Bonding device and bonding method thereof

Abstract

The invention provides a bonding device and a bonding method thereof.The bonding device comprises a base, a micro-motion base table and a vertical motion assembly which are arranged on the base, and further comprises a lower bonding head assembly which is arranged on the micro-motion base table and comprises a first suction cup and a first reference block; the upper bonding head assembly is arranged on the vertical movement assembly and comprises a second suction cup and a second reference block; the contour measurement assembly comprises a horizontal movement assembly and a contour sensor, and the contour sensor performs contour scanning on the upper bonding head assembly and the lower bonding head assembly; and the visual sensor detects the relative position of the first reference block and the second reference block. According to the contour features of the lower bonding head assembly and the upper bonding head assembly obtained through scanning of the contour sensor, the first suction cup is adjusted through the micro-motion base station, so that horizontal alignment and vertical leveling of the upper chip or the lower chip or the wafer are achieved, and the relative position of the upper chip or the lower chip or the wafer is detected through the visual sensor before bonding. Therefore, the bonding precision is ensured.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a bonding device and a bonding method thereof. Background Art

[0002] 3D chips refer to chips that use vertical stacking or layering technology to stack multiple chips together to achieve higher performance, higher integration and smaller size. This technology can stack chips with different functions (such as processors, memory, sensors, etc.) together to achieve functional integration and performance improvement, and reduce horizontal space occupancy and transmission loss.

[0003] The manufacturing of 3D chips is mainly achieved through chip or wafer bonding equipment. 3D chips require multiple chip layers to be precisely aligned and stacked together, which requires the manufacturing process to have high-precision alignment and stacking technology to ensure that the interconnection and heat dissipation channels between the layers of chips can work properly. In practice, if you want to achieve high-density and high-reliability interconnection at the micron or even nanometer scale, this places extremely high demands on both manufacturing processes and equipment.

[0004] Previous bonding devices used complex optical path imaging to identify and locate the marking points on the chip or wafer to achieve mark alignment, but they were unable to control the posture between chips, between wafers, or between chips and wafers. In addition, previous bonding devices also had the problem that although they could reduce the horizontal alignment time, they would lose alignment accuracy. Summary of the invention

[0005] In view of this, the present invention provides a bonding device and a bonding method thereof, wherein a first suction cup and a second suction cup are respectively arranged on a lower bonding head assembly and an upper bonding head assembly, and are used to absorb chips or wafers to be bonded. The contour features of the lower bonding head assembly and the upper bonding head assembly are scanned by a contour sensor, and the position of the first suction cup is adjusted by a micro-motion base according to the contour features obtained by the scan, so that the upper and lower chips or wafers can be horizontally aligned and vertically leveled, and when the upper bonding head assembly and the lower bonding head assembly are at a certain distance, the relative positions of the upper and lower chips or wafers are detected by a visual sensor, and if the current relative position error meets the requirement, the bonding is continued by pressing down; if the relative position is out of tolerance, the posture is fine-tuned by the micro-motion base to meet the position error requirement, thereby achieving fine adjustment and ensuring bonding accuracy.

[0006] The embodiment of the present invention provides the following technical solution: a bonding device, comprising a base, and a micro-motion base and a vertical motion component respectively arranged on the base, and further comprising:

[0007] A lower bonding head assembly, which is disposed on the micro-motion base and includes a first suction cup and a first reference block, and the micro-motion base drives the first suction cup to move so as to adjust the position of the first suction cup;

[0008] An upper bonding head assembly, which is disposed on the vertical motion assembly and includes a second suction cup and a second reference block, and the vertical motion assembly drives the second suction cup to move so as to adjust the position of the second suction cup;

[0009] a profile measurement assembly, the profile measurement assembly being disposed on the base and comprising a horizontal motion assembly and a profile sensor, the horizontal motion assembly driving the profile sensor to move along a first direction to perform profile scanning on the upper bonding head assembly and the lower bonding head assembly; and

[0010] At least one visual sensor is disposed on the base and is used to detect the relative position of the first reference block and the second reference block.

[0011] Preferably, the lower bonding head assembly further comprises a first mounting seat, and the first mounting seat is arranged on a side of the micro-motion base close to the upper bonding head assembly.

