Automatic pre-applying film equipment and automatic pre-applying film method

Abstract

This invention relates to an automatic pre-applying film equipment and method. The automatic pre-applying film equipment includes a frame, a board feeding assembly, a pre-applying film assembly, and a board output assembly. The board feeding assembly includes a board feeding conveying structure and a board storage structure arranged side-by-side on one side of the frame, and a board picking and placing structure located above the board storage structure and the board feeding conveying structure. The pre-applying film assembly includes a first pre-applying film mechanism and a second pre-applying film mechanism arranged vertically and vertically in the middle of the frame, with a film application gap between the first and second pre-applying film mechanisms corresponding to the board feeding conveying structure. The board output assembly includes a board output conveying structure located on the other side of the frame, and a board pulling mechanism located above the board output conveying structure. This invention solves the problem of traditional manual pre-applying film to circuit boards, which requires one person to operate one machine, and where improper manual operation can lead to product wrinkles, dry film wrinkles, and other problems affecting product quality.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to an automatic pre-filming equipment and an automatic pre-filming method. Background Technology

[0002] In traditional technology, before vacuum lamination of printed circuit boards (PCBs), dry film of appropriate size needs to be cut according to the PCB dimensions. The dry film is then manually pre-laid on one side of the PCB by an operator. The operator then flips the PCB by holding its corners and manually pre-laid dry film on the other side. Finally, the PCB is transferred to the vacuum lamination machine's production platform for vacuum lamination. This manual pre-lamination method requires one person to operate one machine, and improper manual operation can result in product wrinkles and dry film wrinkles, affecting product quality. Summary of the Invention

[0003] This invention provides an automatic pre-applying film equipment and method, which can solve the technical problems of traditional methods of pre-applying film to circuit boards manually, which requires one person to operate one machine and results in product wrinkles and dry film wrinkles when the manual operation is not standardized, thus affecting product quality.

[0004] To address the aforementioned technical problems, the present invention provides an automatic pre-applying film device, comprising:

[0005] frame;

[0006] The board feeding assembly includes a board feeding conveying structure and a board storage structure arranged side by side on one side of the frame, and a board picking and placing structure disposed above the board storage structure and the board feeding conveying structure.

[0007] The pre-applied film assembly includes a first pre-applied film mechanism and a second pre-applied film mechanism that are disposed vertically and vertically in the middle of the frame, and the first pre-applied film mechanism and the second pre-applied film mechanism have a film application gap corresponding to the feed plate conveying structure.

[0008] The plate ejection assembly includes a plate ejection conveying structure located on the other side of the frame, and a plate pulling mechanism located above the plate ejection conveying structure.

[0009] Optionally, both the first pre-applying film mechanism and the second pre-applying film mechanism include an applicator mounted on the frame, a film dispensing mechanism mounted on the applicator, a film pulling and fixing suction plate mechanism corresponding to the film dispensing mechanism, an applicator suction block structure corresponding to the film pulling and fixing suction plate mechanism, a dry film cutting structure corresponding to the applicator suction block structure, and a feeding / discharging sensor located at the applicator gap, wherein the applicator gap is formed between the two applicator suction block structures.

[0010] Optionally, the film-pulling and film-fixing suction plate mechanism includes a U-shaped mounting frame rotatably mounted on the film-applying frame, a connecting shaft rotatably mounted between the two side plates of the U-shaped mounting frame, a connecting block on each side of the connecting shaft, a telescopic drive member on each side plate of the U-shaped mounting frame, a dry film adsorption positioning plate connected to the ends of the two telescopic drive members, and a connecting rod at each end of the dry film adsorption positioning plate, wherein the two connecting rods are respectively movably inserted into the two connecting blocks.

[0011] Optionally, the dry film adsorption positioning plate includes an adsorption plate body connected to the telescopic drive member and the connecting rod, and a dry film heating member disposed at the bottom or top of the adsorption plate body. The side of the adsorption plate body is provided with a plurality of first vacuum adsorption holes for adsorbing the dry film supplied by the film dispensing mechanism. The dry film heating member is used to press the dry film onto the circuit board.

[0012] Optionally, the film dispensing mechanism includes a film dispensing roll rotatably mounted on the film applicator, a plurality of film dispensing guide shafts rotatably mounted on the film applicator, and a film dispensing limiting shaft rotatably mounted on the film applicator. The film dispensing limiting shaft and the connecting shaft are arranged side by side and close to each other, with a positioning gap between them. The positioning gap corresponds to the side of the adsorption plate body on which a plurality of the first vacuum adsorption holes are provided.

[0013] Optionally, the film-applying suction block structure includes an arc-shaped suction block rotatably mounted on the film-applying frame. The arc-shaped suction block has a plurality of second vacuum suction holes on its arc-shaped surface for adsorbing the dry film supplied by the film-dispensing mechanism and the film-pulling and film-fixing suction plate mechanism. The film-applying gap is formed between two arc-shaped suction blocks.

[0014] Optionally, the dry film cutting structure includes a cutting guide frame disposed on the film applicator and corresponding to the film applicator suction block structure, a cutting blade slidably disposed on the cutting guide frame, and a cutting drive unit connected to the cutting blade, the cutting drive unit being used to drive the cutting blade to move along the cutting guide frame.

[0015] Optionally, the plate pulling mechanism includes plate pulling guide rails on both sides of the plate conveying structure, a plate pulling frame slidably disposed on the plate pulling guide rails on both sides, a plate pulling drive member disposed on the frame and connected to the plate pulling frame, and a plurality of plate pulling clamps protruding from one side of the plate pulling frame. The plate pulling clamps are arranged in a front-to-back correspondence with the film application gap, and the plate pulling drive member is used to drive the plate pulling frame and the plate pulling clamps on it to move closer to or away from the film application gap.

[0016] Optionally, the feeding conveying structure includes a first conveying frame disposed on the frame, and a conveying roller structure disposed on the first conveying frame, wherein the conveying direction of the conveying roller structure corresponds to the film-applying gap;

[0017] The plate conveying structure includes a second conveying frame on the machine frame, a conveying roller structure on the second conveying frame, and a first limiting roller and a second limiting roller located at both ends of the second conveying frame and above the conveying roller structure. The conveying direction of the conveying roller structure is opposite to the film-applying gap. The plate pulling mechanism is slidably disposed on the second conveying frame and spans across the top of the conveying roller structure.

[0018] In addition, the present invention also proposes an automatic pre-applying film method, which is applied to the automatic pre-applying film equipment described above;

[0019] The method includes:

[0020] The board picking and placing structure of the board feeding assembly retrieves the circuit board from the storage structure and transfers it to the board feeding conveyor structure on the side of the storage structure. The board feeding conveyor structure is then controlled to transport the circuit board toward the film-applying gap of the pre-applying film assembly.

[0021] The first and second pre-filming mechanisms of the pre-filming assembly respectively pre-feed two dry films to the filming gap. When the circuit board is detected to have been delivered to the filming gap, the first and second pre-filming mechanisms respectively apply the two dry films to the starting ends of the two sides of the circuit board.

[0022] The plate pulling mechanism of the control board output assembly clamps and pulls the circuit board located at the film bonding gap and the dry film attached to the starting end on both sides of the board, and controls the first pre-film bonding mechanism and the second pre-film bonding mechanism to continuously attach two dry films to the two sides of the circuit board passing through the film bonding gap.

[0023] When the end of the circuit board is detected to be leaving the film-applying gap, the first pre-applying film mechanism and the second pre-applying film mechanism are controlled to cut the dry film adhered to both sides of the circuit board from the end of the circuit board, and the board pulling mechanism is controlled to place the circuit board with pre-applying film on both sides onto the board delivery conveyor structure, and the board delivery conveyor structure is controlled to transport the circuit board with pre-applying film on both sides to the next station.

