Temperature measuring and heating integrated heater suitable for spacecraft and using method

Abstract

The invention relates to a temperature measuring and heating integrated heater suitable for a spacecraft and a using method, the heater comprises a plurality of constantan heating wires and a plurality of high-resistance surface-mounted thermistors, and the plurality of constantan heating wires are connected in parallel; the two ends of each high-resistance surface-mounted thermistor are connected with the two ends of the corresponding constantan heating wire in parallel through connecting wires. Each constantan heating wire and the corresponding high-resistance patch thermistor are arranged between the two insulating films, and the connecting lead extends out of the two insulating films and is connected with an on-satellite computer through an electric connector. According to the invention, the high-resistance surface-mounted thermistor, the constantan heating wire and the two insulating films are glued, so that gluing and fixing are convenient, and double-sided insulation is realized; in the implementation stage, implementation of temperature measurement and heating can be completed through one-time operation, and compared with a traditional process, more time is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of heaters for spacecraft, and in particular to a temperature measurement and heating integrated heater suitable for spacecraft and a use method thereof. Background Art

[0002] Among the various systems of the spacecraft, the thermal control system ensures that the propellants, components, etc. are within the operating temperature requirements to ensure their normal operation.

[0003] As an indispensable component for temperature control of spacecraft in orbit, the heater is generally in the form of a film containing constantan resistance wire. In order to achieve temperature control for specific purposes, a temperature measurement sensor is required to be used in conjunction with the heater to complete closed-loop temperature control.

[0004] In the traditional design, the heater and temperature measurement sensor are connected to the onboard computer using two cables respectively. Since the spacecraft uses a large number of heaters and temperature measurement sensors and they are distributed in various locations on the satellite, the heater and temperature measurement sensor cables occupy a considerable amount of weight resources.

[0005] In order to reduce the consumption of the above-mentioned cable resources, the present invention proposes a temperature measurement and heating integrated heater suitable for spacecraft, which realizes the two functions of heating and temperature measurement through the connection of two cables, reducing the use of cables by 50%. Summary of the invention

[0006] In order to solve the technical problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a temperature measurement and heating integrated heater suitable for spacecraft and a method of use, which adopts a high-resistance thermistor as a temperature measuring element, integrated in parallel with a constantan wire film heater, and realizes temperature measurement and heating integration by using a time-sharing method of heating and temperature measurement, thereby reducing the use of cables by 50%.

[0007] In order to achieve the above-mentioned purpose of the invention, the present invention provides a temperature measurement and heating integrated heater suitable for spacecraft, comprising:

[0008] Multiple constantan heating wires, multiple constantan heating wires are connected in parallel;

[0009] A plurality of high-resistance chip thermistors, wherein two ends of each high-resistance chip thermistor are connected in parallel with two ends of the corresponding constantan heating wire through connecting wires;

[0010] Each constantan heating wire and the corresponding high-resistance chip thermistor are arranged between two insulating films, and the connecting wire extends out of the two insulating films and is connected to the on-board computer through an electrical connector.

[0011] Furthermore, the onboard computer includes a heating circuit, which is connected in series with a programmable switch, and the series-connected programmable switch and the heating circuit are connected to an electrical connector via a line.

[0012] Furthermore, the onboard computer also includes a measured circuit, which is connected in parallel with a heating circuit through a line, and the heating circuit is connected in series with the programmable switch.

[0013] Furthermore, the onboard computer also includes a voltage-dividing resistor and a temperature measuring circuit connected in series, and the voltage-dividing resistor and the temperature measuring circuit connected in series are connected in parallel with the circuit to be measured; in the heating stage, the programmable switch is closed downward, and the heating circuit supplies power to the constantan heating wire through the electrical connector, and the constantan heating wire is heated; in the temperature measuring stage, the programmable switch is closed upward, the heating circuit stops working, and the power supply circuit of the temperature measuring circuit is connected, and a temperature-related voltage is generated at both ends of the high-resistance chip thermistor after passing through the voltage-dividing resistor. After the circuit to be measured is measured, the temperature data is calculated; the heating stage and the temperature measuring stage work alternately, and the above working process can achieve heating and temperature measurement through a cable.

