A cockpit controller structure

By installing a placement cavity in the cabin controller and a built-in fan, combined with the design of the barrier and heat dissipation fins, the problems of low heat dissipation efficiency and high noise in the air-cooled design in the prior art are solved, and efficient heat dissipation and EMC compatibility are achieved.

CN119743939APending Publication Date: 2025-04-01镁佳(北京)科技有限公司
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Patent Information

Application Number
CN202411936340.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2025-04-01

AI Technical Summary

Technical Problem

The air-cooled design of the existing smart cockpit controller is difficult to meet the EMC requirements due to the external fan.

Method used

A cockpit controller structure is designed, by providing a placement cavity in the housing, both the printed circuit board and the fan are placed in the cavity, and the fan is blown directly onto the printed circuit board to improve heat dissipation, and a barrier is provided in the cavity to meet the EMC requirements. At the same time, add heat dissipation fins to improve heat dissipation ability.

Benefits of technology

It improves the heat dissipation efficiency of the printed circuit board, reduces fan noise, meets the requirements of EMC, and improves the overall heat dissipation effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the field of intelligent device technology, and specifically to a cockpit controller structure, including a shell, a blocking member, a fan, and a plurality of printed circuit boards, wherein a placement cavity is provided inside the shell; the blocking member is fixedly arranged in the placement cavity and divides the placement cavity into a printed circuit board placement cavity and a fan placement cavity, and the blocking member is provided with a plurality of air outlet holes connecting the printed circuit board placement cavity and the fan placement cavity; the shell is provided with an air outlet connecting the printed circuit board placement cavity and an air inlet connecting the fan placement cavity; the fan is placed in the fan placement cavity, and a plurality of printed circuit boards are placed in the printed circuit board placement cavity. Among them, the built-in fan can directly blow to the printed circuit board to improve the heat dissipation effect on the printed circuit board, and the setting of the blocking member can play the effect of partially isolating the printed circuit board to meet the EMC requirements.
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Description

Technical Field

[0001] The present invention relates to the technical field of intelligent devices, and in particular to a cockpit controller structure. Background Art

[0002] At present, smart cockpits have basically become standard equipment for cars. The customer needs of major car manufacturers vary greatly, and most of them adopt customized development, which makes it difficult to reuse structures. In addition, due to the high integration of controller functions, the heat generation power of chips on PCBA is getting higher and higher, and single-board solutions are increasingly unable to meet customer size requirements. More and more smart cockpit controllers are beginning to use double-layer printed circuit board solutions to meet customer needs for small size and multiple functions, and air cooling has become the mainstream heat dissipation method.

[0003] In order to meet the requirements of EMC, the mainstream air-cooling designs on the market currently basically place the fan externally, that is, place the fan outside the shell. In this design, the fan can only blow to the shell, the heat dissipation efficiency is low and the wind resistance is large, which will cause the fan to generate loud noise. Summary of the invention

[0004] In view of this, the present invention provides a cockpit controller structure to solve the problem of reducing the noise generated by the fan under the premise of meeting the EMC requirements.

[0005] In a first aspect, the present invention provides a cockpit controller structure, comprising:

[0006] A housing, wherein a placement cavity is provided inside the housing;

[0007] A blocking member is fixedly arranged in the placement cavity and divides the placement cavity into a printed circuit board placement cavity and a fan placement cavity, and the blocking member is provided with a plurality of air outlet holes connecting the printed circuit board placement cavity and the fan placement cavity; the housing is provided with an air outlet connecting the printed circuit board placement cavity and an air inlet connecting the fan placement cavity;

[0008] A fan is placed in the fan placement chamber;

[0009] A plurality of printed circuit boards are placed in the printed circuit board placement cavity.

[0010] In the above structure, a placement cavity is provided in the shell, and the printed circuit board and the fan are placed in the placement cavity. Compared with placing the fan outside, the built-in fan can blow directly to the printed circuit board, thereby improving the heat dissipation effect on the printed circuit board. At the same time, in order to meet the requirements of EMC (electromagnetic compatibility), a blocking member is fixed inside the placement cavity in the present invention, and the blocking member divides the placement cavity into a printed circuit board placement cavity and a fan placement cavity. Several printed circuit boards are placed in the printed circuit board placement cavity, and the fan is placed in the fan placement cavity; the setting of the blocking member can play the effect of partially isolating the printed circuit board to meet the requirements of EMC. At the same time, in order to enable the airflow blown by the fan to reach the printed circuit board, a plurality of air outlet holes connecting the printed circuit board placement cavity and the fan placement cavity are provided on the blocking member to achieve the effect of heat dissipation on the printed circuit board. At the same time, the shell is provided with an air outlet connected to the printed circuit board placement cavity and an air inlet connected to the fan placement cavity. The air inlet is used to allow external air to flow into the fan placement cavity. When the air is blown by the fan, it flows through the printed circuit board to take away the heat on the printed circuit board, and then flows out of the shell through the air outlet, and the cycle is repeated to achieve heat dissipation of the printed circuit board.

