Array substrate, display panel and method for manufacturing display panel

Abstract

The present application provides an array substrate, a display panel and a method for preparing the display panel, wherein the display panel includes an array substrate; the array substrate provided by the present application is used for a display panel, and the display panel includes a light-emitting component; the array substrate includes a base layer, a conductive layer and a metal solder layer, and an electrode layer is provided on the base layer; the conductive layer includes a plurality of conductive protrusions, and along the thickness direction of the base layer, at least a first end of some of the conductive protrusions is electrically connected to the electrode layer, and at least a second end of some of the conductive protrusions is connected to the metal solder layer, and the metal solder layer is electrically connected to the electrode layer through the conductive protrusions; there is a gap between two adjacent conductive protrusions. During the laser welding process of the array substrate provided by the present application, the solder can be fully melted, thereby improving the welding strength of the light-emitting component and ensuring the quality of the product.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate, a display panel, and a method for preparing the display panel. Background Art

[0002] LED (Light-Emitting Diode) is widely used in fields such as lighting and control panels. With the rapid development of LED direct display product technology, the requirements for the welding quality of LED products are becoming higher and higher.

[0003] In the prior art, laser welding technology is applied to the production and processing of LED products. During the laser welding process, the solder will be heated and melted, and the LED light-emitting component can be connected to the substrate through the solder.

[0004] However, during the laser welding process, the solder may not melt completely, resulting in insufficient welding strength of the LED light-emitting component and the quality of the product cannot be guaranteed. Summary of the invention

[0005] In view of the above problems, the present application provides an array substrate, a display panel and a method for preparing a display panel, wherein the display panel includes an array substrate; during the laser welding process of the array substrate provided by the present application, the solder can be fully melted, thereby improving the welding strength of the light-emitting components and ensuring the quality of the product.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] In a first aspect, the present application provides an array substrate, the array substrate comprising a base layer, a conductive layer and a metal solder layer, wherein an electrode layer is provided on the base layer, the conductive layer is connected to the electrode layer, and the metal solder layer is connected to a side of the conductive layer away from the electrode layer;

[0008] The conductive layer includes multiple conductive protrusions. Along the thickness direction of the base layer, the first ends of at least some of the conductive protrusions are electrically connected to the electrode layer, and the second ends of at least some of the conductive protrusions are connected to the metal solder layer. The metal solder layer is electrically connected to the electrode layer through the conductive protrusions; there is a gap between two adjacent conductive protrusions.

[0009] In a possible implementation manner, at least a portion of the gap is located on a side of the conductive layer close to the metal solder layer and extends to the metal solder layer.

[0010] In a possible implementation, along the thickness direction of the base layer, the conductive layer includes a plurality of sub-conductive layers that are sequentially stacked and connected, and any two adjacent sub-conductive layers are made of different metal materials.

[0011] In this way, the bonding surface formed between any two adjacent sub-conductive layers after heating can ensure the bonding effect between metals and enhance the overall electrical conductivity of the conductive layer.

[0012] In a possible implementation, the multiple sub-conductive layers include a Cu layer, a Ni layer and an Au layer, which are stacked in sequence in a direction away from the base layer; the Cu layer is connected to the electrode layer, and the Au layer is connected to the metal solder layer.

[0013] In this way, the conductive layer formed by the cooperation of the Cu layer, the Ni layer and the Au layer can further improve the bonding strength of laser welding and the quality of the product.

[0014] In a possible implementation manner, the first ends of at least some of the conductive protrusions abut against the electrode layer to be electrically connected to the electrode layer.

[0015] In this way, after the two ends of the conductive protrusion respectively abut against the electrode layer and the metal solder layer, it is convenient to form an electrically conductive structure.

[0016] In one possible implementation, the conductive layer also includes a metal connecting layer; along the thickness direction of the base layer, one side of the metal connecting layer is connected to the electrode layer, and the other side is connected to the first end of at least part of the conductive protrusion; the first end of at least part of the conductive protrusion is electrically connected to the electrode layer through the metal connecting layer.

