Quick-changing and fixing device for IC (integrated circuit) bonding head of thermosensitive sheet

By designing the thermal sheet IC bond head quick replacement fixing device, the combination of thrust surface, calibration surface, pressing block, U-shaped latch, fixing plate and limiting components, the problem of manual calibration and adjustment of IC bond head replacement in the prior art is solved, and the rapid replacement of bond head and automatic angle calibration of the bond head is realized, and the working efficiency is improved.

CN119764217APending Publication Date: 2025-04-04ZHUHAI XPRINTER ELECTRONICS TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202411927589.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-25
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

During the production process of existing thermal sensitive sheets, the replacement of IC bond heads requires manual angle calibration and adjustment, which takes a lot of time.

Method used

A thermal sheet IC bond head quick replacement fixing device is designed. Through the cooperation of the set thrust surface, calibration surface, block, U-shaped pin, fixing plate and limiting components, the bond head body is quickly replaced and angle automatic calibration.

Benefits of technology

It realizes rapid replacement of bond heads and automatic angle calibration, reducing the time of manual calibration and improving work efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention belongs to the technical field of heat-sensitive sheet IC bonding head quick-change fixing, and particularly relates to a heat-sensitive sheet IC bonding head quick-change fixing device which comprises a fixing base, a circular groove is formed in the fixing base, a connecting column is arranged in the circular groove, a stepping motor is arranged at the top end of the connecting column, and the output end of the stepping motor is coaxially connected with the connecting column. A third groove is formed in the position, located on one side of the circular groove, in the fixing base. A limiting plate fixed to the connecting column is installed in the third groove in an inserted mode. The fixing assembly is located in the fixing base and used for fixing the connecting column and the fixing base; according to the whole device, when the bonding head body is replaced, only the pressing block needs to be detached, the bonding head body is replaced with a new bonding head body, the side face of the bonding head body is close to the calibration face of the fixing base, the bonding head body is pushed upwards to the thrust face, and the bonding head body is locked through the pressing block and the limiting assembly, and at the moment, the angle of the bonding head body is consistent with the calibration face of the fixing base; and manual angle calibration and adjustment are not needed, use is more convenient, and time is saved.
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Description

Technical Field

[0001] The invention belongs to the technical field of quick-change fixing of thermal chip IC bonding heads, and in particular relates to a quick-change fixing device of a thermal chip IC bonding head. Background Art

[0002] IC bonding is a crucial step in chip packaging technology. In thermal film production, IC bonding involves joining the integrated circuit (IC) chip to the thermal film substrate through a specific process. This process is similar to establishing a neural connection between the "brain" (IC chip) and the "body" (thermal film substrate) in a complex electronic system, enabling the IC chip to effectively control the various functions of the thermal film.

[0003] The existing thermal sheet production process requires IC bonding. ICs bond to ceramic substrates at varying angles, requiring different bonding heads for each IC. After changing the bonding head, manual angle calibration and adjustment are required, which is very time-consuming. To address this, we have developed a quick-change fixture for thermal sheet IC bonding heads. Summary of the Invention

[0004] The object of the present invention is to provide a quick-change fixing device for a thermal chip IC bonding head to solve the problems raised in the above background technology.

[0005] In view of this, the present invention provides a quick-change fixing device for a thermal chip IC bonding head, comprising: A fixing base, wherein a circular groove is provided in the fixing base, a connecting column is provided in the circular groove, a stepping motor is provided at the top of the connecting column, the output end of the stepping motor is coaxially connected to the connecting column, a groove three is provided in the fixing base and located on one side of the circular groove, a limiting plate fixed to the connecting column is inserted and installed in the groove three; A fixing assembly, the fixing assembly being located in the fixing seat and being used to fix the connecting column to the fixing seat; A pressure block, the pressure block is located at the bottom of the fixed base, a fixing plate is fixedly installed on one side of the pressure block, two through slots 2 are defined on the pressure block, and two through slots 1 are defined on the fixed base, the same U-shaped pin is inserted and installed in the two through slots 1, and the two ends of the U-shaped pin pass through the two through slots 2 and extend to the outside; A limiting assembly, located in the fixing plate and used to limit the position of the U-shaped latch; The mounting post is located between the pressure block and the fixing seat. A groove four is provided in the fixing seat and between the two through grooves two. A semicircular ring fixed to the mounting post is inserted and installed in the groove four. The bottom of the mounting post is fixedly installed with a bonding head body. A calibration surface is provided on the fixing seat and located on one side of the bonding head body. A thrust surface is provided on the fixing seat and located on the top of the bonding head body.

