Wafer carrying method and device, electronic equipment and storage medium
By using the mapping part and the lifting and moving part in the wafer loader, the handling parameters are determined based on the position data of different wafer boxes and compensated, the problem that the coordinates of the robotic point cannot be automatically compensated, and the accuracy of wafer handling and product yield are improved.
Patent Information
- Application Number
- CN202411983935.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-04-04
AI Technical Summary
During the wafer handling process, the existing technology has large differences in the height of the wafer box starting layer of different brands and models, resulting in the coordinates of the robot point cannot be automatically compensated in real time, resulting in chip collision and scribing, and reducing product yield.
By setting a mapping part and a lifting and moving part in the wafer loader, the handling parameters of the transport robot are determined based on the position data of the wafer in different wafer boxes, and automatic adaptation to different wafer boxes is achieved through compensation parameters.
It realizes automatic identification of wafer positions in different wafer boxes and automatic compensation of the coordinates of the transport robot, eliminates the impact of wafer height error on handling, reduces the probability of hitting and scribing, and improves product yield.
Smart Images
Figure CN119764231A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and more specifically, to a method, device, electronic device and storage medium for wafer handling. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Wafers are generally placed in a wafer box.
[0003] As the semiconductor industry reduces costs and increases efficiency, more and more types of wafer boxes are used in the production and manufacturing process of integrated circuits. The quality of the various types of wafer boxes varies greatly, and the heights of the starting layers of wafer boxes of different brands and models vary greatly.
[0004] At present, the technology uses program algorithms to store the coordinates of wafer box points. Every time a new type of wafer box is put into production, the robot needs to perform teaching actions again, which is inefficient. In addition, the wafer handling robot can only store a limited number of wafer box points. When a new type of wafer box is put into production, the robot point coordinates cannot be automatically compensated in real time. In actual production, collision and dicing caused by wafer box errors often occur, reducing product yield. Summary of the invention
[0005] In view of this, the purpose of the present application is to provide a method, device, electronic device and storage medium for wafer handling to overcome the problems in the prior art.
[0006] In a first aspect, an embodiment of the present application provides a method for wafer handling, which acts on a wafer handling system, wherein the wafer handling system includes a wafer loader and a wafer handling robot, wherein a first wafer box is provided in the wafer loader, and a wafer is provided in the first wafer box; the method includes:
[0007] Determining a first handling parameter of the wafer handling robot according to first position data of the wafer in the first wafer box;
[0008] When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter;
[0009] Based on the second transport parameter, the wafer transport robot is controlled to transport the wafers in the second wafer box.
[0010] In some technical solutions of the present application, the wafer loader includes: a mapping part and a lifting and moving part;
[0011] The step of determining a first handling parameter of the wafer handling robot according to the first position data of the wafer in the first wafer box comprises:
[0012] Controlling the lifting and lowering motion part to move the mapping part to a starting position of a first storage unit of a first layer in the first wafer box;
[0013] Controlling the mapping unit to detect the wafer in the first storage unit of the first layer to obtain first position information of the wafer in the first storage unit of the first layer;
[0014] When controlling the transport robot to transport the wafers in the first storage unit of the first layer, the movement parameters of the transport robot are used as the first transport parameters.
[0015] In some technical solutions of the present application, when the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes:
[0016] Controlling the lifting and lowering motion part to move the mapping part to a starting position of a second storage unit of each layer in the second wafer box;
[0017] Controlling the mapping unit to detect the wafers in the second storage units of each layer to obtain second position information of the wafers in the second storage units of each layer;
[0018] Based on the difference between the second position information of the wafer in each layer of the second storage unit and the first position information of the first layer of the first storage unit, the first transport parameter is compensated to obtain the second transport parameter of each layer of the second storage unit.
