A flexible heat dissipation device and method with a gradient inverse opal nanostructure

Abstract

This invention provides a flexible heat dissipation device and method with a gradient inverse opal nanostructure, relating to the field of heat dissipation for flexible electronic devices. Addressing the problem that current heat dissipation structures in flexible electronic devices are difficult to adapt to the device distribution, this invention employs a hexagonal structure for the encapsulation cover, manifold layer, and microchannel, offering advantages in flow uniformity. It allows for modular connection and integration based on the specific array configuration and spatial arrangement of the functional components of the flexible electronic device, forming an integrated flexible heat dissipation system. Furthermore, it organically utilizes the nano-circulation driving force of the gradient inverse opal nanostructure and the efficient heat dissipation capability of the flexible manifold microchannel, thus providing a universal thermal management solution for efficient heat dissipation of various types and forms of flexible electronic devices.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation in flexible electronic devices, and specifically to a flexible heat dissipation device and method with a gradient inverse opal nanostructure. Background Technology

[0002] With the revolutionary development of microelectronics technology, flexible electronic devices, such as wearable devices, smart medical devices, and electronic skin, have shown broad application prospects. Their unique flexibility, deformability, and ability to conform to various complex shapes have made them highly sought after in many high-tech fields, including consumer electronics, healthcare, and smart sensing. However, flexible electronic devices typically require the integration of numerous functional components within a compact space. The heat generated by these integrated circuits and functional elements during high-power operation is difficult to dissipate effectively. Furthermore, the special flexible structure of these devices imposes stringent limitations on heat dissipation space and methods, making thermal management a key bottleneck restricting device performance and operational reliability.

[0003] Traditional electronic devices typically rely on rigid heat dissipation devices such as heat pipes and vapor chambers for heat dissipation. However, for flexible electronic devices, these rigid heat dissipation devices, made of materials such as metals, have inherent limitations in that they cannot be bent or stretched, greatly restricting their flexible application on the variable curvature surfaces where flexible electronic devices operate. Furthermore, the functional components in flexible electronic devices often have various array configurations. Current commonly used heat dissipation structures cannot flexibly form an overall heat dissipation circulation system according to the array configuration of the devices. This results in difficulties in achieving a good fit between the heat dissipation structure and the various array configurations of the functional components, leading to a complex heat dissipation system and relatively inefficient cooling performance. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a flexible heat dissipation device and method with a gradient inverse opal nanostructure. This device and method can achieve modular connection and combination according to the specific array form and arrangement space of the functional components of flexible electronic devices to form an integrated flexible heat dissipation system. Furthermore, it organically utilizes the nano-circulation driving force of the gradient inverse opal nanostructure and the efficient heat dissipation capability of the flexible manifold microchannel, thereby providing a universal thermal management technology solution for efficient heat dissipation of different types and forms of flexible electronic devices.

[0005] The first objective of this invention is to provide a flexible heat dissipation device with a gradient inverse opal nanostructure, employing the following solution:

[0006] It includes at least one honeycomb-shaped flexible unit, the flexible unit comprising a microchannel portion, a manifold layer portion and an encapsulation cover portion arranged sequentially along the axial direction;

[0007] The manifold layer is equipped with a diversion loop, an inlet manifold, and an outlet manifold. The diversion loop is distributed circumferentially along the edge of the manifold layer. The inlet manifold is connected to the diversion loop, and the outlet manifold is connected to the collection cavity in the center of the manifold layer. Multiple inlet manifolds and multiple outlet manifolds are arranged alternately around the circumference of the manifold layer.

[0008] The microchannel section has multiple annular microchannels spaced radially along it; the inlet manifold is connected to the outlet manifold through the annular microchannels, and the annular microchannels have gradient inverse opal nanostructures at the connection points;

[0009] The encapsulation cover has an outlet for the working fluid that connects to the collection cavity, and the manifold layer has an inlet for the cooling working fluid that connects to the branching loop on its circumferential sidewall.

