Wafer double-side coating device and double-station wafer coating device

Abstract

The application discloses a wafer double-sided coating device and a double-station wafer coating device. The wafer double-sided coating device comprises a working cavity, a carrier and a target material. The carrier comprises a receiving part, a magnetic attraction part, a turnover driving part and a moving mechanism. After receiving the wafer, the carrier can fix and turn over the wafer. The wafer front and back surfaces can be coated in turn by the turnable carrier and the target material. The carrier can magnetically attract the receiving part by the magnetic attraction part, so that the wafer can be fixed, the wafer can be conveniently positioned and turned over, wafer damage caused by unstable pressure can be avoided, and the reliability of wafer turning movement is ensured. The double-station wafer coating device comprises a working cavity, two groups of carriers and a target material. The two groups of carriers are arranged in the working cavity along the vertical direction at intervals. The target material is arranged between the two groups of carriers and has two target surfaces. By arranging the double-sided target material and arranging one group of carriers respectively facing the target material, the double-sided coating of two groups of wafers can be simultaneously carried out in one working cavity, and the coating efficiency is further improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer coating, in particular to a wafer double-side coating device and a double-station wafer coating device. BACKGROUND

[0002] Wafer coating is a technology of covering one or more layers of thin films on the surface of a wafer. These thin films can be different materials such as metals, non-metals, and compounds, and have specific electrical, optical, or mechanical properties. Through coating, the performance of the wafer can be improved, making it more suitable for various application scenarios.

[0003] Some special processes require coating both sides of the wafer. In the prior art, if double-side coating of the wafer is required, two process chambers are usually provided, one of which is used to realize front-side coating of the wafer, and after the front-side coating is completed, the wafer is sent into the other process chamber for back-side coating. In this way, the coating of both sides of the wafer is finally completed.

[0004] Configuring two process chambers increases the layout cost of the equipment, increases the floor area of the equipment, and also increases the moving steps of the wafer, which increases the possibility of contamination of the wafer and easily affects the process effect. SUMMARY

[0005] The application aims to overcome the deficiencies in the prior art and provides a wafer double-side coating device and a double-station wafer coating device.

[0006] The application provides a wafer double-side coating device, which comprises a working chamber for providing space for wafer coating, a carrier arranged in the working chamber for receiving the wafer and capable of fixing and turning the wafer, and a target material arranged in the working chamber and facing the carrier. During the coating process, metal atoms sputtered from the target material fall on the surface of the wafer to realize the coating of the wafer. The carrier comprises a receiving part for receiving the wafer, the middle part of the receiving part being open to expose the back surface of the wafer; a magnetic attraction part for attracting the receiving part to fix the wafer between the receiving part and the magnetic attraction part, the middle part of the magnetic attraction part being open to expose the front surface of the wafer; a turning driving part for driving the receiving part to rotate; and a moving mechanism for controlling the magnetic attraction part to move closer to or away from the receiving part. During coating, the wafer falls on the receiving part, the moving mechanism controls the magnetic attraction part to move closer to the receiving part so that the magnetic attraction part attracts the receiving part and fixes the wafer. After the front surface of the wafer facing the target material is coated, the turning driving part drives the receiving part to rotate, and the receiving part and the magnetic attraction part cooperate to turn the wafer to expose the back surface of the wafer to the target material.

[0007] Further, the receiving member is arranged in a circular ring shape, one side of the receiving member is provided with a gap, and the mechanical hand used for transferring the wafer can translate and lift through the gap; the mechanical hand translates to be able to deliver the wafer to above the receiving member; the mechanical hand lowers to be able to drop the wafer on the receiving member from top to bottom; the mechanical hand rises to be able to lift the wafer on the receiving member from bottom to top.

[0008] Further, the receiving member is arranged in a stepped shape, the inner ring of the receiving member is recessed downward to form a circular groove for accommodating the wafer.

[0009] Further, the outer ring of the receiving member is protruded compared with the inner ring, one of the top surface of the magnetic member facing the outer ring and the bottom surface of the magnetic member facing the receiving member is provided with a positioning hole, and the other is provided with a positioning pin, and the positioning hole and the positioning pin correspond one by one; and / or, the magnetic member is arranged in an inverted stepped shape, the inner ring of the magnetic member is recessed upward to form a clamping groove for facilitating the insertion of the receiving member.

[0010] Further, the moving mechanism comprises: a top plate for contacting the magnetic member; a lifting driving member for driving the top plate to move in the vertical direction; when coating, the wafer falls on the receiving member, the lifting driving member drives the top plate to lower the magnetic member to approach and adsorb the receiving member; the lifting driving member drives the top plate to continue to lower to separate the top plate from the magnetic member, so that the magnetic member remains on the receiving member and can rotate with the receiving member; after coating is completed, the lifting driving member drives the top plate to rise, and the top plate gradually approaches to lift the magnetic member.

[0011] Further, one of the top plate and the magnetic member is provided with a positioning hole, and the other is provided with a positioning pin, and the positioning hole and the positioning pin correspond one by one.

[0012] Further, the wafer double-sided coating device further comprises a shielding member, the shielding member is arranged in the working cavity and surrounds the receiving member and the magnetic member; the target surface of the target material is exposed in the shielding member and faces the receiving member and the magnetic member; the shielding member can prevent the metal atoms sputtered from the target material from adhering to the inner wall of the working cavity; the working cavity is provided with a wafer inlet and outlet, and the shielding member is provided with an avoidance inlet and outlet, the avoidance inlet and outlet is opposite to the wafer inlet and outlet, and the wafer can approach or away from the carrier through the wafer inlet and outlet and the avoidance inlet and outlet.

[0013] The application also provides a double-station wafer coating device, which comprises a working cavity for providing a space for wafer coating, two groups of carriers arranged in the working cavity in a vertical direction, the carriers being used for receiving wafers and capable of fixing and turning over the wafers, and a target material arranged between the two groups of carriers, the target material having two target surfaces arranged in a vertical direction and respectively facing one group of carriers.