[0019] In some technical solutions of the present application, the wafer loader includes: a mapping part and a lifting and moving part;
[0020] The step of determining a first handling parameter of the wafer handling robot according to the first position data of the wafer in the first wafer box comprises:
[0021] Controlling the lifting and lowering motion part to move the mapping part to a starting position of a first storage unit of each layer in the first wafer box;
[0022] Controlling the mapping unit to detect the wafers in the first storage units of each layer to obtain first position information of the wafers in the first storage units of each layer;
[0023] When controlling the transport robot to transport the wafers of the first storage units of each layer, the movement parameters of the transport robot are used as the first transport parameters of the layer.
[0024] In some technical solutions of the present application, when the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes:
[0025] Controlling the lifting and lowering motion part to move the mapping part to a starting position of a second storage unit of each layer in the second wafer box;
[0026] Controlling the mapping unit to detect the wafers in the second storage units of each layer to obtain second position information of the wafers in the second storage units of each layer;
[0027] Based on the difference between the second position information of the wafer in the second storage unit of each layer and the first position information of the first storage unit of the corresponding layer, the first handling parameter corresponding to each layer is compensated to obtain the second handling parameter of the second storage unit of each layer.
[0028] In some technical solutions of the present application, the first handling parameter includes: a first taking-out parameter and a first placing parameter;
[0029] When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes:
[0030] When the wafer is set in a second wafer box, compensating the first taking-out parameter according to the second position data to obtain a second taking-out parameter;
[0031] The first placement parameter is compensated according to the second position data to obtain a second placement parameter.
[0032] In some technical solutions of the present application, the above method further includes:
[0033] When the following conditions are met, an alarm message is generated:
[0034] Detecting the wafers in the second wafer box, and finding that the wafers are abnormal;
[0035] Alternatively, the compensation parameter is not within a preset range; wherein the compensation parameter is determined based on the second position data and the first position data.
[0036] In a second aspect, an embodiment of the present application provides a wafer handling device, which acts on a wafer handling system, wherein the wafer handling system includes a wafer loader and a wafer handling robot, wherein the wafer loader is provided with a first wafer box, wherein the first wafer box is provided with a wafer; the device includes:
[0037] A first determining module, configured to determine a first handling parameter of the wafer handling robot according to first position data of the wafer in the first wafer box;
[0038] a second determining module, configured to determine, when the wafer is set in a second wafer box, a second handling parameter of the wafer handling robot according to second position data of the wafer in the second wafer box and the first handling parameter;
[0039] A control module is used to control the wafer handling robot to handle the wafers in the second wafer box based on the second handling parameter.
[0040] In a third aspect, an embodiment of the present application provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the above-mentioned wafer handling method when executing the computer program.
[0041] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the above-mentioned wafer handling method are executed.
[0042] The technical solution provided by the embodiments of the present application may have the following beneficial effects:
[0043] The method of the present application includes determining a first handling parameter of the wafer handling robot according to first position data of the wafer in the first wafer box; when the wafer is set in a second wafer box, determining a second handling parameter of the wafer handling robot according to second position data of the wafer in the second wafer box and the first handling parameter; and based on the second handling parameter, controlling the wafer handling robot to carry the wafers in the second wafer box.
[0044] The present application automatically identifies the positions of wafers in different wafer boxes, realizes automatic compensation of the coordinates of the wafer handling robot, eliminates the influence of the height error of the wafer box on the wafer handling, reduces the probability of wafer collision and dicing, and improves the yield.
[0045] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0047] Figure 1 A schematic flow chart of a wafer transport method provided in an embodiment of the present application is shown;
[0048] Figure 2 A schematic diagram of an overall wafer loader provided in an embodiment of the present application is shown;
[0049] Figure 3 A schematic diagram of some hardware of a wafer loader provided in an embodiment of the present application is shown;
[0050] Figure 4 A partial hardware schematic diagram of another wafer loader provided in an embodiment of the present application is shown;
[0051] Figure 5 A schematic diagram of a wafer transport device provided in an embodiment of the present application is shown;
[0052] Figure 6 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION
[0053] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of explanation and description and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn in real proportion. The flowchart used in this application shows the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowchart can be implemented out of sequence, and the steps without logical context can be reversed in order or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart under the guidance of the content of the present application, or remove one or more operations from the flowchart.
[0054] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.
