Chip mounting device for integrated circuit processing

Abstract

The invention belongs to the technical field of circuit processing chip mounting, and discloses a chip mounting device for integrated circuit processing, which comprises a chip mounting mechanism and a glue dripping device arranged on the chip mounting mechanism, the bottom of the glue dripping device is provided with a glue dripping pipe, and the outer side of the glue dripping pipe is fixedly sleeved with a first fixing plate; and first electric push levers which are symmetrically distributed are fixedly mounted at the bottom of the first fixing plate. According to the glue uniformizing and glue removing device, the inclination angle of the glue uniformizing and glue removing plate can be changed, the glue uniformizing and glue removing plate can be driven to flatten glue through rotation of the gear ring when the glue uniformizing and glue removing plate is at different angles, redundant glue can be pushed to the glue uniformizing and glue removing plate during rotation, and the redundant glue is removed; and in the process of flattening and removing the glue, only one surface of the glue uniformizing and removing plate is always in contact with the glue, and in the subsequent glue pushing process of the pushing plate, the glue on the glue uniformizing and removing plate can be completely pushed into the glue guiding mechanism, so that the glue is prevented from remaining.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit processing patch technology, in particular to a patch device for integrated circuit processing. Background Art

[0002] When using polymer adhesive as the adhesive for the chip, the adhesive is often applied to the chip pad using a syringe or a syringe, and then the chip is accurately placed on the adhesive on the pad using an automatic pick-up machine, and finally pressed together.

[0003] The patent with application number CN202310493255.5 discloses a patch device for integrated circuit processing, which relates to the field of integrated circuit processing patch technology, including a patch machine body, a moving table installed on the upper part of the patch machine body, and a mounting plate is provided on the front end surface of the moving seat of the third linear motor, a glue dispenser is installed on one side of the front end surface of the mounting plate, and a glue filling machine is provided on the top surface of the patch machine body; a glue dispenser is vertically installed at the liquid outlet end of the glue dispenser, and a glue leveling mechanism is provided inside the sleeve; a pushing component is provided on the outer wall of the upper part of the glue dispenser; the present invention cooperates with the sleeve, the glue leveling mechanism and the positioning ring plate, so that after the PCB board is patched with glue, the colloid dripped on the patch can be evenly spread out immediately, and the excess colloid can be scraped and collected, which can effectively avoid the occurrence of high stress caused by the formation of voids between the chip and the colloid at the bottom when the chip is subsequently patched by the chip mounting machine, so as to improve the chip bonding efficiency and bonding stability.

[0004] However, in the above patent, the convex surface of the glue leveling board is used when spreading the colloid evenly, and the concave surface of the glue leveling board is used when collecting excess colloid. This will result in residual colloid adhering to the convex surface of the glue leveling board after the colloid is spread. The residual colloid may drip when the glue is not leveled, thereby affecting the patch; in addition, dust may remain on the PCB board, and dust particles will be mixed between the surface of the bonded object and the epoxy resin adhesive, hindering the sufficient contact between the adhesive and the bonded object, making it impossible for the adhesive to well infiltrate the surface of the bonded object, thereby failing to form a strong bonding interface, and ultimately resulting in a decrease in bonding strength.

[0005] Therefore, improvements are made to the above problems. Summary of the invention

[0006] In order to solve the problems mentioned in the above background technology that residual colloid may adhere to the convex surface of the glue-spreading plate, the residual colloid may drip when the glue is not spread, thereby affecting the patch, and dust may affect the bonding strength, the present invention provides a patch device for integrated circuit processing.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a patch device for integrated circuit processing, comprising a patch mechanism and a glue dispenser arranged thereon, a glue dispenser is installed at the bottom of the glue dispenser, a first fixing plate is fixedly sleeved on the outer side of the glue dispenser, a symmetrically distributed first electric push rod is fixedly installed at the bottom of the first fixing plate, and further comprising:

[0008] A sleeve, which is sleeved on the surface of the dripping tube and fixedly mounted on the movable end of the first electric push rod;