[0010] Furthermore, the flow distribution loop is hexagonal to allow the cooling medium to flow. The inlet manifold and outlet manifold extend radially along the manifold layer, with one radial end of the inlet manifold connected to the flow distribution loop and the other radial end of the outlet manifold connected to the collection chamber.

[0011] Furthermore, the inlet manifold forms a tapered flow channel structure radially along the manifold layer portion, and the width of the inlet manifold gradually decreases along the radial direction close to the axis of the manifold layer portion.

[0012] Furthermore, along the axial direction of the manifold layer, one end of the inlet manifold and the outlet manifold abuts against the microchannel section and connects to the annular microchannel, while the other end is sealed by the encapsulation cover section.

[0013] Furthermore, the annular microchannels on the microchannel portion are concentrically distributed, and the annular microchannels are hexagonal.

[0014] Furthermore, the microchannel portion has a central chamber that connects to the collection chamber.

[0015] Furthermore, within the annular microchannel, a first porous inverse opal nanostructure and a second porous inverse opal nanostructure are sequentially arranged in the direction from the inlet manifold to the outlet manifold, and the pore size of the first porous inverse opal nanostructure is smaller than that of the second porous inverse opal nanostructure.

[0016] Furthermore, when multiple flexible units are provided, the sides of adjacent flexible units are attached together, and the cooling medium inlets distributed on the attached sides are connected. Multiple flexible units are assembled to form a flexible module for heat dissipation.

[0017] A second objective of this invention is to provide a method for operating a flexible heat dissipation device with a gradient inverse opal nanostructure as described in the first objective, comprising:

[0018] The microchannel portion of the flexible unit is arranged on the heating surface, and the cooling medium flows in from the cooling medium inlet of the manifold layer;

[0019] After being diverted by the diversion loop, the coolant enters multiple inlet manifolds, flows downwards and impacts the microchannel layer to cool the heat-generating surface;

[0020] The gradient inverse opal nanostructure at the microchannel layer can supply capillary force and nanoporous channels to form a replenishing nanocirculation. Under the action of pressure difference, the cooling working fluid after heat exchange flows out of the microchannel layer, flows to the outlet manifold and is collected in the collection chamber.

[0021] The heat exchange cycle is completed after the working fluid flows out of the outlet.

[0022] Furthermore, when multiple flexible units are spliced ​​together, the sides of adjacent flexible units are attached together, and the cooling medium inlets distributed on the attached sides are connected, allowing the cooling medium to enter multiple flexible units.

[0023] Compared with the prior art, the advantages and positive effects of this invention are:

[0024] (1) To address the problem that the heat dissipation and cooling structures in current flexible electronic devices are difficult to match the device distribution, the microchannel, manifold layer, and encapsulation cover are all hexagonal, which has the advantage of uniform flow. Compared with rectangular loops, hexagonal loops can reduce the generation of dead zones and eddies, making the fluid distribution in the channel more uniform, thereby improving heat transfer efficiency and reducing pressure drop. It also has the advantage of integrated heat dissipation units. Compared with circular loops, hexagonal loops can achieve seamless and tight arrangement of heat dissipation units, providing higher channel density and increasing the system's heat and mass transfer capabilities. The honeycomb design of the hexagonal structure has good mechanical stability, can withstand high internal and external pressures, and has the advantage of flexibility. It can achieve modular connection and combination according to the specific array form and arrangement space of the functional components of flexible electronic devices, forming an integrated flexible heat dissipation system. It also organically utilizes the nano-circulation driving force of gradient inverse opal nanostructures and the efficient heat dissipation capability of flexible manifold microchannels, thereby providing a universal thermal management technology solution for efficient heat dissipation of different types and forms of flexible electronic devices.

[0025] (2) It has a multi-level gradient three-dimensional interconnected porous inverse opal nanostructure. On the one hand, it utilizes the strong capillary driving characteristics of the small pore structure to effectively promote the rapid transport and transfer of fluid in a narrow space. On the other hand, it utilizes the large pore area to fully utilize the permeation characteristics of the gas-liquid two-phase working fluid, so that the gas-liquid two-phase can permeate and diffuse efficiently in it, thereby realizing the high circulation power of the nanoscale three-dimensional heat dissipation structure fluid, promoting the circulation and replenishment of the working fluid, and strengthening the thermo-mass circulation characteristics.