[0011] In an optional embodiment, the cockpit controller structure further includes a plurality of heat dissipation fins, which are connected to the housing and arranged along the airflow direction provided by the fan.

[0012] In the above structure, in order to further improve the heat dissipation capacity of the cockpit controller structure, the present invention fixes a plurality of heat dissipation fins on the shell, and increases the heat dissipation area of ​​the shell through the heat dissipation fins, so as to improve the heat dissipation capacity of the cockpit controller structure. Furthermore, the heat dissipation fins are connected to the shell and arranged along the airflow direction provided by the fan, ensuring that the heat dissipation fins do not hinder the flow of the airflow, so that the airflow can quickly flow through the heat dissipation fins and take away the heat on the heat dissipation fins. At the same time, the heat dissipation fins do not hinder the flow of the airflow, and the noise during the flow of the airflow can also be reduced.

[0013] In an optional embodiment, the fan placement cavity partially protrudes from the upper outer wall of the shell, and the fan placement cavity is provided with an air outlet slot opened toward the upper outer wall of the shell at the protruding portion;

[0014] The heat dissipation fins are arranged on the upper outer wall of the shell.

[0015] In the above structure, the heat dissipation fins are arranged on the upper outer wall of the shell, and the upper part of the fan placement cavity protrudes from the upper outer wall of the shell. The airflow blown by the fan is divided into two parts. The part of the airflow inside the shell flows through the printed circuit board and then flows out from the air outlet to complete the heat dissipation inside the shell; further, since the upper part of the fan placement cavity protrudes from the upper outer wall of the shell, part of the airflow blown by the fan is blown to the upper side of the shell, and this part of the airflow flows through the heat dissipation fins arranged on the upper outer wall of the shell to dissipate the heat of the heat dissipation fins. The two parts of the airflow simultaneously realize the heat dissipation of the shell and the printed circuit board, which can improve the heat dissipation effect of the cockpit controller structure.

[0016] In an optional embodiment, the cockpit controller structure further includes a windshield, which is fixed to the housing and covers a portion of the heat dissipation fins;

[0017] An interface is provided on one side of the wind shield, and the interface is communicated with the air outlet slot.

[0018] In the above structure, in order to enable the airflow blown to the upper side of the shell to flow smoothly to the heat dissipation fins on the upper outer wall of the shell, a wind shield is fixed on the outer wall of the shell, and the wind shield covers part of the heat dissipation fins. The wind shield is connected to the air outlet slot through an interface on one side of the wind shield, thereby limiting the airflow blown to the upper side of the shell by the fan, so that most of the airflow on the upper side of the shell can flow to the heat dissipation fins, thereby improving the heat dissipation effect of the heat dissipation fins.

[0019] In an optional embodiment, the height of the wind shield is lower than the height of the air outlet slot, and the top wall of the interface is sloped.

[0020] In the above structure, the height of the wind shield is set lower than the height of the air outlet slot so that there is a height difference between the interface of the wind shield and the air outlet slot, and then the top wall of the interface is set to be sloped. The sloped top wall of the interface can guide the airflow inside it to the cooling fins, which can increase the flow rate of the airflow at the cooling fins and further improve the heat dissipation effect of the cooling fins.

[0021] In an optional embodiment, a plurality of heat dissipation bosses are provided on the inner wall of the shell, and the heat dissipation bosses are suitable for abutting against the chip on the printed circuit board.

[0022] In the above structure, in order to improve the heat dissipation effect of the printed circuit board, a heat dissipation boss is provided on the inner wall of the shell in the present invention, and the heat dissipation boss is directly in contact with the chip on the printed circuit board. Since the heat generated by the chip on the printed circuit board during operation is relatively large, the boss is provided to directly in contact with the chip on the printed circuit board, so that the heat generated by the chip on the printed circuit board can be quickly transferred to the shell and dissipated through the shell.

[0023] In an optional embodiment, it comprises a main printed circuit board and a secondary printed circuit board, wherein the main printed circuit board is supported by the blocking member to abut against the upper side wall of the housing, and the secondary printed circuit board abuts against the lower side wall of the housing;

[0024] The main printed circuit board and the auxiliary printed circuit board are arranged on the upper and lower sides of the air channel formed by the air outlet holes on the blocking member.