[0009] A positioning mechanism, which is sleeved on the lower end of the sleeve and is used to limit the area of ​​the flattened colloid;

[0010] A glue spreading and removing mechanism, which is arranged inside the positioning mechanism and is used to spread and remove the glue discharged from the glue dripping tube;

[0011] A driving mechanism, which is arranged inside the positioning mechanism and is used to drive the glue spreading and removing mechanism to rotate;

[0012] A glue pushing mechanism, which is arranged inside the glue leveling and glue removing mechanism and is used to push excess colloid for collection;

[0013] The glue guiding mechanism is arranged outside the positioning mechanism and is used to collect excess colloid.

[0014] Preferably, the positioning mechanism comprises a positioning ring and a first spring, the positioning ring is slidably connected to the sleeve, the first spring is sleeved on the surface of the positioning ring and two ends of the first spring are respectively in elastic contact with the positioning ring and the first spring.

[0015] Preferably, the driving mechanism includes a second fixed plate, a first micromotor, a gear, a gear ring and a connecting rod, the second fixed plate is fixedly connected to the positioning ring, the first micromotor is fixedly connected to the second fixed plate, the gear is fixedly mounted on the output shaft of the first micromotor, the gear ring is rotatably connected to the inner wall of the positioning ring and meshes with the gear, and the two ends of the connecting rod are respectively fixedly connected to the gear ring and the glue spreading and removing mechanism.

[0016] Preferably, the glue spreading and removing mechanism includes a storage bin, a positioning plate, a glue spreading and removing plate, a second electric push rod, a connecting slide and a positioning slide. The storage bin is fixedly connected to the connecting rod, the positioning plate is symmetrically fixed to the top of the storage bin, the glue spreading and removing plate is movably connected to the middle of the storage bin and one end of the glue spreading and removing plate is slidably connected to the positioning plate, the second electric push rod is fixedly installed on the top of the storage bin, the connecting slide is connected to the movable end of the second electric push rod through a universal joint, and the positioning slide is fixedly installed on the surface of the glue spreading and removing plate and is slidably connected to the connecting slide.

[0017] Preferably, the glue pushing mechanism includes a second micromotor, a threaded rod and a push plate, the second micromotor is fixedly installed on one side of the storage bin, the threaded rod is fixedly installed on the output shaft of the second micromotor, the push plate is threadedly connected to the threaded rod, and the push plate slides inside the storage bin through the threaded rod.

[0018] Preferably, the rubber guiding mechanism includes a first rubber guiding tube, a second rubber guiding tube, a second spring, a third rubber guiding tube and a collecting bin, the first rubber guiding tube is fixedly mounted on a side of the collecting bin away from the second micro motor, the third rubber guiding tube is fixedly mounted on the outside of the positioning ring, the second rubber guiding tube is elastically slidably connected to the third rubber guiding tube via the second spring, the second rubber guiding tube is elastically clamped to the first rubber guiding tube via the second spring, the collecting bin is fixedly connected to the third rubber guiding tube, and an arc chamfer is provided at one end of the second rubber guiding tube close to the first rubber guiding tube.

[0019] Preferably, a first arc groove and a second arc groove are formed on the surface of the positioning plate, the first arc groove is connected to the second arc groove, and one end of the glue spreading and removing plate is slidably engaged in the first arc groove and the second arc groove.

[0020] Preferably, a rubber strip is provided at the contact point between the glue spreading and de-glueing plate and the storage bin.

[0021] Preferably, when the adhesive spreading and adhesive removing plates move inside the second arc-shaped groove, the bottom ends of the adhesive spreading and adhesive removing plates are located at the same height.

