Electronic equipment, electric assembly and vehicle
By setting up spacers in the cooling waterway of electronic equipment, changing the flow distribution of coolant, the problem that the cooling waterway in the prior art does not have targeted heat dissipation, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202410679206.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-04-04
AI Technical Summary
The existing cooling waterway design does not have targeted heat dissipation enhancement to different locations of the same heat dissipation body.
A spacer is provided in the first flow channel of the electronic device to change the flow distribution of the coolant so that the coolant flows more to the first heating component that generates more heat.
By targeted diversion of the coolant, the heat exchange effect and heat exchange efficiency of the electronic equipment are significantly improved.
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Figure CN119767613A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic product manufacturing, and more specifically, to an electronic device, a powertrain and a vehicle. Background Art
[0002] In the existing cooling water channel design, the structure design is usually in the cooling main body water channel. The heat conduction ribs designed in the water channel are mainly for diversion or to increase heat conduction, and do not have the targeted heat dissipation enhancement for different positions of the same heat dissipation main body. Summary of the invention
[0003] One object of the present invention is to provide a new technical solution for electronic equipment, powertrain and vehicle, which can at least solve the problem that the cooling water channel of the prior art does not have the targeted heat dissipation enhancement for different positions of the same heat dissipation body.
[0004] According to a first aspect of the present invention, an electronic device is provided, comprising: a casing, a first flow channel being provided in the casing, the first flow channel comprising a first region and a second region, the first region being located upstream of the second region, a barrier being provided corresponding to the position of the first region, a first heat-generating component being provided at a corresponding position of the second region, the second region being used for dissipating heat to the first heat-generating component, and the barrier being used for changing the flow distribution of the coolant in the second region so that more of the coolant flows to the corresponding position of the first heat-generating component.
[0005] Optionally, the first heat-generating component includes a plurality of power tubes, a gap is provided between two adjacent power tubes, and the barrier is provided corresponding to the gap.
[0006] Optionally, the first heat-generating component includes at least one power module, each of the power modules includes at least two power tubes, a gap is provided between two adjacent power tubes, and the barrier is provided corresponding to the gap.
[0007] Optionally, the power module includes a shell, the barrier is disposed in the shell, and the barrier is inserted into the first flow channel.
[0008] Optionally, the first heat-generating component includes a power tube, and the power tube includes a first tube and a second tube. The heat generated by the first tube is greater than that of the second tube. The baffle is at least partially arranged at a position corresponding to the second tube to allow more coolant to flow to the first tube.
[0009] Optionally, in a direction perpendicular to the flow direction of the coolant, the first heat-generating components at both ends are located inside corresponding parts of the second region, and gaps are provided on both sides of the second region, and at least a partial barrier is provided at a position of the first region corresponding to the gap.
[0010] Optionally, the electronic device further comprises: a flow channel cover plate, the flow channel cover plate is arranged in the box body, and the first flow channel is formed in the flow channel cover plate.
[0011] Optionally, the baffle is arranged in the flow channel cover plate.
[0012] Optionally, the first flow channel has a first water inlet and a first water outlet, the first area is close to the first water inlet, and the second area is close to the first water outlet. When the coolant flows between the first water inlet and the first water outlet, the flow distribution of the coolant in the second area is changed by the barrier member so that more flow flows to the corresponding position of the first heat-generating component.
[0013] Optionally, a slope body is provided in the first region at the position of the first water inlet, and the coolant is introduced into the first region through the slope body.
[0014] Optionally, the width of the first region gradually increases in a direction toward the second region.
[0015] Optionally, the box body further includes a second flow channel and a third flow channel, the second water outlet of the second flow channel is communicated with the first water inlet of the first flow channel, and the third flow channel is connected with the first water outlet of the first flow channel.
[0016] Optionally, a containing space is provided in the box body, the second flow channel is a U-shaped flow channel and is arranged around the containing space, and the containing space is suitable for accommodating a second heat-generating component.
