IC chip laser ablation printing equipment

Abstract

The invention discloses IC chip laser ablation printing equipment, and relates to the field of chip word removal processing, the IC chip laser ablation printing equipment comprises a top seat, the bottom of the top seat is mounted at the top of a receiving box, and vibration disc feeding modules are sequentially mounted at the top of the top seat from left to right; a material taking manipulator; the laser ablation module is used for carrying out laser ablation operation on the chip so as to carry out auxiliary laser ablation cleaning on characters on the surface of the chip; the cleaning module is used for carrying out auxiliary cleaning on particulate matters generated by ablation of the surface of the chip; an ink jet module; and a drying module and a double-rail transfer module. Laser ablation replaces manual polishing or chemical corrosion to carry out character removal treatment, the character removal uniformity is ensured through accurate and controllable light spot energy distribution of laser, meanwhile, laser character removal belongs to a non-contact mode, mechanical damage to a chip is avoided, the laser character removal becomes a mainstream choice due to high precision and stability, and the laser character removal efficiency is greatly improved. The ablation depth can be self-defined without causing extra damage to the IC chip.

Description

Technical Field

[0001] The invention relates to the field of chip de-characterization processing, in particular to an IC chip laser ablation printing device. Background Art

[0002] Chip production is a highly sophisticated and complex process. It begins with the design phase, where engineers use professional design software to draw the circuit diagram of the chip. These designs are then converted into a series of tiny patterns that are precisely engraved on silicon wafers using photolithography. During the photolithography process, a laser or electron beam is used to expose the photoresist, and then the pattern is transferred to the silicon wafer through chemical treatment. Next, electronic components such as transistors, resistors, and capacitors are formed on the silicon wafer through steps such as ion implantation and etching. This series of steps requires extremely high precision and cleanliness to ensure the performance and reliability of the chip. After completing all process steps, the silicon wafer is cut into individual chips, packaged, and tested. During the production process of IC chips, products often need to be reworked due to NG, model changes, or the need to remove the characters on the surface of the IC chip for reprocessing and use for the protection of sensitive information.

[0003] Existing methods for processing characters on the surface of IC chips mostly include physical character removal methods such as grinding and chemical corrosion, but these two character removal methods are inefficient and are only suitable for small batches of IC products. Due to process limitations, product damage may occur, and they cannot be applied to small-sized products (less than 1mm×1mm). They cannot adapt well to different work requirements. Therefore, an IC chip laser ablation printing device is needed to assist in solving this problem. Summary of the invention

[0004] Based on this, the purpose of the present invention is to provide an IC chip laser ablation printing device to solve the existing IC chip surface character processing methods, most of which include physical character removal methods such as grinding and chemical corrosion, but these two character removal methods are inefficient and are only suitable for small batches of IC products with character removal. Due to process limitations, product damage may occur, and they cannot be applied to small-sized products (less than 1mm×1mm), and cannot adapt well to technical problems of different work requirements.

[0005] To achieve the above object, the present invention provides the following technical solution: an IC chip laser ablation printing device, comprising a top seat, the bottom of the top seat is installed on the top of the receiving box, and the top of the top seat is installed from left to right in sequence

[0006] The vibration plate feeding module is used to place the chips and make the chips resonate under the action of vibration, becoming active and easy to move, thereby achieving directional movement and orderly arrangement of the chips in a certain direction;

[0007] A material-retrieving robot, which is used to assist in the adsorption and clamping of chips;

[0008] A laser ablation module is used to perform laser ablation on the chip, thereby assisting in laser ablation cleaning of text on the chip surface;

[0009] A cleaning module, which is used to assist in cleaning particles generated by ablation on the chip surface;

[0010] The inkjet module is used to brush ink on the grooves produced by ablation on the chip surface to cover the ablation traces and perform targeted spraying;

[0011] The drying module is used to assist in drying the chip surface after spraying.

[0012] And the drying module, inkjet module, cleaning module, laser ablation module, material taking robot and vibration plate feeding module are connected through

[0013] The dual-track transfer module is used to assist in the transportation of chips, ensuring that the chips can be stably transported and processed.

[0014] The present invention is further configured such that the double-track transfer module includes a first linear module symmetrically installed at the top of the top seat, and a carrying plate is protruding and slidingly provided on one side edge adjacent to the two first linear modules, a lifting cylinder is installed on the carrying plate, and a material shuttle assembly for carrying the chip is installed at the top of the lifting cylinder.