[0024] The beneficial effects of the technical solution provided by this invention include:

[0025] The circuit board stored in the board storage structure can be automatically transferred to the board feeding conveyor structure through the board feeding assembly's board picking and placing structure. The board feeding conveyor structure can then automatically transport the circuit board to the film application gap of the pre-film application assembly. The first and second pre-film application mechanisms can then pre-apply film to both sides of the circuit board. During the pre-film application process, the board feeding assembly's board pulling mechanism pulls the circuit board with pre-applied dry film, and the circuit board with dry film on both sides is pulled to the board feeding conveyor structure. The board feeding conveyor structure then transports the circuit board with pre-applied dry film to the next workstation (i.e., the production platform of the vacuum laminator).

[0026] In this process, automated pre-filming equipment can automatically load and unload circuit boards, simultaneously pre-applying dry film to both sides of the circuit board. This eliminates the need for manual pre-laying of dry film on one side of the circuit board, followed by manual flipping and pre-laying on the other side, and then manual transfer to the vacuum laminating machine's production platform for vacuum lamination. This significantly improves pre-filming efficiency, reduces the number of operators and saves manpower, and also reduces product wrinkles and dry film wrinkles caused by improper manual operation, thus ensuring product quality. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a three-dimensional structural diagram of the automatic pre-applying film device according to an embodiment of the present invention. Figure 1 ;

[0029] Figure 2 This is a three-dimensional structural diagram of the automatic pre-applying film device according to an embodiment of the present invention. Figure 2 ;

[0030] Figure 3 This is a three-dimensional structural diagram of the infeed assembly of the automatic pre-applying film equipment according to an embodiment of the present invention;

[0031] Figure 4 This is a three-dimensional structural diagram of the pre-film application component of the automatic pre-film application equipment according to an embodiment of the present invention. Figure 1 ;

[0032] Figure 5 This is a three-dimensional structural diagram of the pre-film application component of the automatic pre-film application equipment according to an embodiment of the present invention. Figure 2 ;

[0033] Figure 6 This is a three-dimensional structural diagram of the first or second pre-film application mechanism of the pre-film application assembly according to an embodiment of the present invention. Figure 1 ;

[0034] Figure 7 This is a three-dimensional structural diagram of the first or second pre-film application mechanism of the pre-film application assembly according to an embodiment of the present invention. Figure 2 ;

[0035] Figure 8 This is a three-dimensional structural diagram of the plate dispensing assembly of the automatic pre-applying film equipment according to an embodiment of the present invention;

[0036] Figure 9 This is a simplified flowchart illustrating the automatic pre-applying film method according to an embodiment of the present invention.

[0037] In the diagram: 10. Automatic pre-applying film equipment; 100. Frame; 200. Feeding assembly; 210. Feeding conveyor structure; 212. First conveyor frame; 214. Conveying roller structure; 220. Storage structure; 230. Board picking and placing structure; 232. Board picking and placing translation drive; 234. Board picking and placing lifting drive; 236. Board picking and placing suction frame; 300. Pre-applying film assembly; 301. First pre-applying film mechanism; 302. Second pre-applying film mechanism; 303. Film application gap; 310. Film application frame; 320. Film exit mechanism; 322. Film exit roll; 324. Film exit guide shaft; 326. Film exit limit shaft; 330. Film pulling and fixing suction plate mechanism; 332. U-shaped mounting frame; 333 334. Connecting shaft; 335. Connecting block; 336. Telescopic drive component; 337. Dry film adsorption positioning plate; 338. Adsorption plate body; 339. Dry film heating component; 300. First vacuum adsorption hole; 310. Connecting rod; 321. Film-applying suction block structure; 332. Arc-shaped adsorption block; 343. Second vacuum adsorption hole; 354. Dry film cutting structure; 355. Cutting guide rail frame; 356. Cutting blade; 357. Cutting drive component; 400. Plate ejection assembly; 410. Plate ejection conveying structure; 412. Second conveying frame; 414. Conveying roller structure; 420. Plate pulling mechanism; 422. Plate pulling guide rail; 424. Plate pulling frame; 426. Plate pulling drive component; 428. Plate pulling clamp. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] like Figures 1 to 2 As shown, this invention proposes an automatic pre-film application device 10, including a frame 100, and a board feeding assembly 200, a pre-film application assembly 300, and a board output assembly 400 sequentially arranged on the frame 100. The board feeding assembly 200 automatically picks up and transports the circuit board to be pre-filmed to the pre-film application assembly 300, while the pre-film application assembly 300 automatically transports the dry film to the film application position and automatically pre-applies the dry film to both sides of the circuit board. The board output assembly 400 assists the pre-film application assembly 300 in applying the film to the circuit board and outputting the board, and then transports the pre-filmed circuit board to the production platform of the vacuum laminator.

[0040] Specifically, the board feeding assembly 200 may include a board feeding conveying structure 210 and a board storage structure 220 arranged side by side on one side of the frame 100, and a board picking and placing structure 230 disposed above the board storage structure 220 and the board feeding conveying structure 210. Furthermore, the pre-applying film assembly 300 may include a first pre-applying film mechanism 301 and a second pre-applying film mechanism 302 disposed vertically and correspondingly in the middle of the frame 100, with a film application gap 303 between the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 corresponding to the board feeding conveying structure 210. Moreover, the board discharging assembly 400 may include a board discharging conveying structure 410 disposed on the other side of the frame 100, and a board pulling mechanism 420 disposed above the board discharging conveying structure 410, the board pulling mechanism 420 cooperating with both the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302.

[0041] The circuit board stored in the storage structure 220 can be automatically transferred to the board conveying structure 210 by the board picking and placing structure 230 of the board feeding assembly 200. The board conveying structure 210 can then automatically transport the circuit board to the film application gap 303 of the pre-film application assembly 300. The first pre-film application mechanism 301 and the second pre-film application mechanism 302 can then pre-apply film to both sides of the circuit board. During the pre-film application process, the board pulling mechanism 420 of the board output assembly 400 pulls the circuit board with the pre-applied dry film and sends the circuit board with dry film on both sides to the board output conveying structure 410. The board output conveying structure 410 then transports the circuit board with the pre-applied dry film to the next work station (i.e., the production platform of the vacuum laminator).

[0042] During this process, the automatic pre-applying film equipment 10 can automatically load and unload circuit boards, simultaneously pre-applying dry film to both the front and back of the circuit boards. This eliminates the need for manual pre-applying of dry film to one side of the circuit board, followed by manual flipping and pre-applying of dry film to the other side, and then manual transfer to the vacuum laminating machine's production platform for vacuum lamination. This significantly improves pre-applying efficiency, reduces the number of operators and saves manpower, and also reduces product wrinkles and dry film wrinkles caused by improper manual operation, thus ensuring product quality.

[0043] Furthermore, such as Figures 2 to 3 As shown, the board feeding assembly 200's board feeding conveying structure 210 may include a first conveying frame 212 mounted on the frame 100, and a conveying roller structure 214 mounted on the first conveying frame 212. The conveying direction of the conveying roller structure 214 corresponds to the film-applying gap 303 between the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302. The board storage structure 220 is located on the side of the conveying roller structure 214. Through the board picking and placing structure 230 above the board storage structure 220 and the board feeding conveying structure 210, the circuit boards to be applied stored on the board storage structure 220 can be picked up and transferred to the conveying roller structure 214, and the circuit boards can be conveyed to the film-applying gap 303 between the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 via the conveying roller structure 214.