[0022] Preferably, a dust removal mechanism is provided on the surface of the sleeve, and the dust removal mechanism includes a micro fan and a connecting hose. The micro fan is fixedly mounted on the outside of the sleeve, and the connecting hose connects the inner cavity of the storage bin and the micro fan. The connecting hose is connected to the storage bin through a sealed bearing, and a dust removal bag for collecting dust is also provided at the connection between the micro fan and the connecting hose. A rectangular notch is provided at a corner of the glue spreading and removing plate near the second micro motor.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. The present invention can change the tilt angle by using the glue-splitting and glue-removing board. Fig. 9 When the angle is shown in the figure, the rotation of the gear ring can drive the glue-spreading and de-glueing plate to flatten the glue. Fig.11 When the angle is shown in , the excess colloid can be pushed onto the glue-spreading and glue-removing board during rotation to achieve removal of the excess colloid, and in the process of flattening and removing the colloid, only one side of the glue-spreading and glue-removing board is always in contact with the colloid. In the subsequent process of pushing the board and pushing the glue, all the colloid on the glue-spreading and glue-removing board can be pushed into the glue guiding mechanism to prevent colloid residue.

[0025] 2. The glue-spreading and glue-removing plate provided in the present invention will also be displaced with the storage bin during rotation, so that it can be ensured that the glue-spreading and glue-removing plate will not go deep into the flattened area to dig out the colloid when it changes from the glue-spreading state to the glue-removing state, thereby ensuring the uniformity of the flattening.

[0026] 3. The present invention can realize the cleaning of dust on the PCB board through the cooperation of the dust removal mechanism, the glue spreading and removing mechanism and the glue pushing mechanism, and the glue spreading and removing plate can be adjusted as follows: Fig.12 In the state shown in the figure, the push plate located at one end of the first glue guide tube is moved toward the end close to the micro-blower by rotating the threaded rod. During the movement of the push plate, the dust adhering to the storage bin and the glue spreading and de-glueing plate is scratched. When the push plate moves to the notch at a corner of the glue spreading and de-glueing plate, the adhering dust is sucked into the connecting hose by wind force and finally enters the dust removal bag to prevent the dust from contacting with excess colloid. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of the present invention;

[0028] Figure 2 It is a structural schematic diagram of the sleeve of the present invention;

[0029] Figure 3 It is a schematic diagram of the internal structure of the sleeve of the present invention;

[0030] Figure 4 It is a schematic diagram of the position of the glue-splitting and glue-removing mechanism of the present invention;

[0031] Figure 5 It is a structural breakdown diagram of the driving mechanism of the present invention;

[0032] Figure 6 It is a structural subdivision diagram of the rubber pushing mechanism of the present invention;

[0033] Figure 7 It is a structural subdivision diagram of the glue-splitting and glue-removing mechanism of the present invention;

[0034] Figure 8 It is a structural separation diagram of the glue guiding mechanism of the present invention;

[0035] Fig. 9 It is a schematic diagram of the structure of the glue-spinning and glue-removing plate during glue-spinning of the present invention;

[0036] Fig.10 It is a schematic diagram of the structural morphology of the glue-spinning and glue-removing plate in the glue-spinning and glue-removing process of the present invention;

[0037] Fig.11 It is a schematic diagram of the structure of the glue-dispensing and glue-removing board during glue removal of the present invention;

[0038] Fig.12 It is a schematic diagram of the structural morphology of the glue-spreading and glue-removing plate when collecting colloid in the present invention.

