A composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement

Abstract

The embodiment of the present invention provides a composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement, including: a plurality of two-dimensional heat pipes, which are arranged in the same plane and arranged in a matrix, and each two-dimensional heat pipe is coated with paints of different emissivity; circuit boards are arranged one by one corresponding to the two-dimensional heat pipes, and each circuit board is provided with a Peltier and a thermocouple on the surface of the side facing the two-dimensional heat pipe corresponding to it; a radiator is arranged one by one corresponding to the circuit board and is located on the side of the circuit board away from the two-dimensional heat pipe; a PID controller is used to continuously monitor and adjust the temperature of the two-dimensional heat pipe through a thermocouple to ensure that the temperature is always stable within a preset ideal range; a computer is used to preset the surface temperature of the two-dimensional heat pipe. It establishes four infrared radiation equations by measuring four paints with different emissivity, and solves the equations together to back-calculate the atmospheric transmittance. This method can eliminate the adverse effects of environmental parameters.

Description

Technical Field

[0001] The invention relates to the field of optoelectronic technology, in particular to a composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement. Background Art

[0002] Atmospheric transmittance is one of the important parameters for infrared target characteristic testing. It is closely related to environmental parameters such as test distance, temperature, humidity, atmospheric pressure, visibility, and aerosols, but it is difficult to obtain atmospheric transmittance through conventional means. During the test, some environmental parameters such as test distance, temperature, humidity, atmospheric pressure, visibility, etc. can be obtained more accurately using existing instruments and equipment, while the measurement of aerosols by existing instruments and equipment has large errors. In addition, since the atmospheric transmittance has a nonlinear relationship with some environmental parameters, such as the test distance, even if the environmental parameters related to the atmospheric transmittance are obtained, it is difficult to accurately calculate the atmospheric transmittance under the current environmental conditions.

[0003] Infrared thermal imagers are important equipment for testing infrared target characteristics. As the age of the instrument increases, its test accuracy also decreases accordingly. Therefore, in the actual test process, a blackbody radiation source is needed to calibrate the infrared thermal imager. At present, a surface source blackbody radiation source is usually used for field infrared target characteristic testing. The surface source blackbody radiation source on the market is generally made of a whole piece of stainless steel plate, aluminum plate and other materials, and an electric heater is used to control the radiation temperature of the front panel of the surface source blackbody radiation source. The shortcomings of existing surface source blackbody radiation sources are that they are made of a whole piece of stainless steel or aluminum plate, resulting in uneven temperature at the edges; in addition, the existing electric heater can only increase the temperature but not reduce the temperature (such as below the ambient temperature). Summary of the invention

[0004] In view of the above-mentioned problems existing in the prior art, an embodiment of the present invention provides a composite device for inverse calculation of atmospheric transmittance and calibration of infrared temperature measurement, which establishes four infrared radiation equations by measuring four paints with different emissivity, and inversely calculates the atmospheric transmittance by solving the equations simultaneously. This method can eliminate the adverse effects of environmental parameters.

[0005] The embodiment of the present invention provides a composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement, comprising:

[0006] A plurality of two-dimensional heat pipes are disposed in the same plane and arranged in a matrix, each of the two-dimensional heat pipes being coated with paint of different emissivity;

[0007] Circuit boards are arranged corresponding to the two-dimensional heat pipes one by one, and each circuit board is provided with a Peltier and a thermocouple on a surface of a side facing the corresponding two-dimensional heat pipe;

[0008] A radiator that is provided in one-to-one correspondence with the circuit board and is located on the side of the circuit board away from the two-dimensional heat pipe;

[0009] A PID controller for continuously monitoring and adjusting the temperature of the two-dimensional heat pipe through a thermocouple to ensure that the temperature always remains stable within a preset ideal range;

[0010] A computer for presetting the surface temperature of the two-dimensional heat pipe.

[0011] In some embodiments of the present invention, the composite device for inverse calculating atmospheric transmittance and calibrating infrared temperature measurement further includes:

[0012] A frame for carrying the two-dimensional heat pipe, the circuit board, and the circuit board.

