Method and device for packaging substrate passive test
By controlling the vertical lifting and lowering of the probe and making it come into contact with the bump to be measured, the problem that the probe in the prior art is difficult to cooperate with the bump, and a more accurate and reliable passive testing is achieved.
Patent Information
- Application Number
- CN202411801504.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-04-01
AI Technical Summary
In the prior art, the probe is difficult to cooperate with the bump to be measured, resulting in insufficient contact time, damage to the probe or inability to accurately contact the upper surface of the bump to be contacted, affecting the test results.
By controlling the vertical lifting and lowering of the probe, the vertical contact between the probe and the bump to be measured is achieved, and the coordination problem between the probe and the bump is solved.
Ensure that the probe is in accurate contact with the upper surface of the convex point to be measured, avoid probe damage, and improve the accuracy and reliability of passive testing.
Smart Images
Figure CN119738683A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a method and a device for passive testing of a packaging substrate. Background Art
[0002] With the development of communication technology, the passive parameter test of the package substrate has received increasing attention. At present, the industry mostly uses high-speed probes to test the passive characteristics of the package substrate. The existing high-frequency probes are generally arranged in an oblique insertion manner, and the probe is brought into contact with the surface to be tested through the travel of the needle, thereby realizing the passive parameter measurement of the package substrate. Figure 1 When testing with an obliquely inserted probe, the tip of the probe 6 contacts the test point 1b during the process of sliding from left to right, and the other end of the probe 6 is connected to the test instrument.
[0003] The package substrate generally has bumps, which are important elements for connecting the chip to the package substrate, similar to a bridge connecting the two. Through the bumps, electrical signals can be transmitted from the chip to the package substrate, completing the communication between the chip and the external system.
[0004] However, when using the existing oblique insertion probe 6 to perform passive parameter testing on the bump, it is inconvenient to use. Figure 2 Since the surface size of the bump 2 is very small, usually in the micron level, the contact area provided by the bump 2 to the probe 6 is very limited. In the process of the probe 6 sliding over the bump 2 from left to right, it is difficult to provide sufficient travel for the probe 6, which often leads to insufficient contact time of the probe 6 on the bump 2, affecting the test results. Moreover, since the bump 2 is often a columnar structure protruding from the substrate 1a, in the process of the probe 6 sliding over the bump 2 from left to right, the probe 6 is prone to collide with the bump 2, resulting in damage to the needle tip of the probe 6, or the probe 6 fails to accurately contact the upper surface of the bump 2, affecting the normal progress of the test. Summary of the invention
[0005] The purpose of the present invention is to provide a method and device for passive testing of a package substrate, which can achieve vertical contact between the probe and the bump to be tested by controlling the vertical lifting of the probe, so as to solve the problem in the prior art that the probe is difficult to match with the bump to be tested.
[0006] In order to achieve the above object, the present invention adopts the following technical solution:
[0007] A method for passive testing of a package substrate, the method being applied to a package substrate, the package substrate having a first direction, a second direction and a third direction which are mutually perpendicular in pairs, the package substrate being provided with a plurality of protrusions with a columnar outer contour, the plurality of protrusions protruding from the package substrate along the third direction;
[0008] The method comprises the following steps:
[0009] Fixing the packaging substrate so that the bumps are arranged upward;
[0010] Driving the probe to move along the first direction and / or the second direction, so that the probe moves to above the bump to be tested;
[0011] The probe is driven to move along the third direction to the top of the bump to be tested, vertically contact the bump to be tested, and start testing.
[0012] The above technical solution has the following advantages: by driving the probe to move on the top of the detection bump, and driving the probe to move along the third direction to the top of the bump to be tested, the probe is made to contact vertically with the bump to be tested. In this way, the probe can avoid colliding with the bump to be tested during the movement, thereby avoiding damage to the probe tip. Moreover, the vertical contact between the probe and the bump to be tested can ensure that the probe is in accurate contact with the upper surface of the bump to be tested, thereby ensuring the accuracy of the passive test.
[0013] In some embodiments, the method further comprises the steps of:
[0014] When the probe ends the current test, driving the probe away from the bump along the third direction;
[0015] Driving the probe to move along the first direction and / or the second direction, so that the probe moves to above the next bump to be tested;
[0016] The probe is driven to move along the third direction to the top of the next bump to be tested, vertically contact the next bump to be tested, and start the next test.
[0017] The above technical solution has the following advantages: when testing multiple bumps, the probe is driven away from the bump and then moved to the top of the next bump to be tested, which can prevent the probe from colliding with the bump to be tested during the movement, and the probe moved to the top of the bump to be tested can achieve vertical contact with the bump to be tested, so that the probe can maintain accurate contact with the upper surface of the bump to be tested during multiple tests.
