Display module and manufacturing method thereof

Abstract

The present invention provides a display module and a manufacturing method thereof, wherein the display module includes a substrate, a solder resist layer, a solder pad, a plurality of lamp beads and an adhesive layer. The surface of the substrate is provided with a solder resist layer, and the solder resist layer is formed with a plurality of glue flow grooves capable of exposing a portion of the surface area of ​​the substrate, and the lamp beads are fixed on the surface of the substrate by soldering with the solder pads and accommodated in the glue flow grooves. The glue flows into the glue flow groove to cover the area on the surface of the substrate corresponding to the glue flow groove, and can flow into the space between the bottom of the lamp beads and the surface of the substrate, thereby forming an adhesive layer, which can fully bond the lamp beads to the surface of the substrate, and can increase the bonding force between the lamp beads in the glue flow groove, thereby effectively enhancing the thrust of the lamp beads and improving the overall structural stability of the display module.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to a display module and a manufacturing method thereof. Background Art

[0002] LED display screens have the characteristics of high brightness, bright colors, high luminous efficiency, high contrast, short response time, wide operating temperature range and low energy consumption. They are widely used in stage display equipment, advertising display equipment, data visualization display equipment and commercial display equipment.

[0003] As LED display screens are increasingly used, users have higher and higher requirements for stage rental display screens. The LED lamp beads of existing LED display screens are directly soldered with solder paste, resulting in low thrust of the LED lamp beads. The thrust of the LED lamp beads refers to the bonding strength between the LED lamp beads and the PCB board under the action of solder paste welding.

[0004] Since rental display screens are often disassembled and assembled, collisions often occur on the display screens. The thrust of LED lamp beads is small, and collisions can easily knock off the LED lamp beads of the display unit, thus affecting the effect of the entire LED display screen and affecting the normal use of users. Summary of the invention

[0005] The purpose of the present invention is to solve the technical problem in the prior art that the thrust of LED lamp beads is small, and the LED lamp beads are easily knocked off after the display unit is hit, thereby affecting the effect of the entire LED display screen and affecting the normal use of users.

[0006] In order to solve the above technical problems, the present invention provides a display module, which includes:

[0007] substrate;

[0008] A solder resist layer is arranged on the surface of the substrate; a plurality of glue flow grooves are formed on the solder resist layer, and the glue flow grooves are recessed structures that sink from the surface of the solder resist layer toward the surface of the substrate so that the area of ​​the surface of the substrate corresponding to the glue flow grooves is exposed;

[0009] A plurality of solder pads are provided, wherein the plurality of solder pads are arranged at intervals on the surface of the substrate and arranged in the glue flow groove;

[0010] A plurality of lamp beads, each of which is welded and fixed on the surface of the substrate through the pad;

[0011] The adhesive layer is arranged on the surface of the substrate and accommodated in the glue flow groove, and the adhesive layer connects the lamp bead and the surface of the substrate.

[0012] In some embodiments of the present application, a glue dispensing area is provided on the surface of the substrate corresponding to the glue flow groove, and the glue dispensing area is arranged close to the central area of ​​the glue flow groove; the glue dispensing area is used for a glue dispensing device to inject glue into the glue flow groove to form the bonding layer.

[0013] In some embodiments of the present application, a welding area is provided on the surface of the substrate corresponding to the glue flow groove, and the welding pad is provided on the welding area; each glue flow groove is correspondingly provided with a plurality of the welding areas, and the plurality of the welding areas are arranged at intervals around the glue dispensing area.

[0014] In some embodiments of the present application, the outer contour of the glue flow groove is square, a welding area is provided at each of the four vertex positions of the glue flow groove, and the glue dot area is arranged at the center position of the glue flow groove.

[0015] In some embodiments of the present application, the thickness of the solder resist layer is 30 μm to 100 μm, and the depth of the glue flow groove is 30 μm to 100 μm.

[0016] In some embodiments of the present application, each of the lamp beads includes a main body and a pin portion connected to the main body, and the pin portion is welded and fixed on the pad; the adhesive layer connects the surface of the main body and the surface of the substrate.

