Frame core bonding device for chip packaging

Abstract

The invention relates to a frame core bonding device for chip packaging, and relates to the technical field of chip packaging, and the frame core bonding device comprises a conveying belt, a smearing mechanism which is arranged above the conveying belt and is used for brushing glue on a lead frame, and a press-fitting mechanism which is used for assembling a chip and the lead frame. According to the frame core bonding device for chip packaging, when the chips are placed, accurate positioning is not needed, a plurality of chips can be positioned at the same time only through movement of the power plate, time is saved, corners of the chips cannot be damaged during positioning, the chips can be rapidly and accurately fed and positioned, the lead frame core bonding efficiency is improved, and the production cost is reduced. The motion stability of each dimension is relatively strong, the production efficiency of semiconductors is improved, a chip can be stably fixed on the lead frame, and the core bonding accuracy of the lead frame is improved.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, in particular to a frame core bonding device for chip packaging. Background Art

[0002] Lead frame is the chip carrier of integrated circuit. It is a key structural component that uses bonding materials such as gold wire, aluminum wire and copper wire to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It acts as a bridge to connect with external wires. Lead frame is required in most semiconductor integrated blocks and is an important basic material in the electronic information industry.

[0003] After the lead frame is produced, the chip is adhered to the lead frame with solder paste. During the production process, the chip is small, so it is inconvenient to adhere it to the lead frame in a conventional way, and multiple chips often need to be adhered to the lead frame. Therefore, how to improve the efficiency of lead frame chip adhesion, but most of the existing lead frames need to flip the chip when loading the chip during processing, which can easily lead to inaccurate chip positioning. Summary of the invention

[0004] In view of the deficiencies of the prior art, the present invention provides a frame core bonding device for chip packaging, which solves the above-mentioned problems.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a frame core bonding device for chip packaging, including a conveyor belt, a coating mechanism arranged above the conveyor belt for brushing glue on the lead frame, and a pressing mechanism for assembling the chip and the lead frame, the surface of the conveyor belt is connected to a loading template for loading the lead frame, the pressing mechanism includes a frame, the surface of the frame is lifted and lowered with a lower pressing plate driven by a driving mechanism, the surface of the frame is slidable left and right with two chip loading tables fixed together and driven by a motor, the inner cavity of the chip loading table is provided with a placement groove for placing the chip, and the machine The top of the rack is fixedly connected with a receiving plate located below the left chip loading platform for receiving the chip, one side of the chip loading platform is fixedly connected with a power plate driven by a cylinder, one side of the power plate is fixedly connected with a connecting plate extending to the inner cavity of the chip loading platform, the inner cavity of the chip loading platform is provided with an embedded groove connected to the placement groove, one side of the connecting plate is fixedly connected with a supporting plate extending to the inner cavity of the placement groove, and both sides of the support plate are fixedly connected with positioning blocks extending to the placement groove and the inner cavity of the embedded groove through return springs, one side of the positioning block is provided with a guiding inclined surface, and the surface of the positioning block is provided with a clamping groove adapted to the chip, and the inner cavity The inner cavity of the embedding groove is fixedly connected with a guide rod, and the inner cavity of the positioning block is provided with a guide inclined groove adapted to the guide rod. When in use, the chip is placed in the placement groove of the inner cavity of the chip loading table located above the receiving plate by a manipulator. At this time, the chip falls on the receiving plate and is placed, and then the power plate is driven by the cylinder to move, which drives the connecting plate to move. The connecting plate drives the positioning block to move in the direction of the chip, and the side guide inclined surface of the positioning block contacts the chip, pushing the chip to the card slot for positioning, and at this time, the guide rod is inserted into the guide inclined groove while moving, forcing the positioning block to move toward both sides to prevent the contact force on the chip when the guide inclined surface contacts the chip Too large will cause edge collapse. The oblique movement of the guide rod can quickly insert the chip into the card slot, and then push it into the abutment slot for positioning. When placing the chip, there is no need for precise positioning. Only the movement of the power plate can position multiple chips at the same time, saving time and without damaging the corners of the chip during positioning. After positioning, the two chip loading tables move to the right at the same time. At this time, the chip loading table on the right is fed, and the chip loading table on the left moves to the bottom of the suction cup, and the suction cup is driven down by the lower pressure plate to adsorb the chip, and then the power plate is retracted to drive the positioning block to reset. At this time, the reset spring contracts to drive the positioning block to retract.

[0006] As a further solution of the present invention: one side of the placement groove is provided with an abutment groove arranged in the inner cavity of the chip loading platform, the bottom of the abutment groove is flush with the bottom of the chip loading platform, the top of the abutment groove is located below the surface of the chip loading platform, and the placement groove is arranged in a through-type manner on the surface of the chip loading platform. The end of the chip can be inserted into the abutment groove through the setting of the abutment groove, so that the top of the chip is limited, and even if it is sucked, it will not detach and rise above the chip loading platform, and it will separate from the suction cup and fall below under cover.