[0018] In some embodiments, the plurality of convex points are arranged in a rectangular array along the first direction and the second direction; and the maximum outer diameter of the convex point in the first direction or the second direction is D, and 70 μm≤D≤90 μm, and the shortest distance between two adjacent convex points in the first direction and the second direction is L, and 70 μm≤L≤90 μm;
[0019] The method further comprises the steps of:
[0020] In the case of driving the probe to move along the first direction and / or the second direction, obtaining the coordinate position of the salient point to be measured in a coordinate system, wherein the coordinate system is composed of the first direction and the second direction;
[0021] The probe is driven to move along the first direction and / or the second direction to the coordinate position of the bump to be tested, so that the probe moves above the bump to be tested.
[0022] The above technical solution has the following advantages: when multiple bumps are arranged in a regular rectangular array, a coordinate system consisting of a first direction and a second direction is established, and the coordinate position of the bump to be measured in the coordinate system is obtained, and the probe is driven to move along the first direction and / or the second direction according to the coordinate position, so that the probe can accurately reach above the bump to be measured, ensuring that the probe is in accurate contact with the upper surface of the bump to be measured.
[0023] In some embodiments, the method further comprises the steps of:
[0024] Fixing the packaging substrate in a test area, wherein the test area is a layout area of the packaging substrate;
[0025] In the case of acquiring the coordinate position of the bump to be tested in the coordinate system, the probe is driven to move along the first direction and the second direction to scan the test area, and the coordinate position of the bump to be tested in the coordinate system is acquired.
[0026] The above technical solution has the following advantages: by scanning the test area with a probe, the coordinate position of the bump to be tested in the coordinate system can be quickly obtained, and the probe can be ensured to reach the position of the bump to be tested in the test area, ensuring smooth passive testing.
[0027] In some embodiments, the method further comprises the steps of:
[0028] In the case where the probes are driven to move along the first direction and / or the second direction, the probes in the first direction or the second direction are moved synchronously.
[0029] The above technical solution has the following advantages: by driving the probes in the first direction or the second direction to move synchronously, multiple probes in the first direction or the second direction can be arranged in the same column or row, so that the probes can test the bumps in the first direction or the second direction.
[0030] The present invention also provides a device for passive testing of a packaging substrate, which is used to implement the above method. The device comprises:
[0031] A support, wherein the support is formed with a test area for placing a package substrate;
[0032] at least one connecting shaft, the connecting shaft being movably connected to the bracket and capable of moving relative to the bracket along the first direction;
[0033] At least one probe is movably connected to the connecting shaft and can move relative to the connecting shaft along the second direction; and the probe is extended along the third direction and can be raised and lowered relative to the connecting shaft along the third direction to vertically contact or separate from the bump on the packaging substrate.
[0034] The above technical solution has the following advantages: the device cooperates with the bracket and the connecting axis to enable the probe to perform linear movement in the first direction and the second direction above the packaging substrate, thereby enabling the probe to achieve two-dimensional movement above the bump, avoiding the probe from colliding with the bump due to position adjustment, and the device enables the probe to vertically contact the bump by raising and lowering the probe relative to the connecting axis along the third direction, thereby ensuring that the probe accurately contacts the upper surface of the bump.
[0035] In some embodiments, an optical component is disposed on the bracket, and the optical component is used to detect and amplify the image of the top of the protrusion.
[0036] The above technical solution has the following advantages: by setting the optical component, the operator can determine the distance between the probe tip and the top of the bump, avoiding the probe tip from hitting the top of the bump when moving toward the bump along the third direction, causing damage to the probe tip.
[0037] In some embodiments, at least two probes are disposed on one connecting shaft, and the two probes can move relative to the connecting shaft along the extension direction of the connecting shaft.
[0038] The above technical solution has the following advantages: by setting the two probes on the same connecting axis, when using a two-port device to perform passive parameter testing on the bumps, the two probes can keep moving synchronously to facilitate testing of the bumps in the same axial direction.
[0039] In some embodiments, the number of the connecting shafts is two, the two connecting shafts are arranged at intervals along the extension direction of the bracket, and two probes are respectively disposed on the two connecting shafts.
[0040] The above technical solution has the following advantages: by setting two connecting axes, the probe of the device can be adapted to the four-port device, and when the four-port device is used to perform passive parameter testing on the bumps, the probes of the same connecting axis can keep moving synchronously to facilitate testing of the bumps in the two axial directions.
[0041] In some embodiments, the probe is connected to a distance adjustment component to adjust the distance between the probe and the top of the bump.
[0042] The above technical solution has the following advantages: by providing a distance adjustment component, the distance between the probe tip and the top of the bump can be finely adjusted to avoid the probe hitting the top of the bump, causing damage to the probe tip.
