Methods and equipment for detecting gaps in photomasks

Abstract

This application provides a method and equipment for detecting gaps in photomasks, including: obtaining key features between chips in the design pattern based on the photomask exposure file; detecting normal gaps if the key features meet preset reference value conditions; determining the gap region corresponding to the normal gap and generating a coordinate file for the gap region; so that after the coordinate file is imported into the inspection machine, the machine inspects other regions besides the region corresponding to the coordinate file. This provides a technique for generating photomask GAP region coordinates using a data processing method. This method addresses various GAPs caused by data processing, significantly reducing photomask inspection time and improving photomask manufacturing yield. By automatically identifying and processing GAP regions, this invention effectively optimizes the photomask manufacturing process, ensuring improved production efficiency and quality.

Description

Technical Field

[0001] This application relates to the field of photomask technology, and more specifically, to a method and equipment for detecting gaps in a photomask. Background Technology

[0002] Photomasks are crucial in the manufacturing process. However, gaps can occur between two adjacent patterns during photomask fabrication. Generally, the presence of these gaps does not affect the product's instructions or performance, but they require manual verification and inspection to confirm that the gaps exist as expected, which can impact the product's testing efficiency.

[0003] However, existing technologies require manual intervention and pattern checking to detect gaps in photomasks, which increases production time and cost, and introduces human error that affects manufacturing efficiency and accuracy.

[0004] Therefore, a new scheme for gap detection in photomasks is needed. Summary of the Invention

[0005] In view of this, embodiments of this specification provide a method for detecting gaps in a photomask and a photomask detection device.

[0006] The embodiments in this specification provide the following technical solutions:

[0007] This specification provides an embodiment of a method for detecting gaps in a photomask, including:

[0008] Extract key features between chips in the design pattern from the photomask exposure file;

[0009] If the key features meet the preset reference value conditions, a normal gap is detected;

[0010] Determine the gap area corresponding to the normal gap and generate a coordinate file for the gap area so that after the coordinate file is imported into the inspection machine, the machine can inspect other areas besides the area corresponding to the coordinate file.

[0011] This specification provides a photomask gap detection module, which applies the photomask gap detection method described above.

[0012] This specification also provides an embodiment of a photomask inspection device, including a photomask gap detection module as described in the above technical solution, or employing a photomask gap detection method as described in the above technical solution.

[0013] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0014] This specification provides a technique for generating photomask GAP region coordinates using a data processing method. This method addresses various GAPs caused by data processing, significantly reducing photomask inspection time and improving photomask manufacturing yield. By automatically identifying and processing GAP regions, this invention effectively optimizes the photomask manufacturing process, ensuring improved production efficiency and quality. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of anomalies in photomasks in existing technology;

[0017] Figure 2 This is a comparative diagram showing the gaps that exist in the photomask design and the actual exposure.

[0018] Figure 3 This is a schematic diagram of the actual gap in the photomask;

[0019] Figure 4 This is a schematic diagram of a gap detection method in a photomask provided in this application;

[0020] Figure 5 This is a flowchart of a photomask gap detection method provided in this application. Detailed Implementation

[0021] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0022] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0024] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0025] Additionally, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be carried out without these specific details.

[0026] In the chip manufacturing process, the production of photomasks plays a crucial role.

[0027] After exposure, photomasks typically require inspection equipment to check for defects on their surface, such as stains, scratches, and dead pixels. These defects can affect the quality and performance of the photomask during manufacturing; therefore, early detection and repair of defects are crucial. Figure 1 The example shows a defect found on an inspection machine.

[0028] However, gaps often occur during photomask manufacturing. A gap typically refers to the space or interval between two adjacent patterns. Inspection equipment may detect defects (such as...) Figure 1 (As shown) After that, the location of the gap needs to be manually checked, and then the difference between the design graphic and the actual graphic needs to be compared. In particular, it is necessary to determine whether the gap appears at the junction of the chip and the dicing track (e.g., Figure 2 As shown, Figure 2 The example design in Part A does not contain a gap. Figure 2 The example in Part B shows a gap in the actual drawing.

[0029] In the current manufacturing environment, resolving such issues typically requires manual intervention and pattern checking to verify and adjust the manufactured photomasks. This not only increases time and costs in the production process, leading to inefficiency, but is also susceptible to subjective factors, introducing human error and affecting manufacturing efficiency and accuracy.

