A light splitting adjustment system and laser scanning processing device

Abstract

The present application relates to the field of laser processing technology, and specifically to a light splitting adjustment system and a laser scanning processing device, including a driving module and a diffraction beam splitting module; the diffraction beam splitting module includes a substrate, and at least two optical diffraction elements are arranged in an array on the substrate; the driving module is used to drive the substrate to move in a plane perpendicular to the main light path, so that the optical diffraction elements cut into the main light path in sequence; the diffraction parameters of adjacent optical diffraction elements are different, so that different beam splitting numbers and / or beam splitting angles are generated when light passes through different optical diffraction elements. The present application can realize the rapid switching of diffraction optical elements, avoid the replacement of processing equipment, and is conducive to improving processing efficiency.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a light splitting adjustment system and a laser scanning processing device. Background Art

[0002] In the field of laser processing, it is common to use a method in which multiple light beams converge simultaneously to a specified position on the surface to be processed in order to improve processing efficiency. Usually, multiple light beams can be achieved by using multiple lasers to work simultaneously, but multiple lasers are expensive and cannot maintain the consistency of the power and spot morphology of multiple beams. Therefore, in high-precision laser processing equipment, diffractive optical elements (DOEs) are often used for laser beam splitting. The surface of the diffractive optical element has a tiny structure. By modulating the phase of the incident laser, a laser beam can be divided into multiple ones to achieve a one-dimensional or two-dimensional array arrangement. The diffractive optical element can achieve equal-energy beam splitting of the incident light, and the power and spot morphology of each outgoing light are consistent. In addition, the element is compact and easy to integrate into various laser systems, and is used in high-precision laser processing equipment.

[0003] The diffractive optical elements currently used in laser processing equipment can only produce a fixed laser beam array. However, a single laser beam distribution array cannot meet all the requirements of the processing process. For example, a laser with more beams can meet high processing rates, but cannot process a certain tiny structure. In this case, it is necessary to manually switch the diffractive optical elements in the optical path or replace the processing equipment, which is cumbersome and time-consuming. Summary of the invention

[0004] The purpose of the present application is to provide a spectroscopic adjustment system and a laser scanning processing device, which can realize the rapid switching of diffraction optical elements, avoid the replacement of processing equipment, and help improve processing efficiency.

[0005] The embodiment of the present application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a spectroscopic adjustment system, comprising a driving module and a diffraction beam splitting module; the diffraction beam splitting module comprises a substrate, on which at least two optical diffraction elements are provided, and at least two of the optical diffraction elements are arranged in an array on the substrate; the driving module is used to drive the substrate to move in a plane perpendicular to a main light path, so that the optical diffraction elements cut into the main light path in sequence; the diffraction parameters of adjacent optical diffraction elements are different, so that different beam splitting numbers and / or beam splitting angles are generated when light passes through different optical diffraction elements.

[0007] As an optional embodiment, it also includes a protective shell; the substrate is installed in the protective shell, and the corresponding two sides of the protective shell are respectively provided with an incident through hole and an exit through hole, and the geometric centers of the incident through hole, the exit through hole and the preset optical diffraction element are all located on the main light path.

[0008] As an optional implementation, the substrate is a circular structure; at least two of the optical diffraction elements are arranged in sequence around the central axis of the substrate.

[0009] As an optional implementation, the optical diffraction element is a fan-shaped structure; the central angle of the optical diffraction element is 30-180°.

[0010] As an optional implementation, the driving module is a rotary motor; the rotation axis of the rotary motor is consistent with the extension direction of the main light path, and the rotation axis is connected to the center of the substrate to drive the substrate to rotate.

[0011] As an optional implementation, at least two of the optical diffraction elements are arranged in sequence along a straight line on the substrate; the driving module is a telescopic drive; and the telescopic drive drives the substrate to move along the arrangement direction of the optical diffraction elements.

[0012] As an optional implementation, the substrate surface has at least two microstructures serving as the optical diffraction elements.

[0013] As an optional implementation, the substrate has at least two mounting holes, and the optical diffraction element is embedded in the mounting holes.

