Laser cutting method, device, equipment and storage medium

Abstract

The present application is applicable to the field of laser processing technology, and provides a laser cutting method, device, equipment and storage medium. The laser cutting method can be applied to cutting a profile having a web and a wing plate, and the laser cutting method comprises: cutting the web by laser, and processing a slag discharge hole in the web by laser; cutting the wing plate by laser on the outer side of the wing plate to form a wing plate cutting seam, and the wing plate cutting seam is connected to the slag discharge hole. The laser cutting method provided in the embodiment of the present application can achieve smooth slag discharge.

Description

Technical Field

[0001] The present application belongs to the field of laser processing technology, and in particular, relates to a laser cutting method, device, equipment and storage medium. Background Art

[0002] H-beam has a web and a wing, and the web is connected to the wing. H-beam is usually cut by laser cutting equipment. Since the thickness of the connection between the web and the wing of the H-beam is large, when the laser cutting equipment is processing the H-beam, the slag discharge will be poor when the laser cutting wing passes through the connection. Summary of the invention

[0003] The embodiments of the present application provide a laser cutting method, device, equipment and storage medium, which can achieve smooth slag discharge.

[0004] In a first aspect, an embodiment of the present application provides a laser cutting method, which can be applied to cutting a profile having a web and a wing. The laser cutting method comprises:

[0005] Cutting the web by laser, and processing slag discharge holes in the web by laser;

[0006] The wing plate is cut by laser on the outer side of the wing plate to form a wing plate cutting seam, and the wing plate cutting seam is communicated with the slag discharge hole.

[0007] In a possible implementation manner of the first aspect, cutting the web by laser and forming a slag discharge hole on the web by laser processing includes:

[0008] The web is cut by laser along the width direction of the profile, and a slag discharge hole is processed by laser on one side of the web in the width direction.

[0009] In a possible implementation manner of the first aspect, cutting the web by laser includes:

[0010] Cutting the web along the width direction of the profile at a first length position in the length direction of the web by laser;

[0011] The step of cutting the wing panel by laser on the outer side of the wing panel comprises:

[0012] The wing panel is cut at the first length position on the outer side of the wing panel along the height direction of the profile by laser.

[0013] In a possible implementation manner of the first aspect, cutting the web by laser and forming a slag discharge hole on the web by laser processing includes:

[0014] Cutting the web in a direction parallel to the height direction of the profile by laser until cutting reaches a first designated position of the web;

[0015] Starting from the first designated position, cutting the web by laser at an angle greater than 0° and less than 90° to the height direction until cutting to a second designated position of the web;

[0016] Starting from the second designated position, a slag removal hole is machined in the web by laser.

[0017] In a possible implementation manner of the first aspect, starting from the second designated position, machining a slag discharge hole on the web by laser includes:

[0018] Starting from the second designated position, a slag removal hole is processed in the web in the direction of cutting the residual material by laser.

[0019] In a possible implementation manner of the first aspect, cutting the web by laser at an angle greater than 0° and less than 90° to the height direction until cutting to a second specified position of the web includes:

[0020] The web is cut by laser at an angle greater than 0° and less than 90° to the height direction and at a reduced cutting speed until the web is cut to a second designated position.

[0021] In a possible implementation manner of the first aspect, the profile includes H-shaped steel or L-shaped steel.

[0022] In a possible implementation manner of the first aspect, the slag discharge hole includes a rectangular hole or a waist-shaped hole.

[0023] In a possible implementation manner of the first aspect, the slag discharge hole leads to a connection transition between the web and the wing plate.

[0024] In a second aspect, an embodiment of the present application provides a laser cutting device, which can be used to cut a profile having a web and a wing, and the laser cutting device includes:

[0025] A web cutting module, used for: cutting the web by laser, and processing slag discharge holes on the web by laser;

[0026] The wing plate cutting module is used to: cut the wing plate by laser on the outer side of the wing plate along the height direction of the profile to form a wing plate cutting seam, and the wing plate cutting seam is connected to the slag discharge hole.

