportation belt 1211 is installed on the two power cylinders 1212, support bars 11 are installed on the front and back of the two assembly seats, an inspection frame 111 is installed on the two support bars 11, and an inspection camera 112 is installed on the top inner wall of the inspection frame 111. The front of the assembly seat on the left is fixedly connected to the motor 1213, and the power end of the motor 1213 is fixedly connected to the front end of the power cylinder 1212 on the left. The delivery unit includes an assembly piece 12, and both sides of the lower side of the assembly piece 12 are fixedly connected to the supporting seat, and the upper side of the assembly piece 12 is fixedly connected to the receiving box 13, and the receiving box 13 contains a plurality of semiconductor components. The assembly piece 12 is provided with a delivery unit that is compatible with the receiving box 13, and the left side of the assembly piece 12 is provided with an adding unit that is compatible with the receiving box 13.

[0036] The delivery unit includes a square opening 14 reserved on the left side of the assembly piece 12, an open hole is reserved on the top of the square opening 14, a square opening 2 15 is reserved on the right inner wall of the square opening 14, a linear drive 16 is fixedly connected between the upper inner wall and the lower inner wall of the square opening 2 15, the power end of the linear drive 16 extends into the square opening 14 and is fixedly connected to a right-angle traction rod 18, the upper side of the right-angle traction rod 18 extends to the upper side of the assembly piece 12, and the upper inner wall of the square opening 2 15 is fixedly connected to the lower inner wall of the square opening 2 15. A battery 17 is fixedly connected between the lower inner walls, and the battery 17 is electrically connected to the linear driver 16. A through hole 124 is reserved on the left inner wall of the container box 13, and a driving platform 125 is installed in the through hole 124. The right side of the right-angle traction rod 18 extends into the through hole 124 and is fixedly connected to the left side of the driving platform 125. The right side of the driving platform 125 is in a straight line with the left inner wall of the container box 13. The right side of the driving platform 125 is in contact with the left side of the semiconductor component at the lowest point. The lower inner wall of the square opening 14 is fixedly connected to the stop platform 123, the right side of the stop platform 123 is displaced and fitted with the left side of the right-angle traction rod 18, the left inner wall of the right-angle traction rod 18 is fixedly connected to the restraining rod 19, the right inner wall of the square opening 14 is reserved for the square opening 3 120, the right end of the restraining rod 19 extends into the square opening 3 120, the upper inner wall of the square opening 3 120 is fixedly connected to the lower inner wall, the right inner wall of the accommodating box 13 is reserved for the unloading port 126, and the upper inner wall of the unloading port 126 is The concave table 127 is fixedly connected to the wall, and a guide cylinder 128 rotates between the front inner wall and the back inner wall of the concave table 127. The front of the concave table 127 is fixedly connected to the second motor 129, which is connected to the battery 17. The power end of the second motor 129 is fixedly connected to the front end of the guide cylinder 128, and the button 121 is connected to the second motor 129. The right inner wall of the storage box 13 is fixedly connected to a guide piece 1214 installed at an angle, and the guide piece 1214 and the transport belt 1211 are adapted to each other;

[0037] The adding unit includes a linear drive 2 130 fixedly connected to the left side of the assembly plate 12, two right-angle rods 131 fixedly connected to the left side of the linear drive 2 130, a displacement table 132 slidably mounted on the two right-angle rods 131, a linear drive 3 133 plugged into the left side of the displacement table 132, a power end of the linear drive 3 133 fixedly connected to an adding plate 135, a constraint plate 134 fixedly connected to the left side of the adding plate 135, and the displacement table 132 slidably mounted on The constraint sheet 134 is located between the two right-angled rods 131. The inner walls of both sides of the additional sheet 135 are reserved with cavities 139. The lower inner wall of the cavity 139 is open and installed. The front inner wall and the back inner wall of the cavity 139 are screwed with a support rod 141. The support rod 141 is fixedly connected to the blocking platform 140. The sides of the two blocking platforms 140 that are close to each other extend into the additional sheet 135. The support rod 141 is fixedly connected to the reserved tooth The plate 142 is located on the front side of the matching blocking platform 140. The two plates 142 are engaged with the sheet 143 with reserved teeth on the sides away from each other. The upper sides of the adding sheet 135 are reserved with square openings 122. The square openings 122 are slidably provided with square rods 137. The upper ends of the sheet 143 extend into the matching square openings 122 and are fixedly connected to the lower sides of the square rods 137. The two square rods The top of 137 extends to the top of the additional plate 135 and is fixedly connected to a displacement rod 136. The right side of the additional plate 135 is fixedly connected to a linear driver 138. The power end of the linear driver 138 is fixedly connected to the bottom side of the displacement rod 136. Such an arrangement is conducive to achieving the goal of automatically sending semiconductor components into inspection one by one, reducing the labor intensity of the operator, making the inspection more efficient, and facilitating the automatic sending of semiconductor components into the containing box 13, which is convenient for use.

