ACF vacuum film sticking machine

Abstract

The invention relates to the technical field of ACF film pasting equipment, in particular to an ACF vacuum film pasting machine which comprises a vacuum lower cavity movement assembly and a vacuum upper cavity alignment assembly. A vacuum cavity is arranged between the upper cover and the lower cover, and the specification of the vacuum cavity is 331.37 mm * 136 mm; and a substrate for performing vacuum adsorption positioning on the ACF film is arranged in the vacuum cavity. According to the invention, high-precision lamination is realized, high-precision lamination of the ACF film and the MicroLed light-emitting chip is realized through laser cutting, visual alignment and precise control, flawless finished products are obtained, lamination is carried out in a vacuum environment with controlled temperature and humidity, and the finished products are ensured to be free of bubbles, wrinkles and cracks and uniform in pressure. High-quality manufacturing is achieved, various parameters are strictly controlled in the technological process, and it is ensured that a high-quality MicroLed light-emitting chip and ACF film attaching product is manufactured. The key points comprehensively cover the technological process of attachment of the ACF film and the MicroLed light-emitting chip described by the file, including cutting, conveying, alignment, attachment, control, beneficial effects and the like, and deep and comprehensive information is provided for readers.

Description

Technical Field

[0001] The invention relates to the technical field of ACF film laminating equipment, and in particular to an ACF vacuum film laminating machine. Background Art

[0002] The existing ACF film laminating equipment has low automation, cannot provide real-time pressure, temperature, and vacuum indicators in the film laminating process, has low accuracy during film laminating, and is easily disturbed by gas particles when laminating at a vacuum of 1E-4mbar, resulting in poor film laminating effect. A Chinese patent discloses a precision fully automatic ACF film laminating equipment (authorization announcement number CN219381619U). The patent technology discloses a precision fully automatic ACF film laminating equipment, which relates to the technical field of ACF film laminating equipment. It includes an ACF film laser cutting station, an ACF film X-axis transport station, an ACF film Y-axis transport station, a vacuum lower cavity motion component, a vacuum upper cavity alignment component, a vacuum manufacturing component, an ion destaticization component, a heating component, a front-end visual component, and a rear-end visual component. The utility model provides a precision fully automatic ACF film laminating equipment, which can realize the automation of the whole process of ACF film laminating, avoid the interference of gas particles in the atmospheric environment at a vacuum pressure of 1E-4mbar, and can provide key technical indicators of the film laminating process in real time, such as pressure, temperature, vacuum degree, etc., accurately locate different parts at different positions through two sets of visual systems, establish a unified coordinate system through software, and complete the film laminating process under the condition of positioning accuracy of 5 microns based on the calculation results of vision and software. This patented technology solves the problem of low accuracy during film laminating and easy interference from gas particles when film laminating at a vacuum degree of 1E-4mbar, resulting in poor film laminating effect.

[0003] However, the size specifications of the cutting in the prior art cannot meet the requirements of larger sizes, and the applicability of the pre-pressed size is also low. It is necessary to solve the problem of the prior art that ACF films of different sizes can be automatically attached to the chip.

[0004] Therefore, those skilled in the art provide an ACF vacuum laminating machine to solve the problems raised in the above background technology. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides: An ACF vacuum laminating machine, comprising: A vacuum lower cavity movement component and a vacuum upper cavity alignment component; a vacuum cavity is built in between, and the specification of the vacuum cavity is 331.37mm*136mm; The vacuum chamber has a built-in substrate for vacuum adsorption and positioning of the ACF film, and a plurality of vacuum holes are opened inside the substrate, and the vacuum holes of the substrate are sealed and connected with a vacuum manufacturing component; The vacuum chamber is equipped with temperature, humidity sensors and air pressure sensors for environmental detection; A heating component for heating the temperature of the vacuum chamber is also provided corresponding to the value detected by the temperature sensor; A humidity component for humidifying and dehumidifying the humidity of the vacuum cavity is also provided corresponding to the detection value of the humidity sensor; ACF film laser cutting station; capable of cutting ACF films with a size of 200mm*200mm.

