Adhesive and tape for semiconductor chip cutting and preparation method

Abstract

The present invention relates to an adhesive and tape for semiconductor chip cutting and a preparation method. The raw materials of the adhesive for semiconductor chip cutting include, by mass, 100 parts of (meth) acrylic acid and (meth) acrylic acid ester prepolymer; 0.1-5 parts of multifunctional acrylic acid; 0.5-5 parts of a first photoinitiator; wherein the (meth) acrylic acid and (meth) acrylic acid ester prepolymer are polymerized from (meth) acrylic acid ester soft monomer, (meth) acrylic acid ester hard monomer, carboxyl group-containing monomer, epoxy group-containing monomer, functional monomer, and a second photoinitiator. The adhesive can be used to prepare an adhesive tape, has good adhesion to quartz glass and chips, and after being pasted to quartz glass and chips and placed in a high temperature environment for a period of time, the peeling force does not increase much, is easy to peel and has no residual adhesive, and the adhesive also has the advantage of being easy to apply.

Description

Technical Field

[0001] The present invention relates to the technical field of adhesives, and in particular to an adhesive and an adhesive tape for semiconductor chip cutting and a preparation method thereof. Background Art

[0002] In the semiconductor chip manufacturing process, it is a necessary step to cut the semiconductor wafer to obtain semiconductor chips. In the cutting process, dicing tape is often used to protect, fix and support the chip. After the cutting is completed, the cut chip is directly lifted up from the dicing tape by a pin. The semiconductor chip dicing tape needs to meet the requirements of being able to firmly bond the wafer and chip during cutting, and to facilitate the peeling and picking of the chip after cutting, and no residual adhesive is left.

[0003] In order to ensure strong adhesion and peeling and picking, traditional semiconductor chip cutting tapes are usually post-processed after cutting to reduce the viscosity of the tape, so as to achieve the effect of easy peeling and picking. The most commonly used viscosity reduction technologies are UV viscosity reduction and heating viscosity reduction. Among them, UV viscosity reduction technology requires UV radiation equipment, which has high maintenance costs, and the shadow part cannot be radiated for viscosity reduction; the heating viscosity reduction method has high requirements for the heat resistance of the tape and components, and requires the tape to maintain stable viscosity in the high temperature environment during the chip cutting process. UV viscosity reduction and heating viscosity reduction tapes need to be post-processed after cutting before the chip can be peeled and picked up; tapes without UV viscosity reduction and heating viscosity reduction functions, after the chip cutting process (usually accompanied by high temperature), the adhesion between the tape and the wafer chip is greatly improved, which is not conducive to peeling and picking up, and it is easy to produce residual glue. Adhesives and tapes used for semiconductor chip cutting have problems such as complex post-processing, limited application range, and easy to produce residual glue. Summary of the invention

[0004] In view of the shortcomings of the prior art, the first object of the present invention is to provide an adhesive for semiconductor chip dicing, which can be used to prepare an adhesive tape, has good adhesion to quartz glass and chips, and after being pasted to quartz glass and chips and placed in a high temperature environment for a period of time, the peeling force does not increase much, is easy to peel and has no residual adhesive, and the adhesive also has the advantage of being easy to coat.

[0005] A second object of the present invention is to provide a method for preparing an adhesive for semiconductor chip dicing, which has the advantage of simple steps.

[0006] The third object of the present invention is to provide a semiconductor chip dicing tape, which has good adhesion to quartz glass and chips, and the peeling force of the tape does not increase much after being placed in a high temperature environment for a period of time after being pasted to quartz glass and chips, and is easy to peel off without residual adhesive.

[0007] A fourth object of the present invention is to provide a method for preparing a semiconductor chip dicing tape, which has the advantage of high efficiency.

[0008] To achieve the first purpose of the present invention, the present invention provides an adhesive for semiconductor chip cutting. The raw materials of the adhesive for semiconductor chip cutting include, by weight: 100 parts of (meth)acrylic acid and (meth)acrylate prepolymer; 0.1 to 5 parts of multifunctional acrylate; 0.5 to 5 parts of a first photoinitiator; wherein the (meth)acrylic acid and (meth)acrylate prepolymer are polymerized from a (meth)acrylate soft monomer, a (meth)acrylate hard monomer, a carboxyl-containing monomer, an epoxy-containing monomer, a functional monomer, and a second photoinitiator.

