Water-jet guided laser processing equipment and method

Abstract

The invention discloses water-jet guided laser processing equipment and a water-jet guided laser processing method, and belongs to the technical field of water-jet guided laser processing. According to the technical scheme, the method comprises the monitoring process of monitoring whether a workpiece is cut through or not when the workpiece is machined through water-guided laser. The monitoring process comprises the steps that a vibration sensor is used for collecting a vibration signal of the workpiece; a signal analyzer is adopted to analyze and judge the vibration signals of the workpiece, interference signals are filtered, and workpiece vibration signals caused by water beams are reserved; workpiece vibration signals caused by water beams are converted and spread according to the time sequence, vibration signal waveforms are obtained, and whether the workpiece is cut through or not is judged according to waveform characteristics. The method is applied to the aspect of water-jet guided laser processing, solves the problems of poor accuracy, complex equipment and high cost of an existing mode for judging whether a workpiece is cut through or not during water-jet guided laser processing, and has the characteristics of high detection precision, simple control method and low cost.

Description

Technical Field

[0001] The invention belongs to the technical field of water-conducting laser processing, and in particular relates to a water-conducting laser processing device and a method. Background Art

[0002] Water-guided laser processing technology is a processing method for precision hole making and cutting. Its principle is to conduct laser energy to the surface of the workpiece through a water jet as thin as a hair, and ablate the workpiece material to achieve processing. It can be used for precision cutting and drilling of metals, ceramics, composite materials, and semiconductor materials. When processing a large number of group holes or processing for a long time, the equipment control system needs to accurately understand the moment when a feature is processed, that is, the feature has been completely cut through, so as to transfer to the next processing position in time to continue processing, reduce the time of equipment idle travel, and improve processing efficiency.

[0003] There are two methods in engineering to identify whether a feature has been processed. One is to use a fixed number of processing cycles. According to the test, the depth of a water-guided laser processing track cycle can be obtained, and then the thickness at the processing feature can be measured to obtain the number of cycles that the equipment should perform. For example, for a through hole with a depth of 5mm, the depth of a water-guided laser processing track cycle is 0.05mm, then at least 100 processing cycles are required to process it through. In this way, the number of processing cycles is set in the machine tool program. After the number of cycles is reached, the processing is ended and the next feature is switched to. The disadvantage of this method is that the processing depth of each cycle is not a fixed value, but changes with the processing depth and processing parameters. The difference is particularly obvious when processing at a large depth. At the same time, the processing time of each hole is not consistent, and it is difficult to calibrate the processing time with a single hole test. If the program setting time is too long, although it can improve the reliability of cutting through, it will greatly reduce the processing efficiency. Therefore, for complex workpieces, it is appropriate to use the method of cutting-through sensing in engineering to directly detect the sound, light, electricity and other signals related to the processing process, and determine whether it is cut through through analysis and judgment. This can not only accurately determine whether it is cut through, but also move to the next working position as soon as possible, thereby improving processing efficiency.

[0004] Chinese patent CN 111194249 A discloses a scheme for cutting-through sensing using optical signals, the main features of which are: laser reaches the surface of the workpiece through a water beam and is reflected, and part of the reflected light is transmitted along the water jet upward along the original path. On the laser light path, the reflected light signal is collected by means of spectroscopic and detection facilities using the characteristics of the wavelength and frequency of the reflected light, and is linked to whether the workpiece is cut through, thereby realizing cutting-through sensing and closed-loop control; Chinese patent CN 114101943 B discloses a scheme for using CCD to measure the spectrum of laser light reflected back along the original path of the water beam, perform element quantitative analysis, and compare it with a pre-established standard element spectrum, while combining with CCD visual images to determine the cutting-through state; Chinese patent CN115041811 B discloses a method for using spectral analysis of the spectral signal returned along the original path of the water beam, and another scheme is to use an acoustic and optical signal analysis device installed below the processing head and facing the processing area to collect acoustic signals during the processing and optical signals propagated in the air for analysis. The common feature of the above schemes is to use the reflected light signal returned through the original path of the water beam, or to determine the cutting state through spectrum analysis or element quantitative analysis.