[0017] In this way, the metal connection layer and the conductive protrusions together form a conductive layer, which facilitates the processing and forming of the conductive layer.

[0018] In a possible implementation, the shape and cross-sectional area of ​​the cross section at each position in the extension direction of the conductive protrusion are the same, and the cross section is a cross section along a direction perpendicular to the thickness of the base layer.

[0019] In this way, when the shape and cross-sectional area of ​​the cross section at each position are the same, the conductive protrusion is a columnar protrusion, which facilitates the processing and forming of the conductive protrusion.

[0020] In a possible implementation, the area of ​​the cross section of the conductive protrusion near the first end is not less than the area of ​​the cross section of the conductive protrusion near the second end; the cross section is a cross section along a direction perpendicular to the thickness of the base layer;

[0021] Preferably, the cross-sectional area of ​​the conductive protrusion gradually decreases along the direction from the first end to the second end.

[0022] In this way, the laser heat can be fully transferred in the gaps of the conductive layer, and the gaps can expose more side surfaces of the metal solder layer, thereby ensuring that the metal solder layer is fully heated.

[0023] In a possible implementation, along the thickness direction of the base layer, the height of the gap is not less than 1 μm; and / or, along the thickness direction perpendicular to the base layer, the width of the gap is not less than 0.5 μm.

[0024] In this way, more laser heat can be transferred in the gap, ensuring the heating effect of the metal solder layer exposed through the gap.

[0025] A second aspect of the present application provides a display panel, comprising a light-emitting element and an array substrate in any of the above implementations, wherein a metal solder layer of the array substrate and a light-emitting electrode of the light-emitting element are laser welded, and the light-emitting electrode is electrically connected to an electrode layer of the array substrate through a conductive layer and the metal solder layer of the array substrate;

[0026] Preferably, at least a portion of the metal solder layer is located in the gaps of the conductive layer, and an engaging structure is formed between the metal solder layer and the conductive layer.

[0027] A third aspect of the present application provides a method for preparing a display panel, comprising:

[0028] Providing an array substrate, wherein the array substrate is the array substrate in any of the above implementations;

[0029] Providing a transfer substrate and a light-emitting component, wherein the light-emitting component is bonded to the transfer substrate through a light-transmitting adhesive layer, and the transfer substrate is a light-transmitting component;

[0030] Aligning the array substrate and the transfer substrate, a side of the array substrate provided with the conductive layer and the metal solder layer is butted against a side of the transfer substrate provided with the light emitting element, and an electrode of the light emitting element is butted against the metal solder layer;

[0031] The laser is irradiated on the matched array substrate and transfer substrate to weld the electrode of the light emitting element to the metal solder layer, and the laser is irradiated from the side of the transfer substrate away from the array substrate to the transfer substrate;

[0032] Remove the transparent adhesive layer and transfer substrate.

[0033] In the array substrate provided by the present application, the metal solder layer is connected to the conductive layer, and the gap in the conductive layer can extend to the metal solder layer located between two adjacent conductive protrusions, so that during the laser welding process, the heat of the laser is more easily transferred to the metal solder layer through the gap in the conductive layer, and the metal solder layer exposed through the gap can be heated, which increases the heating area of ​​the metal solder layer, thereby ensuring that the metal solder layer can be fully melted, and then improves the welding strength of the light-emitting component on the array substrate, and ensures the quality of the product. In addition, after the laser welding is completed, the solder cools and solidifies, and a meshing structure is formed between the metal solder layer and the conductive layer, and the bonding strength between the metal solder layer and the conductive layer is enhanced, further ensuring the quality of the product after welding. In addition, due to the presence of the gap in the conductive layer, the gap facilitates the volatilization and discharge of the flux in the solder, further ensuring the welding strength and product quality. The display panel provided by the present application has the above-mentioned array substrate; the preparation method of the display panel provided by the present application is easy to implement and convenient for the production and processing of the display panel.