[0009] In some embodiments of the present invention, the (meth)acrylate soft monomer includes at least one of ethyl acrylate, n-butyl acrylate, 2-ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, and lauryl (meth)acrylate.

[0010] In some embodiments of the present invention, the (meth)acrylate hard monomer includes at least one of methyl methacrylate, cyclohexyl (meth)acrylate, furfuryl (meth)acrylate, and isobornyl (meth)acrylate.

[0011] In some embodiments of the present invention, the carboxyl group-containing monomer includes at least one of acrylic acid and methacrylic acid.

[0012] In some embodiments of the present invention, the epoxy-containing monomer includes at least one of glycidyl acrylate and glycidyl (meth)acrylate.

[0013] In some embodiments of the present invention, the functional monomer includes at least one of hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, acrylamide, N,N-dimethylacrylamide, and N-acryloylmorpholine.

[0014] In some embodiments of the present invention, the second photoinitiator includes at least one of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, 2-hydroxy-2-methylpropiophenone, 1-hydroxycyclohexyl phenyl ketone, phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide, 2,2-dimethoxy-2-phenylacetophenone, and methyl benzoylformate.

[0015] In some embodiments of the present invention, the (meth)acrylate soft monomer is a mixture of n-butyl acrylate and 2-ethylhexyl (meth)acrylate, and the mass ratio of n-butyl acrylate to 2-ethylhexyl (meth)acrylate is 1:(1-2).

[0016] In some embodiments of the present invention, the multifunctional acrylate includes at least one of trimethylolpropane triacrylate, pentaerythritol triacrylate, isopentaerythritol tetraacrylate, polydipentaerythritol pentaacrylate, and polydipentaerythritol hexaacrylate.

[0017] In some embodiments of the present invention, the first photoinitiator includes at least one of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, 2-hydroxy-2-methylpropiophenone, 1-hydroxycyclohexyl phenyl ketone, phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide, 2,2-dimethoxy-2-phenylacetophenone, and methyl benzoylformate.

[0018] In some embodiments of the present invention, the first photoinitiator and the second photoinitiator are of the same or different types.

[0019] In some embodiments of the present invention, the mass ratio of the (meth)acrylate soft monomer, the (meth)acrylate hard monomer, the carboxyl group-containing monomer, the epoxy group-containing monomer, the functional monomer and the second photoinitiator is 75: (5-20): (5-20): (2-8): (1-6): (0.5-5).

[0020] In some embodiments of the present invention, the viscosity of the (meth)acrylic acid and (meth)acrylate prepolymer at 25° C. is 4000-8000 cps.

[0021] In some embodiments of the present invention, the mass ratio of the (meth)acrylate soft monomer, the (meth)acrylate hard monomer, the carboxyl group-containing monomer, the epoxy group-containing monomer, the functional monomer and the second photoinitiator is 75: (8-10): (8-10): (3-5): (2-4): (0.5-1).

[0022] In some embodiments of the present invention, the viscosity of the (meth)acrylic acid and (meth)acrylate prepolymer at 25° C. is 4900-5500 cps.

[0023] To achieve the second purpose of the present invention, the present invention also provides a method for preparing the above-mentioned adhesive for semiconductor chip cutting, comprising the following steps: Step 1: obtaining (meth)acrylic acid and (meth)acrylate prepolymers; Step 2: adding multifunctional acrylate and a first photoinitiator to the (meth)acrylic acid and (meth)acrylate prepolymers and stirring them evenly to obtain an adhesive for semiconductor chip cutting.

[0024] In some embodiments of the present invention, the specific steps of step one are: putting the (meth)acrylate soft monomer, the (meth)acrylate hard monomer, the carboxyl group-containing monomer, the epoxy group-containing monomer, the functional monomer and the second photoinitiator into a reaction kettle, stirring them evenly, and irradiating them with a UV lamp under nitrogen protection to obtain (meth)acrylic acid and (meth)acrylate prepolymers.