[0055] It should be noted that the term "comprising" will be used in the embodiments of the present application to indicate the existence of the features declared thereafter, but does not exclude the addition of other features.
[0056] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Wafers are generally placed in a wafer box.
[0057] As the semiconductor industry reduces costs and increases efficiency, more and more types of wafer boxes are used in the production and manufacturing process of integrated circuits. The quality of the various types of wafer boxes varies greatly, and the heights of the starting layers of wafer boxes of different brands and models vary greatly.
[0058] At present, the technology uses program algorithms to store the coordinates of wafer box points. Every time a new type of wafer box is put into production, the robot needs to perform teaching actions again, which is inefficient. In addition, the wafer handling robot can only store a limited number of wafer box points. When a new type of wafer box is put into production, the robot point coordinates cannot be automatically compensated in real time. In actual production, collision and dicing caused by wafer box errors often occur, reducing product yield.
[0059] Based on this, the embodiments of the present application provide a method, device, electronic device and storage medium for wafer handling, which are described below through embodiments.
[0060] Figure 1 A schematic flow chart of a wafer handling method provided in an embodiment of the present application is shown, wherein the method acts on a wafer handling system, the wafer handling system includes a wafer loader and a wafer handling robot, the wafer loader is provided with a first wafer box, and the first wafer box is provided with a wafer; comprising steps S101-S103; specifically:
[0061] S101, determining a first handling parameter of the wafer handling robot according to first position data of the wafer in the first wafer box;
[0062] S102, when the wafer is set in the second wafer box, determining a second handling parameter of the wafer handling robot according to second position data of the wafer in the second wafer box and the first handling parameter;
[0063] S103 . Based on the second transport parameter, control the wafer transport robot to transport the wafers in the second wafer box.
[0064] The present application automatically identifies the positions of wafers in different wafer boxes, realizes automatic compensation of the coordinates of the wafer handling robot, eliminates the influence of the height error of the wafer box on the wafer handling, reduces the probability of wafer collision and dicing, and improves the yield.
[0065] Some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0066] The method in the embodiment of the present application acts on a wafer handling system, wherein the wafer handling system includes a wafer loader and a wafer handling robot. Figure 2 , Figure 3 and Figure 4 As shown, the wafer loader includes a mapping unit 3, a data acquisition unit, a lifting and moving unit 4, and a loader data processing unit. The wafer loader is also connected to a manipulator 5, which includes a manipulator data processing unit, a manipulator body, and a hand fork. The wafer loader is provided with a first wafer box 1, and the first wafer box 1 is provided with a wafer 2.
[0067] When the wafer loader performs wafer mapping operation, the wafer loader lifting part drives the wafer mapping part to the mapping start position, the insertion mechanism of the wafer mapping part extends into the wafer box, and the wafer loader lifting part drives the wafer mapping part to run vertically to the mapping end position. The through-beam photoelectric sensor of the wafer loader mapping part is blocked by the wafer, and there will be a level change. The wafer loader data acquisition unit records the position data of the through-beam photoelectric sensor of the wafer loader mapping part when the level changes.
[0068] The wafer loader lifting and moving part drives the wafer loader mapping part to move vertically during the wafer loader mapping operation, and its built-in encoder can transmit the vertical position information of the mapping part to the wafer loader data acquisition unit in real time.
[0069] The wafer handling robot consists of a robot body and a hand fork. When the wafer handling robot data processing unit controls the wafer handling robot to pick up and place wafers, the wafer handling robot body drives the hand fork to extend into the wafer box to perform wafer picking and placing operations.
[0070] When the above-mentioned wafer loader performs the method of wafer handling, the embodiment of the present application first places the wafer in the first wafer box, installs the first wafer box on the above-mentioned wafer loader, and then determines the first handling parameters of the wafer loader for handling the wafer in the first wafer box through calibration. Then, when a new wafer box (such as a second wafer box) is installed on the wafer loader, the second handling parameters for handling the wafer in the second wafer box can be obtained by compensation based on the first handling parameters, and there is no need to use the wafer loader to perform a trial handling operation on the second wafer box, thereby improving work efficiency.
