Camera modules and electronic equipment

Abstract

The present application relates to a camera module and electronic equipment. The camera module includes a circuit board, a photosensitive chip, a support member and an electronic component. The support member is connected between the circuit board and the photosensitive chip, and a receiving space is formed between the side of the photosensitive chip facing away from the photosensitive area and the circuit board. The electronic component is at least partially received in the receiving space. The support member includes an electrically connected first electrical connection part and a second electrical connection part. The first electrical connection part is electrically connected to the circuit board, and the second electrical connection part is electrically connected to the photosensitive chip. The camera module and electronic equipment of the present application are as follows. The support member can not only support the photosensitive chip, but also meet the need to electrically connect the electronic component to the circuit board. Therefore, the present application scheme can take into account the shooting performance of the camera module while achieving miniaturization.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to camera modules and electronic equipment. Background Art

[0002] As a module that realizes the shooting function of electronic devices such as mobile phones, tablets, and smart watches, the imaging performance of the camera module directly affects the shooting experience of the electronic devices.

[0003] In the related art, in addition to the photosensitive chip, other electronic components need to be arranged around the corresponding photosensitive chip on the circuit board of the camera module, which is not conducive to the miniaturization of the camera module. Removing the electronic components will lead to a decrease in the shooting performance of the camera module. Summary of the invention

[0004] The present application provides a camera module and an electronic device to solve the technical problem of how to achieve miniaturization while taking into account the shooting performance of the camera module.

[0005] On the one hand, the present application provides a camera module, comprising:

[0006] Circuit boards;

[0007] A photosensitive chip having a photosensitive area and a non-photosensitive area around the photosensitive area;

[0008] A support member connected between the circuit board and the photosensitive chip, so that a receiving space is formed between the side of the photosensitive chip facing away from the photosensitive area and the circuit board, the support member includes a first electrical connection portion and a second electrical connection portion which are electrically connected, the first electrical connection portion is electrically connected to the circuit board, and the second electrical connection portion is electrically connected to the photosensitive chip;

[0009] The electronic component is at least partially contained in the containing space, and the electronic component is electrically connected to the circuit board.

[0010] In one of the embodiments, the orthographic projection of the support member on the plane where the photosensitive chip is located is located in the non-photosensitive area.

[0011] In one embodiment, the support member includes a plurality of metal conductors arranged at intervals, one end of the metal conductor is provided with the first electrical connection portion, and the other end of the metal conductor is provided with the second electrical connection portion.

[0012] In one embodiment, the metal conductor comprises a copper alloy wire.

[0013] In one of the embodiments, the support member further includes a plastic package, the plastic package is coated on the metal conductor, and the photosensitive chip and the circuit board are both in contact with the plastic package.

[0014] In one embodiment, the over-molded part includes a first over-molded part and a second over-molded part, and the first over-molded part and the second over-molded part are spaced apart from each other or connected as a whole through injection molding.

[0015] In one embodiment, a portion of the plurality of metal conductors is disposed in the first overmolding component, and the other portion is disposed in the second overmolding component.

[0016] In one embodiment, the support member includes a frame and a metal insert, the first electrical connection portion is located on the end surface of the frame facing the circuit board, the second electrical connection portion is located on the end surface of the frame facing the photosensitive chip, at least a portion of the metal insert is embedded in the frame, and the metal insert is electrically connected to the first electrical connection portion and the second electrical connection portion.

[0017] In one embodiment, a plurality of first solder pads are provided on a side of the circuit board facing the photosensitive chip, and the plurality of first solder pads are correspondingly welded to the plurality of first electrical connection parts; a plurality of second solder pads are provided on a side of the photosensitive chip facing the circuit board, and the plurality of second solder pads are correspondingly welded to the plurality of second electrical connection parts.

[0018] In one embodiment, the frame includes a plurality of frame portions, and the frame portion where the first electrical connection portion is disposed is different from the frame portion where the second electrical connection portion is disposed.

[0019] In one embodiment, the camera module includes a bracket and a lens assembly, the bracket is arranged around the photosensitive chip, the bracket is connected to the circuit board, and the lens assembly is arranged on the photosensitive path of the photosensitive chip and connected to the bracket.

