Semiconductor wafer defect detection device

Abstract

The invention relates to the technical field of wafer detection, in particular to a semiconductor wafer defect detection device. The semiconductor wafer defect detection device comprises a supporting base, the top of the supporting base is fixedly connected with a supporting frame, a plurality of separation blocks are arranged in the supporting frame, one side of the supporting frame is fixedly connected with a support, one side of the support is provided with a limiting assembly, the limiting assembly comprises a sliding groove, and the sliding groove is fixedly connected with the supporting frame. The sliding groove is formed in one side of the support, a sliding block is movably connected to the interior of the sliding groove, a hydraulic rod is fixedly connected to one side of the sliding block, a supporting rod is fixedly connected to one side of the hydraulic rod, a sliding rail is arranged at the bottom of the sliding groove, and a movable block is movably connected to the exterior of the sliding groove. According to the device, the wafer can be accurately positioned and stably fixed, the wafer is prevented from falling off or shaking during detection, the accuracy of a detection result is prevented from being influenced, and the universality and the flexibility of the device are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and in particular to a semiconductor wafer defect detection device. Background Art

[0002] Semiconductor wafers are thin slices of semiconductor material used to manufacture integrated circuits. Wafers are made of very pure single-crystalline materials. Through a complex process, cylindrical ingots of high-purity single-crystalline semiconductors are made, which are then cut into thin slices. These slices are polished and cleaned to ensure a smooth and defect-free surface.

[0003] During the inspection process, the existing wafer defect inspection device usually clamps the wafer through a clamping block and places it directly on the inspection table. Since the sizes of wafers are different and the placement positions are also different, not only manual adjustment is required, but also position errors are easily caused, which in turn affects the accuracy of the inspection. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor wafer defect detection device to solve the problem proposed in the above background technology that the wafer is usually clamped by a clamping block and placed directly on the detection table. Since the sizes of the wafers are different and the placement positions are also different, not only manual adjustment is required, but also position errors are easily caused, thereby affecting the accuracy of the detection. In order to achieve the above purpose, the present invention provides the following technical solutions: A semiconductor wafer defect detection device, including a support base, the top of the support base is fixedly connected to a support frame, a plurality of partition blocks are arranged inside the support frame, one side of the support frame is fixedly connected to a bracket, one side of the bracket is provided with a limiting component, the limiting component includes a slide groove, the slide groove is opened on one side of the bracket, the slide groove is movably connected to a slider inside, one side of the slider is fixedly connected to a hydraulic rod, one side of the hydraulic rod is fixedly connected to a support rod, the bottom of the slide groove is provided with a slide rail, the outer side is movably connected to a movable block, and the two sides of the slide rail are respectively A fixed block is fixedly connected, one side of the fixed block is fixedly connected to a telescopic push rod, the outside of the telescopic push rod is movably connected to a return spring, one end of the telescopic push rod is fixedly connected to one side of the movable block, one side of the movable block is fixedly connected to a connecting rod, the top of the connecting rod is fixedly connected to an arc block, and by installing a limit assembly, the wafer can be accurately positioned and stably fixed to prevent the wafer from falling off or shaking during detection, thereby affecting the accuracy of the detection result, and at the same time, through the coordinated use of the hydraulic rod and the telescopic push rod, the wafer can be adaptively adjusted according to different sizes and shapes, thereby improving the versatility and flexibility of the device.

[0005] Further preferably, a motor is fixedly connected to one side of the bracket, a rotating rod is fixedly connected to the output end of the motor, and a fixed disk is fixedly connected to the top of the rotating rod. The rotating rod is driven by the motor to rotate, thereby driving the fixed disk and the wafer thereon to rotate. The wafer rotates on the fixed disk, so that the camera module or other detection device can comprehensively and evenly scan the surface of the wafer, reducing detection errors caused by wafer shaking or position displacement, and improving the accuracy and comprehensiveness of detection.

[0006] Further preferably, one side of the bracket is fixedly connected to a fixing plate, the bottom of the fixing plate is fixedly connected to a cylinder rod 1, one side of the cylinder rod 1 is fixedly connected to a telescopic rod, the bottom of the telescopic rod is fixedly connected to a detection block, and the bottom of the detection block is fixedly connected to a camera module. The telescopic function of cylinder rod 1 enables the detection block and the camera module thereon to move up and down, and by adjusting the detection height, it is ensured that the camera module can accurately focus on the wafer surface and capture clear and high-quality images, thereby improving the accuracy and reliability of detection and reducing the risks of missed detection and false detection.

