Two-dimensional integrated semiconductor laser array bionic water-cooling heat sink

Abstract

The invention discloses a bionic water cooling heat sink for a two-dimensional integrated semiconductor laser array. The bionic water cooling heat sink comprises a water cooling cavity, a bionic topology diversion trench and a water cooling table, wherein the water cooling cavity is composed of a water inlet, a water outlet, a water cooling column, a cavity inner chamber, a lower threaded hole, a lower sealing groove and a cavity outer wall. The top end of the water cooling column comprises a plurality of circles of water outlet holes, the water outlet holes have the same radius, the distances between the tops of the water outlet holes and the table plate are equal, and meanwhile the distances between the water outlet holes in the same circle and the center of the water cooling column are increased exponentially along with increase of the circle number of the corresponding water outlet holes from the center of the water cooling column to the outer side. The bionic topology diversion trench comprises a plurality of circles of grooves, each groove has the same width, and the distance from the center of each groove to the center of the bionic topology diversion trench is exponentially increased along with the increase of the circle number of the corresponding groove from the center of the bionic topology diversion trench to the outer side. According to the invention, effective heat dissipation and quick response of the two-dimensional integrated semiconductor laser array can be realized, and the optical performance is improved.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation of semiconductor optoelectronic devices, in particular to a bionic water-cooled heat sink for a two-dimensional integrated semiconductor laser array. Background Art

[0002] Semiconductor lasers have the advantages of high photoelectric conversion efficiency, fast modulation rate, high coherence, long life, and easy two-dimensional integration. They are now widely used in material processing, medical treatment, optical communication, sensing and other fields. In the above fields, a two-dimensional integrated array structure is usually used to effectively improve the output optical power of semiconductor lasers.

[0003] However, considering the self-heating effect caused by the dissipated power on each unit of the laser array and the thermal coupling effect caused by heat conduction between the units, the junction temperature of the semiconductor laser array will increase significantly. Further considering the impact of thermal photoelectric feedback on the performance of the semiconductor laser, the output optical power of the semiconductor laser array will decrease significantly, causing thermal reversal, thereby severely limiting the optical output capacity of the semiconductor laser array. In order to reduce the junction temperature of the semiconductor laser, a semiconductor cooling sheet is usually pasted to the bottom of the semiconductor laser as a heat sink to achieve the heat dissipation function. This method is based on the Peltier effect and uses the method of powering the semiconductor cooling sheet to achieve temperature difference cooling and heat dissipation, but its response time is too long and the heat dissipation capacity is limited, which is far from meeting the heat dissipation requirements of high-power semiconductor laser arrays for two-dimensional integration. In order to cope with the above problems, there is an urgent need for a two-dimensional integrated semiconductor laser array heat sink structure design with fast response speed and strong heat dissipation capacity. Summary of the invention

[0004] The invention discloses a two-dimensional integrated semiconductor laser array bionic water-cooled heat sink, which is characterized by comprising a water-cooling cavity (1), a bionic topological flow guide groove (2), a sealing ring (3), a water-cooling platform (4) and fixing screws (5);

[0005] The water-cooling chamber (1) comprises a water inlet (11), a water outlet (12), a water-cooling column (13), an inner chamber (14), a lower threaded hole (15), a lower sealing groove (16) and an outer wall (17) of the chamber, wherein the lower sealing groove (16) is connected to the water-cooling platform (4) via a sealing ring (3);

[0006] The water-cooling table (4) comprises an upper sealing groove (41), an upper threaded hole (42), a table plate (43) and a welding pad (44), wherein the upper sealing groove (41) is connected to the water-cooling chamber (1) via a sealing ring (3);

[0007] The fixing screw (5) passes through the upper threaded hole (42) and the lower threaded hole (15) in sequence from top to bottom to fix the water cooling platform (4) and the water cooling chamber (1); after the bottom of the two-dimensional integrated semiconductor laser array (6) is evenly coated with thermal conductive solder, it is fixed just above the solder pad (44).

[0008] The present invention discloses a two-dimensional integrated semiconductor laser array bionic water-cooled heat sink, characterized in that the water-cooling cavity (1), bionic topological flow guide groove (2), table (43) and fixing screw (5) are all made of copper; the sealing ring (3) is made of fluororubber; and the pad (44) is made of aluminum nitride.

[0009] A two-dimensional integrated semiconductor laser array bionic water-cooled heat sink according to the present invention is characterized in that the top of the water-cooling column (13) comprises a plurality of circles of water outlet holes (131), wherein the water outlet holes on each circle have the same diameter d, the distance between the top of each circle of water outlet holes and the platform (43) is equal, and the distance from the center of each water outlet hole to the center of the water-cooling column increases exponentially with the increase of the number of circles of water outlet holes corresponding to the water-cooling column from the center of the water-cooling column to the outside, and satisfies the following relationship:

[0010] r i =A+B×exp((i+C) / D)

[0011] where r i is the distance from the center of the i-th circle of water holes to the center of the water cooling column, in mm. A, B, C, and D are constants.