[0015] The present invention is further configured such that the material shuttle assembly includes a lower material shuttle installed at the top of a lifting cylinder and an upper material shuttle installed at the top of the lower material shuttle, and chip slots for placing chips are equidistantly provided at the top of the upper material shuttle, and the sides of the lower material shuttle and the upper material shuttle are connected and fixed by a fixing assembly.

[0016] The present invention is further configured such that the fixing assembly includes a hook fixed on the side of the upper shuttle and a hinged seat fixed on the side of the lower shuttle, a pressing plate is hingedly installed on the hinged seat, a pull ring is hingedly installed on the outer side of the pressing plate, and the pull ring is engaged with the hook.

[0017] The present invention is further configured such that the drying module comprises an inverted U-shaped drying box installed on the top of the top seat, the drying box is provided with a through slot for the double-track transfer module to pass through, and an infrared heating plate for auxiliary drying is installed at the top of the through slot.

[0018] The present invention is further configured such that the inkjet module comprises a second linear module mounted on the top of the top seat, a connecting plate is slidably provided on the second linear module, and an inkjet assembly for auxiliary inkjet is mounted on the connecting plate.

[0019] The present invention is further configured such that the cleaning module includes a third linear module vertically installed at the top of the top seat, a protruding plate is slidably installed on the third linear module, a dust suction seat is installed on the protruding plate, electrostatic brushes are symmetrically protruding on both sides of the bottom of the dust suction seat, a negative pressure connecting hole is installed at the top of the dust suction seat, and the negative pressure connecting hole is connected to the negative pressure pipe.

[0020] The present invention is further configured as follows: the laser ablation module includes a base plate installed at the top of the top seat and a laser ablation machine for laser ablation, wherein a mounting plate protrudes from the top of the base plate, a mounting seat is arranged at the top of the mounting plate, a screw rod is rotatably arranged on the mounting seat, a second slider is sleeved and installed on the screw rod, the second slider is threadedly engaged with the screw rod, a rotating rod is fixed to one end of the screw rod extending out of the mounting seat, a slide seat is protruding from the bottom of the laser ablation machine, a first slide seat is slidably arranged on the slide seat, and a support rod is hingedly installed between the first slide seat and the second slide seat and the slide seat and the mounting plate.

[0021] The present invention is further configured as follows: the material picking robot includes a material picking motor installed at the top of a top seat, an extension plate is installed at the front end of the machine shaft of the material picking motor, a connecting seat is installed at the top of one end of the extension plate away from the material picking motor, a material picking nozzle is slidably installed on the connecting seat, the material picking nozzle is connected to a negative pressure pump, a second C-shaped mounting rod is rotatably embedded in one end of the connecting seat, a first mounting rod is hingedly installed at one end of the second mounting rod away from the connecting seat, and one end of the first mounting rod away from the second mounting rod is fixed to the top of the material picking motor.

[0022] The present invention is further configured such that the vibration plate feeding module comprises a frame body and a bearing platform installed at the top of the top seat, a loading plate is installed at the top of the frame body, and a receiving plate is installed at the top of the bearing platform.

[0023] In summary, the present invention mainly has the following beneficial effects: the present invention uses a laser ablation module installed at the top of the top seat, and can perform auxiliary laser ablation and de-characterization processing on the chip inside the discharge trough through the laser ablation machine during operation. The rotating rod is rotated, and the rotating rod drives the screw rod to rotate as a whole. The second slider is threadedly matched with the screw rod, so that the second slider moves as a whole. The support rods are crossed, so as to adjust the overall height of the laser ablation machine. During operation, the overall height of the laser ablation machine can be adjusted according to different work requirements. During operation, laser ablation can be used instead of manual grinding or chemical corrosion to perform de-characterization processing. The energy distribution of the laser spot can be precisely controlled to ensure the uniformity of text removal. At the same time, laser de-characterization is non-contact and will not cause mechanical damage to the chip. Laser de-characterization has become the mainstream choice due to its high precision and stability. It can achieve customized ablation depth without causing additional damage to the IC chip, ensuring that the chip de-characterization work can be carried out smoothly and stably.

