Vapor growth equipment with rotating base

By designing a rotating base and a uniform heater in the gas phase growth device, the problem of temperature gradient between the base and the heater is solved, and the temperature uniformity and film formation quality of the wafer surface are improved.

CN119753641BActive Publication Date: 2025-05-16CHUYUN TECH (SHAOXING CO LTD
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Patent Information

Application Number
CN202510258672.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-03-06
Publication Date
2025-05-16
Estimated Expiration
2045-03-06

AI Technical Summary

Technical Problem

In a gas phase growth device where the base is rotatable, the temperature gradient between the base and the heater results in uneven temperatures on the wafer surface, affecting the film formation quality.

Method used

A gas phase growth device with a rotating base is designed, and the rotating base and the uniform heating device are connected by the carrier rotation shaft and the uniform heating rotating shaft respectively. The uniform heating device is arranged between the rotating base and the first heating device around the carrier rotation shaft to realize independent uniform heating of the temperature field between the base and the heater, and the degree of uniform heating is selected according to the rotation speed of the rotating base.

Benefits of technology

The temperature uniformity of the substrate surface is improved, the film formation quality is improved, and the temperature control ability of the equipment is enhanced.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a vapor phase growth device provided with a rotating base, the vapor phase growth device also includes a process chamber, a carrier rotating shaft and a heat-uniform rotating shaft which are movably sleeved from the inside to the outside in sequence, a rotating drive component, a first heating device and a heat-uniform device. The carrier rotating shaft and the heat-uniform rotating shaft are respectively connected to the rotating base and the heat-uniform device, the heat-uniform device is arranged between the rotating base and the first heating device around the carrier rotating shaft, the top dynamic seal of the rotating drive component is arranged in the process chamber, the edge of the top surface is connected to the heat-uniform rotating shaft to drive the heat-uniform rotating shaft to rotate relative to the rotating base, the carrier rotating shaft passes through the heat-uniform rotating shaft and is arranged in the middle of the top surface of the rotating drive component, so that the rotating base is driven by the rotating drive component to rotate relative to the heat-uniform device, so that not only the temperature field between the base and the heater can be independently heated, but also whether to perform heating uniformly and the degree of heating uniformly can be selected according to the rotation speed of the rotating base, which is beneficial to improving the temperature uniformity of the substrate surface.
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Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a vapor phase growth equipment provided with a rotating base. Background Art

[0002] In the semiconductor manufacturing process, vapor deposition technology, such as MOCVD, is used to deposit functional thin films on the wafer surface.

[0003] In a vapor phase growth device with a rotatable susceptor, the rotation of the susceptor can make the gas flow above the substrate uniform, which is beneficial to the uniformity of film formation. A heater is arranged under the susceptor to heat the susceptor, and the heat transfer from the susceptor to the wafer makes the surface temperature of the substrate reach the process temperature requirement.

[0004] Due to the complexity of process influencing factors such as temperature field and flow field, even if the rotation of the base can drive the mixing of the temperature field below the base during the process, this degree of effect may still cause a temperature gradient to exist between the base and the heater (either axially or radially). However, the limit of the base's rotation rate adjustment is mainly necessary to ensure that the gas flow field is evenly distributed in a small range above the wafer. Therefore, the rotation rate adjustment range is limited by the process conditions, which will still make the temperature of the wafer surface uneven, which may seriously affect the film formation quality on the wafer surface.

[0005] Therefore, it is necessary to provide a new type of vapor phase growth equipment with a rotating base to solve the above problems existing in the prior art. Summary of the invention

[0006] The object of the present invention is to provide a vapor growth device equipped with a rotating base, which can not only independently heat the temperature field between the base and the heater, but also can choose whether to heat evenly and the degree of heating evenly according to the rotation speed of the rotating base, which is beneficial to improving the temperature uniformity of the substrate, such as the surface of the wafer.

[0007] To achieve the above object, the technical solution of the present invention is as follows:

[0008] A vapor growth device provided with a rotating base comprises a process chamber, a rotating device, and a rotating base, a first heating device and a uniform heat device arranged in the process chamber for carrying a substrate; the first heating device is arranged between the rotating base and the bottom wall of the process chamber to provide heat; the rotating device comprises a carrier shaft and a uniform heat rotating shaft which are movably sleeved in sequence from the inside to the outside, respectively connecting the rotating base and the uniform heat device, and the uniform heat device is arranged around the carrier shaft between the rotating base and the first heating device; the rotating device comprises a rotating drive assembly, the top dynamic seal of the rotating drive assembly is arranged in the process chamber, the top edge is connected to the uniform heat rotating shaft to drive the uniform heat rotating shaft to rotate relative to the rotating base, and the carrier shaft passes through the uniform heat rotating shaft and is arranged in the middle of the top surface of the rotating drive assembly, so that the rotating base can rotate relative to the uniform heat device under the drive of the rotating drive assembly.