[0043] Compared with the prior art, the method and device for passive testing of a package substrate implemented by the present invention have the following beneficial effects:
[0044] The method for passive testing of a package substrate provided by the present application controls the travel path of the probe so that the probe moves along a third direction to the top of the push-button to be tested and makes vertical contact with the bump to be tested. In this way, when the method is used to perform a basic passive parameter test on the package, the probe can move on the upper layer of the bump to be tested to avoid the probe tip colliding with the bump to be tested and causing damage to the probe tip. Moreover, when the probe moves above the bump to be tested, it is only necessary to drive the probe up and down along the third direction to achieve vertical contact between the probe and the bump to be tested, and the test device connected to the probe can test the bump to be tested.
[0045] The device for passive testing of packaging substrates provided in the present application, through the cooperation between the bracket and the connecting shaft, limits the movement of the probe along the first direction and the second direction, so that the movement path of the probe is adapted to the arrangement of the bumps, and the movement position of the probe is mapped one-to-one with the coordinate position of the bump to be tested, making it more convenient to operate the probe to move to the bump to be tested. BRIEF DESCRIPTION OF THE DRAWINGS
[0046] Figure 1 It is a schematic diagram of the coordination between the oblique insertion needle probe and the test point in the prior art;
[0047] Figure 2 is a schematic diagram of a packaging substrate in an embodiment of the present invention;
[0048] Figure 3 is a top view of a packaging substrate in an embodiment of the present invention;
[0049] Figure 4 Schematic diagram of the cooperation between the needle oblique insertion probe and the packaging substrate in an embodiment of the present invention;
[0050] Figure 5 is a schematic flow chart of a method for passive testing of a package substrate in a first implementation manner in an embodiment of the present invention;
[0051] Figure 6 is a flow chart of a method for passive testing of a package substrate in a second implementation manner in an embodiment of the present invention;
[0052] Figure 7is a flow chart of a method for passive testing of a package substrate in a third implementation manner according to an embodiment of the present invention;
[0053] Figure 8 is a flow chart of a method for passive testing of a package substrate in a fourth implementation manner according to an embodiment of the present invention;
[0054] Fig. 9 is a schematic diagram of a device for passive testing of a package substrate in an embodiment of the present invention;
[0055] Fig.10 4 is a top view of a device for passive testing of a package substrate in an embodiment of the present invention.
[0056] In the figure, X, first direction; Y, second direction; Z, third direction; 1, packaging substrate; 1a, substrate; 1b, test point; 2, bump; 3, test area; 4, bracket; 4a, support arm; 5, connecting axis; 6, probe; 7, optical component. DETAILED DESCRIPTION
[0057] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0058] In the description of the present invention, it should be understood that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.
[0059] In the description of the present invention, it should be understood that the terms "height", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like used in the present invention to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0060] In the description of the present invention, it should be understood that the terms "first" and "second" are used in the present invention for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.
[0061] Example
[0062] refer to Figure 1 , is a passive parameter test method provided by the prior art. In the passive parameter test method, the test point 1b can provide a contact surface with a large area, so that the probe 6 can contact it. The probe 6 adopts a needle oblique insertion arrangement, one end of the probe 6 is connected to the test instrument, and the other end of the probe 6, that is, the needle tip of the probe 6 slides from left to right across the contact surface of the test point 1b. Since the test point 1b has a sufficiently large contact surface, when the probe 6 slides from left to right across the test point 1b, there is enough time to complete the passive parameter test.
[0063] refer to Figure 2-3 , is a schematic diagram of a packaging substrate 1 used in an embodiment of the present invention, wherein the packaging substrate 1 includes a substrate 1a, wherein the substrate 1a has a first direction X, a second direction Y and a third direction Z which are perpendicular to each other, and a plurality of bumps 2 are arranged on the substrate 1a, wherein each outer contour of the bump 2 is columnar, and the plurality of bumps 2 all protrude from the surface of the substrate 1a along the third direction Z, and the plurality of bumps 2 are concentrated in a designated area to form a bump area of the packaging substrate 1.
[0064] It should be noted that, in the embodiment of the present invention, when the user looks down at the bump area, the side where the bump area is located is the upper / top side of the package substrate 1, and the opposite side is the lower / bottom side of the package substrate 1, and the directions where the upper / top side and the lower / bottom side of the package substrate 1 are located are taken as the third direction Z of the package substrate 1; Figure 1 The left and right sides shown are the left and right sides of the package substrate 1, and the direction of the left and right sides of the package substrate 1 is taken as the first direction X of the package substrate 1; definition Figure 1 The front and back shown are the front side and the back side of the packaging substrate 1 , and the direction where the front side and the back side of the packaging substrate 1 are located is taken as the second direction Y of the packaging substrate 1 .