[0027] In a third aspect, an embodiment of the present application provides a processing device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the laser cutting method described in any one of the first aspects when executing the computer program.

[0028] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the laser cutting method described in any one of the first aspects above is implemented.

[0029] In a fifth aspect, an embodiment of the present application provides a computer program product. When the computer program product runs on a terminal device, the terminal device executes the laser cutting method described in any one of the above-mentioned first aspects.

[0030] The beneficial effects of the embodiments of the present application are:

[0031] The web is cut by laser, and a slag discharge hole is processed on the web by laser. The outer side of the wing plate is cut by laser to form a wing plate cutting seam, and the wing plate cutting seam is connected to the slag discharge hole. In this way, the waste slag generated when the wing plate is laser cut to the connection transition point can be discharged from the slag discharge hole, and smooth slag discharge can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 It is a schematic diagram of a process of a laser cutting method provided in an embodiment of the present application;

[0034] Figure 2 This is a schematic diagram of the cutting principle of the laser cutting method provided by an embodiment of the present application;

[0035] Figure 3 This is another schematic diagram of the cutting principle of the laser cutting method provided by one embodiment of the present application;

[0036] Figure 4 is a flow chart of step A1 of the laser cutting method provided in one embodiment of the present application;

[0037] Figure 5 is a schematic structural diagram of a laser cutting device provided in one embodiment of the present application;

[0038] Figure 6It is a structural schematic diagram of a web cutting module of a laser cutting device provided in one embodiment of the present application;

[0039] Figure 7 It is a structural schematic diagram of a processing device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following Figures 1 to 7 It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0041] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0042] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0043] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0044] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0045] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0046] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0047] The embodiment of the present application provides a laser cutting method, which can be applied to cutting a profile having a web and a wing, wherein the profile can be an H-shaped steel or an L-shaped steel. The embodiment of the present application is described by taking an H-shaped steel as an example.

[0048] Figure 1 Schematic diagram of a laser cutting method according to an embodiment of the present invention. Figure 1 The laser cutting method provided in the embodiment of the present application includes steps A1 to A2.

[0049] Step A1, cutting the web by laser, and processing slag discharge holes on the web by laser.

[0050] Figure 2 It is a schematic diagram of the cutting principle of the laser cutting method provided in one embodiment of the present application. Figure 3 Schematic diagram of another cutting principle of the laser cutting method provided by an embodiment of the present application. Figure 2 and Figure 3 The laser cutting head 200 of the laser processing equipment emits laser to cut the web 101 of the H-shaped steel 100. During the cutting process, the slag discharge hole 110 is processed by laser in the web 101, so that the cutting seam at the location of the slag discharge hole 110 becomes larger and communicates with the cutting seams at other locations of the web 101, forming a web cutting seam.

[0051] Specifically, the web 101 of the H-beam 100 is cut by laser along the width direction W (i.e., the X-axis direction) of the H-beam 100, and a slag discharge hole 110 is processed by laser on one side of the web 101 in the width direction W to achieve cutting of the H-beam 100 along the width direction W of the H-beam 100; in the width direction W, the slag discharge hole 110 is connected with the cutting seams at other positions of the web 101 to form a web cutting seam.

[0052] Cutting the web 101 of the H-beam 100 by laser along the width direction W of the H-beam 100 may specifically include: cutting the web 101 at a first length position in the length direction L (i.e., the Y-axis direction) of the web 101 by laser along the width direction W of the H-beam 100, thereby achieving cutting off the web 101 at the first length position.

[0053] In some other embodiments, the web 101 of the H-beam 100 is cut by laser along a direction greater than 0° and less than 90° with respect to the width direction W of the H-beam 100, and a slag discharge hole 110 is processed by laser on one side of the web 101 in the aforementioned direction to achieve beveling of the H-beam 100.

[0054] The web 101 of the H-shaped steel 100 is connected to the wing 102, and the connection is a connection transition 120. The connection transition 120 can be a fillet or a chamfer. In the height direction H of the H-shaped steel 100, the thickness of the connection transition 120 is greater than the thickness of the web 101.