[0024] The double-track transfer module on the top of the top seat can further improve the overall work efficiency during operation. The detachable design of the loading shuttle on the first linear module can replace the loading shuttles of different sizes according to different work requirements during operation. It can adapt to the removal of IC chips in various packaging forms, such as BGA, DIP, SOP, TSSOP, SOT, SOJ, QFP, QFN, TO, etc., further improving the practicality of the device.

[0025] Through the cleaning module installed on the top of the top seat, the electrostatic brush can be used to assist in electrostatic adsorption of the particles generated by ablation during operation, and after electrostatic adsorption, the electrostatically adsorbed impurities can be assisted to be sucked out by negative pressure adsorption. The height of the electrostatic brush can also be adjusted by adjusting the height of the protruding plate on the third linear module according to different work requirements during operation, so that the impurities can be effectively adsorbed and filtered during operation, and the ablated particles can be prevented from affecting subsequent inkjet and drying operations as much as possible. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the present invention;

[0027] Figure 2 This is a schematic diagram of the structure after the double-track transfer module is installed on the top seat of the present invention;

[0028] Figure 3 For the present invention Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0029] Figure 4 It is a side view of the vibrating plate feeding module of the present invention;

[0030] Figure 5It is a structural schematic diagram of the material taking manipulator of the present invention;

[0031] Figure 6 It is a side view of the laser ablation module of the present invention;

[0032] Figure 7 It is a structural schematic diagram of the cleaning module of the present invention;

[0033] Figure 8 It is a structural schematic diagram of the inkjet module of the present invention;

[0034] Fig. 9 It is a structural schematic diagram of the drying module of the present invention.

[0035] In the figure: 1. top seat; 2. receiving box; 3. leveling knob; 4. double track transfer module; 41. first linear module; 42. material shuttle assembly; 421. lower material shuttle; 422. upper material shuttle; 423. material discharge trough; 424. fixing assembly; 4241. pull ring; 4242. hinge seat; 4243. pressing plate; 4244. hook; 43. lifting cylinder; 5. drying module; 51. drying box; 52. infrared heating plate; 6. inkjet module; 61. second linear module; 62. connecting plate; 63. inkjet assembly; 7. cleaning module; 71. third Linear module; 72, dust suction seat; 73, negative pressure connecting hole; 74, electrostatic brush; 8, laser ablation module; 81, laser ablation machine; 82, first slider; 83, second slider; 84, mounting seat; 841, bottom plate; 85, screw rod; 851, rotating rod; 86, support rod; 9, material picking robot; 91, material picking motor; 92, first mounting rod; 93, second mounting rod; 94, extension plate; 95, material picking nozzle; 10, vibration plate feeding module; 101, frame body; 102, loading plate; 103, bearing platform; 104, containing plate. DETAILED DESCRIPTION

[0036] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0037] An IC chip laser ablation printing device, such as Figure 1 , Figure 2 and Figure 3As shown, it includes a top seat 1, the bottom of the top seat 1 is installed on the top of the receiving box 2, and a leveling knob 3 is threadedly installed on the bottom of the receiving box 2, which can effectively adjust the overall levelness of the receiving box 2 during operation, and a double-track transfer module 4 is installed on the top of the top seat 1 for assisting the conveying and processing of chips to ensure that the chips can be stably conveyed and processed. The double-track transfer module 4 includes a first linear module 41 symmetrically installed on the top of the top seat 1, and a carrying plate is protruding and slidingly provided on one side of the two adjacent first linear modules 41, and a lifting cylinder 43 is installed on the carrying plate. A material shuttle assembly 42 for carrying chips is installed at the top of the lifting cylinder 43, and the material shuttle assembly 42 includes a lower material shuttle 421 installed at the top of the lifting cylinder 43 and a loading shuttle 422 installed at the top of the lower material shuttle 421, and chip slots for placing chips are equidistantly provided at the top of the loading shuttle 422.

[0038] Through the double-track transfer module 4 on the top of the top seat 1, the overall work efficiency can be further improved through the double-track form during operation. It is equipped with a lifting cylinder 43 to realize double-station avoidance and alternating operation, which greatly improves the operation speed and ensures that subsequent chip work can proceed smoothly.

[0039] The sides of the lower material shuttle 421 and the upper material shuttle 422 are connected and fixed by a fixing assembly 424, and the fixing assembly 424 includes a hook 4244 fixed on the side of the upper material shuttle 422 and a hinge seat 4242 fixed on the side of the lower material shuttle 421, and a pressing plate 4243 is hingedly installed on the hinge seat 4242, and a pull ring 4241 is hingedly installed on the outer side of the pressing plate 4243, and the pull ring 4241 and the hook 4244 are engaged and snap-fitted.