[0038] The front inner wall and the back inner wall of the assembly seat are both fixedly connected to the slewing bearing 1, the front end and the back end of the power cylinder 1212 are both fixedly connected to the rotating rod 1, the inner wall of the slewing bearing 1 is fixedly connected to the peripheral wall of the matching rotating rod, the power end of the motor 1213 is fixedly connected to the front end of the rotating rod 1 on the left, the front inner wall and the back inner wall of the concave platform 127 are both fixedly connected to the slewing bearing 2, the front end and the back end of the guide cylinder 128 are fixedly connected to the rotating rod 2, the inner wall of the slewing bearing 2 is fixedly connected to the peripheral wall of the matching rotating rod 2, the power end of the motor 2 129 is fixedly connected to the front end of the rotating rod 2 on the front, the front inner wall and the back inner wall of the through hole 124 are respectively connected to the front and back displacement of the driving platform 125, and the right side of the displacement platform 132 An insertion port is reserved, and the inner wall of the insertion port is fixedly connected to the outer wall of the linear drive three 133. A square cavity one is reserved on the right side of the displacement platform 132, and the inner wall of the square cavity one is slidably connected to the outer wall of the constraint plate 134. Two square cavities two are reserved on the top of the displacement platform 132. The square cavity one is between the two square cavities two, and the inner wall of the square cavity two is slidably connected to the outer wall of the matching right-angle rod 131. The left sides of the two supporting seats on the left among the four supporting seats are fixedly connected to a connecting plate, and the left side of the connecting plate is fixedly connected to the right side of the linear drive two 130. Such an arrangement is conducive to achieving the goal of automatically sending semiconductor components into inspection one by one, reducing the labor intensity of operators, making detection more efficient, and facilitating the automatic feeding of semiconductor components into the containing box 13, which is convenient for use.

[0039] An intelligent detection method for semiconductor processing equipment comprises the following steps:

[0040] S1: During the delivery and inspection of semiconductor components, the linear actuator 16 is operated. During the operation of the linear actuator 16, its power end pulls the right-angle pulling rod 18 to move to the right. The right-angle pulling rod 18 pulls the driving platform 125 to move to the right and drives the semiconductor components at the lowest position. Under this pulling reason, the semiconductor components are slowly moved to the unloading port 126, so that the upper surface of the semiconductor components and the lower surface of the guide cylinder 128 are in contact with each other;

[0041] S2: The right-angle traction rod 18 moves toward the right and also pulls the restraint rod 19 to slide toward the right in the square opening 3 120. The restraint rod 19 moves toward the right until it fits with the left side of the button 121. In this way, the button 121 allows the motor 2 129 to operate. The power end of the motor 2 129 pulls the guide cylinder 128 to rotate. The guide cylinder 128 rotates and pulls the semiconductor component to move toward the right. The semiconductor component slowly leaks out of the unloading port 126 toward the right and moves along the slope of the guide piece 1214 to the top of the conveying belt 1211.

[0042] S3: Let the motor 1213 operate, the power end of the motor 1213 pulls the left power cylinder 1212 to rotate, the left power cylinder 1212 pulls the right power cylinder 1212 to rotate via the transport belt 1211, the two power cylinders 1212 together pull the transport belt 1211 to run the delivery, the transport belt 1211 pulls the semiconductor parts on it to move to the inspection area, and then they are inspected by the inspection camera 112;

[0043] S4: When the linear drive 16 goes back, it pulls the driving platform 125 toward the edge of the group and separates from the semiconductor component at the lowest position. When the driving platform 125 moves toward the left to the through port 124, all the semiconductor components at the lowest position are moved out of the container box 13, releasing the obstruction to the semiconductor components that touch each other. At this time, the semiconductor component at the lowest position in the container box 13 moves downward to touch the lower inner wall of the container box 13 due to the mass of the body, and the stacked semiconductor components move downward in sequence. The running linear drive 16 then acts to drive the semiconductor component at the lowest position to be delivered, thereby achieving the goal of self-delivery detection. During the self-delivery period, the running conveyor belt 1211 then delivers the semiconductor components to the detection, thereby achieving the goal of sequential detection of semiconductor components.

