Leveling device, leveling equipment and leveling method of leveling equipment

Abstract

According to the leveling device, the leveling equipment and the leveling method of the leveling equipment, efficient leveling can be achieved. The leveling device comprises a bottom plate, a plurality of flexible leveling pieces, a bearing piece and a plurality of leveling fasteners, the bottom plate is provided with a first face, the flexible leveling pieces are all installed on the first face, each flexible leveling piece can elastically deform in the height direction of the flexible leveling piece, and a second fixing hole of each flexible leveling piece is communicated with a first fixing hole of the bottom plate; the bearing part is installed on the sides, deviating from the first face, of the multiple flexible leveling parts, the bearing part is provided with a bearing face deviating from the multiple flexible leveling parts, the bearing face is used for bearing a part to be leveled, and each third fixing hole of the bearing part communicates with the second fixing hole of one flexible leveling part; and each leveling fastener penetrates through one third fixing hole, one second fixing hole and one first fixing hole, and each leveling fastener is used for adjusting the height of one flexible leveling piece.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a leveling device, a leveling equipment, and a leveling method for the leveling equipment. Background Art

[0002] As chip manufacturing technology continues to evolve, the features of the chips that need to be inspected are getting smaller and smaller. In the chip manufacturing process, in order to ensure the precision and accuracy of the chip wafer during inspection or processing, a leveling device is needed to level the wafer. However, the existing leveling device is complicated to operate and has low leveling efficiency, which reduces the production efficiency of the chip. Summary of the invention

[0003] The present application provides a leveling device, a leveling equipment and a leveling method for the leveling equipment, which can achieve efficient leveling, help speed up the production cycle of chips, and improve the production efficiency of chips.

[0004] In a first aspect, the present application provides a leveling device, including a base plate, a plurality of flexible leveling members, a bearing member, and a plurality of leveling fasteners, wherein the base plate has a first surface, the base plate is provided with a plurality of first fixing holes, the plurality of first fixing holes are arranged at intervals from each other, and the opening of each fixing hole is located on the first surface; the plurality of flexible leveling members are installed on the base plate, each of the flexible leveling members can be elastically deformed along the height direction of the flexible leveling member, each of the flexible leveling members is provided with a second fixing hole, the second fixing hole penetrates the flexible leveling member along the height direction of the flexible leveling member, and is connected to the first fixing hole ; The carrier is installed on the side of the multiple flexible leveling members away from the first surface, the carrier has a bearing surface away from the multiple flexible leveling members, the bearing surface is used to bear the member to be leveled, the carrier is provided with multiple third fixing holes, each of the third fixing holes penetrates the carrier along the thickness direction of the carrier, and is connected with the second fixing hole of one of the flexible leveling members; each of the leveling fasteners is passed through one of the third fixing holes, the second fixing hole of one of the flexible leveling members and one of the first fixing holes, and each of the leveling fasteners is used to adjust the height of one of the flexible leveling members. In the leveling device provided in the present application, by tightening the leveling fasteners, the distance between the carrier and the first surface of the base plate can be changed, thereby squeezing the multiple flexible leveling members, so that the height of the multiple flexible leveling members changes, thereby providing leveling feed for the leveling device, changing the horizontality of the carrier surface, and enabling the leveling device to achieve a leveling operation. Under this setting, on the one hand, the leveling device can realize the integrated design of leveling and fastening, so that the leveling and fastening of the leveling device can be completed at one time, thereby reducing the interference of the fastening operation on the leveling operation, realizing efficient leveling in a limited space, thereby improving the leveling efficiency of the leveling device, thereby helping to speed up the production rhythm of the chip and improve the production efficiency of the chip. On the other hand, the leveling device only includes components such as the base plate, the flexible leveling member, the bearing member and the leveling fastener, and the assembly between the base plate, the flexible leveling member and the bearing member can be realized through the leveling fastener, so the structure of the leveling device is simple and compact, which is conducive to improving the maintainability of the leveling device and facilitating the maintenance of the leveling device. At the same time, the integrated design of leveling and fastening of the leveling device can also make the force generated by leveling and the force generated by fastening collinear, thereby avoiding the generation of external torque and preventing the bearing member from being deformed due to bending torque, thereby reducing the influence of the leveling and fastening operations on the morphological accuracy of the bearing member, and ensuring that the leveling device has a better leveling effect on the member to be leveled.

[0005] In a possible implementation, each of the flexible leveling members includes a flexible base and a flexible ball table, the flexible base is mounted on the first surface, and the flexible base is provided with a first sub-hole, the first sub-hole penetrates the flexible base along the height direction of the flexible base, and is connected to the first fixing hole, the flexible ball table is mounted on the side of the flexible base away from the first surface, the flexible ball table is provided with a second sub-hole, the second sub-hole penetrates the flexible ball table along the height direction of the flexible ball table, and is connected to the first sub-hole, wherein the second fixing hole includes the first sub-hole and the second sub-hole; the bearing member is located on the side of the flexible ball table away from the flexible base; each of the leveling fasteners is passed through one of the first sub-holes and one of the second sub-holes. Under this setting, the flexible leveling member is composed of a flexible base and a flexible ball table, which can reduce the processing accuracy of the flexible leveling member and the assembly accuracy between the flexible leveling member and the base plate.

[0006] In a possible implementation, the flexible base is provided with a contact groove, the opening of the contact groove is located on the surface of the flexible base away from the first surface, and the contact groove is connected to the first sub-hole; the flexible ball table is located in the contact groove, and the flexible ball table has a contact surface facing the contact groove, and the contact surface abuts against the groove wall surface of the contact groove. Under this setting, the assembly accuracy between the flexible ball table and the flexible base can be reduced, thereby helping to reduce the difficulty of assembling the flexible leveling member.