[0040] By setting up a detachable design of the material shuttle assembly 42, it is possible to replace the loading shuttle 422 of different sizes according to different work requirements during work, and it can adapt to the removal of IC chips in various packaging forms, such as BGA, DIP, SOP, TSSOP, SOT, SOJ, QFP, QFN, TO, etc., thereby further improving the practicability of the device.

[0041] Reference Figure 1 and Figure 4 As shown, a vibration plate feeding module 10 is installed at the far left of the top of the top seat 1. The vibration plate feeding module 10 includes a frame body 101 and a supporting platform 103 installed at the top of the top seat 1. A loading plate 102 is installed at the top of the frame body 101, and a receiving plate 104 is installed at the top of the supporting platform 103. A voice coil motor for vibration is installed inside the receiving plate 104.

[0042] The voice coil motor provided inside the carrier platform 103 is activated by the vibration plate feeding module 10, so that the chips are directed to move in a certain direction and arranged in an orderly manner. The chips are assisted in lighting by the lighting lamp on the top of the carrier platform 103, and the chip grabbing mechanism is assisted in lighting during the lighting process.

[0043] Reference Figure 1 and Figure 5 As shown, a material picking robot 9 for assisting the adsorption and clamping of the chip is installed at the top of the top seat 1. The material picking robot 9 includes a material picking motor 91 installed at the top of the top seat 1. An extension plate 94 is installed at the front end of the shaft of the material picking motor 91. A connecting seat is installed at the top of the end of the extension plate 94 away from the material picking motor 91. A material picking nozzle 95 is slidably installed on the connecting seat. The material picking nozzle 95 is connected to the negative pressure pump. A C-shaped second mounting rod 93 is rotatably embedded at one end of the connecting seat. A first mounting rod 92 is hingedly installed at one end of the second mounting rod 93 away from the connecting seat, and an end of the first mounting rod 92 away from the second mounting rod 93 is fixed at the top of the material picking motor 91.

[0044] Through the set material picking robot 9, the material picking motor 91 drives the extension plate 94 to rotate as a whole, and during the rotation of the extension plate 94, it drives the connecting seat to rotate as a whole, and moves the material picking nozzle 95 to the top of the accommodating tray 104, and captures and processes the image of the surrounding environment of the top of the accommodating tray 104 through the perspective camera, so as to provide rich environmental information for the material picking robot 9, and extend the material picking nozzle 95 as a whole when the material picking nozzle 95 reaches the corresponding position, thereby assisting in picking up the chip. After picking up the material, the material picking motor 91 rotates and makes the material picking nozzle 95 reach the top of the material shuttle assembly 42, and places the chip in the receiving hole discharge trough 423, thereby completing the material picking and discharging work, and using a high-precision and high-flexibility 4-axis robot for picking and discharging. The product on the vibration disk can be positioned based on vision, and rotation correction can be performed after picking up the material.

[0045] Reference Figure 1 and Figure 6 As shown, a laser ablation module 8 for laser ablation of the chip is installed at the top of the top seat 1, so as to assist in laser ablation and cleaning of the text on the surface of the chip. The laser ablation module 8 includes a base plate 841 installed at the top of the top seat 1 and a laser ablation machine 81 for laser ablation. A mounting plate protrudes from the top of the base plate 841, and a mounting seat 84 is arranged at the top of the mounting plate. A screw rod 85 is rotatably arranged on the mounting seat 84, and a second slider 83 is sleeved and installed on the screw rod 85. The second slider 83 is threadedly matched with the screw rod 85, and a rotating rod 851 is fixed to one end of the screw rod 85 extending out of the mounting seat 84. A slide seat is protruding from the bottom of the laser ablation machine 81, and a first slider 82 is slidably arranged on the slide seat. A support rod 86 is hingedly installed between the first slider 82 and the second slider 83 as well as between the slide seat and the mounting plate.

