Semiconductor edge searching positioning device

Abstract

The invention discloses a semiconductor edge searching and positioning device, relates to the technical field of semiconductors, and solves the technical problems that the existing semiconductor edge searching and positioning device generally performs edge searching and positioning on a single semiconductor at a time and the working steps are tedious when more semiconductors are processed. According to the photoelectric sensor, a plurality of driving gears are arranged, a transfer wheel, a driving block and a fixing table are arranged at the positions, corresponding to the driving gears, in the workbench, rotation of a driving column is selectively transmitted to the surface of the fixing table through sliding of the driving block, then the fixing table drives a wafer to rotate, and selective rotation and sliding of the wafers at different positions are achieved. The photoelectric sensor and the Notch port or the Flat port on the surface of the wafer are enabled to be located on the same vertical line, after the photoelectric sensor positions a single wafer, the next wafer is positioned through the Notch port or the Flat port, a workbench can achieve edge searching and positioning of a plurality of wafers at a time, the wafers can be carried to the inside of the device at a time, and the working frequency is reduced.

Description

Technical Field

[0001] The invention belongs to the field of semiconductors, relates to a semiconductor edge-finding technology, and in particular to a semiconductor edge-finding positioning device. Background Art

[0002] Semiconductor edge positioning refers to the precise edge identification and positioning of wafers through specific equipment and technical means during the semiconductor manufacturing process.

[0003] Existing semiconductor edge-finding and positioning devices generally achieve edge recognition and positioning based on mechanical positioning methods, optical positioning methods, and image recognition positioning methods. Among them, the more common ones are sensors and automatic control devices based on optical positioning methods. Through photoelectric sensors or laser sensors combined with corresponding signal processing technologies and algorithms, the positioning marks on the semiconductor surface are controlled to move to the same position.

[0004] However, existing sensor-type semiconductor edge-finding and positioning devices generally only perform edge-finding and positioning on a single semiconductor. Therefore, when processing semiconductors of the same size, the semiconductors need to be moved multiple times, and continuous attention is required during the edge-finding and positioning process, which consumes a lot of energy and physical strength. Moreover, when processing a single batch of semiconductors, the individual processing method makes the overall processing process longer and the work steps cumbersome.

[0005] To this end, the present invention proposes a semiconductor edge finding and positioning device. Summary of the invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a semiconductor edge finding and positioning device, which solves the problem that the existing semiconductor edge finding and positioning device generally only performs edge finding and positioning on a single semiconductor at a time, and the working steps are cumbersome when processing more semiconductors.

[0007] To achieve the above object, according to an embodiment of the first aspect of the present invention, a semiconductor edge finding and positioning device is provided, comprising a workbench, wherein a positioning mechanism is arranged inside the workbench, and the positioning mechanism comprises:

[0008] A driving column, the driving column is rotatably connected to the inside of the workbench, and a plurality of driving gears are fixedly connected to the surface of the driving column;

[0009] A plurality of rotating wheels and a plurality of fixed platforms, wherein the rotating wheels and the fixed platforms are both rotatably connected to the inside of the workbench, two rotating wheels located on the same horizontal plane form a group, a transfer belt is connected between the rotating wheels in the same group, and one side of the rotating wheels is fixedly connected to the fixed platform;

[0010] A plurality of driving blocks, each of which is slidably connected to the rotating wheel, and each of which has a driving tooth fixedly connected to its surface, and each of which is adapted to the driving gear;

[0011] The photoelectric sensor is slidably arranged on the surface of the workbench, a connecting block is fixedly connected to the surface of the photoelectric sensor, an operating rod is rotatably connected inside the workbench, and the operating rod is threadedly connected to the connecting block.

[0012] Optionally, a motor is fixedly connected inside the workbench, and one end of the output shaft on the surface of the motor is fixedly connected to the driving column.

[0013] Optionally, a plurality of cylinders are fixedly connected inside the workbench, and piston rods inside the cylinders are rotatably connected to the driving blocks.

[0014] Optionally, one end of the piston rod inside the cylinder is fixedly connected to two rotating rings, and two rotating grooves are provided on the surface of the driving block, and the rotating rings are adapted to the rotating grooves.

[0015] Optionally, adjacent driving blocks are slidably connected with transfer blocks inside, a side of the transfer blocks away from the driving column contacts the surface of the rotating ring, and connecting springs are fixedly connected between adjacent transfer blocks.