[0006] Preferably: the transport mechanism comprises an ACF film X-axis transport station and an ACF film Y-axis transport station; The ACF film X-axis conveying station and the ACF film Y-axis conveying station in the conveying mechanism cooperate with each other to automatically convey the ACF film, and are equipped with a module for automatically moving and positioning the ACF film; The ACF film X-axis transport station is used to actively move the ACF film to the position of the ACF film Y-axis transport station.

[0007] The ACF film X-axis transport station and the ACF film Y-axis transport station in the transport mechanism use a suction cup assembly to transport and move the ACF film.

[0008] Preferably: an ion antistatic component is arranged inside the vacuum chamber and is used to remove static electricity when the ACF film environment is vacuumed.

[0009] Preferably: the vacuum lower cavity movement component and the vacuum upper cavity alignment component are both built-in to meet the pre-pressure of diaphragms of various sizes, and the specifications of the vacuum cavity are the same as 331.37mm*136mm.

[0010] Various diaphragm preloads include: One is ACF film size: 166.042mm*93.428mm; The second type is ACF film size: 168.75mm*150mm; Three CF membrane sizes: 101mm*136mm.

[0011] Preferably, the front-end visual component and the back-end visual component both have a real-time positioning function for locating the positions of the ACF film and the chip.

[0012] The front-end visual component is used for position calibration of the ACF film after it is placed inside the vacuum chamber; The rear-end vision component is used for position calibration when the chip film is placed on the ACF film.

[0013] Preferably, the bottom of the vacuum lower chamber movement component and the vacuum upper chamber alignment component are equipped with a station rack.

[0014] Preferably: the workstation rack is used to assemble and install the ACF film laser cutting station, the ACF film X-axis transport station, the ACF film Y-axis transport station, the vacuum lower cavity movement component, the vacuum upper cavity alignment component, the vacuum manufacturing component, the ion destaticization component, the heating component, the front-end vision component, and the back-end vision component.

[0015] Preferably: a station protection frame is installed on the outer edge of the station frame surface, and glass is installed on the outer side of the station protection frame to seal the processing space in the station, and the station protection frame is used to keep the ACF film processing environment in a closed state.

[0016] The technical effects and advantages of the present invention are as follows: 1. The present invention has ACF film laser cutting, cutting specifications, the whole ACF film is placed on the laser cutting station 1, the specification is 331.37mm*136mm, suitable for cutting larger ACF films. Cutting method, through laser cutting technology, the ACF film is divided into the size required by the process. ACF film transportation and alignment, during the transportation process, the cut ACF film is transported by the vacuum suction cup on the X-axis transportation station 2 to the Y-axis transportation station 3, and then to the vacuum upper cavity alignment component 5 at the rear end.

[0017] 2. The present invention has a positioning technology, using visual components (front-end visual component 9 and rear-end visual component 10) to accurately position the ACF film to ensure the accuracy of subsequent bonding. The MicroLed light-emitting chip is bonded to the ACF film. In the bonding step, the MicroLed light-emitting chip is placed on the ACF film after being visually aligned by the rear-end visual component 10. The vacuum lower cavity motion component 4 and the vacuum upper cavity alignment component are closed and then vacuumed. 3. The present invention has a vacuum laminating environment, and laminating is performed in a vacuum, temperature and humidity controlled environment to ensure that there are no impurities or bubbles between the chip and the ACF film, and the pressure is uniform, and the temperature, humidity and pressure are controlled and monitored by sensors. The temperature sensor, humidity sensor and air pressure sensor detect the values ​​inside the vacuum cavity in real time. The control component, heating component 8 and humidity component are used to control the temperature and humidity in the vacuum cavity to ensure that the laminating process is carried out under appropriate conditions.