[0017] In some embodiments of the present application, the adhesive layer is formed by curing glue, and the glue enters the glue flow groove and can flow between the lamp bead and the surface of the substrate.

[0018] In some embodiments of the present application, the glue is an epoxy resin glue mixture, and the epoxy resin glue mixture includes a base resin, a curing agent, a black filler and a coupling agent. The shear strength of the bonding layer formed by the glue is greater than 20 MPa.

[0019] The present invention also provides a method for manufacturing a display module, which comprises the following steps:

[0020] Providing a substrate, and disposing a solder resist layer on the surface of the substrate;

[0021] A plurality of solder flow grooves are formed on the solder resist layer, and solder pads are arranged in areas on the surface of the substrate corresponding to the solder flow grooves;

[0022] Soldering the lamp bead to the soldering pad;

[0023] Glue is injected into the glue flow groove, and the glue can flow between the lamp bead and the substrate to form an adhesive layer in the area of ​​the surface of the substrate corresponding to the glue flow groove.

[0024] In some embodiments of the present application, a plurality of the solder pads are disposed on the surface of the substrate corresponding to the glue flow groove, the plurality of solder pads are arranged at intervals along the circumference of the glue flow groove, and the glue is injected into the center of the glue flow groove.

[0025] It can be seen from the above technical scheme that the beneficial effects of the present invention are as follows: in the display module and the manufacturing method thereof of the present invention, a solder resist layer is provided on the surface of the substrate, and the solder resist layer is formed with a plurality of glue flow grooves that can expose a part of the surface area of ​​the substrate, and the lamp beads are fixed on the surface of the substrate by soldering with solder pads and accommodated in the glue flow grooves. The glue flows into the glue flow grooves to cover the area on the surface of the substrate corresponding to the glue flow grooves, and can flow into the space between the bottom of the lamp beads and the surface of the substrate, thereby forming an adhesive layer, which can make the lamp beads fully bonded to the surface of the substrate, and can increase the bonding force between the lamp beads in the glue flow grooves, thereby effectively enhancing the thrust of the lamp beads and improving the overall structural stability of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a top view of the structure of an embodiment of a display module of the present invention.

[0027] Figure 2 It is a top view of a glue flow groove in one embodiment of a display module of the present invention.

[0028] Figure 3 It is a structural front view of an embodiment of a display module of the present invention.

[0029] Figure 4 It is a structural schematic diagram of a method for forming a glue flow groove in an embodiment of a display module of the present invention.

[0030] Figure 5 It is a structural schematic diagram of another method of forming the glue flow groove in an embodiment of the display module of the present invention.

[0031] Figure 6 It is a structural schematic diagram of another method for forming the glue flow groove in an embodiment of the display module of the present invention.

[0032] Figure 7 It is a top view of a glue flow groove in one embodiment of a display module of the present invention.

[0033] Figure 8 It is a front view of the structure of the glue flow groove of an embodiment of the display module of the present invention.

[0034] Fig. 9 It is a flow chart of the steps of the method for manufacturing the display module of the present invention.

[0035] Fig.10 It is a structural schematic diagram of setting a solder paste layer on a pad during the display module manufacturing process of the present invention.

[0036] Fig.11 It is a structural schematic diagram of welding lamp beads to pads during the display module manufacturing process of the present invention.

[0037] Fig.12 This is a thrust test diagram of a display module according to an embodiment of the present invention.

[0038] The reference numerals are explained as follows: 100, display module; 10, substrate; 101, welding area; 102, glue dispensing area; 20, solder mask layer; 201, glue flow groove; 30, solder pad; 40, lamp bead; 41, main body; 42, pin part; 50, adhesive layer; 60, solder paste layer; 70, roughening structure; 80, black PP substrate. DETAILED DESCRIPTION

[0039] Typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and the descriptions and illustrations therein are essentially used for illustration purposes rather than for limiting the present invention.

[0040] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indications of directions or positional relationships (such as up, down, left, right, front and back, etc.) are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions also change accordingly.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0042] The inventors of the present application discovered during actual work that, in the prior art, when preparing a display module, solder paste is usually first printed on the pad of a PCB board, and then the lamp beads are mounted on the PCB board through mounting equipment, and then reflow soldered to the LED light board; secondly, reinforcing glue is filled in the gaps between the lamp beads of the LED light board to allow it to flow into the bottom of the lamp beads, and finally the LED display module is obtained by heating and curing.