[0014] Further, the target material comprises a support for mounting the two target surfaces, an electricity connection mechanism for connecting a power supply to the two target surfaces so that the power supply supplies power to the two target surfaces simultaneously, and a cooling mechanism for cooling the target surfaces.

[0015] Further, the support comprises an upper mounting ring for mounting one of the target surfaces, a lower mounting ring for mounting the other target surface, and a support column arranged between the upper mounting ring and the lower mounting ring and used for connecting the upper mounting ring and the lower mounting ring, wherein the upper mounting ring and the lower mounting ring are both provided with cooling channels, the support column is provided with a communication channel for communicating the two cooling channels, one of the upper mounting ring and the lower mounting ring is provided with a coolant inlet, and the other is provided with a coolant outlet; during operation of the target material, the coolant can enter the cooling channels through the coolant inlet, flow through the upper mounting ring and the lower mounting ring, and then be discharged through the coolant outlet.

[0016] The application provides a wafer double-side coating device, which comprises a working cavity, a carrier and a target material, the carrier comprises a receiving member, a magnetic member, a turning-over driving member and a moving mechanism, and the carrier is capable of fixing and turning over a wafer after receiving the wafer; the target material and the turnable carrier can be used to realize sequential coating of the front and back surfaces of the wafer, the surface of the wafer to be coated can be quickly changed by turning over the wafer once in one working cavity, and the wafer can be reset by turning over the wafer again, so as to facilitate the wafer to be processed by downstream devices or facilitate the wafer information to be recorded; meanwhile, the carrier can magnetically attract the receiving member by the magnetic member, so as to fix the wafer, facilitate positioning and turning over of the wafer, avoid wafer damage caused by unstable pressure, and effectively ensure the reliability of wafer turning-over movement.

[0017] The application also provides a double-station wafer coating device, which comprises a working cavity, two groups of carriers and a target material, the two groups of carriers are arranged in the working cavity in a vertical direction, the target material is arranged between the two groups of carriers and has two target surfaces; the carrier comprises a material receiving part, a magnetic attraction part, a turnover driving part and a moving mechanism, and the carrier can fix and turn over the wafer after receiving the wafer; by arranging the double-sided target material and arranging one group of carriers respectively facing the target material, double-sided coating of two groups of wafers can be carried out in one working cavity at the same time, and the coating efficiency is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A structure schematic diagram of a wafer double-sided coating device provided by the application is shown in the figure.

[0019] Figure 2 A structure schematic diagram of a carrier is shown in the figure. Figure 1

[0020] Figure 3 A structure schematic diagram of a magnetic attraction part and a top plate in the carrier is shown in the figure. Figure 2

[0021] A structure schematic diagram of another carrier provided by the application is shown in the figure. Figure 4

[0022] A structure schematic diagram of a double-station wafer coating device provided by the application is shown in the figure. Figure 5

[0023] A structure schematic diagram of a double-station wafer coating device is shown in the figure. Figure 6 Figure 5 A structure schematic diagram of a target material in the double-station wafer coating device is shown in the figure.

[0024] DETAILED DESCRIPTION Figure 7 Figure 6 In order to make the above objectives, features and advantages of the application more apparent and understandable, the specific embodiments of the application are described in detail below with reference to the accompanying drawings. In the following description, a large number of specific details are set forth in order to facilitate a full understanding of the application. However, the application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the application, so the application is not limited to the specific embodiments disclosed below.

[0025] In order to make the above objectives, features and advantages of the application more apparent and understandable, the specific embodiments of the application are described in detail below with reference to the accompanying drawings. In the following description, a large number of specific details are set forth in order to facilitate a full understanding of the application. However, the application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the application, so the application is not limited to the specific embodiments disclosed below.

[0026] ​​​The application provides a wafer double-sided coating device, which comprises a working cavity 100 for providing a space for wafer coating, a carrier 200 arranged in the working cavity 100 and used for receiving a wafer, capable of fixing and turning over the wafer, and a target material 300 arranged in the working cavity 100 and facing the carrier 200; during coating, metal atoms sputtered from the target material 300 fall on the wafer surface to realize wafer coating.

[0027] Specifically refer to Figure 1 In the illustrated embodiment, the working cavity 100 is provided with a wafer inlet and outlet, and a wafer transfer mechanism such as a mechanical hand can transfer the wafer into the working cavity 100 through the wafer inlet and outlet. The target material 300 is arranged at the top of the working cavity 100, and the carrier 200 is arranged directly below the target material 300. The carrier 200 can cooperate with the mechanical hand to receive the wafer to be coated and make the wafer face the target material 300.

[0028] Further, the cavity wall of the working cavity 100 is provided with an air inlet channel and an air outlet channel. The air inlet channel is connected to a coating chamber and a gas supply device, and the air outlet channel is connected to the coating chamber and a gas extraction device. The gas supply device can pass the reaction gas for coating into the coating chamber through the air inlet channel, and the gas extraction device can extract the gas in the coating chamber through the air outlet channel. The gas supply device and the gas extraction device cooperate to maintain the required cavity pressure for coating.

[0029] Further, the target material 300 is connected to a radio frequency power supply. During operation, the radio frequency power supply supplies power to the target material 300, which can ionize the reaction gas after being powered on. After the reaction gas is ionized, the electrons bombard the target material 300, and the metal atoms on the surface of the target material 300 are bombarded out. The metal atoms move towards the carrier 200, deposit on the wafer surface, and realize coating.