[0006] In this technical solution, during installation, the staff can first put the fixing seat on the connecting column, so that the limit plate on the connecting column is inserted into the groove three, and the connecting column is inserted into the circular groove. Under the action of the limit plate, the fixing seat can be prevented from rotating on the connecting column. Then, the fixing assembly is used to fix the fixing seat and the connecting column. Then the staff puts the upper end of the mounting column into the fixing seat and locates it between the two through slots 1, and then moves the mounting column upward until the side of the bonding head body contacts the calibration surface and the top of the bonding head body contacts the thrust surface. At this time, the angle of the bonding head body is consistent with the calibration surface and no recalibration is required. Then, the staff inserts the two ends of the U-shaped pin into the two through slots 1 respectively, and then, respectively puts the two through slots 2 on the pressure block on the two ends of the U-shaped pin, and then moves the pressure block toward the mounting column until the semicircular ring on the mounting column is inserted into the groove 4. Then, the limit assembly is used to limit the U-shaped pin. At this time, the pressure block will be fixed, so that the position of the mounting column is fixed.

[0007] In the above technical solution, further, the fixing assembly includes: Groove 1, the groove 1 is provided on the fixing seat, a groove 2 is provided on the fixing seat and located at the top of the groove 1, the groove 2 is connected to the circular groove, a limiting disk is provided in the groove 1, a vertical plate fixed to the limiting disk is provided in the groove 2, and the limiting disk is plugged into and matched with the connecting column; Two thread grooves are provided in the fixing seat and are respectively located on both sides of groove 2. A fixing bolt is installed in the thread of one of the thread grooves. One end of the fixing bolt passes through the vertical plate and the other thread groove and extends to the outside.

[0008] In this technical solution, when fixing, the limit plate can be inserted into groove one, so that the vertical plate is inserted into groove two. At this time, the U-shaped arc surface on the limit plate will be inserted into the connecting column, which can preliminarily limit the position of the connecting column to prevent the fixing seat from shaking up and down on the connecting column. Under the action of the limit plate, the fixing seat can be prevented from rotating on the connecting column. Then, under the action of the thread, the staff uses a tool to thread one end of the fixing bolt into one of the thread grooves, and then continues to rotate the fixing bolt so that one end of the fixing bolt is threaded into the vertical plate, and then continues to rotate the fixing bolt so that one end of the fixing bolt is threaded into the other thread groove, so that the fixing bolt can no longer rotate. At this time, the fixing seat will be fixed to the connecting column.

[0009] In the above technical solution, further, one end of the fixing bolt is threadedly connected to the vertical plate and another thread groove.

[0010] In this technical solution, under the action of the thread, it is ensured that one end of the fixing bolt can be threadedly installed into the vertical plate and the other thread groove.