[0044] Furthermore, the board conveying structure 210 may also include a circuit board cleaning roller structure disposed on the first conveyor frame 212. The circuit board cleaning roller structure may be located at the conveying end of the conveying roller structure 214. When the circuit board is conveyed to the film-applying gap 303, the surface of the circuit board is cleaned by the circuit board cleaning roller structure, and the circuit board is limited to ensure that the circuit board is aligned with the film-applying gap 303 during conveying, preventing deviation. In addition, the conveying roller structure 214 may be arranged to extend longitudinally along the frame 100, that is, to convey the circuit board along the longitudinal direction of the frame 100.

[0045] Furthermore, the storage structure 220 may include a storage rack disposed on the frame 100 and located on the side of the first conveyor rack 212. The storage rack can be used to store trays loaded with stacked circuit boards, or directly to store stacked circuit boards. The storage structure 220 may also include a circuit board lifting structure disposed on the storage rack, which can lift and transfer the trays or circuit boards. In addition, the storage rack may be provided with a limiting plate structure to limit the position of the trays or circuit boards from all sides. Furthermore, the storage rack and the first conveyor rack 212 may be arranged side-by-side laterally along the frame 100, such that the board feeding conveyor structure 210 and the storage structure 220 are arranged laterally side-by-side on the frame 100.

[0046] Furthermore, the board pick-and-place structure 230 may include a pick-and-place material translation drive 232 disposed transversely along the upper side of the frame 100, a pick-and-place material lifting drive 234 connected to the pick-and-place material translation drive 232, and a pick-and-place material suction rack 236 disposed on the pick-and-place material lifting drive 234. The pick-and-place material translation drive 232 is transversely disposed between the board storage structure 220 and the conveying roller structure 214, and can perform translational drive on the pick-and-place material suction rack 236 between the two; the pick-and-place material lifting drive 234 can drive the pick-and-place material suction rack 236 to move closer to or further away from the board storage structure 220 or the conveying roller structure 214, facilitating the picking or placing of circuit boards by the pick-and-place material suction rack 236. In addition, the board pick-and-place structure 230 may also include a material vision positioning structure disposed on the frame 100 or the pick-and-place material lifting drive 234, which can detect and position the circuit boards, facilitating accurate picking and placing of the circuit boards.

[0047] Furthermore, the material handling translation drive 232 may include a first motor linear drive module horizontally mounted on the frame 100, and the material handling lifting drive 234 may include a second motor linear drive module vertically mounted on the first motor linear drive module. Moreover, the material handling adsorption rack 236 may include an adsorption frame connected to the second motor linear drive module, a telescopic drive 335 on each side of the adsorption frame, an adsorption plate on each telescopic drive 335, and multiple vacuum nozzles on each adsorption plate. The two adsorption plates may be arranged side-by-side. The multiple vacuum nozzles on the two adsorption plates allow for the adsorption or release of the circuit board from both sides, and the telescopic drive 335 allows for further lifting and lowering of the adsorption plates, enabling fine adjustment of the adsorption height.

[0048] In addition, such as Figures 4 to 7 As shown, the first pre-film application mechanism 301 and the second pre-film application mechanism 302 of the pre-film application assembly 300 may each include a film application frame 310 provided on the frame 100, a film dispensing mechanism 320 provided on the film application frame 310, a film pulling and fixing suction plate mechanism 330 corresponding to the film dispensing mechanism 320, a film application suction block structure 340 corresponding to the film pulling and fixing suction plate mechanism 330, a dry film cutting structure 350 corresponding to the film application suction block structure 340, and a material feeding and discharging sensor provided at the film application gap 303. A film application gap 303 is formed between the two film application suction block structures 340.

[0049] The film dispensing mechanism 320 supplies dry film to be applied to the surface of the circuit board at the film application gap 303. The film application suction block structure 340 located at the film application gap 303 positions and pulls the dry film, causing the dry film on the film dispensing mechanism 320 to move towards the film application gap 303 under the guidance of the film application suction block structure 340. The film pulling and fixing suction plate mechanism 330 pulls the dry film on the film dispensing mechanism 320 out and can also stick the dry film that has moved to the film application gap 303 onto the circuit board that has been conveyed to the film application gap 303, so as to fix the end of the dry film to the surface of the circuit board. Moreover, after the dry film is pre-applied to the surface of a circuit board, the dry film can be cut by the dry film cutting structure 350 to facilitate the conveying of the circuit board with the dry film applied to the next station, and also to facilitate the application of dry film to another circuit board.

[0050] The material feeding and discharging sensors can be used to detect and sense the circuit board. When one side of the circuit board enters the film-applying gap 303, and the material feeding and discharging sensors detect the circuit board, the film pulling and fixing suction plate mechanism 330 can pull the dry film on the film discharging mechanism 320 to discharge it. At the same time, the film pulling and fixing suction plate mechanism 330 can stick and fix the end of the dry film, which has been guided to the film-applying gap 303 by the film-applying suction block structure 340, to the edge of the circuit board surface. Fixing the end of the dry film to the circuit board facilitates the pre-applying of the dry film to the entire surface of the circuit board. Moreover, the board-applying assembly 400 can pull the circuit board with the applied dry film to the board-applying conveying structure 410 through the board pulling mechanism 420. During the process of continuously pulling the circuit board out of the film-applying gap 303, the film-applying suction block structure 340 can continuously guide and squeeze the dry film onto the surface of the circuit board. When the material feed sensor detects that the circuit board has been completely pulled out of the film-coating gap 303 (i.e., the other side of the circuit board leaves the film-coating gap 303), the dry film at the end of the circuit board can be cut by the dry film cutting structure 350.

[0051] Specifically, the first pre-applying mechanism 301 of the pre-applying film assembly 300 may include a first film applicator 310 disposed on the upper side of the frame 100, a first film dispensing mechanism 320 disposed on the first film applicator 310, a first film pulling and fixing suction plate mechanism 330 corresponding to the first film dispensing mechanism 320, a first film applicator suction block structure 340 corresponding to the first film pulling and fixing suction plate mechanism 330, a first dry film cutting structure 350 corresponding to the first film applicator suction block structure 340, and a first feed / discharge sensor disposed at the film applicator gap 303. Moreover, the first film dispensing mechanism 320 may be disposed on the top of the first film applicator 310, the first film applicator suction block structure 340 may be disposed on the bottom of the first film applicator 310, the first film pulling and fixing suction plate mechanism 330 may be disposed between the first film dispensing mechanism 320 and the first film applicator suction block structure 340, and the first dry film cutting structure 350 may be correspondingly disposed on the side of the first film applicator suction block structure 340. Dry film can be supplied from the first film dispensing mechanism 320 at the top to the first film applicator 310 at the bottom, and the dry film can be pulled towards the first film applicator 310 by the first film pulling and fixing suction plate mechanism 330 in the middle.

[0052] Furthermore, the second pre-applying film mechanism 302 may include a second film applicator 310 disposed on the lower side of the frame 100, a second film dispensing mechanism 320 disposed on the second film applicator 310, a second film pulling and fixing suction plate mechanism 330 corresponding to the second film dispensing mechanism 320, a second film applicator suction block structure 340 corresponding to the second film pulling and fixing suction plate mechanism 330, a second dry film cutting structure 350 corresponding to the second film applicator suction block structure 340, and a second feed / discharge sensor disposed at the film applicator gap 303. The aforementioned film applicator gap 303 is formed between the first film applicator suction block structure 340 and the second film applicator suction block structure 340. Correspondingly, the second film dispensing mechanism 320 can be located at the bottom of the second film applicator 310, the second film applicator suction block structure 340 can be located at the top of the second film applicator 310, the second film pulling and fixing suction plate mechanism 330 can be located between the second film dispensing mechanism 320 and the second film applicator suction block structure 340, and the second dry film cutting structure 350 can be located on the side of the second film applicator suction block structure 340. Dry film can be supplied from the second film dispensing mechanism 320 at the bottom to the second film applicator 310 at the top, and the dry film can be pulled towards the second film applicator 310 by the second film pulling and fixing suction plate mechanism 330 in the middle.