[0030] The carrier 200 comprises a material receiving part 210 for receiving the wafer, the middle part of the material receiving part 210 is open to expose the back surface of the wafer; a magnetic attraction part 220 for attracting the material receiving part 210, thereby fixing the wafer between the material receiving part 210 and the magnetic attraction part 220, the middle part of the magnetic attraction part 220 is open to expose the front surface of the wafer; a turning drive part 230 for driving the material receiving part 210 to rotate; a moving mechanism 240 for controlling the magnetic attraction part 220 to approach or move away from the material receiving part 210; during coating, the wafer falls on the material receiving part 210, and the moving mechanism 240 controls the magnetic attraction part 220 to approach the material receiving part 210, so that the magnetic attraction part 220 attracts the material receiving part 210 and fixes the wafer; after the front surface of the wafer facing the target material 300 is coated, the turning drive part 230 drives the material receiving part 210 to rotate, and the material receiving part 210 and the magnetic attraction part 220 cooperate to turn over the wafer, so that the back surface of the wafer faces the target material 300.

[0031] Specifically refer to Figure 1 and Figure 2In the illustrated embodiment, the receiving member 210 is in the shape of a ring. When the receiving member 210 supports the wafer, the edge of the wafer is supported by the receiving member 210, and the front surface of the wafer is not blocked by the receiving member 210. The target film deposition area on the back surface of the wafer, except for the edge portion, is exposed by the open portion (e.g., the inner ring of the ring in the illustrated embodiment) of the receiving member 210.

[0032] It is easily understood that the receiving member 210 can be in any shape, as long as it can support the edge of the wafer and has an open portion to expose the target film deposition area on the back surface of the wafer.

[0033] The moving mechanism 240 can be any mechanism that can conveniently grab the magnetic member 220 and move the magnetic member 220 to approach or move away from the receiving member 210. The moving mechanism 240 can move the magnetic member 220 to approach or move away from the receiving member 210 by lifting or translating the magnetic member 220 after grabbing the magnetic member 220. The moving mechanism 240 can also move the magnetic member 220 to approach or move away from the receiving member 210 by flipping the magnetic member 220 along an arc or curved path after grabbing the magnetic member 220.

[0034] The present application does not limit the specific configuration of the moving mechanism 240 or the specific movement of the magnetic member 220, as long as the moving mechanism 240 can move the magnetic member 220 to approach or move away from the receiving member 210 and does not hinder the rotation of the magnetic member 220 with the receiving member 210.

[0035] The flipping driving member 230 can be any rotating driving member that can drive the receiving member 210 to rotate, such as a rotary cylinder or a motor. The fixed end of the flipping driving member 230 is arranged outside the working cavity 100, and the movable end is inserted into the working cavity 100 through a magnetic fluid or other sealing transmission structure and connected to the receiving member 210, which facilitates installation, debugging, and maintenance.

[0036] Continuing to refer to Figure 1 and Figure 2 In the illustrated embodiment, the magnetic member 220 is also in the shape of a ring. After the receiving member 210 receives the wafer, the moving mechanism 240 controls the magnetic member 220 to descend and land on the receiving member 210. The magnetic member 220 can abut against the edge of the wafer from the front surface, thereby fixing the wafer between the magnetic member 220 and the receiving member 210. At this time, the target film deposition area on the front surface of the wafer can be exposed directly below the target material 300 through the open portion of the magnetic member 220.

[0037] The magnetic member 220 can also be in any shape, as long as it can abut against the edge of the wafer and has an open portion to expose the target film deposition area on the front surface of the wafer.

[0038] In addition, the magnetic member 220 can be made of a magnet or embedded with a magnet. The magnetic member 220 has a magnetic property of attracting metal products. The receiving member 210 is made of a metal material or embedded with a metal material. When the magnetic member 220 is close to the receiving member 210, the magnetic member 220 can attract the receiving member 210, so as to reliably fix the wafer and avoid displacement or even falling of the wafer when the receiving member 210 is turned over.

[0039] It should be noted that, after the film is completed, in order to control the magnetic member 220 to separate from the receiving member 210 by the moving mechanism 240, the magnetic member 220 has a weak magnetic property. In this way, the wafer can be fixed while the magnetic force is not too large to damage the wafer.

[0040] In an embodiment, the moving mechanism 240 controls the magnetic member 220 to be away from the receiving member 210. After the receiving member 210 receives the wafer, the moving mechanism 240 controls the magnetic member 220 to be close to and abut against the receiving member 210. The magnetic member 220 attracts the receiving member 210, and the wafer is fixed between the magnetic member 220 and the receiving member 210. The front surface of the wafer is exposed below the target 300 through the open part of the magnetic member 220, and the back surface of the wafer is exposed outside through the open part of the receiving member 210. The target 300 is powered on, the reaction gas enters the working cavity 100, the film coating device works for a preset time, and the film coating on the front surface of the wafer is completed. The turning driving member 230 drives the receiving member 210 to rotate, and the magnetic member 220 rotates under the action of the magnetic force, thereby driving the wafer between the magnetic member 220 and the receiving member 210 to turn over. The back surface of the wafer is exposed below the target 300. The film coating device works again for a preset time, and the film coating on the back surface of the wafer is completed.

[0041] The wafer double-sided film coating device provided by the application realizes the sequential film coating on the front and back surfaces of the wafer by the turnable carrier 200 and the target 300. The film coating surface of the wafer can be quickly changed by one turning in one working cavity 100, and the wafer can be reset by the second turning, so as to facilitate the downstream to continue processing the wafer or recording the wafer information. Meanwhile, the carrier 200 is combined with the receiving member 210 having a metal material through the magnetic member 220 having a magnetic attraction property. The wafer can be fixed and conveniently turned over, and the wafer can be prevented from being damaged due to unstable pressure, thereby effectively ensuring the reliability of the wafer turning movement.

[0042] Optionally, the receiving member 210 is in a circular ring shape, and one side of the receiving member 210 is provided with a gap. A mechanical hand for transferring the wafer can translate and lift through the gap. The mechanical hand can translate to deliver the wafer above the receiving member 210, and can lower the wafer on the receiving member 210 from top to bottom. The mechanical hand can lift the wafer on the receiving member 210 from bottom to top.