[0043] Among them, the glue forms an adhesive layer between the lamp bead and the solder mask ink layer of the PCB board.

[0044] After testing, the inventors of the present application found that when the LED display module manufactured by the above method is impacted, the solder resist ink layer is easily delaminated and peeled off, thereby causing the adhesion of the lamp beads to fail and the lamp beads to fall off.

[0045] To solve this problem, the inventor of the present application provides a display module 100, which includes a substrate 10, a solder resist layer 20, a solder pad 30, a plurality of lamp beads 40 and an adhesive layer 50. Figures 1 to 3 In some embodiments of the present application, the solder resist layer 20 is disposed on the surface of the substrate 10, and a plurality of glue flow grooves 201 are formed on the solder resist layer 20. The glue flow grooves 201 are recessed structures that sink from the surface of the solder resist layer 20 toward the surface of the substrate 10, so that the area of ​​the surface of the substrate 10 corresponding to the glue flow grooves 201 is exposed. A plurality of solder pads 30 are provided, and the plurality of solder pads 30 are disposed at intervals on the surface of the substrate 10 and arranged in the glue flow grooves 201. Each lamp bead 40 is fixed to the surface of the substrate 10 by soldering the solder pad 30, and the adhesive layer 50 is disposed on the surface of the substrate 10 and accommodated in the glue flow grooves 201, and the adhesive layer 50 connects the lamp bead 40 and the surface of the substrate 10.

[0046] For the display module 100 of the present application, the surface of the substrate 10 is provided with a solder resist layer 20, and the solder resist layer 20 is formed with a plurality of glue flow grooves 201 that can expose a part of the surface area of ​​the substrate 10, and the lamp beads 40 are fixed on the surface of the substrate 10 by welding through the solder pads 30 and accommodated in the glue flow grooves 201. The glue flows into the glue flow grooves 201 to cover the area of ​​the surface of the substrate 10 corresponding to the glue flow grooves 201, and can flow into the space between the bottom of the lamp beads 40 and the surface of the substrate 10, thereby forming an adhesive layer 50, which can make the lamp beads 40 fully bonded to the surface of the substrate 10, and can increase the bonding force between the lamp beads 40 and the lamp beads 40 in the glue flow grooves 201, thereby effectively enhancing the thrust of the lamp beads 40 and improving the overall structural stability of the display module 100.

[0047] Furthermore, in some embodiments of the present application, the substrate 10 may be a flat substrate, a multi-layer circuit board substrate, or a multi-layer circuit board substrate with a driver IC.

[0048] The surface of the substrate 10 is provided with a solder resist layer 20, and the material of the solder resist layer 20 can be one of black ink, black PP substrate, black epoxy resin, black silicone resin, or a combination thereof. When the solder resist layer 20 is a combination of multiple materials, it can be a combination of any two materials among the aforementioned multiple materials, or a combination of three materials, and the ratio of the combination is not limited.

[0049] In some examples, the thickness H of the solder resist layer 20 can be 30 μm to 100 μm (including the values ​​at both ends of the interval, and unless otherwise specified, the interval values ​​disclosed in the present disclosure include both ends). The solder resist layer 20 in this thickness range can be used to form a glue flow groove 201 for glue flow and accommodating glue, and can also be used to protect the lamp beads 40 and prevent light crosstalk between the lamp beads 40.

[0050] The thickness of the solder resist layer 20 may be determined by the height of the lamp beads 40 and the height of the solder pads 30 , or may be determined in combination with the overall thickness of the display module 100 .

[0051] like Figure 4 As shown, in some embodiments of the present application, a plurality of glue flow grooves 201 are formed on the solder resist layer 20, and the glue flow grooves 201 can be formed by ink exposure and development. The glue flow grooves 201 are recessed structures that sink from the surface of the solder resist layer 20 toward the surface of the substrate 10, so that the area of ​​the surface of the substrate 10 corresponding to the glue flow grooves 201 is exposed.