[0005] However, the above scheme requires special spectrum analysis equipment, and increases the complexity of the water-conducting laser processing optical head, which increases the cost. In addition, in the scheme using acoustic signals, since it is non-contact, there is a possibility of intermittent distortion in acoustic signal detection. Summary of the invention

[0006] The details of one or more embodiments of the present invention are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent.

[0007] The present invention provides a water-conducting laser processing monitoring device and method, which solves the problems of poor accuracy, complex equipment and high cost in the existing method for judging whether a workpiece is cut through during water-conducting laser processing, and has the characteristics of high detection accuracy, simple control method and low cost.

[0008] The present invention discloses a water-conducting laser processing method, including a monitoring process of monitoring whether the workpiece is cut through when the workpiece is processed by the water-conducting laser. The monitoring process includes: a signal collection step, including using a vibration sensor to collect the vibration signal of the workpiece; a signal processing step, including using a signal analyzer to analyze and judge the vibration signal of the workpiece, filtering the interference signal, and retaining the vibration signal of the workpiece caused by the water beam; and a judgment step, converting the vibration signal of the workpiece caused by the water beam and expanding it in time sequence to obtain a vibration signal waveform. In one processing cycle: if the vibration signal waveform is a continuous waveform with stable amplitude and frequency, it is judged that the processing state of the workpiece is not cut through; if the vibration signal waveform is an intermittent waveform with fluctuating amplitude and frequency, it is judged that the processing state of the workpiece is critically cut through; if the vibration signal waveform does not exist, it is judged that the processing state of the workpiece is completely cut through.

[0009] In some of the embodiments, the signal analyzer analyzes and determines the vibration signal of the workpiece in the cyclic processing process, filters the interference signal, and retains the vibration signal of the workpiece caused by the water beam.

[0010] In some of the embodiments, the interference signal includes a workpiece vibration signal caused by the movement of the machine tool.

[0011] In some of the embodiments, the method includes: using a water-guided laser to perform a first processing cycle on the position to be processed of the workpiece, and at the same time, the vibration sensor collects the vibration signal of the first processing cycle of the workpiece, and the signal analyzer analyzes and determines the vibration signal of the first processing cycle of the workpiece: if the processing state of the workpiece is cutting through, the processing is stopped; if the processing state of the workpiece is not cutting through or critical cutting through, using a water-guided laser to perform a second processing cycle on the position to be processed of the workpiece until the processing state of the workpiece is cutting through.

[0012] Another aspect of the present invention discloses a water-conducting laser processing device for the water-conducting laser processing method described in any of the above technical solutions, comprising: a vibration sensor, a probe in contact with a workpiece to collect a vibration signal of the workpiece; a signal analyzer, electrically connected to the vibration sensor, analyzing and judging the vibration signal of the workpiece, filtering interference signals, and retaining the workpiece vibration signal caused by the water beam, converting the workpiece vibration signal caused by the water beam and expanding it in time sequence to obtain a vibration signal waveform, and within a processing cycle: if the vibration signal waveform is a continuous waveform with stable amplitude and frequency, it is judged that the processing state of the workpiece is not cut through; if the vibration signal waveform is an intermittent waveform with amplitude and frequency fluctuations, it is judged that the processing state of the workpiece is critical cutting through; if the vibration signal waveform does not exist, it is judged that the processing state of the workpiece is fully cut through; a water-conducting laser processing device is used to process the workpiece; a general control device is electrically connected to the signal analyzer and the water-conducting laser processing device, when the signal analyzer determines that the processing state of the workpiece is not cut through or critical cutting through, the water-conducting laser processing device is controlled to continue processing the workpiece; when the signal analyzer determines that the processing state of the workpiece is cutting through, the water-conducting laser processing device is controlled to stop processing the workpiece.

[0013] In some embodiments, a signal amplifier is further included, and the signal analyzer is electrically connected to the vibration sensor through the signal amplifier. The signal amplifier amplifies the vibration signal collected by the vibration sensor and transmits it to the signal analyzer.

[0014] In some of the embodiments, a workbench is further included, and the workpiece is fixed on the workbench.

[0015] In some embodiments, the vibration sensor probe is in contact with the workpiece, or the vibration sensor probe is in contact with the workpiece and the workbench.