[0043] Specifically, the receiving member 210 is located at one side of the wafer inlet and outlet, and a notch on the receiving member 210 is opposite to the wafer inlet and outlet. When loading, the robot carries the wafer through the wafer inlet and outlet to probe into the working cavity 100; the robot continuously translates inward, passes through the notch, and transports the wafer to above the receiving member 210, then the robot is lowered to make the wafer fall on the receiving member 210; after the robot is continuously lowered to be far away from the wafer and the receiving member 210, the robot is withdrawn to close the working cavity 100, and the coating operation can be started. After the coating on both sides of the wafer is completed, the robot enters the working cavity 100 again, so that the robot is lower than the receiving member 210 and is located directly below the wafer, the robot is gradually raised, the robot can lift the wafer to make the wafer separate from the receiving member 210, then the robot can carry the wafer to pass through the notch and leave the working cavity 100 from the wafer inlet and outlet.

[0044] Optionally, the receiving member 210 is arranged in a stepped manner, and an inner ring of the receiving member 210 is recessed downward to form a circular groove for accommodating the wafer.

[0045] Specifically, the receiving member 210 is arranged in a stepped manner, and an inner ring of the receiving member 210 is recessed downward to form a circular groove for accommodating the wafer. Figure 4 In the illustrated embodiment, the receiving member 210 is substantially annular, one side of the receiving member 210 facing the wafer inlet and outlet is provided with a notch, and a ring-shaped main body of the receiving member 210 is arranged in a stepped manner, an inner ring of the receiving member 210 is a lower step for supporting the wafer, and an outer ring of the receiving member 210 is an edge fence for limiting the position of the wafer.

[0046] When the receiving member 210 supports the wafer, the wafer can enter the recessed circular groove. The circular groove can limit the position of the wafer, ensure that the wafer is in a preset position, facilitate the magnetic attraction member 220 to accurately fix the wafer, and also can assist in fixing the wafer, avoid the wafer from radially displacing, and facilitate the wafer to receive the coating and turn over.

[0047] Further, the groove depth of the circular groove is slightly smaller than the thickness of the wafer. In this way, when the magnetic attraction member 220 is pressed downward, the wafer can be resisted, and the wafer is further fixed by the pressure.

[0048] Optionally, the outer ring of the receiving member 210 is protruded compared with the inner ring, one of a top surface of the magnetic attraction member 220 facing the outer ring and a bottom surface of the magnetic attraction member 220 facing the receiving member 210 is provided with a positioning hole, and the other is provided with a positioning pin, and the positioning hole and the positioning pin correspond to each other in one-to-one manner.

[0049] Specifically, the receiving member 210 is arranged in a stepped manner, and an inner ring of the receiving member 210 is recessed downward to form a circular groove for accommodating the wafer. Figure 4 In the illustrated embodiment, the receiving member 210 is arranged in a stepped manner, an inner ring is a lower step, and an outer ring is an upper step, and the outer ring can limit the wafer from outside to inside. The top surface of the outer ring of the receiving member 210 is provided with a plurality of spaced positioning holes, and the bottom surface of the magnetic attraction member 220 is correspondingly provided with a plurality of positioning pins. When the magnetic attraction member 220 is attracted to the receiving member 210, the positioning pins can be inserted into the corresponding positioning holes.

[0050] The matching arrangement of the positioning pin and the positioning hole can increase the fixing force when the receiving piece 210 is adsorbed by the magnetic piece 220, and can avoid the relative displacement between the receiving piece 210 and the magnetic piece 220 when the wafer is turned over. Meanwhile, the matching form of the positioning pin and the positioning hole can also calibrate the relative position of the receiving piece 210 and the magnetic piece 220, so as to ensure that the two are adsorbed in a preset state, thereby avoiding that the target film-coating area of the wafer is shielded when the two are misaligned.

[0051] Optionally, the magnetic piece 220 is arranged in an inverted step shape, and the inner circle of the magnetic piece 220 is upwardly recessed to form a clamping groove for facilitating the insertion of the receiving piece 210.

[0052] Specifically, refer to Figure 4 In the illustrated embodiment, the magnetic piece 220 is arranged in a cover shape, and the outer periphery of the magnetic piece 220 is provided with a cover edge extending downward. When the magnetic piece 220 adsorbs the receiving piece 210, the receiving piece 210 can be inserted into the clamping groove.

[0053] The clamping form of the receiving piece 210 and the magnetic piece 220 can also increase the fixing force when the two are adsorbed, and calibrate the relative position of the two when the two are adsorbed, thereby avoiding that the target film-coating area of the wafer is mistakenly shielded.

[0054] In an embodiment, the moving mechanism 240 is fixedly connected with the magnetic piece 220.

[0055] For example, the moving mechanism 240 adopts an electric cylinder, the cylinder body of the electric cylinder is fixedly arranged outside the working cavity 100, the movable rod is inserted into the working cavity 100 through a sealing transmission structure such as a bellows and is connected with the magnetic piece 220, and the magnetic piece 220 is rotatably arranged on the movable rod through a bearing. In the initial state, the magnetic piece 220 is suspended above the receiving piece 210. After the receiving piece 210 takes the wafer, the electric cylinder drives the magnetic piece 220 to descend, so as to adsorb the receiving piece 210 and fix the wafer. After the front film-coating of the wafer is completed, the turning driving piece 230 drives the receiving piece 210 to rotate, and the magnetic piece 220 rotates with the receiving piece 210 and does not interfere with the electric cylinder. After the wafer is turned over, the back film-coating can be performed. After the double-sided film-coating of the wafer is completed, the electric cylinder drives the magnetic piece 220 to ascend, so as to take away the wafer on which the film-coating is completed by the mechanical hand.

