A packaging substrate and its manufacturing method, an electric drive system and a vehicle

Abstract

This application provides a packaging substrate and its manufacturing method, an electric drive system and a vehicle. The packaging substrate includes a multilayer structure, a power chip and a resistor-capacitor module. The multilayer structure includes a first circuit layer and a second circuit layer. Two embedded cavities are formed inside the packaging substrate. The two embedded cavities are disposed between the first circuit layer and the second circuit layer and are spaced apart along a first direction. The power chip and the resistor-capacitor module are respectively disposed in the two embedded cavities. The first direction is perpendicular to the stacking direction of the multilayer structure.

Description

Technical Field

[0001] This application belongs to the field of electric drive control technology, and more specifically, relates to a packaging substrate and its manufacturing method, an electric drive system and a vehicle. Background Technology

[0002] In the drive system of electric vehicles, when the main drive based on the embedded system adopts a silicon carbide drive circuit, oscillations will be generated during the switching process. Therefore, an RC absorption circuit is designed to absorb these oscillations.

[0003] like Figure 1 As shown, in related technologies, the RC snubber circuit 100' is positioned on the top layer of the packaged circuit board 200'. Because the RC snubber circuit 100' needs to withstand a large voltage, the power consumption of each component is high, resulting in high temperatures during use. This leads to high ambient temperatures, and the top layer is far from the cooling channels at the bottom of the packaged circuit board, failing to achieve ideal heat dissipation. Furthermore, there are multiple RC snubber circuits 100', and each RC snubber circuit has a large package size, resulting in a large overall packaged circuit board volume. This occupies a significant portion of the internal volume of the electric drive system, hindering the efficient use of internal space. Simultaneously, the large package size of the RC snubber circuits makes it difficult to achieve a reasonable wiring layout on the top layer, thus hindering the circuit board from meeting safety regulations. Summary of the Invention

[0004] The purpose of this application is to provide a packaging substrate and its manufacturing method, an electric drive system and a vehicle, to solve the technical problems of existing circuit boards that have poor heat dissipation efficiency, large package size and are not conducive to reasonable wiring on the top layer due to placing the RC circuit on the top layer.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] A packaging substrate is provided, the packaging substrate comprising a multilayer structure, a power chip, and a resistor-capacitor module;

[0007] The multilayer structure includes a first circuit layer and a second circuit layer. The packaging substrate has two embedded cavities inside. The two embedded cavities are disposed between the first circuit layer and the second circuit layer and are spaced apart along a first direction. The power chip and the resistor-capacitor module are respectively disposed in the two embedded cavities. The first direction is perpendicular to the stacking direction of the multilayer structure.

[0008] In some embodiments, the first circuit layer is provided with a first potential transmission section and a negative potential section spaced apart from the first potential transmission section, and the second circuit layer is provided with a second potential transmission section and a positive potential section spaced apart from the second potential transmission section.

[0009] The first potential transmission section and the positive potential section are directly opposite each other along the stacking direction, and the second potential transmission section and the negative potential section are directly opposite each other along the stacking direction. The first potential transmission section and the second potential transmission section are connected through a metal hole.

[0010] In some embodiments, the RC module consists of resistors and capacitors connected in series.

[0011] In some embodiments, the resistor-capacitor module includes a silicon substrate and resistive devices and capacitors integrated on the silicon substrate, the silicon substrate being stacked on the circuit layer.

[0012] In some embodiments, the resistive device and the capacitor are arranged sequentially along a second direction, wherein the first direction, the second direction, and the stacking direction are perpendicular to each other.

[0013] In some embodiments, the packaging substrate includes multiple sets of power chips, which are arranged sequentially along the first direction; each set of power chips includes multiple power chips, which are arranged sequentially along the second direction; the packaging substrate includes multiple resistor-capacitor modules, and a resistor-capacitor module is provided between any two adjacent sets of power chips.

[0014] In some embodiments, the power chip, the resistor-capacitor module, and the metal via are arranged sequentially along the first direction, and the metal via is located between any adjacent power chip and resistor-capacitor module.