[0025] To achieve the third purpose of the present invention, the present invention also provides a semiconductor chip cutting tape, which includes a first release film, an adhesive layer and a second release film bonded in sequence, and the adhesive layer is formed by UV curing the above-mentioned semiconductor chip cutting adhesive.

[0026] To achieve the fourth object of the present invention, the present invention also provides a method for preparing the above-mentioned semiconductor chip dicing tape, comprising the following steps: Step A: uniformly coating the semiconductor chip dicing adhesive between the first release film and the second release film and curing the tape by UV irradiation, wherein the total energy of the UV light irradiation is 1000 to 5000 mJ / cm 2 , the UV light wavelength is 320-400nm; Step B: placing the UV curing tape obtained in Step A under a humidity environment of 45±1°C and 50±20%RH for several days to obtain a tape for cutting semiconductor chips.

[0027] In some embodiments of the present invention, the first release film is a PET release film with a thickness of 50-100 μm.

[0028] In some embodiments of the present invention, the second release film is a PET release film with a thickness of 70 to 125 μm.

[0029] In some embodiments of the present invention, the thickness of the adhesive layer is 400-1000 μm.

[0030] Compared with the prior art, the present invention can achieve the following beneficial effects:

[0031] The adhesive and tape for semiconductor chip cutting of the present invention have good adhesion to quartz glass and chips, and after the quartz glass and chips are pasted and placed in a high temperature environment for 2 hours, the peeling force increases slightly, and it is easy to peel without residual adhesive. In addition, the present invention uses UV bulk polymerization to prepare the adhesive, and manufactures the tape by UV light curing coating, which has the advantages of simple operation, high coating efficiency, environmental protection and energy saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the structure of an embodiment of the adhesive tape of the present invention. In the figure, 1 is a first release film, 2 is an adhesive layer, and 3 is a second release film.

[0033] The present invention is further described in detail below with reference to the accompanying drawings and specific implementation modes. DETAILED DESCRIPTION

[0034] The embodiment of the present invention provides an adhesive for cutting semiconductor chips, which is mainly used to protect, fix and support semiconductor wafers and semiconductor chips during the process of cutting semiconductor wafers to manufacture semiconductor chips, and facilitates chip peeling and picking up after cutting, without residual adhesive left. Of course, the adhesive for cutting semiconductor chips of the present invention can also be used in other occasions where objects need to be fixed for processing and peeled off after processing.

[0035] Specifically, the adhesive for semiconductor chip dicing of the present embodiment comprises, by weight, 100 parts of (meth)acrylic acid and (meth)acrylate prepolymer; 0.1 to 5 parts of multifunctional acrylate; and 0.5 to 5 parts of a first photoinitiator.

[0036] Among them, (meth)acrylic acid and (meth)acrylate prepolymers are polymerized from (meth)acrylate soft monomers, (meth)acrylate hard monomers, carboxyl-containing monomers, epoxy-containing monomers, functional monomers, and a second photoinitiator. The molecular chains of the (meth)acrylic acid and (meth)acrylate prepolymers obtained by polymerization may contain links formed by methacrylic acid, acrylic acid, (meth)acrylate, or methacrylate monomers, so they are called (meth)acrylic acid and (meth)acrylate prepolymers. The raw materials of (meth)acrylic acid and (meth)acrylate prepolymers contain a photoinitiator. (Meth)acrylic acid and (meth)acrylate prepolymers can be obtained by photocuring, such as ultraviolet light curing, from (meth)acrylate soft monomers, (meth)acrylate hard monomers, carboxyl-containing monomers, epoxy-containing monomers, functional monomers, and a second photoinitiator.

[0037] The multifunctional acrylate refers to an acrylate compound having at least two alkenyl groups. The mass fraction of the multifunctional acrylate can be 0.1, 0.2, 0.3, 0.4, 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, etc., relative to 100 parts of (meth)acrylic acid and (meth)acrylate prepolymer.