[0020] In one embodiment, the lens assembly includes a mounting seat and a plurality of lenses, the plurality of lenses are mounted on the mounting seat, and the mounting seat is integrally formed with the bracket.

[0021] On the other hand, the present application provides an electronic device, including a device body and the above-mentioned camera module, wherein the camera module is connected to the device body.

[0022] The camera module and electronic device mentioned above, the camera module includes a circuit board, a photosensitive chip, a support member and an electronic component, the support member is connected between the circuit board and the photosensitive chip, and a receiving space is formed between the side of the photosensitive chip facing away from the photosensitive area and the circuit board, and the electronic component is at least partially received in the receiving space, thereby reducing the space occupied by the electronic component around the photosensitive chip corresponding to the circuit board, which is conducive to the miniaturization of the camera module. In addition, the support member includes an electrically connected first electrical connection part and a second electrical connection part, the first electrical connection part is electrically connected to the circuit board, and the second electrical connection part is electrically connected to the photosensitive chip. In this way, the support member can not only support the photosensitive chip, but also meet the need to electrically connect the electronic component to the circuit board, so as to maintain the performance requirements of the electronic component when the camera module is working. Therefore, the present application scheme can take into account the shooting performance of the camera module while achieving miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a three-dimensional schematic diagram of an electronic device according to an embodiment.

[0025] Figure 2 It is a schematic diagram of the three-dimensional structure of an electronic device according to another embodiment.

[0026] Figure 3 The figure is a schematic cross-sectional structure diagram of a camera module according to one embodiment.

[0027] Figure 4 The figure is a schematic diagram of the structure of a support member in a camera module according to one embodiment.

[0028] Figure 5 It is a schematic structural diagram of a support member in a camera module according to another embodiment.

[0029] Figure 6 A schematic diagram of the cross-sectional structure of a camera module according to another embodiment.

[0030] Figure 7 for Figure 6 A schematic diagram of the three-dimensional structure of the support member of the camera module is shown.

[0031] Figure 8 for Figure 7 The schematic diagram of the bottom view structure of the support member of the camera module is shown.

[0032] Fig. 9 for Figure 7 The cross-sectional structure diagram of the support member of the camera module along line II is shown.

[0033] Fig.10 It is a schematic diagram of the three-dimensional structure of a bracket in a camera module according to one embodiment.

[0034] Fig.11 This is a structural block diagram of the electronic device provided in this application.

[0035] Description of Figure Numbers:

[0036] 100, device body; 110, housing; 120, display screen; 200, camera module; 210, circuit board; 211, first pad; 220, photosensitive chip; 220a, photosensitive area; 220b, non-photosensitive area; 220c, second pad; 230, support member; 230a, receiving space; 230b, first electrical connection part; 230c, second electrical connection part; 231, metal conductor; 232, plastic package Component; 232a, first overmolded component; 232b, second overmolded component; 233, frame; 233a, first frame portion; 233b, second frame portion; 233c, third frame portion; 233d, four frame portions; 234, metal inlay; 240, electronic component; 250, bracket; 251, side surrounding portion; 252, receiving portion; 260, lens assembly; 261, mounting seat; 262, lens; 270, filter. DETAILED DESCRIPTION

[0037] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0038] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0039] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0040] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0041] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0042] (1) Satellite phone or cellular phone;

[0043] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0044] (3) Radiotelephone, pager, Internet / Intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0045] (4) conventional laptop and / or handheld receivers;

[0046] (5) Conventional laptop and / or palmtop radiotelephone transceivers, etc.

[0047] An electronic device according to an embodiment of the present application, such as Figure 1 As shown, the electronic device can be a wearable device such as a smart bracelet, a smart watch, etc. Figure 2 As shown, the electronic device may also be a mobile phone. It is understood that the specific form of the electronic device may be other, such as a tablet computer, a notebook computer, a smart helmet, smart glasses, etc., which is not limited here.

[0048] like Figure 1 and Figure 2 As shown, the electronic device includes a device body 100 and a camera module 200. The camera module 200 is connected to the device body 100. The camera module 200 is used for shooting, so that the electronic device has a shooting function.