[0014] In the second aspect, an embodiment of the present application provides a laser scanning processing device, including a laser light source, a lens group, a scanning device, a work platform and the above-mentioned spectroscopic adjustment system. The laser generated by the laser light source sequentially passes through the diffraction optical element of the spectroscopic adjustment system and the lens group, and is irradiated to the work platform through the scanning device.

[0015] As an optional implementation, it further includes a sinusoidal lens and a focusing lens; the light emitted by the scanning device passes through the sinusoidal lens and the focusing lens in sequence and irradiates the working platform.

[0016] The beneficial effects of the embodiments of the present application include:

[0017] In the first aspect, the embodiment of the present application provides a light splitting adjustment system, including a driving module and a diffraction beam splitting module. The diffraction beam splitting module of the embodiment of the present application includes a substrate, on which at least two optical diffraction elements are provided, and at least two optical diffraction elements are arranged in an array on the substrate. The driving module of the embodiment of the present application is used to drive the substrate to move in a plane perpendicular to the main light path, so that the optical diffraction elements cut into the main light path in sequence; because the diffraction parameters of adjacent optical diffraction elements in the embodiment of the present application are different, different beam splitting numbers and / or beam splitting angles can be generated when light passes through different optical diffraction elements. Compared with the prior art, the diffraction beam splitting module of the embodiment of the present application can generate a variety of laser beam splitting distributions under the drive of the driving module, so the embodiment of the present application can be switched arbitrarily according to different processing requirements, and can achieve fast switching without disassembly. Greatly improve processing efficiency and processing accuracy.

[0018] In the second aspect, the embodiment of the present application provides a laser scanning processing device, including a laser light source, a lens group, a scanning device, a work platform and the above-mentioned light splitting adjustment system, the laser light generated by the laser light source sequentially passes through the diffractive optical element and the lens group of the light splitting adjustment system, and is irradiated to the work platform through the scanning device. The laser scanning processing device provided by the embodiment of the present application can realize the rapid switching of the diffractive optical element, avoid the replacement of the processing equipment, and is conducive to improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is one of the structural schematic diagrams of the light splitting and adjusting system of an embodiment of the present application;

[0021] Figure 2 This is a schematic diagram of the structure of the laser scanning processing device according to an embodiment of the present application;

[0022] Figure 3 This is one of the structural schematic diagrams of the substrate in the light splitting adjustment system of the embodiment of the present application;

[0023] Figure 4 This is the second structural schematic diagram of the substrate in the light splitting adjustment system of the embodiment of the present application;

[0024] Figure 5 This is the second structural diagram of the light splitting and adjusting system of the embodiment of the present application;

[0025] Figure 6This is the third structural diagram of the light splitting and adjusting system of the embodiment of the present application;

[0026] Figure 7 This is the fourth structural schematic diagram of the light splitting and adjusting system according to the embodiment of the present application.

[0027] icon:

[0028] 100-driving module; 101-substrate; 102-optical diffraction element; 103-protective housing; 104-incident through hole; 105-exit through hole; 106-laser light source; 107-lens group; 108-scanning device; 109-working platform; 110-sine lens; 111-focusing objective lens; 112-first motor; 113-second motor; 114-turntable. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0031] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0032] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] The surface of the diffractive optical element has a tiny structure. By modulating the phase of the incident laser, a laser beam can be split into multiple ones to achieve a one-dimensional or two-dimensional array arrangement. The diffractive optical element can achieve equal energy beam splitting of the incident light, and the power and spot morphology of each outgoing light are consistent. The element is small in size and easy to integrate into various laser systems. It is used in high-precision laser processing equipment.

[0034] The diffractive optical elements currently used in laser processing equipment can only produce a fixed laser beam array. However, a single laser beam distribution array cannot meet all the requirements of the processing process. For example, a laser with more beams can meet high processing rates, but cannot process a certain tiny structure. In this case, it is necessary to manually switch the diffractive optical elements in the optical path or replace the processing equipment, which is cumbersome and time-consuming.