[0007] As a further solution of the present invention: a suction cup connected to an external air source is fixedly connected to the bottom of the lower pressure plate, and the diameter of the suction cup is smaller than the minimum inner diameter of the placement groove. The suction cup is driven to move up and down by the up and down movement of the lower pressure plate, so that the chip can be first adsorbed and positioned, and then pressed downward to press it on the solder paste on the lead frame.

[0008] As a further solution of the present invention: the smearing mechanism includes a fixed plate, the surface of the fixed plate is lifted and lowered with a glue storage frame driven by a motor, storage grooves are provided on both sides of the glue storage frame, the surface of the glue storage frame is provided with glue coating grooves corresponding to the placement grooves, the surface of the glue storage frame is provided with a glue injection port located between the placement grooves, the glue injection port is connected with an external solder paste supply mechanism through a pipeline, the top of the glue storage frame is slidably connected with a scraper plate driven by a power mechanism, when in use, the glue storage frame moves downward and presses the top of the lead frame, and then glue is injected through the glue injection port, and then the scraper plate reciprocates left and right to smear the solder paste on the top of the lead frame through the glue coating groove, and then the excess solder paste is pushed to the storage grooves on both sides for storage, and then the glue-coated lead frame is continuously conveyed by the conveyor belt to the bottom of the suction cup, and then the suction cup is pressed down to stick the chip on the top of the lead frame, and then reset and repeat the above steps.

[0009] As a further solution of the present invention: a plurality of placement grooves are provided and are evenly distributed on the surface of the chip loading platform, and a plurality of suction cups are provided and correspond one to one with the placement grooves.

[0010] As a further solution of the present invention: a protrusion adapted to the placement groove is provided on the top of the receiving plate, and the surface of the receiving plate other than the protrusion does not abut against the bottom of the chip loading platform.

[0011] As a further solution of the present invention: the embedded groove is arranged in the inner cavity of the chip loading platform.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. The present invention does not require precise positioning when placing chips. Only the movement of the power plate is required to perform positioning operations on multiple chips at the same time, which saves time and does not damage the corners of the chips during positioning. After positioning, the two chip loading platforms move to the right at the same time. At this time, the chip loading platform on the right is fed, and the chip loading platform on the left is moved under the suction cup. The suction cup is driven down by the lower pressure plate to adsorb the chip. The chip can be quickly and accurately loaded and positioned, and the efficiency of lead frame core bonding is improved. The movement stability in all dimensions is strong, which improves the production efficiency of semiconductors, can stably fix the chip on the lead frame, and improves the accuracy of lead frame core bonding.

[0014] 2. The present invention can insert the end of the chip into the abutment groove, so that the top of the chip is limited and will not be separated from the chip loading platform even if it is sucked, but will be separated from the suction cup and fall below under protection.

[0015] 3. The present invention injects glue through the glue injection port, and then the scraper moves back and forth left and right to apply the solder paste through the glue coating groove on the top of the lead frame, and then the excess solder paste is pushed into the storage grooves on both sides for storage. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention;

[0017] Figure 2 A top view of the structure of the chip loading platform of the present invention;

[0018] Figure 3 For the present invention Figure 2 A partial enlarged view of the middle A;

[0019] Figure 4 A top view of the structure of the chip loading platform in a clamping state of the present invention;

[0020] Figure 5 For the present invention Figure 4 A partial enlarged view of point B in the middle;

[0021] Figure 6 It is a top view of the structure of the glue storage frame of the present invention.

[0022] In the figure: 1. conveyor belt; 2. loading template; 3. lead frame; 4. rack; 5. chip loading platform; 6. placement slot; 7. suction cup; 8. power board; 9. connecting plate; 11. guide inclined slot; 12. guide rod; 13. support plate; 14. reset spring; 15. clamping slot; 16. guide slope; 17. chip; 18. fixing plate; 19. glue storage frame; 20. storage slot; 21. glue coating slot; 22. glue injection port; 23. positioning block; 24. receiving plate; 25. lower pressure plate; 26. abutment slot; 27. scraper plate. DETAILED DESCRIPTION