[0016] Optionally, a contact block is slidably connected to one side of the fixing table close to the wafer, and a sliding spring is fixedly arranged between the contact block and the fixing table.

[0017] Optionally, an operating column is rotatably connected to a side of the contact block close to the wafer, and a limiting component is provided between the operating column and the contact block.

[0018] Optionally, a plurality of expansion blocks are slidably connected inside the operating column, and the plurality of expansion blocks are arranged in a circular array on the surface of the operating column. A movable column is fixedly connected to the surface of the expansion block, and an oblique groove is provided on the surface of the operating column, and the movable column is adapted to the oblique groove. A horizontal groove is provided on the surface of the contact block, and the expansion block is adapted to the horizontal groove.

[0019] Optionally, the rotation between the operating rod and the workbench is limited by a limit assembly, the limit assembly includes a limit ring slidably set on the surface of the operating rod, a limit spring is fixedly connected between the limit ring and the operating rod, an elastic ring is fixedly connected to the surface of the workbench, and the limit ring and the elastic ring are adapted to each other.

[0020] Optionally, a sliding shaft is fixedly connected to the inside of the limiting ring, a sliding groove is opened on the surface of the operating rod, and the sliding shaft is adapted to the sliding groove; the cross-section of the operating rod is circular, and the diameter of the side of the operating rod away from the limiting ring is larger than the diameter of the side close to the limiting ring.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows: through the multiple driving gears on the surface of the driving column, and the rotating wheel, the driving block and the fixed table are arranged corresponding to the driving gear positions inside the workbench, and then the rotation of the driving column is selectively transmitted to the surface of the fixed table through the sliding of the driving block, and then the fixed table drives the wafer to rotate, so as to realize the selective rotation of wafers at different positions, and then through the sliding photoelectric sensor, the position of the photoelectric sensor can be located on the same vertical line as the Notch or Flat mouth position on the wafer surface, and then after the photoelectric sensor locates a single wafer, the Notch or Flat mouth position can be used to position the next wafer, so as to realize the positioning of multiple wafers, and then the workbench can realize edge finding and positioning of multiple wafers at a time, and can transport multiple wafers into the device at a time, thereby reducing the working frequency and concentrating the working steps. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural stereogram of the present invention;

[0023] Figure 2 is a three-dimensional structural cross-sectional view of the motor of the present invention;

[0024] Figure 3 For the present invention Figure 2 A magnified view of the local structure at point A in the middle;

[0025] Figure 4 For the present invention Figure 2 A magnified view of the local structure at B in the middle;

[0026] Figure 5 For the present invention Figure 2 A magnified view of the local structure at C in the middle;

[0027] Figure 6 A three-dimensional structural cross-sectional view of the photoelectric sensor of the present invention;

[0028] Figure 7 For the present invention Figure 6 A magnified view of the local structure at D in the middle;

[0029] Figure 8 For the present invention Figure 6 Enlarged view of the local structure at point E in the middle.

[0030] In the figure: 1. Workbench;

[0031] 21. driving column; 22. driving gear; 23. transfer wheel; 24. fixing platform; 25. transfer belt; 26. driving block; 27. driving gear; 28. photoelectric sensor; 29. ​​operating lever;

[0032] 31. Motor; 32. Cylinder; 33. Rotating ring; 34. Rotating groove; 35. Transfer block; 36. Connecting spring;

[0033] 41. operating column; 42. unfolding block; 43. moving column; 44. oblique slot; 45. horizontal slot;

[0034] 51. Limiting ring; 52. Limiting spring; 53. Elastic ring; 54. Sliding shaft; 55. Sliding groove. DETAILED DESCRIPTION

[0035] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] like Figure 1-8 As shown, a semiconductor edge finding and positioning device includes a workbench 1, wherein a positioning mechanism is arranged inside the workbench 1, and the positioning mechanism includes:

[0037] A driving column 21, wherein the driving column 21 is rotatably connected to the inside of the workbench 1, and a plurality of driving gears 22 are fixedly connected to the surface of the driving column 21, and the plurality of driving gears 22 are arranged at intervals on the surface of the driving column 21;