[0014] Furthermore, the packaging specification of the high-resistance chip thermistor does not exceed the 0402 specification, and each high-resistance chip thermistor and the corresponding constantan heating wire are packaged in two insulating films 3.

[0015] Furthermore, the resistance of the high-resistance chip thermistor is not less than 30KΩ at room temperature and not less than 5KΩ at 70°C, so that within the operating range of -40°C to 70°C, the power consumption of the high-resistance chip thermistor does not exceed 0.2W.

[0016] Furthermore, the insulating film is made of polyimide material.

[0017] The present invention provides a method for using a temperature measurement and heating integrated heater applicable to a spacecraft, comprising the following steps:

[0018] Step 1: Set the temperature control target to T0 through the onboard computer;

[0019] Step 2: When the onboard computer detects that the temperature of the high-resistance chip thermistor is less than T0, the program-controlled switch is closed downward for a closing time of t.

[0020] Step 3: When the time is reached, the program-controlled switch is closed upward, the heating is turned off, and the onboard computer measures the temperature; when the temperature of the high-resistance thermistor is greater than T0, the heating is stopped; when the temperature of the high-resistance thermistor is less than T0, the program-controlled switch is closed downward again to heat the device;

[0021] Step 4: Repeat the above process to keep the temperature of the controlled object at T0.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The present invention proposes an integrated temperature measurement and heating heater suitable for spacecraft, which bonds a high-resistance chip thermistor, a constantan heating wire and two insulating films. The bonding and fixing are convenient and double-sided insulation is achieved. In the implementation stage, temperature measurement and heating can be completed in one operation, which saves more time than traditional processes.

[0024] 2. The present invention proposes a method for using an integrated temperature measurement and heating heater suitable for spacecraft. By cooperating with a constantan heating wire and a high-resistance chip thermistor, corresponding heating and temperature measurement methods are adopted, and wires are selected to achieve both temperature measurement and heating. Compared with traditional heating and temperature measurement methods, wires can be saved, effectively reducing the consumption of spacecraft weight resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Attached Figure 1 It is a schematic diagram of an integrated temperature measurement and heating heater suitable for spacecraft.

[0027] Attached Figure 2 The invention discloses a circuit principle diagram of a method for using a temperature measurement and heating integrated heater suitable for spacecraft.

[0028] In the figure:

[0029] 1. Constantan heating wire; 2. High resistance chip thermistor; 3. Connecting wire; 4. Insulating film; 5. Electrical connector; 6. Onboard computer;

[0030] 61. Heating circuit; 62. Program-controlled switch; 63. Measured circuit; 64. Voltage-dividing resistor; 65. Temperature measurement circuit. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] The present invention provides a temperature measurement and heating integrated heater suitable for a spacecraft, comprising:

[0033] A plurality of constantan heating wires 1, wherein the plurality of constantan heating wires 1 are connected in parallel;

[0034] A plurality of high-resistance chip thermistors 2, wherein two ends of each high-resistance chip thermistor 2 are connected in parallel with two ends of the corresponding constantan heating wire 1 through connecting wires 3;

[0035] Each constantan heating wire 1 and the corresponding high-resistance chip thermistor 2 are arranged between two insulating films 4 , and the connecting wire 3 extends out of the two insulating films 4 and is connected to the onboard computer 6 through the electrical connector 5 .

[0036] The present application uses a corresponding heating and temperature measurement method by combining a constantan heating wire 1 and a high-resistance chip thermistor 2, and selects two wires to achieve both temperature measurement and heating. Compared with traditional heating and temperature measurement methods, two wires can be saved, effectively reducing the consumption of spacecraft weight resources.