[0034] The structure of the present application and its other inventive objectives and beneficial effects will be more clearly understood through the description of the specific implementation methods in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 A first processing schematic diagram of a display panel provided in an embodiment of the present application;

[0037] Figure 2 A second processing schematic diagram of a display panel provided in an embodiment of the present application;

[0038] Figure 3 A third processing schematic diagram of a display panel provided in an embodiment of the present application;

[0039] Figure 4 A fourth processing schematic diagram of a display panel provided in an embodiment of the present application;

[0040] Figure 5 A fifth processing schematic diagram of a display panel provided in an embodiment of the present application;

[0041] Figure 6 A sixth processing schematic diagram of a display panel provided in an embodiment of the present application;

[0042] Figure 7A first structural diagram of a conductive layer provided in an embodiment of the present application;

[0043] Figure 8 A schematic diagram of the connection of multiple sub-conductive layers provided in an embodiment of the present application;

[0044] Fig. 9 A schematic diagram of the connection between the conductive layer and the metal solder layer provided in an embodiment of the present application;

[0045] Fig.10 A schematic diagram of a light-emitting element provided in an embodiment of the present application being connected to a metal solder layer;

[0046] Fig.11 A second structural diagram of the conductive layer provided in an embodiment of the present application;

[0047] Fig.12 A third structural diagram of the conductive layer provided in an embodiment of the present application;

[0048] Fig.13 A fourth structural diagram of the conductive layer provided in an embodiment of the present application;

[0049] Fig.14 A flow chart of a method for preparing a display panel provided in an embodiment of the present application.

[0050] Description of reference numerals:

[0051] 100-base layer; 110-electrode layer;

[0052] 111-substrate cathode; 112-substrate anode;

[0053] 200-conductive layer; 210-conductive protrusion;

[0054] 220-metal connection layer; 230-sub-conductive layer;

[0055] 231-Cu layer; 232-Ni layer;

[0056] 233-Au layer; 300-metal solder layer;

[0057] 400-light-emitting element; 410-light-emitting electrode;

[0058] 411-LED cathode; 412-LED anode;

[0059] 500-gap; 600-transfer substrate;

[0060] 700-light-transmitting adhesive layer; 800-laser. DETAILED DESCRIPTION

[0061] With the rapid development of Mini & Micro-LED direct display product technology, the requirements for LED display effects are getting higher and higher, and the welding quality in LED products can directly affect the display effect of the product; among them, laser welding, as a welding technology, has the advantages of high energy density, small impact area and good welding effect, so it is gradually applied to LED products, and the development of laser welding technology has also become one of the key tracks. In the existing technology, during the laser welding process of LED products, the solder will be heated and melted, and the LED light-emitting parts can be connected to the substrate through the solder.

[0062] However, during the laser welding process, the solder may not be heated enough and thus cannot be completely melted. After the electrodes of the LED light-emitting component are connected to the solder, the welding strength of the LED light-emitting component is insufficient, and the quality of the product cannot be guaranteed.

[0063] Based on the above problems, the present application provides an array substrate, a display panel and a method for preparing a display panel, wherein the display panel includes an array substrate; the conductive layer in the array substrate includes a plurality of conductive protrusions, the metal solder layer is electrically connected to the electrode layer through the conductive protrusions, and there is a gap between two adjacent conductive protrusions; thus, when the metal solder layer is laser welded to the light-emitting component, the presence of the gap in the conductive layer facilitates the transfer of laser heat to the metal solder layer through the gap, thereby ensuring that the metal solder layer can be fully melted, thereby improving the welding strength of the light-emitting component and ensuring the quality of the product.

[0064] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0065] The following specific embodiments are used to describe in detail the technical solution of the present application and how the technical solution of the present application solves the above technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0066] The following combination Figures 1 to 13 , the structures of the array substrate and the display panel provided in the embodiments of the present application are described in detail.