[0009] By adopting the above technical scheme, the carrier shaft and the heat uniforming shaft are respectively connected to the rotating base and the heat uniforming device, the heat uniforming device is arranged around the carrier shaft between the rotating base and the first heating device, the top dynamic seal of the rotating drive component is arranged in the process chamber, the edge of the top surface is connected to the heat uniforming shaft to drive the heat uniforming shaft to rotate relative to the rotating base, the carrier shaft passes through the heat uniforming shaft and is arranged in the middle of the top surface of the rotating drive component, so that the rotating base is driven by the rotating drive component to rotate relative to the heat uniforming device, thereby not only being able to independently heat the temperature field between the base and the heater, but also being able to select whether to heat uniformly and the degree of heating uniformly according to the rotation speed of the rotating base, which is beneficial to improving the temperature uniformity of the substrate surface.

[0010] Optionally, the rotation drive assembly includes:

[0011] An upper rotary sealing assembly, the top of which is disposed at the bottom of the process chamber in a dynamic sealing manner and connected to the heat-uniform rotating shaft to drive the heat-uniform device to rotate relative to the rotating base;

[0012] A lower rotary seal assembly, the top of which is arranged at the bottom of the upper rotary seal assembly;

[0013] The transmission shaft passes through the upper rotary seal assembly and the lower rotary seal assembly and is connected to the carrier shaft, so that the lower rotary seal assembly drives the rotary base to rotate relative to the heat equalizing device through the transmission shaft.

[0014] Optionally, the lower rotary seal assembly includes a fixed sleeve and a second driving mechanism;

[0015] The transmission shaft passes through the fixed sleeve and the upper rotary seal assembly from the bottom of the fixed sleeve and is connected to the carrier shaft;

[0016] The bottom of the transmission shaft protrudes from the bottom of the fixed sleeve, and the second driving mechanism is disposed at the bottom of the fixed sleeve in a dynamic sealing manner and is rotatably connected to the transmission shaft to drive the transmission shaft to rotate relative to the fixed sleeve.

[0017] Optionally, the upper rotary seal assembly includes a rotary sleeve and a first driving mechanism;

[0018] The transmission shaft passes through the rotating sleeve and is connected to the carrier rotating shaft;

[0019] The top of the rotating sleeve is connected to the heat-uniform rotating shaft, and the first driving mechanism is rotationally connected to the side wall of the rotating sleeve to drive the rotating sleeve to drive the heat-uniform rotating shaft to rotate relative to the transmission shaft.

[0020] Optionally, the transmission shaft includes an upper shaft body and a lower shaft body connected to each other;

[0021] The upper shaft body extends axially along the upper rotary seal assembly, one end of which is connected to the carrier shaft and the other end of which is inside the upper rotary seal assembly;

[0022] The lower shaft body extends axially along the lower rotary seal assembly, and the bottom protrudes from the bottom of the lower rotary seal assembly. The second driving mechanism is disposed at the bottom of the lower rotary seal assembly in a dynamic sealing manner and is rotationally connected to the bottom of the lower shaft body.

[0023] Optionally, the upper rotary sealing assembly includes a sealing plate, a rotary sleeve and a first driving mechanism, and the lower rotary sealing assembly includes a fixed sleeve and a second driving mechanism;

[0024] The rotating sleeve is disposed on the top of the sealing plate in a dynamic sealing manner, the top of the rotating sleeve is connected to the heat-distributing rotating shaft, and the first driving mechanism is rotatably disposed on the side wall of the rotating sleeve to drive the rotating sleeve to drive the heat-distributing rotating shaft to rotate relative to the sealing plate;

[0025] The top fixed seal of the fixed sleeve is arranged at the bottom of the sealing plate, the transmission shaft extends into the rotating sleeve after passing through the sealing plate, the bottom of the transmission shaft protrudes from the bottom of the fixed sleeve, and the second driving mechanism is arranged at the bottom of the fixed sleeve in a dynamic sealing manner and is rotatably connected to the transmission shaft to drive the transmission shaft to rotate relative to the fixed sleeve.

[0026] Optionally, the upper rotary seal assembly further comprises a sealing sleeve disposed at the bottom of the process chamber, wherein the sealing sleeve is mounted on the rotary sleeve in a dynamic sealing manner to strengthen the dynamic sealing relationship between the rotary sleeve and the bottom of the process chamber.

[0027] Optionally, the heat uniformizing device includes a heat conducting device connected to the top of the heat uniformizing rotating shaft.

[0028] Optionally, it also includes a power supply stator, a rotor and an electric conduction device, and the heat uniformity device includes a heating device;

[0029] The heating device is connected to the top of the heat-uniform rotating shaft;

[0030] The rotor is sleeved on the upper rotating seal assembly, the electrical conduction device is electrically connected to the rotor, passes through the upper rotating seal assembly and the heat uniform rotating shaft and is electrically connected to the heating device, the power supply stator is sleeved on the rotor and is stationary relative to the process chamber, so as to provide electrical energy for generating heat for the heating device through the rotational friction between the rotor and the power supply stator.

[0031] Optionally, the power supply stator, the rotor and the electrical conduction device form a conductive slip ring.

