Mask processing method and device, equipment, medium and product

Abstract

The invention discloses a mask processing method, device and equipment, a medium and a product, and relates to the technical field of semiconductor integrated circuits. The mask processing method comprises the following steps: acquiring an initial mask layout, wherein the initial mask layout comprises a first mask pattern and a second mask pattern; projecting the first mask pattern onto the second mask pattern to obtain a projection point of the contour of the first mask pattern on the second mask pattern; determining whether the second mask pattern meets the first cutting condition or not according to the length of the target edge of the second mask pattern by taking the condition that the distance between two adjacent points on the target edge of the second mask pattern after projection is not smaller than the preset cutting length as a constraint condition; under the condition that the second mask pattern meets the first cutting condition, the cutting position of the second mask pattern is determined according to the number of the projection points and the positions of the projection points; and cutting the second mask pattern according to the cutting position to obtain an optimized mask pattern corresponding to the initial mask pattern.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor integrated circuit technology, and in particular, relates to a mask processing method, device, equipment, medium and product. Background Art

[0002] In integrated circuit manufacturing, Optical Proximity Correction (OPC) is an important technology that is often used to solve layout deformation and layout deviation problems in the photolithography process. Cutting the mask pattern is one of the commonly used mask processing methods in OPC.

[0003] In the existing method, when there are conflicts among the cutting points when cutting the mask pattern, the conflicting cutting points are usually visited in a preset traversal order, and the cutting points visited first are retained while the cutting points visited later are discarded.

[0004] However, the existing method needs to rely on a preset traversal order, which can easily cause the position of the cutting point of two graphics with the same shape to change after symmetry or rotation processing. That is, the cutting point position of the same graphics is inconsistent, resulting in poor lithography effect of the layout. Summary of the invention

[0005] The embodiments of the present application provide a mask processing method, device, equipment, medium and product, which can avoid the phenomenon of inconsistent cutting positions corresponding to the same pattern, thereby improving the lithography effect of the layout.

[0006] In one aspect of an embodiment of the present application, a mask processing method is provided, comprising:

[0007] Acquire an initial mask layout, wherein the initial mask layout includes a first mask pattern and a second mask pattern;

[0008] Projecting the first mask pattern onto the second mask pattern to obtain projection points of the outline of the first mask pattern on the second mask pattern;

[0009] Taking the distance between two adjacent points on the target edge of the projected second mask pattern as a constraint condition not less than the preset cutting length, determining whether the second mask pattern satisfies the first cutting condition according to the length of the target edge of the second mask pattern, the target edge being the edge where the projection point on the second mask pattern is located;

[0010] When the second mask pattern meets the first cutting condition, the cutting position of the second mask pattern is determined according to the number of projection points and the positions of the projection points; according to the cutting position, the second mask pattern is cut to obtain an optimized mask layout corresponding to the initial mask layout.

[0011] In one aspect of an embodiment of the present application, a mask processing device is provided, comprising:

[0012] A layout acquisition module, used to acquire an initial mask layout, wherein the initial mask layout includes a first mask pattern and a second mask pattern;

[0013] A pattern projection module, used for projecting the first mask pattern onto the second mask pattern to obtain projection points of the outline of the first mask pattern on the second mask pattern;

[0014] A condition judgment module, used to determine whether the second mask pattern satisfies the first cutting condition according to the length of the target edge of the second mask pattern, with the distance between two adjacent points on the target edge of the projected second mask pattern being not less than a preset cutting length as a constraint condition, and the target edge being the edge where the projection point on the second mask pattern is located;

[0015] A position determination module is used to determine the cutting position of the second mask pattern according to the number of projection points and the positions of the projection points when the second mask pattern meets the first cutting condition; a graphic cutting module is used to cut the second mask pattern according to the cutting position to obtain an optimized mask layout corresponding to the initial mask layout.

[0016] According to one aspect of an embodiment of the present application, an electronic device is provided, which includes: a memory and a program or instruction stored in the memory and executable on a processor, wherein when the program or instruction is executed by the processor, a mask processing method as provided in any aspect of the above-mentioned embodiment of the present application is implemented.

[0017] In one aspect of an embodiment of the present application, a readable storage medium is provided, on which a program or instruction is stored. When the program or instruction is executed by a processor, a mask processing method provided in any aspect of the above-mentioned embodiment of the present application is implemented.

[0018] According to one aspect of an embodiment of the present application, a computer program product is provided. When instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes a mask processing method provided by any aspect of the embodiment of the present application described above.

[0019] In the mask processing method provided in the embodiment of the present application, the distance between two adjacent points on the target edge of the second mask pattern after projection is not less than the preset cutting length as a constraint condition, and whether the second mask pattern satisfies the first cutting condition is determined according to the length of the target edge of the second mask pattern. Then, when the second mask pattern satisfies the first cutting condition, the cutting position of the second mask pattern is determined according to the number of projection points and the position of the projection points. In this way, the embodiment of the present application provides a reasonable cutting position determination mechanism, and the cutting position of the target edge can be accurately determined only according to the length of the target edge, the number of projection points and the position of the projection points. There is no need to rely on a preset traversal order to determine the cutting position, thereby avoiding the phenomenon of inconsistent cutting positions corresponding to the same pattern, and improving the lithography effect of the layout. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0021] Figure 1 It is a flowchart of a first mask processing method provided by an embodiment of the present application;

[0022] Figure 2 is a schematic diagram of projecting a first mask pattern onto a second mask pattern provided by an embodiment of the present application;

[0023] Figure 3 is a flow chart of a second mask processing method provided by an embodiment of the present application;

[0024] Figure 4 is a flow chart of a third mask processing method provided by an embodiment of the present application;

[0025] Figure 5 This is a schematic diagram of a projection of a single projection point provided by an embodiment of the present application;

[0026] Figure 6 is a projection diagram of two projection points provided by an embodiment of the present application;

[0027] Figure 7 is a schematic diagram of a second first mask pattern projected onto a second mask pattern provided by an embodiment of the present application;

[0028] Figure 8 is a structural schematic diagram of a mask processing device provided by an embodiment of the present application;

[0029] Fig. 9It is a structural schematic diagram of a mask processing device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0030] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0032] It should be noted that the acquisition, storage, use, and processing of data in the technical solution of this application are in compliance with the relevant provisions of national laws and regulations.

[0033] It should be noted that in the embodiments of the present application, certain software, components, models and other existing solutions in the industry may be mentioned, and they should be regarded as exemplary. Their purpose is only to illustrate the feasibility of implementing the technical solution of the present application, but it does not mean that the applicant has or will necessarily use the solution.

[0034] In the existing method, when there is a conflict in the cutting points when cutting the mask pattern, the conflicting cutting points are usually visited in a preset traversal order, and the cutting points visited first are retained and the cutting points visited later are discarded. However, the existing method easily leads to the phenomenon that the cutting points of the same pattern are inconsistent, resulting in poor lithography effect of the layout.