[0053] In this embodiment, the first film-applying frame 310 and the second film-applying frame 310 can be integrated; the first infeed / outfeed sensor and the second infeed / outfeed sensor can be the same infeed / outfeed sensor, so that the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 can be controlled by the same infeed / outfeed sensor. Moreover, the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 can be symmetrically arranged on the frame 100, which facilitates simultaneous pre-applying of dry film to the front and back of the circuit board, and makes the dry film application neater and more reliable.

[0054] Furthermore, the film applicator 310 (i.e., the first film applicator 310 or the second film applicator 310) may include a first side frame plate and a second side frame plate arranged side by side and opposite to each other on the frame 100. The film dispensing mechanism 320, the film pulling and fixing suction plate mechanism 330, the film applicator suction block structure 340, and the dry film cutting structure 350 may all be arranged between the first side frame plate and the second side frame plate. Moreover, the film dispensing mechanism 320 may include a film dispensing roll 322 rotatably arranged between the first side frame plate and the second side frame plate, a plurality of film dispensing guide shafts 324 rotatably arranged between the first side frame plate and the second side frame plate, and a film dispensing limiting shaft 326 rotatably arranged between the first side frame plate and the second side frame plate. The film dispensing limiting shaft 326 may be arranged close to the film pulling and fixing suction plate mechanism 330.

[0055] Furthermore, the film delivery roll 322 can be detachably installed between the first side frame plate and the second side frame plate for threading the dry film roll; the film delivery guide shaft 324 and the film delivery limiting shaft 326 are used to tension the dry film and guide it towards the film-applying suction block structure 340. Moreover, the film delivery roll 322 and the film delivery limiting shaft 326 can be located on one side of the film-applying frame 310 (the side closer to the film-pulling and film-fixing suction plate mechanism 330), and multiple film delivery guide shafts 324 can be located on the other side of the film-applying frame 310 (the side away from the film-pulling and film-fixing suction plate mechanism 330); moreover, the film delivery roll 322 and the film delivery limiting shaft 326 can be located at the upper and lower parts of the film-applying frame 310 respectively, while multiple film delivery guide shafts 324 can be located in the middle of the film-applying frame 310, which is more conducive to tensioning the dry film so that the material can be delivered more smoothly. Furthermore, two film delivery rollers 322 can be provided, with the two rollers 322 correspondingly and movably engaged between the first and second side frame plates, facilitating the installation and replacement of dry film rolls. The lower film delivery roller 322 can be used to hold the dry film roll, while the upper film delivery roller 322 can be used to limit and guide the dry film. In addition, the film delivery guide shaft 324 is positioned close to the film pulling and fixing suction plate mechanism 330, facilitating the limiting of the dry film between the two, bringing the dry film close to the film pulling and fixing suction plate mechanism 330, and facilitating the adsorption, positioning, and pulling out of the dry film.

[0056] In addition, the film-stretching and film-fixing suction plate mechanism 330 may include a U-shaped mounting frame rotatably disposed between the first side frame plate and the second side frame plate of the film-applying frame 310, a connecting shaft 333 rotatably disposed between the two side plates of the U-shaped mounting frame, a connecting block 334 on each side of the connecting shaft 333, a telescopic drive member 335 on each side plate of the U-shaped mounting frame, a dry film adsorption positioning plate 336 connected to the ends of the two telescopic drive members 335, and a connecting rod 337 at each end of the dry film adsorption positioning plate 336, with the two connecting rods 337 respectively movably passing through the two connecting blocks 334. When the dry film adsorption positioning plate 336 is moved telescopically from both ends by two telescopic drive members 335, the two connecting rods 337 connected to the dry film adsorption positioning plate 336 will move telescopically along the two connecting blocks 334, which can guide and limit the dry film adsorption positioning plate 336. At the same time, under the action of the telescopic drive members 335, the connecting blocks 334, connecting rods 337, and the dry film adsorption positioning plate 336 as a whole will swing around the connecting shaft 333. In addition, the telescopic drive member 335 can be configured as a telescopic drive cylinder.

[0057] The dry film adsorption positioning plate 336 can be moved telescopically by the telescopic drive 335, moving it to the side of the film-applying suction block structure 340. This allows the dry film adsorption positioning plate 336 to move to the film-applying gap 303, corresponding to the edge of the circuit board conveyed to the film-applying gap 303. This facilitates the adhesion of the end of the dry film adsorbed and positioned by the film-applying suction block structure 340 to the edge of the circuit board via the dry film adsorption positioning plate 336. Furthermore, when the dry film adsorption positioning plate 336 moves closer to the film-applying suction block structure 340 under the drive of the telescopic drive 335, it can not only move linearly but also rotate at a preset angle, bringing the side of the dry film adsorption positioning plate 336 closer to the dry film. This facilitates the adsorption of the dry film, allowing the dry film adsorption positioning plate 336 to move together with the film-applying suction block structure 340 for easy and convenient pulling and unloading of the dry film.

[0058] Furthermore, the dry film adsorption positioning plate 336 may include an adsorption plate body 3362 connected to the telescopic drive member 335 and the connecting rod 337, and a dry film heating member 3364 disposed at the bottom or top of the adsorption plate body 3362. The side of the adsorption plate body 3362 is provided with a plurality of first vacuum adsorption holes 3366 for adsorbing the dry film supplied by the film dispensing mechanism 320. The dry film heating member 3364 is used to press the dry film onto the circuit board. Moreover, the film dispensing limiting shaft 326 of the film dispensing mechanism 320 may be arranged side by side with the connecting shaft 333 to form a positioning gap between them. This positioning gap corresponds to the side of the adsorption plate body 3362 where the plurality of first vacuum adsorption holes 3366 are provided. The dry film drawn out by the film delivery mechanism 320 through the film delivery roll 322 and the film delivery guide shaft 324 can be guided to the positioning gap between the film delivery limiting shaft 326 and the connecting shaft 333, so that when the dry film is near the side of the adsorption plate 3362 of the dry film adsorption positioning plate 336, it is guided to the film application gap 303 at the film application block structure 340.

[0059] Before the dry film is pulled and positioned by the dry film adsorption positioning plate 336, the dry film can be adsorbed and positioned by the multiple first vacuum adsorption holes 3366 on the side of the adsorption plate body 3362 of the dry film adsorption positioning plate 336. When the adsorption plate body 3362 is driven to move towards the film-attaching suction block structure 340 by the telescopic drive member 335, the dry film can be pulled out towards the film-attaching suction block structure 340. Furthermore, the dry film heating element 3364 at the bottom or top of the adsorption plate 3362 of the dry film adsorption positioning plate 336 allows the adsorption plate 3362 to be driven close to the film-applying gap 303 at the film-applying block structure 340. This allows the dry film heating element 3364 on the adsorption plate 3362 to abut against the end of the dry film located at the film-applying gap 303, thermally bonding the end of the dry film to the edge of the circuit board surface at the film-applying gap 303. This fixes the end of the dry film to the edge of the circuit board surface, facilitating subsequent complete application of the dry film to the entire surface of the circuit board. Additionally, after the dry film is positioned and pulled out using the dry film adsorption positioning plate 336, its adsorption and positioning of the dry film can be released.