[0032] Optionally, the upper rotary sealing assembly includes a rotary sleeve, a sealing sleeve and a first driving mechanism;

[0033] The bottom of the rotating sleeve is connected to the heat-distributing rotating shaft;

[0034] The sealing sleeve is arranged at the bottom of the process chamber, and is sleeved on the rotating sleeve in a dynamic sealing manner to strengthen the dynamic sealing relationship between the rotating sleeve and the bottom of the process chamber;

[0035] The first driving mechanism is rotatably disposed on the bottom side wall of the rotating sleeve to drive the rotating sleeve to drive the heat-uniform rotating shaft to rotate;

[0036] The rotor is arranged on the side wall of the middle part of the rotating sleeve, and the electrical conduction device passes through the rotating sleeve and the heat-distributing rotating shaft and is electrically connected to the heating device.

[0037] Optionally, the rotating sleeve body includes an inner rotating body and an outer rotating body which are sequentially sleeved from the inside to the outside, so that the bottom side wall of the inner rotating body is exposed;

[0038] The sealing sleeve is sleeved on the outer rotating body in a dynamic sealing manner and covers the top side wall of the outer rotating body so that the middle side wall and the bottom side wall of the outer rotating body are exposed, and the rotor is arranged on the middle side wall of the outer rotating body;

[0039] The first driving mechanism is rotatably disposed on the bottom side wall of the inner rotating body to drive the inner rotating body and the outer rotating body to rotate synchronously;

[0040] At least one of the inner rotating body and the outer rotating body is connected to the heat dissipating rotating shaft.

[0041] Optionally, the inner rotating body and the outer rotating body are detachably arranged, and at least one of the inner rotating body and the outer rotating body is detachably arranged with respect to the heat uniform rotating shaft.

[0042] Optionally, the radial dimension of the heat uniformizing device does not exceed the radial dimension of the bearing surface of the rotating base, and the radial dimension of the heat uniformizing device is not less than 95% of the radial dimension of the bearing surface of the rotating base.

[0043] Optionally, a gas injection device is also included, and the gas injection device is arranged on the top wall or side wall of the process chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A schematic structural diagram of a vapor phase growth device according to an embodiment of the present invention;

[0045] Figure 2 It is a schematic diagram of the assembly structure of a rotation drive assembly, a process chamber bottom plate, a heat distribution device, and a rotation base according to an embodiment of the present invention;

[0046] Figure 3 It is a structural schematic diagram of a lower rotary sealing assembly in a rotary drive assembly according to an embodiment of the present invention;

[0047] Figure 4 It is a schematic diagram of an assembly structure of an upper rotary seal assembly, a process chamber bottom plate, an upper shaft body and other structures according to an embodiment of the present invention;

[0048] Figure 5 It is a schematic diagram of another assembly structure of the upper rotary seal assembly, the process chamber bottom plate, the upper shaft body and other structures according to an embodiment of the present invention;

[0049] Figure 6 It is a schematic diagram of another assembly structure of the upper rotary seal assembly, the process chamber bottom plate, the upper shaft body and other structures in an embodiment of the present invention.

[0050] Reference numerals:

[0051] 100, process chamber; 110, base; 120, first heating device; 130, uniform heat device; 131, heat conducting device; 132, rotor; 133, electrical conduction device; 134, heating device; 300, shaft assembly; 310, carrier shaft; 320, uniform heat rotating shaft; 400, rotation drive assembly; 410, upper rotation sealing assembly; 411, rotation sleeve; 412, first driving mechanism; 413, sealing plate; 414, sealing sleeve; 415, inner rotating body; 416, outer rotating body; 420, lower rotation sealing assembly; 421, fixed sleeve; 422, second driving mechanism; 430, transmission shaft; 431, upper shaft; 432, lower shaft. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0053] Combine the following Figure 1-Figure 6 , the specific implementation modes of the present invention are further described in detail.

[0054] Reference Figure 1 , an embodiment of the present invention provides a vapor phase growth device for processing a substrate, wherein the vapor phase growth device includes a process chamber 100, a rotating device, a rotating base 110 disposed in the process chamber 100, a first heating device 120, and a uniform heating device 130. In some embodiments, the rotating base 110, the first heating device 120, and the uniform heating device 130 are all disposed inside the process chamber 100, part of the rotating device is disposed outside the process chamber 100, and part of the rotating device is disposed inside the process chamber 100, so that the rotating device can drive the uniform heating device 130 and the rotating base 110 in the process chamber 100 to rotate respectively from the outside.

[0055] In some embodiments, the radial dimension of the uniform heating device 130 does not exceed the radial dimension of the bearing surface of the rotating base 110, and the radial dimension of the uniform heating device 130 is not less than 95% of the radial dimension of the bearing surface of the rotating base 110, so as to avoid adverse effects on the process gas flow field and ensure the temperature uniformity of each substrate supported on the rotating base 110.

[0056] In some embodiments, the rotating base 110 rotates relative to the process chamber 100 to carry the substrate. Specifically, the rotating base 110 is rotatably disposed inside the process chamber 100 and is used to carry the substrate. The rotating base 110 is provided with a plurality of recesses for placing the substrate. In some more specific embodiments, the plurality of recesses are evenly distributed on the rotating base 110.