[0007] In a possible embodiment, the groove wall surface of the contact groove includes a groove bottom wall surface, a first groove side wall surface and a second groove side wall surface, the first groove side wall surface and the second groove side wall surface are respectively located on opposite sides of the groove bottom wall surface and are both connected to the groove bottom wall surface, and the distance between the first groove side wall surface and the second groove side wall surface gradually increases along the groove bottom wall surface toward the opening of the contact groove; the contact surface is an arc surface, and illustratively, the radius R of the contact surface is 20mm≤R≤60mm. The contact surface abuts against both the first groove side wall surface and the second groove side wall surface. Under this setting, the contact surface is always in point contact with the groove wall surface of the contact groove. On the one hand, the requirements for the processing accuracy of the flexible ball table and the flexible base can be reduced, thereby reducing the requirements for the assembly accuracy between the flexible ball table and the flexible base. On the other hand, the flexible ball table can be prevented from generating bending and torsional moment, thereby preventing the bearing member placed on the flexible leveling member from being deformed due to the influence of the bending and torsional moment, thereby helping to ensure that the leveling effect of the leveling device is better. At the same time, during the leveling process, the contact surface and the wall surface of the contact groove are always in point contact, which can also ensure that the maximum stress point of the flexible ball table is always located on the contact surface of the flexible ball table, reducing local stress concentration, thereby avoiding the generation of bending and torsional moments, and further helping to prevent the bearing parts from being deformed due to bending and torsional moments, thereby ensuring that the leveling effect of the leveling device is better.

[0008] In a possible implementation manner, the angle α between the groove bottom wall and the first groove wall is 90°≤α≤120°, and / or the angle β between the groove bottom wall and the second groove wall is 90°≤β≤120°.

[0009] In a possible implementation, the flexible ball table is provided with a first through hole, which is located on a side of the flexible ball table close to the flexible base, and penetrates the flexible ball table along the thickness direction of the flexible ball table, and is spaced apart from the second sub-hole. In this embodiment, the first through hole is a waist-shaped hole. The length direction of the first through hole is parallel to the contact surface. Under this setting, the distance between the hole wall surface on the side of the first through hole close to the contact surface and the contact surface is the same, so as to ensure that the elastic force and elastic restoring force generated when the flexible ball table undergoes elastic deformation are basically the same, thereby avoiding large deformation of the flexible leveling member during the leveling process, making the modal of the flexible leveling member controllable, and facilitating the leveling of small deformation of the leveling device.

[0010] In a possible implementation manner, there are two first through holes, and the two first through holes are respectively located on opposite sides of the second sub-hole. Under this configuration, more deformation space can be provided for the flexible ball table, so that the flexible ball table can better generate elastic force and elastic restoring force.

[0011] In a possible implementation, the flexible base is provided with a second through hole, the second through hole is located on a side of the flexible base close to the flexible ball table, and penetrates the flexible base in the width direction of the flexible base, and is spaced apart from the first sub-hole. In this embodiment, the second through hole is a waist-shaped hole. The length direction of the second through hole is parallel to the groove wall of the contact groove. Under this setting, the distance between the hole wall on the side of the second through hole close to the groove wall of the contact groove and the groove wall of the contact groove is the same, so as to ensure that the elastic force and elastic restoring force generated when the flexible base undergoes elastic deformation are basically the same, thereby avoiding large deformation of the flexible leveling member during the leveling process, making the modal of the flexible leveling member controllable, and facilitating the small deformation leveling of the leveling device.

[0012] In a possible implementation, there are two second through holes, and the two second through holes are respectively located on opposite sides of the first sub-hole. Under this configuration, more deformation space can be provided for the flexible base, so that the flexible base can better generate elastic force and elastic restoring force.

[0013] In a possible implementation, the elastic modulus of the flexible leveling member is less than or equal to 60 GPa, and the yield strength of the flexible base is greater than or equal to 600 MPa. Exemplarily, the flexible leveling member is made of a superelastic nickel-titanium alloy material, so that the flexible leveling member as a whole has properties such as high rigidity and high elasticity.

[0014] In a possible implementation, each of the leveling fasteners includes a head and a rod, the rod is inserted into one of the third fixing holes, the second fixing hole of one of the flexible leveling members, and the first fixing hole, and the head is fixedly connected to one end of the rod facing away from the support member; the leveling device also includes a plurality of washers, each of which is sleeved on the rod of one of the leveling fasteners, and clamped between the head of one of the leveling fasteners and the support member. It can be understood that the washers can protect the support member to prevent the surface of the support member from being scratched due to the friction of the leveling fasteners. At the same time, the washers are made of non-metallic materials. During the leveling process, the friction between the washers and the leveling fasteners is the friction between metal materials and non-metallic materials, and no metal chips or other particles will be generated, thereby reducing the pollution problem caused by metal friction in the leveling device and avoiding the impact on the environment.

[0015] In a possible embodiment, the bearing member is further provided with a plurality of assembly recesses, the plurality of assembly recesses are arranged at intervals from each other, the opening of each assembly recess is located on the bearing surface, and each assembly recess is arranged around the circumference of one of the third fixing holes; the head of each leveling fastener is located in one assembly recess, and the surface of the head of each leveling fastener facing away from the rod is located between the bearing surface and the bottom wall of the assembly recess. Under this arrangement, the leveling fastener can be prevented from protruding relative to the bearing surface of the bearing member, thereby preventing the leveling fastener from affecting the connection reliability between the part to be leveled placed on the bearing member and the bearing member, preventing the part to be leveled from falling off the bearing member, and thus ensuring the normal progress of subsequent inspections.

[0016] In a second aspect, the present application further provides a leveling device, comprising a detector and a leveling device as described in any one of the above items, wherein along the height direction of the leveling device, the detector is located on the side of the bearing surface away from the multiple flexible leveling members, and is used to detect the horizontality of the bearing surface. In this embodiment, the multiple leveling fasteners can be adjusted according to the detection results of the detector to adjust the height of the multiple flexible leveling members, thereby achieving leveling of the leveling device.

[0017] In a possible implementation, the leveling device further includes a motion platform, and the motion platform is used to drive the leveling device to move. In this configuration, the leveling device can move under the drive of the motion platform, so that the bearing surface of the leveling device is arranged relative to the detector, so that the detector can detect the horizontality of the bearing surface.

[0018] In a third aspect, the present application also provides a leveling method for a leveling device, comprising:

[0019] Step 1, providing the leveling device as described above;

[0020] Step 2, using a detector to detect the horizontality of the bearing surface;

[0021] Step three, adjusting the plurality of leveling fasteners according to the detection result of the detector to adjust the height of the plurality of flexible leveling members.

[0022] In a possible implementation manner, after performing step one and before performing step two, the leveling method of the leveling device further includes: pre-tightening a plurality of the leveling fasteners.