[0039] In the figure: 1, patch mechanism; 2, glue dispenser; 3, glue dispenser; 4, first fixed plate; 5, first electric push rod; 6, sleeve; 7, positioning mechanism; 701, positioning ring; 702, first spring; 8, driving mechanism; 801, second fixed plate; 802, first micro motor; 803, gear; 804, gear ring; 805, connecting rod; 9, glue spreading and degumming mechanism; 901, storage bin; 902, positioning plate; 903, glue spreading and degumming plate; 904, second electric push rod; 905, connecting slider; 906, positioning slide; 921, first arc groove; 922, second arc groove; 10, rubber pushing mechanism; 1001, second micro motor; 1002, threaded rod; 1003, push plate; 11, dust removal mechanism; 1101, micro fan; 1102, connecting hose; 12, rubber guiding mechanism; 1201, first rubber guiding hose; 1202, second rubber guiding hose; 1203, second spring; 1204, third rubber guiding hose; 1205, collecting bin. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] like Figures 1 to 12 As shown, the present invention provides a patch device for integrated circuit processing, including a patch mechanism 1 and a glue dispenser 2 arranged thereon, a glue dispenser 3 is installed at the bottom of the glue dispenser 2, a first fixing plate 4 is fixedly sleeved on the outer side of the glue dispenser 3, a symmetrically distributed first electric push rod 5 is fixedly installed on the bottom of the first fixing plate 4, and also includes a sleeve 6, the sleeve 6 is sleeved on the surface of the glue dispenser 3 and fixedly installed on the movable end of the first electric push rod 5; a positioning mechanism 7, the positioning mechanism 7 is sleeved on the lower end of the sleeve 6 and is used to limit the flattened colloid area; a glue spreading and degumming mechanism 9, the glue spreading and degumming mechanism 9 is arranged inside the positioning mechanism 7 and is used to spread and remove the colloid discharged from the glue dispenser 3; a driving mechanism 8, the driving mechanism 8 is arranged inside the positioning mechanism 7 and is used to drive the glue spreading and degumming mechanism 9 to rotate; a glue pushing mechanism 10, the glue pushing mechanism 10 is arranged inside the glue spreading and degumming mechanism 9 and is used to push the excess colloid for collection; a glue guiding mechanism 12, the glue guiding mechanism 12 is arranged outside the positioning mechanism 7 and is used to collect excess colloid.

[0042] The above scheme is adopted: before glue dripping, the micro-blower 1101 is first started to generate negative pressure through the channel formed by the storage bin 901 and the glue spreading and de-glueing plate 903, so as to absorb the dust on the PCB board. At the same time, the storage bin 901 is driven to rotate by the driving mechanism 8 to ensure the dust removal effect; and after glue dripping, the glue spreading and de-glueing plate 903 is driven to rotate and adjust the position by starting the second electric push rod 904, so that the glue spreading and de-glueing plate 903 can be tilted in two opposite directions. In this way, under the drive of the driving mechanism 8, the glue spreading and de-glueing plate 903 can flatten the colloid and collect it before removal, and after the glue spreading and de-glueing plate 903 is driven to further tilt by the second electric push rod 904 until a relatively closed cavity is formed with the storage bin 901, the push plate 1003 is driven to move inside the storage bin 901 by the rotation of the threaded rod 1002, so that the colloid can be pushed into the glue guiding mechanism 12 for collection.

[0043] like Figure 3 As shown, the positioning mechanism 7 includes a positioning ring 701 and a first spring 702. The positioning ring 701 is slidably connected to the sleeve 6. The first spring 702 is sleeved on the surface of the positioning ring 701 and its two ends are elastically in contact with the positioning ring 701 and the first spring 702 respectively.

[0044] With the above solution, the first spring 702 can be set up so that the positioning ring 701 can remain stable after contacting the PCB board under the push of the first electric push rod 5, and the first spring 702 is compressed at this time, providing a certain amount of redundancy.

[0045] like Figure 4 , 5 As shown, the driving mechanism 8 includes a second fixed plate 801, a first micro motor 802, a gear 803, a gear ring 804 and a connecting rod 805. The second fixed plate 801 is fixedly connected to the positioning ring 701, the first micro motor 802 is fixedly connected to the second fixed plate 801, the gear 803 is fixedly installed on the output shaft of the first micro motor 802, the gear ring 804 is rotatably connected to the inner wall of the positioning ring 701 and meshes with the gear 803, and the two ends of the connecting rod 805 are respectively fixedly connected to the gear ring 804 and the glue leveling and degumming mechanism 9.

[0046] The above solution is adopted: the first micro motor 802 drives the gear 803 to rotate, thereby driving the gear ring 804 to rotate inside the positioning ring 701, and then driving the storage bin 901 to rotate through the connecting rod 805, thereby achieving the purpose of rotating the glue-leveling and glue-removing plate 903 to flatten the colloid.