[0049] In some embodiments, the device body 100 includes a housing 110 and a display screen 120 connected to the housing 110. A receiving space is formed between the housing 110 and the display screen 120. The receiving space is used to receive the internal parts of the electronic device. The housing 110 can protect the internal parts of the electronic device. The housing 110 can be the back cover of the electronic device and cover the battery, motherboard and other components of the electronic device. The camera module 200 can be installed on the housing 110, and when shooting is required, the camera module 200 can receive external light for imaging.

[0050] It should be noted that the device body 100 may also not have the display screen 120 , that is, the display screen 120 is not necessary for the device body 100 .

[0051] The camera module 200 may be a conventional camera, for example, a plurality of lenses are arranged in a straight line along the optical axis. In some embodiments, the camera module 200 may also be a periscope camera implemented by using edges or reflectors to change the light propagation path. The type of the camera module 200 is not limited here.

[0052] The structure of the camera module 200 will be further described below.

[0053] Combination Figure 3 As shown, the camera module 200 includes a circuit board 210 , a photosensitive chip 220 , a support member 230 and an electronic component 240 .

[0054] The circuit board 210 may be a PCB board, i.e. a printed circuit board 210 (Printed Circuit Board). In some embodiments, the PCB board includes a first hard board portion, a soft board portion, and a second hard board portion, wherein the soft board portion is connected between the first hard board portion and the second hard board portion. The photosensitive chip 220 is disposed in the first hard board portion. The PCB board is provided with a connector, which is disposed in the second hard board portion, so as to electrically connect the PCB board with other components of the electronic device such as a main board by using the connector, so as to pave the way for the camera module 200 to perform the shooting function in the electronic device.

[0055] The photosensitive chip 220 can be connected to the circuit board 210 through a patch process. The photosensitive chip 220 is used to convert light into electrical signals when receiving light, and then convert it into digital signals through analog-to-digital conversion to meet the needs of digital imaging.

[0056] The types of the photosensitive chip 220 may include CCD (Charge Coupled Device) elements, CMOS (Complementary Metal Oxide Semiconductor) devices, photosensitive diodes, etc. In terms of color, the photosensitive chip 220 may be a color light sensor, a monochromatic light sensor, an infrared light sensor, a grayscale sensor, etc. The type of the photosensitive chip 220 is not limited here.

[0057] Combination Figure 3 As shown, the support member 230 is connected between the circuit board 210 and the photosensitive chip 220, and a receiving space 230a is formed between the side of the photosensitive chip 220 facing away from the photosensitive area 220a and the circuit board 210. The electronic component 240 is at least partially received in the receiving space 230a, thereby reducing the space occupied by the electronic component 240 around the circuit board 210 corresponding to the photosensitive chip 220, which is conducive to the miniaturization of the camera module 200. In addition, the support member 230 includes a first electrical connection portion 230b and a second electrical connection portion 230c that are electrically connected, the first electrical connection portion 230b is electrically connected to the circuit board 210, and the second electrical connection portion 230c is electrically connected to the photosensitive chip 220. In this way, the support member 230 can not only support the photosensitive chip 220, but also meet the need of electrically connecting the electronic component 240 to the circuit board 210, thereby maintaining the performance requirements of the electronic component 240 when the camera module 200 is working. Therefore, the present application scheme can take into account the shooting performance of the camera module 200 while achieving miniaturization.

[0058] There is no limitation on the number of the electronic components 240. The types of the electronic components 240 include, but are not limited to, resistors, capacitors, or inductors, which are not limited here.

[0059] In some embodiments, the orthographic projection of the support member 230 on the plane where the photosensitive chip 220 is located is located in the non-photosensitive area 220b.

[0060] It should be noted that the photosensitive area 220a of the photosensitive chip 220 is used to receive light exposure to meet the imaging needs of the photosensitive chip 220. The non-photosensitive area 220b can be arranged with peripheral circuits to meet the electrical connection needs of the photosensitive chip 220 and the second electrical connection part 230c. Therefore, in this embodiment, the positive projection of the support member 230 on the plane where the photosensitive chip 220 is located is located in the non-photosensitive area 220b, which can make the second electrical connection part 230c of the support member 230 close to the non-photosensitive area 220b, thereby facilitating the electrical connection of the second electrical connection part 230c to the peripheral circuit corresponding to the non-photosensitive area 220b.