[0023] In a possible implementation, step three includes: determining whether the horizontality of the bearing surface is within a preset horizontality range; when the horizontality of the bearing surface is within the preset horizontality range, stopping adjusting the plurality of leveling fasteners; when the horizontality of the bearing surface is not within the preset horizontality range, adjusting the plurality of leveling fasteners to adjust the height of the plurality of flexible leveling members, and performing step two. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0025] Figure 1 It is a structural schematic diagram of a leveling device provided by the present application;

[0026] Figure 2 yes Figure 1 A schematic diagram of the structure of the leveling device in the leveling equipment shown;

[0027] Figure 3 yes Figure 2 A schematic diagram of the exploded structure of the leveling device shown;

[0028] Figure 4 yes Figure 2 The structure diagram of the leveling device shown is cut along AA;

[0029] Figure 5 yes Figure 3A schematic diagram of the structure of the bottom plate in the leveling device shown;

[0030] Figure 6 yes Figure 3 A schematic diagram of the structure of a flexible leveling member in the leveling device shown;

[0031] Figure 7 yes Figure 6 The schematic diagram of the cross-sectional structure of the flexible leveling member after being cut along BB;

[0032] Figure 8 yes Figure 6 A schematic diagram of the structure of a flexible base in the flexible leveling member shown;

[0033] Fig. 9 yes Figure 6 A schematic diagram of the structure of a flexible ball table in the flexible leveling member shown;

[0034] Fig.10 yes Figure 3 A schematic diagram of the structure of the bearing member in the leveling device shown;

[0035] Fig.11 This is a flow chart of a leveling method for a leveling device provided in the present application.

[0036] Description of reference numerals:

[0037] 10- bottom plate;

[0038] 100-leveling device; 110-housing; 120-moving platform; 130-leveling device; 140-detector; 101-first surface; 102-second surface; 103-contact groove; 104-first fixing hole; 10a-first central axis;

[0039] 20-flexible leveling member; 21-flexible base; 22-flexible ball table; 23-second fixing hole;

[0040] 20a-second central axis; 231-first sub-hole; 232-second sub-hole; 211-contact groove; 211a-first groove side wall surface; 211b-second groove side wall surface; 211c-groove bottom wall surface; 213-second through hole; 22a-supporting portion; 22b-abutting portion; 222-first side surface; 223-second side surface; 224-contact surface; 225-first through hole;

[0041] 30- bearing member;

[0042] 30a-bearing surface; 31-third fixing hole; 32-assembly sink;

[0043] 40-leveling fastener;

[0044] 41-head; 42-rod;

[0045] 50-washer. DETAILED DESCRIPTION

[0046] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0047] See also Figure 1 , Figure 1 It is a structural schematic diagram of a leveling device 100 provided in the present application.

[0048] The leveling device 100 of the present application can be used to level the wafer of the chip, and can also be applied to other devices that need to be leveled, such as optical detection devices and atomic force microscopes (Atomic Force Microscope, AFM), and the embodiments of the present application do not strictly limit this. For example, in the chip manufacturing process, the leveling device 100 can be used to level the wafer of the chip to ensure the precision and accuracy of the wafer in operations such as detection or processing. For another example, when using an optical detection device to detect performance parameters such as the shape, size and surface quality of the part to be detected, the leveling device 100 in the optical detection device can be used to adjust the position of the part to be detected to reduce the measurement error and ensure that the accuracy of the detection result of the optical detection device is good.

[0049] In this embodiment, the leveling device 100 may include a housing 110, a motion platform 120, a leveling device 130 and a detector 140. The motion platform 120, the leveling device 130 and the detector 140 are all installed in the housing 110. The motion platform 120 can move relatively in the housing 110. The leveling device 130 is installed on the motion platform 120, and can move relative to the housing 110 driven by the motion platform 120. The leveling device 130 is used for leveling to ensure that the detection accuracy and result accuracy of the parts to be leveled placed on the leveling device 130 are high. The detector 140 is located on the side of the leveling device 130 away from the motion platform 120. The detector 140 is used to detect the horizontality of the leveling device 130. The leveling device 100 can level the leveling device 130 according to the horizontality result of the leveling device 130 detected by the detector 140. In some other embodiments, the number of the leveling device 130 can also be multiple. At this time, multiple leveling devices 130 can perform leveling simultaneously or sequentially, and the embodiments of the present application do not impose any limitation on this.

[0050] Please refer to Figures 2 to 4 , Figure 2 yes Figure 1 The schematic diagram of the structure of the leveling device 130 in the leveling device 100 is shown in FIG. Figure 3 yes Figure 2 The exploded structural diagram of the leveling device 130 is shown in FIG. Figure 4 yes Figure 2 The structure diagram of the leveling device 130 shown is cut along AA. Here, "cut along AA" means cutting along the plane where the AA line is located, and similar descriptions in the following text can be understood in the same way.

[0051] In this embodiment, the leveling device 130 includes a base plate 10, a plurality of flexible leveling members 20, a bearing member 30, a plurality of leveling fasteners 40 and a plurality of washers 50. Specifically, the plurality of flexible leveling members 20 are mounted on the base plate 10 and are spaced apart from each other. The bearing member 30 is mounted on the side of the plurality of flexible leveling members 20 that is away from the base plate 10. Along the height direction of the leveling device 130, the bearing member 30 is spaced apart from the base plate 10. The bearing member 30 is used to carry the member to be leveled (not shown). The plurality of leveling fasteners 40 are used to assemble the base plate 10, the plurality of flexible leveling members 20 and the bearing member 30. During the leveling process, the leveling fastener 40 is rotated, and the force of the leveling fastener 40 is transmitted to the flexible leveling member 20 through the carrier 30, so that the flexible leveling member 20 undergoes elastic deformation to change the height of the flexible leveling member 20, thereby changing the distance between the carrier 30 and the base plate 10, and then adjusting the level of the carrier 30 so that the level of the carrier 30 meets the detection requirements. In this process, the gasket 50 can protect the surface of the carrier 30 to prevent the surface of the carrier 30 from being scratched due to the friction of the leveling fastener 40.

[0052] Please refer to Figure 4 and Figure 5 , Figure 5 yes Figure 3 The structure diagram of the bottom plate 10 in the leveling device 130 is shown.

[0053] In this embodiment, the base plate 10 is mounted on the motion platform 120. In this embodiment, the base plate 10 is made of metal material. Exemplarily, the base plate 10 can be made of aluminum alloy material (such as Al 7075). Specifically, the base plate 10 has a first central axis 10a. The base plate 10 is rotationally symmetric about the first central axis 10a. The base plate 10 also has a first surface 101 and a second surface 102. Along the thickness direction of the base plate 10, the first surface 101 and the second surface 102 are arranged opposite to each other.