[0035] The purpose of the present application is to provide a mask processing method, device, equipment, medium and product. In the mask processing method provided in the embodiment of the present application, the distance between two adjacent points on the target edge of the second mask pattern after projection is not less than the preset cutting length as a constraint condition, and whether the second mask pattern meets the first cutting condition is determined according to the length of the target edge of the second mask pattern. Then, when the second mask pattern meets the first cutting condition, the cutting position of the second mask pattern is determined according to the number of projection points and the position of the projection points. In this way, the embodiment of the present application provides a set of reasonable cutting position determination mechanisms, and the cutting position of the target edge can be accurately determined only according to the length of the target edge, the number of projection points and the position of the projection points. There is no need to rely on a preset traversal order to determine the cutting position, thereby avoiding the phenomenon of inconsistent cutting positions corresponding to the same pattern, and improving the lithography effect of the layout.

[0036] The following describes specific embodiments of the mask processing method, device, equipment, medium and product provided in the embodiments of the present application. The following first describes the mask processing method.

[0037] Figure 1 A flowchart of a mask processing method is provided. The mask processing method can be applied to a server. The mask processing method can include the following S101 to S104.

[0038] S101, obtaining an initial mask layout, wherein the initial mask layout includes a first mask pattern and a second mask pattern.

[0039] In this embodiment, the initial mask layout includes a first mask pattern and a second mask pattern. The first mask pattern and the second mask pattern are two-dimensional patterns, representing mask patterns used to manufacture specific structures or devices in semiconductor manufacturing.

[0040] The first mask pattern is a pattern used as a projection source in the initial mask layout, and the second mask pattern is a pattern used as a projection target in the initial mask layout.

[0041] S102, projecting the first mask pattern onto the second mask pattern to obtain projection points of the outline of the first mask pattern on the second mask pattern.

[0042] In this embodiment, the projection points are used to characterize the relative positional relationship between the first mask pattern and the second mask pattern on a two-dimensional plane.

[0043] As an example, Figure 2As shown, a schematic diagram of projecting a first mask pattern onto a second mask pattern is provided. In the illustrated orientation, the first mask pattern 201 is above the second mask pattern 202, and the outer contour of the first mask pattern 201 is projected onto the target edge of the second mask pattern 202 facing the first mask pattern 201, and two projection points can be obtained, namely, projection point 204 and projection point 205.

[0044] S103, taking the distance between two adjacent points on the target edge of the projected second mask pattern as a constraint condition not less than a preset cutting length, and determining whether the second mask pattern satisfies the first cutting condition according to the length of the target edge of the second mask pattern, the target edge being the edge where the projection point on the second mask pattern is located.

[0045] In this embodiment, the constraint condition is that the distance between two adjacent points on the target edge where the projection point on the second mask pattern is located after projection is not less than the preset cutting length. Figure 2 As shown, the distance between the projection point 204 and the end point 203, the distance between the projection point 204 and the projection point 205, and the distance between the projection point 205 and the end point 206 are not less than the preset cutting length.

[0046] The first cutting condition is used to determine whether the second mask pattern can be cut. For example, according to the constraint condition, if the length of the target edge is less than twice the preset cutting length, then no matter which point on the target edge is used as the cutting position, the constraint condition will be violated. Therefore, the first cutting condition can be preset as whether the length of the target edge is less than twice the preset cutting length.

[0047] As an example, after obtaining the projection point of the outline of the first mask pattern on the second mask pattern, the server directly determines whether the length of the target edge where the projection point on the second mask pattern is located is less than twice the preset cutting length.

[0048] When the length of the target side is less than twice the preset cutting length, it can be determined that the second mask pattern does not meet the first cutting condition, and the second mask pattern is not cut.

[0049] When the length of the target side is greater than or equal to twice the preset cutting length, it can be determined that the second mask pattern meets the first cutting condition. At this time, there is a cutting position on the second mask pattern that meets the requirement.

[0050] S104, when the second mask pattern satisfies the first cutting condition, determining the cutting position of the second mask pattern according to the number of projection points and the positions of the projection points.

[0051] In this embodiment, when the second mask pattern meets the first cutting condition, the service end can determine that there is a cutting position that meets the requirement on the second mask pattern.

[0052] At this time, the projection points are further moved or removed according to the number and positions of the projection points on the second mask pattern, so that the final cutting position can make the second mask pattern meet the constraint conditions. That is, the distance between the cutting position on the target edge of the second mask pattern and the end point of the target edge, and the distance between the cutting positions are greater than or equal to the preset cutting length.

[0053] Specifically, when each projection point can be moved to obtain a cutting position that satisfies the constraint conditions, each projection point is moved to obtain the cutting position of the second mask pattern; when the cutting position that satisfies the constraint conditions cannot be obtained no matter how the projection point is moved, the corresponding projection point is removed to ensure that other projection points can obtain a cutting position that satisfies the constraint conditions.

[0054] S105, cutting the second mask pattern according to the cutting position to obtain an optimized mask layout corresponding to the initial mask layout.

[0055] In this embodiment, the optimized mask layout is used to represent a new mask layout obtained by cutting the second mask pattern that can be cut in the initial mask layout.

[0056] As an example, the server performs a cutting operation on the second mask pattern according to the determined cutting position to obtain an optimized mask layout. Specifically, this can be achieved by modifying the mask layout data, such as using a mask layout editing tool to add a cutting line at the cutting position in the second mask pattern.

[0057] In the mask processing method provided in this embodiment, the distance between two adjacent points on the target edge of the second mask pattern after projection is not less than the preset cutting length as a constraint condition, and whether the second mask pattern meets the first cutting condition is determined according to the length of the target edge of the second mask pattern. Then, when the second mask pattern meets the first cutting condition, the cutting position of the second mask pattern is determined according to the number of projection points and the position of the projection points. In this way, the embodiment of the present application provides a set of reasonable cutting position determination mechanisms, and the cutting position of the target edge can be accurately determined only according to the length of the target edge, the number of projection points and the position of the projection points. There is no need to rely on a preset traversal order to determine the cutting position, thereby avoiding the phenomenon of inconsistent cutting positions corresponding to the same pattern, and improving the lithography effect of the layout.

[0058] As an optional embodiment, Figure 3As shown, S103 may specifically include the following S301 to S303:

[0059] S301, comparing the length of the target edge with a preset edge length threshold to obtain an edge length comparison result;

[0060] S302, when the edge length comparison result indicates that the length of the target edge is less than a preset edge length threshold, determining that the second mask pattern does not meet the first cutting condition;

[0061] S303: When the side length comparison result indicates that the length of the target side is greater than or equal to a preset side length threshold, determine that the second mask pattern meets the first cutting condition.

[0062] In this embodiment, the preset edge length threshold is used to evaluate whether the second mask pattern meets the first cutting condition. For example, when the first cutting condition is whether the length of the target edge is less than twice the preset cutting length, the preset edge length threshold is equal to twice the preset cutting length.

[0063] As an example, the server determines the target edge where the projection point is located in the second mask pattern according to the projection point of the outline of the first mask pattern on the second mask pattern, and simultaneously obtains the length of the target edge.