[0023] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0024] See also Figure 1-6The present invention provides a technical solution: a frame core bonding device for chip packaging, comprising a conveyor belt 1, a coating mechanism for brushing glue on a lead frame 3 arranged above the conveyor belt 1, and a pressing mechanism for assembling a chip 17 and the lead frame 3, the surface of the conveyor belt 1 is connected to a loading template 2 for loading the lead frame 3, the pressing mechanism comprises a frame 4, the surface of the frame 4 is provided with a lower pressing plate 25 driven by a driving mechanism, the surface of the frame 4 is provided with two fixed chip loading platforms 5 driven by a motor, the inner cavity of the chip loading platform 5 is provided with a placement groove 6 for placing the chip 17, the top of the frame 4 is fixedly connected with a lower pressing plate 25 driven by a driving mechanism for loading the lead frame 3, and the lower pressing plate 25 driven by a driving mechanism for loading the lead frame 3 is driven by a driving mechanism for loading the lead frame 3. A receiving plate 24 for receiving the chip 17, one side of the chip loading platform 5 is fixedly connected to a power plate 8 driven by a cylinder, one side of the power plate 8 is fixedly connected to a connecting plate 9 extending to the inner cavity of the chip loading platform 5, the inner cavity of the chip loading platform 5 is provided with an embedded groove connected to the placement groove 6, one side of the connecting plate 9 is fixedly connected to a support plate 13 extending to the inner cavity of the placement groove 6, both sides of the support plate 13 are respectively fixedly connected to positioning blocks 23 extending to the placement groove 6 and the inner cavity of the embedded groove through reset springs 14, one side of the positioning block 23 is provided with a guide inclined surface 16, the surface of the positioning block 23 is provided with a snap-in groove 15 adapted to the chip 17, the inner cavity of the embedded groove is fixedly connected to a guide rod 12, and the inner cavity of the positioning block 23 is provided with a guide rod 12 connected to the ... The guide inclined groove 11 adapted to the guide rod 12 is used to place the chip 17 into the placement groove 6 of the inner cavity of the chip loading table 5 above the receiving plate 24 by a manipulator when in use. At this time, the chip 17 falls on the receiving plate 24 and is placed. Then the power plate 8 is driven by the cylinder to move, driving the connecting plate 9 to move. The connecting plate 9 drives the positioning block 23 to move in the direction of the chip 17. The side guide inclined surface 16 of the positioning block 23 contacts the chip 17, and the chip 17 is pushed to the card slot 15 for positioning. At this time, the guide rod 12 is inserted into the guide inclined groove 11 while moving. The forced stretching of the positioning block 23 to move toward both sides can prevent the contact force of the guide inclined surface 16 on the chip 17 from being too large, resulting in edge collapse. The chip 17 can be quickly inserted into the card slot 15 through the oblique movement of the guide rod 12, and then pushed into the abutment slot 26 for positioning. When placing the chip 17, there is no need for precise positioning. The movement of the power plate 8 is sufficient to perform positioning operations on multiple chips 17 at the same time, saving time and causing no damage to the corners of the chip 17 during positioning. After positioning, the two chip loading platforms 5 move to the right at the same time. At this time, the chip loading platform 5 on the right is fed, and at this time, the chip loading platform 5 on the left moves to the bottom of the suction cup 7, and the suction cup 7 is driven down by the lower pressure plate 25 to adsorb the chip 17. Then the power plate 8 is retracted to drive the positioning block 23 to reset. At this time, the reset spring 14 contracts to drive the positioning block 23 to retract.

[0025] One side of the placement groove 6 is provided with an abutment groove 26 arranged in the inner cavity of the chip loading platform 5. The bottom of the abutment groove 26 is flush with the bottom of the chip loading platform 5, and the top of the abutment groove 26 is located below the surface of the chip loading platform 5. The placement groove 6 is set through the surface of the chip loading platform 5. Through the setting of the abutment groove 26, the end of the chip 17 can be inserted, so that the top of the chip is limited, and even if it is sucked, it will not detach and rise above the chip loading platform 5, and it will separate from the suction cup 7 and fall below under cover.

[0026] The bottom of the lower pressure plate 25 is fixedly connected with a suction cup 7 connected to the external air source. The diameter of the suction cup 7 is smaller than the minimum inner diameter of the placement groove 6. The suction cup 7 is driven to move up and down by the lower pressure plate 25. The chip 17 can be first adsorbed and positioned, and then pressed downward to press it onto the solder paste on the lead frame 3.

[0027] The smearing mechanism includes a fixed plate 18, and a glue storage frame 19 driven by a motor is provided on the surface of the fixed plate 18. Storage grooves 20 are provided on both sides of the glue storage frame 19. Glue coating grooves 21 corresponding to the positions of the placement grooves 6 are provided on the surface of the glue storage frame 19. A glue injection port 22 located between the placement grooves 6 is provided on the surface of the glue storage frame 19. The glue injection port 22 is connected to an external solder paste supply mechanism through a pipeline. The top of the glue storage frame 19 is slidably connected to a scraper plate 27 driven by a power mechanism. When in use, the glue storage frame 19 moves downward and presses on the top of the lead frame 3, and then glue is injected through the glue injection port 22. Then, the scraper plate 27 reciprocates left and right to smear the solder paste on the top of the lead frame 3 through the glue coating groove 21, and then the excess solder paste is pushed to the storage grooves 20 on both sides for storage, and then the glue-coated lead frame 3 is continuously conveyed by the conveyor belt 1 to the bottom of the suction cup 7, and then the suction cup 7 is pressed down to stick the chip 17 on the top of the lead frame 3, and then reset and repeat the above steps.