[0012] The first suction cup and the first reference block are both arranged on the first mounting seat,

[0013] At least two first reference blocks are provided and are evenly distributed on the periphery of the first suction cup.

[0014] Preferably, the upper bonding head assembly further comprises a second mounting seat, and the second mounting seat is arranged on a side of the vertical motion assembly close to the lower bonding head assembly.

[0015] The second suction cup and the second reference block are both arranged on the second mounting seat.

[0016] At least two second reference blocks are provided, which are evenly distributed on the periphery of the second suction cup and are provided in one-to-one correspondence with the first reference blocks.

[0017] Preferably, when the upper bonding head assembly is bonded to the lower bonding head assembly, the orthographic projection of the second reference block on the first mounting seat coincides with the orthographic projection of the first reference block on the first mounting seat.

[0018] Preferably, the horizontal motion assembly comprises a motion unit and a guide rail.

[0019] One end of the motion unit is connected to the contour sensor and drives the contour sensor to move along the guide rail.

[0020] Preferably, the profile sensor is a dual profile sensor or a single profile sensor, wherein

[0021] The dual profile sensor is capable of simultaneously scanning the profiles of the upper bond head assembly and the lower bond head assembly under the drive of the motion unit;

[0022] The single profile sensor can scan the profiles of the upper bond head assembly and the lower bond head assembly respectively under the drive of the motion unit.

[0023] Preferably, the contour sensor can at least obtain the following contours: the contour of the chip and / or wafer adsorbed on the first suction cup and the second suction cup, the contour of the first suction cup and the second suction cup, and the contour of the first reference block and the second reference block.

[0024] Preferably, at least one of the visual sensors is arranged on a side of the lower bonding head assembly away from the contour measurement assembly.

[0025] The visual sensor detects relative positions of the first reference block and the second reference block in a first direction and a third direction.

[0026] According to a bonding method of an embodiment of the present invention, based on any one of the bonding devices described above, the bonding method includes:

[0027] The first chip or wafer is sucked and fixed by the first suction cup, and the second chip or wafer is sucked and fixed by the second suction cup;

[0028] The horizontal motion assembly drives the profile sensor to move between the upper bond head assembly and the lower bond head assembly, and performs profile scanning on the upper bond head assembly and the lower bond head assembly to obtain at least the profile of the first chip or wafer, the profile of the second chip or wafer, the profile of the first reference block, and the profile of the second reference block;

[0029] Obtaining the first relative position of the lead or pad protrusion on the first chip or wafer relative to the first reference block, and the second relative position of the lead or pad protrusion on the second chip or wafer relative to the second reference block through the profile acquired by the profile sensor, fitting the first relative position and the second relative position respectively obtained into the same coordinate system, and adjusting the micro-motion base to horizontally align and vertically level the first chip or wafer and the second chip or wafer;

[0030] After the horizontal motion component drives the contour sensor to move out along the first direction, the vertical motion component drives the second chip or wafer to move in the second direction toward the direction close to the first chip or wafer. When the distance between the first chip or wafer and the second chip or wafer is the first distance, the visual sensor detects the relative position of the first reference block and the second reference block, and after fine-tuning the horizontal and / or vertical errors of the first chip or wafer and the second chip or wafer through the micro-motion base, the vertical motion component continues to drive the second chip or wafer to move in the second direction toward the direction close to the first chip or wafer to complete the bonding between the second chip or wafer and the first chip or wafer.

[0031] Preferably, during the process of performing profile scanning on the upper bond head assembly and the lower bond head assembly:

[0032] When the profile sensor is a dual profile sensor, the motion unit drives the dual profile sensor to move to a specified position, and the dual profile sensor can simultaneously scan the profiles of the upper bonding head assembly and the lower bonding head assembly;

[0033] When the contour sensor is a single contour sensor, the motion unit drives the single contour sensor to move to a specified position, and the single contour sensor scans the contours of the upper bonding head assembly and the lower bonding head assembly twice. After completing the first scan, the single contour sensor is driven by the motion unit to rotate 180 degrees around the first direction as the axis, and then performs a second scan.