[0055] In the width direction W of the H-beam 100, the slag discharge hole 110 is connected to the connection transition 120 between the web 101 and the wing plate 102. In this way, when the wing plate 102 is laser cut to the connection transition 120, the formed wing plate cutting seam can be connected to the slag discharge hole 110. In some other embodiments, in the width direction W of the H-beam 100, the slag discharge hole 110 is separated from the connection transition 120 by a distance greater than zero.

[0056] The slag discharge hole 110 is a through hole. The slag discharge hole 110 can be a rectangular hole or a waist-shaped hole. Among them, the rectangular hole is easy to process and can increase the processing speed.

[0057] The specific size of the slag discharge hole 110 can be dynamically adjusted according to the actual processed profile, for example, determined according to the thickness of the profile.

[0058] For the H-shaped steel 100, there are wing plates 102 on both sides. Therefore, the cutting can be started from the middle position of the web 101 to both sides successively, and the slag discharge holes 110 can be processed on both sides.

[0059] Step A2: cutting the wing panel by laser on the outer side of the wing panel to form a wing panel cutting seam.

[0060] For example, along the height direction H (i.e., the Z-axis direction) of the H-shaped steel, the wing panel 102 is cut at the first length position by laser on the outer side of the wing panel 102, so as to cut off the wing panel 102 at the first length position. In some other embodiments, the wing panel 102 is cut by laser on the outer side of the wing panel 102 along a direction greater than 0° and less than 90° with the height direction H.

[0061] The wing plate cutting seam is communicated with the slag discharge hole 110. Since the slag discharge hole 110 is a part of the web plate cutting seam, the wing plate cutting seam is also communicated with the web plate cutting seam.

[0062] One side of the wing plate 102 is connected to the web 101, and the other side of the wing plate 102 is away from the web 101. The outer side of the wing plate 102 refers to the side of the wing plate 102 away from the web 101.

[0063] The wing plate 102 is cut on the outer side of the wing plate 102 . By setting the parameters of the laser, the wing plate 102 can be cut from the outer side of the wing plate 102 to the slag discharge hole 110 .

[0064] Since the wing plate cutting seam is connected to the slag discharge hole 110, it indicates that the cutting depth of the laser cutting of the wing plate 102 reaches the slag discharge hole 110, and the waste slag generated by the laser cutting the connection transition 120 on the outer side of the wing plate 102 will be discharged from the slag discharge hole 110. Specifically, the cutting plane of the wing plate 102 and the slag discharge hole 110 may intersect, for example, intersect in a straight line, which is conducive to smooth slag discharge when the laser cuts the wing plate 102.

[0065] According to the above content, it can be known that by laser cutting the web 101, and processing the slag discharge hole 110 on the web 101 by laser, the wing plate is cut by laser on the outside of the wing plate 102 to form a wing plate cutting seam, the wing plate cutting seam is connected with the slag discharge hole 110, and the slag discharge hole 110 leads to the connection transition 120 between the web 101 and the wing plate 102. In this way, the waste slag generated when the wing plate 102 is laser cut to the connection transition 120 can be discharged from the slag discharge hole 110, so as to achieve smooth slag discharge, prevent cutting slag from sticking, prevent cutting equipment (such as the laser cutting head of the laser processing equipment) from being worn, and ensure the continuity of cutting.

[0066] During the laser cutting process of the profile, the cutting height is detected by the capacitance sensor in real time and the capacitance value between the profile surface is fed back to the control system for real-time adjustment, forming a closed loop to achieve follow-up control of the cutting height, which can ensure cutting stability and cutting quality. When cutting the web 101 of the H-shaped steel, the cutting height refers to the distance from the end of the laser cutting head to the surface of the web 101 along the height direction H; when cutting the wing 102 of the H-shaped steel, the cutting height refers to the distance from the end of the laser cutting head to the surface of the wing 102 along the width direction W.

[0067] Figure 4 is a flow chart of step A1 of the laser cutting method provided in one embodiment of the present application. Figure 4 The above-mentioned step A1 (cutting the web by laser and machining slag removal holes on the web by laser) may include steps A11 to A13.