[0057] In some embodiments, the first heating device 120 is disposed between the rotating base 110 and the bottom wall of the process chamber 100 to provide heat to the rotating base 110. Specifically, there is a spacing between the first heating device 120 and the rotating base 110 to ensure that the rotation of the first heating device 120 and the rotating base 110 does not interfere with each other. There is a spacing between the first heating device 120 and the rotating base 110, and the limit of adjusting the rotation rate of the rotating base 110 is mainly necessary to meet the uniform distribution of the gas flow field in a small range above the substrate. Therefore, the rotation rate adjustment range is limited by the process conditions, which still makes the temperature of the substrate surface non-uniform, which seriously affects the surface film quality.

[0058] The first heating device 120 is fixedly disposed inside the process chamber 100, and is specifically implemented by conventional technical means in the art. In some embodiments, the first heating device 120 may be a resistance heater or other device capable of temperature control to heat the inside of the process chamber 100 so that the susceptor 110 transfers heat to the substrate.

[0059] In some embodiments, the uniform heating device 130 is disposed inside the process chamber 100 and can rotate inside the process chamber 100 to uniformize the temperature gradient between the first heating device 120 and the rotating base 110 , which is beneficial to the temperature uniformity of the rotating base 110 .

[0060] In some embodiments, the uniform heating device 130 is disposed between the rotating base 110 and the first heating device 120 .

[0061] Reference Figure 2 The rotating device includes a rotating shaft assembly 300 and a rotating driving assembly 400. The rotating shaft assembly 300 is disposed on the bottom wall of the process chamber 100 and is respectively connected to the rotating base 110 and the uniform heating device 130 so that the rotating base 110 and the uniform heating device 130 are respectively rotated under the driving of the rotating driving assembly 400.

[0062] In some embodiments, the rotary drive assembly 400 is dynamically sealed on the bottom wall of the process chamber 100 to ensure the airtightness of the bottom of the process chamber 100 and can drive the rotary base 110 and the uniform heat device 130 to rotate in the process chamber 100 .

[0063] In some embodiments, the shaft assembly 300 includes a carrier shaft 310 and a heat-uniform rotation shaft 320 that are movably sleeved from the inside to the outside, wherein one end of the carrier shaft 310 is connected to the rotating base 110 to drive the rotating base 110 to rotate; one end of the heat-uniform rotation shaft 320 is connected to the heat-uniform device 130 to drive the heat-uniform device 130 to rotate. In some embodiments, the carrier shaft 310 is connected to the middle of the rotating base 110.

[0064] In some embodiments, the carrier shaft 310 is rod-shaped and coaxially arranged with the rotating base 110, and the carrier shaft 310 is used to support the rotating base 110. In some embodiments, one end of the carrier shaft 310 is connected to the rotating base 110, and the other end is connected to the rotating drive assembly 400, and the rotating drive assembly 400 drives the carrier shaft 310 to rotate, thereby driving the rotating base 110 to rotate.

[0065] In some embodiments, the rotating base 110 is fixedly connected to the carrier shaft 310 .

[0066] In some embodiments, the rotating base 110 and the carrier shaft 310 are detachably connected so that the rotating base 110 and the carrier shaft 310 can rotate synchronously.

[0067] In some embodiments, the heat uniform rotation shaft 320 is tubular and movably mounted outside the carrier rotation shaft 310. The heat uniform rotation shaft 320 is rotatably connected to the bottom wall of the process chamber 100. In addition, the heat uniform rotation shaft 320 is also connected to the rotation drive assembly 400. The rotation drive assembly 400 can drive the heat uniform rotation shaft 320 to rotate, thereby driving the heat uniform device 130 to rotate to mix the temperature field in the process chamber 100.

[0068] In some embodiments, the uniform heat device 130 is disposed between the rotating base 110 and the first heating device 120 around the carrier rotation axis 310 .

[0069] In some embodiments, the heat-uniform device 130 is fixedly connected to the top of the heat-uniform rotating shaft 320 , for example, they are integrally formed, etc. Specifically, the heat-uniform device 130 is fixedly connected to the top side wall of the heat-uniform rotating shaft 320 .

[0070] In some embodiments, the heat-uniform device 130 and the heat-uniform rotating shaft 320 are detachably connected, for example, by bolting or clamping.

[0071] In some embodiments, the rotary drive assembly 400 includes an upper rotary seal assembly 410 , a lower rotary seal assembly 420 , and a transmission shaft 430 .

[0072] In some embodiments, the heat-distributing rotating shaft 320 can drive the heat-distributing device 130 to rotate under the action of the upper rotating sealing assembly 410. In some embodiments, the heat-distributing device 130 can transfer heat or generate heat, which will be described in detail later.

[0073] In some embodiments, the heat-distributing device 130 is an annular plate, which is sleeved on the side wall of the heat-distributing rotating shaft 320 .

[0074] In some embodiments, the top of the upper rotating seal assembly 410 is disposed at the bottom of the process chamber 100 in a dynamic sealing manner and connected to the heat-uniform rotating shaft 320 . The upper rotating seal assembly 410 drives the heat-uniform device 130 to rotate relative to the rotating base 110 .