[0038] The first photoinitiator is a chemical substance that can initiate polymerization of (meth)acrylate soft monomers, (meth)acrylate hard monomers, carboxyl-containing monomers, epoxy-containing monomers, and functional monomers under the action of light. The mass fraction of the first photoinitiator can be 0.5 parts, 1 parts, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc. relative to 100 parts of (meth)acrylic acid and (meth)acrylate prepolymer.

[0039] The adhesive for cutting semiconductor chips of this embodiment can be used to prepare adhesive tape, and has good adhesion to quartz glass and chips. Moreover, after the quartz glass and chips are pasted and placed in a high temperature environment for many hours, the peeling force does not increase much, and it is easy to peel and has no residual adhesive. The adhesive for cutting semiconductor chips is easy to apply, which is conducive to the preparation of adhesive tape. In addition, the adhesive for cutting semiconductor chips does not need to use organic solvents, which is safe and environmentally friendly.

[0040] In some examples, the adhesive for semiconductor chip cutting of this embodiment is mainly composed of the following components by weight: 100 parts of (meth) acrylic acid and (meth) acrylic acid ester prepolymer; 0.1-5 parts of multifunctional acrylic acid; 0.5-5 parts of first photoinitiator. In addition to (meth) acrylic acid and (meth) acrylic acid ester prepolymer, multifunctional acrylic acid and first photoinitiator, the adhesive for semiconductor chip cutting may also contain a small amount of auxiliary agents.

[0041] In some examples, the adhesive for semiconductor chip cutting of the present embodiment is composed of the following components by weight: 100 parts of (meth)acrylic acid and (meth)acrylate prepolymer; 0.1-5 parts of multifunctional acrylate; 0.5-5 parts of first photoinitiator. The adhesive for semiconductor chip cutting does not contain other raw materials except (meth)acrylic acid and (meth)acrylate prepolymer, multifunctional acrylate and first photoinitiator, and except for unavoidable impurities, and has a simpler composition.

[0042] In some examples, the (meth)acrylate soft monomer includes at least one of ethyl acrylate, n-butyl acrylate, 2-ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, and lauryl (meth)acrylate. The molecules of the above monomers contain an alkyl side group with a carbon number greater than 2, so that the prepolymer and the polymer of the adhesive have good flexibility.

[0043] In some examples, the (meth)acrylate soft monomer is a mixture of n-butyl acrylate and 2-ethylhexyl (meth)acrylate, and the mass ratio of n-butyl acrylate to 2-ethylhexyl (meth)acrylate is 1:(1-2). By mixing a variety of (meth)acrylate soft monomers, the flexibility of the prepolymer and the polymer can be better improved and the viscosity can be reduced. In some examples, the mass ratio of n-butyl acrylate to 2-ethylhexyl (meth)acrylate can be 1:1.5.

[0044] In some examples, the (meth)acrylate hard monomer includes at least one of methyl methacrylate, cyclohexyl (meth)acrylate, furfuryl (meth)acrylate, and isobornyl (meth)acrylate. The molecules of the above monomers contain methyl or ring, so that the prepolymer and the polymer of the adhesive have good rigidity. By cooperating with the (meth)acrylate soft monomer and the (meth)acrylate hard monomer, a polymer with suitable flexibility and rigidity can be obtained to meet the purpose of the tape.

[0045] In some examples, the carboxyl-containing monomer includes at least one of acrylic acid and methacrylic acid. The above monomers contain carboxyl and alkenyl groups, the carboxyl group can increase the intermolecular force and react with epoxy groups, etc., and the alkenyl group can participate in the copolymerization of (meth)acrylate soft monomers, (meth)acrylate hard monomers, etc.

[0046] In some examples, the epoxy-containing monomer includes at least one of glycidyl acrylate and glycidyl (meth)acrylate. The above monomers contain epoxy and alkenyl groups, the epoxy group can self-polymerize and undergo ring-opening polymerization with carboxyl, amino, hydroxyl, etc., and the alkenyl group can participate in copolymerization with (meth)acrylate soft monomers, (meth)acrylate hard monomers, etc.