[0047] like Figure 6 , 7As shown, the glue spreading and de-glueing mechanism 9 includes a storage bin 901, a positioning plate 902, a glue spreading and de-glueing plate 903, a second electric push rod 904, a connecting slider 905 and a positioning slide 906. The storage bin 901 is fixedly connected to the connecting rod 805, the positioning plate 902 is symmetrically fixed to the top of the storage bin 901, the glue spreading and de-glueing plate 903 is movably connected to the middle of the storage bin 901 and one end thereof is slidably connected to the positioning plate 902, the second electric push rod 904 is fixedly installed on the top of the storage bin 901, the connecting slider 905 is connected to the movable end of the second electric push rod 904 through a universal joint, and the positioning slide 906 is fixedly installed on the surface of the glue spreading and de-glueing plate 903 and is slidably connected to the connecting slider 905.

[0048] Adopting the above solution: the set glue dispensing and desizing plate 903 can change the tilt angle, when the glue dispensing and desizing plate 903 is as Fig. 9 When the angle is shown in FIG. , the rotation of the gear ring 804 can drive the adhesive dispensing and de-adhesive plate 903 to flatten the adhesive. Fig.11 When the angle is shown in the figure, the excess colloid can be pushed onto the glue-leveling and glue-removing plate 903 during rotation to achieve the removal of the excess colloid, and in the process of flattening and removing the colloid, only one side of the glue-leveling and glue-removing plate 903 is always in contact with the colloid. In the subsequent process of pushing the glue by the push plate 1003, all the colloid on the glue-leveling and glue-removing plate 903 can be pushed into the glue guiding mechanism 12 to prevent colloid residue.

[0049] like Figure 6 As shown, the glue pushing mechanism 10 includes a second micro motor 1001, a threaded rod 1002 and a push plate 1003. The second micro motor 1001 is fixedly installed on one side of the storage bin 901, the threaded rod 1002 is fixedly installed on the output shaft of the second micro motor 1001, the push plate 1003 is threadedly connected to the threaded rod 1002, and the push plate 1003 slides inside the storage bin 901 through the threaded rod 1002.

[0050] The above solution is adopted: during the process of glue spreading, the push plate 1003 only adheres to the inner wall of the storage bin 901, and when the glue spreading and glue removing plate 903 removes the excess glue, Fig.12 In the state shown in , the push plate 1003 is still in contact with the adhesive spreading and debonding plate 903. At this time, the movement of the push plate 1003 can push the colloid on the adhesive spreading and debonding plate 903 into the adhesive guiding mechanism 12 by squeezing, thereby collecting excess colloid.

[0051] like Figure 6 , 8As shown, the rubber guiding mechanism 12 includes a first rubber guiding tube 1201, a second rubber guiding tube 1202, a second spring 1203, a third rubber guiding tube 1204 and a collecting bin 1205. The first rubber guiding tube 1201 is fixedly mounted on a side of the storage bin 901 away from the second micro motor 1001, the third rubber guiding tube 1204 is fixedly mounted on the outer side of the positioning ring 701, the second rubber guiding tube 1202 is elastically slidably connected to the third rubber guiding tube 1204 via the second spring 1203, the second rubber guiding tube 1202 is elastically clamped to the first rubber guiding tube 1201 via the second spring 1203, the collecting bin 1205 is fixedly connected to the third rubber guiding tube 1204, and an arc chamfer is provided at one end of the second rubber guiding tube 1202 close to the first rubber guiding tube 1201.

[0052] With the above solution, since the storage bin 901 rotates driven by the connecting rod 805 , the slidable second rubber guide tube 1202 can be connected by extrusion during the process of the first rubber guide tube 1201 rotating with the storage bin 901 .

[0053] like Fig. 9 As shown, a first arc groove 921 and a second arc groove 922 are provided on the surface of the positioning plate 902, and the first arc groove 921 is connected to the second arc groove 922. One end of the glue spreading and de-glueing plate 903 is slidably engaged in the first arc groove 921 and the second arc groove 922. When the glue spreading and de-glueing plate 903 moves in the second arc groove 922, the bottom ends of the glue spreading and de-glueing plate 903 are located at the same height.