[0068] Step A11, cutting the web by laser in a direction parallel to the height direction of the profile until cutting to a first designated position of the web.

[0069] The laser cuts the web 101 in a direction parallel to the height direction H of the profile, which means that the laser cutting head of the laser processing equipment emits laser to cut the web 101 in a direction parallel to the height direction H of the profile.

[0070] For example, in the XOZ plane, the laser cuts the web 101 along the width direction W in a direction parallel to the height direction H of the profile until the web 101 is cut to a first designated position.

[0071] In some other embodiments, the laser cuts the web 101 in a direction parallel to the height direction H of the profile and in a direction greater than 0° and less than 90° to the width direction W of the H-shaped steel 100 until cutting to the first designated position of the web 101 .

[0072] Step A12, starting from the first designated position, cutting the web by laser at an angle greater than 0° and less than 90° with respect to the height direction until cutting to the second designated position of the web.

[0073] The first designated position is relatively close to the connection transition point 120 between the web 101 and the wing plate 102. Starting from the first designated position, the laser cuts the web 101 at an angle in the XOZ plane (i.e., the laser cuts the web 101 at an angle greater than 0° and less than 90° to the height direction H), which can prevent the laser cutting head from colliding with the H-shaped steel and protect the cutting equipment.

[0074] In the actual cutting trajectory planning, in order to avoid the collision between the laser cutting head and the wing plate 102 of the H-shaped steel during the cutting process, when planning the cutting trajectory close to the wing plate side, the safety offset D of the laser cutting head and the end point A of the web cutting trajectory (i.e., the second designated position) are set to realize the position coordinate control of the laser cutting head, which can achieve collision avoidance between the laser cutting head and the wing plate and avoid wear of the laser cutting head.

[0075] The workpiece detection, cutting track movement, and the attitude and position control of the laser cutting head during the entire cutting process can all be completed by the three-dimensional five-axis CNC laser cutting system. The workpiece detection system of the three-dimensional five-axis CNC laser cutting machine tool completes the repositioning of the incoming profile and generates the actual coordinate system of the workpiece so that the laser cutting head can form a corresponding angle adjustment (that is, the laser cutting head forms a corresponding swing angle) to achieve tilted cutting.

[0076] The angle change of the laser cutting head (ie the angle change of the laser) is gradually reduced or gradually increased, and sudden changes should be avoided.

[0077] Step A12 may specifically include: starting from the first designated position, cutting the web 101 by laser at an angle greater than 0° and less than 90° to the height direction H and reducing the cutting speed until cutting to the second designated position of the web 101 .

[0078] As mentioned above, in the width direction W, the end point of the web cutting is point A, and point A is the transition arc point of the web plane of the H-beam, which can ensure the continuity of the cutting and achieve safe avoidance of the cutting head.

[0079] The cutting state of a section of the track before point A (i.e., the second designated position) is the swing head deceleration section, i.e., from the first designated position to the second designated position, the laser cuts the web 101 at an angle greater than 0° and less than 90° with the height direction H and reduces the cutting speed. In the height direction H, when the vector of the straight line where the cutting head is located is at an angle with the normal vector of the upper surface of the web 101, it is determined as the deceleration start point, which is the deceleration flag position, i.e., the first designated position. The first designated position is also the start point for the angle change of the cutting head. The specific position of the first designated position is determined by the maximum diameter of the capacitive sensor of the cutting head and the safety offset of the cutting head.

[0080] The cutting speed is reduced from the first designated position, and the web 101 is cut obliquely at a lower speed, which can ensure the stability of the oblique cutting and improve the processing quality. The specific speed ratio for reducing the cutting speed can be determined according to the thickness of different H-beams.

[0081] When reducing the cutting speed, gradually reduce the cutting speed, and when increasing the cutting speed, gradually increase the cutting speed. Sudden changes should be avoided.

[0082] Step A13, starting from the second designated position, a slag discharge hole is machined on the web by laser.