[0065] It should be noted that when performing passive parameter testing on the bump area of the package substrate 1, since the multiple bumps 2 in the bump area are distributed at intervals, there is a certain gap between two adjacent bumps 2, so that the multiple bumps 2 in the bump area no longer constitute a continuous contactable plane, and the contact surfaces provided by the multiple bumps 2 in the bump area for the probe 6 are spaced and independent contact surfaces. Moreover, the bumps 2 of the package substrate 1 are often in micron-level sizes, and the contactable area provided by each bump 2 for the probe 6 is very limited.
[0066] refer to Figure 4 When the passive parameter test is performed on the bump area of the package substrate 1 by using the obliquely inserted probe 6, as before, since the contact area provided by each bump 2 for the probe 6 is very limited, the probe 6 cannot obtain enough time to complete the passive parameter test. Secondly, since the bump 2 protrudes from the substrate 1a and there is a certain gap between two adjacent bumps 2, the probe 6 can easily enter between two adjacent bumps 2, and it is difficult to accurately contact the top of the bump 2 in the height direction of the bump 2. As a result, when the probe 6 slides from left to right, it often collides with the bump 2. Since the specifications of the bump 2 are in the micron level, the outer dimensions of the probe 6 adapted to the bump 2 are very small, and its structural strength is low. The collision between the probe 6 and the bump 2 can easily cause damage to the needle tip of the probe 6.
[0067] In order to solve this problem, the embodiment of the present invention provides a method for passive testing of a packaging substrate 1, referring to Figure 5 , is a flow chart of a method for passive testing of a package substrate 1 in a first embodiment of the present invention, specifically including steps S11 to S13:
[0068] S11, fixing the package substrate 1 so that the bumps 2 are arranged upward;
[0069] S12, driving the probe 6 to move along the first direction X and / or the second direction Y, so that the probe 6 moves to above the bump 2 to be tested;
[0070] S13, driving the probe 6 to move along the third direction Z to the top of the bump 2 to be tested, vertically contacting the bump 2 to be tested, and starting the test.
[0071] It can be understood that the vertical contact of the probe 6 with the bump 2 to be tested means that the tip of the probe 6 is perpendicular to the top of the bump 2 to be tested and contacts the top of the bump 2 to be tested. In this way, the contact mode between the probe 6 and the bump 2 to be tested is changed from sliding contact to static contact, that is, during the passive parameter test, the probe 6 and the bump 2 to be tested remain relatively still, and the tip of the probe 6 will stay on the top of the bump 2 to be tested and no longer slide relative to the bump 2 to be tested. Moreover, the vertical contact of the probe 6 with the bump 2 to be tested will make the tip of the probe 6 perpendicular to the top of the bump 2 to be tested. When the tip of the probe 6 falls between two connected bumps 2, the tip of the probe 6 does not contact the top of the bump 2 to be tested, and the passive parameter test will not be turned on. In this way, it can also be ensured that during the passive parameter test, the tip of the probe 6 is always in contact with the top / upper surface of the bump 2 to be tested, thereby ensuring the accuracy of the passive parameter test.
[0072] By making the probe 6 contact vertically with the bump 2 to be tested, the probe 6 does not need to move relative to the bump 2 during the test. In this way, the method can be applied to bumps 2 with specifications and dimensions reaching the micron level. Even if the specifications and dimensions of the bump 2 are at the micron level, the probe 6 can still maintain sufficient contact time with the bump 2 to complete the passive parameter test. Moreover, the probe 6 is raised and lowered relative to the bump 2 along the third direction to ensure that the contact surface between the probe 6 and the bump 2 is always the top surface of the bump 2. The operator controls the probe 6 to abut the top of the bump 2, which is conducive to the probe 6 testing multiple bumps 2 one by one, avoiding the probe 6 accidentally touching other bumps 2 and affecting the accuracy of the passive parameter test.
[0073] It should be noted that when the probe 6 moves relative to the bump 2 along the first direction X and / or the second direction Y, it is always above the bump 2 to ensure that the tip of the probe 6 does not touch the bump 2 when moving along the first direction X and / or the second direction Y, thereby preventing the tip of the probe 6 from colliding with the bump 2. Figure 6 As an example of this embodiment, it is a flow chart of the method for passive testing of the package substrate 1 in the embodiment of the present invention under the second embodiment, which specifically includes steps S11 to S17:
[0074] S11, fixing the package substrate 1 so that the bumps 2 are arranged upward;
[0075] S12, driving the probe 6 to move along the first direction X and / or the second direction Y, so that the probe 6 moves to above the bump 2 to be tested;
[0076] S13, driving the probe 6 to move along the third direction Z to the top of the bump 2 to be tested, vertically contacting the bump 2 to be tested, and starting the test;
[0077] S14, when the probe 6 finishes the current test, driving the probe 6 along the third direction Z away from the bump 2 that has completed the test;
[0078] S15, driving the probe 6 to move along the first direction X and / or the second direction Y, so that the probe 6 moves to the top of the next bump 2 to be tested;
[0079] S16, driving the probe 6 to move along the third direction Z to the top of the next bump 2 to be tested, vertically contacting the next bump 2 to be tested, and starting the next test;
[0080] S17, repeat step S14 to step S16 until all bumps 2 have been tested.