[0054] The above scheme is adopted: by setting the first arc groove 921 and the second arc groove 922, the position of the glue spreading and degumming plate 903 can be limited. When one end of the glue spreading and degumming plate 903 is located in the first arc groove 921, the rotation of the glue spreading and degumming plate 903 is centered on the hinge with the storage bin 901. When one end of the glue spreading and degumming plate 903 is located in the second arc groove 922, the glue spreading and degumming plate 903 will also be displaced between the storage bin 901 during rotation. In this way, it can be ensured that the glue spreading and degumming plate 903 will not go deep into the flattened area to dig out the colloid when it changes from the glue spreading state to the glue removal state, thereby ensuring the uniformity of the flattening.

[0055] like Figure 6 As shown, a rubber strip is provided at the contact point between the glue spreading and de-glueing plate 903 and the storage bin 901 .

[0056] By adopting the above solution, the rubber strip can ensure the sealing of the connection between the two, so as to ensure that wind enters from the bottom of the storage bin 901 when removing dust.

[0057] like Figure 4 , 5As shown, a dust removal mechanism 11 is provided on the surface of the sleeve 6, and the dust removal mechanism 11 includes a micro fan 1101 and a connecting hose 1102. The micro fan 1101 is fixedly installed on the outside of the sleeve 6, and the connecting hose 1102 connects the inner cavity of the storage bin 901 and the micro fan 1101. The connecting hose 1102 is connected to the storage bin 901 through a sealed bearing, and a dust removal bag for collecting dust is also provided at the connection between the micro fan 1101 and the connecting hose 1102. A rectangular notch is opened at a corner of the glue distributing and removing plate 903 near the second micro motor 1001.

[0058] The above scheme is adopted: through the rectangular notch at one corner of the glue-spreading and de-glueing plate 903, the push plate 1003 can be moved from the end close to the first glue guide tube 1201 to the end close to the second micro motor 1001 during the dust removal process, and the glue-spreading and de-glueing plate 903 and the storage bin 901 are kept to form a sealed cavity, such as Fig.12 In the state shown, the dust adhering to the storage bin 901 and the glue-splitting and glue-removing plate 903 can be pushed off during the process, so that when the push plate 1003 moves to the notch at a corner of the glue-splitting and glue-removing plate 903, the dust is sucked into the connecting hose 1102 by wind force and finally enters the dust removal bag, thereby further improving the dust removal effect and preventing dust from being contaminated when removing excess colloid.

[0059] The working principle and use process of the present invention:

[0060] Before glue dripping, first start the first electric push rod 5 to drive the sleeve 6 to make the bottom of the positioning ring 701 in pressure contact with the PCB board, and keep the bottom of the glue dripping tube 3 higher than the storage bin 901, then start the micro fan 1101, and under the connection of the connecting hose 1102, the wind enters from the bottom opening formed by the storage bin 901 and the glue spreading and de-glueing plate 903, then start the first micro motor 802 to drive the storage bin 901 to rotate, and the dust on the PCB board is taken away by the wind. At the same time, the position of the glue spreading and de-glueing plate 903 can be adjusted by the second electric push rod 904 to achieve the adjustment of the negative pressure wind force. After the dust is taken away, the glue spreading and de-glueing plate 903 can be adjusted as shown in the figure. Fig.12 The push plate 1003 is moved to the state shown in the figure, and the second micro motor 1001 is started. The push plate 1003 located at one end of the first adhesive guide tube 1201 is moved to the end of the micro fan 1101 by the rotation of the threaded rod 1002. During the movement of the push plate 1003, the dust adhering to the storage bin 901 and the adhesive dispensing and de-adhesive plate 903 is scratched. When the push plate 1003 moves to the notch at one corner of the adhesive dispensing and de-adhesive plate 903, the adhering dust is sucked into the connecting hose 1102 by wind force and finally enters the dust removal bag.