[0011] In the above technical solution, further, the limiting component includes: A power cavity, the power cavity is opened in a fixed plate, a slide groove is opened in the fixed plate and on both sides of the power cavity, a worm is rotatably installed in the power cavity, a worm wheel is rotatably installed in the power cavity and at the bottom of the worm, a threaded rod is rotatably installed in the slide groove, opposite ends of the two threaded rods respectively pass through opposite sides of the two slide grooves and extend into the power cavity, and opposite ends of the two threaded rods are coaxially connected to the two ends of the worm wheel respectively, one end of the worm passes through one side of the power cavity and extends to the outside and is fixedly installed with a handle; Two sliders, each of which is slidably mounted in the two slide grooves and is located on the two threaded rods. A slot is provided on each of the two opposite sides of the U-shaped latch. The ends of the two sliders that are spaced apart from each other pass through the two opposite sides of the slide grooves and extend into the two slots. Two hand-tightening bolts are respectively threadedly installed in the two ends of the U-shaped pin, and one end of the hand-tightening bolt extends into the corresponding slider.

[0012] In this technical solution, the staff can turn the handle by hand, and the handle will drive the worm to rotate. Under the action of meshing, the worm will drive the worm wheel to rotate. Subsequently, the two ends of the worm wheel will respectively drive the two threaded rods to rotate. Under the action of the thread, the two threaded rods will respectively drive the two sliders away from each other until the ends of the two sliders that are away from each other are respectively inserted into the two slots, so that the U-shaped pin can be limited. At this time, the pressure block will be fixed, so that the position of the mounting column is fixed.

[0013] In the above technical solution, further, the worm is engaged with the worm wheel, one end of the threaded rod is rotationally connected to the power chamber, the slider is threadedly connected to the corresponding threaded rod, and the threads on the two threaded rods have opposite rotation directions.

[0014] In this technical solution, under the action of meshing, the rotation of the worm will drive the rotation of the worm wheel, ensuring that one end of the threaded rod can rotate in the power chamber. Under the action of the thread, the rotation of the two threaded rods can respectively drive the two sliders away from each other.

[0015] In the above technical solution, further, one end of the slider is plugged into and matched with the corresponding slot, and one end of the hand-tightening bolt is threadedly connected to the slider.

[0016] In this technical solution, it is ensured that one end of the slider can be inserted into the corresponding slot, and it is ensured that one end of the hand-tightening bolt can be threadedly installed in the slider.

[0017] In the above technical solution, further, the limiting plate and the connecting column are an integrally formed structure, and the limiting disk and the vertical plate are an integrally formed structure.

[0018] In this technical solution, the structural stability between the limiting plate and the connecting column is ensured, and the structural stability between the limiting plate and the vertical plate is ensured.

[0019] In the above technical solution, further, the calibration surface is in close contact with one side of the bonding head body, and the thrust surface is in close contact with the top of the bonding head body.

[0020] In this technical solution, it is ensured that the calibration surface can calibrate the angle of the bonding head body, and it is ensured that the thrust surface can limit the position of the bonding head body.

[0021] In the above technical solution, further, both ends of the U-shaped pin are respectively plugged into and fitted with the two through slots.

[0022] In this technical solution, it is ensured that both ends of the U-shaped pin can be inserted into the two through slots 2 respectively.

[0023] In the above technical solution, further, the mounting post, the semicircular ring and the bonding head body are an integrally formed structure.

[0024] In this technical solution, the structural stability of the mounting column, the semicircular ring and the bonding head body is ensured.

[0025] The beneficial effects of the present invention are: 1. This thermal IC bonding head quick-change fixture features a thrust surface, calibration surface, pressure block, U-shaped latch, fixing plate, and limit assembly. When replacing the bonding head body, simply remove the pressure block and replace it with a new one. The side of the bonding head body, close to the calibration surface of the fixing base, is pushed upward to the thrust surface and locked with the pressure block and limit assembly. This ensures that the angle of the bonding head body is aligned with the calibration surface of the fixing base, eliminating the need for manual angle calibration and adjustment. This makes it more convenient to use and saves time.