[0034] Compared with the prior art, the at least one technical solution adopted in the embodiments of this specification can achieve the following beneficial effects:

[0035] The contour features of the lower bonding head assembly and the upper bonding head assembly are scanned by a contour sensor, and the position of the first suction cup is adjusted by a micro-motion base according to the contour features obtained by the scan, so that horizontal alignment and vertical leveling are achieved between the upper and lower chips or wafers, and when the upper bonding head assembly and the lower bonding head assembly are at a certain distance, the relative positions of the upper and lower chips or wafers are detected by a visual sensor, so that a close-range secondary fine alignment is achieved, thereby ensuring the bonding accuracy. In addition, the present invention can simultaneously measure the horizontal position and vertical posture between the upper and lower chips or wafers by only using one contour sensor for scanning, thereby realizing the compactness of the measuring device. In addition, in the traditional alignment method, the horizontal position and vertical posture between the upper and lower chips or wafers cannot be measured simultaneously, resulting in the introduction of multiple measurement errors, while the present invention only needs to move once to meet the horizontal and vertical measurements, which can reduce the influence of motion errors on the measurement results. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 is a schematic structural diagram of a bonding device provided by the present invention;

[0038] Figure 2 It is a structural schematic diagram of a lower bonding head assembly in the bonding device provided by the present invention;

[0039] Figure 3 It is a structural schematic diagram of an upper bonding head assembly in the bonding device provided by the present invention;

[0040] Figure 4 It is a schematic structural diagram of the upper bonding head assembly and the lower bonding head assembly in the bonding device provided by the present invention when bonding.

[0041] In the figure, 1. base; 2. lower bonding head assembly; 21. first mounting seat; 22. first suction cup; 23. first reference block; 3. upper bonding head assembly; 31. second mounting seat; 32. second suction cup; 33. second reference block; 4. contour measurement assembly; 41. contour sensor; 42. horizontal motion assembly; 421. motion unit; 422. guide rail; 5. visual sensor; 6. micro-motion base; 7. vertical motion assembly. DETAILED DESCRIPTION

[0042] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0043] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0044] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present invention, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0045] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention. The drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0046] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0047] The technical solutions provided by various embodiments of the present invention are described below in conjunction with the accompanying drawings.

[0048] Reference Figure 1 In the present invention, the X direction is referred to as the first direction, the Z direction is referred to as the second direction, and the Y direction is referred to as the third direction. Figure 1-Figure 4 As shown, the bonding device of the present invention includes a base 1 and a micro-motion base 6 and a vertical motion component 7 respectively arranged on the base 1. The bonding device also includes a lower bonding head component 2 and an upper bonding head component 3. The lower bonding head component 2 is installed on the micro-motion base 6, and includes a first suction cup 22 and a first reference block 23. The micro-motion base 6 is used to drive the first suction cup 22 to move so as to adjust the position of the first suction cup 22. The upper bonding head component 3 is installed on the vertical motion component 7, and includes a second suction cup 32 and a second reference block 33. The vertical motion component 7 is used to drive the second suction cup 32 to move along the vertical motion component 7. Figure 1 The Z direction (second direction) shown moves to adjust the position of the second suction cup 32 so that the second suction cup 32 is close to or away from the first suction cup 22 .

[0049] It should be noted that, in some embodiments, the movement of the second suction cup 32 driven by the vertical motion component 7 is not limited to the above-mentioned movement along the vertical axis. Figure 1In addition to the movement in the Z direction shown, the vertical movement component 7 can also drive the second suction cup 32 to move in the Rx and / or Ry directions.

[0050] The bonding device further comprises a profile measurement component 4 and at least one visual sensor 5. The profile measurement component 4 is mounted on the base 1, and comprises a profile sensor 41 and a horizontal motion component 42. The profile sensor 41 is mounted on the horizontal motion component 42, and the horizontal motion component 42 drives the profile sensor 41 along the Figure 1 The X direction (first direction) shown in the figure moves between the lower bond head assembly 2 and the upper bond head assembly 3, so that the profile sensor 41 can perform profile scanning on the lower bond head assembly 2 and the upper bond head assembly 3. The visual sensor 5 is arranged on the base 1, and is used to detect the relative positions of the first reference block 23 and the second reference block 33 in the X direction (first direction) and the Y direction (third direction). At least one of the visual sensors 5 can be arranged on the side of the lower bond head assembly 2 away from the profile measurement assembly 4, and a plurality of the visual sensors 5 can be distributed on the side of the lower bond head assembly 2 away from the vertical motion assembly 7.