[0046] By installing the laser ablation module 8 at the top of the top seat 1, the laser ablation machine 81 can be used to assist the laser ablation and remove characters on the chip inside the discharge trough 423 during operation. The rotating rod 851 is rotated, and the rotating rod 851 drives the screw rod 85 to rotate as a whole. The second slider 83 and the screw rod 85 are threadedly matched, so that the second slider 83 moves as a whole, and then the support rod 86 is crossed, so that the overall height of the laser ablation machine 81 is adjusted. During operation, the overall height of the laser ablation machine 81 can be adjusted according to different work requirements. During operation, laser ablation can be used instead of manual grinding or chemical corrosion to remove characters. The precise and controllable spot energy distribution of the laser can ensure the uniformity of character removal. At the same time, laser character removal is non-contact and will not cause mechanical damage to the chip. Laser character removal has become the mainstream choice due to its high precision and stability. It can achieve customized ablation depth without causing additional damage to the IC chip, ensuring that the chip character removal work can be carried out smoothly and stably.

[0047] Reference Figure 1 and Figure 7 As shown, a cleaning module 7 is provided at the top of the top seat 1 for assisting in cleaning particles generated by ablation on the chip surface. The cleaning module 7 includes a third linear module 71 vertically installed at the top of the top seat 1. A protruding plate is slidably installed on the third linear module 71, and a dust suction seat 72 is installed on the protruding plate. Electrostatic brushes 74 are symmetrically protruded on both sides of the bottom of the dust suction seat 72. A negative pressure connecting hole 73 is installed at the top of the dust suction seat 72, and the negative pressure connecting hole 73 is connected to the negative pressure pipe.

[0048] Through the cleaning module 7 installed on the top of the top seat 1, the electrostatic brush 74 can be used to assist in electrostatic adsorption of the particles generated by ablation during operation, and after electrostatic adsorption, the electrostatically adsorbed impurities can be assisted to be sucked out by negative pressure adsorption. During operation, the height of the electrostatic brush 74 can be adjusted by adjusting the height of the protruding plate on the third linear module 71 according to different work requirements, so that the impurities can be effectively adsorbed and filtered during operation, and the ablated particles can be prevented from affecting subsequent inkjet and drying operations as much as possible.

[0049] Reference Figure 1 and Figure 8 As shown, an inkjet module 6 is installed at the top of the top seat 1 for brushing ink on the grooves produced by ablation on the chip surface to cover the traces of ablation and perform targeted spraying. The inkjet module 6 includes a second linear module 61 installed at the top of the top seat 1, and a connecting plate 62 is slidably arranged on the second linear module 61, and an inkjet component 63 for auxiliary inkjet is installed on the connecting plate 62.

[0050] By setting up the inkjet module 6, the inkjet component 63 can be used to brush ink on the surface of the product after the characters are removed, where there are still traces of ablation left on the surface, to cover the traces of ablation. The inkjet component 63 is equipped with a visual camera to visually capture the grooves on the surface of the IC chip, and then perform targeted spraying, which is highly adaptable to different character patterns of different products.

[0051] Reference Figure 1 and Fig. 9 As shown, a drying module 5 is installed at the top of the top seat 1, and the drying module 5 includes an inverted U-shaped drying box 51 installed at the top of the top seat 1. The drying box 51 is provided with a through slot for the double-track transfer module 4 to pass through, and an infrared heating plate 52 for auxiliary drying is installed at the top of the through slot. A programmable controller for controlling several modules is installed inside the top seat 1. The model of the controller is S7-300, and it can be used but not limited to this model.

[0052] Through the provided drying module 5, the chip after brushing ink needs to enter the drying box 51, and the chip is heated and dried to harden the ink; the drying box 51 uses an infrared heating plate 52 for heating and drying. The infrared heating plate 52 uses microcrystalline glass as a substrate and a metal oxide as a nano-electric heating coating on the surface. It heats in the form of radiation and heat conduction. Different temperatures can be set for products in different packaging forms. In order to avoid oxidation of the product surface, nitrogen can be flushed in after the two sides are semi-closed.

[0053] Working principle of the present invention:

[0054] During operation, the raw materials are placed on the top of the loading tray 102, and part of the raw materials are placed into the receiving tray 104. The corresponding loading shuttle 422 is replaced according to the size of the chip, and the loading shuttle 422 is placed on the unloading shuttle 421. The pull ring 4241 is hung on the hook 4244, and the pressing plate 4243 is pressed, so that the pull ring 4241 is hung on the hook 4244, thereby completing the overall fixing of the loading shuttle 422.