[0044] S5: As the detection continues, the number of semiconductor components in the container box 13 gradually decreases. When semiconductor components need to be added to the container box 13, the semiconductor components are sequentially stacked into the adding sheet 135, and the two blocking stations 140 block the semiconductor components in the adding sheet 135;

[0045] S6: Then, the linear drive 2 130 is operated. The power end of the linear drive 2 130 pulls the displacement table 132 to move upwards between the two right-angle rods 131. The displacement table 132 pulls the linear drive 3 133 to move upwards. The linear drive 3 133 pulls the adding piece 135 to move upwards. After the adding piece 135 moves upwards until its bottom and the top of the containing box 13 are in a straight line, the linear drive 3 133 is operated. The power end of the linear drive 3 133 pulls the adding piece 135 to move toward the right. The adding piece 135 pulls the restraining piece 134 to move in the square cavity 1. During the period when the adding piece 135 moves toward the right to the top of the containing box 13, the linear drive 3 133 is stopped from operating.

[0046] S7: Then, the linear drive 4 138 is operated. The power end of the linear drive 4 138 pulls the displacement rod 136 to move upward. The displacement rod 136 pulls the two square rods 137 and the matching square opening 4 122 to move upward. The square rod 137 pulls the matching supporting rod 141 to rotate. The supporting rod 141 pulls the matching blocking platform 140 to rotate. The two blocking platforms 140 move in directions away from each other and release the blocking of the semiconductor components. In this way, the semiconductor components in the adding sheet 135 are slowly moved into the containing box 13 due to the weight of the body, thereby achieving the goal of adding semiconductor components.

[0047] S8: At this time, the linear drive four 138 can be operated, the movement direction can be reversed, and the two blocking platforms 140 can be rotated towards each other to form a straight line, and the linear drive four 138 can be paused. Then, the linear drive three 133 can be reversed to make the adding piece 135 move to the left and deviate from the containing box 13. Then, the linear drive two 130 can be reversed to make the adding piece 135 move downward and return to its original position, so as to provide conditions for the subsequent addition of semiconductor components.

[0048] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An intelligent detection device for semiconductor processing equipment, comprising a delivery unit installed on one side of a delivery unit, the delivery unit comprising two concave assembly seats, a power cylinder (1212) is screwed between the front and back inner walls of the assembly seats, a conveying belt (1211) is installed on the two power cylinders (1212), support bars (11) are installed on the front and back of the two assembly seats, a detection frame (111) is installed on the two support bars (11), a detection camera (112) is installed on the top inner wall of the detection frame (111), a motor 1 (1213) is fixedly connected to the front of the assembly seat on the left, and the power end of the motor 1 (1213) is fixedly connected to the front end of the power cylinder (1212) on the left, characterized in that: The delivery unit comprises an assembly sheet (12), the lower sides of which are fixedly connected to a supporting seat, the upper side of which is fixedly connected to a containing box (13), a plurality of semiconductor components being contained in the containing box (13), a delivery unit adapted to the containing box (13) being arranged on the assembly sheet (12), and an adding unit adapted to the containing box (13) being arranged on the left side of the assembly sheet (12).

2. The intelligent detection device for semiconductor processing equipment according to claim 1, characterized in that: The delivery unit comprises a square opening (14) reserved on the left side of the assembly plate (12), an open hole reserved on the top of the square opening (14), a square opening (15) reserved on the right inner wall of the square opening (14), a linear driver (16) fixedly connected between the upper inner wall and the lower inner wall of the square opening (15), a power end of the linear driver (16) extending into the square opening (14) and fixedly connected to a right-angle traction rod (18), the upper end of the right-angle traction rod (18) extending to the upper side of the assembly plate (12), the upper inner wall of the square opening (15) and the lower inner wall are fixedly connected. A battery (17) is fixedly connected between the inner walls, and the battery (17) is electrically connected to a linear driver (16). A through hole (124) is reserved on the left inner wall of the housing box (13), and a driving platform (125) is arranged in the through hole (124). The right side of the right-angle traction rod (18) extends into the through hole (124) and is fixedly connected to the left side of the driving platform (125). The right side of the driving platform (125) and the left inner wall of the housing box (13) are in a straight line. The right side of the driving platform (125) is in contact with the left side of the semiconductor component at the lowest position. The square hole (14) The lower inner wall of the square opening (14) is fixedly connected to a stop platform (123), the right side of the stop platform (123) and the left side of the right-angle traction rod (18) are displaced and fitted, the left inner wall of the right-angle traction rod (18) is fixedly connected to a restraining rod (19), the right inner wall of the square opening (14) is reserved for a square opening (120), the right end of the restraining rod (19) extends into the square opening (120), the upper inner wall and the lower inner wall of the square opening (120) are fixedly connected to a button (121), the right inner wall of the accommodating box (13) is reserved for a discharge port (126), the upper inner wall of the discharge port (126) is fixedly connected to the upper inner wall of the square opening (120). The concave platform (127) is connected to the inner wall of the front side and the inner wall of the back side of the concave platform (127), and a guide tube (128) rotates between them. The front side of the concave platform (127) is fixedly connected to a second motor (129), and the second motor (129) is connected to a battery (17). The power end of the second motor (129) is fixedly connected to one end of the front side of the guide tube (128). The button (121) is connected to the second motor (129). The right inner wall of the accommodating box (13) is fixedly connected to a guide sheet (1214) arranged at an angle, and the guide sheet (1214) and the transport belt (1211) are adapted to each other.