[0026] 2. The quick-change fixing device for the thermal chip IC bonding head, through the cooperation between the set limit plate, groove three, circular groove and fixing components, makes it faster to remove the fixing base from the connecting column, and can also position the fixing base, making it more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is one of the regional structural diagrams of the fixing seat in the present invention; Figure 3 This is one of the structural diagrams of the fixing seat in the present invention; Figure 4 This is the second structural diagram of the fixing seat in the present invention; Figure 5 This is a schematic diagram of the regional structure of the connecting column in the present invention; Figure 6 Schematic diagram of the cross-sectional structure of the fixing plate in the present invention; Figure 7 It is a structural schematic diagram of the briquette in the present invention; Figure 8 This is the second schematic diagram of the regional structure of the fixing seat in the present invention; Figure 9 Schematic diagram of the structure inside the fixing seat of the present invention; Figure 10 It is a structural schematic diagram of the mounting post, the semicircular ring and the bonding head body in the present invention; Figure 11 Schematic diagram of the structure inside the fixed plate of the present invention; Figure 12 For the present invention Figure 11 A in the middle is an enlarged schematic diagram of the structure; Figure 13 It is a structural schematic diagram of the U-shaped latch in the present invention.

[0028] The marks in the figure are: 1. Stepper motor; 2. Connecting column; 3. Fixing seat; 4. Fixing bolt; 5. Pressure block; 6. Fixing plate; 7. Thrust surface; 8. Calibration surface; 9. Bonding head body; 10. Thumb bolt; 11. Limit plate; 12. U-shaped latch; 13. Vertical plate; 14. Limit plate; 15. Through slot 1; 16. Groove 1; 17. Groove 2; 18. Threaded slot; 19. Groove 3; 20. Circular slot; 21. Mounting column; 22. Semicircular ring; 23. Slider; 24. Slide; 25. Threaded rod; 26. Power chamber; 27. Worm; 28. Worm gear; 29. ​​Handle; 30. Slot; 31. Through slot 2; 32. Groove 4. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0030] In the description of this application, it should be noted that the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn according to the actual proportional relationship. Technologies, methods and equipment known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0031] It should be noted that the terms "first," "second," etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than those illustrated or described herein, and that the objects distinguished by "first," "second," etc. are generally of the same type, and do not limit the number of objects. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0032] It should be noted that, in the description of this application, the directions or positional relationships indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise specified, these directional terms do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of this application; the directional terms "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0033] It should be noted that, in the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0034] Example 1: See also Figure 1 - Figure 13 As shown, this embodiment provides a quick-change fixing device for a thermal IC bonding head, comprising: A fixing base 3 is provided with a circular groove 20 in the fixing base 3, a connecting column 2 is provided in the circular groove 20, a stepping motor 1 is provided at the top of the connecting column 2, and the output end of the stepping motor 1 is coaxially connected to the connecting column 2. A groove 3 19 is provided in the fixing base 3 and on one side of the circular groove 20, and a limit plate 14 fixed to the connecting column 2 is inserted and installed in the groove 3 19; A fixing assembly is located in the fixing seat 3 and is used to fix the connecting column 2 to the fixing seat 3; The pressing block 5 is located at the bottom of the fixing base 3. A fixing plate 6 is fixedly installed on one side of the pressing block 5. The pressing block 5 is provided with two through slots 2 31. The fixing base 3 is provided with two through slots 15. The same U-shaped latch 12 is inserted into the two through slots 15. The two ends of the U-shaped latch 12 pass through the two through slots 2 31 and extend to the outside. A limiting assembly is located inside the fixing plate 6 and is used to limit the position of the U-shaped latch 12; The mounting column 21 is located between the pressure block 5 and the fixing seat 3. A groove 4 32 is provided in the fixing seat 3 and between the two through grooves 2 31. A semicircular ring 22 fixed to the mounting column 21 is inserted and installed in the groove 4 32. The bottom of the mounting column 21 is fixedly installed with a bonding head body 9. A calibration surface 8 is provided on the fixing seat 3 and located on one side of the bonding head body 9. A thrust surface 7 is provided on the fixing seat 3 and located on the top of the bonding head body 9.