[0055] The voice coil motor provided inside the carrier platform 103 is started, so that the chips are directed to move in a certain direction and arranged in an orderly manner, and the chips are auxiliary illuminated by the lighting lamp on the top of the carrier platform 103, and the chip grabbing mechanism is also auxiliary illuminated during the illumination process;

[0056] Start the material picking motor 91, which drives the extension plate 94 to rotate as a whole. During the rotation of the extension plate 94, it drives the connecting seat to rotate as a whole, and moves the material picking nozzle 95 to the top of the accommodating tray 104. The top of the accommodating tray 104 is captured and processed by the perspective camera to provide rich environmental information for the material picking robot 9. When the material picking nozzle 95 reaches the corresponding position, the material picking nozzle 95 is extended as a whole, thereby assisting in picking up the chip. After picking up the material, the material picking motor 91 rotates and makes the material picking nozzle 95 reach the top of the material shuttle assembly 42, and places the chip in the receiving hole discharge trough 423, thereby completing the material picking and discharging work.

[0057] Start the first linear module 41, and move the material shuttle assembly 42 to the top of the laser ablation module 8. Use the laser ablation machine 81 to perform auxiliary laser ablation and de-characterization processing on the chip inside the material receiving hole discharge trough 423. Rotate the rotating rod 851. The rotating rod 851 drives the screw rod 85 to rotate as a whole. The second slider 83 and the screw rod 85 are threadedly matched, so that the second slider 83 moves as a whole. Keen recognizes that the support rod 86 is crossed, so as to adjust the overall height of the laser ablation machine 81. During work, the overall height of the laser ablation machine 81 can be adjusted according to different work requirements to improve the overall practicality of the device.

[0058] After laser ablation is completed, the first linear module 41 is started to make the material shuttle assembly 42 pass under the cleaning module 7. During the movement of the material shuttle assembly 42, the electrostatic brush 74 is used to assist in electrostatic adsorption of the particles generated by ablation. After electrostatic adsorption, negative pressure adsorption can be used to assist in sucking out the electrostatically adsorbed impurities. During operation, the height of the electrostatic brush 74 can be adjusted by adjusting the height of the protruding plate on the third linear module 71 according to different work requirements.

[0059] When the first linear module 41 moves to the inkjet module 6, it stops and the second linear module 61 is started to move the connecting plate 62 and the inkjet assembly 63 to the specified position. The inkjet assembly 63 can be used to brush ink on the surface of the product after the characters are removed, where there are still traces of ablation left on the surface to cover the traces of ablation. The inkjet assembly 63 is equipped with a visual camera to visually capture the grooves on the surface of the IC chip, and then perform targeted spraying, which is highly adaptable to different character patterns of different products.

[0060] After inkjet printing, the shuttle assembly 42 on the first linear module 41 passes through the drying module 5, and then the chip in the shuttle assembly 42 is assisted in heating and drying by the infrared heating plate 52 inside the drying module 5 to harden the ink. During operation, when the two shuttle assemblies 42 are close to each other, the lifting cylinder 43 can be started to lift the shuttle assembly 42, so that the shuttle assemblies 42 on the two first linear modules 41 can move up and down alternately.

[0061] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. An IC chip laser ablation printing device, comprising a top seat (1), characterized in that: The bottom of the top seat (1) is installed on the top of the receiving box (2), and the top of the top seat (1) is installed with A vibration plate feeding module (10) is used to place chips and make the chips resonate under the action of vibration, so that they become active and easy to move, thereby achieving directional movement and orderly arrangement of the chips in a certain direction; A material taking robot (9), which is used to assist in adsorption and clamping of the chip; A laser ablation module (8) is used to perform a laser ablation operation on the chip, thereby performing auxiliary laser ablation cleaning on the text on the chip surface; A cleaning module (7) is used to assist in cleaning particles generated by ablation on the chip surface; An inkjet module (6) is used to apply ink to the grooves produced by ablation on the chip surface to cover the ablation traces and to perform targeted spraying; The drying module (5) is used to perform auxiliary drying treatment on the chip surface after spraying. and a drying module (5), an inkjet module (6), a cleaning module (7), a laser ablation module (8), a material taking manipulator (9) and a vibration plate feeding module (10) connected therethrough. The double-track transfer module (4) is used to assist in the conveying and processing of the chips, thereby ensuring that the chips can be stably conveyed and processed.