[0051] It should be noted that the horizontal motion component 42 and the vertical motion component 7 can be selected according to actual conditions to ensure that the horizontal motion component 42 can drive the contour sensor 41 to move along the X direction (first direction) and the vertical motion component 7 can at least drive the upper bonding head component 3 to move along the Z direction (second direction).

[0052] It should also be noted that the minimum profile resolution of the profile sensor 41 (for example: line scanning laser triangle ruler, line scanning spectral confocal, etc.) in the present invention has reached microns, which can effectively identify pad bumps or leads with heights and intervals less than microns, and can meet the detection requirements of bonding accuracy less than microns.

[0053] like Figure 2As shown, in some embodiments, the lower bonding head assembly 2 further includes a first mounting seat 21, the first mounting seat 21 is mounted on the micro-motion base 6, and the first suction cup 22 and the first reference block 23 are both mounted on the side of the first mounting seat 21 close to the upper bonding head assembly 3. At least two first reference blocks 23 are provided, and the first reference blocks 23 are evenly distributed on the periphery of the first suction cup 22. The position of the first reference block 23 on the first mounting seat 21 is fixed, and the position of the first reference block 23 relative to the first suction cup 22 is fixed. After the profile sensor 41 scans the lower bonding head assembly 2, the posture of the wafer or chip pin or pad protrusion relative to the first reference block 23 in the horizontal and vertical directions is obtained by conversion and calibration based on the obtained profile features, and the position of the lead or pad protrusion on the wafer or chip relative to the first reference block 23 is obtained based on the whole machine coordinate system.

[0054] It should be noted that, in this embodiment, two first reference blocks 23 are provided, and the two first reference blocks 23 are symmetrically distributed on both sides of the first suction cup 22. However, in some embodiments, the number of the first reference blocks 23 can also be three, four, or other numbers, as long as the first reference blocks 23 are distributed around the first suction cup 22 and their positions are fixed relative to the first suction cup 22.

[0055] like Figure 3 As shown, in some embodiments, the upper bonding head assembly 3 further includes a second mounting seat 31, which is mounted on the side of the vertical motion assembly 7 close to the lower bonding head assembly 2, and the second suction cup 32 and the second reference block 33 are both mounted on the second mounting seat 31. At least two second reference blocks 33 are provided, and the second reference blocks 33 are evenly distributed on the periphery of the second suction cup 32. The position of the second reference block 33 on the second mounting seat 31 is fixed, and the position of the second reference block 33 relative to the second suction cup 32 is fixed. After the profile sensor 41 scans the upper bonding head assembly 3, the posture of the wafer or chip pin or pad protrusion relative to the second reference block 33 in the horizontal and vertical directions is obtained by conversion and calibration based on the obtained profile features, and the position of the lead or pad protrusion on the wafer or chip relative to the second reference block 33 is obtained based on the whole machine coordinate system.

[0056] It should be noted that, in this embodiment, two second reference blocks 33 are provided, and the two second reference blocks 33 are symmetrically distributed on both sides of the second suction cup 32. However, in some embodiments, the number of the second reference blocks 33 may also be three, four, or other numbers, as long as the second reference blocks 33 are distributed around the second suction cup 32 and are fixed relative to the second suction cup 32.

[0057] like Figure 4 As shown, when the upper bonding head assembly 3 is bonded to the lower bonding head assembly 2, the orthographic projection of the second reference block 33 on the first mounting seat 21 coincides with the orthographic projection of the first reference block 23 on the first mounting seat 21, thereby enabling alignment of the upper and lower chips or wafers by detecting the relative positions of the first reference block 23 and the second reference block 33 in the X direction and the Y direction.

[0058] like Figure 1 As shown, in some embodiments, the horizontal motion assembly 42 includes a motion unit 421 and a guide rail 422. One end of the motion unit 421 is connected to the profile sensor 41 and drives the profile sensor 41 to move along the guide rail 422.