[0037] The present application glues a high-resistance chip thermistor 2, a constantan heating wire 1 and two insulating films 4 together, and the gluing and fixing are convenient to achieve double-sided insulation. During the implementation phase, temperature measurement and heating can be completed in one operation, which saves more time than traditional processes.

[0038] The onboard computer 6 includes a heating circuit 61, which is connected in series with a program-controlled switch 62, and the program-controlled switch 62 and the heating circuit 61 are connected in series with the electrical connector 5 through a line. The onboard computer 6 also includes a measured circuit 63, which is connected in parallel with the heating circuit 61 through a line, and the heating circuit 63 is connected in series with the program-controlled switch 62. The onboard computer 6 also includes a voltage-dividing resistor 64 and a temperature measuring circuit 65 connected in series, which are connected in parallel with the measured circuit 63; in the heating stage, the programmable switch 62 is closed downward, and the heating circuit 61 supplies power to the constantan heating wire 1 through the electrical connector 2, and the constantan heating wire 1 is heated; in the temperature measuring stage, the programmable switch 62 is closed upward, the heating circuit 61 stops working, and the power supply circuit of the temperature measuring circuit 65 is connected. After passing through the voltage-dividing resistor 64, a temperature-related voltage is generated at both ends of the high-resistance chip thermistor 2. After being measured by the measured circuit 63, the temperature data is calculated; the heating stage and the temperature measuring stage work alternately, and the above working process can achieve heating and temperature measurement through two cables.

[0039] The packaging specification of the high-resistance chip thermistor 2 does not exceed the 0402 specification. Each high-resistance chip thermistor 2 and the corresponding constantan heating wire 1 are packaged in two insulating films 3. When temperature measurement is achieved, it has good insulation from the spacecraft or related equipment.

[0040] The high-resistance chip thermistor 2 has a resistance of not less than 30KΩ at room temperature and a resistance of not less than 5KΩ at 70°C, so that within the use range of -40°C to 70°C, the power consumption of the high-resistance chip thermistor 2 does not exceed 0.2W.

[0041] The insulating film 3 is made of polyimide material to provide good insulation for the high-resistance chip thermistor 2 and the constantan heating wire 1. The insulating film 3 is a thin sheet structure to facilitate bonding and packaging.

[0042] During the specific design, the resistance value of the constantan heating wire 1 and the size of the insulating film 3 are appropriately designed according to the specific conditions of the spacecraft, and a vacuum-resistant, high- and low-temperature-resistant gluing process is used to glue and encapsulate the connected high-resistance chip thermistor 2, constantan heating wire 1, and connecting wire 4 together inside the insulating film 3.

[0043] During the implementation phase of spacecraft thermal control, the heater of the present application is attached to the surface of the controlled object (structural cabin, equipment, etc.) and connected to the onboard computer 6 through the electrical connector 5.

[0044] The present invention provides a method for using a temperature measurement and heating integrated heater applicable to a spacecraft, comprising the following steps:

[0045] Step 1, setting the temperature control target to T0 through the onboard computer 6;

[0046] Step 2: When the onboard computer 6 detects that the temperature of the high-resistance chip thermistor 2 is less than T0, the program-controlled switch 62 is closed downward for a closing time of t;

[0047] Step 3, when the time is reached, the program-controlled switch 62 is closed upward, the heating is turned off, and the onboard computer 6 measures the temperature; when the temperature of the high-resistance chip thermistor 2 is detected to be greater than T0, the heating is stopped; when the temperature of the high-resistance chip thermistor 2 is less than T0, the program-controlled switch 62 is closed downward again to heat;

[0048] Step 4: Repeat the above process to keep the temperature of the controlled object at T0.

[0049] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0050] Finally, it should be noted that the above is a preferred embodiment of the present invention. It should be pointed out that although the preferred embodiment of the present invention has been described, for those skilled in the art, once the basic creative concept of the present invention is known, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention. Therefore, the attached claims are intended to be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the embodiments of the present invention.