[0061] The electrical connection method between the second electrical connection portion 230c and the photosensitive chip 220 is not limited here.

[0062] For example, in some embodiments, the second electrical connection portion 230c may be soldered to the photosensitive chip 220 by soldering.

[0063] The non-photosensitive area 220b of the photosensitive chip 220 is provided with welding pins, which are folded from the edge of the photosensitive chip 220 to the side of the photosensitive chip 220 facing away from the photosensitive area 220a, and are electrically connected to the second electrical connection portion 230c.

[0064] In some embodiments, when manufacturing the photosensitive chip 220, a welding pin may be provided on the side of the photosensitive chip 220 that faces away from the photosensitive area 220a. In this way, the welding pin may be used to electrically connect to the second electrical connection portion 230c.

[0065] Continue to combine Figure 3 As shown, the support member 230 includes a plurality of metal conductors 231 arranged at intervals, so as to utilize the plurality of metal conductors 231 to meet the electrical connection requirements between the photosensitive chip 220 and the corresponding plurality of electrical connection points in the circuit board 210. The number of the support members 230 can be set according to the electrical connection requirements between the photosensitive chip 220 and the circuit board 210, and is not limited here.

[0066] It should be noted that a first electrical connection portion 230b is provided at one end of the metal conductor 231, and a second electrical connection portion 230c is provided at the other end of the metal conductor 231. In this way, the first electrical connection portion 230b and the second electrical connection portion 230c are conducted through the metal conductor 231 itself, and then when the two ends of the metal conductor 231 are respectively connected to the photosensitive chip 220 and the circuit board 210, on the one hand, the metal conductor 231 realizes the electrical connection between the photosensitive chip 220 and the circuit board 210, and on the other hand, the metal conductor 231 can play a supporting effect, thereby supporting the photosensitive chip 220 at intervals on the circuit board 210, so as to utilize the space between the photosensitive chip 220 and the circuit board 210 to set the electronic component 240, thereby realizing the miniaturization of the camera module 200.

[0067] In some embodiments, the metal conductor 231 includes a copper alloy wire. The metal conductor 231 made of such a copper alloy has a high structural strength and can enhance the support stability of the photosensitive chip 220 .

[0068] Combination Figure 4As shown, the support member 230 also includes a plastic package 232, which is coated on the metal conductor 231, thereby protecting the metal conductor 231 and reducing the probability of the metal conductor 231 bending and causing the photosensitive chip 220 to deflect. It should be noted that the photosensitive chip 220 and the circuit board 210 are both in contact with the plastic package 232, so that the plastic package 232 is used to improve the support force of the photosensitive chip 220, enhance the stability of the photosensitive chip 220, and make it difficult for the photosensitive chip 220 to tilt relative to the circuit board 210, so as to ensure the imaging quality of the camera module 200.

[0069] Combination Figure 4 As shown, the overmolding 232 includes a first overmolding 232a and a second overmolding 232b. The first overmolding 232a and the second overmolding 232b are spaced apart from each other so that the first overmolding 232a and the second overmolding 232b are respectively supported on both sides of the photosensitive chip 220 to improve the support stability of the photosensitive chip 220.

[0070] Combination Figure 5 In some embodiments, the first overmolded part 232a and the second overmolded part 232b are connected as one piece by injection molding. For example, when manufacturing the support member 230, the metal conductor 231 can be pre-fixed in an injection mold, and then the molten plastic fluid is injected into the injection mold, and the first overmolded part 232a and the second overmolded part 232b are connected as one piece by injection molding. The metal conductor 231 is not easy to bend under the coating of the plastic material, so as to stably support the photosensitive chip 220.

[0071] In some embodiments, a portion of the multiple metal conductors 231 are disposed in the first overmolded part 232a, and the other portions are disposed in the second overmolded part 232b, thereby making full use of the design space of the first overmolded part 232a and the second overmolded part 232b to arrange the metal conductors 231. Compared with the metal conductors 231 being all disposed on one side, this structural arrangement can reduce the occurrence of short circuit defects between the metal conductors 231.