[0015] In some embodiments, the multilayer structure further includes a transport layer group comprising at least two signal transmission layers, the transport layer group being disposed between the first line layer and the second line layer;

[0016] The two embedded cavities are a first embedded cavity and a second embedded cavity. The first embedded cavity penetrates the entire thickness of the transmission layer group, and the power chip is disposed in the first embedded cavity. The second embedded cavity penetrates a portion of the thickness of the transmission layer group, and the resistor-capacitor module is disposed in the second embedded cavity.

[0017] The advantages of the packaging substrate provided in this application are as follows:

[0018] Compared with the prior art, the packaging substrate provided in this application has its resistor-capacitor modules embedded in it using an embedded method, meaning that both the power chip and the resistor-capacitor modules are embedded in the multilayer structure of the packaging substrate. This embedding method has the following technical advantages:

[0019] First, because the resistor-capacitor module withstands a large voltage and the power consumption of each device is large, the ambient temperature of the embedded cavity where the resistor-capacitor module is located is high. Since the embedded cavity is located in a multi-layer structure, the embedded cavity is close to the cooling channel at the bottom of the multi-layer structure. The cooling channel can directly cool the multi-layer structure and thus remove the heat from the embedded cavity. The resistor-capacitor module can achieve a relatively ideal heat dissipation effect.

[0020] Secondly, the resistor-capacitor modules are embedded in the embedded cavity inside the multilayer structure, which does not increase the volume of the multilayer structure. Whether it is one or more resistor-capacitor modules, the packaging substrate can save space on the top layer, thereby reducing the packaging volume of the packaging substrate and reducing the occupancy of the packaging substrate on the internal space of the electric drive system, which is conducive to the rational use of the internal space of the electric drive system.

[0021] Third, the packaging substrate can save space on the top layer, which is conducive to achieving a reasonable wiring layout on the top layer, thereby meeting the safety requirements of the packaging substrate.

[0022] Another object of this application is to provide an electric drive system comprising the packaging substrate described above.

[0023] The advantages of the electric drive system provided in this application compared to the prior art are the same as the advantages of the packaging substrate provided in this application compared to the prior art, and will not be repeated here.

[0024] Another object of this application is to provide a vehicle that includes the packaging substrate as described above; or, the vehicle that includes the electric drive system as described above.

[0025] The advantages of the vehicle provided in this application compared to the prior art are the same as the advantages of the packaging substrate or electric drive system provided in this application compared to the prior art, and will not be repeated here.

[0026] Another object of this application is to provide a method for manufacturing a packaging substrate, the method comprising:

[0027] A prefabricated substrate is provided, the prefabricated substrate including a second circuit layer, the prefabricated substrate having at least two embedded cavities, the embedded cavities being located above the second circuit layer and having openings facing away from the second circuit layer;

[0028] A power chip and a resistor-capacitor module are provided, and the power chip and the resistor-capacitor module are respectively placed into the two embedded cavities through the two openings;

[0029] A first circuit layer is fabricated above the opening where the power chip is located, and the first circuit layer covers the openings of at least two of the embedded cavities.

[0030] In some embodiments, providing the resistor-capacitor module and placing the resistor-capacitor module into the embedded cavity through the opening includes:

[0031] A silicon substrate is provided, on which resistive devices and capacitors are integrated to form the resistive-capacitive module, and the resistive-capacitive module is placed into the embedded cavity through the opening;

[0032] Alternatively, a silicon substrate is provided, which is placed into the embedded cavity through the opening, and a resistor and capacitor are integrated on the silicon substrate through the opening to form the resistor-capacitor module.

[0033] The beneficial effects of the method for manufacturing the packaging substrate provided in this application are as follows:

[0034] Compared with existing technologies, the packaging substrate fabrication method provided in this application provides a power chip and a resistor-capacitor (RC) module, and allows the power chip and the RRC module to be placed into two embedded cavities through two openings respectively. The RRC module can be placed into the embedded cavity simultaneously with the power chip, and one of the RRC module and the power chip can be placed immediately after the other. In other words, based on existing packaging substrate fabrication methods, the placement of the RRC module only needs to be performed simultaneously with or before and after the power chip placement step, without making significant changes to the fabrication order or process of the packaging substrate, to obtain the packaging substrate with the aforementioned beneficial effects provided in this application. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of a circuit board in the related technology, in which the RC snubber circuit is located on the top layer;

[0037] Figure 2 A side section view of the packaging substrate along the stacking direction provided in the embodiments of this application;

[0038] Figure 3 The circuit connection diagram of multiple power chips and multiple resistor-capacitor modules in the packaging substrate provided in the embodiments of this application is shown.