[0054] The base plate 10 is also provided with a plurality of first fixing holes 104 and a plurality of contact grooves 103. The openings of the plurality of first fixing holes 104 and the plurality of contact grooves 103 are all located on the first surface 101. Among them, the plurality of first fixing holes 104 are arranged at intervals from each other. Each first fixing hole 104 is recessed from the first surface 101 in a direction away from the flexible leveling member 20. In this embodiment, the plurality of first fixing holes 104 all penetrate the base plate 10 in the thickness direction and are arranged at intervals from each other. Exemplarily, there are three first fixing holes 104. The diameter of the circumscribed circle formed by the centers of the three first fixing holes 104 is 230 mm, and the angle of the line between the centers of two adjacent first fixing holes 104 and the first central axis 10a of the base plate 10 is 120°. In this embodiment, each first fixing hole 104 is a threaded hole. Among them, the diameter of the internal thread of each first fixing hole 104 is 5 mm, and the pitch of each first fixing hole 104 is 0.5 mm.

[0055] The plurality of contact grooves 103 are all recessed from the first surface 101 toward the second surface 102. Each contact groove 103 is arranged around the circumference of a first fixing hole 104. In this embodiment, the plurality of contact grooves 103 are arranged at intervals around the first central axis 10a of the bottom plate 10. Exemplarily, there are three contact grooves 103. The three contact grooves 103 are rotationally symmetrical about the first central axis 10a of the bottom plate 10.

[0056] Please refer to Figure 4 , Figure 6 and Figure 7 , Figure 6 yes Figure 3 The schematic diagram of the structure of the flexible leveling member 20 in the leveling device 130 is shown. Figure 7 yes Figure 6 The cross-sectional structure diagram of the flexible leveling member 20 is shown after being cut along BB.

[0057] Multiple flexible leveling members 20 are all located on the side of the second surface 102 facing the first surface 101. Among them, multiple flexible leveling members 20 are arranged at intervals around the first central axis 10a of the base plate 10. Exemplarily, there are three flexible leveling members 20. The three flexible leveling members 20 are arranged in a nonlinear array. Among them, "nonlinear array arrangement" means that the three flexible leveling members 20 are not arranged in a straight line, but form a nonlinear array in a complex and irregular manner. In some other embodiments, the number of flexible leveling members 20 can also be two, four or more than four, and the embodiments of the present application do not impose strict restrictions on this. Among them, when there are two flexible leveling members 20, the two flexible leveling members 20 are respectively located on opposite sides of the first central axis 10a of the base plate 10. When the number of flexible leveling members 20 is four or more than four, the four or more flexible leveling members 20 can also be arranged in a nonlinear array.

[0058] In this embodiment, each flexible leveling member 20 is installed in a contact groove 103 of the bottom plate 10, and each flexible leveling member 20 can be elastically deformed along the height direction of the flexible leveling member 20. In this embodiment, each flexible leveling member 20 has a second central axis 20a. Along the length direction of the flexible leveling member 20, each flexible leveling member 20 is mirror-symmetrical about the second central axis 20a.

[0059] Specifically, each flexible leveling member 20 is provided with a second fixing hole 23. The second fixing hole 23 penetrates the flexible leveling member 20 along the height direction of the flexible leveling member 20, and is connected to a first fixing hole 104 of the bottom plate 10. The center of the second fixing hole 23 coincides with the second central axis 20a of the flexible leveling member 20. Specifically, the second fixing hole 23 of each flexible leveling member 20 includes a first sub-hole 231 and a second sub-hole 232. The first sub-hole 231 is located on the side of the second sub-hole 232 facing the first surface 101 of the bottom plate 10, and is connected to the second sub-hole 232.

[0060] Each flexible leveling member 20 includes a flexible base 21 and a flexible ball table 22. The flexible base 21 of each flexible leveling member 20 is mounted on the first surface 101 and is located in a contact groove 103 of the base plate 10. The flexible ball table 22 is mounted on the side of the flexible base 21 away from the first surface 101 of the base plate 10. In addition, exemplarily, the elastic modulus of each flexible leveling member 20 is less than or equal to 60 Gpa, and the yield strength of each flexible leveling member 20 is greater than or equal to 600 Mpa. Specifically, the elastic modulus of the flexible base 21 is less than or equal to 60 Gpa, and the yield strength of the flexible base 21 is greater than or equal to 600 Mpa, and / or the elastic modulus of the flexible ball table 22 is less than or equal to 60 Gpa, and the yield strength of the flexible ball table 22 is greater than or equal to 600 Mpa. In this embodiment, the flexible base 21 and the flexible ball table 22 are both made of superelastic inner titanium alloy material, so that the flexible base 21 and the flexible ball table 22 have high rigidity and high elasticity, so that the flexible leveling member 20 as a whole has high rigidity and high elasticity. In other embodiments, the flexible base 21 and the flexible ball table 22 can also be made of other materials with low elastic modulus and high yield height, so that the flexible base 21 and the flexible ball table 22 can have high rigidity and high elasticity, and the embodiments of the present application do not impose strict restrictions on this.

[0061] Please refer to Figure 7 and Figure 8 , Figure 8 yes Figure 6 A schematic structural diagram of a flexible base 21 in a flexible leveling member 20 is shown.

[0062] In this embodiment, the flexible base 21 is provided with a first sub-hole 231 and a contact groove 211. The first sub-hole 231 penetrates the flexible base 21 along the height direction of the flexible base 21 and is connected to the first fixing hole 104. The center of the first sub-hole 231 coincides with the center axis of the flexible base 21. The opening of the contact groove 211 is located on the surface of the flexible base 21 away from the first surface 101. The contact groove 211 is recessed from the surface of the flexible base 21 facing the flexible ball table 22 to the direction away from the flexible ball table 22, and penetrates the two surfaces in the width direction of the flexible base 21 and is connected to the first sub-hole 231. Exemplarily, the cross-sectional shape of the contact groove 211 parallel to the height direction of the flexible base 21 is V-shaped.

[0063] Specifically, the groove wall surface of the contact groove 211 includes a first groove side wall surface 211a, a second groove side wall surface 211b and a groove bottom wall surface 211c. The first groove side wall surface 211a and the second groove side wall surface 211b are respectively located on opposite sides of the groove bottom wall surface 211c, and are both connected to the groove bottom wall surface 211c. Along the groove bottom wall surface 211c in the direction of the opening of the contact groove 211, the distance between the first groove side wall surface 211a and the second groove side wall surface 211b gradually increases. In other words, the first groove side wall surface 211a and the second groove side wall surface 211b are both inclined relative to the groove bottom wall surface 211c. Among them, the angle α between the groove bottom wall surface 211c and the first groove side wall surface 211a is 90°≤α≤120°, and / or, the angle β between the groove bottom wall surface 211c and the second groove side wall surface 211b is 90°≤β≤120°. Exemplarily, the angle α between the groove bottom wall surface 211 c and the first groove side wall surface 211 a is 120°, and the angle β between the groove bottom wall surface 211 c and the second groove side wall surface 211 b is 120°.