[0075] In some embodiments, the transmission shaft 430 passes through the lower rotating seal assembly 420 and the upper rotating seal assembly 410, and is connected to the carrier rotating shaft 310, so that the lower rotating seal assembly 420 drives the rotating base 110 to rotate relative to the heat equalizing device 130 through the transmission shaft 430. Specifically, the process in which the transmission shaft 430 drives the carrier rotating shaft 310 to rotate under the drive of the lower rotating seal assembly 420 and the process in which the upper rotating seal assembly 410 drives the heat equalizing rotating shaft 320 to rotate do not affect each other, and at least one of the heat equalizing rotating shaft 320 and the carrier rotating shaft 310 can be selected for rotation control according to process requirements.

[0076] In some embodiments, the transmission shaft 430 includes an upper shaft body 431 and a lower shaft body 432 connected in sequence.

[0077] In some embodiments, the transmission shaft 430 passes through the lower rotating seal assembly 420 and the upper rotating seal assembly 410 in sequence from the bottom of the lower rotating seal assembly 420 , and the bottom of the transmission shaft 430 extends out of the bottom of the lower rotating seal assembly 420 to drive the carrier shaft 310 to rotate under the drive of the lower rotating seal assembly 420 .

[0078] In some embodiments, reference Figure 2 and Figure 3 The upper rotary sealing assembly 410 includes a rotary sleeve 411 and a first driving mechanism 412 .

[0079] In some embodiments, reference Figure 2 and Figure 4 The lower rotary sealing assembly 420 includes a fixed sleeve 421 and a second driving mechanism 422 .

[0080] In some embodiments, the transmission shaft 430 passes through the fixed sleeve 421 and the upper rotating seal assembly 410 from the bottom of the fixed sleeve 421, and is connected to the carrier shaft 310. The bottom of the transmission shaft 430 protrudes from the bottom of the fixed sleeve 421, and the second driving mechanism 422 is disposed at the bottom of the fixed sleeve 421 in a dynamic sealing manner and is rotatably connected to the transmission shaft 430 to drive the transmission shaft 430 to rotate relative to the fixed sleeve 421.

[0081] In some embodiments, a dynamic seal is provided between the transmission shaft 430 and the rotating sleeve 411 so that the rotational motions of the two do not interfere with each other, or there is a distance between the outer wall of the transmission shaft 430 and the inner wall of the rotating sleeve 411 so that the rotation of the rotating sleeve 411 does not drive the transmission shaft 430 to rotate synchronously, and vice versa.

[0082] In some embodiments, the upper shaft 431 extends axially along the upper rotating seal assembly 410 , with one end connected to the carrier shaft 310 and the other end inside the upper rotating seal assembly 410 .

[0083] In some embodiments, the upper shaft 431 is disposed in the rotating sleeve 411. Specifically, the upper shaft 431 extends from the rotating sleeve 411 toward the carrier shaft 310 until it is connected to the carrier shaft 310.

[0084] In some embodiments, there is a distance between the outer wall of the upper shaft body 431 and the inner wall of the rotating sleeve body 411 so that the upper shaft body 431 and the rotating sleeve body 411 do not interfere with each other.

[0085] In some embodiments, the upper shaft 431 and the carrier shaft 310 are an integrated structure.

[0086] In some embodiments, the lower shaft body 432 extends axially along the lower rotary seal assembly 420, and the bottom protrudes from the bottom of the lower rotary seal assembly 420. The second driving mechanism 422 is disposed at the bottom of the lower rotary seal assembly 420 in a dynamic sealing manner and is rotatably connected to the bottom of the lower shaft body 432.

[0087] In some embodiments, the lower shaft 432 axially penetrates the fixed sleeve 421 along the fixed sleeve 421 , and extends into the rotating sleeve 411 to connect with the upper shaft 431 .

[0088] In some embodiments, the lower shaft 432 and the rotating sleeve 411 are dynamically sealed or spaced apart from each other, so that the lower shaft 432 does not interfere with the rotation of the rotating sleeve 411, and vice versa. In some embodiments, the lower shaft 432 and the upper shaft 431 can be fixedly connected or detachably connected, which is not limited here, as long as they can rotate synchronously.

[0089] In some embodiments, the bottom of the lower shaft 432 protrudes from the bottom of the fixed sleeve 421, and the second driving mechanism 422 is rotatably connected to the bottom of the lower shaft 432 and is dynamically sealed at the bottom of the fixed sleeve 421 to drive the lower shaft 432 to drive the upper shaft 431 and the carrier shaft 310 to rotate synchronously.

[0090] In some embodiments, the rotating sleeve 411 is hollow and one end is connected to the heat uniform rotating shaft 320 to drive the heat uniform rotating shaft 320 to rotate; the first driving mechanism 412 is connected to the side wall of the rotating sleeve 411 to provide driving force.

[0091] In some embodiments, the upper rotating seal assembly 410 further includes a sealing sleeve 414 , which is disposed at the bottom of the process chamber 100 . The sealing sleeve 414 is dynamically sleeved on the rotating sleeve 411 to strengthen the dynamic sealing relationship between the rotating sleeve 411 and the bottom of the process chamber 100 .