[0052] Among them, the glue flow groove 201 is formed by setting a solder resist ink on the substrate 10 to obtain a solder resist layer 20, and then by exposure and development, and then by heating and curing. In this embodiment, the exposure and development position of the solder resist layer 20 corresponds to the setting position of the glue flow groove 201, and the thickness of the solder resist layer 20 is consistent with the groove depth of the glue flow groove 201. In addition, a roughening structure 70 can be set inside the glue flow groove 201 to enhance the bonding area between the high-strength reinforcing glue and the substrate 10, thereby effectively increasing the bonding strength between the two. The roughening structure 70 can be wavy, zigzag, or a convex dot structure arranged at intervals.

[0053] See also Figure 5 In some other embodiments, the glue groove 201 can also be formed by pressing a hollowed-out black PP substrate 80 on the substrate 10. The hollowed-out position of the black PP substrate 80 corresponds to the setting position of the glue groove 201, and the height of the black PP substrate 80 is consistent with the groove depth of the glue groove 201. In addition, a roughening structure 70 can also be set inside the glue groove 201 to enhance the bonding area between the high-strength reinforcing adhesive and the substrate 10, thereby effectively increasing the bonding strength between the two. The roughening structure 70 can be wavy, zigzag, or a convex dot structure arranged at intervals.

[0054] like Figure 6As shown, in other embodiments, the glue flow groove 201 can be firstly pressed on the substrate 10 by the hollowed-out black PP substrate 80, and then the solder mask layer 20 is obtained by setting the solder mask ink on the substrate 10, and then the solder mask layer 20 is exposed and developed, and finally cured by heating. Among them, the hollow position of the black PP substrate 80 and the exposure and development position of the solder mask layer 20 are corresponding to the setting position of the glue flow groove 201, and the sum of the height of the black PP substrate and the thickness of the solder mask layer 20 is the groove depth of the glue flow groove 201. In addition, a roughening structure 70 can be set inside the glue flow groove 201 to enhance the bonding area between the high-strength reinforcing glue and the substrate 10, thereby effectively increasing the bonding strength between the two. The roughening structure 70 can be wavy, zigzag, or a convex dot structure arranged at intervals.

[0055] like Figure 1 As shown, a plurality of glue flow grooves 201 are formed on the solder resist layer 20, and the plurality of glue flow grooves 201 are arranged at intervals on the surface of the substrate 10. In some examples, the plurality of glue flow grooves 201 are arranged in a matrix on the substrate 10. This arrangement can achieve uniformity and aesthetics of the arrangement of the lamp beads 40 on the substrate 10, and ensure a uniform and soft display effect of the display module 100.

[0056] Combination Figure 2 , Figure 3 as well as Figure 7 As shown, each glue flow groove 201 is provided with a plurality of pads 30, and the plurality of pads 30 are arranged at intervals on the surface of the substrate 10. In addition, each glue flow groove 201 is provided with a plurality of lamp beads 40, and each lamp bead 40 is fixed to the surface of the substrate 10 by welding through the pad 30.

[0057] In some examples, a solder paste layer 60 may be provided on the pad 30 , and each lamp bead 40 is soldered to the pad 30 of the substrate 10 through the solder paste layer 60 .

[0058] In some embodiments of the present application, the lamp bead 40 can be either a common light-emitting diode chip or a micron-sized ...

[0059] When the lamp bead 40 of the present application is a Mini-LED, the solder resist layer 20 can absorb the divergent light emitted to both sides of the lamp bead 40, effectively reducing the optical crosstalk between Mini-LED pixels and improving the sharpness and contrast of the entire display module 100.

[0060] In some examples, the lamp bead 40 may include a main body 41 and a pin 42 connected to the main body 41. The pin 42 of each lamp bead 40 abuts against the solder paste layer 60 on the pad 30 to achieve soldering and fixing of the lamp bead 40 and the pad 30.

[0061] In some embodiments of the present application, each lamp bead 40 may include four pins 42. The main body 41 may include an R chip, a G chip, and a B chip, and the four pins 42 may be respectively a cathode corresponding to the R chip, a cathode corresponding to the G chip, a cathode corresponding to the B chip, and a common anode.