[0039] Figure 4 This is a schematic diagram illustrating a method for fabricating a packaging substrate provided in an embodiment of this application.

[0040] The following are the labeling elements in the figure:

[0041] 100. Multilayer structure; 200. Power chip; 300. Resistor-capacitor module; 400. Insulating layer; 500. Copper layer; 600. Top metal layer;

[0042] 101a, Negative potential section; 101b, Positive potential section; 102a, First potential transmission section; 102b, Second potential transmission section; 103a, First embedded cavity; 103b, Second embedded cavity; 104, Metal hole; 105, Transmission layer group;

[0043] 301. Resistive devices; 302. Capacitors. Detailed Implementation

[0044] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0045] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0046] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0048] The packaging substrate and its manufacturing method, electric drive system and vehicle provided in the embodiments of this application will now be described.

[0049] Please see Figure 2 and Figure 3 As shown, the packaging substrate provided in this application embodiment includes a multilayer structure 100, a power chip 200, and a resistor-capacitor module 300.

[0050] The multilayer structure 100 includes a first circuit layer and a second circuit layer. Two embedded cavities are formed inside the packaging substrate, positioned between the first and second circuit layers and spaced apart along a first direction. The power chip 200 and the resistor-capacitor module 300 are respectively disposed in the two embedded cavities. The first direction is perpendicular to the stacking direction of the multilayer structure 100.

[0051] The multilayer structure 100 refers to a structure formed by stacking multiple layers sequentially along the stacking direction. These layers include, but are not limited to, metal layers, protective layers, dielectric layers, and insulating layers. The multilayer structure 100 constitutes the main part of the packaging substrate, serving as a support and conductor. Functional devices are disposed on the surface or inside the multilayer structure 100. The composition of the multilayer structure 100 and the function of each layer of the packaging substrate are well-known to those skilled in the art, and this application embodiment will not describe them in detail. Generally, the packaging substrate can be a PCB (Printed Circuit Board), also known as a printed circuit board.

[0052] Generally, the power chip is embedded in the transmission layer group 105 described below. The first line layer and the second line layer refer to two metal layer structures located outside the transmission layer group 105 on the multilayer structure 100. The first line layer and the second line layer have electrical and / or signal interconnection functions, which serve to connect the substrate to the external circuit. The thickness of the first line layer and the second line layer is customized according to different requirements, and their materials can be one of metals or metal alloys such as copper, aluminum, and copper-aluminum alloy.

[0053] In the actual multilayer structure 100, insulating layers may be optionally provided between the layers within the transmission layer group 105, between the transmission layer group 105 and the first and second circuit layers, and between the first and second circuit layers and the layers located on their outer sides. For example, an insulating layer 400 and a copper layer 500 are stacked sequentially on the lower side of the second circuit layer. The copper layer 500 contacts the cooling channel. The top layer of the first circuit layer also has a top metal layer 600 for arranging various electrical devices. This embodiment does not describe these insulating layers and other metal layers in detail. The materials, functions, and stacking relationships of each metal layer structure in the multilayer structure 100 with other layer structures, as well as their connection relationships with various functional devices, are well known to those skilled in the art, and this embodiment does not describe them in detail.

[0054] The RC module 300 refers to a module that includes at least a resistor 301 and a capacitor 302 connected in series. Its main function is to absorb oscillations during circuit switching. For example, in the drive system of an electric vehicle, when the main drive based on the embedded system uses a silicon carbide drive circuit, oscillations will occur during switching, so the RC module 300 is designed to absorb these oscillations.