[0035] During installation, the staff can first put the fixing seat 3 on the connecting column 2, so that the limiting plate 14 on the connecting column 2 is inserted into the groove 3 19, and the connecting column 2 is inserted into the circular groove 20. Under the action of the limiting plate 14, the fixing seat 3 can be prevented from rotating on the connecting column 2. Then, the fixing assembly is used to fix the fixing seat 3 and the connecting column 2. Then the staff puts the upper end of the mounting column 21 into the fixing seat 3 and locates it between the two through slots 15, and then moves the mounting column 21 upward until the side of the bonding head body 9 contacts the calibration surface 8, and the top of the bonding head body 9 contacts the thrust surface 7. At this time, the angle of the bonding head body 9 is consistent with the calibration surface 8, and no recalibration is required. Then, the staff inserts the two ends of the U-shaped pin 12 into the two through slots 15 respectively, and then, respectively puts the two through slots 2 31 on the pressure block 5 on the two ends of the U-shaped pin 12, and then, moves the pressure block 5 in the direction close to the mounting column 21 until the semicircular ring 22 on the mounting column 21 is inserted into the groove 4 32, and then, through the set limit assembly, the limit assembly limits the U-shaped pin 12. At this time, the pressure block 5 will be fixed, so that the position of the mounting column 21 is fixed.

[0036] Example 2: This embodiment provides a quick-change fixing device for a thermal IC bonding head. In addition to the technical solutions of the above embodiments, it also has the following technical features. The fixing assembly includes: Groove 16, groove 16 is provided on the fixing base 3, and groove 2 17 is provided on the fixing base 3 and located at the top of groove 16, groove 2 17 is connected to the circular groove 20, a limiting plate 11 is provided in groove 16, and a vertical plate 13 fixed to the limiting plate 11 is provided in groove 2 17, and the limiting plate 11 is plugged into and matched with the connecting column 2; Two thread grooves 18 are provided in the fixing seat 3 and are respectively located on both sides of the groove 2 17 . A fixing bolt 4 is installed in the inner thread of one of the thread grooves 18 . One end of the fixing bolt 4 passes through the vertical plate 13 and the other thread groove 18 and extends to the outside.

[0037] Among them, when fixing, the limit plate 11 can be inserted into groove 16, so that the vertical plate 13 is inserted into groove 2 17. At this time, the U-shaped arc surface on the limit plate 11 will be inserted into the connecting column 2, which can preliminarily limit the position of the connecting column 2 to prevent the fixing seat 3 from shaking up and down on the connecting column 2. Under the action of the limit plate 14, the fixing seat 3 can be prevented from rotating on the connecting column 2. Then, under the action of the thread, the staff uses a tool to thread one end of the fixing bolt 4 into one of the thread grooves 18, and then continues to rotate the fixing bolt 4 so that one end of the fixing bolt 4 is threaded into the vertical plate 13, and then continues to rotate the fixing bolt 4 so that one end of the fixing bolt 4 is threaded into the other thread groove 18, so that the fixing bolt 4 can no longer rotate. At this time, the fixing seat 3 will be fixed to the connecting column 2.

[0038] Example 3: This embodiment provides a quick-change fixing device for a thermal chip IC bonding head. In addition to the technical solutions of the above embodiments, it also has the following technical features: one end of the fixing bolt 4 is threadedly connected to the vertical plate 13 and another thread groove 18.

[0039] Here, under the action of the thread, it is ensured that one end of the fixing bolt 4 can be threadedly installed into the vertical plate 13 and the other thread groove 18.