[0060] Furthermore, the film-applying suction block structure 340 may include an arc-shaped suction block 342 rotatably disposed between the first side plate and the second side plate of the film-applying frame 310. The arc-shaped suction block 342 has multiple second vacuum suction holes 344 on its arc-shaped surface for adsorbing the dry film supplied by the film-exit mechanism 320 and the film-pulling and fixing suction plate mechanism 330. A film-applying gap 303 is formed between two arc-shaped suction blocks 342. The arc-shaped surface of the arc-shaped suction block 342 may extend from the adsorption side of the adsorption plate body 3362 of the dry film adsorption positioning plate 336 towards the film-applying gap 303, facilitating the adsorption and positioning of the dry film guided by the film-exit mechanism 320 and the film-pulling and fixing suction plate mechanism 330 through the multiple second vacuum suction holes 344 on the arc-shaped suction block 342. This allows the end of the dry film to be positioned at the film-applying gap 303, facilitating its alignment with the circuit board delivered to the film-applying gap 303.

[0061] Furthermore, by rotating the arc-shaped adsorption block 342, when guiding the dry film, the arc-shaped surface of the arc-shaped adsorption block 342 can rotate towards the film pulling and fixing suction plate mechanism 330. This not only increases the film-applying gap 303 between the two film-applying suction block structures 340, facilitating the film-applying gap 303 at the end of the dry film, but also allows the arc-shaped surface of the arc-shaped adsorption block 342 to approach and parallel the adsorption side of the adsorption plate body 3362 of the dry film adsorption positioning plate 336, making it easier to adsorb and position the dry film pulled out by the dry film adsorption positioning plate 336. Moreover, when the dry film is laid on the circuit board at the film-applying gap 303, the adsorption and positioning of the dry film can be released, and the arc-shaped adsorption block 342 can be rotated so that its arc-shaped surface approaches the surface of the circuit board in the film-applying gap 303, which can better squeeze and adhere the dry film to the surface of the circuit board. Furthermore, a separate rotary drive can be provided to rotate the arc-shaped adsorption block 342; alternatively, the pulling force of the pulling plate mechanism 420 can be used to cause the arc-shaped adsorption block 342 to rotate under the tension of the dry film during the process of stretching and applying the dry film to the circuit board, thereby clamping the circuit board at the film application gap 303. In addition, an arc-shaped guide baffle can be provided on the outer side of the arc-shaped surface of the arc-shaped adsorption block 342, forming a guide gap between the arc-shaped adsorption block 342 and the guide baffle, so that the dry film can be smoothly applied and positioned on the arc-shaped surface of the arc-shaped adsorption block 342 through the guide gap, thereby guiding the end of the dry film to the film application gap 303.

[0062] Furthermore, the dry film cutting structure 350 may include a cutting guide rail 352 disposed between the first and second side plates of the film application frame 310 and corresponding to the film application suction block structure 340, a cutting blade 354 slidably disposed on the cutting guide rail 352, and a cutting drive member 356 connected to the cutting blade 354. The cutting drive member 356 is used to drive the cutting blade 354 to move along the cutting guide rail 352. When the circuit board located at the film application gap 303 is pulled out by the plate pulling mechanism 420, the arc-shaped suction block 342 continuously guides and squeezes the dry film onto the circuit board. When the film application is completed on the entire surface of the circuit board, the cutting blade 354 can be driven to move by the dry film cutting structure 350, so that the cutting blade 354 cuts the dry film guided by the film application suction block structure 340 to the film application gap 303, which facilitates the completion of the circuit board after film application.

[0063] Furthermore, the side of the intermediate connecting plate of the U-shaped mounting bracket of the film-stretching and film-fixing suction plate mechanism 330 can also be provided with multiple third vacuum adsorption holes. This intermediate connecting plate can be located between the arc-shaped adsorption block 342 of the film-attaching suction block structure 340 and the dry film adsorption positioning plate 336 of the film-stretching and film-fixing suction plate mechanism 330. When the dry film is cut by the cutting blade 354, the dry film can be adsorbed and positioned through the multiple third vacuum adsorption holes on the intermediate connecting plate. After the dry film is cut, the adsorption and positioning of the dry film can be released, and the dry film can be adsorbed and positioned again by the arc-shaped adsorption block 342 of the film-attaching suction block structure 340, which facilitates the re-guiding of the dry film to the film-attaching gap 303. Furthermore, a cutting gap is formed between the cutting guide rail 352 and the side of the intermediate connecting plate of the U-shaped mounting bracket. When the dry film is not being cut, it can be limited and guided, allowing the dry film to be smoothly guided and adsorbed onto the arc-shaped adsorption block 342 through the cutting gap. When the dry film is being cut, the intermediate connecting plate of the U-shaped mounting bracket can limit the dry film and prevent it from shifting during cutting. In addition, a cutting groove can be provided on the side of the intermediate connecting plate of the U-shaped mounting bracket to cooperate with the cutting blade 354.

[0064] In addition, such as Figure 2 and Figure 8As shown, the board conveying structure 410 may include a second conveyor frame 412 mounted on the frame 100, a conveyor roller structure 414 mounted on the second conveyor frame 412, and a first limiting roller and a second limiting roller located at both ends of the second conveyor frame 412 and above the conveyor roller structure 414. The conveying direction of the conveyor roller structure 414 is opposite to the film-applying gap 303 (meaning the direction away from the film-applying gap 303). The board pulling mechanism 420 is slidably mounted on the second conveyor frame 412 and spans across the top of the conveyor roller structure 414. The circuit board with dry film applied, pulled out from the film-applying gap 303 by the board pulling mechanism 420, can be moved onto the conveyor roller structure 414 and conveyed to the vacuum laminator for lamination. Moreover, when conveying the circuit board through the conveyor roller structure 414, the first limiting roller and the second limiting roller can limit the circuit board to keep it straight during the conveying process.

[0065] Furthermore, the plate pulling mechanism 420 may include plate pulling guide rails 422 disposed on both sides of the plate conveying structure 410, plate pulling frame 424 slidably disposed on the plate pulling guide rails 422 on both sides, plate pulling drive member 426 disposed on the frame 100 and connected to the plate pulling frame 424, and a plurality of plate pulling clamps 428 protruding from one side of the plate pulling frame 424. The plate pulling clamps 428 are arranged in a corresponding manner to the film application gap 303. The plate pulling drive member 426 is used to drive the plate pulling frame 424 and the plate pulling clamps 428 thereon to move closer to or away from the film application gap 303.

[0066] When the circuit board is conveyed to the film-coating gap 303 by the board feeding conveyor structure 210, and the dry film end is bonded to the edge of the circuit board surface by the film pulling and fixing suction plate mechanism 330, the multiple pulling plate clamps 428 on the pulling plate frame 424 can be moved to the film-coating gap 303 by the pulling plate driving member 426 of the pulling plate mechanism 420. The multiple pulling plate clamps 428 arranged side by side simultaneously hold the edges (starting ends) of the front and back sides of the circuit board, as well as the ends of the dry film bonded to the edges of both sides. Then, the multiple pulling plate clamps 428 on the pulling plate frame 424 can be moved to the conveying roller structure 414 in a direction away from the film-coating gap 303 by the pulling plate driving member 426, so that the circuit board and dry film can be gradually pulled out of the film-coating gap 303. When the circuit board and dry film are pulled out by the plate pulling mechanism 420, the arc-shaped suction blocks 342 of the film-applying suction block structure 340 on both sides of the film-applying gap 303 can continuously squeeze and pre-apply the dry film to the two surfaces of the circuit board. Moreover, the plate pulling drive 426 can be set as a linear motor drive module. In addition, the plate pulling mechanism 420 may include multiple clamp lifting drive components provided on the plate pulling frame 424. The multiple clamp lifting drive components are connected one-to-one with multiple plate pulling clamps 428 to drive the plate pulling clamps 428 to move up and down so as to clamp and place the circuit board on the board feeding conveyor structure 210.