[0067] The present application provides an array substrate for a display panel, wherein the display panel includes a light emitting element 400. Specifically, the light emitting element 400 may be an LED light emitting element. Figure 3As shown in the figure, the structure of the array substrate is shown, and the array substrate includes a base layer 100, a conductive layer 200 and a metal solder layer 300, wherein an electrode layer 110 is provided on the base layer 100, the conductive layer 200 is connected to the electrode layer 110, and the metal solder layer 300 is connected to the side of the conductive layer 200 away from the electrode layer 110, so that the electrode layer 110, the conductive layer 200 and the metal solder layer 300 form an electrical connection. Among them, the metal solder layer 300 is used for laser welding with the light-emitting element 400, and the metal solder layer 300 is used to complete the metal bonding between the array substrate and the light-emitting element 400. The electrode of the light-emitting element 400 can be fixedly connected with the metal solder layer 300 through a laser welding process and form an electrical connection; after the light-emitting element 400 and the array substrate are connected together, the two together become a part of the display panel.

[0068] like Fig. 9 As shown, the figure shows a connection schematic diagram of the conductive layer 200, wherein the conductive layer 200 includes a plurality of conductive protrusions 210, along the thickness direction of the base layer 100, the first ends of at least some of the conductive protrusions 210 are electrically connected to the electrode layer 110, the second ends of at least some of the conductive protrusions 210 are connected to the metal solder layer 300, and the metal solder layer 300 is electrically connected to the electrode layer 110 through the conductive protrusions 210. In addition, there is a gap 500 between two adjacent conductive protrusions 210, and there are multiple gaps 500 in the metal solder layer 300.

[0069] In some embodiments, at least part of the gap 500 is located on the side of the conductive layer 200 close to the metal solder layer 300 and extends to the metal solder layer 300; thus, part of the side of the metal solder layer 300 that is not connected to the conductive protrusion 210 on the side facing the conductive layer 200 can be connected to the gap 500 and exposed through the gap 500. It should be noted that when the gap 500 exposes part of the metal solder layer 300, it can also be connected to the environment outside the electrode layer 110. Only part of the gap 500 can be located on the side of the conductive layer 200 close to the metal solder layer 300, so that the part of the gap 500 can extend to the metal solder layer 300. Alternatively, all of the gaps 500 can be located on the side of the conductive layer 200 close to the metal solder layer 300, so that all of the gaps 500 can extend to the metal solder layer 300.

[0070] It should be noted that, in a specific embodiment, Fig. 9As shown, the first ends of all the conductive protrusions 210 are electrically connected to the electrode layer 110, and the second ends of all the conductive protrusions 210 are connected to the metal solder layer 300, so that the metal solder layer 300 is electrically connected to the electrode layer 110 through the conductive protrusions 210. Alternatively, in another specific embodiment, the first ends of some of the conductive protrusions 210 are electrically connected to the electrode layer 110, and the second ends of some of the conductive protrusions 210 are connected to the metal solder layer 300; wherein the conductive protrusions 210 that are electrically connected to the electrode layer 110 and the metal solder layer 300 can make the metal solder layer 300 and the electrode layer 110 form an electrical connection.

[0071] Thus, when the array substrate provided by the present application is connected to the light emitting element 400, laser welding is performed between the metal solder layer 300 of the array substrate and the light emitting element 400; since the metal solder layer 300 is connected to the conductive layer 200, and the gap 500 in the conductive layer 200 can extend to the metal solder layer 300 located between two adjacent conductive protrusions 210, during the laser welding process, the heat of the laser 800 is more easily transferred to the metal solder layer 300 through the gap 500 in the conductive layer 200, and the metal solder layer 300 exposed through the gap 500 can be heated, thereby increasing the heating area of ​​the metal solder layer 300, thereby ensuring that the metal solder layer 300 can be fully melted, and then improving the welding strength of the light emitting element 400, and ensuring the quality of the product. It should be noted that if there is no gap 500 inside the conductive layer 200, the side of the metal solder layer 300 that is attached to the conductive layer 200 is not easily heated, so that the solder is easily melted poorly, affecting the welding strength.