[0040] Example 4: This embodiment provides a quick-change fixing device for a thermal IC bonding head. In addition to the technical solutions of the above embodiments, it also has the following technical features: the limit assembly includes: A power cavity 26 is provided in the fixed plate 6. Slide grooves 24 are provided in the fixed plate 6 and on both sides of the power cavity 26. A worm 27 is rotatably installed in the power cavity 26. A worm wheel 28 is rotatably installed in the power cavity 26 and at the bottom of the worm 27. A threaded rod 25 is rotatably installed in the slide groove 24. The opposite ends of the two threaded rods 25 respectively pass through the opposite sides of the two slide grooves 24 and extend into the power cavity 26. The opposite ends of the two threaded rods 25 are coaxially connected to the two ends of the worm wheel 28. One end of the worm 27 passes through one side of the power cavity 26 and extends to the outside and is fixedly installed with a handle 29. Two sliders 23 are slidably mounted in two slide grooves 24 and are respectively located on two threaded rods 25. A slot 30 is defined on opposite sides of the U-shaped latch 12. The distal ends of the two sliders 23 penetrate the distal sides of the two slide grooves 24 and extend into the two slots 30. Two hand-tightening bolts 10 are respectively threadedly installed in the two ends of the U-shaped pin 12, and one end of the hand-tightening bolt 10 extends into the corresponding slider 23.

[0041] Among them, the staff can turn the handle 29 by hand, and the handle 29 will drive the worm 27 to rotate. Under the action of meshing, the worm 27 will drive the worm wheel 28 to rotate, and then the two ends of the worm wheel 28 will respectively drive the two threaded rods 25 to rotate. Under the action of the threads, the two threaded rods 25 will respectively drive the two sliders 23 to move away from each other until the ends of the two sliders 23 that are away from each other are respectively inserted into the two card slots 30, so that the U-shaped pin 12 can be limited. At this time, the pressure block 5 will be fixed, so that the position of the mounting column 21 is fixed.

[0042] Example 5: This embodiment provides a quick-change fixing device for a thermal chip IC bonding head. In addition to the technical solutions of the above-mentioned embodiments, it also has the following technical features: a worm 27 is engaged with a worm wheel 28, one end of a threaded rod 25 is rotatably connected to a power chamber 26, a slider 23 is threadedly connected to the corresponding threaded rod 25, and the threads on the two threaded rods 25 have opposite rotation directions.

[0043] Among them, under the action of meshing, the rotation of the worm 27 will drive the worm wheel 28 to rotate, ensuring that one end of the threaded rod 25 can rotate in the power chamber 26. Under the action of the thread, the rotation of the two threaded rods 25 can respectively drive the two sliders 23 away from each other.

[0044] Example 6: This embodiment provides a quick-change fixing device for a thermal chip IC bonding head. In addition to the technical solutions of the above-mentioned embodiments, it also has the following technical features: one end of the slider 23 is plugged into the corresponding slot 30, and one end of the hand-tightening bolt 10 is threadedly connected to the slider 23.

[0045] Here, it is ensured that one end of the slider 23 can be inserted into the corresponding slot 30 , and that one end of the hand-tightening bolt 10 can be threadedly installed into the slider 23 .

[0046] Example 7: This embodiment provides a quick-change fixing device for a thermal chip IC bonding head. In addition to the technical solutions of the above embodiments, it also has the following technical features: the limit plate 14 and the connecting column 2 are an integrally formed structure, and the limit plate 11 and the vertical plate 13 are an integrally formed structure.

[0047] The structure between the limiting plate 14 and the connecting column 2 is ensured to be stable, and the structure between the limiting plate 11 and the vertical plate 13 is ensured to be stable.

[0048] Example 8: This embodiment provides a quick-change fixing device for a thermal chip IC bonding head. In addition to the technical solutions of the above-mentioned embodiments, it also has the following technical features: the calibration surface 8 is in close contact with one side of the bonding head body 9, and the thrust surface 7 is in close contact with the top of the bonding head body 9.

[0049] Here, it is ensured that the calibration surface 8 can calibrate the angle of the bonding head body 9 and that the thrust surface 7 can limit the position of the bonding head body 9 .

[0050] Example 9: This embodiment provides a quick-change fixing device for a thermal chip IC bonding head. In addition to the technical solutions of the above embodiments, it also has the following technical features: the two ends of the U-shaped pin 12 are respectively plugged into the two second through slots 31.