[0047] In some examples, the functional monomer includes at least one of hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, acrylamide, N,N-dimethylacrylamide, and N-acryloylmorpholine. The above monomers contain alkenyl and functional groups such as hydroxyl and amino. The functional groups such as hydroxyl and amino can react with functional groups such as carboxyl and epoxy. The alkenyl can participate in the copolymerization of (meth)acrylate soft monomers, (meth)acrylate hard monomers, etc.

[0048] The prepolymer obtained by copolymerizing the above-mentioned monomers has a suitable viscosity, is convenient for uniform mixing and coating of the adhesive, and has good adhesion and peeling performance after high temperature.

[0049] In some examples, the second photoinitiator includes at least one of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, 2-hydroxy-2-methyl propiophenone, 1-hydroxycyclohexyl phenyl ketone, phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide, 2,2-dimethoxy-2-phenylacetophenone, and methyl benzoylformate. The above photoinitiator can initiate monomer polymerization under the action of light such as ultraviolet light. The above photoinitiator also has the advantages of easy availability of raw materials.

[0050] In some examples, the multifunctional acrylate includes at least one of trimethylolpropane triacrylate, pentaerythritol triacrylate, isopentaerythritol tetraacrylate, polydipentaerythritol pentaacrylate, and polydipentaerythritol hexaacrylate, and the multifunctional acrylate has three olefin groups and can increase the crosslinking degree of the adhesive.

[0051] In some examples, the first photoinitiator includes at least one of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, 2-hydroxy-2-methyl propiophenone, 1-hydroxycyclohexyl phenyl ketone, phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide, 2,2-dimethoxy-2-phenylacetophenone, and methyl benzoylformate. The above photoinitiator can promote the polymerization of the prepolymer and the multifunctional acrylate to obtain a solid or semi-solid adhesive layer for application to the tape.

[0052] In some examples, the first photoinitiator and the second photoinitiator are of the same type, which is convenient for preparing raw materials. In other examples, the first photoinitiator and the second photoinitiator are of different types, as long as they can initiate photopolymerization.

[0053] In some examples, the mass ratio of the first photoinitiator to the second photoinitiator is (3-5):1, so as to obtain the desired prepolymer and polymer viscosity and molecular weight.

[0054] In some examples, the mass ratio of (meth)acrylate soft monomer, (meth)acrylate hard monomer, carboxyl group-containing monomer, epoxy group-containing monomer, functional monomer and second photoinitiator is 75: (5-20): (5-20): (2-8): (1-6): (0.5-5). When the amount of each monomer is within the above range, the resulting prepolymer has good adhesion and peeling performance after high temperature.

[0055] In some examples, the mass ratio of (meth)acrylate soft monomer, (meth)acrylate hard monomer, carboxyl monomer, epoxy monomer, functional monomer and second photoinitiator is 75: (8-10): (8-10): (3-5): (2-4): (0.5-1), and when the amount of each monomer is within the above range, the resulting prepolymer has better adhesion and peeling performance after high temperature. In some examples, the mass ratio of (meth)acrylate soft monomer, (meth)acrylate hard monomer, carboxyl monomer, epoxy monomer, functional monomer and second photoinitiator is 75: 8: 8: 5: 4: (0.5-1), and when the amount of each monomer is within the above range, the peeling force of the tape after high temperature is further reduced.

[0056] In some examples, the viscosity of (meth)acrylic acid and (meth)acrylate prepolymers at 25°C is 4000-8000 cps. When the viscosity of (meth)acrylic acid and (meth)acrylate prepolymers is within the above range, it is convenient for raw material mixing and reaction polymerization, and it is convenient for adhesive coating. The (meth)acrylic acid and (meth)acrylate prepolymers with the desired viscosity can be obtained by adjusting the prepolymerization time and the type and amount of prepolymer monomers.

[0057] In some examples, the viscosity of (meth)acrylic acid and (meth)acrylate prepolymer at 25°C is 4900-5500 cps. When the viscosity of (meth)acrylic acid and (meth)acrylate prepolymer is within the above range, it is more conducive to reducing the peeling force of the tape after high temperature. In some examples, the viscosity of (meth)acrylic acid and (meth)acrylate prepolymer at 25°C is 4950-5200 cps.