[0072] In addition, during the laser welding process, the heated and melted solder can also enter the gap 500 in the conductive layer 200, such as Fig.10 As shown, when the solder cools and solidifies, a meshing structure is formed between the metal solder layer 300 and the conductive layer 200, and the bonding strength between the metal solder layer 300 and the conductive layer 200 is enhanced, further ensuring the quality of the product after welding. In addition, during the laser welding process, there will be flux in the solder, and the flux is often an organic substance. The flux that has not volatilized will remain in the metal solder layer 300, thereby affecting the bonding strength of the welding; in the array substrate of the present application, since there is a gap 500 in the conductive layer 200, the gap 500 facilitates the volatilization and discharge of the flux in the solder, further ensuring the bonding strength and product quality after laser welding.

[0073] Combine the following Figures 1 to 3 , the processing process of the array substrate is described as follows: Figure 1As shown, the base layer 100 may include a TFT (Thin Film Transistor) glass substrate. First, an electrode layer 110 is formed on the glass substrate by an array process; then, as shown in FIG. Figure 2 As shown, the conductive layer 200 can be formed on the electrode layer 110 by evaporation, PVD (Physical Vapor Deposition), exposure, development and etching, etc.; finally, the metal solder layer 300 can be formed on the conductive layer 200 by stencil printing, coating, etc., and specifically, the metal solder layer 300 can be a solder paste layer. In addition, it should be noted that the electrode layer 110 can form a first pad layer, and the conductive layer 200 can form a second pad layer.

[0074] In addition, the electrode layer 110 includes a base cathode 111 and a base anode 112, and the light-emitting electrode 410 of the LED light-emitting element includes an LED cathode 411 and an LED anode 412; the base cathode 111 can form an electrical connection with the LED cathode 411 through the conductive layer 200 and the metal solder layer 300, and the base anode 112 can form an electrical connection with the LED anode 412 through the conductive layer 200 and the metal solder layer 300.

[0075] In the embodiments of the present application, Figure 8 As shown, along the thickness direction of the base layer 100, the conductive layer 200 includes a plurality of sub-conductive layers 230 which are sequentially stacked and connected, and any two adjacent sub-conductive layers 230 are made of different metal materials. With such arrangement, during the laser welding process, compared with the sub-conductive layers 230 of a single metal, when the conductive layer 200 is composed of sub-conductive layers 230 of a plurality of metal materials, the bonding surface formed after heating between any two adjacent sub-conductive layers 230 can ensure the bonding effect between the metals and enhance the overall electrical conductivity of the conductive layer 200.

[0076] The material of the conductive layer 200 includes at least one of metals such as Cu, Ni, Au, In, Sn, Ti, Al, ITO, and Mo, and may be a combination of two or more metal film layers, and each metal film layer has a certain thickness.

[0077] For example, Figure 8As shown, the multiple sub-conductive layers 230 include a Cu layer 231, a Ni layer 232 and an Au layer 233. In the direction away from the base layer 100, the Cu layer 231, the Ni layer 232 and the Au layer 233 are stacked in sequence; the Cu layer 231 is connected to the electrode layer 110, and the Au layer 233 is connected to the metal solder layer 300. The Cu layer 231, the Ni layer 232 and the Au layer 233 are stacked in sequence to form a conductive layer 200, and the conductive layer 200 can be metal-bonded with the Au electrode of the light-emitting element 400 through the Au layer 233 and form an electrical connection. In practical applications, Cu is a common conductive layer material. After the Cu layer 231 is covered by other metal layers, the other metal layers can effectively prevent Cu diffusion and Cu oxidation; in this way, the conductive layer 200 formed by the mutual cooperation of the Cu layer 231, the Ni layer 232 and the Au layer 233 can further improve the bonding strength of laser welding and the quality of the product.