[0007] Further preferably, one side of the bracket is fixedly connected with a cylinder rod 2, the top of the cylinder rod 2 is fixedly connected with a mounting block, the top of the mounting block is fixedly connected with a sliding rod, the outside of the sliding rod is movably connected with a moving block, and one side of the moving block is fixedly connected with a fixed rod. Wafers that fail the inspection can be taken away by the fixed rod driven by the extension and retraction of the cylinder rod 2, so that they can be smoothly transferred to the designated position through the sliding of the moving block, avoiding shaking or position displacement of the wafer during transportation, thereby improving stability in use.

[0008] Further preferably, a support plate is fixedly connected to one side of the bracket, and a support shaft is fixedly connected to the top of the support plate. The fixed connection between the support plate and the support shaft provides additional support for the entire detection device, which can provide centralized support for unqualified wafers and enhance the stability and rigidity of the structure.

[0009] Further preferably, a control panel is fixedly connected to one side of the bracket, an emergency button is provided on one side of the control panel, a display light is provided on the top of the control panel, the display light is electrically connected to the control panel, and the emergency button is electrically connected to the control panel. Through the integrated use of the control panel and the emergency button, the operator can control and monitor the detection device without directly contacting the detection device. When the detection device is in working state, standby state or fails, the display light can send different signals to indicate the current state, thereby helping the operator to respond in time.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] In the present invention, by installing a limit assembly, the wafer can be accurately positioned and stably fixed, thereby preventing the wafer from falling off or shaking during detection, which in turn affects the accuracy of the detection results. At the same time, through the coordinated use of the hydraulic rod and the telescopic push rod, the wafer can be adaptively adjusted according to different sizes and shapes, thereby improving the versatility and flexibility of the device.

[0012] In the present invention, the telescopic function of the cylinder rod 1 enables the detection block and the camera module thereon to move up and down. By adjusting the detection height, it is ensured that the camera module can accurately focus on the wafer surface and capture clear, high-quality images, thereby improving the accuracy and reliability of detection and reducing the risks of missed detection and false detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The three-dimensional structure of the present invention is shown in FIG. Figure 1 ;

[0014] Figure 2 The present invention is a schematic diagram of a local stereoscopic enlarged structure. Figure 1 ;

[0015] Figure 3 For the present invention Figure 2 A in the middle is an enlarged schematic diagram of the three-dimensional structure;

[0016] Figure 4 The present invention is a schematic diagram of a local stereoscopic enlarged structure. Figure 2 ;

[0017] Figure 5 The present invention is a schematic diagram of a local stereoscopic enlarged structure. Figure 3 ;

[0018] Figure 6 The three-dimensional structure of the present invention is shown in FIG. Figure 2 .

[0019] In the figure: 1. support base; 2. support frame; 3. partition block; 4. bracket; 5. limit assembly; 6. motor; 7. rotating rod; 8. fixed disc; 9. fixed plate; 10. cylinder rod one; 11. telescopic rod; 12. detection block; 13. camera module; 14. cylinder rod two; 15. mounting block; 16. slide rod; 17. moving block; 18. fixed rod; 19. support plate; 20. support shaft; 21. control panel; 22. emergency button; 23. display light; 501. slide groove; 502. slider; 503. hydraulic rod; 504. support rod; 505. slide rail; 506. movable block; 507. fixed block; 508. telescopic push rod; 509. reset spring; 510. connecting rod; 511. arc block. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technical personnel in this field without creative work are within the scope of protection of the present invention.