[0038] A plurality of rotating wheels 23 and a plurality of fixed tables 24, wherein the rotating wheels 23 and the fixed tables 24 are both rotatably connected to the inside of the workbench 1, and the rotating wheels 23 and the fixed tables 24 are arranged at intervals inside the workbench 1, and the number of the rotating wheels 23 is the same as the number of the driving gears 22, and the number of the fixed tables 24 is twice the number of the driving gears 22, and the plurality of rotating wheels 23 are grouped into two, and the two rotating wheels 23 in the same group are located on the same horizontal plane, and one rotating wheel 23 in the same group is fixedly connected to the fixed table 24, and the fixed tables 24 are grouped into two, and the opposite surfaces of the fixed tables 24 in the same group are bonded to the wafer; a transfer belt 25 is transmission-connected between the two rotating wheels 23 in the same group;

[0039] A plurality of driving blocks 26, each of which is slidably connected to the surface of the rotating wheel 23, and each of which is fixedly connected to a driving tooth 27, and each of which is adapted to the driving gear 22; there is a gap between the rotating wheel 23 and the driving gear 22;

[0040] A photoelectric sensor 28, wherein the photoelectric sensor 28 is slidably disposed on the surface of the workbench 1, a connecting block is fixedly connected to the surface of the photoelectric sensor 28, an operating rod 29 is rotatably connected inside the workbench 1, and the operating rod 29 is threadedly connected to the connecting block;

[0041] It should be noted that the photoelectric sensor 28 is electrically connected to an external power supply. The photoelectric sensor 28 converts the optical signal into an electrical signal by using the principle of photoelectric conversion. A Notch or Flat port is opened on the surface of the wafer, and the distance between the edge of the wafer and the center of the wafer is shortened. During the rotation of the wafer, the photoelectric sensor 28 is set at the edge of the wafer, and then rotated to the Notch or Flat port position, the data changes, and the Notch or Flat port position on the wafer is located. Then, the Notch or Flat port position can be used to perform edge-finding and positioning operations on a wafer that is farther away.

[0042] In actual application, the semiconductor edge-finding and positioning device has multiple driving gears 22 on the surface of the driving column 21, and a rotating wheel 23, a driving block 26 and a fixed table 24 are arranged inside the workbench 1 at positions corresponding to the driving gears 22, so that the rotation of the driving column 21 is selectively transmitted to the surface of the fixed table 24 through the sliding of the driving block 26, and then the fixed table 24 drives the wafer to rotate, so as to achieve selective rotation of wafers at different positions, and then through the sliding photoelectric sensor 28, the position of the photoelectric sensor 28 can be located on the same vertical line as the Notch or Flat position of the wafer surface, so that after the photoelectric sensor 28 locates a single wafer, the Notch or Flat position can locate the next wafer, so as to achieve positioning of multiple wafers, and then the workbench 1 can realize edge-finding and positioning of multiple wafers at a time, and can transport multiple wafers into the device at a time, so as to reduce the working frequency and concentrate the working steps;

[0043] In some specific embodiments, a motor 31 is fixedly connected inside the workbench 1, and the motor 31 is electrically connected to an external power supply. A coupling (not shown in the figure) is fixedly connected to one end of the output shaft on the surface of the motor 31, and the connecting shaft (not shown in the figure) is fixedly connected to the driving column 21; the driving column 21 is driven to rotate by the motor 31, so that the rotation speed and rotation direction of the motor 31 can be conveniently controlled. At the same time, the motor 31 can be connected to other control systems to rotate it to a specified position after positioning at the Notch or Flat port of the wafer;

[0044] In some specific implementation schemes, a plurality of cylinders 32 are fixedly connected inside the workbench 1, and the piston rods inside the cylinders 32 are all rotatably connected to the driving blocks 26; one end of the piston rod inside the cylinder 32 is fixedly connected to two rotating rings 33, and two rotating grooves 34 are provided on the surface of the driving block 26, and the rotating rings 33 are adapted to the rotating grooves 34; the rotating rings 33 on the surface of the piston rod inside the cylinder 32 are used to realize the rotatable connection with the driving block 26, so that the cylinders 32 at different positions can be operated to work, so that the driving teeth 27 on the surface of the driving blocks 26 at different positions contact the driving gear 22, so as to realize the rotation of the rotating wheel 23 and the fixed table 24 at this position, and then drive the wafers at different positions to rotate;