[0018] 4. The present invention has the lamination of ACF film and base plate. During the lamination process, the relative position of the ACF film and the base plate is calculated by software, and the movement and rotation of the vacuum lower cavity motion component 4 and the vacuum upper cavity alignment component 5 are utilized to complete the precise lamination of the ACF film and the base plate. The lamination effect ensures that the ACF film and the base plate are laminar-free, wrinkle-free, crack-free and have uniform pressure. The upper and lower cavities are molded and heated. During the mold closing process, the Y-axis movement of the vacuum upper cavity alignment component 5 completes the mold closing of the upper and lower cavities. During the heating process, the heating component 8 in the upper cavity is started, and the vacuum manufacturing component 6 on the lower cavity side is started. After the vacuum degree and temperature reach the film lamination requirements, the molding process is completed.

[0019] 5. The present invention has high-precision bonding. Through laser cutting, visual alignment and precise control, the high-precision bonding of ACF film and MicroLed light-emitting chip is achieved, and the finished product is flawless. The bonding is carried out in a vacuum environment with controlled temperature and humidity to ensure that the finished product has no bubbles, wrinkles, cracks and uniform pressure. High-quality manufacturing, the process strictly controls various parameters to ensure the manufacture of high-quality MicroLed light-emitting chip and ACF film bonding products. These key points fully cover the process of bonding ACF film and MicroLed light-emitting chip described in the document, including cutting, transportation, alignment, bonding, control and beneficial effects, providing readers with in-depth and comprehensive information. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of an ACF vacuum laminating machine provided by the present application; Figure 2 It is a schematic diagram of the front structure of an ACF vacuum laminating machine provided by the present application; Figure 3 It is a schematic diagram of the structure of the side of an ACF vacuum laminating machine provided by the present application; Figure 4 It is a schematic diagram of the structure of an ACF vacuum laminating machine provided by the present application from a top view; Figure 5 This is a schematic diagram of the structure of a removal station guard frame in an ACF vacuum laminating machine provided by the present application; Figure 6 It is a structural schematic diagram of a substrate in a vacuum chamber of an ACF vacuum laminator provided in the present application.

[0021] In the figure: 1. ACF film laser cutting station; 2. ACF film X-axis transport station; 3. ACF film Y-axis transport station; 4. Vacuum lower cavity movement component; 5. Vacuum upper cavity alignment component; 6. Vacuum manufacturing component; 7. Ion destaticization component; 8. Heating component; 9. Front-end vision component; 10. Back-end vision component; 11. Station rack; 12. Station guard frame. DETAILED DESCRIPTION

[0022] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The examples of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific uses.

[0023] For example, see Figures 1 to 6 In this embodiment, an ACF vacuum laminating machine is provided, including: a vacuum lower cavity movement component 4, a vacuum upper cavity alignment component 5; a vacuum cavity is built in between, and the vacuum cavity specification is 331.37mm*136mm; The vacuum chamber has a built-in substrate for vacuum adsorption and positioning of the ACF film, and a plurality of vacuum holes are opened inside the substrate, and the vacuum holes of the substrate are sealed and connected to a vacuum manufacturing component 6; The vacuum chamber is equipped with temperature, humidity sensors and air pressure sensors for environmental detection; A heating component 8 for heating the temperature of the vacuum chamber is also provided corresponding to the value detected by the temperature sensor; A humidity component for humidifying and dehumidifying the humidity of the vacuum cavity is also provided corresponding to the detection value of the humidity sensor; ACF film laser cutting station 1: capable of cutting ACF films with a size of 200mm*200mm.

[0024] The transport mechanism includes an ACF film X-axis transport station 2 and an ACF film Y-axis transport station 3; The ACF film X-axis conveying station 2 and the ACF film Y-axis conveying station 3 in the conveying mechanism cooperate with each other to automatically convey the ACF film, and are equipped with a module for automatically moving and positioning the ACF film; The ACF film X-axis transport station 2 is used to actively move the ACF film to the position of the ACF film Y-axis transport station 3 .

[0025] The ACF film X-axis transport station 2 and the ACF film Y-axis transport station 3 in the transport mechanism use suction cup assemblies to transport and move the ACF film.

[0026] The ion antistatic component 7 is arranged inside the vacuum chamber and is used to remove static electricity when the ACF film environment is vacuumed.

[0027] The vacuum lower cavity movement component 4 and the vacuum upper cavity alignment component 5 are both built-in to meet the pre-pressure of diaphragms of various sizes, and the specifications of the vacuum cavity are the same as 331.37mm*136mm.