[0071] In an optional embodiment, when placing the first wafer box on the wafer loader, it is necessary to first determine the first handling parameters of the first wafer box on the wafer loader. In an actual business system, the wafer box generally includes multiple layers of storage units. For ease of description, the storage unit of the first wafer box is referred to as the first storage unit, and the storage unit of the second wafer box is referred to as the second storage unit in the embodiment of the present application. If the first wafer box includes ten layers, it is the first unit of the first layer, the first storage unit of the second layer, the first storage unit of the third layer...the first storage unit of the tenth layer.
[0072] When determining the first transport parameter, the embodiment of the present application provides different determination methods: a first method and a second method.
[0073] For the first method: controlling the lifting and lowering motion part to move the mapping part to a starting position of a first storage unit of a first layer in the first wafer box;
[0074] Controlling the mapping unit to detect the wafer in the first storage unit of the first layer to obtain first position information of the wafer in the first storage unit of the first layer;
[0075] When controlling the transport robot to transport the wafers in the first storage unit of the first layer, the movement parameters of the transport robot are used as the first transport parameters.
[0076] When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes:
[0077] Controlling the lifting and lowering motion part to move the mapping part to a starting position of a second storage unit of each layer in the second wafer box;
[0078] Controlling the mapping unit to detect the wafers in the second storage units of each layer to obtain second position information of the wafers in the second storage units of each layer;
[0079] Based on the difference between the second position information of the wafer in each layer of the second storage unit and the first position information of the first layer of the first storage unit, the first transport parameter is compensated to obtain the second transport parameter of each layer of the second storage unit.
[0080] For the second method: controlling the lifting and lowering motion part to move the mapping part to the starting position of the first storage unit of each layer in the first wafer box;
[0081] Controlling the mapping unit to detect the wafers in the first storage units of each layer to obtain first position information of the wafers in the first storage units of each layer;
[0082] When controlling the transport robot to transport the wafers of the first storage units of each layer, the movement parameters of the transport robot are used as the first transport parameters of the layer.
[0083] When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes:
[0084] Controlling the lifting and lowering motion part to move the mapping part to a starting position of a second storage unit of each layer in the second wafer box;
[0085] Controlling the mapping unit to detect the wafers in the second storage units of each layer to obtain second position information of the wafers in the second storage units of each layer;
[0086] Based on the difference between the second position information of the wafer in the second storage unit of each layer and the first position information of the first storage unit of the corresponding layer, the first handling parameter corresponding to each layer is compensated to obtain the second handling parameter of the second storage unit of each layer.
[0087] Specifically, the first method is: select the first storage unit of the first layer of the first wafer box as a reference, and compensate the second storage units of each layer of the second wafer box. That is, the first handling parameter of the first storage unit of the first layer is compensated according to the layer number difference to obtain the second handling parameter of the second storage unit of the first layer; the first handling parameter of the first storage unit of the first layer is compensated according to the layer number difference to obtain the second handling parameter of the second storage unit of the second layer, ... the first handling parameter of the first storage unit of the first layer is compensated according to the layer number difference to obtain the second handling parameter of the second storage unit of the Nth layer.
[0088] The second method: select the first storage unit of each layer in the first wafer box as a reference, and compensate the second storage unit of the corresponding layer of the second wafer box. That is, the first handling parameter of the first storage unit of the first layer is compensated to obtain the second handling parameter of the second storage unit of the first layer; the first handling parameter of the first storage unit of the second layer is compensated to obtain the second handling parameter of the second storage unit of the second layer, ... the first handling parameter of the first storage unit of the Nth layer is compensated to obtain the second handling parameter of the second storage unit of the Nth layer.
[0089] It should be noted that if the number of layers of the second wafer box is greater than the number of layers of the first wafer box, the first method can be used directly, or the first method and the second method can be combined. For example, the first wafer box has ten layers and the second wafer box has fifteen layers. When using the first method and the second method in combination, the first handling parameters of the ten layers of the first wafer box can be used to determine the second handling parameters of the ten layers of the second wafer box. Then select the first handling parameters of any number of layers in the first wafer box as a reference to compensate for the eleventh to fifteenth layers of the second wafer box, and obtain the second handling parameters of the eleventh to fifteenth layers of the second wafer box.