[0092] In some embodiments, the upper rotary seal assembly 410 further includes a sealing plate 413. The rotary sleeve 411 is disposed on the top of the sealing plate 413 in a dynamic sealing manner, the top of the rotary sleeve 411 is connected to the heat-uniform rotating shaft 320, the first driving mechanism 412 is rotatably disposed on the side wall of the rotary sleeve 411 to drive the rotary sleeve 411 to drive the heat-uniform rotating shaft 320 to rotate relative to the sealing plate 413; the top of the fixed sleeve 421 is fixedly sealed and disposed at the bottom of the sealing plate 413; the transmission shaft 430 penetrates the sealing plate 413 and then extends into the rotary sleeve 411.

[0093] In some embodiments, reference Figure 6 The rotating sleeve 411 includes an inner rotating body 415 and an outer rotating body 416 which are sequentially sleeved from the inside to the outside.

[0094] In some embodiments, the bottom side wall of the inner rotating body 415 is exposed, and the first driving mechanism 412 rotates the top side wall of the inner rotating body 415 to drive the inner rotating body 415 and the outer rotating body 416 to rotate synchronously.

[0095] In some embodiments, the first driving mechanism 412 is rotatably disposed on the bottom side wall of the rotating sleeve 411 to drive the rotating sleeve 411 to drive the heat uniform rotating shaft 320 to rotate.

[0096] In some embodiments, the sealing sleeve 414 is sleeved on the outer rotating body 416 in a dynamic sealing manner and covers the top side wall of the outer rotating body 416 to expose the middle side wall and the bottom side wall of the outer rotating body 416, so that the rotor 132 can be disposed on the exposed side wall of the outer rotating body 416. In some embodiments, the rotor 132 is disposed on the middle side wall of the outer rotating body 416.

[0097] In some embodiments, at least one of the inner rotating body 415 and the outer rotating body 416 is connected to the heat dissipating rotating shaft 320 .

[0098] In some embodiments, the inner rotating body 415 and the outer rotating body 416 are an integrated structure.

[0099] In some embodiments, the inner rotating body 415 and the outer rotating body 416 are detachably arranged.

[0100] In some embodiments, at least one of the inner rotating body 415 and the outer rotating body 416 is detachably disposed with respect to the heat distributing rotating shaft 320 .

[0101] In some embodiments, reference Figure 4 The heat uniforming device 130 includes a heat conducting device 131 connected to the heat uniforming rotating shaft 320 to absorb and transfer heat.

[0102] The material of the heat conducting device 131 is heat resistant and has good thermal conductivity, and the specific heat resistance is selected according to the process temperature requirement.

[0103] In some specific embodiments, the heat conducting device 131 may be a graphite plate. By absorbing the heat of the first heating device 120 and transferring the heat to the rotating base 110, the heat uniforming device 130 improves the utilization efficiency of heat energy and reduces heat loss.

[0104] In some more specific embodiments, the surface of the heat conducting device 131 may be coated with a thermally conductive coating, such as silicon carbide.

[0105] In some embodiments, the uniform heating device 130 includes a heating device 134 , and the vapor phase growth equipment further includes a rotor 132 and an electrical conduction device 133 .

[0106] In some embodiments, reference Figure 5 and Figure 6 The uniform heat device 130 includes a main support member connected to the side wall of the uniform heat rotating shaft 320; a heating device 134, which is arranged on the main support member and is used to convert externally provided electrical energy into thermal energy to generate heat.

[0107] In some embodiments, the heating device 134 is a resistance heating wire, and the main support member is a substrate supporting the resistance heating wire, and the substrate can be an insulating substrate, such as a boron nitride ceramic substrate, or a conductive substrate, such as a molybdenum silicide substrate. When the substrate is a heat-resistant conductive substrate, the resistance heating wire and the substrate are electrically insulated.

[0108] In some embodiments, the heating device 134 is a graphite plate that converts electrical energy into thermal energy to generate heat.

[0109] In some embodiments, the vapor phase growth apparatus further includes a power supply stator, a rotor 132 and an electrical conduction device 133 .

[0110] In some embodiments, the rotor 132 is sleeved on the upper rotating seal assembly 410 to rotate synchronously, and the electric conduction device 133 is electrically connected to the rotor 132, passes through the upper rotating seal assembly 410 and the heat-distributing rotating shaft 320, and then is electrically connected to the heating device 134. The power supply stator is sleeved on the rotor 132 and is stationary relative to the process chamber 100, so as to provide electric energy for generating heat to the heating device 134 through the rotational friction between the rotor 132 and the power supply stator.

[0111] In some embodiments, the power supply stator, the rotor 132 and the electrical conduction device 133 form a conductive slip ring.

[0112] In some embodiments, the bottom of the rotating sleeve 411 is connected to the uniform heat rotating shaft 320; the sealing sleeve 414 is disposed at the bottom of the process chamber 100, and is dynamically sealed on the rotating sleeve 411 to strengthen the dynamic sealing relationship between the rotating sleeve 411 and the top plate; the first driving mechanism 412 is rotatably disposed on the bottom side wall of the rotating sleeve 411 to drive the rotating sleeve 411 to drive the uniform heat rotating shaft 320 to rotate; the rotor 132 is disposed on the middle side wall of the rotating sleeve 411, and the electrical conduction device 133 passes through the rotating sleeve 411 and the uniform heat rotating shaft 320 and is electrically connected to the heating device 134.