[0083] The second designated position is the starting point of the laser processing of the slag removal hole on the web. The second designated position can be specifically the cutting end point of the web, and the laser processes the slag removal hole 110 at the cutting end point.

[0084] The slag removal holes can be processed on the web by laser. Specifically, the slag removal holes can be processed on the web in the direction of cutting the residual material to ensure the flatness of the cut of the workpiece (i.e. the cut profile) and facilitate subsequent processing. Of course, according to actual needs, the slag removal holes can also be processed on the web in the opposite direction of the cutting residual material.

[0085] After the cutting position reaches point A (i.e., the second designated position), a slag discharge hole 110 is generated in the direction of the cutting residual material; if the -Y direction is the residual material direction, a slag discharge hole 110 is generated in the -Y direction; if the +Y direction is the residual material direction, a slag discharge hole 110 is generated in the +Y direction. The cutting trajectory for generating the slag discharge hole 110 is ABCD, which can be a closed rectangle; the width AB and length BC of the rectangular slag discharge hole 110 can be dynamically matched according to the actual profile. Point C is the swing angle recovery point and cutting speed recovery point of the cutting head, and is the speed recovery mark.

[0086] The laser cutting method provided in the embodiment of the present application re-plans the cutting path of the web to form slag removal holes that are helpful for cutting the wing plates, adjusts the cutting height in real time through a capacitive sensor, and controls the movement of the cutting head by the machine tool CNC system to complete the cutting. It can smoothly remove slag during cutting, avoid the situation where slag sticks at the arc transition between the web and the wing plate during conventional cutting, and enable smooth material drop of the workpiece. It can realize automatic loading and unloading from raw materials to workpieces, ensure the continuity of cutting, improve cutting effects, and improve production efficiency. It is particularly suitable for cutting large-size, heavy-duty, or extra-heavy-duty profiles.

[0087] Corresponding to the method described in the above embodiment, Figure 5 A structural block diagram of a laser cutting device provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0088] refer to Figure 5 The laser cutting device provided in the embodiment of the present application can be used to cut a profile having a web and a wing. The laser cutting device includes a web cutting module 1A and a wing cutting module 2A.

[0089] The web cutting module 1A is used to cut the web by laser and to process slag removal holes in the web by laser.

[0090] The wing plate cutting module 2A is used to: cut the wing plate by laser on the outer side of the wing plate along the height direction of the profile to form a wing plate cutting seam, and the wing plate cutting seam is connected to the slag discharge hole.

[0091] Figure 6 Schematic diagram of the structure of the web cutting module of the laser cutting device provided in one embodiment of the present application. Figure 6 The web cutting module 1A may include a first web cutting submodule 11A, a second web cutting submodule 12A and a hole processing submodule 13A.

[0092] The first web cutting submodule 11A is used to cut the web by laser in a direction parallel to the height direction of the profile until it reaches a first designated position of the web.

[0093] The second web cutting submodule 12A is used to: start from the first designated position, cut the web by laser at an angle greater than 0° and less than 90° with respect to the height direction, until cutting to the second designated position of the web.

[0094] The hole processing submodule 13A is used to: start from the second designated position, and process the slag removal hole in the web by laser.

[0095] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0096] Figure 7 This is a schematic diagram of the structure of a processing device provided in one embodiment of the present application. Figure 7 As shown, the processing device 7 of this embodiment includes: at least one processor 70 ( Figure 7 Only one is shown in the figure), a memory 71, and a computer program 72 stored in the memory 71 and executable on at least one processor 70; when the processor 70 executes the computer program 72, the steps in the above-mentioned method embodiments are implemented.

[0097] The processing device 7 may include, but is not limited to, a processor 70 and a memory 71. Those skilled in the art will appreciate that Figure 7 It is only an example of processing equipment and does not constitute a limitation of the processing equipment. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access equipment, buses, etc.