[0067] The automatic pre-applying film equipment 10 provided by this invention can automatically pick up and convey boards, eliminating the need for manual operation during production. It allows for simultaneous pre-applying of dry film to both sides of the product and can cut the dry film to the appropriate size, improving equipment uptime and reducing the number of defective products caused by manual operation. Previously, one person operated one machine; now, multiple machines can be operated simultaneously, saving manpower. A separate cutting device is unnecessary, eliminating the need for such equipment and further saving manpower. It also reduces the defect rate caused by manual film application.

[0068] Furthermore, the present invention also proposes an automatic pre-applying film method, applied to the automatic pre-applying film device 10 described above. Specifically, as... Figure 9 As shown, the automatic pre-applied film method may include the following steps:

[0069] S100, the board picking and placing structure 230 of the board feeding assembly 200 picks up the circuit board from the board storage structure 220 and transfers the circuit board to the board feeding conveying structure 210 on the side of the board storage structure 220, and controls the board feeding conveying structure 210 to convey the circuit board to the film application gap 303 of the pre-film application assembly 300.

[0070] S200, the first pre-filming mechanism 301 and the second pre-filming mechanism 302 of the control pre-filming assembly 300 respectively pre-feed two dry films to the filming gap 303. When the circuit board is detected to be fed to the filming gap 303, the first pre-filming mechanism 301 and the second pre-filming mechanism 302 respectively apply the two dry films to the starting ends of the two sides of the circuit board.

[0071] S300, the plate pulling mechanism 420 of the control board output assembly 400 clamps and pulls the circuit board located at the film-applying gap 303 and the dry film at the starting end applied to both sides of the circuit board, and controls the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 to continuously apply two dry films to the two sides of the circuit board passing through the film-applying gap 303.

[0072] S400. When it is detected that the end of the circuit board leaves the film-applying gap 303, the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 are controlled to cut the dry film on both sides of the circuit board from the end of the circuit board, and the board-pulling mechanism 420 is controlled to place the circuit board with pre-applying film on both sides onto the board-out conveying structure 410, and the board-out conveying structure 410 is controlled to convey the circuit board with pre-applying film on both sides to the next station.

[0073] The automatic pre-applying film method provided by this invention can control the board feeding assembly 200 to automatically convey the circuit board to be pre-applied film to the pre-applying film assembly 300 to the film application gap 303 between the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 of the pre-applying film assembly 300. It can also control the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 of the pre-applying film assembly 300 to automatically pre-apply film from the front and back sides of the circuit board at the same time. Furthermore, it can control the board output assembly 400's pulling mechanism 420 to pull and discharge the circuit board and the dry film pre-applied on both sides of the circuit board. This can automatically and completely pre-apply the dry film to the front and back sides of the circuit board, and can automatically convey the circuit board after pre-applying film to the vacuum laminator (i.e., the next station).

[0074] Further, in step S100, controlling the board feeding assembly 200's board picking and placing structure 230 to retrieve the circuit board from the storage structure 220 and transfer the circuit board to the board feeding conveying structure 210 on the side of the storage structure 220, and controlling the board feeding conveying structure 210 to convey the circuit board towards the film application gap 303 of the pre-film application assembly 300, may further include the following steps:

[0075] S110. Multiple circuit boards to be laminated are stacked in the storage rack of the storage structure 220 or placed in the tray on the storage rack. The board feeding assembly 200 controls the board picking and placing structure 230 to drive the board picking and placing suction rack 236 to move laterally to directly above the circuit boards on the storage rack. The board picking and placing structure 230 controls the board picking and placing structure 230 to descend to near the top of the circuit boards on the storage rack. The board picking and placing structure 230 controls the board picking and placing structure 230 to pick up and grab the circuit boards on the storage rack.

[0076] S120: The picking and placing lifting drive 234 of the board picking and placing structure 230 drives the picking and placing suction frame 236 and the circuit board it grips to rise to a preset height position directly above the circuit board on the storage rack. The picking and placing translation drive 232 drives the picking and placing suction frame 236 and the circuit board it grips to move laterally to directly above the conveying roller structure 214 of the board feeding conveying structure 210. The picking and placing lifting drive 234 drives the picking and placing suction frame 236 and the circuit board it grips to descend to a position close to the surface of the conveying roller structure 214. The picking and placing suction frame 236 places the gripped circuit board on the conveying roller structure 214. Then, the board picking and placing structure 230 can be reset to control it to pick up and transfer the next circuit board.

[0077] S130, the conveying roller structure 214 of the control board conveying structure 210 conveys the circuit board located thereon to the film application gap 303 between the first pre-film application mechanism 301 and the second pre-film application mechanism 302 of the pre-film application assembly 300; and during the conveying process, the circuit board cleaning roller structure at the conveying end of the conveying roller structure 214 can be controlled to clean the front and back of the circuit board.

[0078] Furthermore, in step S200, the first pre-applying mechanism 301 and the second pre-applying mechanism 302 of the pre-applying film assembly 300 respectively pre-feed two dry films to the film application gap 303, which may further include the following steps:

[0079] S210. Two rolls of dry film are placed on the film output shaft 322 of the film output mechanism 320 of the first pre-filming mechanism 301 and the film output shaft 322 of the second pre-filming mechanism 302, respectively. The dry film of the rolls on the film output shaft 322 is guided to the arc surface of the arc-shaped adsorption block 342 of the corresponding film-applying suction block structure 340 by the film output guide shaft 324 and the film output limiting shaft 326 of the film output mechanism 320 of each pre-filming mechanism.

[0080] S220, the multiple second vacuum adsorption holes 344 on the arc-shaped adsorption block 342 of the control film-applying suction block structure 340 adsorb and position the ends of the dry film, and position the ends of the dry film of the two rolls of dry film at the film-applying gap 303 between the arc-shaped adsorption blocks 342 of the two film-applying suction block structures 340 respectively.

[0081] Furthermore, in step S200, when the circuit board is detected to be conveyed to the film-applying gap 303, the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 are controlled to apply two dry films to the starting ends of the two sides of the circuit board, which may further include the following steps:

[0082] S230. When the conveying roller structure 214 of the control board conveying structure 210 conveys the circuit board to the film application gap 303 of the pre-film application assembly 300, the circuit board is detected by the material inlet / outlet sensor provided at the film application gap 303.

[0083] S240. When the material feeding and discharging sensor detects that one end of the circuit board has entered the film-applying gap 303, the film-pulling and film-fixing suction plate mechanism 330 of the first pre-applying film mechanism 301 and the film-pulling and film-fixing suction plate mechanism 330 of the second pre-applying film mechanism 302 are controlled to attach the ends of the dry film positioned on the arc-shaped suction blocks 342 of the corresponding film-applying suction block structure 340 to the starting end of the front side of the circuit board (i.e., the side edge of the front side of the circuit board that initially enters the film-applying gap 303) and the starting end of the back side (i.e., the side edge of the back side of the circuit board that initially enters the film-applying gap 303) respectively.

[0084] Furthermore, in step S240, controlling the film pulling and fixing suction plate mechanism 330 of the first pre-film application mechanism 301 and the film pulling and fixing suction plate mechanism 330 of the second pre-film application mechanism 302 to adhere the ends of the dry film positioned on the arc-shaped suction blocks 342 of the corresponding film application suction block structure 340 to the starting ends of the front and back sides of the circuit board, respectively, may further include the following steps:

[0085] S242, Multiple first vacuum adsorption holes 3366 on the side of the adsorption plate body 3362 of the dry film adsorption positioning plate 336 of the film pulling and fixing suction plate mechanism 330 of the first pre-film applying mechanism 301 and the second pre-film applying mechanism 302 adsorb and position the dry film portion located between the film applying suction block structure 340 and the film discharging mechanism 320 of the first pre-film applying mechanism 301 and the second pre-film applying mechanism 302 respectively.