3. The intelligent detection device for semiconductor processing equipment according to claim 1, characterized in that: The adding unit comprises a second linear drive (130) fixedly connected to the left side of the assembly plate (12), the left side of the second linear drive (130) is fixedly connected to two right-angle rods (131), a displacement platform (132) is slidably mounted on the two right-angle rods (131), the left side of the displacement platform (132) is plugged with a third linear drive (133), the power end of the third linear drive (133) is fixedly connected to an adding plate (135), and the left side of the adding plate (135) is fixedly connected to a constraint The displacement platform (132) is slidably mounted on the constraint plate (134), the constraint plate (134) is located between the two right-angle rods (131), the inner walls on both sides of the adding plate (135) are reserved with cavities (139), the lower inner wall of the cavity (139) is open, the front inner wall and the back inner wall of the cavity (139) are screwed together with a supporting rod (141), the supporting rod (141) is fixedly connected to the blocking platform (140), and the two blocking The sides of the blocking platform (140) approaching each other extend into the additional sheet (135), the support rod (141) is fixedly connected to a plate body (142) with a reserved tooth opening, the plate body (142) is located on the front side of the matching blocking platform (140), the sides of the two plates (142) facing away from each other are engaged with a sheet body 2 (143) with a reserved tooth opening, and the upper sides of the additional sheet (135) are reserved with square openings 4 (122), and the square openings 4 (122) are slidably arranged. A square rod (137) is provided, and the upper ends of the second sheet body (143) extend into the matching square opening four (122) and are fixedly connected to the lower side of the square rod (137). The upper sides of the two square rods (137) extend to the upper side of the additional sheet (135) and are fixedly connected to a displacement rod (136). The right side of the additional sheet (135) is fixedly connected to a linear driver four (138), and the power end of the linear driver four (138) is fixedly connected to one side of the lower side of the displacement rod (136).

4. The intelligent detection device for semiconductor processing equipment according to claim 1, characterized in that: The front inner wall and the back inner wall of the assembly seat are both fixedly connected to a slewing bearing 1, the front end and the back end of the power cylinder (1212) are both fixedly connected to a rotating rod 1, the inner wall of the slewing bearing 1 is fixedly connected to a peripheral wall of the matching rotating rod, and the power end of the motor 1 (1213) is fixedly connected to the front end of the rotating rod 1 on the left.

5. The intelligent detection device for semiconductor processing equipment according to claim 2, characterized in that: The front inner wall and the back inner wall of the concave table (127) are both fixedly connected to the second slewing bearing, the front end and the back end of the guide tube (128) are both fixedly connected to the second rotating rod, the inner wall of the second slewing bearing is fixedly connected to the peripheral wall of the second rotating rod, and the power end of the second motor (129) is fixedly connected to the front end of the second rotating rod.

6. The intelligent detection device for semiconductor processing equipment according to claim 2, characterized in that: The front inner wall and the back inner wall of the through opening 1 (124) are respectively connected to the front and back displacements of the driving platform (125).

7. The intelligent detection device for semiconductor processing equipment according to claim 3, characterized in that: An insertion opening is reserved on the right side of the displacement platform (132), and the inner wall of the insertion opening is fixedly connected to the outer wall of the linear drive three (133).

8. The intelligent detection device for semiconductor processing equipment according to claim 3, characterized in that: A square cavity 1 is reserved on the right side of the displacement platform (132), and the inner wall of the square cavity 1 is slidably connected to the outer wall of the constraint plate (134). Two square cavities 2 are reserved on the top of the displacement platform (132), and the square cavity 1 is located between the two square cavities 2. The inner wall of the square cavity 2 is slidably connected to the outer wall of the matching right-angle rod (131).