[0016] In some embodiments, the water-guided laser processing device includes a laser and a processing head; the laser is electrically connected to the master control device; the processing head further includes: a high-pressure water chamber, the inner wall of which forms a chamber, and the chamber is filled with water; a glass window is provided on one side, and a nozzle is opened on the other side, and the nozzle is arranged opposite to the glass window; a focusing lens is arranged opposite to the glass window, and the focusing point is aligned with the nozzle; the laser emitted by the laser is focused by the focusing lens, passes through the glass window and the water in the chamber through the nozzle to form a high-pressure water beam coupled with the laser, and the high-pressure water beam impacts the surface of the workpiece to process the workpiece and generate vibration.

[0017] In some of the embodiments, a mechanical control device for controlling the machine tool is further included, and the mechanical control device is electrically connected to the master control device.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The present invention proposes a water-guided laser processing method, which directly measures the vibration characteristics of the workpiece, collects the vibration signal of the workpiece caused by the water beam during water-guided processing, and determines whether the drilling or cutting is through. The method has the characteristics of high detection accuracy, simple control method, low cost, and easy promotion.

[0020] The present invention provides a water-conducting laser processing device, which has the characteristics of simple structure and low equipment cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 A schematic diagram of the structure of a water-conducting laser processing device provided in an embodiment of the present invention;

[0023] Figure 2 A flow chart of water-conducting laser processing provided by an embodiment of the present invention;

[0024] Figure 3 The vibration signal waveform diagram of the workpiece in the processing state of the embodiment of the present invention is not cut through;

[0025] Figure 4 A vibration signal waveform diagram of a workpiece in a critical cutting state provided by an embodiment of the present invention;

[0026] Figure 5 A vibration signal waveform diagram of a workpiece in a cutting-through state provided in an embodiment of the present invention;

[0027] Figure 6 A schematic diagram of a machine tool processing path for a processing cycle provided by an embodiment of the present invention;

[0028] Figure 7 A schematic diagram of a blind hole or blind groove provided in an embodiment of the present invention;

[0029] Figure 8 A schematic diagram of a fully cut-through workpiece state provided by an embodiment of the present invention;

[0030] Fig. 9 A schematic diagram of the structure of a processing head provided by an embodiment of the present invention;

[0031] Description of the drawings: 1. Vibration sensor; 2. Signal amplifier; 3. Signal analyzer; 4. Master control device; 5. Mechanical control device; 6. Laser; 7. Workpiece; 8. Workbench; 9. Water beam; 10. Laser; 1101. High-pressure water chamber; 1102. Glass window; 1103. Nozzle; 1104. Focusing lens. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the present invention more clearly understood, the present invention is described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Based on the embodiments provided by the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0033] Obviously, the drawings described below are only some examples or embodiments of the present invention. For ordinary technicians in this field, the present invention can also be applied to other similar scenarios based on these drawings without creative work. In addition, it can also be understood that although the efforts made in this development process may be complicated and lengthy, for ordinary technicians in this field related to the content disclosed by the present invention, some changes in design, manufacturing or production based on the technical content disclosed by the present invention are just conventional technical means, and should not be understood as insufficient content disclosed by the present invention.

[0034] Reference to "embodiments" in the present invention means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in the present invention may be combined with other embodiments without conflict.

[0035] Unless otherwise defined, the technical terms or scientific terms involved in the present invention shall have the usual meanings understood by persons with ordinary skills in the technical field to which the present invention belongs. The words "one", "a", "a", "the" and the like involved in the present invention do not indicate a quantity limitation and may indicate the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in the present invention are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device including a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in the present invention are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in the present invention refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships, for example, "A and / or B" may indicate: A exists alone, A and B exist at the same time, and B exists alone.