[0030] The inventors discovered that gaps (GAPs) appearing during photomask manufacturing differ from traditional surface defect detection. On one hand, due to the transformation relationships set by the process specifications during photomask manufacturing, gaps may occur in the inner frame area. However, these gaps are expected and do not affect the quality and performance of the final product. On the other hand, although gaps present during photomask manufacturing do not affect the quality and performance of the final product, they require additional manual verification or corresponding inspection steps, thus affecting the inspection efficiency after photomask exposure. Therefore, the goal is to effectively ignore these normal gaps during inspection without cumbersome inspection steps, while ensuring that the quality and performance of the final product meet requirements. In other words, to effectively handle normal gaps during photomask manufacturing, improving product quality and reducing production costs.

[0031] Based on this, the embodiments of this specification propose a new scheme for detecting gaps in photomasks. By using data processing methods to generate the coordinates of the gap areas in the photomask, the inspection time of the photomask is significantly reduced, the yield of photomask manufacturing is improved, and the photomask manufacturing process is effectively optimized by automatically identifying and processing the gap areas, thus ensuring the improvement of production efficiency and quality.

[0032] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0033] like Figures 3-5 As shown in the embodiment of this specification, a method for detecting gaps in a photomask is provided, including steps S501-S503. Step S501 involves obtaining key features between chips in the design pattern based on the photomask exposure file. Step S502 involves detecting normal gaps if the key features meet preset reference value conditions. Step S503 involves determining the gap region corresponding to the normal gap and generating a coordinate file for the gap region so that after the coordinate file is imported into the inspection machine, the machine can inspect other regions besides the region corresponding to the coordinate file.

[0034] In photomask manufacturing, the "inner frame" refers to the boundary lines or framework within the photomask pattern used to locate and delineate each specific chip region. When the chip pattern and the dicing pattern are adjacent, gaps (gaps) may appear in the inner frame area due to the transformation relationship set by the process bisector. These gaps are expected and do not affect the quality and performance of the final product, but they may require additional manual verification or inspection steps, impacting inspection efficiency. The key issue is how to effectively ignore these normal gaps during inspection to ensure that the quality and performance of the final product meet requirements.

[0035] During data processing, when edge-fitting graphics, such as Chip graphics and cut line graphics, are edge-fitting, the conversion relationship set by process bias can cause gaps to appear in the inner frame area. For example... Figure 3 As shown, a gap area appears between the inner boundary of the dicing channel and the boundary of the main chip. Although these gaps are expected and do not affect the quality and performance of the product, they require additional manual verification or inspection steps, resulting in extended inspection time and impacting inspection efficiency.

[0036] Specifically, in step S501, the key features between chips in the design pattern during photomask manufacturing are used to locate and demarcate the photomask pattern, and to automatically detect gaps in the photomask by scanning the exposure file after exposure. Obtaining the key features between chips in the design pattern provides a basis for gap detection in the photomask. In some embodiments, the key features between chips in the design pattern are obtained by using a high-precision scanning device or camera to scan or photograph the exposure file. The acquired images are then preprocessed and image analysis algorithms such as image segmentation and feature extraction are applied to measure the key features between adjacent chips.

[0037] In step S502, in conjunction with the above embodiments, key feature information between chips is acquired after exposure. This key feature information is then detected. If the detected key information meets a preset reference value condition, a normal gap is identified. In some embodiments, the most directly obtainable key feature between chips, such as width, is detected. If the width meets a preset reference value condition, a normal gap is detected. A normal gap is expected and does not affect the quality and performance of the product.

[0038] In step S503, after a normal gap is detected, the gap area corresponding to that normal gap is determined, and a coordinate file of the gap area is generated. After this coordinate file is imported into the inspection machine, the machine inspects areas other than those corresponding to the coordinate file.

[0039] In some embodiments, image analysis is still used to identify and label GAP regions, such as through edge detection and contour tracking to determine gap areas. This generates a GAP region coordinate file, recording in detail the location, start point, and end point coordinates of each GAP. When the generated coordinate file is used for inspection on the testing machine, the corresponding normal gap area can be excluded, and other areas can be inspected instead. This not only shortens the time for normal gap inspection but also effectively eliminates detected normal gaps when the testing machine is inspecting other defects, thereby improving the overall efficiency and accuracy of photomask defect detection.

[0040] Of course, if the key features cannot meet the preset reference value conditions, then the gaps or other defects must be inspected during subsequent machine inspections.

[0041] In conjunction with the above embodiments, in a first aspect, the embodiments of this specification obtain key features between adjacent chips, and when the key features meet preset reference value conditions, efficiently detect normal gaps. Moreover, the detection range is relatively small compared to the detection range of other defects in the photomask. This is mainly aimed at the fact that there is less data processing between adjacent chips and that it will not affect the detection of other defects in the photomask. Therefore, a faster and more accurate implementation method is adopted to obtain key features between chips and locate the GAP area, and generate the coordinate file of the GAP.