[0081] It can be understood that, in the process of the probe 6 moving to the top of the bump 2 to be tested, the moving path of the probe 6 depends on the current position of the probe 6 and the position of the bump 2 to be tested. For example, if the probe 6 and the bump 2 to be tested are in the same axial direction parallel to the first direction X, the probe 6 only needs to move along the first direction X to move to the top of the bump 2 to be tested; or, if the probe 6 and the bump 2 to be tested are in the same axial direction parallel to the second direction Y, the probe 6 only needs to move along the second direction Y to move to the top of the bump 2 to be tested; or, if the probe 6 and the bump 2 to be tested are in different axial directions parallel to the first direction X, the probe 6 needs to move along the first direction X and the second direction Y to move to the top of the bump 2 to be tested.
[0082] By executing steps S11 to S17, in the case of testing multiple bumps 2, the probe 6 no longer simply performs a sliding movement from left to right, but performs a movement along the third direction Z away from the bump 2, moves along the first direction X and / or the second direction Y to the top of the next bump 2 to be tested, and then moves along the third direction Z to the top of the bump 2 to be tested, ensuring that the probe 6 can avoid colliding with the bump 2 to be tested during the movement and maintain accurate contact with the upper surface of the bump 2 to be tested, so that the method can be adapted to the bump area of the packaging substrate 1.
[0083] refer to Figure 3 In the package substrate 1 of the embodiment of the present invention, a plurality of bumps 2 are generally arranged in a rectangular array along the first direction X and the second direction Y; and not only are the bumps 2 of the package substrate 1 micrometer-sized, but the spacing between two adjacent bumps 2 is also often micrometer-sized. For example, the maximum outer diameter of the bump 2 in the first direction X or the second direction Y is D, and 70μm≤D≤90μm, and the shortest spacing between two adjacent bumps 2 in the first direction X and the second direction Y is L, and 70μm≤L≤90μm. Such specifications and dimensions make it easy for the obliquely inserted probe 6 to frequently collide with the bump 2. For this reason, it is necessary for the probe 6 to contact the bump 2 to be tested in a vertical contact manner.
[0084] Considering that the plurality of bumps 2 are arranged in a rectangular array, the arrangement of the bumps 2 has a specific regularity, and the method can control the moving path of the probe 6 according to the arrangement regularity of the bumps 2. Figure 7 As an example of this embodiment, it is a flow chart of the method for passive testing of the package substrate 1 in the embodiment of the present invention under the third embodiment, which specifically includes steps S11 to S19:
[0085] S11, fixing the package substrate 1 so that the bumps 2 are arranged upward;
[0086] S12, obtaining the coordinate position of the convex point 2 to be measured in the coordinate system, where the coordinate system consists of a first direction X and a second direction Y;
[0087] S13, driving the probe 6 to move along the first direction X and / or the second direction Y to the coordinate position of the bump 2 to be tested, so that the probe 6 moves above the bump 2 to be tested;
[0088] S14, driving the probe 6 to move along the third direction Z to the top of the bump 2 to be tested, vertically contacting the bump 2 to be tested, and starting the test;
[0089] S15, when the probe 6 finishes the current test, driving the probe 6 along the third direction Z away from the bump 2 that has completed the test;
[0090] S16, obtaining the coordinate position of the next salient point 2 to be measured in the coordinate system;
[0091] S17, driving the probe 6 to move along the first direction X and / or the second direction Y to the coordinate position of the next convex point 2 to be tested, so that the probe 6 moves above the next convex point 2 to be tested;
[0092] S18, driving the probe 6 to move along the third direction Z to the top of the next bump 2 to be tested, vertically contacting the next bump 2 to be tested, and starting the next test;
[0093] S19, repeat steps S15 to S18 until all bumps 2 have been tested.
[0094] It should be noted that, when multiple bumps 2 are arranged in a rectangular array, the multiple bumps 2 will be distributed in rows and columns. An XY coordinate system consisting of a first direction X and a second direction Y is established, and the first direction X indicates the row distribution of the multiple bumps 2, and the second direction Y indicates the column distribution of the multiple bumps 2, that is, a corresponding coordinate position can be assigned to each bump 2 of the package substrate 1. Obtaining the coordinate position of the bump 2 to be measured in the coordinate system can enable the probe 6 to accurately reach the top of the bump 2 to be measured.