[0098] The processor 70 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0099] In some embodiments, the memory 71 may be an internal storage unit of the processing device 7, such as a hard disk or memory of the processing device. In other embodiments, the memory 71 may also be an external storage device of the processing device, such as a plug-in hard disk equipped on the processing device, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. Further, the memory 71 may also include both an internal storage unit of the processing device and an external storage device. The memory 71 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as program codes of computer programs, etc. The memory 71 may also be used to temporarily store data that has been output or is to be output.

[0100] Exemplarily, the computer program 72 may be divided into one or more modules / units, one or more modules / units are stored in the memory 71, and executed by the processor 70 to complete the present application. One or more modules / units may be a series of computer program instruction segments capable of completing specific functions, and the instruction segments are used to describe the execution process of the computer program 72 in the processing device 7.

[0101] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0102] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0103] If the aforementioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium; when the computer program is executed by the processor, the steps of the above-mentioned various method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. Computer-readable media include: any entity or device that can carry computer program code to a device / terminal device, a recording medium, a computer memory, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), an electric carrier signal, a telecommunication signal, and a software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0104] An embodiment of the present application further provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments can be implemented.

[0105] An embodiment of the present application provides a computer program product. When the computer program product runs on a terminal device, the terminal device can implement the steps in the above-mentioned various method embodiments.

[0106] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0107] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0108] In the embodiments provided in the present application, it should be understood that the disclosed devices / equipment and methods can be implemented in other ways. For example, the device / equipment embodiments described above are only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0109] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0110] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A laser cutting method, which can be applied to cutting a profile having a web and a wing, characterized in that: The laser cutting method comprises: Cut the web by laser, and form slag discharge holes on the web by laser processing; The wing plate is cut by laser on the outer side of the wing plate to form a wing plate cutting seam, and the wing plate cutting seam is communicated with the slag discharge hole.

2. The laser cutting method according to claim 1, characterized in that: The method of cutting the web by laser and forming a slag discharge hole on the web by laser includes: The web is cut by laser along the width direction of the profile, and a slag discharge hole is processed by laser on one side of the web in the width direction.

3. The laser cutting method according to claim 1, characterized in that: The cutting of the web by laser comprises: Cutting the web along the width direction of the profile at a first length position in the length direction of the web by laser; The step of cutting the wing panel by laser on the outer side of the wing panel comprises: The wing panel is cut at the first length position on the outer side of the wing panel along the height direction of the profile by laser.

4. The laser cutting method according to claim 1, characterized in that: The method of cutting the web by laser and forming a slag discharge hole on the web by laser includes: Cutting the web in a direction parallel to the height direction of the profile by laser until cutting reaches a first designated position of the web; Starting from the first designated position, cutting the web by laser at an angle greater than 0° and less than 90° to the height direction until cutting to a second designated position of the web; Starting from the second designated position, a slag removal hole is machined in the web by laser.

5. The laser cutting method according to claim 4, characterized in that: The step of machining a slag discharge hole on the web by laser from the second designated position comprises: Starting from the second designated position, a slag removal hole is processed in the web in the direction of cutting the residual material by laser.

6. The laser cutting method according to claim 4, characterized in that: The cutting of the web by laser at an angle greater than 0° and less than 90° to the height direction until the web is cut to a second designated position includes: The web is cut by laser at an angle greater than 0° and less than 90° to the height direction and at a reduced cutting speed until the web is cut to a second designated position.

7. The laser cutting method according to any one of claims 1 to 6, characterized in that: The profile includes H-shaped steel or L-shaped steel; the slag discharge hole includes a rectangular hole or a waist-shaped hole; the slag discharge hole leads to the connection transition between the web and the wing plate.

8. A laser cutting device, which can be used to cut profiles with webs and wing plates, characterized in that: The laser cutting device comprises: A web cutting module, used for: cutting the web by laser, and processing slag discharge holes on the web by laser; The wing plate cutting module is used to: cut the wing plate by laser on the outer side of the wing plate along the height direction of the profile to form a wing plate cutting seam, and the wing plate cutting seam is connected to the slag discharge hole.

9. A processing equipment, characterized in that: The method comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the laser cutting method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the laser cutting method according to any one of claims 1 to 7 is implemented.

Images