[0026] (3) It has a ring-shaped flexible manifold microchannel structure. By optimizing the working fluid flow distribution path on a macro scale, it can achieve uniform distribution and efficient transmission of fluid. In addition, the manifold microchannel structure arrangement has the ability of jet impact cooling, which can provide stronger heat exchange capacity in high heat flux areas. Furthermore, the flexible design enables it to adapt to complex three-dimensional curved surface application scenarios, and realize effective thermal management of flexible electronic devices and wearable devices. Attached Figure Description

[0027] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0028] Figure 1 This is a schematic diagram of the overall structure of the flexible heat dissipation device with gradient inverse opal nanostructure in Embodiments 1 and 2 of the present invention.

[0029] Figure 2 This is an exploded view of the overall structure of the flexible heat dissipation device with gradient inverse opal nanostructure in Embodiments 1 and 2 of the present invention.

[0030] Figure 3 This is a schematic diagram of the cooling working fluid flow in the manifold layer of the flexible heat dissipation device with a gradient inverse opal nanostructure in Embodiments 1 and 2 of the present invention.

[0031] Figure 4 This is a schematic diagram of the flow direction of the cooling working fluid in the microchannel section in Embodiments 1 and 2 of the present invention.

[0032] Figure 5 This is a schematic diagram of the flow of the cooling working fluid in the annular microchannel under the action of the gradient inverse opal nanostructure in Examples 1 and 2 of the present invention.

[0033] Figure 6 This is a schematic diagram of the flow of cooling working fluid in the planar direction of the flexible heat dissipation device with gradient inverse opal nanostructure in Embodiments 1 and 2 of the present invention.

[0034] Figure 7 for Figure 6 A schematic diagram of the cross-section at point AA.

[0035] Figure 8 This is a schematic diagram of a heat dissipation system formed by splicing multiple flexible units in embodiments 1 and 2 of the present invention.

[0036] Figure 9 This is a schematic diagram illustrating how multiple flexible units are spliced ​​together and attached to the heat-generating surface of a flexible electronic device for effective heat dissipation in embodiments 1 and 2 of the present invention.

[0037] Figure 10This is a schematic diagram illustrating the flexibility of the heat dissipation system formed by splicing multiple flexible units in Embodiments 1 and 2 of the present invention.

[0038] In the figure: 1. Encapsulation cover plate, 2. Manifold layer, 3. Microchannel, 11. Working fluid outlet, 21. Cooling working fluid inlet, 22. Hexagonal cooling working fluid distribution loop, 23. Inlet manifold, 24. Outlet manifold, 25. Collection cavity, 251. Through hole, 31. Annular microchannel, 32. Hexagonal chamber, 33. Gradient inverse opal nanostructure.

[0039] 实 Heart-shaped arrows represent the flow path of the cooling medium, dashed arrows represent the flow path of the cooling medium after heat exchange, and ● indicates that the cooling medium flows outward perpendicular to the plane. This indicates that the cooling medium flows inward perpendicular to the plane. Detailed Implementation

[0040] Example 1

[0041] In a typical embodiment of the present invention, such as Figures 1-10 As shown, a flexible heat dissipation device with a gradient inverse opal nanostructure is presented.

[0042] Current commonly used heat dissipation structures cannot flexibly form an overall heat dissipation circulation system according to the array form of devices, resulting in difficulties in achieving good integration between the heat dissipation structure and the various array forms of functional components. This leads to complex heat dissipation systems and relatively inefficient cooling effects. Therefore, this embodiment provides a flexible heat dissipation device with a gradient inverse opal nanostructure. This device can achieve modular connection and integration according to the specific array form and arrangement space of the functional components of flexible electronic devices, forming an integrated flexible heat dissipation system. Furthermore, it organically utilizes the nano-circulation driving force of the gradient inverse opal nanostructure and the efficient heat dissipation capability of the flexible manifold microchannel, thereby providing a universal thermal management technology solution for efficient heat dissipation of different types and forms of flexible electronic devices.