[0056] In another embodiment, the moving mechanism 240 is separately connected with the magnetic piece 220.

[0057] Specifically, the moving mechanism 240 comprises: a top plate 241 configured to contact the magnetic member 220; and a lifting drive 242 configured to drive the top plate 241 to move in a vertical direction. When the film coating is performed, the wafer falls on the receiving member 210, the lifting drive 242 drives the top plate 241 to lower the magnetic member 220, so that the magnetic member 220 is close to and adsorbs the receiving member 210; the lifting drive 242 drives the top plate 241 to continue to lower, so that the top plate 241 is separated from the magnetic member 220, so that the magnetic member 220 remains on the receiving member 210 and can rotate with the receiving member 210; after the film coating is completed, the lifting drive 242 drives the top plate 241 to rise, and the top plate 241 gradually approaches to lift the magnetic member 220.

[0058] The lifting drive 242 can be any driving member that can drive the top plate 241 to move up and down, such as a pneumatic cylinder or an electric cylinder.

[0059] Specifically, the lifting drive 242 can be any driving member that can drive the top plate 241 to move up and down, such as a pneumatic cylinder or an electric cylinder. Figure 1 Figure 2 In the illustrated embodiment, the top plate 241 is also provided in a circular ring shape, and the inner ring diameter of the top plate 241 is greater than the outer ring diameter of the receiving member 210; in this way, when the top plate 241 is lowered, the receiving member 210 can pass through the inner ring of the top plate 241, and the top plate 241 and the receiving member 210 do not interfere with each other. At the same time, the inner ring diameter of the top plate 241 is less than the outer ring diameter of the magnetic member 220, so that the top plate 241 can contact and lift the magnetic member 220 when the top plate 241 is raised.

[0060] After the magnetic member 220 is lowered to abut and adsorb the receiving member 210, the top plate 241 can continue to lower until it is completely separated from the magnetic member 220 and away from the receiving member 210, thereby leaving a required space for the rotation of the receiving member 210 and the magnetic member 220. Since the top plate 241 is separated from the magnetic member 220, the magnetic member 220 will not interfere with the rotation of the receiving member 210, so that the moving mechanism 240 and the turnover drive 230 do not interfere with each other.

[0061] Optionally, the top plate 241 is made of a metal material. In this way, when the top plate 241 lifts the magnetic member 220, the lifting force provided by the lifting drive 242 can overcome the adsorption of the magnetic member 220 to the receiving member 210, so that the magnetic member 220 is separated from the receiving member 210, and the adsorption of the magnetic member 220 to the top plate 241 can avoid displacement of the magnetic member 220 during the lifting movement, thereby ensuring that the magnetic member 220 moves along a preset path, adsorbs the receiving member 210 at a preset position, fixes the wafer, and avoids misalignment and shielding of the target film coating area of the wafer.

[0062] Optionally, one of the top plate 241 and the magnetic member 220 is provided with a positioning hole, and the other is provided with a positioning pin, and the positioning hole and the positioning pin one-to-one correspond.

[0063] Specifically, the lifting drive 242 can be any driving member that can drive the top plate 241 to move up and down, such as a pneumatic cylinder or an electric cylinder.​Figure 3 In the illustrated embodiment, the magnetic attraction member 220 is provided with a plurality of positioning pins at intervals on the bottom surface facing the top plate 241, and the top plate 241 is provided with a plurality of positioning holes corresponding to the positioning pins on the top surface facing the magnetic attraction member 220. When the top plate 241 is raised, any positioning pin can be inserted into a positioning hole.

[0064] The matching arrangement of the positioning pins and the positioning holes defines the relative position of the magnetic attraction member 220 and the top plate 241, so that the relative displacement of the two during the lifting process can be avoided. Meanwhile, the matching form of the positioning pins and the positioning holes can also calibrate the relative position of the magnetic attraction member 220 and the top plate 241, so as to ensure that the magnetic attraction member 220 always remains in the preset position and does not block the target film-coating area of the wafer when the material receiving member 210 is attracted.

[0065] Optionally, the wafer double-sided film-coating device provided by the present application further comprises a shielding member 400 arranged in the working cavity 100 and surrounding the material receiving member 210 and the magnetic attraction member 220; the target surface of the target material 300 is exposed to the shielding member 400 and faces the material receiving member 210 and the magnetic attraction member 220; the shielding member 400 can prevent the metal atoms sputtered from the target material 300 from adhering to the inner wall of the working cavity 100; the wafer inlet and outlet are arranged on the working cavity 100, and the displacement inlet and outlet are arranged on the shielding member 400 and face the wafer inlet and outlet, so that the wafer can approach or move away from the carrier 200 through the wafer inlet and outlet and the displacement inlet and outlet.

[0066] For details, please refer to Figure 1 In the illustrated embodiment, the shielding member 400 is arranged in a cylindrical shape, and is arranged in the working cavity 100 below the target material 300, close to the target material 300, and surrounds the material receiving member 210 and the magnetic attraction member 220; the upper and lower ends of the shielding member 400 are open to expose the target material 300 and facilitate the movement of gas, plasma and metal atoms.

[0067] The shielding member 400 can shield the inner wall of the working cavity 100, thereby preventing the metal atoms from adhering to the inner wall of the working cavity 100.

[0068] The shielding member 400 is detachably arranged in the working cavity 100 (for example, the shielding member 400 is mounted by screwing, clamping, inserting, etc.), and after a period of use, the shielding member 400 can be removed by opening the cavity for replacement or cleaning, so that the excessive metal atoms adhering to the shielding member 400 do not affect the environment in the cavity.