[0035] In order to solve the above technical problems, the embodiments of the present application provide a light splitting adjustment system and a laser scanning processing device.

[0036] Reference Figure 1 , Figure 2 As shown, an embodiment of the present application provides a light splitting adjustment system, including a driving module 100 and a diffraction beam splitting module; the diffraction beam splitting module includes a substrate 101, on which at least two optical diffraction elements 102 are provided, and the at least two optical diffraction elements 102 are arranged in an array on the substrate 101; the driving module 100 is used to drive the substrate 101 to move in a plane perpendicular to the main light path, so that the optical diffraction elements 102 cut into the main light path in sequence; the diffraction parameters of adjacent optical diffraction elements 102 are different, so that different beam splitting numbers and / or beam splitting angles are generated when the light passes through different optical diffraction elements 102.

[0037] It should be noted that the light splitting adjustment system of the embodiment of the present application mainly includes a driving module 100 and a diffraction beam splitting module.

[0038] Reference Figure 1 , Figure 2 As shown, the driving module 100 of the embodiment of the present application is used to control the movement of the substrate 101, so that different optical diffraction elements 102 on the substrate 101 are sequentially cut into the main light path. The diffraction beam splitting module of the embodiment of the present application includes a substrate 101, and at least two optical diffraction elements 102 are arranged on the substrate 101 in an array. Each optical diffraction element 102 has different diffraction parameters and can generate different numbers and / or angles of beam splitting when light passes through.

[0039] In the initial state of the light splitting adjustment system of the embodiment of the present application, a certain optical diffraction element 102 on the substrate 101 is located in the main light path, and the laser beam generates a specific beam splitting array after passing through the diffraction element.

[0040] When the laser beam splitting array needs to be changed, the driving module 100 drives the substrate 101 to move in a plane perpendicular to the main light path according to preset instructions or real-time processing requirements. The movement of the substrate 101 causes the optical diffraction elements 102 at different positions to sequentially cut into the main light path and replace the current diffraction elements.

[0041] It should be noted that, in the dynamic switching, since the multiple optical diffraction elements 102 on the substrate 101 have different diffraction parameters, different numbers and / or angles of beam splitting will be generated when the light passes through different diffraction elements. Through the precise control of the driving module 100, different laser beam splitting arrays can be quickly switched without interrupting the laser processing to meet different processing requirements.

[0042] In order to ensure the accuracy and stability of switching, the spectroscopic adjustment system of the embodiment of the present application can be equipped with a sensor or a control system to monitor the position of the substrate 101 in real time, and adjust the action of the driving module 100 according to the feedback information to ensure that the correct diffraction element can be cut into the main light path each time the switch is made.

[0043] It should be noted that the substrate 101 is a platform that carries multiple optical diffraction elements 102, and is usually made of high-precision materials such as glass, metal or ceramics to ensure that it maintains stability and flatness during movement. At least two optical diffraction elements 102 are provided on the substrate 101 of the embodiment of the present application, and these optical diffraction elements 102 are arranged in an array. Each optical diffraction element 102 has different diffraction parameters and can generate beam splitting of different numbers and / or angles when light passes through. For example, one of the optical diffraction elements 102 can divide a beam of laser into multiple sub-beams to form a dense beam splitting array, which is suitable for scenes with high processing rates. Among them, one of the optical diffraction elements 102 can produce beam splitting at a larger angle, which is suitable for processing workpieces with a larger area or scenes where the direction of the laser beam needs to be accurately controlled. Some special diffraction elements can also be designed to generate laser beam splitting arrays of specific shapes, such as annular, linear or other complex shapes, which are suitable for specific processing processes.

[0044] It should be noted that adjacent optical diffraction elements 102 have different diffraction parameters, specifically including:

[0045] Grating constant: Different diffraction elements have different grating constants, which determine the diffraction angle produced when light passes through. A larger grating constant will generate a smaller diffraction angle, while a smaller grating constant will generate a larger diffraction angle.