[0012] The present invention discloses a two-dimensional integrated semiconductor laser array bionic water-cooled heat sink, characterized in that when the two-dimensional integrated semiconductor laser array bionic water-cooled heat sink is in operation, deionized water will flow out of the water outlet (131) from the bottom to the top through the water inlet (11) and the water cooling column (13), and then flow into the bionic topological flow guide groove (2), contact the bottom of the water cooling platform (4) while regulating the lateral flow, and finally flow out of the two-dimensional integrated semiconductor laser array bionic water-cooled heat sink from the water outlet (12) through the cavity (14). The bionic topological flow guide groove comprises a plurality of grooves (21), each of which has the same width W, and the distance from the center of each groove to the center of the bionic topological flow guide groove increases exponentially with the increase of the number of grooves corresponding to the center of the bionic topological flow guide groove toward the outside, and satisfies the following relationship:

[0013] R j =M+N×exp(P×j)

[0014] Where R j is the distance from the center of the j-th groove to the center of the bionic topological guide groove, in mm, where M, N, and P are constants. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The objects and advantages of the present invention may be further understood from the following description taken in conjunction with the accompanying drawings. In these drawings:

[0016] Figure 1 A three-dimensional diagram of an embodiment of the present invention;

[0017] FIG. 2( a ) is a top view of the water outlet portion at the top of the water-cooling column in an embodiment of the present invention;

[0018] FIG2( b ) is a top view of the bionic topological flow guide groove portion in an embodiment of the present invention;

[0019] FIG3( a ) is a three-dimensional temperature distribution of the embodiment of the present invention during temperature control operation;

[0020] FIG3( b ) is a three-dimensional temperature distribution of an embodiment of the present invention when the temperature is not controlled;

[0021] FIG4( a ) is a flow velocity distribution diagram of deionized water in a bionic topological flow guide groove during temperature control operation according to an embodiment of the present invention;

[0022] FIG4( b ) is a cross-sectional view of the flow rate distribution of deionized water during temperature control operation according to an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The embodiment of the present invention takes the two-dimensional integrated semiconductor laser bionic water-cooled heat sink with a water outlet hole with a gradually varying spacing and a bionic topological flow guide groove structure as an example to specifically describe the content of the present invention. The field to which the present invention relates is not limited thereto.

[0024] Example:

[0025] The embodiment of the present invention discloses a two-dimensional integrated semiconductor laser bionic water-cooled heat sink, wherein Figure 1 It is a three-dimensional diagram of an embodiment of the present invention, comprising a water-cooling chamber (1), a bionic topological flow guide groove (2), a sealing ring (3), a water-cooling platform (4) and fixing screws (5).

[0026] The water cooling column (13) and the outer wall (17) of the water cooling chamber (1) are made of copper, wherein the height of the water cooling column is 26 mm, the wall thickness is 1 mm, and the diameter d of the water outlet hole (131) is 1 mm. The diameters of the water inlet (11) and the water outlet (12) are both 16 mm, and the diameters of the eight lower threaded holes (15) are all 2 mm. The water cooling chamber (1) is a cylinder with a total height of 26.5 mm, a bottom diameter of 68 mm, and an outer wall (17) of 5.5 mm thickness.

[0027] The bionic topological flow guide groove (2) is made of copper, has a diameter of 64 mm, a height of 1 mm, is 2 mm away from the inner wall of the water cooling chamber (1), and the width W of each groove (21) is 1 mm.

[0028] The sealing ring (3) is made of fluororubber, has a line width of 1 mm and an outer diameter of 59 mm.

[0029] The middle plate (43) of the water-cooling table (4) is made of copper, has a diameter of 67 mm and a thickness of 2 mm, the diameters of the eight upper threaded holes (42) are all 2 mm, and the material of the welding pad (44) is aluminum nitride.

[0030] The fixing screw (5) has a diameter of 2 mm and matches the lower threaded hole (15) and the upper threaded hole (42).

[0031] The semiconductor laser (6) is a two-dimensional integrated vertical cavity surface emitting laser (VCSEL) array having 10×10 units.

[0032] FIG2(a) is a top view of the water outlet hole portion at the top of the water cooling column in an embodiment of the present invention. The water outlet holes (131) on each circle have the same diameter d, and the distance between the top of each circle of water outlet holes and the table (43) is equal. At the same time, the distance from the center of each water outlet hole to the center of the water cooling column (13) increases exponentially with the increase of the number of water outlet holes from the center of the water cooling column to the outside, and satisfies the following relationship:

[0033] r i =-9.5+10.9×exp((i-1) / 6.95)

[0034] where r i It is the distance from the center of the i-th circle of water holes to the center of the water cooling column, in mm.