[0095] Moreover, based on the regular arrangement of the plurality of bumps 2 in a rectangular array, the position of the bumps 2 can be scanned by the probe 6 to determine the coordinate position of one or some bumps 2, thereby obtaining the coordinate position corresponding to each bump 2 of the package substrate 1. Figure 8 As an example of this embodiment, it is a flowchart of the method for passive testing of the package substrate 1 in the fourth embodiment of the present invention, which specifically includes steps S11 to S20:
[0096] S11, fixing the package substrate 1 in the test area 3 so that the bumps 2 are arranged upward; the test area 3 is the arrangement area of the package substrate 1;
[0097] S12, driving the probe 6 to move along the first direction X and the second direction Y, scanning the test area 3, and generating the coordinate positions of all the bumps 2 in the test area 3;
[0098] S13, obtaining the coordinate position of the convex point 2 to be measured in the coordinate system, where the coordinate system consists of a first direction X and a second direction Y;
[0099] S14, driving the probe 6 to move along the first direction X and / or the second direction Y to the coordinate position of the bump 2 to be tested, so that the probe 6 moves above the bump 2 to be tested;
[0100] S15, driving the probe 6 to move along the third direction Z to the top of the bump 2 to be tested, vertically contacting the bump 2 to be tested, and starting the test;
[0101] S16, when the probe 6 finishes the current test, driving the probe 6 along the third direction Z away from the bump 2 that has completed the test;
[0102] S17, obtaining the coordinate position of the next salient point 2 to be measured in the coordinate system;
[0103] S18, driving the probe 6 to move along the first direction X and / or the second direction Y to the coordinate position of the next convex point 2 to be tested, so that the probe 6 moves above the next convex point 2 to be tested;
[0104] S19, driving the probe 6 to move along the third direction Z to the top of the next bump 2 to be tested, vertically contacting the next bump 2 to be tested, and starting the next test;
[0105] S20, repeating steps S16 to S19 until all bumps 2 have been tested.
[0106] It should be noted that the probe 6 scans the test area 3, as an example of this embodiment, and its specific working process can be: when any bump 2 is selected as the target bump 2, the probe 6 starts from the starting position, moves along the first direction X and / or the second direction Y to the top of the target bump 2, and moves along the third direction Z to the top of the target bump 2, and contacts the target bump 2 to generate a test signal, thereby determining the position of the target bump 2, and then using the position of the target bump 2 as the coordinate origin to generate the coordinate positions of all bumps 2 in the test area 3. For example, in the case where a plurality of bumps 2 are arranged in a rectangular array of 8 rows and 8 columns, the bump 2 in the 4th row and the 4th column is selected as the target bump 2, and the target bump 2 is used as the coordinate origin, and (1,0) and (-1,0) are used to represent the coordinate positions of two bumps 2 adjacent to the target bump 2 in the first direction X, respectively, to generate the coordinate positions of all bumps 2 in the test area 3.
[0107] Alternatively, the probe 6 scans the test area 3, as an example of this embodiment, and its specific working process can also be: taking the starting position of the probe 6 as the coordinate origin, and taking the interval between two adjacent convex points 2 as the coordinate distance on the same coordinate axis, assigning a corresponding coordinate position to the target convex point 2, and generating the coordinate positions of the remaining convex points 2 in the test area 3. For example, in the case where a plurality of convex points 2 are arranged in a rectangular array of 8 rows and 8 columns, the convex point 2 in the 4th row and the 4th column is selected as the target convex point 2, and taking the original position of the probe 6 in the 1st row and the 1st column as an example, the coordinate position of the target convex point 2 is (4, 4), and the coordinate positions of the remaining convex points 2 in the test area 3 are generated accordingly.
[0108] Of course, when the probe 6 scans the test area 3, the probe 6 can also contact the bumps 2 in the same row and / or column in turn to determine the number of bumps 2 in the same row and / or column, and then combine the above two example processes to generate the coordinate positions of all bumps 2 in the test area 3.
[0109] Passive parameter testing is generally performed on the bump 2 to be tested through a two-port or four-port device, and correspondingly, the number of probes 6 is generally two or four. Since the size of the bump 2 on the package substrate 1 is in the micron level, and the spacing between two adjacent bumps 2 is also in the micron level, the probe 6 is easily deviated from the coordinate position of the bump 2 when it moves randomly. Therefore, as an example of this embodiment, in the aforementioned embodiment, in the case of driving the probe 6 to move along the first direction X and / or the second direction Y, it is an optional movement mode to make the probes 6 in the first direction X or the second direction Y move synchronously.
[0110] In order to implement the aforementioned several implementation methods of the method for passive testing of the package substrate 1, the embodiment of the present invention also provides a device for passive testing of the package substrate 1, referring to Figure 9-10 , which includes a bracket 4, a connecting shaft 5 and a probe 6, wherein the bracket 4 is formed with a test area 3 for placing a packaging substrate 1; the connecting shaft 5 is movably connected to the bracket 4 and can move relative to the bracket 4 along a first direction X; the probe 6 is movably connected to the connecting shaft 5 and can move relative to the connecting shaft 5 along a second direction Y; and the probe 6 is extended along a third direction Z and can be raised and lowered relative to the connecting shaft 5 along the third direction Z to vertically contact or separate from the bump 2 on the packaging substrate 1.