[0086] S244. The telescopic drive 335 of the film stretching and fixing suction plate machine, which controls the first pre-film application mechanism 301 and the second pre-film application mechanism 302 respectively, drives the dry film adsorption positioning plate 336, which is rotatably mounted on the U-shaped mounting frame, to extend and rotate, so that the dry film adsorption positioning plate 336 moves to the side of the film application suction block structure 340, so that the dry film adsorption positioning plate 336 corresponds to the starting end of the circuit board, and pulls the dry film roll on the film output roll 322 of the film output mechanism 320 to output the material.

[0087] S246, The dry film heating element 3364 on the dry film adsorption positioning plate 336 heats the ends of the dry film adsorbed and positioned by the film adsorption block structure 340, so that the ends of the two dry films are respectively bonded to the starting end on the front side and the starting end on the back side of the circuit board.

[0088] S248. Control the adsorption plate 3362 of the dry film adsorption positioning plate 336 of the first pre-film application mechanism 301 and the second pre-film application mechanism 302 to release the adsorption positioning of the dry film, and control the first pre-film application mechanism 301 and the second pre-film application mechanism 302 to reset.

[0089] Furthermore, in step S300, the control of the board-out assembly 400's pulling mechanism 420 to clamp and pull the circuit board located at the film-applying gap 303 and the dry film applied to its two sides, and the control of the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 to continuously apply two dry films to the two sides of the circuit board passing through the film-applying gap 303, may further include the following steps:

[0090] S310, the plate pulling mechanism 420 of the pre-controlled plate feeding assembly 400 drives the plate pulling frame 424 and its multiple plate pulling clamps 428 to move to the outlet side of the film application gap 303.

[0091] S320. After the starting ends of the front and back sides of the circuit board located at the film-applying gap 303 have completed the application of the dry film, the multiple pull plate clamps 428 of the control pull plate mechanism 420 simultaneously clamp the starting end of the circuit board and the dry film on both sides from different positions, and control the arc-shaped adsorption blocks 342 of the two film-applying suction block structures 340 to release the adsorption and positioning of the dry film.

[0092] S330, the pull plate drive 426 of the control pull plate mechanism 420 drives the pull plate frame 424 and its multiple pull plate clamps 428 to pull away from the exit side of the film-applying gap 303, so that the dry film that is pressed against the arc-shaped adsorption block 342 of the two film-applying suction block structures 340 respectively drives the corresponding arc-shaped adsorption block 342 to rotate, so that the arc-shaped adsorption block 342 continuously squeezes and presses the corresponding dry film onto the two sides (front and back) of the circuit board passing through the film-applying gap 303.

[0093] Furthermore, in step S400, when it is detected that the end of the circuit board leaves the film-applying gap 303, controlling the first pre-applying film mechanism 301 and the second pre-applying film mechanism 302 to cut the dry film adhered to both sides of the circuit board from the end of the circuit board may further include the following steps:

[0094] S410. When the material feeding and discharging sensor detects that the other end (i.e. the end) of the circuit board leaves the film-attaching gap 303, the pull plate driving component 426 of the pull plate mechanism 420 stops working, and controls multiple third vacuum adsorption holes on the side of the middle connecting plate of the U-shaped mounting bracket of the two film-attaching and film-fixing suction plate mechanisms 330 to adsorb and position the dry film.

[0095] S420, the dry film cutting structure 350, which controls the first pre-film application mechanism 301 and the second pre-film application mechanism 302 respectively, cuts the dry film on both sides of the circuit board and cuts the dry film attached to both sides of the circuit board from the end of the circuit board.

[0096] Furthermore, step S420 above may further include the following steps:

[0097] S422, the cutting drive 356 of the dry film cutting structure 350 of the first pre-film application mechanism 301 and the second pre-film application mechanism 302 respectively drives the cutting blade 354 to slide along the cutting guide frame 352 corresponding to the film application suction block structure 340, so that the cutting blade 354 cuts the dry film adsorbed and positioned on the side of the middle connecting plate of the U-shaped mounting frame, and cuts the dry film adhering to both sides of the circuit board from the end of the circuit board.

[0098] S424, control the pulling plate mechanism 420 to pull the circuit board with the cut dry film to the preset position of the pulling plate mechanism 420, and release the adsorption and positioning of the dry film by the side of the middle connecting plate of the U-shaped mounting bracket. At the same time, control the multiple second vacuum adsorption holes 344 on the arc surface of the arc adsorption block 342 of the film adsorption block structure 340 to adsorb and position the dry film so that the end of the dry film is located at the film adsorption gap 303 again.

[0099] Furthermore, in step S400, controlling the plate pulling mechanism 420 to place the circuit board with pre-applied film on both sides onto the board delivery conveying structure 410, and controlling the board delivery conveying structure 410 to transport the circuit board with pre-applied film on both sides to the next station, may further include the following steps:

[0100] S430, the multiple plate-pulling clamps 428 of the control plate-pulling mechanism 420 simultaneously release the clamps on the pre-filmed circuit board, so that the pre-filmed circuit board falls onto the conveying roller structure 414 of the board output conveying structure 410; the control conveying roller structure 414 conveys the pre-filmed circuit board to the next station, so that the pre-filmed circuit board reaches the vacuum laminator.

[0101] Furthermore, the automatic pre-applying film device 10 described above may include a controller connected to the board feeding assembly 200, the pre-applying film assembly 300, and the board output assembly 400, for controlling the automatic pre-applying film device 10 to implement the above-described automatic pre-applying film method.

[0102] Furthermore, the present invention also proposes an automatic pre-applying film system, applied to an automatic pre-applying film device 10. Specifically, the automatic pre-applying film system may include:

[0103] The board feeding control module is used to control the board picking and placing structure 230 of the board feeding assembly 200 to pick up the circuit board from the storage structure 220, and to transfer the circuit board to the board feeding conveying structure 210 on the side of the storage structure 220, and to control the board feeding conveying structure 210 to convey the circuit board to the film application gap 303 of the pre-film application assembly 300.

[0104] The circuit board film application control module is used to control the first pre-film application mechanism 301 and the second pre-film application mechanism 302 of the pre-film application assembly 300 to pre-feed two dry films to the film application gap 303. When the circuit board is detected to be fed to the film application gap 303, the module controls the first pre-film application mechanism 301 and the second pre-film application mechanism 302 to apply the two dry films to the starting ends of the two sides of the circuit board.

[0105] The plate pulling control module is used to control the plate pulling mechanism 420 of the plate output assembly 400 to clamp and pull the circuit board located at the film bonding gap 303 and the dry film attached to the starting end on both sides of the circuit board, and to control the first pre-film bonding mechanism 301 and the second pre-film bonding mechanism 302 to continuously attach two dry films to the two sides of the circuit board passing through the film bonding gap 303.

[0106] The board ejection control module is used to control the first pre-filming mechanism 301 and the second pre-filming mechanism 302 to cut the dry film adhered to both sides of the circuit board from the end of the circuit board when the end of the circuit board is detected to leave the film-applying gap 303. It also controls the board pulling mechanism 420 to place the circuit board with pre-film applied on both sides onto the board ejection conveying structure 410, and controls the board ejection conveying structure 410 to convey the circuit board with pre-film applied on both sides to the next station.

[0107] The automatic pre-applying film system described in this embodiment corresponds to the automatic pre-applying film method described above. The functions of each module in the automatic pre-applying film system in this embodiment are described in detail in the corresponding method embodiments, and will not be repeated here.

[0108] Based on the same inventive concept, embodiments of this application also provide a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements all or part of the method steps in the above-described automatic pre-applying film method.

[0109] Based on the same inventive concept, this application also provides an electronic device, including a memory and a processor. The memory stores a computer program that runs on the processor. When the processor executes the computer program, it implements all or part of the method steps in the above-described automatic pre-applying film method.