[0072] Combination Figure 6 As shown, in other embodiments, the support member 230 includes a frame 233 and a metal insert 234. The first electrical connection portion 230b is located on the end surface of the frame 233 facing the circuit board 210, and the second electrical connection portion 230c is located on the end surface of the frame 233 facing the photosensitive chip 220. At least a portion of the metal insert 234 is embedded in the frame 233, and the metal insert 234 is electrically connected to the first electrical connection portion 230b and the second electrical connection portion 230c.

[0073] The metal insert 234 can be integrally molded with the frame 233 by injection molding. This injection molding process is mature and it is easy to embed at least part of the metal insert 234 in the frame 233. Moreover, under this structural setting, the connection between the metal insert 234 and the frame 233 is stable, so that the support member 230 stably supports the photosensitive chip 220 while maintaining the electrical connection stability of the metal insert 234 between the photosensitive chip 220 and the circuit board 210.

[0074] Continue to combine Figure 6 As shown, in some embodiments, a plurality of first pads 211 are provided on one side of the circuit board 210 facing the photosensitive chip 220. The plurality of first pads 211 are correspondingly welded with the plurality of first electrical connection portions 230b, so that the circuit board 210 and the metal insert 234 are electrically connected.

[0075] A plurality of second solder pads 220c are provided on one side of the photosensitive chip 220 facing the circuit board 210, and the plurality of second solder pads 220c are correspondingly soldered to the plurality of second electrical connection portions 230c, so that the photosensitive chip 220 is electrically connected to the circuit board 210. It can be seen that the photosensitive chip 220 and the circuit board 210 are connected by the metal insert 234.

[0076] It should be noted that the metal insert 234 can be a plurality of independent filamentary or sheet-like parts, as long as it can meet the electrical connection requirements of the photosensitive chip 220 and the corresponding functional parts of the circuit board 210. The number of the first point connection parts and the second electrical connection parts 230c in the metal insert 234 can be specifically configured according to the electrical connection requirements between the photosensitive chip 220 and the circuit board 210, and is not limited here.

[0077] In the present application, the welding methods between the components involved in welding include but are not limited to hot pressing welding, solder reflow welding or low melting point alloy welding. For example, the first solder pad 211 and the first electrical connection portion 230b can be welded to the photosensitive chip 220 by hot pressing welding, solder reflow welding or low melting point alloy welding, and the other end can be welded to the circuit board 210 by hot pressing welding, solder reflow welding or low melting point alloy welding.

[0078] The frame body 233 includes multiple frame parts, and the frame part for setting the first electrical connection part 230b is different from the frame part for setting the second electrical connection part 230c, so that the frame part can be used to distinguish the first electrical connection part 230b from the second electrical connection part 230c, and the different frame parts of the frame body 233 can provide more design space to arrange the first electrical connection part 230b or the second electrical connection part 230c.

[0079] The number of frame parts is not limited here. Figure 6 and Figure 7As shown, in some embodiments, the frame 233 includes a first frame portion 233a, a second frame portion 233b, a third frame portion 233c and a fourth frame portion 233d arranged along the peripheral side of the photosensitive chip 220.

[0080] Combination Figures 7 to 9 As shown, in some embodiments, the first electrical connection portion 230b is located in the first frame portion 233a, and the second electrical connection portion 230c is located in the third frame portion 233c. Part of the structure of the metal insert 234 is embedded in the second frame portion 233b or the fourth frame portion 233d, and at least one first electrical connection portion 230b located in the first frame portion 233a is connected to at least one second electrical connection portion 230c located in the third frame portion 233c. In this embodiment, the wall thickness of the second frame portion 233b or the fourth frame portion 233d can be used to arrange the metal insert 234 to achieve electrical connection between the electronic components 240, thereby making full use of the structural design space of the frame 233, so as to facilitate the miniaturization of the camera module 200.

[0081] Combination Figure 6 and Fig.10 As shown, in some embodiments, the camera module 200 includes a bracket 250 and a lens assembly 260. The bracket 250 is arranged around the photosensitive chip 220. The bracket 250 is connected to the circuit board 210, and the lens assembly 260 is arranged on the light sensing path of the photosensitive chip 220 and connected to the bracket 250. The lens assembly 260 is used to process external light so as to process the light into light that can adapt to the imaging chip for imaging.