[0062] The four pins 42 of each lamp bead 40 are fixed to the surface of the substrate 10 by welding through a pad 30, that is, four pads 30 are provided under each lamp bead 40. After the pins 42 of the lamp bead 40 are fixed to the corresponding pads 30 by welding through the solder paste layer 60, there is a gap between the bottom of the main body 41 of the lamp bead 40 and the surface of the substrate 10.

[0063] Further, see Figure 1 and Figure 2 In some embodiments of the present application, the outer contour of the glue flow groove 201 is a square, and a welding area 101 is provided in the area of ​​the surface of the substrate 10 corresponding to the glue flow groove 201. The welding area 101 is used for arranging the pad 30 on the surface of the substrate 10.

[0064] In some examples, four welding areas 101 are provided in the area of ​​the surface of the substrate 10 corresponding to each glue flow groove 201, and the four welding areas 101 are respectively arranged near the four vertex positions of the glue flow groove 201. Four welding pads 30 are provided in each welding area 101, and the four welding pads 30 in each welding area 101 are arranged in a field shape.

[0065] This arrangement can not only realize the welding and fixation of each lamp bead 40 on the substrate 10 , but also realize the uniformity and aesthetics of the arrangement of the lamp beads 40 on the substrate 10 , thereby ensuring the uniform and soft display effect of the display module 100 .

[0066] like Figure 7 As shown, in some embodiments of the present application, a glue spot 102 is provided in the area of ​​the surface of the substrate 10 corresponding to each glue flow groove 201, and the glue spot 102 is arranged at the center of the glue flow groove 201. The glue spot 102 is used for a glue dispensing device to inject glue into the glue flow groove 201 to form the bonding layer 50.

[0067] By setting a glue dispensing area 102 in the glue flow groove 201, glue can be injected into multiple glue flow grooves 201 at a time through a glue dispensing device, so that the glue can flow from the glue dispensing area 102 to the surroundings, and flow to the welding area 101 at the same time and flow into the space between the lamp bead 40 and the surface of the substrate 10, so that the multiple lamp beads 40 in each glue flow groove 201 are simultaneously bonded and fixed to the surface of the substrate 10, effectively increasing the bonding force between the lamp bead 40 and the substrate 10, and enhancing the thrust of the lamp bead 40.

[0068] In some examples, the glue is an epoxy resin glue mixture, and the epoxy resin glue mixture includes a base resin, a curing agent, a black filler, and a coupling agent.

[0069] The shear strength of the adhesive layer 50 formed by the glue is greater than 20 MPa, which can effectively improve the structural strength of the connection between the lamp bead 40 and the substrate 10, and can increase the adhesion between the lamp beads 40 and the lamp beads 40 in the glue flow groove 201, thereby effectively enhancing the thrust of the lamp bead 40 and improving the overall structural stability of the display module 100.

[0070] like Figure 8 As shown, in some embodiments of the present application, the depth of the glue flow groove 201 is 30 μm to 100 μm, and the depth of the glue flow groove 201 is consistent with the thickness H of the solder resist layer 20 .

[0071] This arrangement can not only ensure that the solder mask layer 20 protects the lamp beads 40 and prevents optical crosstalk between the lamp beads 40, but also effectively form a glue flow groove 201 with a set groove depth, thereby ensuring the capacity of the glue in the glue flow groove 201, so that the glue can be effectively filled and cured in the glue flow groove 201, so that the lamp beads 40 and the surface of the substrate 10 form a firm bond, thereby enhancing the thrust of the lamp beads 40.

[0072] Reference Figure 3 , Figure 7 as well as Figure 8 ,in, Figure 3 and Figure 7 An embodiment of the present application is shown, that is, the outer contour of the glue flow groove 201 described above is a square, a welding area 101 is provided at the four vertex positions of the glue flow groove 201, and each welding area 101 is provided with four welding pads 30 arranged in a field shape, and each welding area 101 is fixed with a lamp bead 40.