[0045] In a further implementation scheme, a transfer block 35 is slidably connected inside the adjacent driving blocks 26, and the side of the transfer block 35 away from the driving column 21 is in contact with the surface of the rotating ring 33, and a connecting spring 36 is fixedly connected between the adjacent transfer blocks 35; a sliding transfer block 35 is arranged inside the adjacent driving blocks 26, and a connecting spring 36 is arranged between the two transfer blocks 35, and the connecting spring 36 can cause the driving block 26 and the transfer block 35 to automatically restore to their original positions, and one side of the transfer block 35 is in contact with the surface of the rotating ring 33, so that the sliding of the rotating ring 33 can push the transfer block 35 and the driving block 26 to move synchronously, and after the piston rod inside the cylinder 32 is reset, both the driving block 26 and the connecting block can be reset;

[0046] In some specific implementation schemes, a contact block is slidably connected to one side of the fixed table 24 close to the wafer, and a sliding spring is fixedly arranged between the contact block and the fixed table 24; a sliding contact block is arranged on the side of the fixed table 24 close to the wafer, and the surface of the contact block can contact the surface of the wafer, thereby increasing the distance between the fixed tables 24, and the rotation synchronization of the two is achieved through the contact between the contact block and the wafer, thereby allowing wafers of different thicknesses to be placed on the surface of the workbench 1;

[0047] In a further implementation scheme, an operating column 41 is rotatably connected to one side of the contact block close to the wafer, a limiting component is arranged between the operating column 41 and the contact block, a plurality of expansion blocks 42 are slidably connected inside the operating column 41, and the plurality of expansion blocks 42 are arranged in a ring array on the surface of the operating column 41, a moving column 43 is fixedly connected to the surface of the expansion block 42, an oblique groove 44 is provided on the surface of the operating column 41, the moving column 43 is adapted to the oblique groove 44, a horizontal groove 45 is provided on the surface of the contact block, and the expansion block 42 is adapted to the horizontal groove 45; an expansion block 42 that can be extended outward is arranged on the surface of the contact block, thereby further expanding the contact area between the contact block and the wafer, and the sliding of the expansion block 42 is realized by the rotation of the operating column 41, the position of all the expansion blocks 42 can be conveniently operated, the contact area of ​​the wafer can be quickly increased, and the stability of the wafer during rotation is ensured;

[0048] In some specific embodiments, the operating rod 29 and the workbench 1 are rotationally restricted by a limiting assembly, the limiting assembly comprising a limiting ring 51 slidably arranged on the surface of the operating rod 29, a limiting spring 52 fixedly connected between the limiting ring 51 and the operating rod 29, the cross section of the limiting ring 51 is a right triangle, an elastic ring 53 is fixedly connected to the surface of the workbench 1, the cross section of the elastic ring 53 is a right triangle, and the limiting ring 51 and the elastic ring 53 are adapted;

[0049] In a further implementation scheme, a sliding shaft 54 ​​is fixedly connected inside the limiting ring 51, and a sliding groove 55 is opened on the surface of the operating rod 29, and the sliding shaft 54 ​​is adapted to the sliding groove 55; the cross section of the operating rod 29 is circular, and the diameter of the side of the operating rod 29 away from the limiting ring 51 is larger than the diameter of the side close to the limiting ring 51; a sliding limiting ring 51 is provided on the surface of the operating rod 29, and a limiting spring 52 is provided between the operating rod 29 and the limiting ring 51, and the position of the limiting ring 51 can be quickly reset by the limiting spring 52, and the limiting ring 51 and the elastic ring 53 are fitted after sliding, which can increase the friction between the two, limit the sliding of the limiting ring 51, and then limit the rotation of the operating rod 29;

[0050] The working principle of the present invention is as follows: the wafer is placed between the contact blocks, the distance between the contact blocks increases, and the contact blocks move toward the wafer under the action of the sliding spring, so that the two contact blocks limit the position of the wafer, and then the limiting ring 51 is slid away from the workbench 1, so that the limiting ring 51 is separated from the elastic ring 53, and the operating rod 29 is rotated. The rotation of the operating rod 29 drives the connecting block to slide, and drives the photoelectric sensor 28 to slide to the edge of the wafer, and then the limiting ring 51 is released. The limiting ring 51 is reset under the action of the limiting spring 52 to limit the rotation of the operating rod 29; then the electric The motor 31 drives the driving column 21 to rotate; at the same time, the cylinder 32 closest to the photoelectric sensor 28 is started, causing the driving block 26 to slide toward the driving column 21, thereby driving the tooth 27 to engage with the driving gear 22. The rotation of the driving column 21 drives the transfer column to rotate, and the fixed table 24 can be driven to rotate through the transfer belt 25, thereby rotating the wafer at that position, and the photoelectric sensor 28 transmits data. When the data is different, the Notch or Flat position of the wafer is located, and then the cylinder 32 at that position is reset, and the cylinder 32 at a farther position is started.