[0082] Specifically, the external light passes through the lens assembly 260 and irradiates the photosensitive area 220a of the photosensitive chip 220. The photosensitive chip 220 converts the light transmitted from the lens assembly 260 into an electrical signal, and then converts it into a digital signal through analog-to-digital conversion.

[0083] Combination Figure 6 As shown, the lens assembly 260 includes a mounting seat 261 and a plurality of lenses 262. The plurality of lenses 262 are mounted on the mounting seat 261. The plurality of lenses 262 are arranged on the mounting seat 261 along the optical axis direction of the lens assembly 260. The number of lenses 262 can be 2 or more than 2. The type, number and arrangement structure of the lenses 262 arranged in the mounting seat 261 are not limited here.

[0084] In some embodiments, the lens assembly 260 includes a lens barrel (not shown), which is connected to a mounting seat 261. A plurality of lenses 262 may be installed in the lens barrel to be connected to the mounting seat 261 through the lens barrel.

[0085] The lens barrel is movably connected to the mounting seat 261, so that the lens barrel can adjust its position relative to the mounting seat 261, thereby achieving focusing. For example, the lens assembly 260 includes a voice coil motor (not shown), which is arranged between the lens barrel and the mounting seat 261. The voice coil motor is used to drive the lens barrel to move relative to the mounting seat 261, so that the lens 262 arranged on the lens barrel moves away from or close to the photosensitive chip 220 along the light sensing path of the photosensitive chip 220, so as to achieve optical focusing.

[0086] The connection method between the mounting base 261 and the bracket 250 includes but is not limited to glue connection or hot melt connection.

[0087] For example, the mounting seat 261 is integrally formed with the bracket 250. In some embodiments, the mounting seat 261 and the bracket 250 are integrally formed by injection molding. The mounting seat 261 and the bracket 250 can both be made of plastic. In this way, the mounting seat 261 and the bracket 250 can be integrally formed by injection molding, that is, the mounting seat 261 and the bracket 250 are an integral structural member. This reduces the number of parts, reduces the assembly complexity of the camera module 200, and reduces the processing cost of the camera module 200.

[0088] Recombination Figure 6 and Fig.10 As shown, in some embodiments, the bracket 250 includes a side surrounding portion 251 and a receiving portion 252. The receiving portion 252 is convexly arranged on the inner wall of the side surrounding portion 251, and the side surrounding portion 251 is arranged around the periphery of the photosensitive chip 220, and the side surrounding portion 251 is connected to the circuit board 210.

[0089] Further, the camera module 200 includes a filter 270, and the filter 270 is connected to the side of the receiving portion 252 facing away from the photosensitive chip 220. In some embodiments, the filter 270 may also be connected to the side of the receiving portion 252 facing the photosensitive chip 220. The setting position of the filter 270 is not limited here, as long as the filter 270 is located on the photosensitive path of the photosensitive chip 220 to exert the filtering effect.

[0090] Combination Fig.11 , Fig.11 The circuit module block diagram of the device body 100 of the electronic device provided in the embodiment of the present application. The device body 100 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. Those skilled in the art will understand that Fig.11 The structure of the device body 100 shown in the figure does not constitute a limitation on the device body 100, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0091] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Generally, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the Global System of Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0092] The memory 502 can be used to store applications and data. The applications stored in the memory 502 include executable codes. The applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the device body 100 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0093] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch panel or touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0094] Furthermore, the touch-sensitive surface may cover a liquid crystal panel. When the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event. The processor 508 then provides corresponding visual output on the liquid crystal panel according to the type of touch event.

[0095] The display unit 504 may be used to display information input by a user or information provided to a user and various graphical user interfaces of the device body 100 . These graphical user interfaces may be composed of graphics, texts, icons, videos, and any combination thereof.

[0096] Although in Fig.11 In the embodiment, the touch sensitive surface and the liquid crystal panel are used as two independent components to realize input and output functions, but in some embodiments, the touch sensitive surface and the liquid crystal panel can be integrated to realize input and output functions. It can be understood that the device body 100 can include an input unit 503 and a display unit 504.