[0064] Then, the length of the target edge is compared with the preset edge length threshold. If the length of the target edge is less than the preset edge length threshold, it can be determined that the second mask pattern does not meet the first cutting condition, and the second mask pattern is not cut at this time; if the length of the target edge is greater than or equal to the preset edge length threshold, it can be determined that the second mask pattern meets the first cutting condition, and there is a cutting position on the second mask pattern that meets the requirements.

[0065] Through this embodiment, it is possible to accurately determine whether the second mask pattern meets the first cutting condition according to the length of the target edge. If the second mask pattern meets the first cutting condition, the cutting position of the second mask pattern is further determined; if the second mask pattern does not meet the first cutting condition, the second mask pattern is not cut directly. In this way, by determining in advance whether the second mask pattern meets the first cutting condition, the processing efficiency of the second mask pattern can be improved.

[0066] As an optional embodiment, Figure 4 As shown, S303 may specifically include the following S401 to S402:

[0067] S401, when the number of projection points is one, according to the position of the projection point and the preset cutting length, the projection point is moved so that the distance between the projection point and the two end points of the target edge is not less than the preset cutting length, and the cutting position of the second mask pattern is obtained;

[0068] S402, when the number of projection points is two, a target operation is performed on the projection points according to the positions of the projection points and a preset length threshold, so that the distance between two adjacent points on the target edge is not less than a preset cutting length, and the cutting position of the second mask pattern is obtained. The target operation is a move operation or a removal operation.

[0069] In this embodiment, when the edge length comparison result indicates that the length of the target edge is greater than or equal to the preset edge length threshold, it can be determined that the second mask pattern meets the first cutting condition, that is, at least one cutting position that meets the constraint condition can be found on the second mask pattern.

[0070] As an example, when there is only one projection point, it means that the projection point can be moved to find a cutting position that satisfies the constraint conditions. Therefore, the server determines the moving direction and moving distance corresponding to the projection point according to the position of the projection point and the preset cutting length, and moves the projection point according to the moving direction and moving distance, thereby obtaining the cutting position of the second mask pattern.

[0071] Furthermore, when there are two projection points, it can only be determined that at least one cutting position satisfying the constraint condition can be found on the second mask pattern, but it is not yet determined whether there are two cutting positions satisfying the constraint condition on the second mask pattern. Therefore, it is necessary to move or remove the two projection points to obtain a cutting position satisfying the constraint condition.

[0072] Specifically, the server can compare the length of the target side where the projection point is located with three times the preset cutting length. When the length of the target side is greater than or equal to three times the preset cutting length, it indicates that there are two cutting positions at this time. At this time, according to the preset projection point processing mechanism, both projection points are moved to obtain two cutting positions on the second mask pattern.

[0073] When the length of the target edge is less than three times the preset cutting length, it indicates that there can only be one cutting position. At this time, according to the preset projection point processing mechanism, the projection point that meets the moving requirements of the two projection points is moved, and the projection point that meets the removal requirements is removed, so as to obtain a cutting position that meets the constraint conditions on the second mask pattern.

[0074] Through this embodiment, a classification discussion is conducted according to the number of projection points, so that the cutting position on the second mask pattern under different circumstances can be accurately determined. Thus, accurate cutting of the second mask pattern under different circumstances can be achieved, and the layout deformation and layout deviation problems in the photolithography process can be overcome.

[0075] As an optional embodiment, S401 may specifically include:

[0076] When the number of projection points is one, the distances between the projection point and the two endpoints of the target edge are calculated according to the position of the projection point;

[0077] Obtaining the length difference between the preset cutting length and the abnormal distance, where the abnormal distance is the distance between the projection point and the two end points of the target edge that is less than the preset cutting length;

[0078] The projection point is moved by the length difference in the direction of increasing abnormal distance to obtain the cutting position of the second mask pattern.

[0079] In this embodiment, the abnormal distance is the distance between the projection point and the two end points that is less than the preset cutting length, that is, the distance that does not meet the constraint condition.

[0080] As an example, when the number of projection points is one, the server calculates the straight-line distances from the projection point to the two endpoints of the target edge according to the position of the projection point. Then, among the distances from the projection point to the two endpoints of the target edge, the distance that is less than the preset cutting length is regarded as an abnormal distance.

[0081] Finally, move the projection point in the direction that increases the abnormal distance. This means moving it toward the longer end of the target edge to ensure that the shorter end of the target edge meets the constraint. The distance moved is the difference between the preset cutting length and the abnormal distance.

[0082] like Figure 5 As shown, a schematic diagram of the projection of a single projection point is provided. In the illustrated orientation, the first mask pattern 201 is above the second mask pattern 202, and the outer contour of the first mask pattern 201 is projected onto the target edge of the second mask pattern 202 facing the first mask pattern 201, and only one projection point 204 is obtained. The distance between the projection point 204 and the endpoint 203 is D1, and the distance between the projection point 204 and the endpoint 206 is D2. And D1 is less than the preset cutting length, and D2 is greater than the preset cutting length. At this time, the projection point 204 is moved in the direction that increases D1, that is, the projection point is moved in the direction close to the endpoint 206, and the distance moved is the length difference between the preset cutting length and D1.

[0083] Through this embodiment, when the number of projection points is one, the distance between the projection point and the two endpoints of the target edge that is less than the preset cutting length is determined as the abnormal distance. The projection point is moved in the direction that increases the abnormal distance by the length difference between the preset cutting length and the abnormal distance to obtain the cutting position of the second mask pattern. In this way, a reasonable cutting position determination mechanism is provided, which does not need to rely on a preset traversal order to determine the cutting position, and can avoid the phenomenon of inconsistent cutting positions corresponding to the same pattern. As an optional embodiment, the cutting position includes a first cutting position and a second cutting position;

[0084] S402 may specifically include:

[0085] When the number of projection points is two, a first spacing distance between a first projection point and a first endpoint and a second spacing distance between a second projection point and a second endpoint are determined according to positions of the projection points, the first endpoint being an endpoint on the target edge adjacent to the first projection point, and the second endpoint being an endpoint on the target edge adjacent to the second projection point;

[0086] According to the size relationship between the first spacing distance, the second spacing distance and the preset length threshold, a target operation is performed on the first projection point and the second projection point to obtain the first cutting position and / or the second cutting position of the second mask pattern.

[0087] In this embodiment, the first projection point is any one of the two projection points, and the second projection point is another projection point except the first projection point.

[0088] The first endpoint is an endpoint adjacent to the first projection point, that is, there is no other projection point between the first projection point and the first endpoint; the second endpoint is an endpoint adjacent to the second projection point, that is, there is no other projection point between the second projection point and the second endpoint.

[0089] The first spacing distance is used to represent the straight-line distance between the first endpoint and the first projection point, and the second spacing distance is used to represent the straight-line distance between the second endpoint and the second projection point.