[0025] In an optional embodiment, the cockpit controller structure further includes a board-to-board connector electrically connected between the main printed circuit board and the auxiliary printed circuit board.

[0026] In an optional embodiment, the cockpit controller structure further includes an EMC baffle, which is in a bent shape and is installed between the main printed circuit board and the auxiliary printed circuit board to separate the electronic components electrically connected to the printed circuit board.

[0027] In the above structure, in order to shield the signals in the main printed circuit board and the auxiliary printed circuit board from radiating outward or the external signals from radiating into the main printed circuit board and the auxiliary printed circuit board, so as to avoid the signals radiated from the main printed circuit board and the auxiliary printed circuit board from affecting the external electronic devices or the external electronic devices from affecting the components on the main printed circuit board and the auxiliary printed circuit board, an EMC baffle is provided between the main printed circuit board and the auxiliary printed circuit board and the electronic components on one side thereof to enhance the EMC protection.

[0028] In an optional embodiment, the housing includes an upper shell and a lower cover, and the upper shell and the lower cover are closed to form the placement cavity;

[0029] The edge of the lower cover is provided with a flexible flange, and the flange is interference fit with the upper shell.

[0030] The cockpit controller structure provided by the present invention has the following advantages:

[0031] 1. The present invention provides a cockpit controller structure, comprising a shell, a blocking member, a fan and a plurality of printed circuit boards, wherein a placement cavity is provided inside the shell; the blocking member is fixedly arranged in the placement cavity and divides the placement cavity into a printed circuit board placement cavity and a fan placement cavity, and the blocking member is provided with a plurality of air outlet holes connecting the printed circuit board placement cavity and the fan placement cavity; the shell is provided with an air outlet connecting the printed circuit board placement cavity and an air inlet connecting the fan placement cavity; the fan is placed in the fan placement cavity, and a plurality of printed circuit boards are placed in the printed circuit board placement cavity.

[0032] The cockpit controller structure of this structure is provided with a placement cavity in the shell, and the printed circuit board and the fan are placed in the placement cavity. Compared with placing the fan outside, the built-in fan can blow directly to the printed circuit board, thereby improving the heat dissipation effect of the printed circuit board. At the same time, in order to meet the requirements of EMC (electromagnetic compatibility), a barrier is fixed inside the placement cavity in the present invention, and the barrier separates the placement cavity into a printed circuit board placement cavity and a fan placement cavity. Several printed circuit boards are placed in the printed circuit board placement cavity, and the fan is placed in the fan placement cavity; the setting of the barrier can play the effect of partially isolating the printed circuit board to meet the requirements of EMC. At the same time, in order to enable the airflow blown by the fan to reach the printed circuit board, a plurality of air outlet holes connecting the printed circuit board placement cavity and the fan placement cavity are provided on the barrier to achieve the effect of heat dissipation of the printed circuit board. At the same time, the shell is provided with an air outlet connected to the printed circuit board placement cavity and an air inlet connected to the fan placement cavity. The air inlet is used to allow external air to flow into the fan placement cavity. When the air is blown by the fan, it flows through the printed circuit board to take away the heat on the printed circuit board, and then flows out of the shell through the air outlet, and the cycle is repeated to achieve heat dissipation of the printed circuit board.

[0033] 2. A cockpit controller structure provided by the present invention also includes a plurality of heat dissipation fins, which are connected to the shell and arranged along the airflow direction provided by the fan.

[0034] In order to further improve the heat dissipation capacity of the cockpit controller structure, the present invention fixes a plurality of heat dissipation fins on the shell to increase the heat dissipation area of ​​the shell through the heat dissipation fins, thereby improving the heat dissipation capacity of the cockpit controller structure. Furthermore, the heat dissipation fins are connected to the shell and arranged along the airflow direction provided by the fan, ensuring that the heat dissipation fins do not hinder the flow of the airflow, so that the airflow can quickly flow through the heat dissipation fins and take away the heat on the heat dissipation fins. At the same time, the heat dissipation fins do not hinder the flow of the airflow, and the noise during the flow of the airflow can also be reduced.

[0035] 3. The present invention provides a cockpit controller structure, wherein the fan placement cavity partially protrudes from the upper outer wall of the shell, and the fan placement cavity is provided with an air outlet groove opened toward the upper outer wall of the shell at the protruding portion; the heat dissipation fins are arranged on the upper outer wall of the shell.