[0058] In some examples, the preparation method of the adhesive for semiconductor chip cutting includes the following steps: Step 1: obtaining (meth) acrylic acid and (meth) acrylic acid ester prepolymer, which can be purchased or made by yourself; Step 2: adding multifunctional acrylic acid and a first photoinitiator to (meth) acrylic acid and (meth) acrylic acid ester prepolymer and stirring them evenly to obtain the adhesive for semiconductor chip cutting. It can be seen that the preparation method of the adhesive for semiconductor chip cutting has simple steps.

[0059] In some examples, the specific steps of step one are: (meth) acrylate soft monomer, (meth) acrylate hard monomer, carboxyl-containing monomer, epoxy-containing monomer, functional monomer and second photoinitiator are put into a reaction kettle, stirred evenly, and irradiated with UV lamp under nitrogen protection to obtain (meth) acrylic acid and (meth) acrylate prepolymer. The above preparation method is simple, safe, environmentally friendly and easy to control. The viscosity of (meth) acrylic acid and (meth) acrylate prepolymer can be tested during the reaction, and the reaction is stopped when the viscosity of the prepolymer reaches the target viscosity.

[0060] In some examples, the present embodiment also provides a semiconductor chip dicing tape, such as Figure 1As shown, the tape for semiconductor chip cutting includes a first release film 1, an adhesive layer 2 and a second release film 3 which are sequentially bonded. The adhesive layer 2 is sandwiched between the first release film 1 and the second release film 3, and the first release film 1 and the second release film 3 protect and support the adhesive layer 2. The adhesive layer 2 is formed by UV curing of the above-mentioned adhesive for semiconductor chip cutting, and the present embodiment also provides an adhesive layer 2 formed by UV curing of the above-mentioned adhesive for semiconductor chip cutting. The adhesive layer 2 is solid or semi-solid, can be stably stored, transported and easy to use. For example, one of the first release film 1 and the second release film 3 is peeled off, the semiconductor wafer is bonded to the adhesive layer 2, and then the other of the first release film 1 and the second release film 3 is peeled off, and the adhesive layer 2 is attached to the workbench, so that the semiconductor wafer can be fixed on the workbench.

[0061] In some examples, the first release film 1 is a PET release film, the raw material of which is easily available, and the thickness thereof is 50-100 μm. It is a light release film and is easy to peel off.

[0062] In some examples, the second release film is a PET release film, the raw material of which is easily available, and the thickness is 70 to 125 μm. It is a heavy release film and can provide good support.

[0063] In some examples, the thickness of the adhesive layer is 400-1000 μm, which can provide good bonding and is easy to prepare.

[0064] In some examples, the present embodiment also provides a method for preparing a semiconductor chip dicing tape, comprising the following steps: Step A: uniformly coating the semiconductor chip dicing adhesive between a first release film and a second release film and curing the tape by UV irradiation, wherein the total energy of the UV light irradiation is 1000 to 5000 mJ / cm 2 , UV light wavelength is 320-400nm; Step B: Place the UV curing tape obtained in step A in a humidity environment of 45±1°C and 50±20%RH for several days to obtain a semiconductor chip dicing tape. The tape is manufactured by UV light curing coating, which has the advantages of high coating efficiency, environmental protection and energy saving.

[0065] The adhesive and tape for semiconductor chip dicing of the present invention will be further described in detail below through specific examples. In the following examples and comparative examples, the raw materials with the same name have the same type and source.

[0066] Preparation of adhesives and tapes of Examples 1 to 3 and Comparative Examples 1 to 3

[0067] Prepare the raw materials of each embodiment and each comparative example as shown in Table 1 and Table 2. Weigh (meth)acrylate soft monomer, (meth)acrylate hard monomer, carboxyl group-containing monomer, epoxy group-containing monomer, functional monomer and second photoinitiator by mass, put the above raw materials into a reaction kettle, stir evenly, and irradiate with UV lamp under nitrogen protection to obtain (meth)acrylic acid and (meth)acrylate prepolymer; add multifunctional acrylate and first photoinitiator to the obtained (meth)acrylic acid and (meth)acrylate prepolymer and stir evenly to obtain adhesive for semiconductor chip cutting.