[0090] When a wafer loader is used to transport the wafer, a process of picking up and a process of placing are included. Therefore, the first transport parameter in the embodiment of the present application includes a first removal parameter and a first placement parameter. The second transport parameter also includes a second removal parameter and a second placement parameter. During specific compensation, the first removal parameter is compensated according to the second position data to obtain the second removal parameter; and the first placement parameter is compensated according to the second position data to obtain the second placement parameter.
[0091] In an optional embodiment, the wafer handling robot and the wafer loader mapping unit are calibrated: the wafer should be correctly placed on the first layer of the first wafer box, the wafer loader lifting and moving unit drives the wafer loader mapping unit to perform mapping operations, the wafer loader mapping unit scans the wafers in the first wafer box, and the wafer loader data acquisition unit records the wafer position of the first layer of the first wafer box used for calibration, recorded as LP_Pa1.
[0092] After the wafer loader mapping is completed, the first wafer box and wafer used for calibration are kept unchanged. The wafer handling robot data processing unit controls the wafer handling robot to calibrate the position of the first layer of wafers in the wafer box. The wafer handling robot data processing unit records the wafer pick position of the wafer handling robot at this time, recorded as RB_Pick_Pa1, and records the wafer put position of the wafer handling robot at this time, recorded as RB_Put_Pa1.
[0093] After the above actions, the position calibration of the wafer handling robot and the wafer loader is completed.
[0094] Wafer handling robot position compensation process: When any other type of second wafer box (third wafer box, fourth wafer box, etc.) is put into use, the vertical motion part of the wafer loader drives the wafer loader mapping part to perform mapping action. If the wafer in the second wafer box is abnormal, the abnormal data will be transmitted. If there is no abnormality, the wafer loader data processing unit records the wafer position in the second wafer box (for example, the 25th layer), recorded as LP_Pb (1) ~ LP_Pb (25), and the wafer loader data processing unit transmits the recorded wafer position to the wafer handling robot data processing unit.
[0095] The wafer handling robot data processing unit calculates the wafer picking and placing compensation value of the wafer handling robot: LP_Pb(n)-LP_Pa(1), where n is the layer number of the second wafer box.
[0096] The wafer handling robot data processing unit determines that the compensation value is within a reasonable range: Specmin≤LP_Pb(n)-LP_Pa(1)≤Specmax, where Specmin and Specmax are determined by the industry standard of the wafer box.
[0097] The position of the robot taking the wafer at the nth layer after compensation is: RB_Pick_Pa1+LP_Pb(n)-LP_Pa(1), where n is the layer number of the second wafer box.
[0098] The position where the robot puts the wafer on the nth layer after compensation is: RB_Put_Pa1+LP_Pb(n)-LP_Pa(1), where n is the layer number of the second wafer box.
[0099] The wafer handling robot data processing unit controls the robot to pick up and place the wafer according to the calculated compensation value.
[0100] Figure 5 A schematic structural diagram of a wafer handling device provided in an embodiment of the present application is shown, which acts on a wafer handling system, wherein the wafer handling system includes a wafer loader and a wafer handling manipulator, wherein a first wafer box is provided in the wafer loader, and a wafer is provided in the first wafer box; the device includes:
[0101] A first determining module, configured to determine a first handling parameter of the wafer handling robot according to first position data of the wafer in the first wafer box;
[0102] a second determining module, configured to determine, when the wafer is set in a second wafer box, a second handling parameter of the wafer handling robot according to second position data of the wafer in the second wafer box and the first handling parameter;
[0103] A control module is used to control the wafer handling robot to handle the wafers in the second wafer box based on the second handling parameter.