[0069] The application also provides a double-station wafer coating device, which comprises a working cavity 100 for providing a space for wafer coating; two groups of carriers 200, which are arranged in the working cavity 100 in a vertical direction and are spaced apart, and are used for receiving wafers and capable of fixing and turning over the wafers; and a target material 300, which is arranged between the two groups of carriers 200 and has two target surfaces 310, which are arranged in a vertical direction and face one group of carriers 200 respectively. The carrier 200 comprises a material receiving part 210 for receiving a wafer, the middle part of the material receiving part 210 is open to expose the back surface of the wafer; a magnetic attraction part 220 for attracting the material receiving part 210, so as to fix the wafer between the material receiving part 210 and the magnetic attraction part 220, the middle part of the magnetic attraction part 220 is open to expose the front surface of the wafer; a turning drive part 230 for driving the material receiving part 210 to rotate; and a moving mechanism 240 for controlling the magnetic attraction part 220 to move close to or away from the material receiving part 210. During coating, the wafer falls on the material receiving part 210, the moving mechanism 240 controls the magnetic attraction part 220 to move close to the material receiving part 210, so that the magnetic attraction part 220 attracts the material receiving part 210 and fixes the wafer; after the one surface of the wafer facing the target material 300 is coated, the turning drive part 230 drives the material receiving part 210 to rotate, and the material receiving part 210 and the magnetic attraction part 220 cooperate to turn over the wafer, so that the other surface of the wafer faces the target material 300.

[0070] Specifically refer to Figure 5 In the illustrated embodiment, two wafer inlets and outlets are arranged on the working cavity 100 and are arranged in a vertical direction and side by side. Refer to Figure 6 Two groups of carriers 200 are arranged in the working cavity 100, the first group of carriers 200A is arranged above and opposite to one of the wafer inlets and outlets, and the second group of carriers 200B is arranged below and opposite to the other wafer inlet and outlet. The target material 300 is arranged in the middle part of the working cavity 100 and between the two groups of carriers 200. Refer to Figure 7 The target material 300 has two target surfaces 310 arranged in an up-down direction, the first target surface 310 faces the first group of carriers 200A from bottom to top, and the second target surface 310 faces the second group of carriers 200B from top to bottom. After the two target surfaces 310 are electrified, an ionized electromagnetic field is formed in the working cavity 100, which can ionize the reaction gas and can escape metal atoms under the bombardment of plasma for coating the wafer.

[0071] The specific configuration of the carrier 200 has been described in detail above, and will not be repeated here.

[0072] In an embodiment, the robot simultaneously or sequentially delivers the wafers to be coated to the two groups of carriers 200 through the corresponding wafer inlets and outlets; after the two groups of material receiving members 210 receive the wafers, the robot moves out, the moving mechanism 240 controls the magnetic members 220 to approach the material receiving members 210, the magnetic members 220 abut against the edges of the wafers and adsorb the material receiving members 210, so as to fix the wafers on the carriers 200; at this time, the back surfaces of the wafers in the first group of carriers 200A face the first target surface 310, and the front surfaces of the wafers in the second group of carriers 200B face the second target surface 310. Start coating, the working cavity 100 is closed, the reaction gas is introduced, and the target material 300 is powered on; the first target surface 310 arranged on the top coats the back surfaces of the wafers on the first group of carriers 200A; the second target surface 310 arranged on the bottom coats the front surfaces of the wafers on the second group of carriers 200B; after the first round of coating is completed, the two groups of turnover driving members 230 are started, so that the two groups of carriers 200 carry the wafers to be turned over; after the turnover is completed, the front surfaces of the wafers in the first group of carriers 200A face the first target surface 310, and the back surfaces of the wafers in the second group of carriers 200B face the second target surface 310; continue to coat; the first target surface 310 arranged on the top coats the front surfaces of the wafers on the first group of carriers 200A; the second target surface 310 arranged on the bottom coats the back surfaces of the wafers on the second group of carriers 200B; after the second round of coating is completed, the two groups of turnover driving members 230 are started again, so that the two groups of wafers return to the state that the front surfaces are on the top. Stop the input of the reaction gas, power off the target material 300, open the working cavity 100, and the robot can take out the wafers completed with double-sided coating and deliver new wafers to be coated.

[0073] By arranging the double-sided target material 300 and arranging the two groups of carriers 200 facing the target material 300, the double-sided coating of the two groups of wafers can be simultaneously performed in one cavity, and the coating efficiency is further improved.

[0074] Optionally, the working cavity 100 is provided with an inlet channel and an outlet channel, the inlet channel is arranged close to the target material 300, so that the gas introduced into the working cavity 100 can quickly enter the ionization electromagnetic field; the outlet channel can be arranged at the bottom of the working cavity 100, or at the top of the working cavity 100, or two outlet channels can be arranged, corresponding to the two groups of carriers 200 (one outlet channel is arranged at the top of the working cavity 100 and used for guiding the reaction gas to flow to the first group of carriers 200A, and the other outlet channel is arranged at the bottom of the working cavity 100 and used for guiding the reaction gas to flow to the second group of carriers 200B), so as to guide the reaction gas to flow in two directions.

[0075] Optionally, the double-station wafer coating device further comprises two sets of shielding members 400, the first set of shielding members 400A is arranged above the target material 300 and surrounds the first set of carriers 200A, and is used for protecting the upper cavity wall of the working cavity 100; the second set of shielding members 400B is arranged below the target material 300 and surrounds the second set of carriers 200B, and is used for protecting the lower cavity wall of the working cavity 100.

[0076] Optionally, the target material 300 comprises: a bracket 320, used for mounting two target surfaces 310; an electrical connection mechanism 330, used for connecting the power supply and the two target surfaces 310, so as to facilitate the power supply to supply power to the two target surfaces 310 at the same time; and a cooling mechanism, used for cooling the target surfaces 310.