[0055] The packaging substrate provided in this application embodiment has a resistor-capacitor module 300 embedded in it, meaning that both the power chip 200 and the resistor-capacitor module 300 are embedded in the multilayer structure 100 of the packaging substrate. This embedding method has the following technical advantages:

[0056] First, because the resistor-capacitor module 300 withstands a large voltage and the power consumption of each device is large, the ambient temperature of the embedded cavity where the resistor-capacitor module 300 is located is high. Since the embedded cavity is located in the multilayer structure 100, the embedded cavity is close to the cooling channel at the bottom of the multilayer structure 100. The cooling channel can directly cool the multilayer structure 100 and thus remove the heat from the embedded cavity. The resistor-capacitor module 300 can achieve a relatively ideal heat dissipation effect.

[0057] Second, the resistor-capacitor module 300 is embedded in the embedded cavity inside the multilayer structure 100, which does not increase the volume of the multilayer structure 100. Whether it is one or more resistor-capacitor modules 300, the packaging substrate can save space on the top layer, thereby reducing the packaging volume of the packaging substrate and reducing the occupancy of the packaging substrate on the internal space of the electric drive system, which is conducive to the rational use of the internal space of the electric drive system.

[0058] Third, the packaging substrate can save space on the top layer, which is conducive to achieving a reasonable wiring layout on the top layer, thereby meeting the safety requirements of the packaging substrate.

[0059] In some embodiments, a first potential transmission section 102a and a negative potential section 101a spaced apart from the first potential transmission section 102a are provided on the first circuit layer, and a second potential transmission section 102b and a positive potential section 101b spaced apart from the second potential transmission section 102b are provided on the second circuit layer. The first potential transmission section 102a and the positive potential section 101b face each other along the stacking direction, and the second potential transmission section 102b and the negative potential section 101a face each other along the stacking direction. The first potential transmission section 102a and the second potential transmission section 102b are connected through a metal via.

[0060] In this embodiment, each potential section is composed of a cluster of multiple potential points integrated on the circuit layer. The positive potential section 101b and the negative potential section 101a are also referred to as DC+ and DC-. The first potential transmission section 102a and the first potential transmission section 102b are also referred to as the two electrodes of AC. It should be noted that the first potential transmission section 102a and the negative potential section 101a spaced apart from it are disposed on the first circuit layer, and the second potential transmission section 102b and the positive potential section 101b spaced apart from it are disposed on the second circuit layer. The function of each potential section and its connection relationship with each layer structure are well known to those skilled in the art, and this embodiment will not describe them in detail.

[0061] Generally, a metal via 104 refers to an opening in the portion of the packaging substrate located between the first and second circuit layers, with metal plated on the via walls to electrically connect the first potential transmission section 102a and the second potential transmission section 102b. The diameter and number of metal vias 104 are customized according to different requirements. The material, function, and connection relationship of the metal vias 104 in the multilayer structure 100 with each layer are well known to those skilled in the art, and will not be described in detail in the embodiments of this application.

[0062] In some embodiments, the resistor-capacitor module 300 is composed of a resistor 301 and a capacitor 302 connected in series. The resistor 301 and capacitor 302 connected in series can be placed as a whole module in an embedded cavity, and the two poles of the resistor-capacitor module 300 are respectively connected to the positive potential section 101b and the negative potential section 101a.

[0063] In some embodiments, the resistor-capacitor module 300 includes a silicon substrate and a resistor 301 and a capacitor 302 integrated on the silicon substrate, with the silicon substrate stacked on a circuit layer. The silicon substrate and the resistor 301 and capacitor 302 integrated on the silicon substrate can be placed as a whole into an embedded cavity, with the two terminals of the resistor-capacitor module 300 connected to the positive potential portion 101b and the negative potential portion 101a, respectively. Alternatively, the silicon substrate can be placed separately into the embedded cavity first, and then the resistor 301 and capacitor 302 can be integrated onto the silicon substrate, wherein integration includes, but is not limited to, etching.

[0064] In some embodiments, the resistor 301 and capacitor 302 are arranged sequentially along a second direction, with the first direction, second direction, and stacking direction being perpendicular to each other. The power devices and RC modules 300 are distributed sequentially along the first direction. Compared to a scheme where the resistor 301 and capacitor 302 are distributed sequentially along the first direction, distributing the resistor 301 and capacitor 302 sequentially along the second direction allows the power devices and RC modules 300 to occupy less space in the first direction. This allows for the arrangement of as many power chips 200 as possible in the first direction, improving the overall power of the electric drive system.