[0043] like Figure 1 As shown, the basic unit of the flexible heat dissipation device with a gradient inverse opal nanostructure is the flexible unit. A single flexible unit is the smallest unit for achieving heat dissipation and cooling. Multiple flexible units can also be spliced ​​together to form a honeycomb-shaped heat dissipation system. Each flexible unit mainly consists of three parts: an encapsulation cover plate 1, a manifold layer 2, and a microchannel 3.

[0044] The flexible unit is hexagonal prism-shaped. The microchannel portion 3, the manifold layer portion 2, and the encapsulation cover portion 1 are stacked sequentially along the axial direction of the honeycomb structure to form the flexible unit. Therefore, the microchannel portion 3, the manifold layer portion 2, and the encapsulation cover portion 1 are also hexagonal prism-shaped structures.

[0045] like Figure 2 As shown, the contours of the encapsulation cover portion 1, the manifold layer portion 2, and the microchannel portion 3 are all hexagonal. One advantage is its superior flow uniformity. Compared to rectangular loops, hexagonal loops can reduce the generation of dead zones and eddies, making the fluid distribution within the channel more uniform, thereby improving heat transfer efficiency and reducing pressure drop. Another advantage is its integrated heat dissipation unit advantage. Compared to circular loops, hexagonal loops achieve seamless and compact arrangement of heat dissipation units, providing higher channel density and increasing the system's heat and mass transfer capabilities. A third advantage is that the hexagonal structure can form a honeycomb pattern after splicing. The honeycomb distribution design has good mechanical stability, can withstand high internal and external pressures, and has flexibility.

[0046] See Figure 2 and Figure 3 The manifold layer 2 is provided with a diversion loop 22, an inlet manifold 23 and an outlet manifold 24. The inlet manifold 23 is connected to the diversion loop 22 and the outlet manifold 24 is connected to the collecting cavity 25 in the center of the manifold layer 2. Multiple inlet manifolds 23 and multiple outlet manifolds 24 are distributed alternately around the circumference of the manifold layer 2.

[0047] For manifold section 2, such as Figure 3 As shown, a hexagonal cooling medium distribution loop 22 is arranged circumferentially, and one or more cooling medium inlets 21 are provided for the cooling medium to enter. An inlet manifold 23 and an outlet manifold 24 extend radially along the manifold layer 2. One radial end of the inlet manifold 23 connects to the distribution loop, and one radial end of the outlet manifold 24 connects to the collecting cavity 25. A through-hole 251 is opened in the center of the collecting cavity 25 for the collection and discharge of the cooling medium after heat exchange.

[0048] In this embodiment, as Figure 3 As shown, several cooling medium inlet manifolds 23 are used for cooling medium diversion and downward impact on the microchannel layer; in addition, cooling medium outlet manifolds 24 are arranged at intervals between the cooling medium inlet manifolds 23 for the cooling medium to flow out of the microchannel layer after heat exchange.

[0049] Specifically, the cooling medium inlet manifold 23 extending in the radial direction has a conical flow channel structure. The width of the inlet manifold 23 gradually decreases in the radial direction close to the axis of the manifold layer 2, which can effectively regulate the flow velocity distribution, reduce flow resistance, and guide the cooling medium to be evenly distributed in the microchannel branch, avoiding the occurrence of local hot spots.

[0050] See Figure 2 and Figure 4The microchannel section 3 is provided with multiple annular microchannels 31 distributed radially at intervals. The annular microchannels 31 are concentrically distributed and a hexagonal chamber 32 is provided in the center. The inlet manifold 23 is connected to the outlet manifold 24 through the annular microchannels 31 or the hexagonal chamber 32. The annular microchannels 31 and the hexagonal chamber 32 are provided with gradient inverse opal nanostructures 33 at the connection positions.