[0059] In some embodiments, the profile sensor 41 is a dual profile sensor or a single profile sensor. Wherein, when the profile sensor 41 is a dual profile sensor, the dual profile sensor can simultaneously scan the profiles of the upper bond head assembly 3 and the lower bond head assembly 2 driven by the motion unit 421. When the profile sensor 41 is a single profile sensor, the single profile sensor can respectively scan the profiles of the upper bond head assembly 3 and the lower bond head assembly 2 driven by the motion unit 421. Specifically, when the horizontal motion assembly 42 drives the single profile sensor to move between the upper bond head assembly 3 and the lower bond head assembly 2, the single profile sensor first performs a profile scan on the upper bond head assembly 3. After the profile scan of the upper bond head assembly 3 is completed, the single profile sensor rotates 180 degrees with the X direction (first direction) as the axis and then performs a profile scan on the lower bond head assembly 2. Needless to say, the profile scan of the lower bond head assembly 2 can also be performed first, and then the profile scan of the upper bond head assembly 3 can be performed.

[0060] In some embodiments, the contour sensor 41 can at least obtain the following contours: the contour of the chip and / or wafer adsorbed on the first suction cup 22 and the second suction cup 32, the contour of the first suction cup 22 and the second suction cup 32, and the contour of the first reference block 23 and the second reference block 33.

[0061] Combination Figure 1-Figure 4 , the bonding method of an embodiment of the present invention will be described below.

[0062] Example 1

[0063] The chip bonding method of the present invention includes adsorbing and fixing the first chip by the first suction cup 22, and adsorbing and fixing the second chip by the second suction cup 32; the horizontal motion component 42 drives the contour sensor 41 to move between the upper bonding head component 3 and the lower bonding head component 2, and uses the contour sensor 41 to perform an overall scan of the lower bonding head component 2 and the upper bonding head component 3 to obtain the contour features of the entire upper bonding head component 3 and the lower bonding head component 2, and obtain the horizontal and vertical postures of the pins or pad protrusions on the first chip and the second chip relative to the reference block through conversion and calibration, thereby obtaining the first relative position of the leads or pad protrusions on the first chip relative to the first reference block 23 and the second relative position of the leads or pad protrusions on the second chip relative to the second reference block 33.

[0064] By converting the first relative position and the second relative position into the same coordinate system, the position and posture of the first chip and the second chip at this time can be known. On this basis, the position of the first chip is adjusted by the micro-motion base 6 so that the first chip and the second chip are aligned in the horizontal direction and parallel in the vertical direction.

[0065] The horizontal motion component 42 drives the contour sensor 41 to move out, and the vertical motion component 7 drives the second chip to move toward the first chip through the second suction cup 32. When the distance between the first chip and the second chip is very close, for example, the distance between the two is the first distance (preferably, the first distance is between 0.05mm and 0.1mm), the visual sensor 5 detects the relative position of the first reference block 23 and the second reference block 33 in the X direction (first direction) and the Y direction (third direction), calculates the relative position of the leads or pad bumps of the first chip and the second chip in the current state, and detects the relative distance between the first reference block 23 and the second reference block 33 in the vertical direction, and converts whether the first chip and the second chip are parallel. If the error of the current relative position meets the requirements, continue to press down for bonding. If the error of the current relative position does not meet the requirements, the position of the first chip is adjusted by the micro-motion base 6 until the error of the relative position meets the requirements, and the press-down bonding operation is completed, thereby ensuring the bonding accuracy.

[0066] For precision motion, uncertain displacement will be caused in the process of the vertical motion component 7 driving the upper bonding head component 3 to move downward, causing horizontal or vertical deviation between the upper and lower chips. However, the present invention uses the visual sensor when the first suction cup 22 and the second suction cup 32 are very close, and further determines whether the upper and lower chips are aligned or parallel to perform fine adjustment by detecting the relative positions of the first reference block 23 and the second reference block 33 in the X direction and the Y direction, thereby improving the bonding accuracy.

[0067] It should be noted that, in the chip bonding method of the present invention, the profile sensor 41 may be a dual profile sensor or a single profile sensor.