[0077] Specifically refer to Figure 6 and Figure 7 In the illustrated embodiment, the bracket 320 is a double-layer structure, comprising: an upper mounting ring 321, in which the first target surface 310 is arranged; a lower mounting ring 322, which is arranged in parallel with the upper mounting ring 321 in the vertical direction, and the second target surface 310 is arranged in the lower mounting ring 322; and a support column 323, which is arranged between the upper mounting ring 321 and the lower mounting ring 322 and is used for supporting the two. The electrical connection mechanism 330 comprises: a first conductive cable, used for connecting the first target surface 310; a second conductive cable, used for connecting the second target surface 310; and a total conductive cable, to which the first conductive cable and the second conductive cable are connected in parallel, and the total conductive cable is connected to the power supply. During coating, the power supply can supply power to the two target surfaces 310 at the same time through the electrical connection mechanism 330.

[0078] After the target surface 310 is powered on, it will generate heat. In order to avoid the influence of high temperature on the equipment, the cooling mechanism is arranged to cool the target surface 310. The coolant used by the cooling mechanism can be a liquid or a gas.

[0079] In an embodiment, the cooling mechanism can be a sandwich layer arranged between the two target surfaces 310. The coolant circulates in the sandwich layer, and the target surface 310 is cooled through heat exchange, and then the temperature is taken away through flow, so as to maintain the temperature.

[0080] In another embodiment, the two target surfaces 310 are fixedly connected together through the bracket 320, and only at least one target surface 310 is provided with a coolant circulation groove. The two target surfaces 310 are sealed and fixed together, and the coolant can flow directly between the target surfaces 310 through the coolant circulation groove and perform heat exchange.

[0081] The application does not limit the specific configuration of the cooling mechanism.

[0082] In one embodiment, the bracket 320 comprises: an upper mounting ring 321 for mounting one of the target surfaces 310; a lower mounting ring 322 for mounting the other target surface 310; a support column 323 arranged between the upper mounting ring 321 and the lower mounting ring 322 for connecting the upper mounting ring 321 and the lower mounting ring 322; wherein the upper mounting ring 321 and the lower mounting ring 322 are each provided with a cooling channel, and the support column 323 is provided with a communication channel communicating the two cooling channels; one of the upper mounting ring 321 and the lower mounting ring 322 is provided with a coolant inlet 341, and the other is provided with a coolant outlet 342; during operation of the target material 300, the coolant can enter the cooling channel through the coolant inlet 341, and after flowing through the upper mounting ring 321 and the lower mounting ring 322, the coolant can be discharged through the coolant outlet 342.

[0083] For details, please refer to Figure 7 In the illustrated embodiment, the upper mounting ring 321 and the lower mounting ring 322 are each provided in the shape of a circular plate, the center of the circular plate is recessed downward to form a mounting groove capable of accommodating the target surface 310; the circular plate is provided with a cooling channel, part of the cooling channel is arranged along the convex step of the edge of the circular plate to extend around the mounting groove, and the other part of the cooling channel is arranged to extend in a meandering manner at the bottom of the mounting groove; one side of the upper mounting ring 321 is provided with a coolant inlet 341; one side of the lower mounting ring 322 is provided with a coolant outlet 342. During operation, the coolant enters the upper mounting ring 321 through the coolant inlet 341, and along the cooling channel in the upper mounting ring 321, the coolant can exchange heat with both the outer peripheral wall of the first target surface 310 and the bottom surface of the first target surface 310, thereby ensuring the cooling effect of the first target surface 310; after flowing through the upper mounting ring 321, the coolant enters the cooling channel in the lower mounting ring 322 along the communication channel in the support column 323, and further exchanges heat with the outer peripheral wall and the top surface of the second target surface 310, thereby ensuring the cooling effect of the second target surface 310; finally, the coolant is discharged through the coolant outlet 342; the coolant continuously enters the target material 300 through the coolant inlet 341, and is discharged through the coolant outlet 342, so as to maintain the temperature of the target material 300.

[0084] The above embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are all within the scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A wafer double-sided coating apparatus, characterized in that, The utility model relates to a kind of sputtering device, including: Working cavity (100) is used to provide space for wafer coating; Carrier (200) is arranged in the working cavity (100), for receiving wafer, can fix and overturn the wafer; Target material (300) is arranged in the working cavity (100), and it is opposite the carrier (200); During coating process, the metal atom sputtered by the target material (300) falls on the wafer surface, realizes the coating of the wafer; Wherein, the carrier (200) includes: Material receiving part (210) is used to receive wafer, the middle part of the material receiving part (210) is open, to expose the back of the wafer; Magnetic attraction part (220) is used to adsorb the material receiving part (210), so as to fix wafer between the material receiving part (210) and the magnetic attraction part (220), the middle part of the magnetic attraction part (220) is open, to expose the front of the wafer; Overturn driving part (230) is used to drive the material receiving part (210) to rotate; Moving mechanism (240) is used to control the magnetic attraction part (220) to be close to or away from the material receiving part (210); Wherein, the material receiving part (210) is arranged in the form of circular ring, when the material receiving part (210) supports wafer, the edge of wafer is supported by the material receiving part (210); The magnetic attraction part (220) is also arranged in the form of circular ring, can resist the edge of wafer from front, so as to fix wafer between the magnetic attraction part (220) and the material receiving part (210); The magnetic attraction part (220) has weak magnetism, which is convenient for separating from the material receiving part (210), and will not damage wafer due to excessive magnetic force; The fixed end of the overturn driving part (230) is arranged outside the working cavity (100), and the movable end is inserted into the working cavity (100) through sealing transmission structure and connected with the material receiving part (210); When coating, wafer falls on the material receiving part (210), the moving mechanism (240) controls the magnetic attraction part (220) to be close to the material receiving part (210), so as to adsorb the material receiving part (210) by the magnetic attraction part (220) and fix the wafer; After the front of the wafer facing the target material (300) completes coating, the overturn driving part (230) drives the material receiving part (210) to rotate, and the material receiving part (210) and the magnetic attraction part (220) cooperate to drive the wafer to turn over, so as to make the back of the wafer face the target material (300).