[0065] In some embodiments, the packaging substrate includes multiple groups of power chips 200, which are arranged sequentially along a first direction; each group of power chips 200 includes multiple power chips 200, which are arranged sequentially along a second direction; the packaging substrate includes multiple resistor-capacitor modules 300, and a resistor-capacitor module 300 is provided between any two adjacent groups of power chips 200.

[0066] Multiple power chips 200 and multiple resistor-capacitor modules 300 are arranged along a first direction. The multiple power chips 200 in a single power chip 200 are arranged along a second direction with the resistors 301 and capacitors 302 in a single resistor-capacitor module 300. This provides the optimal layout of multiple power chips 200 and multiple resistor-capacitor modules 300 in the multilayer structure 100. It can not only arrange a large number of power chips 200 to improve the total power of the electric drive system, but also achieve good oscillation absorption through the reasonable arrangement of multiple resistor-capacitor modules 300.

[0067] In some embodiments, multiple resistor-capacitor modules 300 may be arranged irregularly in the multilayer structure 100. For example, unused areas in the multilayer structure 100 of the existing packaging substrate may be fully utilized for cavity opening, or one or more resistor-capacitor modules 300 may be arranged between two adjacent chips in any direction. Multiple resistor-capacitor modules 300 may be arranged in parallel or at an angle.

[0068] In some embodiments, each group of power chips 200 includes two power chips 200, and more than two groups of power chips 200 can be configured in the first direction. For example Figure 3 As shown, a half-bridge structure of multiple power chips 200 connected in parallel is illustrated. Each parallel upper and lower bridge forms a group, and a resistor-capacitor module 300 is connected in parallel between any two adjacent groups.

[0069] The electrical connections between the power chips 200 and between them and the resistor-capacitor module 300, as well as the electrical connections between the resistor-capacitor modules 300, are well-known technologies to those skilled in the art. The embodiments of this application have changed the placement of the resistor-capacitor module 300 and the method of fabricating it in the multilayer structure 100, but have not changed the electrical connections between the resistor-capacitor module 300 and other devices and each layer of the structure.

[0070] In some embodiments, the power chip 200, the resistor-capacitor module 300, and the metal via 104 are arranged sequentially along a first direction, with the metal via 104 located between any adjacent power chip 200 and resistor-capacitor module 300. The metal via 104 avoids the power chip 200 and resistor-capacitor module 300, that is, the cavity opening operation and the fabrication area of ​​the metal via 104 are separated from each other, which facilitates fabrication and forms functional areas that are spaced apart after fabrication, thus facilitating heat dissipation.

[0071] In some embodiments, the multilayer structure 100 further includes a transmission layer group 105, which includes at least two signal transmission layers and is disposed between the first line layer and the second line layer. The two embedded cavities are a first embedded cavity 103a and a second embedded cavity 103b, respectively. The first embedded cavity 103a penetrates the entire thickness of the transmission layer group 105, and the power chip 200 is disposed in the first embedded cavity 103a. The second embedded cavity 103b penetrates a portion of the thickness of the transmission layer group 105, and the resistor-capacitor module 300 is disposed in the second embedded cavity 103b.

[0072] Generally, a signal transmission layer refers to a metal layer structure located inside the first and second circuit layers, which has electrical and / or signal interconnection functions. The power chip 200 is connected to each circuit layer and each signal transmission layer, and the power chip 200 can be powered or input / output signals through the circuit layers and / or signal transmission layers. The number and thickness of the signal transmission layer are customized according to different requirements. The material, function, and stacking relationship of the signal transmission layer in the multilayer structure 100 with other layer structures, as well as its connection relationship with various functional devices, are well known to those skilled in the art, and this application embodiment does not describe them in detail.

[0073] Another objective of this application is to provide an electric drive system, which includes the above-described packaging substrate. The advantages of the electric drive system provided in this application compared to the prior art are the same as the advantages of the packaging substrate provided in this application compared to the prior art, and will not be repeated here.

[0074] Another objective of this application is to provide a vehicle, which includes the above-described packaging substrate; or, the vehicle includes the above-described electric drive system. The advantages of the vehicle provided by this application compared to the prior art are consistent with the advantages of the packaging substrate or electric drive system provided by this application compared to the prior art, and will not be repeated here.