[0042] Traditional methods primarily focus on detecting defects that affect photomask performance, aiming to identify and repair these defects early. The inventors, however, propose a different approach. They argue that even if normal inspection ultimately doesn't affect photomask performance and quality, the embodiments in this specification utilize the same sampling data processing method for detecting normal gaps between chips, compared to other large-scale data processing. This improves the efficiency and accuracy of normal gap detection while maintaining the detection of other defects. Furthermore, it avoids the need for repeated inspection of already identified normal gap areas, thus preventing lower inspection efficiency and impacting the overall inspection efficiency and accuracy of the photomask.

[0043] Secondly, regarding gaps that do not affect the final quality and performance of the photomask, the traditional method uses manual intervention and pattern inspection. However, the embodiments in this specification adopt a different approach (for gaps in the photomask that do not affect product quality, an inspection machine is still used for detection. Only normal gaps that have been detected are excluded in the inspection machine, but this does not affect the detection of defects. This is completely different from the traditional method that does not affect quality and performance and does not require excessive inspection). As mentioned above, this method is based on more efficient and accurate acquisition of the GAP area and generation of GAP coordinate files. Then, the coordinate files of the gaps are imported into the inspection machine so that the inspection machine can exclude the area of ​​these normal gaps for other defect detection.

[0044] In other words, by using gap coordinate files during inspection, it is possible to avoid the detection of normal gaps and achieve inspections that meet high requirements for product quality and performance without affecting the detection of other defects.

[0045] In summary, the photomask gap detection method provided in this specification not only does not affect the photomask's ability to detect other defects, but also requires almost no additional complex detection steps. However, it completely improves the efficiency and accuracy of the overall photomask inspection, greatly increasing production efficiency and product yield.

[0046] like Figure 4 As shown, one design principle of this embodiment is as follows: the width between CH IPs on the scan exposure file is considered a GAP if its width matches the bi as (i.e., a preset reference value). The corresponding GAP area is located, and a coordinate file of the GAP area is generated. These coordinate files are imported into the inspection machine, which will not inspect the specified area.

[0047] Therefore, normal gaps between the design drawings and exposure files caused by data processing will not be detected, eliminating the need for manual re-verification. This method effectively improves inspection efficiency without affecting the accuracy of the inspection results.

[0048] In some embodiments, the preset reference value is obtained based on the systematic deviation between the actual results caused by process factors and the design expectation, and the preset reference value does not affect product quality and performance.

[0049] Specifically, the preset reference value is determined by analyzing historical production data and using the systematic deviation between the actual results caused by process factors and the design expectations as the preset reference value. For example, the conversion relationship set by process bi as (i.e., real-time adjustment of manufacturing parameters to compensate for deviations) may lead to gaps in performance (GAP). However, these GAPs are within expectations and do not affect the quality and performance of the final product.

[0050] In some embodiments, the gap region includes a portion of the chip pattern, the dicing path, and the detected normal gap.

[0051] like Figure 3 and 4 As shown, normal gaps were detected, and the gap area included part of the chip pattern, the dicing path, and the detected normal gaps.

[0052] like Figure 4 As shown, the gap region includes a portion of the chip pattern, such as... Figure 3 As shown, when the CH IP graphic and the cutting track graphic are aligned, the gap area includes the cutting track.

[0053] It should be noted that the gap area not only includes the detected normal gaps, but also expands the area appropriately to exclude the detection of normal gaps during subsequent machine inspections, thereby improving the efficiency of machine inspections.

[0054] In some embodiments, key features include width, aspect ratio between adjacent chips, or angle.

[0055] Specifically, key features between chips in the design pattern are obtained based on the photomask exposure file. These key features include, but are not limited to, width, aspect ratio between adjacent chips, or angle. In some embodiments, width is more intuitive and can be used to detect gaps. In other embodiments, the aspect ratio or angle between adjacent chips can be converted into width to detect gaps.

[0056] In some embodiments, the method further includes displaying and storing a coordinate file of the gap region on the user interface, wherein the coordinate file of the gap region includes the position, size and quantity of the gap region.

[0057] In conjunction with the above embodiments, after obtaining the coordinate file of the gap area, the coordinate file of the gap area is displayed and stored on the operation interface, which can show the position, size and quantity of the gap area in the coordinate file.

[0058] In some embodiments, the method further includes: obtaining key features between chips with different arrangement forms based on different patterns designed in the photomask; wherein the arrangement of adjacent chips includes linear arrangement, grid arrangement, ring arrangement, staggered arrangement and mixed arrangement.