[0051] Here, it is ensured that both ends of the U-shaped pin 12 can be inserted into the two second through slots 31 respectively.

[0052] Example 10: This embodiment provides a quick-change fixing device for a thermal chip IC bonding head. In addition to the technical solutions of the above embodiments, it also has the following technical features: the mounting post 21, the semicircular ring 22 and the bonding head body 9 are an integrally formed structure.

[0053] The structures of the mounting post 21 , the semicircular ring 22 and the bonding head body 9 are ensured to be stable.

[0054] Then, the fixing bolt 4 is screwed to the other end of the fixing bolt 4, and the fixing bolt 4 is screwed to the other end of the fixing bolt 4. At this time, the fixing bolt 4 is fixed to the fixing post 2, and the fixing post 2 is prevented from rotating. Then the staff puts the upper end of the mounting column 21 into the fixing seat 3 and locates it between the two through slots 15, and then moves the mounting column 21 upward until the side of the bonding head body 9 contacts the calibration surface 8 and the top of the bonding head body 9 contacts the thrust surface 7. At this time, the angle of the bonding head body 9 is consistent with the calibration surface 8 and there is no need to recalibrate. Then, the staff inserts the two ends of the U-shaped pin 12 into the two through slots 15 respectively, and then, the two through slots 2 31 on the pressure block 5 are respectively placed on the two ends of the U-shaped pin 12, and then, the pressure block 5 is moved in the direction close to the mounting column 21 until the mounting column 2 1 is inserted into the groove 24 32. Then, the staff can turn the handle 29 by hand, and the handle 29 will drive the worm 27 to rotate. Under the action of meshing, the worm 27 will drive the worm wheel 28 to rotate. Then, the two ends of the worm wheel 28 will respectively drive the two threaded rods 25 to rotate. Under the action of the threads, the two threaded rods 25 will respectively drive the two sliders 23 to move away from each other until the ends of the two sliders 23 that are away from each other are respectively inserted into the two slots 30, so that the U-shaped pin 12 can be limited. At this time, the pressure block 5 will be fixed, so that the position of the mounting column 21 is fixed.

[0055] The embodiments of the present application are described above in conjunction with the accompanying drawings. Unless there is a conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. The quick-change fixing device for thermal IC bonding head is characterized by: include: A fixing seat (3), wherein a circular groove (20) is provided in the fixing seat (3), a connecting column (2) is provided in the circular groove (20), a stepping motor (1) is provided at the top end of the connecting column (2), an output end of the stepping motor (1) is coaxially connected to the connecting column (2), a third groove (19) is provided in the fixing seat (3) and located on one side of the circular groove (20), a limiting plate (14) fixed to the connecting column (2) is inserted and installed in the third groove (19); A fixing assembly, the fixing assembly being located in the fixing seat (3) and being used to fix the connecting column (2) and the fixing seat (3); A pressing block (5), the pressing block (5) being located at the bottom of the fixing seat (3), a fixing plate (6) being fixedly mounted on one side of the pressing block (5), the pressing block (5) being provided with two second through slots (31), the fixing seat (3) being provided with two first through slots (15), the two first through slots (15) being inserted with the same U-shaped pin (12), the two ends of the U-shaped pin (12) respectively passing through the two second through slots (31) and extending to the outside; A limiting component, the limiting component is located in the fixing plate (6) and is used to limit the position of the U-shaped latch (12); A mounting column (21) is provided between the pressure block (5) and the fixing seat (3); a groove (4) (32) is provided in the fixing seat (3) and between the two through grooves (31); a semicircular ring (22) fixed to the mounting column (21) is inserted and installed in the groove (32); a bonding head body (9) is fixedly installed at the bottom of the mounting column (21); a calibration surface (8) is provided on the fixing seat (3) and located on one side of the bonding head body (9); and a thrust surface (7) is provided on the fixing seat (3) and located on the top of the bonding head body (9).