[0051] As an innovative improvement, such as Figure 5 As shown, the microchannel portion 3 has gradient inverse opal nanostructures 33 arranged in the annular microchannel 31 and the hexagonal chamber 32. This addresses the technical problem of conventional microchannels in high heat flux density heat dissipation scenarios, where the cooling medium generates a large number of bubbles during heat exchange due to evaporation / boiling, forming emboli and blocking the cooling medium replenishment path, thus inducing flow boiling instability, local coolant shortage, and heat exchange capacity degradation in the microchannel. By arranging gradient inverse opal nanostructures 33 at the inflow and outflow points of the cooling medium in the microchannel portion 3, the fluid circulation driving force is provided, promoting the circulation and replenishment of the working medium and enhancing the heat-mass circulation characteristics.

[0052] Within the annular microchannel 31, a first porous inverse opal nanostructure and a second porous inverse opal nanostructure are sequentially arranged in the direction from the inlet manifold 23 to the outlet manifold 24, and the pore size of the first porous inverse opal nanostructure is smaller than that of the second porous inverse opal nanostructure.

[0053] Specifically, a small-pore porous inverse opal nanostructure is arranged at the annular microchannel 31 corresponding to the cooling medium inlet manifold 21, and a large-pore porous inverse opal nanostructure is arranged at the annular microchannel 31 corresponding to the cooling medium outlet manifold 24. The strong capillary-driven characteristics of the small-pore structure are fully utilized to effectively promote the rapid transport and transfer of the cooling medium within a confined space for replenishment. Furthermore, the large-pore region fully leverages the permeation characteristics of the gas-liquid two-phase working medium, enabling efficient permeation and diffusion of the gas-liquid two-phase flow, thereby enhancing the heat and mass circulation transport.

[0054] like Figure 6 and Figure 7 As shown, the microchannel portion 3, the manifold layer portion 2, and the encapsulation cover portion 1 are stacked axially to form a flexible unit. Specifically, one end of the inlet manifold 23 and the outlet manifold 24 of the manifold layer portion 2 abuts against the microchannel portion 3 and connects the annular microchannel 31 and the hexagonal chamber 32, while the other end is blocked by the encapsulation cover portion 1.

[0055] The encapsulation cover portion 1 has a working fluid outlet 11 that connects to the collection cavity 25, which is used for the cooling working fluid to flow out of the heat dissipation device after heat exchange is completed; the manifold layer portion 2 has a cooling working fluid inlet 21 that connects to the diversion loop on its circumferential side wall, which is used to input the cooling working fluid into the heat dissipation device.

[0056] The circulating heat exchange path of the cooling medium in the flexible unit is as follows: the cooling medium flows in from the cooling medium inlet 21 of the manifold layer 2, is diverted through the hexagonal cooling medium diversion loop 22, and enters several cooling medium inlet manifolds 23; since the inlet manifolds 23 are connected to the annular microchannels 31 and the hexagonal chambers 32 of the microchannel section 3, the cooling medium enters the annular microchannels 31 simultaneously through multiple segmented fluid inlets, and after heat exchange with the heating surface, it flows out simultaneously through multiple segmented fluid outlets into the cooling medium outlet manifolds 24. This effectively shortens the fluid flow length in the microchannel, reduces flow resistance and pressure drop, and has excellent flow heat exchange characteristics.

[0057] As an innovative improvement, due to the optimized structural design of the annular diversion, the annular microchannel 31, and the conical cooling working fluid inlet manifold 23, compared with traditional microchannels, the flexible heat dissipation device with gradient inverse opal nanostructure provided in this embodiment has more uniform flow distribution characteristics, excellent flow characteristics, and uniform temperature characteristics, and also has efficient cooling capability with jet impact, realizing effective thermal management of flexible electronic devices and wearable devices.

[0058] In this embodiment, a flexible heat dissipation device with a gradient inverse opal nanostructure is implemented as follows. In this embodiment, the gradient inverse opal nanostructure 33 is constructed using a sacrificial template method combined with photolithography.