[0073] For the display substrate 10 of the above embodiment, Figure 3 and Figure 8As shown, the length of the glue flow groove 201 is L, the side length of the lamp bead 40 is l, and the spacing between two adjacent lamp beads 40 is p. Then, L=p+2l. This arrangement can realize the reasonable arrangement of the lamp beads 40 in each glue flow groove 201, which can not only ensure the effective filling and curing of the glue in the glue flow groove 201, but also realize the uniformity and aesthetics of the arrangement of the lamp beads 40, and ensure the uniform and soft display effect of the display module 100.

[0074] It should be noted that in other embodiments of the present application, the shape of the glue flow groove 201 can also be other forms, such as regular shapes such as circles, polygons, or other irregular shapes. Correspondingly, the arrangement of the welding area 101 in each glue flow groove 201, that is, the arrangement of the lamp beads 40 can also be in a variety of arrangement forms. Therefore, the size of the glue flow groove 201 can be determined according to the setting requirements of the specific product.

[0075] Furthermore, participation Fig. 9 One embodiment of the present application further provides a method for manufacturing a display module 100, the manufacturing method is used to prepare the display module 100 of the above structure, and the manufacturing method of the present application comprises the following steps:

[0076] Step S10, providing a substrate 10, and disposing a solder resist layer 20 on a surface of the substrate 10;

[0077] Step S20, forming a plurality of solder flow grooves 201 on the solder resist layer 20, and setting solder pads 30 in areas corresponding to the solder flow grooves 201 on the surface of the substrate 10;

[0078] Step S30, welding and fixing the lamp bead 40 on the pad 30;

[0079] In step S40 , glue is injected into the glue flow groove 201 . The glue can flow between the lamp beads 40 and the substrate 10 to form an adhesive layer 50 in the area of ​​the surface of the substrate 10 corresponding to the glue flow groove 201 .

[0080] In some embodiments of the present application, in step S10 , the material used for the solder resist layer 20 may be one of black ink, black PP substrate, black epoxy resin, black silicone resin, or a combination thereof.

[0081] The thickness H of the solder resist layer 20 can be set to 30 μm to 100 μm. The solder resist layer 20 of this thickness range can be used to form a glue flow groove 201 for glue flow and accommodating glue, and can also be used to protect the lamp beads 40 and prevent light crosstalk between the lamp beads 40.

[0082] In step S20, a plurality of solder flow grooves 201 are formed on the solder resist layer 20, and the plurality of solder flow grooves 201 are arranged at intervals. Figure 4As shown, the glue groove 201 can be formed by ink exposure and development. The glue groove 201 formed on the solder resist layer 20 is a concave structure that sinks from the surface of the solder resist layer 20 toward the surface of the substrate 10. The setting of the glue groove 201 makes the surface of the substrate 10 corresponding to the glue groove 201 exposed.

[0083] Among them, the glue flow groove 201 is formed by setting a solder resist ink on the substrate 10 to obtain a solder resist layer 20, and then by exposure and development, and then by heating and curing. In this embodiment, the exposure and development position of the solder resist layer 20 corresponds to the setting position of the glue flow groove 201, and the thickness of the solder resist layer 20 is consistent with the groove depth of the glue flow groove 201. In addition, a roughening structure 70 can be set inside the glue flow groove 201 to enhance the bonding area between the high-strength reinforcing glue and the substrate 10, thereby effectively increasing the bonding strength between the two. The roughening structure 70 can be wavy, zigzag, or a convex dot structure arranged at intervals.

[0084] See also Figure 5 In some other embodiments, the glue groove 201 can also be formed by pressing a hollowed-out black PP substrate 80 on the substrate 10. The hollowed-out position of the black PP substrate 80 corresponds to the setting position of the glue groove 201, and the height of the black PP substrate 80 is consistent with the groove depth of the glue groove 201. In addition, a roughening structure 70 can also be set inside the glue groove 201 to enhance the bonding area between the high-strength reinforcing adhesive and the substrate 10, thereby effectively increasing the bonding strength between the two. The roughening structure 70 can be wavy, zigzag, or a convex dot structure arranged at intervals.