[0036] In the cockpit controller structure of this structure, the heat dissipation fins are arranged on the upper outer wall of the shell, and the upper part of the fan placement cavity protrudes from the upper outer wall of the shell. The airflow blown by the fan is divided into two parts. The part of the airflow inside the shell flows through the printed circuit board and then flows out from the air outlet to complete the heat dissipation inside the shell; further, since the upper part of the fan placement cavity protrudes from the upper outer wall of the shell, part of the airflow blown by the fan is blown to the upper side of the shell, and this part of the airflow flows through the heat dissipation fins arranged on the upper outer wall of the shell to dissipate the heat of the heat dissipation fins. The two parts of the airflow simultaneously realize the heat dissipation of the shell and the printed circuit board, which can improve the heat dissipation effect of the cockpit controller structure.

[0037] 4. The present invention provides a cockpit controller structure, wherein a wind shield is fixed to the shell and covers a portion of the heat dissipation fins; an interface is provided on one side of the wind shield, and the interface is connected to the air outlet slot.

[0038] The cockpit controller structure of this structure is provided with a wind shield fixed on the outer wall of the shell in order to enable the airflow blown to the upper side of the shell to flow smoothly to the heat dissipation fins on the upper outer wall of the shell. The wind shield covers part of the heat dissipation fins, and the wind shield is connected to the air outlet slot through an interface on one side of the wind shield, so as to limit the airflow blown by the fan to the upper side of the shell, so that most of the airflow on the upper side of the shell can flow to the heat dissipation fins, thereby improving the heat dissipation effect of the heat dissipation fins.

[0039] 5. The present invention provides a cockpit controller structure, wherein the height of the wind shield is lower than the height of the air outlet slot, and the top wall of the interface is sloped.

[0040] The cockpit controller structure of this structure sets the height of the wind shield plate to be lower than the height of the air outlet slot, so that there is a height difference between the interface of the wind shield plate and the air outlet slot, and then sets the top wall of the interface to be sloped. The sloped top wall of the interface can guide the airflow inside it to the cooling fins, which can increase the flow rate of the airflow at the cooling fins and further improve the heat dissipation effect of the cooling fins.

[0041] 6. In a cockpit controller structure provided by the present invention, a plurality of heat dissipation bosses are provided on the inner wall of the shell, and the heat dissipation bosses are suitable for abutting against the chip on the printed circuit board.

[0042] The cockpit controller structure of this structure, in order to improve the heat dissipation effect of the printed circuit board, is provided with a heat dissipation boss on the inner wall of the shell in the present invention, and the heat dissipation boss is directly abutted against the chip on the printed circuit board. Since the heat generated by the chip on the printed circuit board during operation is relatively large, the boss is provided to directly abut the chip on the printed circuit board, so that the heat generated by the chip on the printed circuit board can be quickly transferred to the shell and dissipated through the shell.

[0043] 7. In a cockpit controller structure provided by the present invention, the EMC baffle is in a bent shape, and the EMC baffle is installed between the main printed circuit board and the auxiliary printed circuit board to separate the electronic components electrically connected to the printed circuit board.

[0044] In order to shield the outward radiation of signals in the main printed circuit board and the auxiliary printed circuit board or the radiation of external signals into the main printed circuit board and the auxiliary printed circuit board, so as to avoid the signals radiated by the main printed circuit board and the auxiliary printed circuit board from affecting external electronic devices or external electronic devices from affecting the components on the main printed circuit board and the auxiliary printed circuit board, the cockpit controller structure of this structure is provided with an EMC baffle between the main printed circuit board and the auxiliary printed circuit board and the electronic components on one side thereof to enhance EMC protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0046] Figure 1 A schematic structural view of a cockpit controller structure provided in an embodiment of the present invention;

[0047] Figure 2 A schematic diagram of the internal structure of a cockpit controller structure provided in an embodiment of the present invention;

[0048] Figure 3 A schematic view of the internal structure of the cockpit controller structure from another direction provided in an embodiment of the present invention;

[0049] Figure 4 A schematic structural view of a printed circuit board in a cockpit controller structure provided in an embodiment of the present invention;

[0050] Figure 5 A schematic structural view of an upper shell in a cockpit controller structure provided in an embodiment of the present invention;

[0051] Figure 6 A schematic structural view of an EMC baffle in a cockpit controller structure provided in an embodiment of the present invention;

[0052] Figure 7 It is a schematic structural view of a lower cover in a cockpit controller structure provided in an embodiment of the present invention;

[0053] Figure 8A schematic structural view of a fan in a cockpit controller structure provided in an embodiment of the present invention;

[0054] Fig. 9 It is a schematic structural view of a windshield in a cockpit controller structure provided in an embodiment of the present invention.