2. The IC chip laser ablation printing device according to claim 1, characterized in that: The double-track transfer module (4) comprises a first linear module (41) symmetrically mounted on the top of the top seat (1), a supporting plate is slidably provided on one side of the two adjacent first linear modules (41), a lifting cylinder (43) is mounted on the supporting plate, and a material shuttle assembly (42) for carrying chips is mounted on the top of the lifting cylinder (43).

3. The IC chip laser ablation printing device according to claim 2, characterized in that: The material shuttle assembly (42) includes a lower material shuttle (421) installed at the top of a lifting cylinder (43) and an upper material shuttle (422) installed at the top of the lower material shuttle (421). Chip slots for placing chips are equidistantly provided at the top of the upper material shuttle (422). The side edges of the lower material shuttle (421) and the upper material shuttle (422) are connected and fixed by a fixing assembly (424).

4. The IC chip laser ablation printing device according to claim 3, characterized in that: The fixing assembly (424) includes a hook (4244) fixed on the side of the upper shuttle (422) and a hinge seat (4242) fixed on the side of the lower shuttle (421), a pressing plate (4243) is hingedly mounted on the hinge seat (4242), a pull ring (4241) is hingedly mounted on the outer side of the pressing plate (4243), and the pull ring (4241) and the hook (4244) are engaged and snap-fitted.

5. The IC chip laser ablation printing device according to claim 1, characterized in that: The drying module (5) comprises an inverted U-shaped drying box (51) installed on the top of the top seat (1), and a through slot for the double-track transfer module (4) to pass through is opened on the drying box (51), and an infrared heating plate (52) for auxiliary drying is installed at the top of the through slot.

6. The IC chip laser ablation printing device according to claim 1, characterized in that: The inkjet module (6) comprises a second linear module (61) mounted on the top of the top seat (1), a connecting plate (62) being slidably arranged on the second linear module (61), and an inkjet assembly (63) for auxiliary inkjet is mounted on the connecting plate (62).

7. The IC chip laser ablation printing device according to claim 1, characterized in that: The cleaning module (7) comprises a third linear module (71) vertically mounted on the top of the top seat (1); a protruding plate is slidably mounted on the third linear module (71); a dust suction seat (72) is mounted on the protruding plate; electrostatic brushes (74) are symmetrically protruding on both sides of the bottom of the dust suction seat (72); a negative pressure connecting hole (73) is mounted on the top of the dust suction seat (72); and the negative pressure connecting hole (73) is connected to a negative pressure pipe.

8. The IC chip laser ablation printing device according to claim 1, characterized in that: The laser ablation module (8) comprises a bottom plate (841) mounted on the top of the top seat (1) and a laser ablation machine (81) for laser ablation, wherein a mounting plate protrudes from the top of the bottom plate (841), a mounting seat (84) is arranged on the top of the mounting plate, a screw rod (85) is rotatably arranged on the mounting seat (84), a second slider (83) is sleeved and mounted on the screw rod (85), the second slider (83) and the screw rod (85) are threadedly matched, a rotating rod (851) is fixed to one end of the screw rod (85) extending out of the mounting seat (84), a slide seat is protruding from the bottom of the laser ablation machine (81), a first slider (82) is slidably arranged on the slide seat, and a support rod (86) is hingedly installed between the first slider (82) and the second slider (83) and the slide seat and the mounting plate.

9. The IC chip laser ablation printing device according to claim 1, characterized in that: The material picking robot (9) includes a material picking motor (91) installed at the top of the top seat (1), an extension plate (94) is installed at the front end of the machine shaft of the material picking motor (91), a connecting seat is installed at the top of one end of the extension plate (94) away from the material picking motor (91), a material picking nozzle (95) is slidably installed on the connecting seat, and the material picking nozzle (95) is connected to a negative pressure pump, and a C-shaped second mounting rod (93) is rotatably embedded and installed at one end of the connecting seat, and a first mounting rod (92) is hingedly installed at one end of the second mounting rod (93) away from the connecting seat, and one end of the first mounting rod (92) away from the second mounting rod (93) is fixed at the top of the material picking motor (91).

10. The IC chip laser ablation printing device according to claim 1, characterized in that: The vibration plate feeding module (10) comprises a frame body (101) and a bearing platform (103) installed at the top of a top seat (1). A loading plate (102) is installed at the top of the frame body (101), and a receiving plate (104) is installed at the top of the bearing platform (103).

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