[0028] There are a plurality of placement grooves 6 , which are evenly distributed on the surface of the chip loading platform 5 , and there are a plurality of suction cups 7 , which correspond to the placement grooves 6 one by one.

[0029] A protrusion matched with the placement groove 6 is formed on the top of the receiving plate 24 , and the surface of the receiving plate 24 other than the protrusion does not abut against the bottom of the chip loading platform 5 .

[0030] The embedded groove is arranged in the inner cavity of the chip loading platform 5 .

[0031] The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been disclosed as above in the form of preferred embodiments, it is not intended to limit the present invention. Any technical personnel in the field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A frame core bonding device for chip packaging, comprising a conveyor belt (1), a coating mechanism arranged above the conveyor belt (1) for brushing glue on a lead frame (3), and a pressing mechanism for assembling a chip (17) and the lead frame (3), wherein the surface of the conveyor belt (1) is drivingly connected to a loading template (2) for loading the lead frame (3), and characterized in that: The pressing mechanism comprises a frame (4), the surface of the frame (4) is provided with a lower pressing plate (25) driven by a driving mechanism, the surface of the frame (4) is provided with two fixed chip loading platforms (5) driven by a motor, the inner cavity of the chip loading platform (5) is provided with a placement groove (6) for placing the chip (17), the top of the frame (4) is fixedly connected with a receiving plate (24) located below the left chip loading platform (5) for receiving the chip (17), one side of the chip loading platform (5) is fixedly connected with a power plate (8) driven by a cylinder, and one side of the power plate (8) is fixedly connected with a connection extending to the inner cavity of the chip loading platform (5). The chip loading platform (5) has an inner cavity provided with an embedded groove connected to the placement groove (6), one side of the connecting plate (9) is fixedly connected with a support plate (13) extending to the inner cavity of the placement groove (6), and the two sides of the support plate (13) are respectively fixedly connected with positioning blocks (23) extending to the placement groove (6) and the inner cavity of the embedded groove through reset springs (14), one side of the positioning block (23) is provided with a guide inclined surface (16), the surface of the positioning block (23) is provided with a snap-in groove (15) adapted to the chip (17), the inner cavity of the embedded groove is fixedly connected with a guide rod (12), and the inner cavity of the positioning block (23) is provided with a guide inclined groove (11) adapted to the guide rod (12).

2. The frame core bonding device for chip packaging according to claim 1, characterized in that: A contact groove (26) is provided on one side of the placement groove (6) and is arranged in the inner cavity of the chip loading platform (5); the bottom of the contact groove (26) is flush with the bottom of the chip loading platform (5); the top of the contact groove (26) is located below the surface of the chip loading platform (5); and the placement groove (6) is arranged in a penetrating manner on the surface of the chip loading platform (5).

3. The frame core bonding device for chip packaging according to claim 1, characterized in that: A suction cup (7) connected to an external air source is fixedly connected to the bottom of the lower pressing plate (25), and the diameter of the suction cup (7) is smaller than the minimum inner diameter of the placement groove (6).

4. The frame core bonding device for chip packaging according to claim 1, characterized in that: The coating mechanism comprises a fixed plate (18), the surface of the fixed plate (18) is provided with a glue storage frame (19) driven by a motor, both sides of the glue storage frame (19) are provided with storage grooves (20), the surface of the glue storage frame (19) is provided with glue coating grooves (21) corresponding to the positions of the placement grooves (6), the surface of the glue storage frame (19) is provided with glue injection ports (22) located between the placement grooves (6), the glue injection ports (22) are connected to an external solder paste supply mechanism through a pipeline, and the top of the glue storage frame (19) is slidably connected with a scraper plate (27) driven by a power mechanism.

5. The frame core bonding device for chip packaging according to claim 3, characterized in that: The placement grooves (6) are provided in plurality and are evenly distributed on the surface of the chip loading platform (5); the suction cups (7) are provided in plurality and correspond one to one with the placement grooves (6).

6. The frame core bonding device for chip packaging according to claim 1, characterized in that: The top of the receiving plate (24) is provided with a protrusion adapted to the placement groove (6), and the surface of the receiving plate (24) other than the protrusion does not abut against the bottom of the chip loading platform (5).

7. The frame core bonding device for chip packaging according to claim 1, characterized in that: The embedded groove is arranged in the inner cavity of the chip loading platform (5).

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