[0068] Example 2

[0069] The wafer chip bonding method of the present invention comprises:

[0070] The wafer is adsorbed and fixed by the first suction cup 22, and the chip is adsorbed and fixed by the second suction cup 32; the horizontal motion component 42 drives the contour sensor 41 to move between the upper bonding head component 3 and the lower bonding head component 2, and the upper bonding head component 3 is scanned as a whole by the contour sensor 41 to obtain the contour features of the entire upper bonding head component 3, and the contour sensor 41 obtains the contour features of the entire wafer in a step scanning manner, and the postures of the pins or pad bumps on the wafer and the chip relative to the reference block in the horizontal and vertical directions are obtained through conversion and calibration, thereby obtaining the first relative position of the leads or pad bumps of the wafer relative to the first reference block 23 and the second relative position of the leads or pad bumps on the chip relative to the second reference block 33.

[0071] By converting the first relative position and the second relative position into the same coordinate system, the position and posture of the wafer and the chip at this time can be known. On this basis, the position of the wafer is adjusted by the micro-motion base 6 so that the wafer and the chip are aligned in the horizontal direction and parallel in the vertical direction.

[0072] The horizontal motion component 42 drives the contour sensor 41 to move out, and the vertical motion component 7 drives the chip to move toward the direction close to the wafer through the second suction cup 32. When the distance between the wafer and the chip is very close, for example, the distance between the two is the first distance (preferably, the first distance is between 0.05mm and 0.1mm), the visual sensor 5 detects the relative position of the first reference block 23 and the second reference block 33 in the X direction (first direction) and the Y direction (third direction), calculates the relative position of the leads or pad protrusions of the wafer and the chip in the current state, and detects the relative distance between the first reference block 23 and the second reference block 33 in the vertical direction, and converts whether the wafer and the chip are parallel. If the error of the current relative position meets the requirements, continue to press down for bonding. If the error of the current relative position does not meet the requirements, the position of the wafer is adjusted by the micro-motion base 6 until the error of the relative position meets the requirements, and the press-down bonding operation is completed, thereby ensuring the bonding accuracy.

[0073] It should be noted that in the wafer chip bonding process of the present invention, the micro-motion base 6 can carry the wafer for stepping, move the area on the wafer that needs to be bonded to directly below the chip, and perform fine-tuning according to the surface shape (warping) of the current area of ​​the wafer to ensure that the current area is parallel to the chip.

[0074] For precision motion, uncertain displacement will be caused in the process of the vertical motion component 7 driving the upper bonding head component 3 to move downward, causing horizontal or vertical deviation between the upper and lower wafers and chips. However, the present invention uses the visual sensor when the first suction cup 22 and the second suction cup 32 are very close, and further determines whether the upper and lower chips or wafers are aligned or parallel to perform fine adjustment by detecting the relative positions of the first reference block 23 and the second reference block 33 in the X direction and the Y direction, thereby improving the bonding accuracy.

[0075] It should be noted that, in the chip bonding method of the present invention, the profile sensor 41 may be a dual profile sensor or a single profile sensor.

[0076] The same or similar parts of the various embodiments in this specification can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the method embodiment described later, since it corresponds to the system, the description is relatively simple, and the relevant parts can be referred to the partial description of the system embodiment.

[0077] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A bonding device, comprising a base, and a micro-motion base and a vertical motion component respectively arranged on the base, characterized in that: Also includes: A lower bonding head assembly, which is disposed on the micro-motion base and includes a first suction cup and a first reference block, and the micro-motion base drives the first suction cup to move so as to adjust the position of the first suction cup; An upper bonding head assembly, which is disposed on the vertical motion assembly and includes a second suction cup and a second reference block, and the vertical motion assembly drives the second suction cup to move so as to adjust the position of the second suction cup; A profile measurement assembly, the profile measurement assembly is disposed on the base, and comprises a horizontal motion assembly and a profile sensor, the horizontal motion assembly drives the profile sensor to move along a first direction to perform profile scanning on the upper bonding head assembly and the lower bonding head assembly; as well as At least one visual sensor is disposed on the base and is used to detect the relative position of the first reference block and the second reference block.