[0064] In addition, the flexible base 21 is also provided with a second through hole 213. The second through hole 213 penetrates the flexible base 21 along the width direction of the flexible base 21, and is located on the side of the flexible base 21 close to the flexible ball table 22, and is spaced apart from the contact groove 211 and the first sub-hole 231. In this embodiment, the second through hole 213 is a waist-shaped hole. The length direction of the second through hole 213 is parallel to the groove wall surface of the contact groove 211. Under this setting, the distance between the hole wall surface of the second through hole 213 on the side close to the groove wall surface of the contact groove 211 and the groove wall surface of the contact groove 211 is the same, so as to ensure that the elastic force and elastic restoring force generated when the flexible base 21 undergoes elastic deformation are basically the same, so as to avoid large deformation of the flexible leveling member 20 during the leveling process, so that the modal of the flexible leveling member 20 is controllable, which is helpful to achieve small deformation leveling of the leveling device 130. Exemplarily, there are two second through holes 213. Along the length direction of the flexible base 21, the two second through holes 213 are respectively located on opposite sides of the first sub-hole 231. Among them, one second through hole 213 is arranged close to the first groove side wall surface 211a of the contact groove 211, and the other second through hole 213 is arranged close to the second groove side wall surface 211b of the contact groove 211. When the flexible base 21 is squeezed, the flexible base 21 will undergo elastic deformation. At this time, the second through hole 213 can provide a deformation space for the flexible base 21, so that the flexible base 21 can better generate elastic force and elastic restoring force. In some other embodiments, the number of the second through holes 213 can also be one, three, or more than three.

[0065] Please refer to Figure 6 , Figure 7 and Fig. 9 , Fig. 9 yes Figure 6 A schematic structural diagram of the flexible ball table 22 in the flexible leveling member 20 is shown.

[0066] In this embodiment, the flexible ball table 22 is located in the contact groove 211 of the flexible base 21. Exemplarily, the flexible ball table 22 is roughly hemispherical. Specifically, the flexible ball table 22 is provided with a second sub-hole 232. The second sub-hole 232 passes through the flexible ball table 22 in the height direction of the flexible ball table 22 (Z-axis direction as shown in the figure) to communicate with the first sub-hole 231 of the flexible base 21. Among them, the center of the second sub-hole 232 coincides with the central axis of the flexible ball table 22. The flexible ball table 22 also includes a supporting portion 22a and an abutting portion 22b, and the abutting portion 22b is fixedly connected to one side of the supporting portion 22a in the thickness direction. Among them, the supporting portion 22a is used to support the bearing member 30. The abutting portion 22b is located on the side of the supporting portion 22a facing the flexible base 21. Exemplarily, the abutting portion 22b is roughly semicircular.

[0067] In this embodiment, the abutment portion 22b is mounted on the contact groove 211 of the flexible base 21, and the peripheral side surface of the abutment portion 22b abuts against the groove wall surface of the contact groove 211. The peripheral side surface of the abutment portion 22b includes a first side surface 222, a second side surface 223 and a contact surface 224. Along the thickness direction of the abutment portion 22b, the first side surface 222 and the second side surface 223 are spaced and arranged opposite to each other. The contact surface 224 is located on the side of the flexible ball table 22 facing the contact groove 211, and is connected between the first side surface 222, the second side surface 223 and the peripheral side surface of the support portion 22a, and abuts against the groove wall surface of the contact groove 211. In this embodiment, the contact surface 224 abuts against both the first groove side wall surface 211a and the second groove side wall surface 211b of the contact groove 211. Exemplarily, the contact surface 224 is an arc surface. Among them, the radius R of the contact surface 224 is 20mm≤R≤60mm. Exemplarily, the radius R of the contact surface 224 is 35 mm.

[0068] It can be understood that since the contact surface 224 is an arc surface, when the flexible ball table 22 is installed in the contact groove 211 of the flexible base 21, the contact surface 224 abuts against the first groove side wall surface 211a and the second groove side wall surface 211b of the contact groove 211, that is, the contact surface 224 and the groove wall surface of the contact groove 211 are always in point contact. On the one hand, the requirements for the processing accuracy of the flexible ball table 22 and the flexible base 21 can be reduced, thereby reducing the requirements for the assembly accuracy between the flexible ball table 22 and the flexible base 21. On the other hand, it can avoid the flexible ball table 22 from generating bending and torsional moment, thereby preventing the bearing member 30 placed on the flexible leveling member 20 from being deformed due to the influence of bending and torsional moment, which helps to ensure that the leveling effect of the leveling device 130 is better. At the same time, during the leveling process, the contact surface 224 and the groove wall of the contact groove 211 are always in point contact, which can also make the maximum stress point of the flexible ball table 22 always located on the contact surface 224 of the flexible ball table 22, thereby reducing local stress concentration, thereby avoiding the generation of bending and torsional moment, and further helping to prevent the bearing member 30 from being deformed due to bending and torsional moment, thereby ensuring that the leveling effect of the leveling device 130 is better.

[0069] In addition, the flexible ball table 22 is further provided with a first through hole 225. Specifically, the abutting portion 22b is provided with the first through hole 225. The first through hole 225 penetrates the abutting portion 22b of the flexible ball table 22 along the thickness direction of the abutting portion 22b of the flexible ball table 22, and is located on a side of the abutting portion 22b of the flexible ball table 22 close to the flexible base 21, and is spaced apart from the second sub-hole 232.

[0070] In this embodiment, the first through hole 225 is a waist-shaped hole. The length direction of the first through hole 225 is parallel to the contact surface 224. Under this setting, the distance between the hole wall surface of the first through hole 225 on the side close to the contact surface 224 and the contact surface 224 is the same, so as to ensure that the elastic force and elastic restoring force generated when the flexible ball table 22 undergoes elastic deformation are basically the same, so as to avoid the flexible leveling member 20 from deforming significantly during the leveling process, so that the modality of the flexible leveling member 20 is controllable, which helps to achieve small deformation leveling of the leveling device 130. Exemplarily, there are two first through holes 225. The two first through holes 225 are respectively located on opposite sides of the second sub-hole 232. When the flexible ball table 22 is squeezed, the flexible ball table 22 will undergo elastic deformation. At this time, the first through hole 225 can provide a deformation space for the flexible ball table 22, so that the flexible ball table 22 can better generate elastic force and elastic restoring force. In some other embodiments, the number of the second through holes 213 can also be one, three or more than three.