[0036] On one hand, the present invention discloses a water-conducting laser 10 processing method, including a monitoring process of monitoring whether the water-conducting laser 10 cuts through the workpiece 7 when processing the workpiece 7. The monitoring process includes: a signal collection step, including using a vibration sensor 1 to collect a vibration signal of the workpiece 7; a signal processing step, including using a signal analyzer 3 to analyze and judge the vibration signal of the workpiece 7, filtering interference signals (interference signals include vibration signals of the workpiece 7 caused by machine tool movement), and retaining the vibration signal of the workpiece 7 caused by the water beam 9; and a judgment step, converting the vibration signal of the workpiece 7 caused by the water beam 9 and expanding it in time sequence to obtain a vibration signal waveform. In one processing cycle: if the vibration signal waveform is Figure 3 The waveform shown in FIG. 1 is continuous and has stable amplitude and frequency, and the processing state of the workpiece 7 is judged to be not cut through; if the vibration signal waveform is Figure 4 The waveform shown in FIG. 1 is intermittent and has amplitude and frequency fluctuations, and it is judged that the processing state of the workpiece 7 is critical cutting; if the vibration signal waveform Figure 5 The water-guided laser 10 processing method directly measures the vibration characteristics of the workpiece 7, collects the vibration signal of the workpiece 7 caused by the water beam 9 during the water-guided processing, and determines whether the drilling or cutting is through-cut, which has the characteristics of high detection accuracy, simple control method, low cost, and easy promotion.

[0037] The signal characteristics for judging whether the workpiece 7 is cut through are as follows: Figure 3-5 As shown:

[0038] Figure 6The figure is a schematic diagram of the machine tool processing path of a processing cycle, where A is both the starting point and the end point of the processing.

[0039] Figure 3 This is a schematic diagram of the vibration signal waveform characteristics in the normal processing state. At this time, the workpiece 7 is not cut through, and the bottom of the processing area is Figure 7 The blind hole or blind groove shown in the figure; the high-pressure water jet 9 continuously impacts the workpiece 7 to generate a continuous vibration signal. After being collected and converted, it is expanded in chronological order to form a Figure 3 The continuous signal waveform shown is the normal processing vibration signal characteristic, and it is judged that the processing state is not cut through.

[0040] Figure 4 It is a schematic diagram of the waveform characteristics of the vibration signal of partial penetration. When the part is completely cut through in a processing cycle, the high-pressure water jet 9 passes through the cut through part without colliding with the workpiece 7. At this time, the vibration signal caused by the water jet 9 disappears, and the waveform diagram shows Figure 4 When the local part is cut through, the high pressure water jet 9 passes through the cut through part, but still impacts and collides with the workpiece 7. At this time, the vibration signal caused by the water jet 9 is compared with the normal waveform, as shown in FIG. Figure 4 As shown in the figure, the amplitude and frequency have changed greatly, and the waveform shows the local half-cut signal characteristics. According to the intermittent waveform characteristics, the processing state is judged to be critical cutting.

[0041] Figure 5 The waveform diagram is a characteristic diagram of the vibration signal waveform in the state of complete cutting. When all parts are completely cut through in a processing cycle, there is no interference between the water jet 9 and the workpiece 7, and the workpiece 7 will not be vibrated. The waveform diagram shows the characteristic of the complete cutting through signal, that is, there is no vibration waveform, and the processing state is judged to be Figure 8 All cut-through states shown.

[0042] The characteristic of water-conducting laser 10 processing is that the laser 10 emitted by the laser 6 is coupled into a small high-pressure water beam 9 through an optical lens group, and the laser 10 is transmitted to the workpiece 7 through the water beam 9 to heat the material and realize the removal processing. It can perform precision hole making, cutting, chamfering, and grooving, and is applied to the fields of metal, semiconductor, ceramic, and composite material processing. The high-pressure water beam 9 is a necessary working material for water-conducting laser 10 processing. The water pressure before the water beam 9 is ejected is usually 3-50MPa, and the diameter of the water beam 9 is usually in the range of 50-100μm. After the high-pressure water beam 9 hits the workpiece 7, the pressure caused is about 0.1N or less. The continuous impact force of the water beam 9 on the workpiece 7 causes the workpiece 7 to generate mechanical vibration. The characteristics of this vibration include phase, amplitude, frequency, etc. These characteristics are related to the material structure of the workpiece 7 and the impact force of the water beam 9 on it, and are typical. At the same time, the movement of the machine tool will also generate vibration and transmit it to the workpiece 7. The signal analyzer 3 detects all vibration signals, retains the vibration signals caused by the water beam 9, and filters out the rest. During the hole making or cutting process, the water jet 9 directly acts on the bottom of the blind hole or blind groove on the workpiece 7. When the processing is completed and a through hole or slit is formed, the water jet 9 directly passes through and the effect on the work disappears or has little effect. By detecting these two different vibration signals, it is possible to identify whether the workpiece 7 is cut through.