[0013] In some embodiments of the present invention, the two-dimensional heat pipe is used to quickly and evenly distribute the refrigerating or heating heat generated by the Peltier over the entire surface.

[0014] In some embodiments of the present invention, the Peltier is used to generate heat transfer between its two ends when an electric current passes through the Peltier, and the heat will transfer from one end to the other end, thereby generating a temperature difference to form a hot and cold end.

[0015] In some embodiments of the present invention, the thermocouple is a temperature sensor for real-time monitoring of the temperature on the surface of the two-dimensional heat pipe and feeding back the temperature data to the PID controller for closed-loop feedback with the set temperature.

[0016] In some embodiments of the present invention, the wires of the thermocouple and the Peltier are connected to the corresponding circuit board by welding. At the same time, each circuit board is connected to the PID controller;

[0017] In some embodiments of the present invention, the radiator is customized according to the Peltier to dissipate the heat generated by the Peltier.

[0018] In some embodiments of the present invention, there are 4 two-dimensional heat pipes, which are respectively coated with ε1 emissivity paint, ε2 emissivity paint, ε3 emissivity paint, and ε4 emissivity paint on the surface. The 4 two-dimensional heat pipes are arranged in a cross shape along the thickness direction and are bonded together into a whole by glue.

[0019] In some embodiments of the present invention, the circuit board, Peltier, and thermocouple in the middle layer are respectively installed at the corresponding positions of the 4 corresponding two-dimensional heat pipes;

[0020] The adjacent four circuit boards are circuit-connected by welding, the entire circuit board is connected to the PID controller, and the computer is connected to the PID controller through a data cable;

[0021] The inner radiators are installed at the corresponding positions of the corresponding circuit boards using thermally conductive silicone rubber;

[0022] The entire device is installed and fixed using a frame.

[0023] Compared with the prior art, the composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement provided by the embodiment of the present invention has the following beneficial effects: currently there is no device on the market that can simultaneously realize the functions of back-calculating atmospheric transmittance and calibrating infrared temperature measurement, while the present device has this function; the accuracy of the calculated atmospheric transmittance is low when the relevant environmental parameters are measured using existing instruments and equipment, and the present device establishes four infrared radiation equations by measuring four paints with different emissivity, and the atmospheric transmittance is obtained by back-calculating the equation group by solving them simultaneously, and this method can eliminate the adverse effects of environmental parameters; the existing surface source blackbody radiation source on the market can only heat up (cannot be lower than the ambient temperature), while the present device uses Peltier as a heating device, which can realize the functions of increasing the temperature and lowering the temperature (lower than the ambient temperature). BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic front view of a composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement provided by an embodiment of the present invention;

[0025] Figure 2 A schematic side view of a composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement provided by an embodiment of the present invention;

[0026] Figure 3 A three-dimensional schematic diagram of a composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement provided by an embodiment of the present invention.

[0027] Reference numerals

[0028] 1. Two-dimensional heat pipe (surface coated with ε1 emissivity paint); 2. Two-dimensional heat pipe (surface coated with ε2 emissivity paint) 3. Two-dimensional heat pipe (surface coated with ε3 emissivity paint); 4. Two-dimensional heat pipe (surface coated with ε4 emissivity paint); 5. Circuit board; 6. Peltier; 7. Thermocouple; 8. Circuit board; 9. Peltier; 10. Thermocouple; 11. Circuit board; 12. Peltier; 13. Thermocouple; 14. Circuit board; 15. Peltier; 16. Thermocouple; 17. Radiator; 18. Radiator; 19. Radiator; 20. Radiator; 21. Frame; 22. PID controller; 23. Computer. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0030] Various aspects and features of the present application are described herein with reference to the accompanying drawings.

[0031] These and other characteristics of the present application will become apparent from the following description of a preferred form of embodiment given as a non-limiting example with reference to the accompanying drawings.

[0032] It should also be understood that, although the present application has been described with reference to some specific examples, those skilled in the art will be able to realize many other equivalent forms of the present application that have the features described in the claims and are therefore within the scope of protection defined thereby.