[0028] Various diaphragm preloads include: One is ACF film size: 166.042mm*93.428mm; The second type is ACF film size: 168.75mm*150mm; Three CF membrane sizes: 101mm*136mm.

[0029] The front-end visual component 9 and the rear-end visual component 10 both have a real-time positioning function for locating the positions of the ACF film and the chip.

[0030] The front-end visual component 9 is used for position calibration of the ACF film after it is placed inside the vacuum chamber; The rear-end vision component 10 is used for position calibration when the chip bonding film is placed on the ACF film.

[0031] The bottom of the vacuum lower chamber movement component 4 and the vacuum upper chamber alignment component 5 are equipped with a station frame 11.

[0032] The workstation frame 11 is used for assembling and installing the ACF film laser cutting station 1, the ACF film X-axis transport station 2, the ACF film Y-axis transport station 3, the vacuum lower cavity movement component 4, the vacuum upper cavity alignment component 5, the vacuum manufacturing component 6, the ion destaticization component 7, the heating component 8, the front-end vision component 9, and the rear-end vision component 10.

[0033] The outer edge of the surface of the station frame 11 is equipped with a station frame 12, and the outer side of the station frame 12 is installed with glass for sealing the processing space in the station, and the station frame 12 is used to keep the ACF film processing environment in a closed state.

[0034] According to the above embodiments, the working principle of the present invention is: Place the ACF film on the ACF film laser cutting station 1, which is 331.37mm*136mm, suitable for cutting larger ACF films, and cut them into the required size by laser cutting. The vacuum suction cup on the ACF film X-axis conveying station 2 conveys the cut ACF film to the ACF film Y-axis conveying station 3, and the ACF film Y-axis conveying station 3 conveys the ACF film to the vacuum upper cavity alignment component 5 at the rear end; The MicroLed light-emitting chip is vertically connected to the substrate electrode. The ACF film after laser cutting is sucked and placed into the substrate of the vacuum cavity through the ACF film Y-axis transport station 3, and is laid on the substrate for pre-pressing. The MicroLed light-emitting chip is placed on the ACF film after visual alignment through the rear-end visual component 10. After the vacuum lower cavity motion component 4 and the vacuum upper cavity alignment component are closed, the vacuum cavity is vacuumed by the vacuum manufacturing component, and the chip is bonded to the ACF under vacuum. The temperature sensor, humidity sensor and air pressure sensor detect the values ​​inside the vacuum chamber in real time, and the temperature and humidity data inside the vacuum chamber are controlled by the heating component 8 and the humidity component, which is beneficial for the vacuum manufacturing component 6 to control the pressure, temperature and humidity when the vacuum is evacuated, and crush the micro-particle conductive balls in the ACF film but not crush them, so that the electrodes on the chip and the substrate are vertically conductive and still insulated horizontally. In a vacuum clean environment, there are no impurities between the film and the electrode, and between the film and the chip, and the bubbles are completely discharged. The final effect is no bubbles, no wrinkles, no cracks and uniform pressure; The ACF film is precisely positioned by the rear-end visual component 10, and the bottom plate is placed on the vacuum cavity motion component 4, on which there is a rough positioning tool; The vacuum chamber motion component 4 moves in the Y-axis direction to below the front visual component 9 and is precisely positioned by vision; The relative position of the ACF film and the base plate is calculated by software, and the ACF film and the base plate are precisely fitted by the Y-axis movement of the vacuum lower chamber motion component 4 and the X-axis, Z-axis and Z-axis rotation of the vacuum upper chamber alignment component 5; Complete the bonding of the ACF film and the base plate according to the established pre-pressing process, and place the chip on the ACF film Y-axis transport station 3; The ACF film Y-axis transport station 3 transports the chip to the rear vacuum upper cavity alignment component 5, and the chip is accurately positioned by the rear visual component 10; The ACF film and bottom plate bonding assembly moves in the Y-axis direction through the vacuum cavity motion assembly 4 to the bottom of the front vision assembly 9 and is accurately positioned again through vision; The relative position of the chip and the bonding component is calculated by software, and the precise bonding of the ACF film and the base plate is completed by the Y-axis movement of the vacuum lower chamber motion component 4 and the X-axis, Z-axis and Z-axis rotation of the vacuum upper chamber alignment component 5; The upper and lower cavities are molded by moving the vacuum upper cavity alignment component 5 along the Y axis. At this time, the heating component 8 in the upper cavity is started, and the vacuum manufacturing component 6 on the lower cavity side is started. After the vacuum degree and temperature meet the requirements for film lamination, the Y-axis on the vacuum upper cavity alignment component 5 continues to press down to complete the pressing process, break the vacuum, and take out the molded part.