[0090] The first cutting position is the cutting position obtained after the target operation is performed on the first projection point, and the second cutting position is the cutting position obtained after the target operation is performed on the second projection point. The preset length threshold may be one or more, and is used to determine whether the first projection point and the second projection point meet the moving requirement or the removal requirement according to the size relationship between the first spacing distance and the second spacing distance.

[0091] As an example, when the number of projection points is two, the server determines the two projection points as the first projection point and the second projection point. At the same time, for each projection point, find its adjacent endpoint on the target edge. The adjacent endpoint of the first projection point is recorded as the first endpoint, and the adjacent endpoint of the second projection point is recorded as the second endpoint.

[0092] Then, a first spacing distance from the first projection point to the first endpoint and a first spacing distance from the second projection point to the second endpoint are calculated, and the first spacing distance and the second spacing distance are respectively compared with a preset length threshold to determine whether they are less than, equal to or greater than the threshold.

[0093] Finally, according to the size relationship between the first spacing distance and the preset length threshold, it is determined whether the first projection point meets the moving requirement or the removal requirement. If the first projection point meets the moving requirement, the first projection point is moved to obtain the corresponding first cutting position; if the first projection point meets the removal requirement, the first projection point is removed, that is, the first cutting position does not exist on the second mask pattern at this time.

[0094] At the same time, according to the size relationship between the second spacing distance and the preset length threshold, it is determined whether the second projection point meets the moving requirement or the removal requirement. If the second projection point meets the moving requirement, the second projection point is moved to obtain the corresponding second cutting position; if the second projection point meets the removal requirement, the second projection point is removed, that is, the second cutting position does not exist on the second mask pattern at this time.

[0095] like Figure 6 As shown, a schematic diagram of projection of two projection points is provided. In the illustrated orientation, the first mask pattern 201 is above the second mask pattern 202, and the outer contour of the first mask pattern 201 is projected onto the target edge of the second mask pattern 202 facing the first mask pattern 201, thereby obtaining two projection points.

[0096] Assuming that the projection point on the left is determined as the first projection point 601, the leftmost endpoint on the target edge of the second mask pattern 202 is the first endpoint 603, and the distance between the first projection point 601 and the first endpoint 603 is the first spacing distance L1; at the same time, the projection point on the right is the second projection point 602, and the rightmost endpoint on the target edge of the second mask pattern 202 is the second endpoint 604, and the distance between the second projection point 602 and the second endpoint 604 is the second spacing distance L2.

[0097] Through this embodiment, when the number of projection points is two, the first interval distance between the first projection point and the first endpoint, and the second interval distance between the second projection point and the second endpoint, are compared with the preset length threshold. According to the comparison result, the corresponding target operation is performed. In this way, a reasonable cutting position determination mechanism is provided, which does not need to rely on the preset traversal order to determine the cutting position, and can avoid the phenomenon of inconsistent cutting positions corresponding to the same graphics.

[0098] As an optional embodiment, the preset length threshold includes a first length threshold, a second length threshold and a third length threshold, the first length threshold is smaller than the second length threshold, and the second length threshold is smaller than the third length threshold;

[0099] The first length threshold is used to determine whether the first projection point and the second projection point satisfy the constraint condition;

[0100] The second length threshold is used to determine whether the first projection point and the second projection point meet a first movement condition, where the first movement condition is to move both the first projection point and the second projection point so that the second mask pattern can have two cutting positions;

[0101] The third length threshold is used to determine whether the first projection point or the second projection point satisfies a second movement condition, and the second movement condition is to move only the first projection point or the second projection point so that the second mask pattern can have two cutting positions.

[0102] In this embodiment, the first length threshold, the second length threshold and the third length threshold are used to determine whether the first projection point and the second projection point meet the moving requirement or the removal requirement according to the size relationship between the first spacing distance and the second spacing distance.

[0103] When the interval distance corresponding to the projection point is less than the first length threshold, it is considered that the projection point does not meet the constraint condition and needs to be moved to increase the interval distance. If it cannot be moved, the projection point needs to be removed.

[0104] When the interval distance corresponding to the projection point is greater than or equal to the first length threshold and less than the second length threshold, it is considered that the projection point meets the constraint condition and can be directly used as the cutting position. However, the interval distance corresponding to the projection point is short at this time, and the projection point cannot be moved so that the second mask pattern can have two cutting positions. That is, the projection point in this case cannot be moved and can only be directly used as the cutting position.

[0105] When the interval distance corresponding to the projection point is greater than or equal to the second length threshold and less than the third length threshold, it is considered that the interval distance corresponding to the projection point is moderate in length and can be moved together with other projection points so that the second mask pattern can have two cutting positions. That is, the projection point in this case can be moved, and the position of the projection point after the movement is used as the cutting position.

[0106] When the interval distance corresponding to the projection point is greater than or equal to the third length threshold, it is considered that the interval distance corresponding to the projection point is particularly long and can be moved separately so that the second mask pattern can have two cutting positions. That is, the projection point in this case can be moved, and the position of the projection point after the movement is used as the cutting position.

[0107] As an optional embodiment, the first length threshold is equal to a preset cutting length;

[0108] The second length threshold is equal to the cumulative value of the target length and the preset cutting length, and the target length is 1 / 2 of the difference between the preset cutting length and the projection length;

[0109] The third length threshold is equal to the cumulative value of the preset cutting length and twice the target length.

[0110] In this embodiment, since the interval distance corresponding to the projection point is less than the first length threshold, it is considered that the projection point does not meet the constraint condition, that is, the first length threshold is the threshold that determines whether the projection point meets the constraint condition. At this time, the first length threshold can be directly determined as the preset cutting length.

[0111] Since the projection point cannot be moved when the interval distance corresponding to the projection point is greater than or equal to the first length threshold and less than the second length threshold, and the projection point can be moved when the interval distance corresponding to the projection point is greater than or equal to the second length threshold and less than the third length threshold, that is, the second length threshold is the threshold for determining whether the projection point can be moved. At this time, the cumulative value of half of the length that the current projection length needs to be expanded and the preset cutting length can be determined as the second length threshold, that is, 1 / 2 of the difference between the preset cutting length and the projection length, plus the preset cutting length.

[0112] Since the projection points can be moved individually when the interval distance corresponding to the projection points is greater than or equal to the third length threshold, so that the second mask pattern can have two cutting positions, that is, the third length threshold is the threshold for determining whether the projection points can be moved individually. At this time, the cumulative value of the length that the current projection length needs to be extended and the preset cutting length can be determined as the third length threshold, that is, the difference between the preset cutting length and the projection length, plus the preset cutting length.

[0113] Through this embodiment, the corresponding values ​​of the first length threshold, the second length threshold, and the third length threshold are reasonably determined according to their respective corresponding functions, so as to ensure that the judgment on whether the projection point can be moved or removed is sufficiently accurate, and the accuracy of determining the cutting position can be improved.