[0111] The number of the connecting shaft 5 can be one, and two probes 6 are arranged on one connecting shaft 5, and the two probes 6 can move respectively along the extension direction of the connecting shaft 5 and relative to the connecting shaft 5. Of course, when the bump 2 to be tested is tested with a four-port device, the number of the connecting shaft 5 can be two, and the two connecting shafts 5 are arranged at intervals along the extension direction of the bracket 4, and two probes 6 are respectively arranged on the two connecting shafts 5.
[0112] Of course, the number of connecting shafts 5 can be greater than two, such as three or four, and the number of probes 6 arranged on the same connecting shaft 5 can also be greater than two, such as three or four, so that the operator can access or replace the required probes 6 according to the requirements of the test equipment to test the bumps 2 to be tested. When the number of connecting shafts 5 is greater than two, the arrangement is the same as that of two connecting shafts 5, and no further illustration is provided here.
[0113] The support 4 may be composed of two support arms 4a arranged at intervals, the two support arms 4a are arranged along the first direction X, and a test area 3 is formed between the two support arms 4a arranged at intervals to place the package substrate 1. The connecting shaft 5 is arranged along the second direction Y and is movably connected to the top of the support arm 4a, so that the connecting shaft 5 can move relative to the support 4 along the first direction X. The connection shaft 5 and the support arm 4a can be movably connected by means of guide rails, screws, connecting rods, etc., which will not be described in detail here.
[0114] The probe 6 can be installed on the connecting shaft 5 through a guide rail, a screw rod, and a connecting rod, so that the probe 6 is movably connected to the connecting shaft 5, so that the probe 6 can move relative to the connecting shaft 5 along the second direction Y. In addition, the probe 6 itself can be provided with a lifting mechanism, such as a cylinder or an oil cylinder driving the probe 6 to rise and fall, or a servo motor driving the screw rod to rotate, driving the probe 6 to rise and fall, etc., so that the probe 6 can rise and fall relative to the connecting shaft 5 along the third direction Z.
[0115] In order to ensure that the tip of the probe 6 is in contact with the top of the bump 2 to be measured, as an example of this embodiment, an optical component 7 can be provided on the bracket 4, and the optical component 7 is used to detect and amplify the image of the top of the bump 2. For example, a lens component can be provided on one of the support arms 4a, and the lens component can move relative to the bracket 4 along the first direction X, and the lens component has an optical zoom function, and the focus of the lens component can be made to fall on the top of the corresponding bump 2 through optical zoom. In this way, when the operator moves the probe 6 to the top of any bump 2, the focus of the lens component can also be adjusted to the top of the same bump 2, so that the operator can visually observe whether the tip of the probe 6 is in contact with the top of the bump 2 to be measured.
[0116] It is understandable that, in the case where the probe 6 is in vertical contact with the bump 2 to be measured, the moving speed of the probe 6 in the third direction Z is too fast, which may cause the probe 6 to hit the top of the bump 2 to be measured. Therefore, as an example of this embodiment, the probe 6 may be connected with a distance adjustment component to adjust the distance between the probe 6 and the top of the bump 2 in the third direction Z. For example, in the case of manual operation, after the operator observes the needle tip of the probe 6 through the lens component, the distance between the probe 6 and the top of the bump 2 in the third direction Z is fine-tuned by the distance adjustment component. Alternatively, in the case of automatic control, after the sensor that moves synchronously with the probe 6 senses that the probe 6 is close to the top of the bump 2, the servo motor switches to the distance adjustment component to fine-tune the distance between the probe 6 and the top of the bump 2 in the third direction Z. The distance adjustment component can adopt a structure such as a gear distance adjustment component, and the gear distance adjustment component is arranged on the lifting mechanism of the probe 6, so as to adjust the moving distance of the probe 6. It will not be described in detail here.
[0117] In summary, the embodiments of the present invention provide a method and device for passive testing of a packaging substrate 1, by controlling the travel path of the probe 6, so that the probe 6 is moved along the third direction Z to the top of the push-button to be tested, and vertically contacts the bump 2 to be tested. In this way, when the method is used to perform a basic passive parameter test on the package, the probe 6 can move on the upper layer of the bump 2 to be tested, so as to avoid the needle tip of the probe 6 colliding with the bump 2 to be tested, causing damage to the needle tip of the probe 6, and when the probe 6 moves to above the bump 2 to be tested, it is only necessary to drive the probe 6 up and down along the third direction Z to achieve vertical contact between the probe 6 and the bump 2 to be tested, and the test device connected to the probe 6 can test the bump 2 to be tested.