[0061] Then, the glue dispenser 2 is started to dispense glue through the glue dispenser tube 3. After the glue is dispensed, the glue dispensing plate 903 is first in the state as shown in FIG. Fig. 9In the state shown in FIG. 8 , the first micro motor 802 is started to drive the gear 803 to rotate, thereby driving the gear ring 804 to rotate, and then driving the storage bin 901 to rotate inside the positioning ring 701 through the connecting rod 805 to flatten the colloid;

[0062] After the flattening is completed, the first micro motor 802 is stopped, and the second electric push rod 904 is started to drive the glue-spreading and de-glueing plate 903 to rotate, so that one end of the glue-spreading and de-glueing plate 903 reaches the connection between the first arc groove 921 and the second arc groove 922 and stops. Fig.11 In the state shown, the first micro motor 802 is started again, and the adhesive dispensing and de-adhesive plate 903 brings the excess adhesive to the surface of the adhesive dispensing and de-adhesive plate 903 by pressure when rotating;

[0063] After all the excess colloid has reached the surface of the glue-spinning and de-glueing board 903, the second electric push rod 904 is started again to move the glue-spinning and de-glueing board 903 as shown in FIG. Fig.12 In the state shown in FIG. 1 , the second micro motor 1001 is started, and the threaded rod 1002 rotates to drive the push plate 1003 to move from the second micro motor 1001 to the first rubber guide tube 1201 . During the movement, the excess colloid can be pressed into the dust removal mechanism 11 for collection;

[0064] It is worth noting that during the rotation of the storage bin 901, the first rubber guide tube 1201 will dock with the second rubber guide tube 1202 once every full rotation. Fig.12 In the state shown in , the first rubber guide tube 1201 and the second rubber guide tube 1202 are in a docking state.

[0065] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0066] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip placement device for integrated circuit processing, comprising a chip placement mechanism (1) and a glue dispenser (2) arranged thereon, a glue dispenser (3) being installed at the bottom of the glue dispenser (2), a first fixing plate (4) being fixedly sleeved on the outer side of the glue dispenser (3), a symmetrically distributed first electric push rod (5) being fixedly installed at the bottom of the first fixing plate (4), characterized in that: Also includes, A sleeve (6), wherein the sleeve (6) is sleeved on the surface of the dripping tube (3) and is fixedly mounted on the movable end of the first electric push rod (5); A positioning mechanism (7), wherein the positioning mechanism (7) is sleeved on the lower end of the sleeve (6) and is used to limit the area of ​​the colloid to be flattened; A glue spreading and removing mechanism (9), wherein the glue spreading and removing mechanism (9) is arranged inside the positioning mechanism (7) and is used to spread and remove the glue discharged from the glue dripping tube (3); A driving mechanism (8), the driving mechanism (8) being arranged inside the positioning mechanism (7) and used for driving the glue spreading and removing mechanism (9) to rotate; A glue pushing mechanism (10), the glue pushing mechanism (10) is arranged inside the glue leveling and glue removing mechanism (9) and is used to push excess colloid for collection; The glue guiding mechanism (12) is arranged outside the positioning mechanism (7) and is used to collect excess glue.

2. The chip bonding device for integrated circuit processing according to claim 1, characterized in that: The positioning mechanism (7) comprises a positioning ring (701) and a first spring (702); the positioning ring (701) is slidably connected to the sleeve (6); the first spring (702) is sleeved on the surface of the positioning ring (701) and its two ends are respectively in elastic contact with the positioning ring (701) and the first spring (702).

3. The chip bonding device for integrated circuit processing according to claim 2, characterized in that: The driving mechanism (8) comprises a second fixed plate (801), a first micro motor (802), a gear (803), a gear ring (804) and a connecting rod (805); the second fixed plate (801) is fixedly connected to the positioning ring (701); the first micro motor (802) is fixedly connected to the second fixed plate (801); the gear (803) is fixedly mounted on the output shaft of the first micro motor (802); the gear ring (804) is rotatably connected to the inner wall of the positioning ring (701) and meshes with the gear (803); and the two ends of the connecting rod (805) are respectively fixedly connected to the gear ring (804) and the glue leveling and degumming mechanism (9).