[0055] Description of reference numerals:

[0056] 1- upper shell;

[0057] 2-Lower cover;

[0058] 3-Blocking piece;

[0059] 4- Fan;

[0060] 5- heat sink fins;

[0061] 6- Wind deflector;

[0062] 7- heat dissipation boss;

[0063] 8- Main printed circuit board;

[0064] 9-a pair of printed circuit boards;

[0065] 10-EMC baffle;

[0066] 11-to-board connector. DETAILED DESCRIPTION

[0067] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0068] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0069] Example

[0070] At present, smart cockpits have basically become standard equipment for cars. The customer needs of major car manufacturers vary greatly, and most of them adopt customized development, which makes it difficult to reuse structures. In addition, due to the high integration of controller functions, the heat generation power of chips on PCBA is getting higher and higher, and single-board solutions are increasingly unable to meet customer size requirements. More and more smart cockpit controllers are beginning to use double-layer printed circuit board solutions to meet customer needs for small size and multiple functions, and air cooling has become the mainstream heat dissipation method.

[0071] In order to meet the requirements of EMC, the mainstream air-cooling designs on the market currently basically place the fan externally, that is, place the fan outside the shell. In this design, the fan can only blow to the shell, the heat dissipation efficiency is low and the wind resistance is large, which will cause the fan to generate loud noise.

[0072] To this end, this embodiment provides a cockpit controller structure, such as Figures 1 to 9 As shown, it includes a housing, a blocking member 3, a fan 4, a printed circuit board, a wind shield 6, an EMC shield 10 and a board connector 11.

[0073] In this embodiment, a placement cavity is provided inside the shell, and a blocking member 3 is fixedly arranged in the placement cavity and divides the placement cavity into a printed circuit board placement cavity and a fan placement cavity, and a plurality of air outlet holes connecting the printed circuit board placement cavity and the fan placement cavity are provided on the blocking member 3; an air outlet connecting the printed circuit board placement cavity and an air inlet connecting the fan placement cavity are provided on the shell; a fan 4 is placed in the fan placement cavity; a plurality of parallel printed circuit boards are placed in the printed circuit board placement cavity, and the printed circuit boards are arranged along the airflow direction provided by the fan 4.

[0074] In this embodiment, a placement cavity is provided in the housing, and the printed circuit board and the fan 4 are placed in the placement cavity. Compared with placing the fan 4 externally, the built-in fan 4 can blow directly to the printed circuit board, thereby improving the heat dissipation effect on the printed circuit board. At the same time, in order to meet the requirements of EMC (electromagnetic compatibility), in this embodiment, a blocking member 3 is fixed inside the placement cavity, and the blocking member 3 divides the placement cavity into a printed circuit board placement cavity and a fan placement cavity. Several printed circuit boards are placed in the printed circuit board placement cavity, and the fan 4 is placed in the fan placement cavity; the setting of the blocking member 3 can play the effect of partially isolating the printed circuit board to meet the requirements of EMC. At the same time, in order to enable the airflow blown by the fan 4 to reach the printed circuit board, a number of air outlet holes connecting the printed circuit board placement cavity and the fan placement cavity are provided on the blocking member 3 to achieve the effect of heat dissipation on the printed circuit board. At the same time, the shell is provided with an air outlet connected to the printed circuit board placement cavity and an air inlet connected to the fan placement cavity. The air inlet is used to allow external air to flow into the fan placement cavity. When the air flows through the printed circuit board under the blowing action of the fan 4, the heat on the printed circuit board is taken away, and then the air flows out of the shell through the air outlet, and the cycle is repeated to achieve heat dissipation of the printed circuit board.

[0075] In this embodiment, if Figure 5 As shown, the blocking member 3 is rectangular as a whole, and multiple rows of air outlet holes are neatly opened on the blocking member 3. As mentioned above, in order to meet the requirements of EMC, the blocking member 3 is set between the fan 4 and the printed circuit board to separate the placement cavity into a printed circuit board placement cavity and a fan placement cavity. Therefore, the solid part between the through holes on the blocking member 3 can enhance the protective effect of the overall structure. Therefore, it can be understood that, under the premise of ensuring that the blocking member 3 does not affect the air outlet effect of the fan 4, the number of air outlet holes on the blocking member 3 should be as small as possible. In this embodiment, the air outlet holes are all rectangular through holes. In some other embodiments, other shapes, such as circular, etc., can also be used.