[0114] As an optional embodiment, according to the size relationship between the first spacing distance, the second spacing distance and the preset length threshold, the first projection point and the second projection point are subjected to target operation to obtain the first cutting position and / or the second cutting position of the second mask pattern, which may specifically include:

[0115] When the first spacing distance is greater than or equal to the first length threshold and less than the second length threshold, determining the first projection point as the first cutting position;

[0116] According to the size relationship between the second spacing distance and the third length threshold, a target operation is performed on the second projection point to determine whether the second mask pattern meets the second cutting condition, and when the second mask pattern meets the second cutting condition, a second cutting position of the second mask pattern is obtained.

[0117] In this embodiment, the second cutting condition is used to characterize the condition for judging whether the second cutting position exists in the second mask pattern. Specifically, the second cutting condition is whether the spacing distance is greater than or equal to the third length threshold.

[0118] As an example, Figure 6 As shown, when the number of projection points is two, the constraint condition at this time is that the first spacing distance L1, the second spacing distance L2, and the projection length L3 between the first projection point 601 and the second projection point 602 need to be greater than the preset cutting length. However, since the projection length L3 between the first projection point 601 and the second projection point 602 is usually less than the preset cutting length in actual production operations, that is, the first projection point 601 and the second projection point 602 cannot simultaneously meet the constraint condition, it is necessary to process the first projection point 601 and the second projection point 602 to obtain a cutting position that meets the constraint condition.

[0119] Specifically, when the first spacing distance L1 is greater than or equal to the first length threshold and less than the second length threshold, the first projection point 601 can be directly determined as the first cutting position. However, the first spacing distance L1 corresponding to the first projection point 601 is short, and the first projection point 601 cannot be moved so that the second projection point 602 also meets the constraint condition.

[0120] Therefore, it is necessary to further obtain the size relationship between the second spacing distance L2 and the third length threshold, so as to determine whether the second spacing distance L2 is long enough, so as to determine whether the second projection point 602 can be moved separately, so that the first projection point 601 and the second projection point 602 simultaneously meet the constraint condition. Finally, according to the size relationship between the second spacing distance L2 and the third length threshold, the corresponding target operation is performed on the second projection point to determine the second cutting position.

[0121] Through this embodiment, when the first spacing distance is greater than or equal to the first length threshold and less than the second length threshold, the first projection point is determined as the first cutting position; then, according to the size relationship between the second spacing distance and the third length threshold, the second projection point is subjected to a target operation, thereby determining the second cutting position of the second mask pattern. In this way, a reasonable cutting position determination mechanism is provided, which does not need to rely on a preset traversal order to determine the cutting position, and can avoid the phenomenon of inconsistent cutting positions corresponding to the same pattern.

[0122] As an optional embodiment, according to the size relationship between the second spacing distance and the third length threshold, performing a target operation on the second projection point, determining whether the second mask pattern satisfies the second cutting condition, and obtaining the second cutting position of the second mask pattern when the second mask pattern satisfies the second cutting condition, may specifically include:

[0123] When the second spacing distance is less than the third length threshold, the second projection point is removed to determine that the second mask pattern does not meet the second cutting condition;

[0124] When the second spacing distance is greater than or equal to the third length threshold, the difference between the preset cutting length and the projection length is used as the moving distance, and the direction close to the second endpoint is used as the moving direction. The second projection point is moved to obtain the second cutting position of the second mask pattern, and the projection length is the distance between the first projection point and the second projection point.

[0125] In this embodiment, if Figure 6 As shown, when the second spacing distance L2 is less than the third length threshold, the second spacing distance L2 is not particularly long and cannot be moved alone, so that the first projection point 601 and the second projection point 602 simultaneously meet the constraint condition. At this time, the second projection point 602 is removed, and only the first projection point 601 is retained as the cutting position.

[0126] In the case where the second spacing distance L2 is greater than or equal to the third length threshold, the second spacing distance L2 is particularly long and can be moved separately so that the first projection point 601 and the second projection point 602 simultaneously meet the constraint condition. Specifically, at this time, the difference between the preset cutting length and the projection length L3 is used as the moving distance, and the direction close to the second end point 604 is used as the moving direction, and the second projection point is moved, so that the projection length L3 is expanded to the preset cutting length, and the second cutting position of the second mask pattern is obtained.

[0127] Through this embodiment, when the second spacing distance is less than the third length threshold, the second projection point is removed; when the second spacing distance is greater than or equal to the third length threshold, the second projection point is moved with the difference between the preset cutting length and the projection length as the moving distance and the direction close to the second end point as the moving direction to obtain the second cutting position of the second mask pattern. In this way, a reasonable cutting position determination mechanism is provided, which does not need to rely on the preset traversal order to determine the cutting position, and can avoid the phenomenon of inconsistent cutting positions corresponding to the same pattern.

[0128] As an optional embodiment, according to the size relationship between the first spacing distance, the second spacing distance and the preset length threshold, the first projection point and the second projection point are subjected to target operation to obtain the first cutting position and / or the second cutting position of the second mask pattern, which may specifically include:

[0129] When the first spacing distance is greater than or equal to the second length threshold, and the second spacing distance is greater than or equal to the second length threshold, half of the difference between the preset cutting length and the projection length is determined as the moving distance;

[0130] Moving the first projection point by a moving distance in a direction close to the first end point to obtain a first cutting position of the second mask pattern;

[0131] The second projection point is moved toward the second end point by a moving distance to obtain a second cutting position of the second mask pattern.

[0132] In this embodiment, if Figure 6 As shown, when the first spacing distance L1 is greater than or equal to the second length threshold, it is considered that the first spacing distance L1 corresponding to the first projection point 601 is moderately long or particularly long, that is, the first projection point 601 can be moved at this time so that the first projection point 601 and the second projection point 602 simultaneously meet the constraint conditions.

[0133] When the second spacing distance L2 is greater than or equal to the second length threshold, it is considered that the second spacing distance L2 corresponding to the second projection point 602 is moderate or particularly long, that is, the second projection point 602 can be moved at this time so that the first projection point 601 and the second projection point 602 simultaneously meet the constraint conditions.

[0134] In the case where both the first projection point 601 and the second projection point 602 can be moved, 1 / 2 of the difference between the preset cutting length and the projection length is determined as the moving distance. Then, the first projection point 601 is moved in a direction close to the first end point 603 by the moving distance, and the second projection point 602 is moved in a direction close to the second end point 604 by the moving distance, so that the projection length L3 is expanded to the preset cutting length, and the first cutting position and the second cutting position of the second mask pattern are obtained.

[0135] Through this embodiment, when the first spacing distance is greater than or equal to the second length threshold, and the second spacing distance is greater than or equal to the second length threshold, 1 / 2 of the difference between the preset cutting length and the projection length is determined as the moving distance, and the first projection point and the second projection point are moved respectively, so as to obtain the first cutting position and the second cutting position of the second mask pattern. In this way, a reasonable cutting position determination mechanism is provided, which does not need to rely on the preset traversal order to determine the cutting position, and can avoid the phenomenon of inconsistent cutting positions corresponding to the same pattern.