2. The quick-change fixing device for thermal IC bonding head according to claim 1, characterized in that: The fixing assembly comprises: A groove one (16), wherein the groove one (16) is provided on the fixing seat (3), a groove two (17) is provided on the fixing seat (3) and located at the top of the groove one (16), wherein the groove two (17) is connected to the circular groove (20), a limiting plate (11) is provided in the groove one (16), a vertical plate (13) fixed to the limiting plate (11) is provided in the groove two (17), and the limiting plate (11) is plugged and matched with the connecting column (2); Two thread grooves (18), both of which are formed in the fixing seat (3) and are respectively located on both sides of the second groove (17), wherein a fixing bolt (4) is installed in the inner thread of one of the thread grooves (18), and one end of the fixing bolt (4) passes through the vertical plate (13) and the other thread groove (18) and extends to the outside.

3. The quick-change fixing device for thermal IC bonding head according to claim 2, characterized in that: One end of the fixing bolt (4) is threadedly connected to the vertical plate (13) and another thread groove (18).

4. The quick-change fixing device for thermal IC bonding head according to claim 1, characterized in that: The limiting component comprises: A power chamber (26), wherein the power chamber (26) is provided in a fixed plate (6), and slide grooves (24) are provided in the fixed plate (6) and on both sides of the power chamber (26), a worm (27) is rotatably installed in the power chamber (26), a worm wheel (28) is rotatably installed in the power chamber (26) and located at the bottom of the worm wheel (27), a threaded rod (25) is rotatably installed in the slide groove (24), opposite ends of the two threaded rods (25) respectively penetrate opposite sides of the two slide grooves (24) and extend into the power chamber (26), and opposite ends of the two threaded rods (25) are respectively coaxially connected to two ends of the worm wheel (28), and one end of the worm (27) penetrates one side of the power chamber (26) and extends to the outside and is fixedly installed with a handle (29); Two sliders (23), the two sliders (23) are slidably mounted in the two slide grooves (24) and are respectively located on the two threaded rods (25), the two ends of the U-shaped latch (12) are each provided with a clamping groove (30) on one side opposite to the other, and the ends of the two sliders (23) that are away from each other respectively penetrate the side of the two slide grooves (24) that are away from each other and extend into the two clamping grooves (30); Two hand-tightening bolts (10), the two hand-tightening bolts (10) are respectively threadedly mounted in the two ends of the U-shaped latch (12), and one end of the hand-tightening bolt (10) extends into the corresponding slider (23).

5. The quick-change fixing device for thermal IC bonding head according to claim 4, characterized in that: The worm (27) is meshed with the worm wheel (28), one end of the threaded rod (25) is rotatably connected to the power chamber (26), the slider (23) is threadedly connected to the corresponding threaded rod (25), and the threads on the two threaded rods (25) have opposite rotation directions.

6. The quick-change fixing device for thermal IC bonding head according to claim 4, characterized in that: One end of the sliding block (23) is plugged into and matched with the corresponding slot (30), and one end of the hand-tightening bolt (10) is threadedly connected to the sliding block (23).

7. The quick-change fixing device for thermal IC bonding head according to claim 2, characterized in that: The limiting plate (14) and the connecting column (2) are an integrally formed structure, and the limiting disk (11) and the vertical plate (13) are an integrally formed structure.

8. The quick-change fixing device for thermal IC bonding head according to claim 1, characterized in that: The calibration surface (8) is in close contact with one side of the bonding head body (9), and the thrust surface (7) is in close contact with the top of the bonding head body (9).

9. The quick-change fixing device for thermal IC bonding head according to claim 1, characterized in that: The two ends of the U-shaped latch pin (12) are respectively plugged into and matched with the two second through slots (31).

10. The quick-change fixing device for thermal IC bonding head according to claim 1, characterized in that: The mounting column (21), the semicircular ring (22) and the bonding head body (9) are an integrally formed structure.