[0046] Phase modulation depth: Different diffraction elements have different phase modulation depths, which affects the phase change of light when it passes through, thereby changing the number and distribution of beam splitting.

[0047] Number of beam splitting: Different diffraction elements can be designed to produce different numbers of beam splitting. For example, some optical diffraction elements 102 can split a laser beam into a 3×3 beam splitting array, while other elements can split the laser into a 5×5 beam splitting array.

[0048] Beam splitting angle distribution: Different diffraction elements can be designed to generate beam splitting with different angle distributions. For example, some optical diffraction elements 102 can generate uniformly distributed beam splitting, while other optical diffraction elements 102 can generate non-uniformly distributed beam splitting, which is suitable for specific processing requirements.

[0049] Since the diffraction parameters of adjacent optical diffraction elements 102 in the embodiment of the present application are different, different beam splitting numbers and / or beam splitting angles can be generated when light passes through different optical diffraction elements 102. Compared with the prior art, the diffraction beam splitting module in the embodiment of the present application can generate a variety of laser beam splitting distributions under the drive of the driving module 100, so the embodiment of the present application can be switched arbitrarily according to different processing requirements, and can achieve rapid switching without disassembly, which greatly improves processing efficiency and processing accuracy.

[0050] Reference Figure 1 , Figure 5 , Figure 6 as well as Figure 7 As shown, as an optional embodiment, it also includes a protective shell 103; the substrate 101 is installed in the protective shell 103, and the corresponding two sides of the protective shell 103 are respectively provided with an incident through hole 104 and an exit through hole 105, and the geometric centers of the incident through hole 104, the exit through hole 105 and the preset optical diffraction element 102 are all located on the main light path.

[0051] The embodiment of the present application can protect the substrate 101 by disposing the protective shell 103 to prevent the external environment from interfering with the substrate 101 .

[0052] Reference Figure 5 As shown, further, the driving module 100 includes a first motor 112 and a second motor 113. A turntable 114 is disposed in the protective housing 103, and the substrate 101 is rotatably mounted on the turntable 114. The rotation axis of the turntable 114 is spaced apart from the rotation axis of the substrate 101 by a preset distance.

[0053] The first motor 112 drives the turntable 114 carrying the substrate 101 to rotate, so as to rotate the light beam arrangement direction of the optical diffraction elements 102 with different partitions, for example, from 0° to 30° or 45°. The second motor 113 directly drives the substrate 101 to rotate to switch the optical diffraction elements 102 with different partitions to generate different patterns.

[0054] Reference Figure 3As shown, as an optional implementation, the substrate 101 is a circular structure; at least two optical diffraction elements 102 are arranged in sequence around the central axis of the substrate 101.

[0055] Furthermore, the substrate 101 of the embodiment of the present application is a circular structure, and the driving module 100 is a rotary motor; the rotating shaft of the rotary motor is consistent with the extension direction of the main light path, and the rotating shaft is connected to the center of the substrate 101 to drive the substrate 101 to rotate.

[0056] The circular substrate 101 in the embodiment of the present application can be driven by a rotary motor to rotate around its axis, so that the diffraction elements at different positions enter the main light path in sequence.

[0057] It should be noted that the multiple optical diffraction elements 102 on the substrate 101 are arranged in a circular array or in a fan-shaped arrangement.

[0058] Further, see Figure 3 , Figure 5 As shown, the optical diffraction element 102 is a fan-shaped structure; the central angle of the optical diffraction element 102 is 30-180°.

[0059] Exemplarily, the central angle of the fan-shaped structure is 30°, and 12 optical diffraction elements 102 arranged in an array around the center are disposed on the substrate 101 .

[0060] Exemplarily, the central angle of the fan-shaped structure is 60°, and six optical diffraction elements 102 arranged in an array around the center are disposed on the substrate 101 .

[0061] Exemplarily, the central angle of the fan-shaped structure is 90°, and four optical diffraction elements 102 arranged in an array around the center are disposed on the substrate 101 .