[0068] Take the adhesive composition of the above embodiment and comparative example, and use the sandwich coating method to evenly coat the adhesive of 500 μm thickness between the 75 μm PET light release film and the 75 μm PET heavy release film, and perform UV irradiation curing under a 365 nm light source, and the total energy of UV light irradiation is 2000 mJ / cm 2 The UV-cured tape was then placed in a 45±1°C, 50±20%RH humidity environment for 3 days to obtain a semiconductor chip dicing tape.

[0069] Table 1 List of adhesive ingredients

[0070]

[0071]

[0072] Table 2 Adhesive composition (parts by mass)

[0073]

[0074]

[0075] Physical property test

[0076] Prepolymer viscosity test: refer to GB / T 2794-2022;

[0077] Holding force test: refer to GB / T 4851-2014;

[0078] 180° peeling force test of quartz glass plate: refer to GB / T2792-2014; after the tape is pasted on the quartz glass, place it in a 200℃ environment for 2 hours, take it out and let it stand at room temperature for 2 hours to cool down, and then test the peeling force after high temperature;

[0079] Residual adhesive test: After the quartz plate and chip are bonded with adhesive tape, they are placed in a 200°C environment for 2 hours. After being taken out and left to cool down at room temperature, the adhesive tape is removed and the residual adhesive is visually inspected under a microscope.

[0080] Table 3 Prepolymer and tape test results

[0081]

[0082]

[0083] It can be seen from the test results in Table 3 that the embodiments of the present invention use carboxyl-containing monomers, epoxy-containing monomers and other functional monomers in the acrylic adhesive composition, and after coating and UV curing, the obtained tape is aged at 45°C for 3 days. The tape has good adhesion to quartz glass and excellent retention performance. After the tape is attached to the quartz glass and the chip and placed in a high temperature environment of 200°C, the peeling force does not increase much, and it is easy to remove without colloid residue.

[0084] In Comparative Example 1, due to the low content of carboxyl-containing monomers and the lack of epoxy-containing monomers and the small amount of functional monomers, the peeling force at room temperature is not high, the retention performance is poor, and the degree of internal crosslinking is low after aging at 45°C. After aging at a high temperature of 200°C, the peeling force increases significantly, it is not easy to remove and there is residual glue. In Comparative Example 2, due to the lack of epoxy-containing monomers and functional monomers, the degree of internal crosslinking is low after aging at 45°C, the peeling force increases significantly after aging at a high temperature of 200°C, it is not easy to remove and there is residual glue. In Comparative Example 3, due to the lack of carboxyl-containing monomers, the degree of internal crosslinking is low after aging at 45°C, the peeling force increases significantly after aging at a high temperature of 200°C, it is not easy to remove and there is residual glue.

[0085] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. An adhesive for semiconductor chip dicing, characterized in that The raw materials of the adhesive for semiconductor chip dicing include, by weight: 100 parts of (meth)acrylic acid and (meth)acrylate prepolymer; 0.1 to 5 parts of multifunctional acrylate; 0.5 to 5 parts of the first photoinitiator; The (meth)acrylic acid and (meth)acrylate prepolymer are polymerized from (meth)acrylate soft monomer, (meth)acrylate hard monomer, carboxyl-containing monomer, epoxy-containing monomer, functional monomer and second photoinitiator.

2. The adhesive for semiconductor chip dicing according to claim 1, characterized in that The (meth)acrylate soft monomer includes at least one of ethyl acrylate, n-butyl acrylate, 2-ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, and lauryl (meth)acrylate; The (meth)acrylate hard monomer includes at least one of methyl methacrylate, cyclohexyl (meth)acrylate, hydrogen furfuryl (meth)acrylate, and isobornyl (meth)acrylate; The carboxyl group-containing monomer includes at least one of acrylic acid and methacrylic acid; The epoxy-containing monomer includes at least one of glycidyl acrylate and glycidyl (meth)acrylate; The functional monomer includes at least one of hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, acrylamide, N,N-dimethylacrylamide, and N-acryloylmorpholine; The second photoinitiator includes at least one of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, 2-hydroxy-2-methylpropiophenone, 1-hydroxycyclohexyl phenyl ketone, phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide, 2,2-dimethoxy-2-phenylacetophenone, and methyl benzoylformate.