2. The bonding device according to claim 1, characterized in that The lower bonding head assembly further comprises a first mounting seat, which is arranged on a side of the micro-motion base close to the upper bonding head assembly. The first suction cup and the first reference block are both arranged on the first mounting seat, At least two first reference blocks are provided and are evenly distributed on the periphery of the first suction cup.

3. The bonding device according to claim 1, characterized in that The upper bonding head assembly further comprises a second mounting seat, and the second mounting seat is arranged on a side of the vertical motion assembly close to the lower bonding head assembly. The second suction cup and the second reference block are both arranged on the second mounting seat. At least two second reference blocks are provided, which are evenly distributed on the periphery of the second suction cup and are provided in one-to-one correspondence with the first reference blocks.

4. The bonding device according to claim 1, characterized in that: When the upper bonding head assembly is bonded to the lower bonding head assembly, the orthographic projection of the second reference block on the first mounting seat coincides with the orthographic projection of the first reference block on the first mounting seat.

5. The bonding device according to claim 1, characterized in that: The horizontal motion assembly includes a motion unit and a guide rail. One end of the motion unit is connected to the contour sensor and drives the contour sensor to move along the guide rail.

6. The bonding device according to claim 5, characterized in that: The profile sensor is a dual profile sensor or a single profile sensor, wherein The dual profile sensor is capable of simultaneously scanning the profiles of the upper bond head assembly and the lower bond head assembly under the drive of the motion unit; The single profile sensor can scan the profiles of the upper bond head assembly and the lower bond head assembly respectively under the drive of the motion unit.

7. The bonding device according to any one of claims 1 to 6, characterized in that: The contour sensor can at least obtain the following contours: the contour of the chip and / or wafer adsorbed on the first suction cup and the second suction cup, the contour of the first suction cup and the second suction cup, and the contour of the first reference block and the second reference block.

8. The bonding device according to any one of claims 1 to 6, characterized in that: At least one of the visual sensors is disposed on a side of the lower bonding head assembly away from the contour measurement assembly, The visual sensor detects relative positions of the first reference block and the second reference block in a first direction and a third direction.

9. A bonding method, based on the bonding device according to any one of claims 1 to 8, characterized in that: The bonding method comprises: The first chip or wafer is sucked and fixed by the first suction cup, and the second chip or wafer is sucked and fixed by the second suction cup; The horizontal motion assembly drives the profile sensor to move between the upper bond head assembly and the lower bond head assembly, and performs profile scanning on the upper bond head assembly and the lower bond head assembly to obtain at least the profile of the first chip or wafer, the profile of the second chip or wafer, the profile of the first reference block, and the profile of the second reference block; Obtaining the first relative position of the lead or pad protrusion on the first chip or wafer relative to the first reference block and the second relative position of the lead or pad protrusion on the second chip or wafer relative to the second reference block through the profile acquired by the profile sensor, fitting the first relative position and the second relative position respectively obtained into the same coordinate system, and adjusting the micro-motion base to horizontally align and vertically level the first chip or wafer and the second chip or wafer; After the horizontal motion component drives the contour sensor to move out along the first direction, the vertical motion component drives the second chip or wafer to move in the second direction toward the direction close to the first chip or wafer. When the distance between the first chip or wafer and the second chip or wafer is the first distance, the visual sensor detects the relative position of the first reference block and the second reference block, and after fine-tuning the horizontal and / or vertical errors of the first chip or wafer and the second chip or wafer through the micro-motion base, the vertical motion component continues to drive the second chip or wafer to move in the second direction toward the direction close to the first chip or wafer to complete the bonding between the second chip or wafer and the first chip or wafer.

10. The bonding method according to claim 9, characterized in that: During the process of performing profile scanning on the upper bond head assembly and the lower bond head assembly: When the profile sensor is a dual profile sensor, the motion unit drives the dual profile sensor to move to a specified position, and the dual profile sensor can simultaneously scan the profiles of the upper bonding head assembly and the lower bonding head assembly; When the contour sensor is a single contour sensor, the motion unit drives the single contour sensor to move to a specified position, and the single contour sensor scans the contours of the upper bonding head assembly and the lower bonding head assembly twice. After completing the first scan, the single contour sensor is driven by the motion unit to rotate 180 degrees around the first direction as the axis, and then performs a second scan.

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