[0113] In some embodiments, the electrical conduction device 133 may be a wire line or other device capable of transmitting electrical energy.

[0114] The vapor phase growth apparatus further includes a gas injection device 500. In some embodiments, when the heat uniforming device 130 is disposed between the rotating base 110 and the first heating device 120, the gas injection device is disposed on the top wall or side wall of the process chamber 100 to provide gas.

[0115] In some specific embodiments, the gas injection device 500 is disposed on the top wall of the process chamber 100, the position of the substrate is opposite to the gas injection device along the axial direction of the process chamber 100, and the process gas ejected by the gas injection device 500 flows toward the substrate carrier where the substrate is located. In some specific embodiments, the gas injection device 500 is disposed on the side wall of the process chamber 100, the position of the substrate is opposite to the top wall of the process chamber 100 along the axial direction of the process chamber 100, and the process gas ejected by the gas injection device 500 flows through the substrate in a laminar flow manner from the side of the position of the substrate after being ejected.

[0116] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A vapor phase growth device provided with a rotating base, characterized in that: It comprises a process chamber (100), a rotating device, and a rotating base (110) for carrying a substrate, a first heating device (120) and a uniform heating device (130) arranged in the process chamber (100); The first heating device (120) is disposed between the rotating base (110) and the bottom wall of the process chamber (100) to provide heat; The rotating device comprises a carrier rotating shaft (310) and a heat-uniform rotating shaft (320) which are movably sleeved from the inside to the outside in sequence, and are respectively connected to the rotating base (110) and the heat-uniform device (130); the heat-uniform device (130) surrounds the carrier rotating shaft (310) and is disposed between the rotating base (110) and the first heating device (120); The rotating device comprises a rotating drive assembly (400), the top dynamic seal of the rotating drive assembly (400) is arranged on the process chamber (100), the edge of the top surface is connected to the uniform heat rotating shaft (320) to drive the uniform heat rotating shaft (320) to drive the uniform heat rotating shaft (320) to drive the uniform heat device (130) to rotate relative to the rotating base (110), and the carrier rotating shaft (310) passes through the uniform heat rotating shaft (320) and is arranged in the middle of the top surface of the rotating drive assembly (400) to drive the rotating base (110) to rotate relative to the uniform heat device (130) under the drive of the rotating drive assembly (400).

2. The vapor growth apparatus according to claim 1, characterized in that: The rotary drive assembly (400) comprises: An upper rotating sealing assembly (410), the top of which is disposed at the bottom of the process chamber (100) in a dynamic sealing manner and is connected to the heat-uniform rotating shaft (320) to drive the heat-uniform device (130) to rotate relative to the rotating base (110); A lower rotating sealing assembly (420), the top of which is arranged at the bottom of the upper rotating sealing assembly (410); The transmission shaft (430) passes through the upper rotating seal assembly (410) and the lower rotating seal assembly (420) and is connected to the carrier rotating shaft (310), so that the lower rotating seal assembly (420) drives the rotating base (110) to rotate relative to the heat equalizing device (130) through the transmission shaft (430).

3. The vapor phase growth apparatus according to claim 2, characterized in that: The lower rotary sealing assembly (420) comprises a fixed sleeve (421) and a second driving mechanism (422); The transmission shaft (430) passes through the fixed sleeve (421) and the upper rotating sealing assembly (410) from the bottom of the fixed sleeve (421), and is connected to the carrier rotating shaft (310); The bottom of the transmission shaft (430) protrudes from the bottom of the fixed sleeve (421), and the second driving mechanism (422) is disposed at the bottom of the fixed sleeve (421) in a dynamic sealing manner and is rotatably connected to the transmission shaft (430) to drive the transmission shaft (430) to rotate relative to the fixed sleeve (421).

4. The vapor phase growth apparatus according to claim 2, characterized in that: The upper rotary sealing assembly (410) comprises a rotary sleeve (411) and a first driving mechanism (412); The transmission shaft (430) passes through the rotating sleeve (411) and is connected to the carrier rotating shaft (310); The top of the rotating sleeve (411) is connected to the heat-uniform rotating shaft (320), and the first driving mechanism (412) is rotationally connected to the side wall of the rotating sleeve (411) to drive the rotating sleeve (411) to drive the heat-uniform rotating shaft (320) to rotate relative to the transmission shaft (430).

5. The vapor phase growth apparatus according to claim 3, characterized in that: The transmission shaft (430) comprises an upper shaft body (431) and a lower shaft body (432) connected to each other; The upper shaft body (431) extends axially along the upper rotating seal assembly (410), one end of which is connected to the carrier rotating shaft (310) and the other end of which is inside the upper rotating seal assembly (410); The lower shaft body (432) extends axially along the lower rotating seal assembly (420), and the bottom protrudes from the bottom of the lower rotating seal assembly (420). The second driving mechanism (422) is disposed at the bottom of the lower rotating seal assembly (420) in a dynamic sealing manner and is rotatably connected to the bottom of the lower shaft body (432).