[0075] like Figure 4 As shown, another objective of this application embodiment is to provide a method for manufacturing a packaging substrate, the method comprising:

[0076] 1001. A prefabricated substrate is provided, the prefabricated substrate including a second circuit layer, and at least two embedded cavities are provided on the prefabricated substrate, the embedded cavities being located above the second circuit layer and having openings facing away from the second circuit layer.

[0077] 1002. Provide a power chip and a resistor-capacitor module, with two openings for placing the power chip and the resistor-capacitor module into two embedded cavities respectively;

[0078] 1003. A first circuit layer is fabricated above the opening where the power chip is located, and the first circuit layer covers the openings of at least two embedded cavities.

[0079] There is no strict order restriction between providing the prefabricated substrate and providing the power chip and resistor-capacitor module.

[0080] The packaging substrate fabrication method provided in this application includes a power chip and a resistor-capacitor (RC) module. The power chip and the RRC module can be placed into two embedded cavities through two openings. The RRC module can be placed into the embedded cavity simultaneously with the power chip, or one of the two can be placed immediately after the other. In other words, based on existing packaging substrate fabrication methods, the RRC module placement only needs to be incorporated simultaneously with or before / after the power chip placement step, without significantly altering the fabrication sequence or process of the packaging substrate, to obtain the packaging substrate with the aforementioned beneficial effects provided in this application.

[0081] In other words, the packaging substrate provided in this application, obtained by the method for manufacturing the packaging substrate according to the embodiments of this application, has the following technical effects:

[0082] First, because the resistor-capacitor module withstands a large voltage and the power consumption of each device is large, the ambient temperature of the embedded cavity where the resistor-capacitor module is located is high. Since the embedded cavity is located in a multi-layer structure, the embedded cavity is close to the cooling channel at the bottom of the multi-layer structure. The cooling channel can directly cool the multi-layer structure and thus remove the heat from the embedded cavity. The resistor-capacitor module can achieve a relatively ideal heat dissipation effect.

[0083] Secondly, the resistor-capacitor modules are embedded in the embedded cavity inside the multilayer structure, which does not increase the volume of the multilayer structure. Whether it is one or more resistor-capacitor modules, the packaging substrate can save space on the top layer, thereby reducing the packaging volume of the packaging substrate and reducing the occupancy of the packaging substrate on the internal space of the electric drive system, which is conducive to the rational use of the internal space of the electric drive system.

[0084] Third, the packaging substrate can save space on the top layer, which is conducive to achieving a reasonable wiring layout on the top layer, thereby meeting the safety requirements of the packaging substrate.

[0085] In some embodiments, the above-described provision of the resistor-capacitor module and placement of the resistor-capacitor module into the embedded cavity through the opening includes:

[0086] A silicon substrate is provided, on which resistive devices and capacitors are integrated to form a resistive-capacitive module, and the resistive-capacitive module is placed into an embedded cavity through an opening; or, a silicon substrate is provided, on which the silicon substrate is placed into an embedded cavity through an opening, and the resistive devices and capacitors are integrated on the silicon substrate through the opening to form a resistive-capacitive module.

[0087] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A packaging substrate, characterized in that: the packaging substrate comprises a multi-layer structure (100), a power chip (200) and a resistance-capacitance module (300); the multi-layer structure (100) comprises a first circuit layer and a second circuit layer, two embedded cavities (103a, 103b) are opened in the packaging substrate, the two embedded cavities (103a, 103b) are arranged between the first circuit layer and the second circuit layer and are arranged in a first direction, the power chip (200) and the resistance-capacitance module (300) are arranged in the two embedded cavities (103a, 103b) respectively; wherein the first direction is perpendicular to the stacking direction of the multi-layer structure (100); the first circuit layer is provided with a first potential transmission part (102a) and a negative potential part (101a) spaced from the first potential transmission part (102a), and the second circuit layer is provided with a second potential transmission part (102b) and a positive potential part (101b) spaced from the second potential transmission part (102b); the first potential transmission part (102a) and the positive potential part (101b) face each other along the stacking direction, the second potential transmission part (102b) and the negative potential part (101a) face each other along the stacking direction, and the first potential transmission part (102a) and the second potential transmission part (102b) are connected through a metal hole.