[0059] First, 5nm-20nm Ti is deposited on the substrate surface using thermal evaporation or electron beam evaporation to increase adhesion. Then, 50nm-200nm gold or platinum or other metals are deposited as a seed layer for electroplating.

[0060] Next, the AZ4620 photoresist is spin-coated onto the substrate surface to form a photosensitive material layer. Electroplating patterns are designed and processed on the mask at the inflow points of the cooling working fluid (arranging small-aperture inverse opal nanostructures). The photoresist layer is cured by irradiation with ultraviolet light, and the photoresist in the unexposed areas is removed using a developer to obtain the electroplated area.

[0061] The immersion area was modified by using solutions such as sodium 3-mercapto-1-propanesulfonate, so that a hydrophilic self-assembled monolayer was attached to the gold surface to form a hydrophilic surface.

[0062] A 4% polystyrene sphere solution with a diameter of 20 nm was dispersed on the substrate surface using a drop casting method. Driven by the sedimentation and convection self-assembly mechanism of the dispersed polystyrene spheres, they were automatically assembled into a porous filler template, which was then transferred to an oven at 95°C for sintering for 0.5 hours to become an electroplated sacrificial layer.

[0063] Finally, an electrochemical workstation at 2.5 mA cm -2 Electrodeposition was performed at a constant current density for 90 minutes. The electroplated sacrificial layer was then removed using a solution such as tetrahydrofuran. The photoresist was removed using a photoresist remover solution. After cleaning with acetone, isopropanol, and deionized water, a small-pore inverse opal nanostructure was obtained.

[0064] Repeat the above operation, change the diameter of the polystyrene ball solution to 200 nm, obtain a large-pore inverse opal nanostructure, and then effectively establish a gradient inverse opal nanostructure 33 in the microchannel part 3.

[0065] Specifically, the diameter of the polystyrene sphere solution can be selected according to the actual situation.

[0066] In this embodiment, the flexible manifold microchannel is constructed using a mold method.

[0067] The encapsulation cover portion 1, manifold layer portion 2, and microchannel portion 3 are all made of the same flexible material. First, a manifold microchannel mold is obtained. Silicon can be used as the mold substrate, and the dimensions and shapes of the encapsulation cover portion 1, manifold layer portion 2, and microchannel portion 3 can be designed on the substrate using photolithography to obtain a silicon-based mold. Alternatively, 3D printing technology can be used to directly design and print resin-based molds for the encapsulation cover portion 1, manifold layer portion 2, and microchannel portion 3.

[0068] After cleaning the obtained manifold microchannel mold, photoresist is spin-coated onto its surface and cured to facilitate the subsequent demolding of the flexible manifold microchannel assembly.

[0069] Liquid polydimethylsiloxane (PDMS) or polymethyl methacrylate (PMMA) is mixed with a curing agent and boron nitride powder. The high thermal conductivity of boron nitride powder significantly enhances the thermal conductivity of the flexible microchannel, facilitating efficient heat transfer between the heat dissipation device and the heating surface. The mixed solution is then poured into a pre-treated manifold microchannel mold, cured in an oven, and then demolded to obtain the various parts of the flexible manifold microchannel. Finally, through-hole treatment (251) is applied to the working fluid inlet and outlet.

[0070] Finally, the various parts of the flexible manifold microchannel are connected and sealed using methods such as direct bonding, hot pressing curing, and plasma bonding to obtain a flexible manifold microchannel heat dissipation device.

[0071] When multiple flexible units are provided, the sides of adjacent flexible units are bonded together, and the cooling medium inlets 21 distributed on the bonded sides are connected. Based on the functional component array form of flexible devices, multiple flexible units are freely spliced ​​and combined to form a flexible module. The flexible module can adopt, for example, Figure 9 and Figure 10The honeycomb structure shown can achieve effective circulation of cooling medium between devices by setting several through holes 251 at the hexagonal cooling medium diversion loop 22 of the spliced ​​heat dissipation device manifold layer 2. It can also be connected through the cooling medium inlet 21 to form a flexible manifold microchannel heat dissipation system, which can then be used to cool flexible heating surfaces of specific shapes.