[0110] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0111] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features of the invention herein.

Claims

1. An automatic pre-applying film device, characterized in that, include: frame; The board feeding assembly includes a board feeding conveying structure and a board storage structure arranged side by side on one side of the frame, and a board picking and placing structure disposed above the board storage structure and the board feeding conveying structure. The pre-applied film assembly includes a first pre-applied film mechanism and a second pre-applied film mechanism, which are respectively disposed on the middle part of the frame. The first pre-applied film mechanism and the second pre-applied film mechanism have a film application gap corresponding to the feed conveyor structure. Both the first pre-applied film mechanism and the second pre-applied film mechanism include a film application frame disposed on the frame, a film dispensing mechanism disposed on the film application frame, a film pulling and fixing suction plate mechanism corresponding to the film dispensing mechanism, and a film application suction block structure corresponding to the film pulling and fixing suction plate mechanism. The film-pulling and film-fixing suction plate mechanism includes a U-shaped mounting frame rotatably mounted on the film-applying frame, a connecting shaft rotatably mounted between the two side plates of the U-shaped mounting frame, a connecting block on each side of the connecting shaft, a telescopic drive member on each side plate of the U-shaped mounting frame, a dry film adsorption positioning plate connected to the ends of the two telescopic drive members, and a connecting rod at each end of the dry film adsorption positioning plate. The two connecting rods are respectively movably inserted into the two connecting blocks. The dry film adsorption positioning plate includes an adsorption plate body connected to the telescopic drive member and the connecting rod, and a dry film heating member located at the bottom or top of the adsorption plate body. The side of the adsorption plate body is provided with a plurality of first vacuum adsorption holes for adsorbing the dry film supplied by the film dispensing mechanism. The dry film heating member is used to press the dry film onto the circuit board. The film-applying suction block structure includes an arc-shaped suction block rotatably mounted on the film-applying frame. The arc-shaped surface of the arc-shaped suction block is provided with a plurality of second vacuum suction holes for adsorbing the dry film supplied by the film dispensing mechanism and the film pulling and fixing suction plate mechanism. The film-applying gap is formed between two arc-shaped suction blocks. The plate ejection assembly includes a plate ejection conveying structure located on the other side of the frame, and a plate pulling mechanism located above the plate ejection conveying structure.

2. The automatic pre-applying film equipment according to claim 1, characterized in that, Both the first pre-applying film mechanism and the second pre-applying film mechanism include a dry film cutting structure that corresponds to and cooperates with the film-applying suction block structure, and a feeding / discharging sensor provided at the film-applying gap, with the film-applying gap formed between the two film-applying suction block structures.

3. The automatic pre-applying film equipment according to claim 2, characterized in that, The first pre-applying film mechanism includes a first film applicator mounted on the upper side of the frame, a first film dispensing mechanism mounted on the first film applicator, a first film pulling and fixing suction plate mechanism corresponding to the first film dispensing mechanism, a first film applicator suction block structure corresponding to the first film pulling and fixing suction plate mechanism, a first dry film cutting structure corresponding to the first film applicator suction block structure, and a first feed / discharge sensor mounted at the film applicator gap. The second pre-applying film mechanism includes a second film applicator mounted on the lower side of the frame, a second film dispensing mechanism mounted on the second film applicator, a second film pulling and fixing suction plate mechanism corresponding to the second film dispensing mechanism, a second film applicator suction block structure corresponding to the second film pulling and fixing suction plate mechanism, a second dry film cutting structure corresponding to the second film applicator suction block structure, and a second feed / discharge sensor mounted at the film applicator gap.

4. The automatic pre-applying film equipment according to claim 1, characterized in that, The film dispensing mechanism includes a film dispensing roll rotatably mounted on the film applicator, a plurality of film dispensing guide shafts rotatably mounted on the film applicator, and a film dispensing limiting shaft rotatably mounted on the film applicator. The film dispensing limiting shaft and the connecting shaft are arranged side by side and close to each other, with a positioning gap between them. The positioning gap corresponds to the side of the adsorption plate body on which a plurality of the first vacuum adsorption holes are provided.

5. The automatic pre-applying film equipment according to claim 2, characterized in that, The dry film cutting structure includes a cutting guide frame disposed on the film applicator and corresponding to the film applicator suction block structure, a cutting blade slidably disposed on the cutting guide frame, and a cutting drive unit connected to the cutting blade. The cutting drive unit is used to drive the cutting blade to move along the cutting guide frame.

6. The automatic pre-applying film equipment according to any one of claims 1-5, characterized in that, The plate pulling mechanism includes plate pulling guide rails on both sides of the plate conveying structure, plate pulling frames slidably disposed on the plate pulling guide rails on both sides, plate pulling drive members disposed on the frame and connected to the plate pulling frames, and a plurality of plate pulling clamps protruding from one side of the plate pulling frames. The plate pulling clamps are arranged in a front-to-back correspondence with the film application gap. The plate pulling drive members are used to drive the plate pulling frames and the plate pulling clamps on them to move closer to or away from the film application gap.

7. The automatic pre-applying film equipment according to any one of claims 1-5, characterized in that, The feeding conveying structure includes a first conveying frame disposed on the frame, and a conveying roller structure disposed on the first conveying frame, wherein the conveying direction of the conveying roller structure corresponds to the film application gap; The plate conveying structure includes a second conveying frame on the machine frame, a conveying roller structure on the second conveying frame, and a first limiting roller and a second limiting roller located at both ends of the second conveying frame and above the conveying roller structure. The conveying direction of the conveying roller structure is opposite to the film-applying gap. The plate pulling mechanism is slidably disposed on the second conveying frame and spans across the top of the conveying roller structure.

8. The automatic pre-applying film equipment according to claim 7, characterized in that, The storage structure includes a storage rack mounted on the frame and located on the side of the first conveyor frame, and a circuit board lifting structure mounted on the storage rack.

9. The automatic pre-applying film equipment according to claim 7, characterized in that, The plate picking and placing structure includes a picking and placing translation drive unit arranged laterally on the upper side of the frame, a picking and placing lifting drive unit connected to the picking and placing translation drive unit, and a picking and placing suction rack arranged on the picking and placing lifting drive unit. The picking and placing translation drive unit is arranged laterally between the plate storage structure and the conveying roller structure.

10. An automatic pre-applying film method, applied to an automatic pre-applying film device as described in any one of claims 1-9; Its features are, The method includes: The board picking and placing structure of the board feeding assembly retrieves the circuit board from the storage structure and transfers it to the board feeding conveyor structure on the side of the storage structure. The board feeding conveyor structure is then controlled to transport the circuit board toward the film-applying gap of the pre-applying film assembly. The first and second pre-filming mechanisms of the pre-filming assembly respectively pre-feed two dry films to the filming gap. When the circuit board is detected to have been delivered to the filming gap, the first and second pre-filming mechanisms respectively apply the two dry films to the starting ends of the two sides of the circuit board. The plate pulling mechanism of the control board output assembly clamps and pulls the circuit board located at the film bonding gap and the dry film attached to the starting end on both sides of the board, and controls the first pre-film bonding mechanism and the second pre-film bonding mechanism to continuously attach two dry films to the two sides of the circuit board passing through the film bonding gap. When the end of the circuit board is detected to be leaving the film-applying gap, the first pre-applying film mechanism and the second pre-applying film mechanism are controlled to cut the dry film adhered to both sides of the circuit board from the end of the circuit board, and the board pulling mechanism is controlled to place the circuit board with pre-applying film on both sides onto the board delivery conveyor structure, and the board delivery conveyor structure is controlled to transport the circuit board with pre-applying film on both sides to the next station.

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