[0043] Furthermore, the signal analyzer 3 analyzes and judges the vibration signal of the workpiece 7 in the cyclic processing process, filters the interference signal, and retains the vibration signal of the workpiece 7 caused by the water jet 9. The reason is that the characteristics of the vibration signal of the cutting are the same or close to the characteristics of the water jet 9 in the non-processing state. The signal analyzer 3 needs to obtain the theoretical working state of the equipment and only analyzes and judges the vibration signal obtained in the cyclic processing process. The signals of the remaining time periods are not processed.

[0044] like Figure 2 As shown, it includes: using a water-conducting laser 10 to perform a first processing cycle on the position to be processed of the workpiece 7, while the vibration sensor 1 collects the vibration signal of the first processing cycle of the workpiece 7, and the signal analyzer 3 analyzes and judges the vibration signal of the first processing cycle of the workpiece 7: if the processing state of the workpiece 7 is cutting through, then the processing is stopped; if the processing state of the workpiece 7 is not cutting through or critical cutting through, then the water-conducting laser 10 is used to perform a second processing cycle on the position to be processed of the workpiece 7 until the processing state of the workpiece 7 is cutting through. Further, the signal analyzer 3 determines whether it is cutting through; if it is not cutting through, that is, "no", then it returns to the start of single-hole processing; if it is cutting through, that is, "yes", then according to the processing instruction given by the master control device 4, it is determined whether all the features to be processed on the workpiece 7 are completed; if "no", the master control device 4 issues a processing instruction and transfers to the next position to continue processing; if "yes", the master control device 4 issues a stop instruction, the processing is completed, and the machine stops.

[0045] Regarding the above processing cycle, the characteristic of water-guided laser 10 processing is layer-by-layer processing. The depth of material removal is about 0.05-0.2mm according to the material characteristics and process parameters of each layer. When cutting and making holes, each layer is processed, which is called a processing cycle. If it is not cut through, it will form Figure 7 The blind hole or blind groove shown in the figure continues to execute the processing cycle until the processing is completed and a Figure 8 The through holes or slits shown.

[0046] The embodiment of the present invention further provides a water-guided laser 10 processing device, Figure 1 FIG. 1 is a schematic diagram of the structure of a water-guided laser processing device 10 according to an embodiment of the present invention. Figure 1 As shown, the water-conducting laser 10 processing equipment includes: a vibration sensor 1, the probe is in contact with the workpiece 7 to collect the vibration signal of the workpiece 7; a signal analyzer 3, which is electrically connected to the vibration sensor 1, analyzes and judges the vibration signal of the workpiece 7, filters the interference signal, and retains the vibration signal of the workpiece 7 caused by the water beam 9, converts the vibration signal of the workpiece 7 caused by the water beam 9 and expands it in time sequence to obtain a vibration signal waveform: if the vibration signal waveform is a continuous waveform with stable amplitude and frequency, it is judged that the processing state of the workpiece 7 is not cut through; if the vibration signal waveform is intermittent and the amplitude and frequency are stable, it is judged that the processing state of the workpiece 7 is not cut through; if the vibration signal waveform is intermittent and the amplitude and frequency are stable, it is judged that the processing state of the workpiece 7 is not cut through; The waveform of the frequency fluctuation determines that the processing state of the workpiece 7 is critically cut through; if the vibration signal waveform does not exist, the processing state of the workpiece 7 is determined to be completely cut through; a water-conducting laser 10 processing device is used to process the workpiece 7; a master control device 4 is electrically connected to the signal analyzer 3 and the water-conducting laser 10 processing device, and when the signal analyzer 3 determines that the processing state of the workpiece 7 is not cut through or critically cut through, the water-conducting laser 10 processing device is controlled to continue processing the workpiece 7; when the signal analyzer 3 determines that the processing state of the workpiece 7 is cut through, the water-conducting laser 10 processing device is controlled to stop processing the workpiece 7. Further, it also includes a signal amplifier 2 and a workbench 8, the signal analyzer 3 is electrically connected to the vibration sensor 1 through the signal amplifier 2, the signal amplifier 2 amplifies the vibration signal collected by the vibration sensor 1 and transmits it to the signal analyzer 3, and the workpiece 7 is fixed on the workbench 8. The vibration sensor 1 probe contacts the workpiece 7, or the vibration sensor 1 probe contacts the workpiece 7 and the workbench 8. In some embodiments, a mechanical control device 5 for controlling the machine tool is also included, and the mechanical control device 5 is electrically connected to the master control device 4.