[0078] In a specific embodiment, Fig. 9 As shown, the first ends of at least some of the conductive protrusions 210 abut against the electrode layer 110 to be electrically connected to the electrode layer 110. In this way, after the two ends of the conductive protrusion 210 abut against the electrode layer 110 and the metal solder layer 300, respectively, an electrically conductive structure is formed. Specifically, the first ends of all the conductive protrusions 210 abut against the electrode layer 110.

[0079] In another specific embodiment, Fig.11 As shown, the conductive layer 200 further includes a metal connection layer 220; along the thickness direction of the base layer 100, one side of the metal connection layer 220 is connected to the electrode layer 110, and the other side is connected to the first end of at least part of the conductive protrusions 210; thus, the first end of at least part of the conductive protrusions 210 is electrically connected to the electrode layer 110 through the metal connection layer 220. In this way, the metal connection layer 220 and the conductive protrusions 210 together form the conductive layer 200, which is convenient for the processing and forming of the conductive layer 200; in addition, the metal connection layer 220 can protect the electrode layer 110 to prevent the electrode layer 110 from being damaged during the etching process of the conductive layer 200. Specifically, the first ends of all the conductive protrusions 210 are connected to the metal connection layer 220.

[0080] In a specific embodiment, Figure 7 As shown, the shape and cross-sectional area of ​​the cross section at each position in the extension direction of the conductive protrusion 210 are the same, wherein the cross section is a cross section along the thickness direction perpendicular to the base layer 100. In this way, when the shape and cross-sectional area of ​​the cross section at each position are the same, the conductive protrusion 210 is a columnar protrusion, which facilitates the processing and forming of the conductive protrusion 210. Specifically, when the shape of the cross section is circular, the diameter of the cross section is not less than 7μm, so that the conductive protrusion 210 can effectively support the liquid solder after being melted by heat.

[0081] In another specific embodiment, Fig.12 and Fig.13 As shown, the cross-sectional area of ​​the conductive protrusion 210 near the first end is not less than the cross-sectional area of ​​the conductive protrusion 210 near the second end; the cross-sectional area is a cross-sectional area along the direction perpendicular to the thickness of the base layer 100; preferably, the cross-sectional area of ​​the conductive protrusion 210 gradually decreases from the first end to the second end. In this way, the volume of the gap 500 in the conductive layer 200 is increased, ensuring that the laser heat can be fully transferred in the gap 500 of the conductive layer 200, and the gap 500 can expose more side surfaces of the metal solder layer 300, thereby ensuring that the metal solder layer 300 is fully heated. Specifically, as Fig.12 As shown, the conductive protrusion 210 may be a conical protrusion; or Fig.13 As shown, the conductive protrusion 210 may be a hemispherical protrusion; it should be noted that the conductive protrusion 210 may also be in other shapes.

[0082] In the embodiments of the present application, Figure 7 As shown, along the thickness direction of the base layer 100, the height h1 of the gap 500 is not less than 1 μm; and / or, along the thickness direction perpendicular to the base layer 100, the width h2 of the gap 500 is not less than 0.5 μm. In this way, more laser heat can be transferred in the gap 500 to ensure the heating effect of the metal solder layer 300 exposed through the gap 500. In addition, the thickness of the metal solder layer 300 is not greater than 30 μm, and the plurality of conductive protrusions 210 are arranged in an array.

[0083] Based on the above embodiments, the present application provides a display panel such as Figure 6 and Fig.10 As shown, the display panel includes a light-emitting component 400 and an array substrate in any of the above embodiments, the metal solder layer 300 of the array substrate and the light-emitting electrode 410 of the light-emitting component 400 are laser welded, and the light-emitting electrode 410 is electrically connected to the electrode layer 110 of the array substrate through the conductive layer 200 and the metal solder layer 300 of the array substrate; during the laser welding process, the solder can be fully melted, thereby improving the welding strength of the light-emitting component 400 on the array substrate, thereby ensuring the quality of the product.