[0071] Please refer to Figure 4 and Fig.10 , Fig.10 yes Figure 3 A schematic structural diagram of the carrier 30 in the leveling device 130 is shown.

[0072] The bearing member 30 is located on a side of the plurality of flexible leveling members 20 away from the first surface 101 of the bottom plate 10. Specifically, the bearing member 30 is located on a side of the flexible ball table 22 of the plurality of flexible leveling members 20 away from the flexible base 21, and abuts against the supporting portion 22a of the flexible ball table 22 of the plurality of flexible leveling members 20. Exemplarily, the bearing member 30 is substantially disc-shaped. The central axis of the bearing member 30 coincides with the first central axis 10a of the bottom plate 10.

[0073] The carrier 30 has a carrier surface 30a facing away from the plurality of flexible leveling members 20. The carrier surface 30a is used to carry the member to be leveled (not shown). Along the height direction of the leveling device 100, the detector 140 is located on the side of the carrier surface 30a facing away from the plurality of flexible leveling members 20, and is spaced apart from and arranged opposite to the carrier surface 30a, so that the detector 140 can detect the horizontality of the carrier surface 30a.

[0074] In this embodiment, the carrier 30 is a wafer chuck. The carrying surface 30a is used to carry the wafer. In some other embodiments, the carrier 30 can also be other components used to carry items that need to be leveled. For example, in an atomic force microscope, the carrier 30 can also be a stage in a rotating device for leveling.

[0075] In this embodiment, the carrier 30 is also provided with a plurality of third fixing holes 31 and a plurality of assembly recesses 32. Among them, the plurality of third fixing holes 31 all penetrate the carrier 30 along the thickness direction of the carrier 30, and are arranged at intervals from each other. Exemplarily, there are three third fixing holes 31. Each third fixing hole 31 is connected to the second fixing hole 23 of a flexible leveling member 20. In addition, the center of each third fixing hole 31 coincides with the second central axis 20a of a flexible leveling member 20. Under this setting, the center of each third fixing hole 31, the center of the second fixing hole 23 of a flexible leveling member 20, and the center of a first fixing hole 104 all coincide.

[0076] The openings of the multiple assembly recesses 32 are all located on the bearing surface 30a. The multiple assembly recesses 32 are all recessed from the bearing surface 30a toward the direction of the flexible ball table 22. Each assembly recess 32 is arranged around the circumference of a third fixing hole 31. The multiple assembly recesses 32 are all used to install the gasket 50 of the leveling device 130.

[0077] Please refer again Figure 4 Each leveling fastener 40 is inserted through a third fixing hole 31 of the carrier 30, a second fixing hole 23 of a flexible leveling member 20, and a first fixing hole of the bottom plate 10, and is fixed to the bottom plate 10, so that the carrier 30 and the flexible leveling member 20 are assembled with the bottom plate 10. Each leveling fastener 40 is inserted through the second sub-hole 232 and the first sub-hole 231 of the second fixing hole 23. Each leveling fastener 40 is used to adjust the height of a flexible leveling member 20.

[0078] It can be understood that since the center of each third fixing hole 31, the center of the second fixing hole 23 of a flexible leveling member 20 and the center of the first fixing hole 104 all coincide, when the leveling fastener 40 is used to adjust the distance between the support member 30 and the first surface 101 of the base plate 10, the generation of bending and torsional moment can be prevented, thereby preventing the support member 30 from being deformed due to the bending and torsional moment, reducing the influence of the leveling fastener 40 on the morphology of the support member 30 during the leveling and fastening process, and thus also helping to achieve small deformation leveling of the leveling device 130.

[0079] In this embodiment, each leveling fastener 40 is made of metal material. Exemplarily, each leveling fastener 40 is made of titanium alloy material. In this embodiment, each leveling fastener 40 is a screw. The thread specification of each leveling fastener 40 is M5, and the pitch is 0.5 mm. Specifically, each leveling fastener 40 includes a head 41 and a rod 42, and the rod 42 is fixedly connected to one side of the head 41. The rod 42 is sequentially inserted into a third fixing hole 31 of the bearing member 30, a second fixing hole 23 of a flexible leveling member 20, and a first fixing hole 104 of the base plate 10, and is fixed to the base plate 10. The head 41 is fixedly connected to an end of the rod 42 away from the bearing member 30. The head 41 of each leveling fastener 40 is located in an assembly sink 32 of the bearing member 30, and the surface of the head 41 of each leveling fastener 40 away from the rod 42 is located between the bottom wall of the assembly sink 32 and the bearing surface 30a. Under this setting, the leveling fastener 40 can be prevented from protruding relative to the bearing surface 30a of the carrier 30, thereby preventing the leveling fastener 40 from affecting the connection reliability between the part to be leveled placed on the carrier 30 and the carrier 30, and preventing the part to be leveled from falling off the carrier 30, thereby ensuring the normal progress of subsequent inspections.

[0080] Each washer 50 is sleeved on a leveling fastener 40 and is located in an assembly recess 32 of the carrier 30. Specifically, each washer 50 is sleeved on a rod 42 of a leveling fastener 40 and is clamped between a head 41 of a leveling fastener 40 and the carrier 30. Exemplarily, the washer 50 is made of non-metallic material to protect the surface of the carrier 30 and prevent the surface of the carrier 30 from being scratched due to the friction of the leveling fastener 40. In addition, since the washer 50 is made of non-metallic material, during the leveling process, the friction between the washer 50 and the leveling fastener 40 is the friction between the metal material and the non-metallic material, and no metal chips or other particles will be generated, thereby reducing the pollution problem caused by metal friction in the leveling device 130 and avoiding the impact on the environment.

[0081] Please continue reading Figure 4 During the assembly process of the leveling device 130, the flexible base 21 of each flexible leveling member 20 is first installed in the contact groove 103 of the base plate 10, and the first sub-hole 231 of the flexible base 21 corresponds to and communicates with the first fixing hole 104 in the contact groove 103. Then, the flexible ball table 22 of each flexible leveling member 20 is installed in the contact groove 211 of the flexible base 21, and the second sub-hole 232 of the flexible ball table 22 corresponds to and communicates with the first sub-hole 231 of the flexible base 21, so that the second fixing hole 23 is connected with the first fixing hole 104, so as to facilitate the subsequent installation of the leveling fastener 40.