[0035] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. An ACF vacuum laminating machine, characterized in that: include: A vacuum lower cavity movement component (4) and a vacuum upper cavity alignment component (5); a vacuum cavity is built in between, and the specification of the vacuum cavity is 331.37 mm*136 mm; The vacuum chamber has a built-in substrate for vacuum adsorption and positioning of the ACF film, and a plurality of vacuum holes are opened inside the substrate, and the vacuum holes of the substrate are sealed and connected to a vacuum manufacturing component (6); The vacuum chamber is equipped with temperature, humidity sensors and air pressure sensors for environmental monitoring; A heating component (8) is also provided to heat the temperature of the vacuum chamber in accordance with the value detected by the temperature sensor; A humidity component for humidifying and dehumidifying the humidity of the vacuum cavity is also provided corresponding to the detection value of the humidity sensor; ACF film laser cutting station (1); capable of cutting ACF films with a size of 200mm*200mm.

2. The ACF vacuum laminating machine according to claim 1, characterized in that: The transport mechanism comprises an ACF film X-axis transport station (2) and an ACF film Y-axis transport station (3); The ACF film X-axis transport station (2) and the ACF film Y-axis transport station (3) in the transport mechanism cooperate with each other to automatically transport the ACF film, and are provided with a module for automatically moving and positioning the ACF film; The ACF film X-axis transport station (2) is used to actively move the ACF film to the position of the ACF film Y-axis transport station (3); The ACF film X-axis transport station (2) and the ACF film Y-axis transport station (3) in the transport mechanism use a suction cup assembly to transport and move the ACF film.

3. The ACF vacuum laminating machine according to claim 1, characterized in that: The ion antistatic component (7) is arranged inside the vacuum chamber and is used to remove static electricity during the vacuum operation of the ACF film environment.

4. The ACF vacuum laminating machine according to claim 1, characterized in that: The vacuum lower cavity movement component (4) and the vacuum upper cavity alignment component (5) are both built-in to meet the pre-pressure of diaphragms of various sizes, and have the same specifications as the vacuum cavity of 331.37 mm*136 mm; Various diaphragm preloads include: One is ACF film size: 166.042mm*93.428mm; The second type is ACF film size: 168.75mm*150mm; Three CF membrane sizes: 101mm*136mm.

5. The ACF vacuum laminating machine according to claim 1, characterized in that: The front-end visual component (9) and the rear-end visual component (10) both have a real-time positioning function and are used to locate the positions of the ACF film and the chip.

6. The ACF vacuum laminating machine according to claim 5, characterized in that: The front-end visual component (9) is used for calibrating the position of the ACF film after it is placed inside the vacuum chamber.

7. The ACF vacuum laminating machine according to claim 5, characterized in that: The rear-end vision component (10) is used for position calibration when the chip bonding film is placed on the ACF film.

8. The ACF vacuum laminating machine according to claim 1, characterized in that: The bottoms of the vacuum lower cavity movement component (4) and the vacuum upper cavity alignment component (5) are equipped with a workstation frame (11).

9. The ACF vacuum laminating machine according to claim 8, characterized in that: The outer edge of the surface of the workstation frame (11) is equipped with a workstation protection frame (12), and the outer side of the workstation protection frame (12) is installed with glass for sealing the processing space in the workstation, and the workstation protection frame (12) is used to keep the ACF film processing environment in a closed state.

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