[0076] In this embodiment, the shell includes an upper shell 1 and a lower cover 2. The upper shell 1 and the lower cover 2 are closed to form a placement cavity. The edge of the lower cover 2 is provided with a flexible flange, and the flange is interference fit with the inner wall of the upper shell 1.

[0077] By providing a flexible flange at the edge of the lower cover 2, such as Figure 1 As shown, when the upper shell 1 and the lower cover 2 are installed, the edge of the upper shell 1 is covered by the flexible flange of the edge of the lower cover 2, and the flange is set to have an interference fit with the upper shell 1, which can ensure that the flange can fit tightly against the side wall of the upper shell 1 and meet the EMC (electromagnetic compatibility) requirements.

[0078] In some embodiments, a plurality of flexible small protrusions may be provided on the inner side of the flexible flange. When a size deviation occurs between the upper shell 1 and the lower cover 2, the small protrusions are elastically deformed by squeezing, thereby partially filling the gap between the side wall of the upper shell 1 and the flexible flange at the edge of the lower cover 2, thereby ensuring the airtightness of the entire metal structure and achieving a high protective effect.

[0079] In this embodiment, if Figure 5 As shown, a cavity is provided inside the upper shell 1. When the upper shell 1 and the lower cover 2 are installed, the lower cover 2 closes the upper shell 1 to form a placement cavity inside the shell. The blocking member 3 is fixed inside the upper shell 1. When the upper shell 1 and the lower cover 2 are installed, the blocking member 3 is used to separate the placement cavity. The air outlet and the air inlet are also opened on opposite sides of the upper shell 1. Among them, the air inlet is annular as a whole, which is used to adapt to Figure 8 The structure of the middle fan 4 has a large number of air outlets, which can enable the hot air inside the shell to flow out quickly.

[0080] In this embodiment, the cockpit controller structure further includes a plurality of heat dissipation fins 5 , which are connected to the housing and arranged along the airflow direction provided by the fan 4 .

[0081] In order to further improve the heat dissipation capacity of the cockpit controller structure, the present embodiment fixes a plurality of heat dissipation fins 5 on the shell, and increases the heat dissipation area of ​​the shell through the heat dissipation fins 5, so as to improve the heat dissipation capacity of the cockpit controller structure. Furthermore, the heat dissipation fins 5 are connected to the shell and arranged along the airflow direction provided by the fan 4, so as to ensure that the heat dissipation fins 5 do not hinder the flow of the airflow, so that the airflow can quickly flow through the heat dissipation fins 5 and take away the heat on the heat dissipation fins 5. At the same time, the heat dissipation fins 5 do not hinder the flow of the airflow, and can also reduce the noise when the airflow flows.

[0082] In this embodiment, the fan placement cavity partially protrudes from the upper outer wall of the shell, and the fan placement cavity is provided with an air outlet slot opened toward the upper outer wall of the shell at the protruding part; the heat dissipation fins 5 are arranged on the upper outer wall of the shell.

[0083] like Figure 1 and Figure 2 As shown, the heat dissipation fins 5 are arranged on the upper outer wall of the housing, and the upper part of the fan placement cavity protrudes from the upper outer wall of the housing. Figure 2As shown, the airflow blown by the fan 4 is divided into two parts. The part of the airflow inside the shell flows through the printed circuit board and then flows out from the air outlet to complete the heat dissipation of the inside of the shell; further, since the upper part of the fan placement cavity protrudes out of the upper outer wall of the shell, part of the airflow blown by the fan 4 is blown to the upper side of the shell, and this part of the airflow flows through the heat dissipation fins 5 arranged on the upper outer wall of the shell to dissipate the heat of the heat dissipation fins 5. The two parts of the airflow simultaneously realize the heat dissipation of the shell and the printed circuit board, which can improve the heat dissipation effect of the cockpit controller structure.

[0084] In this embodiment, the wind shield 6 is fixed to the housing and covers a portion of the heat dissipation fins 5 ; an interface is provided on one side of the wind shield 6 , and the interface is communicated with the air outlet slot.

[0085] like Figure 1 and Figure 2 As shown, in order to enable the airflow blown to the upper side of the shell to flow smoothly to the heat dissipation fins 5 on the upper outer wall of the shell, a wind shield 6 is fixed on the outer wall of the shell. The wind shield 6 covers part of the heat dissipation fins 5, and the wind shield 6 is connected to the air outlet slot through an interface on one side thereof, thereby limiting the airflow blown to the upper side of the shell by the fan 4, so that most of the airflow on the upper side of the shell can flow to the heat dissipation fins 5, thereby improving the heat dissipation effect on the heat dissipation fins 5.