[0082] After the multiple flexible leveling members 20 are assembled with the base plate 10, the bearing member 30 is placed on the side of the multiple flexible leveling members 20 away from the base plate 10, and each third fixing hole 31 of the bearing member 30 corresponds to and communicates with the second fixing hole 23 of a flexible leveling member 20. Then, each washer 50 is sleeved on the rod 42 of a leveling fastener 40. Then, the rod 42 of each leveling fastener 40 is sequentially passed through the third fixing hole 31 of the bearing member 30, the second sub-hole 232 of the flexible ball table 22, the first sub-hole 231 of the flexible base 21 and the first fixing hole 104 of the base plate 10. Finally, the leveling fastener 40 is tightened by using the mutual cooperation between the thread of the leveling fastener 40 and the thread of the first fixing hole 104 to achieve the fixation between the leveling fastener 40 and the base plate 10, thereby achieving the assembly between the bearing member 30, the base plate 10 and the flexible leveling member 20. At this time, each washer 50 is located in an assembly groove 32 of the carrier 30, and is located between the head 41 of a leveling fastener 40 and the bottom wall of an assembly groove 32, so as to avoid the leveling fastener 40 causing wear to the surface of the carrier 30 during the assembly process, thereby helping to extend the service life of the carrier 30.

[0083] In this embodiment, when the leveling fastener 40 is tightened, the distance between the bearing member 30 and the first surface 101 of the bottom plate 10 changes, and the multiple flexible leveling members 20 are squeezed, so that the height of the multiple flexible leveling members 20 can be adjusted, and then the horizontality of the bearing surface 30a of the bearing member 30 can be adjusted, so that the horizontality of the bearing surface 30a meets the detection requirements. In this process, the force of the leveling fastener 40 is transmitted to the flexible ball table 22 through the bearing member 30, and the flexible ball table 22 is elastically deformed by the pressure and squeezes the flexible base 21, so that the flexible base 21 is also elastically deformed, so that the overall height of the flexible leveling member 20 changes, and the horizontality of the bearing surface 30a of the bearing member 30 is adjusted. Under this setting, the tightening operation of the leveling device 130 is also a leveling operation, and the tightening operation and the leveling operation can be performed simultaneously, which can not only achieve efficient leveling of the leveling device 130, but also avoid the secondary tightening operation from interfering with the leveling result of the leveling device 130, thereby achieving high-precision leveling of the leveling device 130 and ensuring that the leveling effect of the leveling device 130 is better.

[0084] It should be noted that, in the actual leveling process, the operator first installs a certain pre-tightening force to pre-tighten and fix each leveling fastener 40, and then uses the detector 140 to detect the levelness of the carrier 30. Then, according to the levelness result of the carrier 30 detected by the detector 140, the pre-tightening force of multiple leveling fasteners 40 is adjusted in sequence to adjust the height of the flexible leveling member 20, so that the levelness of the carrier 30 meets the detection requirements.

[0085] In the leveling device 130 provided by the present application, by tightening the leveling fastener 40, the distance between the carrier 30 and the first surface 101 of the bottom plate 10 can be changed, thereby squeezing the multiple flexible leveling members 20, so that the height of the multiple flexible leveling members 20 changes, thereby providing leveling feed for the leveling device 130, changing the horizontality of the carrier surface 30a, and enabling the leveling device 130 to achieve a leveling operation. Under this setting, on the one hand, the leveling device 130 can achieve an integrated leveling and fastening design, so that the leveling and fastening of the leveling device 130 can be completed at one time, thereby reducing the interference of the fastening operation on the leveling operation, and achieving efficient leveling in a limited space, thereby improving the leveling efficiency of the leveling device 130, thereby helping to speed up the production cycle of the chip and improve the production efficiency of the chip. On the other hand, the structure of the leveling device 130 is simple and compact, which is conducive to improving the maintainability of the leveling device 130 and facilitating the maintenance of the leveling device 130.

[0086] At the same time, the integrated leveling and fastening design of the leveling device 130 can also make the force generated by leveling and the force generated by fastening colinear, thereby avoiding the generation of external torque and preventing the support component 30 from being deformed due to bending torque, thereby reducing the impact of leveling and fastening operations on the morphological accuracy of the support component 30, and ensuring that the leveling device 130 has a better leveling effect on the leveling component.

[0087] In addition, the flexible ball table 22 and the flexible base 21 of the leveling device 130 have high rigidity, so that the rigidity of the flexible ball table 22 and the flexible base 21 can be controlled, so that the overall rigidity of the flexible leveling member 20 can be controlled, so that the overall mode of the leveling device 130 can be controlled, so that the leveling device 130 will not deform when it moves at high speed driven by the motion platform 120. On the one hand, the reliability of the leveling device 130 can be improved, and on the other hand, it can also help to improve the measurement speed, thereby helping to speed up the production rhythm of the chip and improve the production efficiency of the chip.

[0088] The present application also provides a leveling method of the leveling device 100 .

[0089] See also Fig.11 , Fig.11 It is a flow chart of a leveling method of a leveling device 100 provided in the present application.

[0090] Step 1 S1, providing a leveling device 130.

[0091] Step 2 S2: Use the detector 140 to detect the horizontality of the carrying surface 30a.

[0092] After performing the above step 1 S1 and before performing step 2 S2 , the leveling method of the leveling device 100 further includes: pre-tightening the plurality of leveling fasteners 40 .

[0093] Step three S3 , adjusting the plurality of leveling fasteners 40 according to the detection result of the detector 140 to adjust the height of the plurality of flexible leveling members 20 .

[0094] In the above step 3 S3, it includes: judging whether the levelness of the bearing surface 30a is within the preset levelness range. When the levelness of the bearing surface 30a is within the preset levelness range, stop adjusting the multiple leveling fasteners 40. When the levelness of the bearing surface 30a is not within the preset levelness range, adjust the multiple leveling fasteners 40 to adjust the height of the multiple flexible leveling members 20, and proceed to step 2 S2.