[0104] The wafer loader comprises: a mapping part and a lifting and moving part;
[0105] Determining a first handling parameter of the wafer handling robot according to the first position data of the wafer in the first wafer box includes:
[0106] Controlling the lifting and lowering motion part to move the mapping part to a starting position of a first storage unit of a first layer in the first wafer box;
[0107] Controlling the mapping unit to detect the wafer in the first storage unit of the first layer to obtain first position information of the wafer in the first storage unit of the first layer;
[0108] When controlling the transport robot to transport the wafers in the first storage unit of the first layer, the movement parameters of the transport robot are used as the first transport parameters.
[0109] When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes:
[0110] Controlling the lifting and lowering motion part to move the mapping part to a starting position of a second storage unit of each layer in the second wafer box;
[0111] Controlling the mapping unit to detect the wafers in the second storage units of each layer to obtain second position information of the wafers in the second storage units of each layer;
[0112] Based on the difference between the second position information of the wafer in each layer of the second storage unit and the first position information of the first layer of the first storage unit, the first transport parameter is compensated to obtain the second transport parameter of each layer of the second storage unit.
[0113] The wafer loader comprises: a mapping part and a lifting and moving part;
[0114] Determining a first handling parameter of the wafer handling robot according to the first position data of the wafer in the first wafer box includes:
[0115] Controlling the lifting and lowering motion part to move the mapping part to a starting position of a first storage unit of each layer in the first wafer box;
[0116] Controlling the mapping unit to detect the wafers in the first storage units of each layer to obtain first position information of the wafers in the first storage units of each layer;
[0117] When controlling the transport robot to transport the wafers of the first storage units of each layer, the movement parameters of the transport robot are used as the first transport parameters of the layer.
[0118] When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes:
[0119] Controlling the lifting and lowering motion part to move the mapping part to a starting position of a second storage unit of each layer in the second wafer box;
[0120] Controlling the mapping unit to detect the wafers in the second storage units of each layer to obtain second position information of the wafers in the second storage units of each layer;
[0121] Based on the difference between the second position information of the wafer in the second storage unit of each layer and the first position information of the first storage unit of the corresponding layer, the first handling parameter corresponding to each layer is compensated to obtain the second handling parameter of the second storage unit of each layer.
[0122] The first handling parameters include: a first taking-out parameter and a first placing parameter;
[0123] When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes:
[0124] When the wafer is set in a second wafer box, compensating the first taking-out parameter according to the second position data to obtain a second taking-out parameter;
[0125] The first placement parameter is compensated according to the second position data to obtain a second placement parameter.
[0126] Alarm module: Generates alarm information when the following conditions are met:
[0127] Detecting the wafers in the second wafer box, and finding that the wafers are abnormal;
[0128] Alternatively, the compensation parameter is not within a preset range; wherein the compensation parameter is determined based on the second position data and the first position data.
[0129] like Figure 6As shown, an embodiment of the present application provides an electronic device for executing the wafer handling method in the present application, the device includes a memory, a processor, a bus, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the wafer handling method when executing the computer program.
[0130] Specifically, the above-mentioned memory and processor may be general-purpose memory and processor, which are not specifically limited here. When the processor runs the computer program stored in the memory, the above-mentioned wafer handling method can be executed.
[0131] Corresponding to the wafer transport method in the present application, an embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the above-mentioned wafer transport method are executed.
[0132] Specifically, the storage medium can be a general storage medium, such as a mobile disk, a hard disk, etc. When the computer program on the storage medium is run, the above-mentioned wafer transport method can be executed.
[0133] In the embodiments provided in the present application, it should be understood that the disclosed systems and methods can be implemented in other ways. The system embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, indirect coupling or communication connection of systems or units, which can be electrical, mechanical or other forms.
[0134] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, and may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0135] In addition, each functional unit in the embodiments provided in the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
[0136] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.
[0137] It should be noted that similar numbers and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and are not to be understood as indicating or implying relative importance.