[0033] The above and other aspects, features and advantages of the present application will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.

[0034] Specific embodiments of the present application are described hereinafter with reference to the accompanying drawings; however, it should be understood that the embodiments applied for are merely examples of the present application, which may be implemented in a variety of ways. Well-known and / or repeated functions and structures are not described in detail to determine the true intent based on the user's historical operations and to avoid unnecessary or redundant details that make the present application unclear. Therefore, the specific structural and functional details applied for herein are not intended to be limiting, but are merely used as the basis and representative basis for the claims to teach those skilled in the art to use the present application in a variety of ways with substantially any suitable detailed structure.

[0035] This specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," all of which may refer to one or more of the same or different embodiments according to the present application.

[0036] The embodiment of the present invention provides a composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement, such as Figures 1 to 3 As shown, including:

[0037] A plurality of two-dimensional heat pipes are disposed in the same plane and arranged in a matrix, each of the two-dimensional heat pipes being coated with paint of different emissivity;

[0038] Circuit boards are arranged corresponding to the two-dimensional heat pipes one by one, and each circuit board is provided with a Peltier and a thermocouple on a surface of a side facing the corresponding two-dimensional heat pipe;

[0039] A heat sink arranged in one-to-one correspondence with the circuit boards and located on a side of the circuit boards away from the two-dimensional heat pipes;

[0040] A PID controller 22, which is used to continuously monitor and adjust the temperature of the two-dimensional heat pipe through a thermocouple to ensure that the temperature is always stable within a preset ideal range;

[0041] A computer 23, which is used to preset the surface temperature of the two-dimensional heat pipe;

[0042] The frame 21 is used to support the two-dimensional heat pipe, the circuit board and the circuit board.

[0043] To facilitate understanding of the above technical solution, the following is an explanation in conjunction with the accompanying drawings and specific examples, as follows:

[0044] The composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement is similar to a sandwich structure, which specifically includes 4 two-dimensional heat pipes (coated with 4 different emissivities), 4 circuit boards, 4 Peltiers, 4 thermocouples, 4 radiators, 1 frame, 1 PID controller, 1 computer, etc. Figure 1 shown.

[0045] Two-dimensional heat pipe: also known as siphon heat pipe, is a highly efficient heat transfer device that can quickly and evenly distribute the heat generated by the Peltier (including cooling or heating) over the entire surface. In addition, the four two-dimensional heat pipes used in this device are coated with four different emissivity paints on their outer surfaces.

[0046] Peltier: Also known as TEC. When current passes through the Peltier, heat transfer occurs between its two ends. Heat is transferred from one end to the other, resulting in a temperature difference to form a hot and cold end.

[0047] Thermocouple: a temperature sensor that monitors the temperature of the two-dimensional heat pipe surface in real time and feeds the temperature data back to the PID controller for closed-loop feedback with the set temperature.

[0048] Circuit board: The wires of thermocouple and Peltier are connected to the circuit board by welding, and the circuit board is connected to the PID controller;

[0049] Radiator: The radiator is customized based on Peltier, which is mainly used to dissipate the heat generated by Peltier;

[0050] PID controller 22: continuously monitors and adjusts the temperature of the two-dimensional heat pipe through sensors to ensure that the temperature is always stable within a preset ideal range;

[0051] Computer 23: preset the surface temperature of the two-dimensional heat pipe;

[0052] Frame 21: serves as the external structural carrier of the entire device.

[0053] In actual engineering, the processing and assembly of a composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement is divided into the following three steps:

[0054] A. Process 4 two-dimensional heat pipes for the outer layer as required, such as two-dimensional heat pipe 1 (coated with paint with emissivity ε1 on the surface), two-dimensional heat pipe 2 (coated with paint with emissivity ε2 on the surface), two-dimensional heat pipe 3 (coated with paint with emissivity ε3 on the surface), and two-dimensional heat pipe 4 (coated with paint with emissivity ε4 on the surface). Arrange the 4 two-dimensional heat pipes in a "field" shape along the thickness direction and bond them together with glue to form an integral whole.