9. The intelligent detection device for semiconductor processing equipment according to claim 3, characterized in that: A connecting plate is fixedly connected to the left side of two of the four supporting seats on the left side, and the left side of the connecting plate is fixedly connected to the right side of the second linear drive (130).

10. An intelligent detection method for semiconductor processing equipment, characterized in that: The device according to any one of claims 1 to 9 further comprises the following steps: S1: During the delivery and inspection of semiconductor components, the linear actuator 1 (16) is operated. During the operation of the linear actuator 1 (16), its power end pulls the right-angle pulling rod (18) to move toward the right. The right-angle pulling rod (18) pulls the driving platform (125) to move toward the right and drives the semiconductor components at the lowest position. Under this pulling reason, the semiconductor components are slowly moved into the unloading port (126), so that the upper surface of the semiconductor components and the lower surface of the guide tube (128) are in contact with each other; S2: The right-angle traction rod (18) moves toward the right and also pulls the restraint rod (19) to slide toward the right in the square opening (120). The restraint rod (19) moves toward the right until it fits with the left side of the button (121). In this way, the button (121) allows the motor (129) to operate. The power end of the motor (129) pulls the guide cylinder (128) to rotate. The guide cylinder (128) rotates and pulls the semiconductor component to move toward the right. The semiconductor component slowly leaks out of the unloading port (126) toward the right and moves along the slope of the guide plate (1214) to the top of the conveying belt (1211); S3: Let the motor 1 (1213) operate, the power end of the motor 1 (1213) pulls the left power cylinder (1212) to rotate, the left power cylinder (1212) pulls the right power cylinder (1212) to rotate via the transport belt (1211), the two power cylinders (1212) together pull the transport belt (1211) to run the delivery, the transport belt (1211) pulls the semiconductor parts on it to move to the detection area, and then is detected by the detection camera (112); S4: When the linear drive 1 (16) moves back, it pulls the driving platform (125) toward the edge of the group and separates from the semiconductor component at the lowest position. When the driving platform (125) moves toward the left to the through port 1 (124), all the semiconductor components at the lowest position are moved out of the receiving box (13), releasing the obstruction to the semiconductor components that are in contact with it. At this time, due to the weight of the semiconductor component, the semiconductor component at the lowest position in the receiving box (13) moves downward to contact the lower inner wall of the receiving box (13), and the stacked semiconductor components move downward in sequence. The linear drive 1 (16) in operation then moves to drive the semiconductor component at the lowest position to be delivered, thereby achieving the goal of self-delivery inspection. During the self-delivery period, the running conveyor belt (1211) then delivers the semiconductor components to the inspection, thereby achieving the goal of sequential inspection of the semiconductor components. S5: As the detection continues, the number of semiconductor components in the receiving box (13) gradually decreases. When semiconductor components need to be added to the receiving box (13), the semiconductor components are stacked in order into the adding sheet (135), and two blocking stations (140) block the semiconductor components in the adding sheet (135); S6: Then, the linear drive 2 (130) is operated, the power end of the linear drive 2 (130) pulls the displacement platform (132) to move upward on the two right-angle rods (131), the displacement platform (132) pulls the linear drive 3 (133) to move upward, the linear drive 3 (133) pulls the adding piece (135) to move upward, after the adding piece (135) moves upward until it is in a straight line below and above the containing box (13), the linear drive 3 (133) is operated, the power end of the linear drive 3 (133) pulls the adding piece (135) to move toward the right, the adding piece (135) pulls the restraining piece (134) to move in the square cavity 1, and during the time when the adding piece (135) moves toward the right to the top of the containing box (13), the linear drive 3 (133) is not operated; S7: Then, the linear drive four (138) is operated, and the power end of the linear drive four (138) pulls the displacement rod (136) to move upward, and the displacement rod (136) pulls the two square rods (137) and the matching square opening four (122) to move upward, and the square rod (137) pulls the matching supporting rod (141) to rotate, and the supporting rod (141) pulls the matching blocking platform (140) to rotate, and the two blocking platforms (140) move in directions away from each other and release the blocking of the semiconductor components, so that the semiconductor components in the adding sheet (135) are slowly moved into the containing box (13) due to the weight of the body, and the purpose of adding semiconductor components is achieved; S8: At this time, the linear drive four (138) can be operated to reverse the movement, so that the two blocking platforms (140) can rotate in a direction close to each other to form a straight line, and the linear drive four (138) can be paused. Then, the linear drive three (133) can be reversed to make the adding plate (135) move to the left and deviate from the containing box (13). Then, the linear drive two (130) can be reversed to make the adding plate (135) move downward and return to its original position, so as to provide conditions for the subsequent addition of semiconductor components.

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