[0084] In addition, at least a portion of the metal solder layer 300 is located in the gap 500 of the conductive layer 200, and an intermeshing structure is formed between the metal solder layer 300 and the conductive layer 200. Fig.10 As shown, during the laser welding process, the heated and melted solder can also enter the gap 500 in the conductive layer 200. When the solder cools and solidifies, an engaging structure is formed between the metal solder layer 300 and the conductive layer 200, further ensuring the bonding strength and product quality after laser welding.

[0085] On the basis of the above embodiments, the present application further provides a display device, including the display panel in the above embodiments. The display device can be any device with a display function, for example, it can be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, abbreviated as UMPC), a netbook or a personal digital assistant (personal digital assistant, abbreviated as PDA) and other mobile devices, and can also be a personal computer (personal computer, abbreviated as PC), a television (television, abbreviated as TV), a teller machine or a self-service machine and other non-mobile devices.

[0086] Based on the above embodiments, the present application also provides a method for preparing a display panel, such as Fig.14 As shown, the preparation method comprises:

[0087] S100: providing an array substrate.

[0088] It should be noted that the array substrate is the array substrate in any of the above embodiments; Figures 1 to 3 As shown, the figure shows the processing schematic diagrams of the array substrate in sequence, the base layer 100 includes a TFT glass substrate, and the electrode layer 110, the conductive layer 200 and the metal solder layer 300 are processed and formed in sequence on the TFT glass substrate.

[0089] S200: providing a transfer substrate and a light-emitting component, wherein the light-emitting component is bonded to the transfer substrate via a light-transmitting adhesive layer, and the transfer substrate is a light-transmitting component.

[0090] It should be noted that the light emitting element 400 is an LED light emitting element, including but not limited to a red light LED, a blue light LED, a green light LED, a yellow light LED, etc. Figure 4 As shown, there are three-color LEDs arranged on the transfer substrate 600, and one of the processes of 1by1 die-bonding transfer process, needle-punch transfer process or stamp mass transfer process can be used to complete the equal spacing arrangement of LED light-emitting components on the transfer substrate 600. Specifically, the transfer substrate 600 can be a high-transmittance glass substrate, and the material type of the transparent adhesive layer includes but is not limited to epoxy adhesive, silicone adhesive, acrylic adhesive, etc.

[0091] S300: Aligning the array substrate and the transfer substrate, a side of the array substrate provided with the conductive layer and the metal solder layer is butted against a side of the transfer substrate provided with the light emitting element, and an electrode of the light emitting element is butted against the metal solder layer.

[0092] It should be noted that if Figure 5As shown, the array substrate and the transfer substrate 600 are aligned with each other, and the electrode of the light-emitting component 400 is in contact with the metal solder layer 300; during the alignment process, the transfer substrate 600 is fixedly arranged, and the movement of the array substrate is controlled by the moving device in the laser equipment, so that the electrode of the light-emitting component 400 is in contact with the metal solder layer 300.

[0093] S400: irradiating the aligned array substrate and transfer substrate with laser light to weld the electrodes of the light emitting element to the metal solder layer. The laser light is emitted from the side of the transfer substrate away from the array substrate to the transfer substrate.

[0094] It should be noted that if Figure 5 As shown, the laser 800 passes through the transfer substrate 600, and the laser energy can be transmitted to the welding point position, so that the metal solder layer 300 is heated and melted and welded with the electrode of the light-emitting component 400; wherein the laser wavelength is not less than 720nm.

[0095] S500: removing the light-transmitting adhesive layer and transferring the substrate.

[0096] It should be noted that, during the laser welding process, the laser 800 can heat the light-transmitting adhesive layer 700 to reduce the viscosity of the light-transmitting adhesive layer 700, thereby enabling the light-emitting element 400 to be separated from the transfer substrate 600; Figure 6 As shown, the figure shows the structure of the display panel after the light-transmitting adhesive layer 700 and the transfer substrate 600 are removed.