[0085] like Figure 6 As shown, in other embodiments, the glue flow groove 201 can be firstly pressed on the substrate 10 by the hollowed-out black PP substrate 80, and then the solder mask layer 20 is obtained by setting the solder mask ink on the substrate 10, and then the solder mask layer 20 is exposed and developed, and finally cured by heating. Among them, the hollow position of the black PP substrate 80 and the exposure and development position of the solder mask layer 20 are corresponding to the setting position of the glue flow groove 201, and the sum of the height of the black PP substrate and the thickness of the solder mask layer 20 is the groove depth of the glue flow groove 201. In addition, a roughening structure 70 can be set inside the glue flow groove 201 to enhance the bonding area between the high-strength reinforcing glue and the substrate 10, thereby effectively increasing the bonding strength between the two. The roughening structure 70 can be wavy, zigzag, or a convex dot structure arranged at intervals.

[0086] In some embodiments of the present application, the outline of the glue groove 201 is a square. After the glue groove 201 is formed, a solder pad 30 is set on the surface of the substrate 10 in the area corresponding to the glue groove 201. The solder pads 30 are arranged in a regional interval in the glue groove 201. For example, a soldering area 101 can be set at each of the four vertex positions of the glue groove 201, and each soldering area 101 is provided with four solder pads 30 arranged in a field shape.

[0087] like Fig.10 and Fig.11 As shown, after a solder pad 30 is arranged in each glue flow groove 201, solder paste is arranged on each solder pad 30. The size of the solder paste on each solder pad 30 is arranged uniformly.

[0088] In step S30, the lamp bead 40 is mounted on the substrate 10 by a patch device. Specifically, each welding area 101 is correspondingly provided with a lamp bead 40, and the pin portion 42 of the lamp bead 40 is connected to the pad 30 by solder paste.

[0089] Then, the lamp bead 40 is soldered and fixed on the soldering pad 30 by a soldering device in a reflow soldering manner, so that the lamp bead 40 is connected and fixed on the substrate 10 .

[0090] After the lamp bead 40 is welded on the substrate 10 , step S40 is performed to inject glue into the glue flow groove 201 . The glue can flow between the lamp bead 40 and the substrate 10 to form an adhesive layer 50 in the area of ​​the surface of the substrate 10 corresponding to the glue flow groove 201 .

[0091] Specifically, a glue dispensing area 102 may be provided in an area of ​​the surface of the substrate 10 corresponding to the glue flow groove 201, and the glue dispensing area 102 may be provided near the center of the glue flow groove 201. The glue dispensing equipment may simultaneously inject glue from the glue dispensing area 102 into multiple glue flow grooves 201 at a time, so that the glue can flow from the glue dispensing area 102 to the surroundings of the glue flow groove 201, and simultaneously flow to the welding area 101 and flow into the space between the lamp beads 40 and the surface of the substrate 10, so that multiple lamp beads 40 in each glue flow groove 201 are simultaneously bonded and fixed to the surface of the substrate 10, and multiple lamp beads 40 in each glue flow groove 201 can be connected and fixed, effectively increasing the bonding force between the lamp beads 40 and the substrate 10, and improving the thrust of the lamp beads 40.

[0092] The glue injected into the glue flow groove 201 may be an epoxy resin glue mixture, and the epoxy resin glue mixture includes a base resin, a curing agent, a black filler and a coupling agent.

[0093] The shear strength of the adhesive layer 50 formed by the glue is greater than 20 MPa, which can effectively improve the structural strength of the connection between the lamp bead 40 and the substrate 10, and can increase the adhesion between the lamp beads 40 and the lamp beads 40 in the glue flow groove 201, thereby effectively enhancing the thrust of the lamp bead 40 and improving the overall structural stability of the display module 100.

[0094] After completing step S40 , the entire structure may be heated and cured in a reflow oven to finally obtain the display module 100 .

[0095] See also Fig.12 After preparing the display module 100, the inventor of the present application measured the thrust of the lamp bead 40. Specifically, the thrust of the lamp bead 40 of the existing display module 100 and the display module 100 of the present application was measured respectively. Ten points were selected in both the existing display module 100 and the display module 100 of the present application, and the thrust of the ten points was measured.