[0055] B. Install the circuit board 5, Peltier 6, and thermocouple 7 in the middle layer at the corresponding positions on two-dimensional heat pipe 1 (coated with paint with emissivity ε1 on the surface), and connect the wires of Peltier 6 and thermocouple 7 to the circuit board 5 by welding;

[0056] Install the circuit board 8, Peltier 9, and thermocouple 10 in the middle layer at the corresponding positions on two-dimensional heat pipe 2 (coated with paint with emissivity ε2 on the surface), and connect the wires of Peltier 9 and thermocouple 10 to the circuit board 8 by welding;

[0057] Install the circuit board 11, Peltier 12, and thermocouple 13 in the middle layer at the corresponding positions on the two-dimensional heat pipe (coated with paint with emissivity ε3 on the surface), and connect the wires of Peltier 12 and thermocouple 13 to the circuit board 11 by welding;

[0058] Install the circuit board 14, Peltier 15, and thermocouple 16 in the middle layer at the corresponding positions on the two-dimensional heat pipe (coated with paint with emissivity ε4 on the surface), and connect the wires of Peltier 15 and thermocouple 16 to the circuit board 14 by welding;

[0059] Connect the adjacent circuit boards 5, circuit board 8, circuit board 11, and circuit board 14 by welding for circuit connection, connect the entire circuit board to the PID controller 22, and connect the computer 23 to the PID controller 22 through a data cable; then install the inner layer radiators 17, radiator 18, radiator 19, and radiator 20 at the corresponding positions of the circuit boards 5, circuit board 8, circuit board 11, and circuit board 14 using thermal conductive silicone.

[0060] C. Install and fix the entire device using the frame 21.

[0061] For the inverse calculation of atmospheric transmittance, according to the process requirements, coat 4 different emissivity paints on the outer surfaces of two-dimensional heat pipe 1, two-dimensional heat pipe 2, two-dimensional heat pipe 3, and two-dimensional heat pipe 4 respectively, such as the emissivity values are ε1, ε2, ε3, and ε4 (the emissivity values are known). In the field environment, use an infrared thermal imager to record the infrared thermal images of the 4 two-dimensional heat pipes, and the infrared radiation brightness measurement values W app,1 、W app,2, W app,3 , W app,4 According to the infrared radiation principle, four sets of equations can be obtained:

[0062] W app,1 =ε1τW obj +(1-ε1)τW ref +(1-τ)W atm (1)

[0063] W app,2 =ε2τW obj +(1-ε2)τW ref +(1-τ)W atm (2)

[0064] W app,3 =ε3τW obj +(1-ε3)τW ref +(1-τ)W atm (3)

[0065] W app,4 =ε4τW obj +(1-ε4)τW ref +(1-τ)W atm (4)

[0066] In the equation group, the surface emissivity ε1, ε2, ε3, ε4 of two-dimensional heat pipe 1, two-dimensional heat pipe 2, two-dimensional heat pipe 3, and two-dimensional heat pipe 4 are known, and the infrared radiation brightness W received by the infrared thermal imager is app,1 , W app,2 , W app,3 , W app,4 It has been measured; while the target of the two-dimensional heat pipe itself radiates W obj , atmospheric transmittance τ, target reflected background radiation W ref , atmospheric radiation W atm Theoretically, only four different emissivities are needed to inversely calculate the atmospheric transmittance τ. This method eliminates the adverse effects of environmental parameters and greatly improves the accuracy of the atmospheric transmittance τ.

[0067] The steps to calibrate infrared temperature measurement are as follows:

[0068] The surface temperatures of four two-dimensional heat pipes, such as T1, T2, T3, T4, etc., are set by computer;

[0069] The surface temperature of the two-dimensional heat pipe is regulated by Peltier to reach the expected set temperature;

[0070] The surface temperature of the two-dimensional heat pipe is monitored in real time using thermocouples, and the temperature is controlled by a PID controller to ensure that the temperature is always stable within the preset ideal range.