[0138] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-mentioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-mentioned embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application. They should all be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims
1. A method for wafer transport, characterized in that: Acting on a wafer handling system, the wafer handling system includes a wafer loader and a wafer handling robot, the wafer loader is provided with a first wafer box, and the first wafer box is provided with wafers; the method includes: Determining a first handling parameter of the wafer handling robot according to first position data of the wafer in the first wafer box; When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter; Based on the second transport parameter, the wafer transport robot is controlled to transport the wafers in the second wafer box.
2. The method according to claim 1, characterized in that: The wafer loader comprises: a mapping part and a lifting and moving part; Determining a first handling parameter of the wafer handling robot according to the first position data of the wafer in the first wafer box includes: Controlling the lifting and lowering motion part to move the mapping part to a starting position of a first storage unit of a first layer in the first wafer box; Controlling the mapping unit to detect the wafer in the first storage unit of the first layer to obtain first position information of the wafer in the first storage unit of the first layer; When controlling the transport robot to transport the wafers in the first storage unit of the first layer, the movement parameters of the transport robot are used as the first transport parameters.
3. The method according to claim 2, characterized in that When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes: Controlling the lifting and lowering motion part to move the mapping part to a starting position of a second storage unit of each layer in the second wafer box; Controlling the mapping unit to detect the wafers in the second storage units of each layer to obtain second position information of the wafers in the second storage units of each layer; Based on the difference between the second position information of the wafer in each layer of the second storage unit and the first position information of the first layer of the first storage unit, the first transport parameter is compensated to obtain the second transport parameter of each layer of the second storage unit.
4. The method according to claim 1, characterized in that: The wafer loader comprises: a mapping part and a lifting and moving part; Determining a first handling parameter of the wafer handling robot according to the first position data of the wafer in the first wafer box includes: Controlling the lifting and lowering motion part to move the mapping part to a starting position of a first storage unit of each layer in the first wafer box; Controlling the mapping unit to detect the wafers in the first storage units of each layer to obtain first position information of the wafers in the first storage units of each layer; When controlling the transport robot to transport the wafers of the first storage units of each layer, the movement parameters of the transport robot are used as the first transport parameters of the layer.
5. The method according to claim 4, characterized in that When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes: Controlling the lifting and lowering motion part to move the mapping part to a starting position of a second storage unit of each layer in the second wafer box; Controlling the mapping unit to detect the wafers in the second storage units of each layer to obtain second position information of the wafers in the second storage units of each layer; Based on the difference between the second position information of the wafer in the second storage unit of each layer and the first position information of the first storage unit of the corresponding layer, the first handling parameter corresponding to each layer is compensated to obtain the second handling parameter of the second storage unit of each layer.
6. The method according to claim 1, characterized in that The first handling parameters include: a first taking-out parameter and a first placing parameter; When the wafer is set in the second wafer box, determining the second handling parameter of the wafer handling robot according to the second position data of the wafer in the second wafer box and the first handling parameter includes: When the wafer is set in a second wafer box, compensating the first taking-out parameter according to the second position data to obtain a second taking-out parameter; The first placement parameter is compensated according to the second position data to obtain a second placement parameter.
7. The method according to claim 1, characterized in that The method further comprises: When the following conditions are met, an alarm message is generated: Detecting the wafers in the second wafer box, and finding that the wafers are abnormal; Alternatively, the compensation parameter is not within a preset range; wherein the compensation parameter is determined based on the second position data and the first position data.
8. A wafer transport device, characterized in that: Acting on a wafer handling system, the wafer handling system includes a wafer loader and a wafer handling robot, the wafer loader is provided with a first wafer box, and the first wafer box is provided with wafers; the device includes: A first determining module, configured to determine a first handling parameter of the wafer handling robot according to first position data of the wafer in the first wafer box; a second determining module, configured to determine, when the wafer is set in a second wafer box, a second handling parameter of the wafer handling robot according to second position data of the wafer in the second wafer box and the first handling parameter; A control module is used to control the wafer handling robot to handle the wafers in the second wafer box based on the second handling parameter.
9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate via the bus, and when the machine-readable instructions are executed by the processor, the steps of the wafer handling method as described in any one of claims 1 to 7 are performed.
10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the wafer handling method as described in any one of claims 1 to 7 are executed.