[0047] Regarding the above vibration sensor 1, signal analyzer 3 and master control device 4, there are many optional models of vibration sensor 1, such as MMF's universal vibration sensor KS76C10, Keyence GT2 series vibration sensor, etc.; signal analyzer 3 is composed of oscilloscope, signal analysis software and computer. The waveform analysis software is installed in the computer, and Scopeview, WFMReader, WaveView, etc. can be used. It is used to filter out clutter and process the vibration waveform caused by water beam into a visual signal, and then judge it according to the preset judgment standard. The master control device 4 mainly includes the Huazhong CNC 848 CNC controller, Siemens S7-200 PLC module and signal connector, etc., which control the operation of the machine tool. It is used to receive signals, human-computer dialogue, and control the operation of the machine tool.

[0048] The above-mentioned water-conducting laser 10 processing equipment has the characteristics of simple structure and low equipment cost. Among them, the workpiece 7 is fixedly mounted on the workbench 8. The probe of the vibration sensor 1 is in direct contact with the workpiece 7, and can also be in contact with the workbench 8 when necessary. The function of the vibration sensor 1 is to convert the mechanical vibration signal into an electrical signal or an optical signal. The signal amplifier 2 is connected to the vibration sensor 1 through wires or optical fibers, amplifies the signal gain, and transmits it to the signal analyzer 3. The function of the signal analyzer 3 is to filter out the interference signal, identify and analyze the vibration signal caused by the water beam 9, and establish a correlation with the drilling state, and then transmit the analysis result to the master control device 4 through the wire. Based on the above results, the master control device 4 issues the next operation instruction to the mechanical control device 5 and the laser 6.

[0049] In some embodiments, the water-conducting laser processing device 10 includes a laser 6 and a processing head; the laser 6 is electrically connected to the master control device 4; Fig. 9 As shown, the processing head further includes: a high-pressure water chamber 1101, the inner wall of which forms a chamber, and the chamber is filled with water; a glass window 1102 is provided on one side, and a nozzle 1103 is provided on the other side, and the nozzle 1103 is arranged opposite to the glass window 1102; a focusing lens 1104 is arranged opposite to the glass window 1102, and the focusing point is aligned with the nozzle 1103; the laser 10 emitted by the laser 6 is focused by the focusing lens 1104, passes through the glass window 1102 and the water in the chamber through the nozzle 1103 to form a high-pressure water beam 9 coupled with the laser 10, and the high-pressure water beam 9 impacts the surface of the workpiece 7 to process the workpiece 7 and generate vibration.

[0050] Regarding the above-mentioned water-guided laser 10 processing equipment, the master control device 4 issues a processing program instruction to drive the laser 6 and the mechanical control device 5 to work together, so that the water beam 9 coupled with the laser 10 performs a processing trajectory cycle at the first position to be processed of the workpiece 7, for example, once processing along the contour of the hole or once processing along the slit position. Synchronously, after receiving the start instruction from the master control device 4, the vibration sensor 1 collects the vibration signal on the workpiece 7 in real time, regardless of whether the water beam 9 is performing processing. The real-time vibration signal is collected by the vibration sensor 1 and amplified by the signal amplifier 2, and then transmitted to the signal analyzer 3. Since the characteristics of the vibration signal of the cut-through are the same or close to the characteristics of the water beam 9 in the non-processing state, the signal analyzer 3 needs to obtain the theoretical working state of the equipment from the master control device 4, and only analyzes and judges the vibration signal obtained in the cyclic processing process, and does not process the signals in the remaining time periods.