Claims

1. A temperature measurement and heating integrated heater suitable for spacecraft, characterized in that: include: A plurality of constantan heating wires (1), wherein the plurality of constantan heating wires (1) are connected in parallel; A plurality of high-resistance chip thermistors (2), wherein two ends of each high-resistance chip thermistor (2) are connected in parallel with two ends of a corresponding constantan heating wire (1) via connecting wires (3); Each constantan heating wire (1) and the corresponding high-resistance chip thermistor (2) are arranged between two insulating films (4), and the connecting wire (3) extends out of the two insulating films (4) and is connected to an onboard computer (6) through an electrical connector (5).

2. The temperature measurement and heating integrated heater suitable for spacecraft according to claim 1, characterized in that: The onboard computer (6) comprises a heating circuit (61), wherein the heating circuit (61) is connected in series with a program-controlled switch (62), and the program-controlled switch (62) and the heating circuit (61) connected in series are connected to an electrical connector (5) via a line.

3. The temperature measurement and heating integrated heater suitable for spacecraft according to claim 2, characterized in that: The onboard computer (6) further comprises a measured circuit (63), wherein the measured circuit (63) is connected in parallel with the heating circuit (61) via a line, and the heating circuit (63) is connected in series with the programmable switch (62).

4. The temperature measurement and heating integrated heater suitable for spacecraft according to claim 3, characterized in that: The onboard computer (6) further comprises a voltage-dividing resistor (64) and a temperature measuring circuit (65) connected in series, wherein the voltage-dividing resistor (64) and the temperature measuring circuit (65) connected in series are connected in parallel with the circuit to be measured (63); in the heating stage, the program-controlled switch (62) is closed downward, and the heating circuit (61) supplies power to the constantan heating wire (1) through the electrical connector (2), and the constantan heating wire (1) is heated; in the temperature measuring stage, the program-controlled switch (62) is closed upward, the heating circuit (61) stops working, and the power supply circuit of the temperature measuring circuit (65) is connected, and a voltage related to temperature is generated at both ends of the high-resistance chip thermistor (2) after passing through the voltage-dividing resistor (64), and after being measured by the circuit to be measured (63), temperature data is calculated and obtained.

5. The temperature measurement and heating integrated heater suitable for spacecraft according to claim 1, characterized in that: The packaging specifications of the high-resistance chip thermistor (2) do not exceed the 0402 specifications, and each high-resistance chip thermistor (2) and the corresponding constantan heating wire (1) are packaged in two insulating films (3).

6. The temperature measurement and heating integrated heater suitable for spacecraft according to claim 1, characterized in that: The high-resistance chip thermistor (2) has a resistance of not less than 30KΩ at room temperature and a resistance of not less than 5KΩ at 70°C, so that within the use range of -40°C to 70°C, the power consumption of the high-resistance chip thermistor (2) does not exceed 0.2W.

7. The temperature measurement and heating integrated heater suitable for spacecraft according to claim 1, characterized in that: The insulating film (3) is made of polyimide material.

8. A method for using the temperature measurement and heating integrated heater according to any one of claims 1 to 7, comprising the following steps: Step 1, setting the temperature control target as T0 through the onboard computer (6); Step 2: When the onboard computer (6) detects that the temperature of the high-resistance chip thermistor (2) is less than T0, the program-controlled switch (62) is closed downward for a closing time of t; Step 3, when the time is reached, the program-controlled switch (62) is closed upward, the heating is turned off, and the onboard computer (6) measures the temperature; when the temperature of the high-resistance chip thermistor (2) is detected to be greater than T0, the heating is stopped; When the temperature of the high resistance chip thermistor (2) is less than T0, the program-controlled switch (62) is closed downward again to perform heating; Step 4: Repeat the above process to keep the temperature of the controlled object at T0.

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