[0059] Specifically, different patterns designed in the photomask lead to different arrangement forms, thus obtaining key features between chips with different arrangements. Specifically, the arrangement methods of adjacent chips include, but are not limited to, linear arrangement, grid arrangement, ring arrangement, staggered arrangement, and mixed arrangement.

[0060] Linear arrangement: Adjacent chips are arranged along a straight line, such as horizontally or vertically. Grid arrangement: Chips are arranged in a grid pattern, forming rows and columns. Circular arrangement: Chips may be arranged in a circular pattern around a central point or area. Staggered arrangement: Chips are arranged in an alternating manner. Hybrid arrangement: A combination of arrangement methods is used.

[0061] In summary, the embodiments of this specification utilize data processing methods to generate the coordinates of GAP regions in the photomask, effectively handling various GAPs caused by data processing, reducing the degradation of photomask inspection, and improving the yield of photomask manufacturing.

[0062] The specific beneficial effects are as follows:

[0063] Improved inspection efficiency: By automatically identifying and processing gaps caused by data processing, the time spent on manual inspection and verification is reduced.

[0064] Improved yield: Ensuring that only relevant areas are inspected and effectively allocating resources improved the yield of photomask manufacturing.

[0065] Reliability: Ensures the integrity of the overall photomask inspection during the inspection process by focusing on the inspection of the main areas while ignoring the unaffected gap areas.

[0066] This method represents a significant advancement in the field of photomask manufacturing, meeting industry demands for improved efficiency, accuracy, and yield.

[0067] In conjunction with the above embodiments, this specification provides a photomask gap detection module that applies the aforementioned photomask gap detection method.

[0068] In conjunction with the above embodiments, this specification provides a photomask inspection device that utilizes the photomask gap detection module described in the foregoing technical solutions, or employs the photomask gap detection method described in the foregoing technical solutions. In some embodiments, the photomask gap detection module is integrated into the inspection machine, thereby reducing photomask inspection time and improving photomask manufacturing yield. By automatically identifying and processing GAP areas, the photomask manufacturing process is effectively optimized, ensuring improved production efficiency and quality. Alternatively, the photomask detection module is located within the photomask inspection equipment, etc.

[0069] In conjunction with the above embodiments, this specification also provides a photomask gap detection system, including: a memory, a processor, and a computer program, wherein the computer program is stored in the memory, and the processor runs the computer program to perform the photomask gap detection method as described in the foregoing technical solutions.

[0070] In conjunction with the above embodiments, this specification also provides a readable storage medium storing a computer program, which, when executed by a processor, is used to implement the gap detection method in the photomask as described in the foregoing technical solutions.

[0071] The same or similar parts between the various embodiments in this specification can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the product embodiments described later are relatively simple in description since they correspond to the methods, and relevant parts can be referred to the descriptions in the system embodiments.

[0072] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A photomask gap detection method, characterized by, The method comprises: acquiring a key feature between chips in a design pattern according to an exposure file of a photomask; if the key feature meets a preset reference value condition, a normal gap is detected; determining a gap region corresponding to the normal gap and generating a coordinate file of the gap region; so that after the coordinate file is imported into a testing machine, the machine detects other regions except the region corresponding to the coordinate file; the preset reference value is obtained according to a system deviation between an actual result caused by a process factor and a design expectation, and the preset reference value does not affect product quality and performance.

2. The photomask gap detection method of claim 1, wherein, The gap region comprises a gap region composed of part of chip patterns, a cutting path and the detected normal gap.

3. The photomask gap detection method of claim 1, wherein, The key feature comprises a width, an aspect ratio or an angle between adjacent chips.

4. The photomask gap detection method of claim 1, wherein, The method further comprises: displaying and storing the coordinate file of the gap region on an operation interface; wherein the coordinate file of the gap region comprises a position, a size and a number of the gap region.

5. The photomask gap detection method of any of claims 1-4, wherein, The method further comprises: according to different design patterns in the photomask, acquiring key features between chips in different arrangement forms; wherein the arrangement of adjacent chips comprises a straight-line arrangement, a grid arrangement, a ring arrangement, a staggered arrangement and a mixed arrangement.

6. A photomask gap detection module, comprising: The method comprises: applying the photomask gap detection method according to any one of claims 1-5.

7. A photomask inspection apparatus, characterized by, The photomask gap detection module according to claim 6, or the photomask gap detection method according to any one of claims 1-5.

8. A photomask gap detection system, comprising: The method comprises: a memory, a processor and a computer program, the computer program is stored in the memory, and the processor runs the computer program to execute the photomask gap detection method according to any one of claims 1-5.

9. A readable storage medium, characterized by, The readable storage medium stores a computer program, and the computer program is executed by the processor to implement the photomask gap detection method according to any one of claims 1-5.

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