[0136] As an optional embodiment, according to the size relationship between the first spacing distance, the second spacing distance and the preset length threshold, the first projection point and the second projection point are subjected to target operation to obtain the first cutting position and / or the second cutting position of the second mask pattern, which may specifically include:

[0137] When the first spacing distance is less than the first length threshold and the third spacing distance from the second projection point to the first endpoint is greater than or equal to the first length threshold, the first projection point is removed and the second projection point is determined as the second cutting position of the second mask pattern.

[0138] In this embodiment, the third interval distance is used to represent the distance between the second projection point and the first endpoint, that is, the cumulative value of the first interval distance and the projection length.

[0139] As an example, Figure 6 As shown, when the first spacing distance L1 is less than the first length threshold, it is considered that the first projection point 601 does not meet the constraint condition; and if the cumulative value of the first spacing distance L1 and the projection length L3 is greater than the first length threshold, it is considered that the second projection point 602 meets the constraint condition. In this case, the first projection point 601 is directly removed, and only the second projection point 602 is retained as the second cutting position of the second mask pattern.

[0140] Through this embodiment, when the first spacing distance is less than the first length threshold, and the third spacing distance from the second projection point to the first endpoint is greater than or equal to the first length threshold, the first projection point is removed, and the second projection point is determined as the second cutting position of the second mask pattern. In this way, a reasonable cutting position determination mechanism is provided, which does not need to rely on a preset traversal order to determine the cutting position, and can avoid the phenomenon of inconsistent cutting positions corresponding to the same pattern.

[0141] As an optional embodiment, the first mask pattern includes a first sub-pattern and a second sub-pattern;

[0142] S104 may specifically include:

[0143] When the number of projection points corresponding to the first sub-graph and the second sub-graph are both two, respectively obtain the distance between each projection point of the first sub-graph and the second sub-graph and the target endpoint, where the target endpoint is any endpoint of the target edge;

[0144] According to the distance between each projection point and the target endpoint, determine whether the preset removal condition is met;

[0145] When the preset removal conditions are met, the target projection point is determined as the cutting position of the second mask pattern, and the projection points other than the target projection point are removed. The target projection points include the projection point closest to the target endpoint and the projection point farthest from the target endpoint.

[0146] In this embodiment, if Figure 7 As shown, a schematic diagram of projecting a first mask pattern onto a second mask pattern is provided. The first mask pattern includes two sub-patterns, namely, a first sub-pattern 201a and a second sub-pattern 201b. Assume that the first sub-pattern 201a is projected onto the second mask pattern 202 and has two projection points, namely, a first sub-pattern projection point 702 and a second sub-pattern projection point 703; and the second sub-pattern 201b is projected onto the second mask pattern 202 and has two projection points, namely, a third sub-pattern projection point 704 and a fourth sub-pattern projection point 705.

[0147] At this time, the first length M1 between the first sub-graphic projection point 702 and the target endpoint 701, the second length M2 between the second sub-graphic projection point 703 and the target endpoint 701, the third length M3 between the third sub-graphic projection point 704 and the target endpoint 701, and the fourth length M4 between the fourth sub-graphic projection point 705 and the target endpoint 701 are obtained respectively.

[0148] Then, according to the first length M1 , the second length M2 , the third length M3 and the fourth length M4 , it is determined whether the first sub-pattern 201 a and the second sub-pattern 201 b at this time meet the preset removal condition.

[0149] When the preset removal conditions are met, the first sub-graphic projection point 702 and the fourth sub-graphic projection point 705 are determined as the cutting positions of the second mask graphic, and the second sub-graphic projection point 703 and the third sub-graphic projection point 704 are removed; when the preset removal conditions are not met, the first sub-graphic 201a and the second sub-graphic 201b are respectively processed according to the projection point processing method provided in the above-mentioned embodiment of the present application when the number of projection points is two.

[0150] According to this embodiment, when the first mask pattern includes the first sub-pattern and the second sub-pattern, and the number of projection points corresponding to the first sub-pattern and the second sub-pattern are both two, a comprehensive analysis is performed according to the positions of the projection points corresponding to the first sub-pattern and the second sub-pattern. In this way, there is no need to analyze the first sub-pattern and the second sub-pattern separately, which can improve the efficiency of determining the cutting position.

[0151] As an optional embodiment, the first sub-graphic is closest to the target endpoint, and the second sub-graphic is farthest from the target endpoint;

[0152] The distances between each projection point and the target endpoint are, in ascending order, the first length, the second length, the third length, and the fourth length;

[0153] The preset removal conditions include:

[0154] The first length is greater than or equal to a second length threshold corresponding to the first sub-graph, and less than a third length threshold corresponding to the first sub-graph;

[0155] The difference between the third length and the second length is less than the target cumulative value, the target cumulative value is the cumulative value of the preset cutting length, the target length corresponding to the first sub-graph, and the target length corresponding to the second sub-graph, the target length is 1 / 2 of the difference between the preset cutting length and the projection length, and the projection length is the distance between the two projection points;

[0156] The difference between the third length and the first length is less than the preset cutting length;

[0157] The difference between the fourth length and the first length is greater than or equal to the preset cutting length.

[0158] In this embodiment, if Figure 7 As shown, the preset removal conditions include:

[0159] The first length M1 is greater than or equal to the second length threshold of the first sub-graph 201a, and less than the third length threshold of the first sub-graph 201a;

[0160] The value of the third length M3 minus the second length M2 is less than the cumulative value of the preset cutting length, 1 / 2 of the difference between the preset cutting length corresponding to the first sub-graph 201a and the projected length, and 1 / 2 of the difference between the preset cutting length corresponding to the second sub-graph 201b and the projected length;

[0161] The value of the third length M3 minus the first length M1 is less than the preset cutting length;

[0162] A value obtained by subtracting the first length M1 from the fourth length M4 is greater than or equal to a preset cutting length.

[0163] Through this embodiment, the preset removal conditions are reasonably set, so that the projection point positions corresponding to the first sub-graph and the second sub-graph can be accurately and comprehensively analyzed. In this way, there is no need to analyze the first sub-graph and the second sub-graph separately, which can improve the efficiency of determining the cutting position.

[0164] Based on the mask processing method, accordingly, the present application also provides a specific embodiment of the mask processing device.

[0165] like Figure 8 As shown, the mask processing device 800 provided in the embodiment of the present application includes a layout acquisition module 810, a graphic projection module 820, a condition judgment module 830, a position determination module 840 and a graphic cutting module 850.