[0097] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0098] The device or element referred to in this application or by implication must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of this application. In the description of this application, the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

[0099] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An array substrate, characterized in that: The array substrate comprises a base layer, a conductive layer and a metal solder layer, wherein an electrode layer is disposed on the base layer, the conductive layer is connected to the electrode layer, and the metal solder layer is connected to a side of the conductive layer away from the electrode layer; The conductive layer includes a plurality of conductive protrusions. Along the thickness direction of the base layer, at least some of the first ends of the conductive protrusions are electrically connected to the electrode layer, and at least some of the second ends of the conductive protrusions are connected to the metal solder layer. The metal solder layer is electrically connected to the electrode layer through the conductive protrusions. There is a gap between two adjacent conductive protrusions.

2. The array substrate according to claim 1, characterized in that: At least a portion of the gap is located on a side of the conductive layer close to the metal solder layer and extends to the metal solder layer.

3. The array substrate according to claim 1, characterized in that: Along the thickness direction of the base layer, the conductive layer includes a plurality of sub-conductive layers stacked and connected in sequence, and any two adjacent sub-conductive layers are made of different metal materials; Preferably, the plurality of sub-conductive layers include a Cu layer, a Ni layer and an Au layer, and the Cu layer, the Ni layer and the Au layer are stacked in sequence in a direction away from the base layer; the Cu layer is connected to the electrode layer, and the Au layer is connected to the metal solder layer.

4. The array substrate according to any one of claims 1 to 3, characterized in that: The first ends of at least some of the conductive protrusions abut against the electrode layer to be electrically connected to the electrode layer.

5. The array substrate according to any one of claims 1 to 3, characterized in that: The conductive layer also includes a metal connecting layer; along the thickness direction of the base layer, one side of the metal connecting layer is connected to the electrode layer, and the other side is connected to the first end of at least part of the conductive protrusions; at least part of the first end of the conductive protrusions is electrically connected to the electrode layer through the metal connecting layer.

6. The array substrate according to any one of claims 1 to 3, characterized in that: The shape and cross-sectional area of ​​the cross section at each position in the extension direction of the conductive protrusion are the same, and the cross section is a cross section along a direction perpendicular to the thickness of the base layer.

7. The array substrate according to any one of claims 1 to 3, characterized in that: The area of ​​the cross section of the conductive protrusion close to the first end is not less than the area of ​​the cross section of the conductive protrusion close to the second end; the cross section is a cross section along a direction perpendicular to the thickness of the base layer; Preferably, along the direction from the first end to the second end, the cross-sectional area of ​​the conductive protrusion gradually decreases.

8. The array substrate according to any one of claims 1 to 3, characterized in that: Along the thickness direction of the base layer, the height of the gap is not less than 1 μm; and / or, along the thickness direction perpendicular to the base layer, the width of the gap is not less than 0.5 μm.

9. A display panel, characterized in that: A light-emitting component and an array substrate according to any one of claims 1 to 8, wherein the metal solder layer of the array substrate and the light-emitting electrode of the light-emitting component are laser welded, and the light-emitting electrode is electrically connected to the electrode layer of the array substrate through the conductive layer and the metal solder layer of the array substrate; Preferably, at least a portion of the metal solder layer is located in the gaps of the conductive layer, and an engaging structure is formed between the metal solder layer and the conductive layer.

10. A method for preparing a display panel, characterized in that: include: Providing an array substrate, wherein the array substrate is the array substrate according to any one of claims 1 to 8; Providing a transfer substrate and a light-emitting component, wherein the light-emitting component is bonded to the transfer substrate via a light-transmitting adhesive layer, and the transfer substrate is a light-transmitting component; Aligning the array substrate with the transfer substrate, a side of the array substrate provided with a conductive layer and a metal solder layer butting against a side of the transfer substrate provided with a light-emitting element, and an electrode of the light-emitting element butting against the metal solder layer; irradiating the aligned array substrate and the transfer substrate with laser light so that the electrode of the light-emitting element is welded to the metal solder layer, the laser light being emitted from a side of the transfer substrate away from the array substrate toward the transfer substrate; The light-transmitting adhesive layer and the transfer substrate are removed.

Images