[0021] See also Figure 1 - Figure 6 The present invention provides a technical solution: a semiconductor wafer defect detection device, comprising a support base 1, a support frame 2 is fixedly connected to the top of the support base 1, a plurality of partition blocks 3 are arranged inside the support frame 2, a bracket 4 is fixedly connected to one side of the support frame 2, a limiting component 5 is arranged on one side of the bracket 4, the limiting component 5 comprises a slide groove 501, the slide groove 501 is opened on one side of the bracket 4, a slider 502 is movably connected inside the slide groove 501, a hydraulic rod 503 is fixedly connected to one side of the slider 502, a support rod 504 is fixedly connected to one side of the hydraulic rod 503, a slide rail 505 is arranged at the bottom of the slide groove 501, and a movable block 506 is movably connected to the outside, fixed blocks 507 are respectively fixedly connected to the two sides of the slide rail 505, a telescopic push rod 508 is fixedly connected to one side of the fixed block 507, a reset spring 509 is movably connected to the outside of the telescopic push rod 508, one end of the telescopic push rod 508 is fixedly connected to one side of the movable block 506, and the movable block 50 One side of 6 is fixedly connected with a connecting rod 510, and the top of the connecting rod 510 is fixedly connected with an arc block 511. One side of the bracket 4 is fixedly connected with a motor 6, and the output end of the motor 6 is fixedly connected with a rotating rod 7, and the top of the rotating rod 7 is fixedly connected with a fixed disc 8. When in use, the staff first places the wafer to be detected inside the support frame 2, and the slider 502 slides inside the slide groove 501 to drive the hydraulic rod 503 to the specified position, and the hydraulic rod 503 is telescopically driven to drive the support rod 504 to take the wafer inside the support frame 2, and then the hydraulic rod 503 and the slider 502 cooperate with each other to enable the wafer to be detected to be placed on the top of the fixed disc 8, and then the arc block 511 connected to the connecting rod 510 is pushed by the telescopic push rod 508 to adjust the position of the wafer so that it can be in the middle of the fixed disc 8, and then by starting the motor 6, the rotating rod 7 is rotated to drive the fixed disc 8 to rotate, and the wafer on its top is rotated for detection.

[0022] In this embodiment, Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 6As shown, one side of the bracket 4 is fixedly connected to a fixing plate 9, the bottom of the fixing plate 9 is fixedly connected to a cylinder rod 10, one side of the cylinder rod 10 is fixedly connected to a telescopic rod 11, the bottom of the telescopic rod 11 is fixedly connected to a detection block 12, the bottom of the detection block 12 is fixedly connected to a camera module 13, one side of the bracket 4 is fixedly connected to a cylinder rod 2 14, the top of the cylinder rod 2 14 is fixedly connected to a mounting block 15, the top of the mounting block 15 is fixedly connected to a slide bar 16, the outside of the slide bar 16 is movably connected to a moving block 17, one side of the moving block 17 is fixedly connected to a fixing rod 18, one side of the bracket 4 is fixedly connected to a support plate 19, the top of the support plate 19 is fixedly connected to a support shaft 2 0, the wafer is placed on the fixed disc 8 on one side of the bracket 4 and driven to rotate by the motor 6. At the same time, the cylinder rod 10 drives the telescopic rod 11 and the detection block 12 to move up and down through telescopic movement. A camera module 13 is fixed at the bottom of the detection block 12 to capture the surface image of the wafer. The collected image data will be transmitted to the computer system for further processing. The detection system can automatically identify different types of defects. At the same time, the cylinder rod 2 14 telescopically drives the mounting block 15, the slide bar 16 and the moving block 17 to move along the direction of the slide bar 16, and the wafers that fail the inspection are placed on the support shaft 20 at the top of the support plate 19 for unified processing by the staff.

[0023] In this embodiment, Figure 1 and Figure 6 As shown, a control panel 21 is fixedly connected to one side of the bracket 4, an emergency button 22 is provided on one side of the control panel 21, a display light 23 is provided on the top of the control panel 21, the display light 23 is electrically connected to the control panel 21, and the emergency button 22 is electrically connected to the control panel 21. During the detection process, the operator controls and monitors the detection device through the control panel 21. When an abnormal situation occurs in the detection device, the operator can press the emergency button 22 to cut off the power supply to prevent the accident from expanding. At the same time, the display light 23 will light up a specific color or flash a specific frequency to provide intuitive alarm information to the operator. The operator can take corresponding measures to deal with it according to the indication of the display light 23 and the alarm information.

[0024] The use method and advantages of the present invention: When the semiconductor wafer defect detection device is used, the working process is as follows:

[0025] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, when in use, the wafer is placed inside the support frame 2, and the wafer is accurately taken and placed on the top of the fixed disc 8 by the sliding of the slider 502 in the slide groove 501 and the extension and retraction of the hydraulic rod 503. The telescopic push rod 508 further pushes the connecting rod 510 and the arc block 511 to fine-tune the position of the wafer to ensure that it is located in the middle of the fixed disc 8, and then the motor 6 is started to drive the fixed disc 8 to rotate by the rotating rod 7, so that the wafer rotates on the fixed disc 8, and the cylinder rod 10 drives the telescopic rod 11 and the detection block 12 to move up and down by extension and retraction. The camera module 13 at the bottom of the detection block 12 captures the image of the rotating wafer surface, and the image data is then transmitted to the computer system for further processing. The operator controls the control panel 21 The detection device is controlled and monitored as a whole. The control panel 21 provides an intuitive operation interface, so that the operator can easily set the detection parameters, start and stop the detection process, etc. The detection system can automatically identify different types of defects. At the same time, the cylinder rod 14 telescopically drives the mounting block 15, the slide bar 16 and the moving block 17 to move along the slide bar 16. The wafers that fail the detection are placed on the support shaft 20 at the top of the support plate 19, and the staff will handle them uniformly. During the detection process, if the device has an abnormal situation, the operator can immediately press the emergency button 22 to cut off the power supply to prevent the accident from expanding. At the same time, the display light 23 will light up a specific color or flash a specific frequency to provide intuitive alarm information to the operator. The operator can take corresponding measures to deal with it according to this information.

[0026] The above shows and describes the basic principles, main features and advantages of the present invention. Technical personnel in this industry should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor wafer defect detection device, comprising a support base (1), characterized in that: The top of the support base (1) is fixedly connected to a support frame (2), a plurality of partition blocks (3) are arranged inside the support frame (2), a support frame (4) is fixedly connected to one side of the support frame (2), a limit assembly (5) is arranged on one side of the support frame (4), the limit assembly (5) comprises a slide groove (501), the slide groove (501) is arranged on one side of the support frame (4), a slider (502) is movably connected inside the slide groove (501), a hydraulic rod (503) is fixedly connected to one side of the slider (502), a support rod (504) is fixedly connected to one side of the hydraulic rod (503), and the limit assembly (55) comprises a slide groove (501), the slide groove (501) is arranged on one side of the support frame (4), a slider (502) is movably connected inside the slide groove (501), a hydraulic rod (503) is fixedly connected to one side of the slider (502), and a support rod (504) is fixedly connected to one side of the hydraulic rod (503). A slide rail (505) is provided at the bottom of the slide groove (501), and a movable block (506) is movably connected to the outside. Fixed blocks (507) are fixedly connected to both sides of the slide rail (505), and a telescopic push rod (508) is fixedly connected to one side of the fixed block (507). A return spring (509) is movably connected to the outside of the telescopic push rod (508). One end of the telescopic push rod (508) is fixedly connected to one side of the movable block (506), and a connecting rod (510) is fixedly connected to one side of the movable block (506). The top of the connecting rod (510) is fixedly connected to an arc block (511).

2. A semiconductor wafer defect detection device according to claim 1, characterized in that: A motor (6) is fixedly connected to one side of the bracket (4), a rotating rod (7) is fixedly connected to the output end of the motor (6), and a fixed disc (8) is fixedly connected to the top of the rotating rod (7).

3. A semiconductor wafer defect detection device according to claim 2, characterized in that: A fixing plate (9) is fixedly connected to one side of the bracket (4), a cylinder rod (10) is fixedly connected to the bottom of the fixing plate (9), a telescopic rod (11) is fixedly connected to one side of the cylinder rod (10), a detection block (12) is fixedly connected to the bottom of the telescopic rod (11), and a camera module (13) is fixedly connected to the bottom of the detection block (12).

4. A semiconductor wafer defect detection device according to claim 3, characterized in that: A second cylinder rod (14) is fixedly connected to one side of the bracket (4), a mounting block (15) is fixedly connected to the top of the second cylinder rod (14), and a sliding rod (16) is fixedly connected to the top of the mounting block (15).

5. The semiconductor wafer defect detection device according to claim 4, characterized in that: The outside of the sliding rod (16) is movably connected to a moving block (17), and one side of the moving block (17) is fixedly connected to a fixed rod (18).

6. The semiconductor wafer defect detection device according to claim 5, characterized in that: A support plate (19) is fixedly connected to one side of the bracket (4), and a support shaft (20) is fixedly connected to the top of the support plate (19).

7. The semiconductor wafer defect detection device according to claim 6, characterized in that: A control panel (21) is fixedly connected to one side of the bracket (4), and an emergency button (22) is provided on one side of the control panel (21).

8. The semiconductor wafer defect detection device according to claim 7, characterized in that: A display light (23) is provided on the top of the control panel (21), and the display light (23) is electrically connected to the control panel (21), and the emergency button (22) is electrically connected to the control panel (21).

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