[0086] In this embodiment, if Figure 1 As shown, a plurality of reinforcing ribs are provided on the surface of the wind shield 6, and the reinforcing ribs are arranged in strips. By providing a plurality of reinforcing ribs on the surface of the wind shield 6, the strength of the wind shield 6 can be improved.

[0087] At the same time, if Figure 2 As shown, the height of the wind shield 6 is lower than the height of the air outlet slot, and the top wall of the interface is sloped. By setting the height of the wind shield 6 lower than the height of the air outlet slot, there is a height difference between the interface of the wind shield 6 and the air outlet slot, and then setting the top wall of the interface to be sloped, as shown in FIG. Figure 2 As shown, the sloped top wall of the interface can guide the airflow inside it to the heat dissipation fins 5, which can increase the flow rate of the airflow at the heat dissipation fins 5 and further improve the heat dissipation effect of the heat dissipation fins 5.

[0088] In this embodiment, a plurality of heat dissipation bosses 7 are provided on the inner wall of the housing, and the heat dissipation bosses 7 are suitable for abutting against the chip on the printed circuit board. In order to improve the heat dissipation effect of the printed circuit board, in this embodiment, a heat dissipation boss 7 is provided on the inner wall of the housing, and the heat dissipation boss 7 directly abuts against the chip on the printed circuit board. Since the heat generated by the chip on the printed circuit board during operation is relatively large, the heat dissipation boss 7 is provided to directly abut against the chip on the printed circuit board, so that the heat generated by the chip on the printed circuit board can be quickly transferred to the housing, and the heat is dissipated through the housing.

[0089] like Figure 5 and Figure 7 As shown, in this embodiment, a plurality of heat dissipation bosses 7 are provided on both the upper shell 1 and the lower cover 2. As mentioned above, the heat dissipation bosses 7 directly abut against the heat generating components on the printed circuit board to improve the heat dissipation effect of the heat generating components on the printed circuit board. Therefore, in this embodiment, a plurality of heat dissipation bosses 7 are provided on both the upper shell 1 and the lower cover 2. The heat dissipation bosses 7 abut against the heat generating components on the printed circuit board. The number and arrangement positions of the heat dissipation bosses 7 are set according to the positions of the heat generating components on the printed circuit board.

[0090] In this embodiment, the printed circuit board includes a main printed circuit board 8 and a sub-printed circuit board 9. The main printed circuit board 8 is supported by the blocking member 3 to abut against the upper side wall of the shell, and the sub-printed circuit board 9 abuts against the lower side wall of the shell; the main printed circuit board 8 and the sub-printed circuit board 9 are arranged on the upper and lower sides of the air duct formed by the air outlet holes on the blocking member 3.

[0091] like Figure 2 As shown, the main printed circuit board 8 is arranged on the upper side of the auxiliary printed circuit board 9, and a channel is formed between the main printed circuit board 8 and the auxiliary printed circuit board 9. Specifically, the main printed circuit board 8 and the auxiliary printed circuit board 9 are arranged on the upper and lower sides of the air duct formed by the air outlet holes on the blocking member 3. After the airflow blown by the fan 4 passes through the air outlet holes on the blocking member 3 and reaches the printed circuit board placement cavity, the airflow flows between the main printed circuit board 8 and the auxiliary printed circuit board 9 and can take away the heat on the main printed circuit board 8 and the auxiliary printed circuit board 9. By arranging the main printed circuit board 8 and the auxiliary printed circuit board 9 on the upper and lower sides of the air duct formed by the air outlet holes on the blocking member 3, both the main printed circuit board 8 and the auxiliary printed circuit board 9 can be in contact with the airflow blown by the fan 4, thereby ensuring that both the main printed circuit board 8 and the auxiliary printed circuit board 9 can be effectively cooled.

[0092] In this embodiment, if Figure 4 As shown, the board connector 11 is electrically connected between the main printed circuit board 8 and the auxiliary printed circuit board 9. The board connector 11 is an existing component and is used to electrically connect the main printed circuit board 8 and the auxiliary printed circuit board 9.

[0093] In this embodiment, the EMC baffle 10 is in a bent shape. The EMC baffle 10 is installed between the main printed circuit board 8 and the auxiliary printed circuit board 9 and separates the electronic components electrically connected to the printed circuit boards.