[0062] It should be noted that the shape of the optical diffraction element 102 may also be other structures, such as a circle or a triangle, and those skilled in the art may select the shape according to their needs, and there is no special limitation on this.

[0063] As an optional implementation, the surface of the substrate 101 has at least two microstructures serving as optical diffraction elements 102 .

[0064] It should be noted that the surface of the substrate 101 has a microstructure serving as the optical diffraction element 102 , that is, the substrate 101 and the optical diffraction element 102 are integrally formed.

[0065] As an optional implementation, the substrate 101 has at least two mounting holes, and the optical diffraction element 102 is embedded in the mounting holes.

[0066] Different from the above-mentioned embodiments, the present embodiment opens a mounting hole on the substrate 101, and embeds an optical diffraction element 102 in the mounting hole. The present embodiment uses the substrate 101 as a bearing structure, and mounts optical diffraction elements 102 with different diffraction parameters on the substrate 101 as needed.

[0067] Reference Figure 4 As shown, as an optional implementation, at least two optical diffraction elements 102 are arranged in sequence along a straight line on a substrate 101; the driving module 100 is a telescopic drive; the telescopic drive drives the substrate 101 to move along the arrangement direction of the optical diffraction elements 102.

[0068] For example, refer to Figure 4 As shown, the substrate 101 is a rectangular structure, and six optical diffraction elements 102 arranged along the length direction of the rectangular structure are disposed on the substrate 101.

[0069] It should be noted that, as required, multiple rows of optical diffraction elements 102 may be disposed on the substrate 101 , and the number of optical diffraction elements 102 in each row may be set by those skilled in the art as required, and is not particularly limited thereto.

[0070] Reference Figure 1 As shown, an embodiment of the present application provides a laser scanning processing device, including a laser light source 106, a lens group 107, a scanning device 108, a working platform 109 and the above-mentioned spectroscopic adjustment system. The laser generated by the laser light source 106 passes through the diffraction optical element of the spectroscopic adjustment system and the lens group 107 in sequence, and is irradiated to the working platform 109 through the scanning device 108.

[0071] The laser scanning processing device provided in the embodiment of the present application realizes dynamic switching of different types of laser beam splitting arrays in the same device by setting a plurality of optical diffraction elements 102 with different diffraction parameters on the substrate 101 and combining the precise control of the driving module 100. The system can not only meet a variety of processing requirements, but also avoid the cumbersome operation of manually switching the optical path or replacing the equipment in the traditional method, significantly improving the efficiency and flexibility of laser processing. In addition, the system is compact in design and easy to integrate, suitable for various laser scanning processing devices, and has broad application prospects.

[0072] It should be noted that when applied in laser cutting, different types of workpieces may require different numbers and angles of laser beam splitting. For example, for thicker materials, fewer but higher-power laser beams can be used for cutting; while for thinner materials, more but lower-power laser beams can be used for cutting. Through this beam splitting adjustment system, different laser beam splitting arrays can be quickly switched in the same device to improve cutting efficiency and quality.

[0073] It should be noted that when applied in laser welding, different types of welds may require laser beam splitting of different shapes. For example, for narrow gap welding, a linearly distributed laser beam can be used, while for wide gap welding, a circularly distributed laser beam can be used. Through this splitting adjustment system, different laser beam splitting arrays can be quickly switched in the same device to meet different welding requirements.

[0074] During laser micromachining, different types of microstructures may require different numbers and angles of laser beam splitting. For example, for the processing of tiny holes, a single laser beam can be used for precise processing; while for the processing of large-area microstructures, multiple laser beams can be used for parallel processing. Through this beam splitting adjustment system, different laser beam splitting arrays can be quickly switched in the same device to meet the processing requirements of different microstructures.

[0075] Reference Figure 1 As shown, as an optional implementation, it also includes a sinusoidal lens 110 and a focusing lens 111 ; the light emitted by the scanning device 108 passes through the sinusoidal lens 110 and the focusing lens in sequence, and irradiates the working platform 109 .