[0051] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A water-conducting laser processing method, characterized in that: The monitoring process includes monitoring whether the water-guided laser cuts through the workpiece during processing of the workpiece, and the monitoring process includes: A signal collection step includes collecting a vibration signal of the workpiece using a vibration sensor; The signal processing step includes using a signal analyzer to analyze and judge the vibration signal of the workpiece, filtering the interference signal, and retaining the vibration signal of the workpiece caused by the water beam; And the judgment step, the workpiece vibration signal caused by the water jet is converted and expanded in time sequence to obtain the vibration signal waveform. In one processing cycle: If the vibration signal waveform is continuous and the amplitude and frequency are stable, it is judged that the processing state of the workpiece is not cut through; If the vibration signal waveform is intermittent and the amplitude and frequency fluctuate, the processing state of the workpiece is judged to be critical penetration; If the vibration signal waveform does not exist, it is judged that the processing state of the workpiece is completely cut through.

2. The water-conducting laser processing method according to claim 1, characterized in that: The signal analyzer analyzes and judges the vibration signal of the workpiece in the cyclic processing process, filters the interference signal, and retains the vibration signal of the workpiece caused by the water beam.

3. The water-conducting laser processing method according to claim 1, characterized in that: The interference signal includes a workpiece vibration signal caused by the movement of the machine tool.

4. The water-conducting laser processing method according to claim 1, characterized in that: include: A water-guided laser is used to perform a first processing cycle on the position to be processed of the workpiece, and at the same time, the vibration sensor collects the vibration signal of the first processing cycle of the workpiece, and the signal analyzer analyzes and judges the vibration signal of the first processing cycle of the workpiece: if the processing state of the workpiece is cutting through, the processing is stopped; if the processing state of the workpiece is not cutting through or critical cutting through, the water-guided laser is used to perform a second processing cycle on the position to be processed of the workpiece until the processing state of the workpiece is cutting through.

5. A water-conducting laser processing device used in the water-conducting laser processing method according to any one of claims 1 to 4, characterized in that: include: Vibration sensor, the probe contacts the workpiece to collect the vibration signal of the workpiece; The signal analyzer is electrically connected to the vibration sensor, analyzes and judges the vibration signal of the workpiece, filters the interference signal, and retains the workpiece vibration signal caused by the water beam, converts the workpiece vibration signal caused by the water beam and expands it in time sequence to obtain the vibration signal waveform. In one processing cycle: If the vibration signal waveform is continuous and the amplitude and frequency are stable, it is judged that the processing state of the workpiece is not cut through; If the vibration signal waveform is intermittent and the amplitude and frequency fluctuate, the processing state of the workpiece is judged to be critical penetration; If the vibration signal waveform does not exist, it is judged that the processing state of the workpiece is completely cut through; A water-conducting laser processing device is used to process workpieces; The master control device is electrically connected to the signal analyzer and the water-conducting laser processing device. When the signal analyzer determines that the processing state of the workpiece is not cut through or critically cut through, the master control device controls the water-conducting laser processing device to continue processing the workpiece; when the signal analyzer determines that the processing state of the workpiece is cut through, the master control device controls the water-conducting laser processing device to stop processing the workpiece.

6. The water-conducting laser processing equipment according to claim 5, characterized in that: It also includes a signal amplifier, and the signal analyzer is electrically connected to the vibration sensor through the signal amplifier. The signal amplifier amplifies the vibration signal collected by the vibration sensor and then transmits it to the signal analyzer.

7. The water-conducting laser processing equipment according to claim 5, characterized in that: Also included is a workbench, on which the workpiece is fixed.

8. The water-conducting laser processing equipment according to claim 7, characterized in that: The vibration sensor probe is in contact with the workpiece, or the vibration sensor probe is in contact with the workpiece and the workbench.

9. The water-conducting laser processing equipment according to claim 5, characterized in that: The water-conducting laser processing device comprises a laser and a processing head; the laser is electrically connected to the master control device; the processing head further comprises: The high-pressure water chamber has an inner wall forming a chamber filled with water; one side is provided with a glass window, and the other side is provided with a nozzle, and the nozzle is arranged opposite to the glass window; A focusing lens is arranged opposite to the glass window, and a focusing point is aligned with the nozzle; after being focused by the focusing lens, the laser emitted by the laser passes through the glass window and the water in the chamber through the nozzle to form a high-pressure water beam coupled with the laser, and the high-pressure water beam impacts the surface of the workpiece to process the workpiece and generate vibration.

10. The water-conducting laser processing equipment according to claim 5, characterized in that: It also includes a mechanical control device for controlling the machine tool, and the mechanical control device is electrically connected to the master control device.

Images