[0051] The above embodiments are only used to illustrate the technical method of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the present invention.

Claims

1. A semiconductor edge finding and positioning device, comprising a workbench (1), characterized in that: The workbench (1) is provided with a positioning mechanism inside, and the positioning mechanism comprises: A driving column (21), the driving column (21) is rotatably connected to the inside of the workbench (1), and a plurality of driving gears (22) are fixedly connected to the surface of the driving column (21); A plurality of rotating wheels (23) and a plurality of fixed platforms (24), wherein the rotating wheels (23) and the fixed platforms (24) are both rotatably connected to the inside of the workbench (1), two rotating wheels (23) located on the same horizontal plane form a group, a transfer belt (25) is transmission-connected between the rotating wheels (23) in the same group, and one side of the rotating wheels (23) is fixedly connected to the fixed platform (24); A plurality of driving blocks (26), each of which is slidably connected to the rotating wheel (23), and each of which is fixedly connected to a driving tooth (27) on its surface, and each of which is adapted to fit the driving gear (22); A photoelectric sensor (28) is slidably arranged on the surface of a workbench (1); a connecting block is fixedly connected to the surface of the photoelectric sensor (28); an operating rod (29) is rotatably connected inside the workbench (1); and the operating rod (29) is threadedly connected to the connecting block.

2. A semiconductor edge finding and positioning device according to claim 1, characterized in that: A motor (31) is fixedly connected inside the workbench (1), and one end of an output shaft on the surface of the motor (31) is fixedly connected to a driving column (21).

3. A semiconductor edge finding and positioning device according to claim 1, characterized in that: A plurality of cylinders (32) are fixedly connected inside the workbench (1), and piston rods inside the cylinders (32) are rotatably connected to the driving blocks (26).

4. A semiconductor edge finding and positioning device according to claim 3, characterized in that: One end of the piston rod inside the cylinder (32) is fixedly connected to two rotating rings (33), and the surface of the driving block (26) is provided with two rotating grooves (34), and the rotating ring (33) is adapted to the rotating grooves (34).

5. A semiconductor edge finding and positioning device according to claim 4, characterized in that: A transfer block (35) is slidably connected inside the adjacent driving blocks (26), and a side of the transfer block (35) away from the driving column (21) contacts the surface of the rotating ring (33), and a connecting spring (36) is fixedly connected between the adjacent transfer blocks (35).

6. A semiconductor edge finding and positioning device according to claim 1, characterized in that: A contact block is slidably connected to one side of the fixed platform (24) close to the wafer, and a sliding spring is fixedly arranged between the contact block and the fixed platform (24).

7. A semiconductor edge finding and positioning device according to claim 6, characterized in that: An operating column (41) is rotatably connected to a side of the contact block close to the wafer, and a limiting component is arranged between the operating column (41) and the contact block.

8. A semiconductor edge finding and positioning device according to claim 7, characterized in that: A plurality of expansion blocks (42) are slidably connected inside the operating column (41), and the expansion blocks (42) are arranged in a ring array on the surface of the operating column (41). A moving column (43) is fixedly connected to the surface of the expansion block (42). An oblique groove (44) is provided on the surface of the operating column (41), and the moving column (43) is adapted to the oblique groove (44). A horizontal groove (45) is provided on the surface of the contact block, and the expansion block (42) is adapted to the horizontal groove (45).

9. A semiconductor edge finding and positioning device according to claim 1, characterized in that: The rotation of the operating rod (29) and the workbench (1) is limited by a limit assembly, the limit assembly comprising a limit ring (51) slidably arranged on the surface of the operating rod (29), a limit spring (52) fixedly connected between the limit ring (51) and the operating rod (29), an elastic ring (53) fixedly connected to the surface of the workbench (1), and the limit ring (51) and the elastic ring (53) are adapted to each other.

10. A semiconductor edge finding and positioning device according to claim 9, characterized in that: A sliding shaft (54) is fixedly connected inside the limiting ring (51), and a sliding groove (55) is provided on the surface of the operating rod (29), and the sliding shaft (54) is adapted to the sliding groove (55); the cross section of the operating rod (29) is circular, and the diameter of the side of the operating rod (29) away from the limiting ring (51) is larger than the diameter of the side close to the limiting ring (51).

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