[0118] The device for passive testing of the packaging substrate 1 provided in the present application, through the cooperation between the bracket 4 arm and the connecting shaft 5, limits the movement of the probe 6 along the first direction X and the second direction Y, so that the moving path of the probe 6 is adapted to the arrangement of the bumps 2, and the moving position of the probe 6 is mapped one-to-one with the coordinate position of the bump 2 to be tested, making it more convenient to operate the probe 6 to move to the bump 2 to be tested.
[0119] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.
Claims
1. A method for passive testing of a packaging substrate (1), the method being applied to a packaging substrate (1), the packaging substrate (1) having a first direction (X), a second direction (Y) and a third direction (Z) which are mutually perpendicular in pairs, the packaging substrate (1) being provided with a plurality of protrusions (2) having a columnar outer contour, the plurality of protrusions (2) protruding from the packaging substrate (1) along the third direction (Z), characterized in that: The method comprises the following steps: Fixing the packaging substrate (1) so that the bumps (2) are arranged upward; Driving the probe (6) to move along the first direction (X) and / or the second direction (Y), so that the probe (6) moves above the bump (2) to be tested; The probe (6) is driven to move along the third direction (Z) to the top of the bump (2) to be tested, vertically contacting the bump (2) to be tested, and starting the test.
2. The method according to claim 1, characterized in that The method further comprises the steps of: When the probe (6) finishes the current test, driving the probe (6) away from the bump (2) along the third direction (Z); Driving the probe (6) to move along the first direction (X) and / or the second direction (Y) to move the probe (6) to the top of the next bump (2) to be tested; The probe (6) is driven to move along the third direction (Z) to the top of the next bump (2) to be tested, vertically contacting the next bump (2) to be tested, and starting the next test.
3. The method according to claim 1, characterized in that The plurality of protrusions (2) are arranged in a rectangular array along the first direction (X) and the second direction (Y); and the maximum outer diameter of the protrusion (2) in the first direction (X) or the second direction (Y) is D, and 70 μm≤D≤90 μm, and the shortest distance between two adjacent protrusions (2) in the first direction (X) and the second direction (Y) is L, and 70 μm≤L≤90 μm; The method further comprises the steps of: When the probe (6) is driven to move along the first direction (X) and / or the second direction (Y), the coordinate position of the convex point (2) to be measured in a coordinate system is obtained, wherein the coordinate system is composed of the first direction (X) and the second direction (Y); The probe (6) is driven to move along the first direction (X) and / or the second direction (Y) to the coordinate position of the bump (2) to be tested, so that the probe (6) is moved above the bump (2) to be tested.
4. The method according to claim 3, characterized in that The method further comprises the steps of: The packaging substrate (1) is fixed in a test area (3), wherein the test area (3) is a layout area of the packaging substrate (1); In the case of obtaining the coordinate position of the bump (2) to be tested in the coordinate system, the probe (6) is driven to move along the first direction (X) and the second direction (Y), scanning the test area (3) to obtain the coordinate position of the bump (2) to be tested in the coordinate system.
5. The method according to claim 1, characterized in that The method further comprises the steps of: When the probe (6) is driven to move along the first direction (X) and / or the second direction (Y), the probes (6) in the first direction (X) or the second direction (Y) are moved synchronously.
6. A device for passive testing of a package substrate (1), used to implement the method according to any one of claims 1 to 5, characterized in that: include: A support (4), wherein the support (4) is formed with a test area (3) for placing the package substrate (1): at least one connecting shaft (5), the connecting shaft (5) being movably connected to the bracket (4) and being capable of moving relative to the bracket (4) along the first direction (X); At least one probe (6) is movably connected to the connecting shaft (5) and is capable of moving relative to the connecting shaft (5) along the second direction (Y); and the probe (6) is extended along the third direction (Z) and is capable of rising and falling relative to the connecting shaft (5) along the third direction (Z) to vertically contact or separate from the bump (2) on the packaging substrate (1).
7. The device according to claim 6, characterized in that An optical component (7) is arranged on the bracket (4), and the optical component (7) is used to detect and amplify the image of the top of the convex point (2).
8. The device according to claim 6, characterized in that At least two probes (6) are arranged on one connecting shaft (5), and the two probes (6) are respectively movable along the extension direction of the connecting shaft (5) and relative to the connecting shaft (5).
9. The device according to claim 8, characterized in that The number of the connecting shafts (5) is two, the two connecting shafts (5) are arranged at intervals along the extension direction of the bracket (4), and two probes (6) are respectively arranged on the two connecting shafts (5).
10. The device according to claim 6, characterized in that The probe (6) is connected to a distance adjustment component to adjust the distance between the probe (6) and the top of the bump (2).