[0072] Based on the array arrangement of different flexible functional components, multiple flexible units are spliced ​​and combined to form a suitable flexible heat dissipation system, providing a universal thermal management solution for flexible electronic devices of different forms or functions.

[0073] like Figure 8 As shown, the flexible units of the flexible heat dissipation device with different gradient inverse opal nanostructures are connected and assembled by adhesive bonding. Multiple flexible units are connected through the cooling medium inlet 21 to realize the cooling medium circulation process at the heat dissipation system level.

[0074] like Figure 9 As shown, a flexible manifold microchannel heat dissipation system composed of multiple flexible units is attached to the surface of the heat-generating element by adhesive bonding, thereby effectively dissipating heat from the flexible electronic device.

[0075] As an innovative improvement, such as Figure 10 As shown, since the flexible manifold microchannel heat dissipation system is made of flexible materials and has a hexagonal structure with excellent flexibility, it can effectively overcome the technical bottleneck of traditional rigid heat dissipation systems that are difficult to bend or whose heat dissipation efficiency drops significantly when bent, and achieve efficient heat dissipation in application scenarios of flexible devices with variable curvature.

[0076] Example 2

[0077] In another typical embodiment of the present invention, such as Figures 1-10 As shown, a working method of a flexible heat dissipation device with a gradient inverse opal nanostructure is given, utilizing the flexible heat dissipation device with a gradient inverse opal nanostructure as in Example 1.

[0078] like Figure 1 As shown, the working method of the flexible heat dissipation device with a gradient inverse opal nanostructure includes:

[0079] The microchannel portion 3 of the flexible unit is arranged on the heating surface, and the cooling medium flows in from the cooling medium inlet 21 of the manifold layer;

[0080] After being diverted by the diversion loop, the coolant enters multiple inlet manifolds 23, flows downwards and impacts the microchannel layer to cool the heat-generating surface;

[0081] The gradient inverse opal nanostructure 33 at the microchannel layer can supply capillary force and nanoporous channels to form a replenishing nanocirculation. Under the action of pressure difference, the cooling working fluid after heat exchange flows out of the microchannel layer, flows to the outlet manifold 24 and is collected in the collection chamber 25.

[0082] The heat exchange cycle is completed after the working fluid flows out through outlet 11.

[0083] When multiple flexible units are spliced ​​together, the sides of adjacent flexible units are attached together, and the cooling medium inlets 21 distributed on the attached sides are connected, so that the cooling medium enters multiple flexible units.

[0084] Specifically, in conjunction with Example 1 and Figures 1-10 The working method of the flexible heat dissipation device with gradient inverse opal nanostructure includes:

[0085] The cooling medium flows in through the cooling medium inlet 21 of the manifold layer. Multiple flexible manifold microchannel heat dissipation devices can share the cooling medium through through holes 251. After being diverted by the hexagonal cooling medium diversion loop 22, it enters the cooling medium inlet 21 manifold. Simultaneously, the cooling medium impacts downwards on the heat-generating surface of the microchannel layer. Under the action of pressure difference, the cooled medium after heat exchange flows out of the microchannel layer and into the cooling medium outlet manifold 24, and then flows out through the manifold collection cavity 25 to complete the heat exchange cycle. In particular, during the heat exchange process in the microchannel layer, evaporation / boiling generates a large number of bubbles, forming embolism and making it difficult to replenish the cooling medium. However, the gradient inverse opal nanostructure 33 at the microchannel layer can provide capillary force and nanoporous channels to form a replenishment nanocirculation, enhancing the thermo-mass circulation characteristics of the heat dissipation system.

[0086] Due to the working method of the flexible heat dissipation device with gradient inverse opal nanostructure, both its material and structure have excellent flexibility advantages, which can effectively achieve efficient heat dissipation for flexible electronic devices with variable curvature surfaces.