[0097] The device body 100 may also include at least one sensor 505, such as a proximity sensor, a motion sensor, and other sensors. Among them, the proximity sensor can turn off the LCD panel and / or the backlight when the device body 100 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that can be configured with the device body 100, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be repeated here.

[0098] The audio circuit 506 can provide an audio interface between the user and the device body 100 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another device body 100 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the device body 100.

[0099] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The device body 100 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507. It provides users with wireless broadband Internet access. Fig.11 A wireless fidelity module 507 is shown, but it is understandable that it is not a necessary component of the device body 100 and can be omitted as needed without changing the essence of the invention.

[0100] The processor 508 is the control center of the device body 100. It uses various interfaces and lines to connect various parts of the entire device body 100. By running or executing the application program stored in the memory 502 and calling the data stored in the memory 502, it executes various functions of the device body 100 and processes data, thereby monitoring the device body 100 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface and application program, etc., and the modem processor mainly processes wireless communication. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0101] The device body 100 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0102] although Fig.11Not shown, the device body 100 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can refer to the previous method embodiment, which will not be described in detail here.

[0103] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0104] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A camera module, characterized in that: include: Circuit boards; A photosensitive chip having a photosensitive area and a non-photosensitive area around the photosensitive area; A support member connected between the circuit board and the photosensitive chip, so that a receiving space is formed between the side of the photosensitive chip facing away from the photosensitive area and the circuit board, the support member includes a first electrical connection portion and a second electrical connection portion which are electrically connected, the first electrical connection portion is electrically connected to the circuit board, and the second electrical connection portion is electrically connected to the photosensitive chip; The electronic component is at least partially contained in the containing space, and the electronic component is electrically connected to the circuit board.

2. The camera module according to claim 1, characterized in that: The orthographic projection of the support member on the plane where the photosensitive chip is located is located in the non-photosensitive area.

3. The camera module according to claim 1 or 2, characterized in that: The support member includes a plurality of metal conductors arranged at intervals, one end of the metal conductor is provided with the first electrical connection portion, and the other end of the metal conductor is provided with the second electrical connection portion.

4. The camera module according to claim 3, characterized in that: The metal conductor includes a copper alloy wire.

5. The camera module according to claim 3, characterized in that: The support member also includes a plastic package, which is coated on the metal conductor, and the photosensitive chip and the circuit board are both in contact with the plastic package.

6. The camera module according to claim 5, characterized in that: The over-molded part includes a first over-molded part and a second over-molded part, and the first over-molded part and the second over-molded part are arranged at a distance from each other or connected as a whole through injection molding.

7. The camera module according to claim 6, characterized in that: A portion of the plurality of metal conductors is disposed on the first overmolding component, and the other portion is disposed on the second overmolding component.

8. The camera module according to claim 1 or 2, characterized in that: The support member includes a frame and a metal insert. The first electrical connection portion is located on the end surface of the frame facing the circuit board, and the second electrical connection portion is located on the end surface of the frame facing the photosensitive chip. At least a portion of the metal insert is embedded in the frame, and the metal insert is electrically connected to the first electrical connection portion and the second electrical connection portion.

9. The camera module according to claim 8, characterized in that: A plurality of first solder pads are provided on the side of the circuit board facing the photosensitive chip, and the plurality of first solder pads are correspondingly welded to the plurality of first electrical connection parts; a plurality of second solder pads are provided on the side of the photosensitive chip facing the circuit board, and the plurality of second solder pads are correspondingly welded to the plurality of second electrical connection parts.

10. The camera module according to claim 8, characterized in that: The frame body includes a plurality of frame portions, and the frame portion where the first electrical connection portion is disposed is different from the frame portion where the second electrical connection portion is disposed.

11. The camera module according to claim 1, characterized in that: The camera module includes a bracket and a lens assembly. The bracket is arranged around the photosensitive chip and is connected to the circuit board. The lens assembly is arranged on the photosensitive path of the photosensitive chip and is connected to the bracket.

12. The camera module according to claim 11, characterized in that: The lens assembly comprises a mounting seat and a plurality of lenses, the plurality of lenses are mounted on the mounting seat, and the mounting seat is integrally formed with the bracket.

13. An electronic device, characterized in that: It comprises a device body and the camera module according to any one of claims 1 to 12, wherein the camera module is connected to the device body.

Images