2. The wafer double side coating film device according to claim 1, wherein The material receiving part (210) is arranged in the form of circular ring, one side of the material receiving part (210) is provided with a notch, and the mechanical hand for transferring wafer can translate and lift through the notch; The mechanical hand can transport wafer to above the material receiving part (210) by translation; The mechanical hand can make wafer fall on the material receiving part (210) from top to bottom by descending; The mechanical hand can lift wafer on the material receiving part (210) from bottom to top by ascending.

3. The wafer double side coating film device according to claim 2, wherein The material receiving part (210) is arranged in the form of step, and the inner ring of the material receiving part (210) is recessed downward to form a circular groove for accommodating wafer.

4. The wafer double side coating film device according to claim 3, wherein The outer ring of the material receiving piece (210) is protruded compared to the inner ring, and the outer ring is provided with a positioning hole on one of the top surface of the magnetic attraction piece (220) and the bottom surface of the magnetic attraction piece (220) facing the material receiving piece (210), and is provided with a positioning pin on the other one, and the positioning hole and the positioning pin correspond to each other one by one; And / or, the magnetic attraction piece (220) is provided in an inverted step shape, and the inner ring of the magnetic attraction piece (220) is upwardly recessed to form a clamping groove facilitating the insertion of the material receiving piece (210).

5. The apparatus according to claim 1, wherein The moving mechanism (240) comprises: a top plate (241) for contacting the magnetic attraction piece (220); a lifting driving piece (242) for driving the top plate (241) to move in a vertical direction; When coating, the wafer falls on the material receiving piece (210), the lifting driving piece (242) drives the top plate (241) to carry the magnetic attraction piece (220) to descend, so that the magnetic attraction piece (220) is close to and attracts the material receiving piece (210); The lifting driving piece (242) drives the top plate (241) to continue to descend, so that the top plate (241) is separated from the magnetic attraction piece (220), so that the magnetic attraction piece (220) remains on the material receiving piece (210) and can rotate with the material receiving piece (210); After the coating is completed, the lifting driving piece (242) drives the top plate (241) to ascend, and the top plate (241) gradually approaches to lift the magnetic attraction piece (220).

6. The wafer double side coating film device according to claim 5, wherein One of the top plate (241) and the magnetic attraction piece (220) is provided with a positioning hole, and the other one is provided with a positioning pin, and the positioning hole and the positioning pin correspond to each other one by one.

7. The apparatus according to any one of claims 1-6, wherein Further comprising a shielding piece (400) arranged in the working cavity (100) and surrounding the material receiving piece (210) and the magnetic attraction piece (220); The target surface of the target material (300) is exposed in the shielding piece (400) and faces the material receiving piece (210) and the magnetic attraction piece (220); The shielding piece (400) can prevent the metal atoms sputtered from the target material (300) from adhering to the inner wall of the working cavity (100); The working cavity (100) is provided with a wafer inlet and outlet, the shielding piece (400) is provided with an avoidance inlet and outlet, the avoidance inlet and outlet faces the wafer inlet and outlet, and the wafer can approach or move away from the carrier (200) through the wafer inlet and outlet and the avoidance inlet and outlet.

8. A twin-station wafer coating apparatus, comprising: It comprises: a working cavity (100) for providing space for wafer coating; two groups of carriers (200) arranged in the working cavity (100) in a vertical direction, the carriers (200) are used for receiving wafers and can fix and flip the wafers; a target material (300) arranged between the two groups of carriers (200), the target material (300) has two target surfaces (310), and the two target surfaces (310) are arranged in a vertical direction and face one group of carriers (200) respectively; The carrier (200) comprises: A receiving member (210) is used to receive a wafer, and a middle part of the receiving member (210) is open to expose a back surface of the wafer; A magnetic member (220) is used to attract the receiving member (210), so as to fix the wafer between the receiving member (210) and the magnetic member (220), and a middle part of the magnetic member (220) is open to expose a front surface of the wafer; A turnover driving member (230) is used to drive the receiving member (210) to rotate; A moving mechanism (240) is used to control the magnetic member (220) to move close to or away from the receiving member (210); When coating, the wafer falls on the receiving member (210), and the moving mechanism (240) controls the magnetic member (220) to move close to the receiving member (210), so that the magnetic member (220) attracts the receiving member (210) and fixes the wafer; After coating of one surface of the wafer facing the target (300) is completed, the turnover driving member (230) drives the receiving member (210) to rotate, and the receiving member (210) and the magnetic member (220) cooperate to drive the wafer to turn over, so that another surface of the wafer faces the target (300).

9. The dual station wafer coating apparatus of claim 8, wherein, The target (300) comprises: A support (320) is used to mount two target surfaces (310); An electricity connecting mechanism (330) is used to connect a power supply with the two target surfaces (310), so that the power supply supplies power to the two target surfaces (310) at the same time; A cooling mechanism is used to cool the target surfaces (310).

10. The dual station wafer coating apparatus of claim 9, wherein, The support (320) comprises: An upper mounting ring (321) is used to mount one of the target surfaces (310); A lower mounting ring (322) is used to mount the other target surface (310); A support column (323) is arranged between the upper mounting ring (321) and the lower mounting ring (322), and is used to connect the upper mounting ring (321) and the lower mounting ring (322); The upper mounting ring (321) and the lower mounting ring (322) are both provided with cooling channels, and the support column (323) is provided with a communication channel which communicates the two groups of cooling channels; One of the upper mounting ring (321) and the lower mounting ring (322) is provided with a coolant inlet (341), and the other is provided with a coolant outlet (342); When the target (300) works, the coolant can enter the cooling channels through the coolant inlet (341), and then flow through the upper mounting ring (321) and the lower mounting ring (322), and finally, the coolant can be discharged through the coolant outlet (342).

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