[0071] The surface temperature measurement values ​​T of four two-dimensional heat pipes were recorded using an infrared thermal imager. app,1 , T app,2 , T app,3 , T app,4 ;

[0072] The temperature measured by the infrared thermal imager is T app,1 , T app,2 , T app,3 , T app,4 By comparing with the preset temperatures T1, T2, T3, and T4, the temperature calibration of the infrared thermal imager can be realized. This method can realize the temperature calibration of the infrared thermal imager at four temperature points at one time, greatly improving the test efficiency of on-site work.

[0073] It can be seen from the above technical scheme that the composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement provided by the above embodiment of the present invention currently does not have the function of simultaneously realizing the back-calculation of atmospheric transmittance and the calibration of infrared temperature measurement on one device on the market, while the present device has this function; the relevant environmental parameters are measured using existing instruments and equipment, and the calculated atmospheric transmittance has low accuracy. The present device establishes four infrared radiation equations by measuring four paints with different emissivity, and the atmospheric transmittance is obtained by solving the equation group by simultaneous calculation. This method can eliminate the adverse effects of environmental parameters; the existing surface source blackbody radiation source on the market can only heat (cannot be lower than the ambient temperature), while the present device uses Peltier as a heating device, which can realize the functions of increasing the temperature and lowering the temperature (lower than the ambient temperature).

[0074] The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present invention.

Claims

1. A composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement, characterized in that: Including: A plurality of two-dimensional heat pipes, which are arranged in the same plane and in a matrix layout, and different emissivity paints are coated on each two-dimensional heat pipe; Circuit boards are arranged corresponding to the two-dimensional heat pipes one by one, and a Peltier and a thermocouple are provided on one surface of each circuit board facing the corresponding two-dimensional heat pipe; Radiators arranged corresponding to the circuit boards one by one and located on the side of the circuit board away from the two-dimensional heat pipe; A PID controller, which is used to continuously monitor and adjust the temperature of the two-dimensional heat pipe through the thermocouple to ensure that the temperature is always stable within a preset ideal range; A computer, which is used to preset the surface temperature of the two-dimensional heat pipe.

2. The composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement according to claim 1, characterized in that: It further includes: A frame, which is used to carry the two-dimensional heat pipe, the circuit board and the circuit board.

3. The composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement according to claim 2, wherein The two-dimensional heat pipe is used to quickly and evenly distribute the heat generated by the Peltier for refrigeration or heating on the entire surface.

4. The composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement according to claim 3, wherein The Peltier is used to generate heat transfer between its two ends when an electric current passes through the Peltier, and the heat will transfer from one end to the other end, thereby generating a temperature difference to form a hot and cold end.

5. The composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement according to claim 4, wherein The thermocouple is a temperature sensor, which is used to monitor the temperature of the surface of the two-dimensional heat pipe in real time and feed back the temperature data to the PID controller for closed-loop feedback with the set temperature.

6. The composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement according to claim 5, wherein The wires of the thermocouple and the Peltier are connected to the corresponding circuit board by welding, and at the same time, each circuit board is connected to the PID controller.

7. The composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement according to claim 6, wherein The radiator is customized according to the Peltier and is used to dissipate the heat generated by the Peltier.

8. The composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement according to claim 7, wherein There are 4 two-dimensional heat pipes, and ε1 emissivity paint, ε2 emissivity paint, ε3 emissivity paint and ε4 emissivity paint are respectively coated on the surfaces. The 4 two-dimensional heat pipes are arranged in a cross shape along the thickness direction and are bonded together as a whole through glue.

9. The composite device for back-calculating atmospheric transmittance and calibrating infrared temperature measurement according to claim 8, wherein The circuit board, Peltier and thermocouple in the middle layer are respectively installed at the corresponding positions of the 4 corresponding two-dimensional heat pipes; The adjacent four circuit boards are connected by welding for circuit connection, the entire circuit board is connected to the PID controller, and the computer is connected to the PID controller through a data cable; The inner-layer radiators are respectively installed at the corresponding positions corresponding to the circuit boards by using thermal conductive silicone; The entire device is installed and fixed by using a frame.

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