4. The chip bonding device for integrated circuit processing according to claim 3, characterized in that: The glue spreading and degumming mechanism (9) includes a storage bin (901), a positioning plate (902), a glue spreading and degumming plate (903), a second electric push rod (904), a connecting slider (905) and a positioning slide (906). The storage bin (901) is fixedly connected to the connecting rod (805), the positioning plate (902) is symmetrically fixed to the top of the storage bin (901), the glue spreading and degumming plate (903) is movably connected to the middle of the storage bin (901) and one end thereof is slidably connected to the positioning plate (902), the second electric push rod (904) is fixedly installed on the top of the storage bin (901), the connecting slider (905) is connected to the movable end of the second electric push rod (904) through a universal joint, and the positioning slide (906) is fixedly installed on the surface of the glue spreading and degumming plate (903) and is slidably connected to the connecting slider (905).

5. The chip bonding device for integrated circuit processing according to claim 4, characterized in that: The glue pushing mechanism (10) comprises a second micro motor (1001), a threaded rod (1002) and a push plate (1003); the second micro motor (1001) is fixedly mounted on one side of the storage bin (901); the threaded rod (1002) is fixedly mounted on the output shaft of the second micro motor (1001); the push plate (1003) is threadedly connected to the threaded rod (1002); and the push plate (1003) slides inside the storage bin (901) through the threaded rod (1002).

6. The chip bonding device for integrated circuit processing according to claim 5, characterized in that: The rubber guiding mechanism (12) comprises a first rubber guiding tube (1201), a second rubber guiding tube (1202), a second spring (1203), a third rubber guiding tube (1204) and a collecting bin (1205); the first rubber guiding tube (1201) is fixedly mounted on a side of the storing bin (901) away from the second micro motor (1001); the third rubber guiding tube (1204) is fixedly mounted on the outside of the positioning ring (701); the second rubber guiding tube (1202) is elastically slidably connected to the third rubber guiding tube (1204) via the second spring (1203); the second rubber guiding tube (1202) is elastically clamped to the first rubber guiding tube (1201) via the second spring (1203); the collecting bin (1205) is fixedly connected to the third rubber guiding tube (1204); and an arc chamfer is provided at one end of the second rubber guiding tube (1202) close to the first rubber guiding tube (1201).

7. The chip bonding device for integrated circuit processing according to claim 4, characterized in that: The surface of the positioning plate (902) is provided with a first arc-shaped groove (921) and a second arc-shaped groove (922), the first arc-shaped groove (921) is connected to the second arc-shaped groove (922), and one end of the glue-distributing and glue-removing plate (903) is slidably engaged in the first arc-shaped groove (921) and the second arc-shaped groove (922).

8. The chip bonding device for integrated circuit processing according to claim 4, characterized in that: A rubber strip is provided at the contact point between the glue leveling and glue removing plate (903) and the storage bin (901).

9. The chip bonding device for integrated circuit processing according to claim 7, characterized in that: When the adhesive spreading and adhesive removal plate (903) moves inside the second arc-shaped groove (922), the bottom ends of the adhesive spreading and adhesive removal plate (903) are located at the same height.

10. The chip bonding device for integrated circuit processing according to claim 5, characterized in that: The surface of the sleeve (6) is provided with a dust removal mechanism (11), and the dust removal mechanism (11) comprises a micro fan (1101) and a connecting hose (1102), wherein the micro fan (1101) is fixedly mounted on the outside of the sleeve (6), and the connecting hose (1102) connects the inner cavity of the storage bin (901) and the micro fan (1101), and the connecting hose (1102) is connected to the storage bin (901) via a sealing bearing, and a dust removal bag for collecting dust is also provided at the connection between the micro fan (1101) and the connecting hose (1102), and a rectangular notch is provided at a corner of the glue distributing and removing plate (903) close to the second micro motor (1001).

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