[0095] The above are only some embodiments and implementation methods of the present application, and the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by any person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A leveling device, characterized in that: It comprises a bottom plate, a plurality of flexible leveling members, a bearing member and a plurality of leveling fasteners, wherein the bottom plate has a first surface, the bottom plate is provided with a plurality of first fixing holes, the plurality of first fixing holes are arranged at intervals from each other, and the opening of each of the fixing holes is located on the first surface; A plurality of the flexible leveling members are mounted on the first surface, each of the flexible leveling members can be elastically deformed along the height direction of the flexible leveling member, each of the flexible leveling members is provided with a second fixing hole, the second fixing hole penetrates the flexible leveling member along the height direction of the flexible leveling member and is connected to the first fixing hole; The bearing member is installed on a side of the plurality of flexible leveling members away from the first surface, the bearing member has a bearing surface away from the plurality of flexible leveling members, the bearing surface is used to bear the member to be leveled, the bearing member is provided with a plurality of third fixing holes, each of the third fixing holes penetrates the bearing member along the thickness direction of the bearing member, and is connected to the second fixing hole of one of the flexible leveling members; Each of the leveling fasteners is inserted through one of the third fixing holes, one of the second fixing holes of the flexible leveling member, and one of the first fixing holes, and each of the leveling fasteners is used to adjust the height of one of the flexible leveling members.

2. The leveling device according to claim 1, characterized in that: Each of the flexible leveling members includes a flexible base and a flexible ball table, wherein the flexible base is mounted on the bottom plate and is provided with a first sub-hole, the first sub-hole passes through the flexible base along the height direction of the flexible base and is communicated with the first fixing hole, the flexible ball table is mounted on a side of the flexible base away from the first surface, the flexible ball table is provided with a second sub-hole, the second sub-hole passes through the flexible ball table along the height direction of the flexible ball table and is communicated with the first sub-hole, wherein the second fixing hole includes the first sub-hole and the second sub-hole; The bearing member is located on a side of the flexible ball table away from the flexible base; Each of the leveling fasteners is inserted through one of the first sub-holes and one of the second sub-holes.

3. The leveling device according to claim 2, characterized in that: The flexible base is provided with a contact groove, the opening of the contact groove is located on the surface of the flexible base away from the first surface, and the contact groove is connected with the first sub-hole; The flexible ball table is located in the contact groove, and the flexible ball table has a contact surface facing the contact groove, and the contact surface abuts against a groove wall surface of the contact groove.

4. The leveling device according to claim 3, characterized in that: The groove wall surface of the contact groove includes a groove bottom wall surface, a first groove side wall surface and a second groove side wall surface, wherein the first groove side wall surface and the second groove side wall surface are respectively located on opposite sides of the groove bottom wall surface and are both connected to the groove bottom wall surface, and the distance between the first groove side wall surface and the second groove side wall surface gradually increases along the direction of the groove bottom wall surface toward the opening of the contact groove; The contact surface is an arc surface, and the contact surface abuts against both the first groove side wall surface and the second groove side wall surface.

5. The leveling device according to claim 4, characterized in that: The radius R of the contact surface is 20 mm ≤ R ≤ 60 mm.

6. The leveling device according to claim 4 or 5, characterized in that: The angle α between the groove bottom wall surface and the first groove side wall surface is 90°≤α≤120°, and / or the angle β between the groove bottom wall surface and the second groove side wall surface is 90°≤β≤120°.

7. The leveling device according to any one of claims 2 to 6, characterized in that: The flexible ball table is provided with a first through hole, which is located on a side of the flexible ball table close to the flexible base, penetrates the flexible ball table along the thickness direction of the flexible ball table, and is spaced apart from the second sub-hole.

8. The leveling device according to claim 7, characterized in that: There are two first through holes, and the two first through holes are respectively located at two opposite sides of the second sub-hole.

9. The leveling device according to any one of claims 3 to 8, characterized in that: The flexible base is provided with a second through hole, which is located on a side of the flexible base close to the flexible ball table, penetrates the flexible base along the width direction of the flexible base, and is spaced apart from the first sub-hole.

10. The leveling device according to claim 9, characterized in that: There are two second through holes, and the two second through holes are respectively located at two opposite sides of the first sub-hole.

11. The leveling device according to claim 1, characterized in that: The elastic modulus of the flexible leveling member is less than or equal to 60 Gpa, and the yield strength of the flexible leveling member is greater than or equal to 600 Mpa.

12. The leveling device according to claim 11, characterized in that: The flexible leveling piece is made of superelastic nickel-titanium alloy material.

13. The leveling device according to claim 1, characterized in that: Each of the leveling fasteners comprises a head and a rod, the rod is inserted into one of the third fixing holes, one of the second fixing holes of the flexible leveling member, and one of the first fixing holes, and the head is fixedly connected to an end of the rod away from the bearing member; The leveling device further comprises a plurality of washers, each of which is sleeved on the stem of one of the leveling fasteners and clamped between the head of one of the leveling fasteners and the bearing member.

14. The leveling device according to claim 13, characterized in that: The bearing member is further provided with a plurality of assembly recesses, the plurality of assembly recesses are arranged at intervals from each other, the opening of each assembly recess is located on the bearing surface, and each assembly recess is arranged around a circumference of one of the third fixing holes; The head of each of the leveling fasteners is located in one of the assembly recesses, and the surface of the head of each of the leveling fasteners that faces away from the stem is located between the bearing surface and the bottom wall of the assembly recess.

15. A leveling device, characterized in that: It comprises a detector and a leveling device as described in any one of claims 1 to 14, wherein along the height direction of the leveling device, the detector is located on the side of the bearing surface away from the plurality of flexible leveling members and is used to detect the horizontality of the bearing surface.

16. The leveling device according to claim 15, characterized in that The leveling equipment further comprises a motion platform, and the motion platform is used for driving the leveling device to move.

17. A leveling method for a leveling device, characterized in that: include: Step 1, providing a leveling device as claimed in claim 15 or 16; Step 2, using a detector to detect the horizontality of the bearing surface; Step three: adjusting the plurality of leveling fasteners according to the detection result of the detector to adjust the height of the plurality of flexible leveling members.

18. The leveling method of the leveling device according to claim 17, characterized in that: After performing step one and before performing step two, the leveling method of the leveling device further includes: pre-tightening the plurality of leveling fasteners.

19. The leveling method of the leveling device according to claim 17, characterized in that: The step three includes: determining whether the horizontality of the bearing surface is within a preset horizontality range; when the horizontality of the bearing surface is within the preset horizontality range, stopping adjusting the plurality of leveling fasteners; when the horizontality of the bearing surface is not within the preset horizontality range, adjusting the plurality of leveling fasteners to adjust the height of the plurality of flexible leveling members, and performing the step two.

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