[0035] FIG2( b) is a top view of a spider web-type bionic topological guide groove according to an embodiment of the present invention, wherein the bionic topological guide groove (2) comprises a plurality of groove circles (21), wherein each groove has the same width W, and the distance from the center of each groove to the center of the bionic topological guide groove increases exponentially with the increase in the number of groove circles corresponding to the center of the bionic topological guide groove toward the outside, and satisfies the following relationship:

[0036] R j =1.11+8.15×exp(0.17×j)

[0037] Where R j It is the distance from the center of the j-th groove to the center of the bionic topological guide groove, in mm.

[0038] Figure 3(a) shows the three-dimensional temperature distribution of the embodiment of the present invention when the temperature control is working, where the VCSEL array working voltage is 2.5V and the working current is 1.2A. It can be seen that the peak junction temperature of the VCSEL array is 368.97K when the temperature control is working, and the corresponding output optical power reaches 1.68W.

[0039] FIG3( b ) is a three-dimensional temperature distribution when the temperature is not controlled in the embodiment of the present invention, where the operating voltage of the VCSEL array is 2.5 V and the operating current is 1.2 A. It can be seen that when the temperature control in the embodiment of the present invention is not used, the peak junction temperature of the VCSEL array is as high as 395.24 K, causing the output optical power to drop to 1.54 W, limiting the optical output capacity of the VCSEL array.

[0040] Figure 4 (a) and Figure 4 (b) are respectively the distribution of the flow rate of deionized water in the bionic topological flow guide groove during temperature control operation of the embodiment of the present invention and the cross-sectional view of the flow rate distribution of deionized water during temperature control operation of the embodiment of the present invention. It can be seen that the flow rate of deionized water gradually decreases from the center of the bionic topological flow guide groove (2) to the outside, and the flow rate around the water outlet (131) is the largest, which is 26.31m / s, and the cooling effect is most obvious. Analysis shows that the embodiment of the present invention controls the flow and heat exchange of deionized water by changing the spacing of the water outlet holes and adding a bionic topological flow guide groove with a gradually changing spacing, ensuring its fast response speed and strong heat dissipation capacity, thereby achieving effective heat dissipation and performance improvement of the two-dimensional integrated semiconductor laser array.

Claims

1. A two-dimensional integrated semiconductor laser array bionic water-cooled heat sink, characterized in that: It comprises a water cooling chamber (1), a bionic topological flow guide groove (2), a water cooling platform (4) and fixing screws (5); The water-cooling chamber (1) comprises a water inlet (11), a water outlet (12), a water-cooling column (13), an inner chamber (14), a lower threaded hole (15), a lower sealing groove (16) and an outer wall (17) of the chamber, wherein the lower sealing groove (16) is connected to the water-cooling platform (4) via a sealing ring (3); The water-cooling table (4) comprises an upper sealing groove (41), an upper threaded hole (42), a table plate (43) and a welding pad (44), wherein the upper sealing groove (41) is connected to the water-cooling chamber (1) via a sealing ring (3); The fixing screw (5) passes through the upper threaded hole (42) and the lower threaded hole (15) in sequence from top to bottom to fix the water cooling platform (4) and the water cooling chamber (1); after the bottom of the two-dimensional integrated semiconductor laser array (6) is evenly coated with thermal conductive solder, it is fixed just above the solder pad (44); The top of the water cooling column (13) comprises a plurality of circles of water outlet holes (131), wherein the water outlet holes on each circle have the same diameter d, and the distance between the top of each circle of water outlet holes and the table (43) is equal. Meanwhile, the distance from the center of each water outlet hole to the center of the water cooling column increases exponentially with the increase of the number of circles of water outlet holes corresponding to the water cooling column from the center of the water cooling column to the outside, and satisfies the following relationship: r i =A+B×exp((i+C) / D) where r i is the distance from the center of the i-th circle of water holes to the center of the water cooling column, and A, B, C, and D are constants.

2. The two-dimensional integrated semiconductor laser array bionic water-cooled heat sink according to claim 1, characterized in that: The water-cooling chamber (1), the bionic topological flow guide groove (2), the table (43) and the fixing screw (5) are all made of copper; the sealing ring (3) is made of fluororubber; and the pad (44) is made of aluminum nitride.

3. The two-dimensional integrated semiconductor laser array bionic water-cooled heat sink according to claim 1, characterized in that: When the two-dimensional integrated semiconductor laser array bionic water-cooled heat sink is working, deionized water will flow out from the water outlet (131) through the water inlet (11) and the water cooling column (13), then flow into the bionic topological guide groove (2), contact the bottom of the water cooling platform (4) while regulating the lateral flow, and finally flow out of the two-dimensional integrated semiconductor laser array bionic water-cooled heat sink from the water outlet (12) through the cavity (14); the bionic topological guide groove comprises a plurality of grooves (21), wherein each groove has the same width W, and the distance from the center of each groove to the center of the bionic topological guide groove increases exponentially with the increase of the number of grooves corresponding to the center of the bionic topological guide groove toward the outside, and satisfies the following relationship: R j =M+N×exp(P×j) Where R j is the distance from the center of the j-th groove to the center of the bionic topological guide groove, and M, N, and P are constants.

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