[0166] The layout acquisition module 810 is used to acquire an initial mask layout, wherein the initial mask layout includes a first mask pattern and a second mask pattern;

[0167] A pattern projection module 820, used to project the first mask pattern onto the second mask pattern to obtain projection points of the outline of the first mask pattern on the second mask pattern;

[0168] The condition judgment module 830 is used to determine whether the second mask pattern satisfies the first cutting condition according to the length of the target edge of the second mask pattern, with the distance between two adjacent points on the target edge of the projected second mask pattern being not less than a preset cutting length as a constraint condition, and the target edge being the edge where the projection point on the second mask pattern is located;

[0169] The position determination module 840 is used to determine the cutting position of the second mask pattern according to the number of projection points and the positions of the projection points when the second mask pattern meets the first cutting condition; the pattern cutting module 850 is used to cut the second mask pattern according to the cutting position to obtain an optimized mask layout corresponding to the initial mask layout. As an optional embodiment, the condition judgment module 830 may specifically include the following units:

[0170] A side length comparison unit, used to compare the length of the target side with a preset side length threshold to obtain a side length comparison result;

[0171] a condition determination unit, configured to determine that the second mask pattern does not satisfy the first cutting condition when the edge length comparison result indicates that the length of the target edge is less than a preset edge length threshold;

[0172] The first condition judgment unit is used to determine that the second mask pattern meets the first cutting condition when the edge length comparison result indicates that the length of the target edge is greater than or equal to a preset edge length threshold.

[0173] As an optional embodiment, the location determination module 840 may specifically include the following units:

[0174] A first operating unit is used to move the projection point according to the position of the projection point and the preset cutting length when the number of the projection point is one, so that the distance between the projection point and the two end points of the target edge is not less than the preset cutting length, and obtain the cutting position of the second mask pattern;

[0175] The second operation unit is used to perform a target operation on the projection points according to the positions of the projection points and a preset length threshold when the number of projection points is two, so that the distance between two adjacent points on the target edge is not less than the preset cutting length, and the cutting position of the second mask pattern is obtained. The target operation is a move operation or a removal operation.

[0176] As an optional embodiment, the first operating unit may be specifically used for:

[0177] When the number of projection points is one, the distances between the projection point and the two endpoints of the target edge are calculated according to the position of the projection point;

[0178] Obtaining the length difference between the preset cutting length and the abnormal distance, where the abnormal distance is the distance between the projection point and the two end points of the target edge that is less than the preset cutting length;

[0179] The projection point is moved by the length difference in the direction of increasing abnormal distance to obtain the cutting position of the second mask pattern.

[0180] As an optional embodiment, the cutting position includes a first cutting position and a second cutting position;

[0181] The second operation unit may specifically include the following subunits:

[0182] a distance determination subunit, for determining, when the number of projection points is two, a first spacing distance between a first projection point and a first endpoint and a second spacing distance between a second projection point and a second endpoint according to positions of the projection points, the first endpoint being an endpoint on the target edge adjacent to the first projection point, and the second endpoint being an endpoint on the target edge adjacent to the second projection point;

[0183] The projection point operation subunit is used to perform target operation on the first projection point and the second projection point according to the size relationship between the first spacing distance, the second spacing distance and the preset length threshold, so as to obtain the first cutting position and / or the second cutting position of the second mask pattern.

[0184] As an optional embodiment, the projection point operation subunit may be specifically used for:

[0185] When the first spacing distance is greater than or equal to the first length threshold and less than the second length threshold, determining the first projection point as the first cutting position;

[0186] According to the size relationship between the second spacing distance and the third length threshold, a target operation is performed on the second projection point to determine whether the second mask pattern meets the second cutting condition, and when the second mask pattern meets the second cutting condition, a second cutting position of the second mask pattern is obtained.

[0187] As an optional embodiment, the projection point operation subunit may be specifically used for:

[0188] When the second spacing distance is less than the third length threshold, the second projection point is removed to determine that the second mask pattern does not meet the second cutting condition;

[0189] When the second spacing distance is greater than or equal to the third length threshold, the difference between the preset cutting length and the projection length is used as the moving distance, and the direction close to the second endpoint is used as the moving direction. The second projection point is moved to obtain the second cutting position of the second mask pattern, and the projection length is the distance between the first projection point and the second projection point.

[0190] As an optional embodiment, the projection point operation subunit may be specifically used for:

[0191] When the first spacing distance is greater than or equal to the second length threshold, and the second spacing distance is greater than or equal to the second length threshold, 1 / 2 of the difference between the preset cutting length and the projection length is determined as the moving distance;

[0192] Moving the first projection point by a moving distance in a direction close to the first end point to obtain a first cutting position of the second mask pattern;

[0193] The second projection point is moved toward the second end point by a moving distance to obtain a second cutting position of the second mask pattern.

[0194] As an optional embodiment, the projection point operation subunit may be specifically used for:

[0195] When the first spacing distance is less than the first length threshold, and the third spacing distance from the second projection point to the first endpoint is greater than or equal to the first length threshold, the first projection point is removed, and the second projection point is determined as the second cutting position of the second mask pattern. As an optional embodiment, the first mask pattern includes a first sub-pattern and a second sub-pattern;

[0196] The location determination module 840 may further include the following units:

[0197] A distance acquisition unit, used for respectively acquiring the distance between each projection point of the first sub-graph and the second sub-graph and a target endpoint when the number of projection points corresponding to the first sub-graph and the second sub-graph are both two, the target endpoint being any endpoint of the target edge;

[0198] The second condition judgment is used to determine whether the preset removal condition is met according to the distance between each projection point and the target endpoint;

[0199] A position determination unit is used to determine the target projection point as the cutting position of the second mask pattern and remove projection points other than the target projection point when a preset removal condition is met. The target projection point includes the projection point closest to the target endpoint and the projection point farthest from the target endpoint.

[0200] Based on the mask processing method, accordingly, the present application also provides a specific embodiment of the mask processing equipment.

[0201] Fig. 9 A schematic diagram of the hardware structure of a mask processing device provided in an embodiment of the present application is shown.

[0202] The mask processing device may include a processor 901 and a memory 902 storing computer program instructions.

[0203] Specifically, the processor 901 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0204] The memory 902 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 902 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive or a combination of two or more of these. In appropriate cases, the memory 902 may include a removable or non-removable (or fixed) medium. In appropriate cases, the memory 902 may be inside or outside the integrated gateway disaster recovery device. In a specific embodiment, the memory 902 is a non-volatile solid-state memory.

[0205] The processor 901 implements any one of the mask processing methods in the above embodiments by reading and executing computer program instructions stored in the memory 902 .

[0206] In one example, the mask processing device may further include a communication interface 903 and a bus 910. Fig. 9 As shown, the processor 901, the memory 902, and the communication interface 903 are connected via a bus 910 and communicate with each other.

[0207] The communication interface 903 is mainly used to implement communication between various modules, devices, layout units and / or equipment in the embodiments of the present application.

[0208] Bus 910 includes hardware, software or both, and the parts of mask processing equipment are coupled to each other. For example, but not limitation, bus may include accelerated graphics port (AGP) or other graphics bus, enhanced industrial standard architecture (EISA) bus, front side bus (FSB), hypertransport (HT) interconnection, industrial standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnection (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations. In appropriate cases, bus 910 may include one or more buses. Although the present application embodiment describes and shows a specific bus, the present application considers any suitable bus or interconnection.