2. The packaging substrate according to claim 1, characterized in that: the resistance-capacitance module (300) is composed of a resistor device (301) and a capacitor device (302) connected in series with each other.

3. The packaging substrate according to claim 1, characterized in that: the resistance-capacitance module (300) comprises a silicon substrate and a resistor device (301) and a capacitor device (302) integrated on the silicon substrate, and the silicon substrate is stacked on one of the circuit layers.

4. The packaging substrate according to claim 2 or 3, characterized in that: the resistor device (301) and the capacitor device (302) are arranged in a second direction; and the first direction, the second direction and the stacking direction are perpendicular to each other.

5. The packaging substrate according to claim 4, characterized in that: the packaging substrate comprises a plurality of groups of the power chip (200), the plurality of groups of the power chip (200) are arranged in the first direction; each group of the power chip (200) comprises a plurality of the power chip (200), and the plurality of the power chip (200) are arranged in the second direction; and the packaging substrate comprises a plurality of the resistance-capacitance module (300), and the resistance-capacitance module (300) is arranged between any two adjacent groups of the power chip (200).

6. The packaging substrate according to claim 1, characterized in that: ​ ​ ​ ​ ​ ​ ​ ​ ​ The first potential transmission part (102a) and the second potential transmission part (102b) are connected through a metal hole (104), the power chip (200), the resistance-capacitance module (300) and the metal hole (104) are sequentially arranged along the first direction, and the metal hole (104) is arranged between the power chip (200) and the resistance-capacitance module (300).

7. The package substrate of any one of claims 1-3, 5-6, wherein: The multi-layer structure (100) further comprises a transmission layer group (105), the transmission layer group (105) comprises at least two signal transmission layers, and the transmission layer group (105) is arranged between the first circuit layer and the second circuit layer; The two embedded cavities (103a, 103b) are respectively a first embedded cavity (103a) and a second embedded cavity (103b), the first embedded cavity (103a) penetrates the thickness of the transmission layer group (105), the power chip (200) is arranged in the first embedded cavity (103a), and the second embedded cavity (103b) penetrates part of the thickness of the transmission layer group (105), and the resistance-capacitance module (300) is arranged in the second embedded cavity (103b).

8. An electric drive system, comprising the package substrate of any one of claims 1-7.

9. A vehicle, comprising the package substrate of any one of claims 1-7.

10. A method for manufacturing a package substrate, comprising: providing a prefabricated substrate, the prefabricated substrate comprising a second circuit layer, and the prefabricated substrate being provided with at least two embedded cavities, the embedded cavities being located above the second circuit layer and being provided with openings facing away from the second circuit layer; providing a power chip (200) and a resistance-capacitance module (300), and placing the power chip (200) and the resistance-capacitance module (300) into the two embedded cavities respectively through the two openings; manufacturing a first circuit layer above the opening where the power chip (200) is located, and making the first circuit layer cover the openings of the at least two embedded cavities, the first circuit layer being provided with a first potential transmission part (102a) and a negative potential part (101a) spaced apart from the first potential transmission part (102a), the second circuit layer being provided with a second potential transmission part (102b) and a positive potential part (101b) spaced apart from the second potential transmission part (102b), the first potential transmission part (102a) and the positive potential part (101b) facing each other along a stacking direction, the second potential transmission part (102b) and the negative potential part (101a) facing each other along the stacking direction, and the first potential transmission part (102a) and the second potential transmission part (102b) being connected through a metal hole.

11. The method for manufacturing a package substrate of claim 10, wherein: ​ ​ ​ ​ The resistor-capacitor module (300) is provided and placed into the embedded cavity by the opening, comprising: A silicon substrate is provided, and a resistor device (301) and a capacitor device (302) are integrated on the silicon substrate to form the resistor-capacitor module (300), and the resistor-capacitor module (300) is placed into the embedded cavity by the opening. Or, a silicon substrate is provided, and the silicon substrate is placed into the embedded cavity by the opening, and a resistor device (301) and a capacitor device (302) are integrated on the silicon substrate to form the resistor-capacitor module (300) by the opening.

Images