3. The adhesive for semiconductor chip dicing according to claim 2, characterized in that The (meth)acrylate soft monomer is a mixture of n-butyl acrylate and 2-ethylhexyl (meth)acrylate, and the mass ratio of the n-butyl acrylate to the 2-ethylhexyl (meth)acrylate is 1:(1-2).

4. The adhesive for semiconductor chip dicing according to any one of claims 1 to 3, characterized in that The multifunctional acrylate includes at least one of trimethylolpropane triacrylate, pentaerythritol triacrylate, isopentaerythritol tetraacrylate, polydipentaerythritol pentaacrylate, and polydipentaerythritol hexaacrylate; The first photoinitiator includes at least one of diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, 2-hydroxy-2-methyl propiophenone, 1-hydroxycyclohexyl phenyl ketone, phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide, 2,2-dimethoxy-2-phenyl acetophenone, and methyl benzoylformate; The first photoinitiator and the second photoinitiator are of the same or different types.

5. The adhesive for semiconductor chip dicing according to any one of claims 1 to 3, characterized in that The mass ratio of the (meth)acrylate soft monomer, the (meth)acrylate hard monomer, the carboxyl group-containing monomer, the epoxy group-containing monomer, the functional monomer and the second photoinitiator is 75: (5-20): (5-20): (2-8): (1-6): (0.5-5); The viscosity of the (meth)acrylic acid and (meth)acrylate prepolymer at 25° C. is 4000-8000 cps.

6. The adhesive for semiconductor chip dicing according to claim 5, characterized in that The mass ratio of the (meth)acrylate soft monomer, the (meth)acrylate hard monomer, the carboxyl group-containing monomer, the epoxy group-containing monomer, the functional monomer and the second photoinitiator is 75: (8-10): (8-10): (3-5): (2-4): (0.5-1); The viscosity of the (meth)acrylic acid and (meth)acrylate prepolymer at 25° C. is 4900-5500 cps.

7. The method for preparing a semiconductor chip dicing adhesive according to any one of claims 1 to 6, characterized in that The following steps are involved: Step 1: obtaining (meth)acrylic acid and (meth)acrylate prepolymer; Step 2: Add multifunctional acrylate and a first photoinitiator to the (meth)acrylic acid and (meth)acrylate prepolymer and stir evenly to obtain an adhesive for semiconductor chip dicing.

8. The preparation method according to claim 7, characterized in that The specific steps of step one are: The (meth)acrylate soft monomer, the (meth)acrylate hard monomer, the carboxyl group-containing monomer, the epoxy group-containing monomer, the functional monomer and the second photoinitiator are added into a reaction kettle, stirred evenly, and then irradiated with a UV lamp under nitrogen protection to obtain (meth)acrylic acid and (meth)acrylate prepolymer.

9. A semiconductor chip dicing tape, characterized in that It comprises a first release film, an adhesive layer and a second release film which are bonded in sequence, wherein the adhesive layer is formed by UV curing an adhesive for semiconductor chip cutting, and the adhesive for semiconductor chip cutting is the adhesive for semiconductor chip cutting according to any one of claims 1 to 6 or the adhesive for semiconductor chip cutting prepared by the preparation method according to claim 7 or 8.

10. The method for preparing a semiconductor chip dicing tape according to claim 9, characterized in that The steps include: Step A: uniformly coating the semiconductor chip dicing adhesive between the first release film and the second release film and curing the adhesive tape by UV irradiation, wherein the total energy of the UV light irradiation is 1000 to 5000 mJ / cm 2 , UV light wavelength is 320~400nm; Step B: placing the UV curing tape obtained in step A in a humidity environment of 45±1°C and 50±20%RH for several days to obtain a tape for semiconductor chip dicing; The first release film is a PET release film with a thickness of 50 to 100 μm; The second release film is a PET release film with a thickness of 70 to 125 μm; The thickness of the adhesive layer is 400-1000 μm.

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