[0087] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A flexible heat dissipation device with a gradient inverse opal nanostructure, characterized in that, It includes at least one hexagonal prism-shaped flexible unit, the flexible unit comprising a microchannel portion, a manifold layer portion and an encapsulation cover portion arranged sequentially along the axial direction; The manifold layer is equipped with a diversion loop, an inlet manifold, and an outlet manifold. The diversion loop is distributed circumferentially along the edge of the manifold layer. The inlet manifold is connected to the diversion loop, and the outlet manifold is connected to the collection cavity in the center of the manifold layer. Multiple inlet manifolds and multiple outlet manifolds are arranged alternately around the circumference of the manifold layer. The microchannel section has multiple annular microchannels spaced radially apart; the inlet manifold is connected to the outlet manifold through the annular microchannels, and the annular microchannels have gradient inverse opal nanostructures at the connection points; wherein, within the annular microchannels, in the direction from the inlet manifold to the outlet manifold, a first porous inverse opal nanostructure and a second porous inverse opal nanostructure are sequentially arranged, and the pore size of the first porous inverse opal nanostructure is smaller than the pore size of the second porous inverse opal nanostructure. The encapsulation cover has an outlet for the working fluid that connects to the collection cavity, and the manifold layer has an inlet for the cooling working fluid that connects to the branching loop on its circumferential sidewall.

2. The flexible heat dissipation device with a gradient inverse opal nanostructure as described in claim 1, characterized in that, The flow distribution loop is hexagonal to allow the cooling medium to flow. The inlet manifold and outlet manifold extend radially along the manifold layer, with one radial end of the inlet manifold connected to the flow distribution loop and the other radial end of the outlet manifold connected to the collection chamber.

3. The flexible heat dissipation device with a gradient inverse opal nanostructure as described in claim 2, characterized in that, The inlet manifold forms a tapered flow channel structure radially along the manifold layer portion, and the width of the inlet manifold gradually decreases along the radial direction close to the axis of the manifold layer portion.

4. The flexible heat dissipation device with a gradient inverse opal nanostructure as described in claim 1, characterized in that, Along the axial direction of the manifold layer, one end of the inlet manifold and the outlet manifold abuts against the microchannel section and connects to the annular microchannel, while the other end is sealed by the encapsulation cover plate section.

5. The flexible heat dissipation device with a gradient inverse opal nanostructure as described in claim 4, characterized in that, The annular microchannels on the microchannel section are concentrically distributed and are hexagonal in shape.

6. The flexible heat dissipation device with a gradient inverse opal nanostructure as described in claim 1, 4, or 5, characterized in that, The microchannel section has a central chamber that connects to the collection chamber.

7. The flexible heat dissipation device with a gradient inverse opal nanostructure as described in claim 1, characterized in that, When multiple flexible units are provided, the sides of adjacent flexible units are attached together, and the cooling medium inlets distributed on the attached sides are connected. Multiple flexible units are assembled to form a flexible module for heat dissipation.

8. A method for operating a flexible heat dissipation device with a gradient inverse opal nanostructure as described in any one of claims 1-7, characterized in that, include: The microchannel portion of the flexible unit is arranged on the heating surface, and the cooling medium flows in from the cooling medium inlet of the manifold layer; After being diverted by the diversion loop, the coolant enters multiple inlet manifolds, flows downwards and impacts the microchannel section, cooling the heat-generating surface; The gradient inverse opal nanostructure in the microchannel section can supply capillary force and nanoporous channels to form a replenishing nanocirculation. Under the action of pressure difference, the cooling working fluid after heat exchange flows out of the microchannel section, flows to the outlet manifold and is collected in the collection chamber. The heat exchange cycle is completed after the working fluid flows out of the outlet.

9. The working method as described in claim 8, characterized in that, When multiple flexible units are spliced ​​together, the sides of adjacent flexible units are attached together, and the cooling medium inlets distributed on the attached sides are connected, allowing the cooling medium to enter multiple flexible units.

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