[0209] In addition, in combination with the mask processing method in the above embodiment, the embodiment of the present application can provide a computer storage medium for implementation. The computer storage medium stores computer program instructions; when the computer program instructions are executed by a processor, any one of the mask processing methods in the above embodiment is implemented.

[0210] In addition, in combination with the mask processing method in the above-mentioned embodiments, the embodiments of the present application may provide a computer program product for implementation. When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes the mask processing method provided in any aspect of the above-mentioned embodiments of the present application.

[0211] It should be clear that the present application is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present application is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present application.

[0212] The functional blocks shown in the above-described block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0213] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

[0214] Aspects of the present disclosure are described above with reference to the flowchart and / or block diagram of the method, device (system) and computer program product according to the embodiment of the present disclosure. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the function / action specified in one or more boxes of the flowchart and / or block diagram. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field programmable logic circuit. It can also be understood that each box in the block diagram and / or flowchart and the combination of boxes in the block diagram and / or flowchart can also be implemented by dedicated hardware that performs a specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions.

[0215] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the system, module and layout unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A mask processing method, characterized in that: include: Acquire an initial mask layout, wherein the initial mask layout includes a first mask pattern and a second mask pattern; Projecting the first mask pattern onto the second mask pattern to obtain projection points of the outline of the first mask pattern on the second mask pattern; Taking the distance between two adjacent points on the target edge of the second mask pattern after projection as a constraint condition not less than a preset cutting length, determining whether the second mask pattern satisfies the first cutting condition according to the length of the target edge of the second mask pattern, the target edge being the edge where the projection point on the second mask pattern is located; When the second mask pattern satisfies the first cutting condition, determining a cutting position of the second mask pattern according to the number of the projection points and the positions of the projection points; The second mask pattern is cut according to the cutting position to obtain an optimized mask layout corresponding to the initial mask layout.

2. The method according to claim 1, characterized in that The step of determining whether the second mask pattern satisfies a first cutting condition according to the length of the target edge includes: Compare the length of the target edge with a preset edge length threshold to obtain an edge length comparison result; When the side length comparison result indicates that the length of the target side is less than the preset side length threshold, determining that the second mask pattern does not meet the first cutting condition; When the side length comparison result indicates that the length of the target side is greater than or equal to the preset side length threshold, it is determined that the second mask pattern meets the first cutting condition.

3. The method according to claim 1, characterized in that The step of determining the cutting position of the second mask pattern according to the number of the projection points and the positions of the projection points comprises: When the number of the projection point is one, the projection point is moved according to the position of the projection point and the preset cutting length so that the distance between the projection point and the two end points of the target edge is not less than the preset cutting length, thereby obtaining the cutting position of the second mask pattern; When the number of the projection points is two, a target operation is performed on the projection points according to the positions of the projection points and a preset length threshold so that the distance between two adjacent points on the target edge is not less than the preset cutting length, and the cutting position of the second mask pattern is obtained, and the target operation is a move operation or a removal operation.

4. The method according to claim 3, characterized in that In the case where the number of the projection point is one, the projection point is moved according to the position of the projection point and the preset cutting length so that the distance between the projection point and the two end points of the target edge is not less than the preset cutting length, and the cutting position of the second mask pattern is obtained, including: When the number of the projection point is one, the distances between the projection point and two endpoints of the target edge are calculated respectively according to the positions of the projection point; Obtaining a length difference between the preset cutting length and an abnormal distance, wherein the abnormal distance is a distance between the projection point and two end points of the target edge that is less than the preset cutting length; The projection point is moved by the length difference in the direction in which the abnormal distance increases, so as to obtain the cutting position of the second mask pattern.

5. The method according to claim 3, characterized in that: The cutting position includes a first cutting position and a second cutting position; When the number of the projection points is two, according to the positions of the projection points and the preset length threshold, a target operation is performed on the projection points so that the distance between two adjacent points on the target edge is not less than the preset cutting length, and a cutting position of the second mask pattern is obtained, including: When the number of the projection points is two, determining a first spacing distance between a first projection point and a first endpoint and a second spacing distance between a second projection point and a second endpoint according to the positions of the projection points, the first endpoint being an endpoint on the target edge adjacent to the first projection point, and the second endpoint being an endpoint on the target edge adjacent to the second projection point; According to the size relationship between the first spacing distance, the second spacing distance and the preset length threshold, target operation is performed on the first projection point and the second projection point to obtain the first cutting position and / or the second cutting position of the second mask pattern.

6. The method according to claim 5, characterized in that The preset length threshold includes a first length threshold, a second length threshold and a third length threshold, the first length threshold is smaller than the second length threshold, and the second length threshold is smaller than the third length threshold; The first length threshold is used to determine whether the first projection point and the second projection point satisfy the constraint condition; The second length threshold is used to determine whether the first projection point and the second projection point meet a first movement condition, wherein the first movement condition is to move both the first projection point and the second projection point so that the second mask pattern can have two cutting positions; The third length threshold is used to determine whether the first projection point or the second projection point satisfies a second movement condition, and the second movement condition is to move only the first projection point or the second projection point so that the second mask pattern can have two cutting positions.

7. The method according to any one of claims 1 to 6, characterized in that: The first mask pattern includes a first sub-pattern and a second sub-pattern; The step of determining the cutting position of the second mask pattern according to the number of the projection points and the positions of the projection points comprises: When the number of the projection points corresponding to the first sub-graph and the second sub-graph are both two, respectively obtaining the distance between each of the projection points of the first sub-graph and the second sub-graph and a target endpoint, where the target endpoint is any endpoint of the target edge; Determining whether a preset removal condition is met according to the distance between each of the projection points and the target endpoint; When the preset removal condition is met, the target projection point is determined as the cutting position of the second mask pattern, and the projection points except the target projection point are removed, and the target projection points include the projection point closest to the target endpoint and the projection point farthest from the target endpoint.

8. The method according to claim 7, characterized in that The first sub-graph is closest to the target endpoint, and the second sub-graph is farthest from the target endpoint; The distances between the projection points and the target endpoint are, in ascending order, a first length, a second length, a third length, and a fourth length; The preset removal conditions include: The first length is greater than or equal to a second length threshold corresponding to the first sub-graph, and less than a third length threshold corresponding to the first sub-graph; The difference between the third length and the second length is less than a target cumulative value, the target cumulative value is a cumulative value of the preset cutting length, the target length corresponding to the first sub-graph, and the target length corresponding to the second sub-graph, the target length is 1 / 2 of the difference between the preset cutting length and the projection length, and the projection length is the distance between the two projection points; The difference between the third length and the first length is smaller than the preset cutting length; A difference between the fourth length and the first length is greater than or equal to the preset cutting length.

9. An electronic device, characterized in that: The device comprises: a processor and a memory storing computer program instructions; When the processor executes the computer program instructions, the mask processing method according to any one of claims 1 to 8 is implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer program instructions, and when the computer program instructions are executed by a processor, the mask processing method according to any one of claims 1 to 8 is implemented.

11. A computer program product, characterized in that When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes the mask processing method according to any one of claims 1 to 8.

Images