[0096] The thrust of the lamp bead 40 at each point is shown in Fig.12 The table in . Fig.12 It can be seen that, compared with the existing display module 100 , the thrust of the lamp beads 40 in the display module 100 of the present application can be increased by 100% to 300%.

[0097] For the display module and its manufacturing method of the present application, the surface of the substrate is provided with a solder resist layer, and the solder resist layer is formed with a plurality of glue flow grooves that can expose part of the surface area of ​​the substrate, and the lamp beads are fixed on the surface of the substrate by soldering with solder pads and accommodated in the glue flow grooves. The glue flows into the glue flow grooves to cover the area on the surface of the substrate corresponding to the glue flow grooves, and can flow into the space between the bottom of the lamp beads and the surface of the substrate, thereby forming an adhesive layer, which can make the lamp beads fully bonded to the surface of the substrate, and can increase the bonding force between the lamp beads in the glue flow grooves, thereby effectively enhancing the thrust of the lamp beads and improving the overall structural stability of the display module.

[0098] Although the present invention has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in a variety of forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A display module, characterized in that: include: substrate; A solder resist layer is arranged on the surface of the substrate; a plurality of glue flow grooves are formed on the solder resist layer, and the glue flow grooves are recessed structures that sink from the surface of the solder resist layer toward the surface of the substrate so that the area of ​​the surface of the substrate corresponding to the glue flow grooves is exposed; A plurality of solder pads are provided, wherein the plurality of solder pads are arranged at intervals on the surface of the substrate and arranged in the glue flow groove; A plurality of lamp beads, each of which is welded and fixed on the surface of the substrate through the pad; The adhesive layer is arranged on the surface of the substrate and accommodated in the glue flow groove, and the adhesive layer connects the lamp bead and the surface of the substrate.

2. The display module according to claim 1, characterized in that: A glue dispensing area is provided on the surface of the substrate in an area corresponding to the glue flow groove, and the glue dispensing area is arranged close to the central area of ​​the glue flow groove; the glue dispensing area is used for a glue dispensing device to inject glue into the glue flow groove to form the bonding layer.

3. The display module according to claim 2, characterized in that: A welding area is provided on the surface of the substrate corresponding to the glue flow groove, and the welding pad is provided on the welding area; each of the glue flow grooves is provided with a plurality of welding areas, and the plurality of welding areas are arranged at intervals around the glue dispensing area.

4. The display module according to claim 3, characterized in that: The outer contour of the glue flow groove is square, a welding area is provided at each of the four vertex positions of the glue flow groove, and the glue dot area is arranged at the center position of the glue flow groove.

5. The display module according to claim 1, characterized in that: The thickness of the solder resist layer is 30 μm to 100 μm, and the depth of the glue flow groove is 30 μm to 100 μm.

6. The display module according to claim 1, characterized in that: Each of the lamp beads comprises a main body and a pin portion connected to the main body, and the pin portion is welded and fixed on the pad; the adhesive layer connects the surface of the main body and the surface of the substrate.

7. The display module according to claim 1, characterized in that: The adhesive layer is formed by curing glue, and the glue enters the glue flow groove and can flow between the lamp bead and the surface of the substrate.

8. The display module according to claim 7, characterized in that: The glue is an epoxy resin glue mixture, which includes a base resin, a curing agent, a black filler and a coupling agent. The shear strength of the bonding layer formed by the glue is greater than 20 MPa.

9. A method for manufacturing a display module, characterized in that: The steps include: Providing a substrate, and disposing a solder resist layer on the surface of the substrate; A plurality of solder flow grooves are formed on the solder resist layer, and solder pads are arranged in areas on the surface of the substrate corresponding to the solder flow grooves; Soldering the lamp bead to the soldering pad; Glue is injected into the glue flow groove, and the glue can flow between the lamp bead and the substrate to form an adhesive layer in the area of ​​the surface of the substrate corresponding to the glue flow groove.

10. The method for manufacturing a display module according to claim 9, characterized in that: A plurality of pads are arranged on the surface of the substrate corresponding to the glue flow groove, and the plurality of pads are arranged at intervals along the circumference of the glue flow groove, and the glue is injected into the center of the glue flow groove.

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