[0076] It should be noted that when using diffractive optical elements for laser beam splitting, diffracted light at different angles will form multiple light spots on the focal plane. This causes the distribution of the light beam on the focal plane to be curved, that is, the spacing between the light beams is closer in the center area and farther in the edge area. This uneven beam distribution will affect the processing accuracy and quality.

[0077] The sinusoidal lens 110 of the embodiment of the present application can collimate and focus the scanning light beam, so that the parallel multiple light beams can be distributed at equal intervals during the processing process, thereby solving the problem of uneven light beam spacing caused by the bow-shaped bending generated under the condition of multiple light beams.

[0078] In multi-beam processing applications such as laser cutting, welding, and marking, the uniform distribution of the beams has a direct impact on the processing quality. If the spacing between the beams is uneven, it may cause some areas to have a higher processing density and other areas to have a lower processing density, which in turn affects the processing effect of the entire workpiece. By ensuring the equal spacing of the multiple beams, the sinusoidal lens 110 can significantly improve the accuracy and uniformity of the processing, ensuring that each beam can act on the workpiece surface with the same energy density, avoiding local overheating or insufficient processing.

[0079] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A light splitting adjustment system, characterized in that: The invention comprises a driving module (100) and a diffraction beam splitting module; the diffraction beam splitting module comprises a substrate (101), at least two optical diffraction elements (102) are arranged on the substrate (101), and the at least two optical diffraction elements (102) are arranged in an array on the substrate (101); the driving module (100) is used to drive the substrate (101) to move in a plane perpendicular to a main light path, so that the optical diffraction elements (102) cut into the main light path in sequence; the diffraction parameters of adjacent optical diffraction elements (102) are different, so that different beam splitting quantities and / or beam splitting angles are generated when light passes through different optical diffraction elements (102).

2. The light splitting adjustment system according to claim 1, characterized in that: It also includes a protective shell (103); the substrate (101) is installed in the protective shell (103); the protective shell (103) has an incident through hole (104) and an exit through hole (105) respectively formed on two corresponding sides; the incident through hole (104), the exit through hole (105) and the geometric centers of the preset optical diffraction element (102) are all located on the main light path.

3. The light splitting adjustment system according to claim 1, characterized in that: The substrate (101) is a circular structure; and at least two of the optical diffraction elements (102) are arranged in sequence around the central axis of the substrate (101).

4. The light splitting adjustment system according to claim 3, characterized in that: The optical diffraction element (102) is a fan-shaped structure; the central angle of the optical diffraction element (102) is 30-180°.

5. The light splitting adjustment system according to claim 3, characterized in that: The driving module (100) is a rotating motor; the rotating shaft of the rotating motor is consistent with the extension direction of the main light path, and the rotating shaft is connected to the center of the substrate (101) to drive the substrate (101) to rotate.

6. The light splitting adjustment system according to claim 1, characterized in that: At least two of the optical diffraction elements (102) are arranged in sequence along a straight line on the substrate (101); the driving module (100) is a telescopic drive; the telescopic drive drives the substrate (101) to move along the arrangement direction of the optical diffraction elements (102).

7. The light splitting adjustment system according to any one of claims 1 to 6, characterized in that: The surface of the substrate (101) has at least two microstructures serving as the optical diffraction elements (102).

8. The light splitting adjustment system according to any one of claims 1 to 6, characterized in that: The substrate (101) has at least two mounting holes, and the optical diffraction element (102) is embedded in the mounting holes.

9. A laser scanning processing device, characterized in that: It comprises a laser light source (106), a lens group (107), a scanning device (108), a working platform (109) and the spectroscopic adjustment system according to any one of claims 1 to 8, wherein the laser light generated by the laser light source (106) sequentially passes through the diffraction optical element of the spectroscopic adjustment system and the lens group (107), and is irradiated to the working platform (109) via the scanning device (108).

10. The laser scanning processing device according to claim 9, characterized in that: It also includes a sinusoidal lens (110) and a focusing lens (111); the light emitted by the scanning device (108) passes through the sinusoidal lens (110) and the focusing lens in sequence and is irradiated onto the working platform (109).

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