[0094] like Figure 4 As shown, a board connector 11 is fixed to the right end of the main printed circuit board 8 and the auxiliary printed circuit board 9, and a plurality of electronic components are fixed to the left end of the main printed circuit board 8 and the auxiliary printed circuit board 9. Figure 1 and Figure 3As shown, the housing is further provided with a placement groove outside the placement cavity for placing the above-mentioned electronic components for connection with external devices. In this embodiment, in order to shield the signals in the main printed circuit board 8 and the auxiliary printed circuit board 9 from radiating outward or the external signals from radiating into the main printed circuit board 8 and the auxiliary printed circuit board 9, so as to avoid the signals radiated by the main printed circuit board 8 and the auxiliary printed circuit board 9 from affecting the external electronic devices or the external electronic devices from affecting the components on the main printed circuit board 8 and the auxiliary printed circuit board 9, as shown in FIG. Figure 3 As shown, an EMC baffle 10 is provided between the main printed circuit board 8 and the auxiliary printed circuit board 9 and the electronic components on one side thereof to enhance EMC protection.

[0095] In this embodiment, if Figure 2 As shown, the main printed circuit board 8 and the auxiliary printed circuit board 9 are placed in parallel inside the shell, and the main printed circuit board 8 and the auxiliary printed circuit board 9 are arranged along the airflow direction provided by the fan 4 to reduce the obstruction of the main printed circuit board 8 and the auxiliary printed circuit board 9 to the airflow provided by the fan 4, while being able to improve the heat dissipation efficiency of the main printed circuit board 8 and the auxiliary printed circuit board 9, it can also effectively reduce wind resistance and thus reduce overall noise.

[0096] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A cockpit controller structure, characterized in that: include: A housing, wherein a placement cavity is provided inside the housing; A blocking member (3) is fixedly arranged in the placement cavity and divides the placement cavity into a printed circuit board placement cavity and a fan placement cavity, and the blocking member (3) is provided with a plurality of air outlet holes communicating with the printed circuit board placement cavity and the fan placement cavity; the housing is provided with an air outlet communicating with the printed circuit board placement cavity and an air inlet communicating with the fan placement cavity; A fan (4) is placed in the fan placement chamber; A plurality of printed circuit boards are placed in the printed circuit board placement cavity.

2. The cockpit controller structure according to claim 1, characterized in that: It also comprises a plurality of heat dissipation fins (5), which are connected to the housing and arranged along the airflow direction provided by the fan (4).

3. The cockpit controller structure according to claim 2, characterized in that: The fan placement cavity partially protrudes from the upper outer wall of the shell, and the fan placement cavity is provided with an air outlet slot opened toward the upper outer wall of the shell at the protruding portion; The heat dissipation fins (5) are arranged on the upper outer wall of the shell.

4. The cockpit controller structure according to claim 3, characterized in that: It also includes a windshield (6), which is fixed to the housing and covers a portion of the heat dissipation fins (5); An interface is provided on one side of the wind shield (6), and the interface is communicated with the air outlet slot.

5. The cockpit controller structure according to claim 4, characterized in that: The height of the wind shield plate (6) is lower than the height of the air outlet slot, and the top wall of the interface is in a slope shape.

6. The cockpit controller structure according to any one of claims 3 to 5, characterized in that: A plurality of heat dissipation bosses (7) are provided on the inner wall of the shell, and the heat dissipation bosses (7) are suitable for abutting against the chip on the printed circuit board.

7. The cockpit controller structure according to any one of claims 3 to 6, characterized in that: It comprises a main printed circuit board (8) and a secondary printed circuit board (9), wherein the main printed circuit board (8) is supported by the blocking member (3) to abut against the upper side wall of the shell, and the secondary printed circuit board (9) abuts against the lower side wall of the shell; The main printed circuit board (8) and the auxiliary printed circuit board (9) are arranged on the upper and lower sides of the air duct formed by the air outlet holes on the blocking member (3).

8. The cockpit controller structure according to claim 7, characterized in that: It also includes a board-to-board connector (11) electrically connected between the main printed circuit board (8) and the auxiliary printed circuit board (9).

9. The cockpit controller structure according to claim 7, characterized in that: It also comprises an EMC baffle (10), which is in a bent shape and is installed between the main printed circuit board (8) and the auxiliary printed circuit board (9) to separate the electronic components electrically connected to the printed circuit board.

10. The cockpit controller structure according to any one of claims 1 to 9, characterized in that: The housing comprises an upper shell (1) and a lower cover (2), wherein the upper shell (1) and the lower cover (2) are closed to form the placement cavity; The edge of the lower cover (2) is provided with a flexible flange, and the flange is interference-fitted with the upper shell (1).