6. The vapor phase growth apparatus according to claim 2, characterized in that: The upper rotary sealing assembly (410) comprises a sealing plate (413), a rotary sleeve (411) and a first driving mechanism (412); the lower rotary sealing assembly (420) comprises a fixed sleeve (421) and a second driving mechanism (422); The rotating sleeve (411) is disposed on the top of the sealing plate (413) in a dynamic sealing manner, the top of the rotating sleeve (411) is connected to the heat-uniform rotating shaft (320), and the first driving mechanism (412) is rotatably disposed on the side wall of the rotating sleeve (411) to drive the rotating sleeve (411) to drive the heat-uniform rotating shaft (320) to rotate relative to the sealing plate (413); The top of the fixed sleeve (421) is fixedly sealed and arranged at the bottom of the sealing plate (413); the transmission shaft (430) penetrates through the sealing plate (413) and then extends into the rotating sleeve (411); the bottom of the transmission shaft (430) protrudes from the bottom of the fixed sleeve (421); the second driving mechanism (422) is arranged at the bottom of the fixed sleeve (421) in a dynamic sealing manner and is rotatably connected to the transmission shaft (430) to drive the transmission shaft (430) to rotate relative to the fixed sleeve (421).

7. The vapor phase growth apparatus according to claim 4, characterized in that: The upper rotary sealing assembly (410) further comprises a sealing sleeve (414) disposed at the bottom of the process chamber (100); the sealing sleeve (414) is mounted on the rotary sleeve (411) in a dynamic sealing manner to strengthen the dynamic sealing relationship between the rotary sleeve (411) and the bottom of the process chamber (100).

8. The vapor growth apparatus according to claim 1, characterized in that: The heat-uniformizing device (130) comprises a heat-conducting device (131) connected to the top of the heat-uniformizing rotating shaft (320).

9. The vapor phase growth apparatus according to claim 2, characterized in that: It also includes a power supply stator, a rotor (132) and an electric conduction device (133), and the heat uniforming device (130) includes a heating device (134); The heating device (134) is connected to the top of the heat-distributing rotating shaft (320); The rotor (132) is sleeved on the upper rotating seal assembly (410), the electrical conduction device (133) is electrically connected to the rotor (132), passes through the upper rotating seal assembly (410) and the heat-distributing rotating shaft (320), and is electrically connected to the heating device (134), the power supply stator is sleeved on the rotor (132) and is stationary relative to the process chamber (100), so as to provide electrical energy for generating heat for the heating device (134) through the rotational friction between the rotor (132) and the power supply stator.

10. The vapor phase growth apparatus according to claim 9, characterized in that: The power supply stator, the rotor (132) and the electrical conduction device (133) form a conductive slip ring.

11. The vapor phase growth apparatus according to claim 9, characterized in that: The upper rotary sealing assembly (410) comprises a rotary sleeve (411), a sealing sleeve (414) and a first driving mechanism (412); The bottom of the rotating sleeve (411) is connected to the heat-distributing rotating shaft (320); The sealing sleeve (414) is disposed at the bottom of the process chamber (100) and is sleeved on the rotating sleeve (411) in a dynamic sealing manner to strengthen the dynamic sealing relationship between the rotating sleeve (411) and the bottom of the process chamber (100); The first driving mechanism (412) is rotatably disposed on the bottom side wall of the rotating sleeve (411) to drive the rotating sleeve (411) to drive the heat-uniform rotating shaft (320) to rotate; The rotor (132) is arranged on the side wall of the middle part of the rotating sleeve (411), and the electrical conduction device (133) passes through the rotating sleeve (411) and the heat-distributing rotating shaft (320) and is electrically connected to the heating device (134).

12. The vapor phase growth apparatus according to claim 11, characterized in that: The rotating sleeve (411) comprises an inner rotating body (415) and an outer rotating body (416) which are sequentially sleeved from the inside to the outside, so that the bottom side wall of the inner rotating body (415) is exposed; The sealing sleeve (414) is sleeved on the outer rotating body (416) in a dynamic sealing manner and covers the top side wall of the outer rotating body (416) so that the middle side wall and the bottom side wall of the outer rotating body (416) are exposed, and the rotor (132) is arranged on the middle side wall of the outer rotating body (416); The first driving mechanism (412) rotates the bottom side wall of the inner rotating body (415) to drive the inner rotating body (415) and the outer rotating body (416) to rotate synchronously; At least one of the inner rotating body (415) and the outer rotating body (416) is connected to the heat dissipating rotating shaft (320).

13. The vapor phase growth apparatus according to claim 12, characterized in that: The inner rotating body (415) and the outer rotating body (416) are detachably arranged, and at least one of the inner rotating body (415) and the outer rotating body (416) is detachably arranged with respect to the heat-distributing rotating shaft (320).

14. The vapor growth apparatus according to claim 1, characterized in that: The radial dimension of the heat-uniform device (130) does not exceed the radial dimension of the bearing surface of the rotating base (110), and the radial dimension of the heat-uniform device (130) is not less than 95% of the radial dimension of the bearing surface of the rotating base (110).

15. The vapor growth apparatus according to claim 1, characterized in that: It also includes a gas injection device (500), and the gas injection device (500) is arranged on the top wall or the side wall of the process chamber (100).

Citation Information

Patent Citations

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