[0017] Optionally, the third flow channel is spaced apart from the first flow channel in a first direction, and the first direction is perpendicular to an extension plane of the first flow channel.
[0018] A second aspect of the present invention provides an electric assembly, comprising the electronic device described in the above embodiment.
[0019] A third aspect of the present invention provides a vehicle comprising the electric assembly described in the above embodiment.
[0020] The electronic device of the present invention, by arranging a baffle member corresponding to the position of the first area in the first flow channel, uses the baffle member to change the flow distribution of the coolant, so that the coolant can flow more to the first heat-generating component that generates more heat, thereby effectively improving the heat exchange effect of the electronic device and improving the heat exchange efficiency.
[0021] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
[0023] Figure 1 is a side view of an electronic device according to an embodiment of the present invention;
[0024] Figure 2 is a cross-sectional view of an electronic device according to an embodiment of the present invention;
[0025] Figure 3 is a side view of a first body of an electronic device according to an embodiment of the present invention;
[0026] Figure 4 is another side view of the first body of the electronic device according to an embodiment of the present invention;
[0027] Figure 5 is another side view of the first body of the electronic device according to the embodiment of the present invention;
[0028] Figure 6 is a side view of a second body of an electronic device according to an embodiment of the present invention;
[0029] Figure 7 is a schematic diagram of the flow direction of a first flow channel of an electronic device according to an embodiment of the present invention;
[0030] Figure 8 It is a schematic diagram of the overall flow of an electronic device according to an embodiment of the present invention.
[0031] Reference numerals:
[0032] first body 11; second body 12;
[0033] First flow channel 20; barrier 21; first region 22; second region 23; ramp 26;
[0034] Flow channel cover plate 30;
[0035] A first water inlet 51; a first water outlet 52; a second water inlet 53; a second water outlet 54; a third water outlet 55; a third water inlet 56;
[0036] The second flow channel 61; the third flow channel 62;
[0037] A first heat generating component 70; a first pipe 71; a second pipe 72;
[0038] The accommodating space 80. DETAILED DESCRIPTION
[0039] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.
[0040] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
[0041] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.
[0042] In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.
[0043] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.
[0044] In the specification and claims of the present invention, if the term "first" or "second" is involved, it may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the related objects are in an "or" relationship.
[0045] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.
[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" involved should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0047] The electronic device according to the embodiment of the present invention is described in detail below with reference to the accompanying drawings.
[0048] like Figures 1 to 8 As shown, an electronic device according to an embodiment of the present invention includes: a box body, wherein a first flow channel 20 is provided in the box body, the first flow channel 20 includes a first area 22 and a second area 23, the first area 22 is located upstream of the second area 23, a barrier 21 is provided corresponding to the position of the first area 22, a first heat-generating component 70 is provided at a corresponding position of the second area 23, the second area 23 is used to dissipate heat for the first heat-generating component 70, and the barrier 21 is used to change the flow distribution of the coolant in the second area 23 so that more coolant flows to the corresponding position of the first heat-generating component 70.
[0049] In other words, see Figures 1 to 8 According to an embodiment of the present invention, the electronic device comprises a housing, wherein a first flow channel 20 is provided in the housing, such as Figure 7 and Figure 8 As shown, the first flow channel 20 has a first area 22 and a second area 23. The first area 22 is located upstream of the second area 23, and the coolant flows through the first area 22 and then flows to the second area 23. A barrier 21 is provided at the position of the first area 22, and the first heat generating component 70 is installed at the corresponding position of the second area 23 (such as Figure 7 As shown in FIG. 1 , the second region 23 is mainly used to dissipate heat for the first heat generating component 70. Figure 2 , Figure 7 and Figure 8 The barrier 21 can change the flow distribution of the coolant in the second area 23, so that the coolant can flow more specifically to the corresponding position of the first heat-generating component 70, thereby effectively dissipating the heat of the first heat-generating component 70 in the electronic device and improving the heat exchange efficiency of the electronic device. In the present invention, the coolant can be cooling water or other cooling media that can be used for cooling and heat dissipation, which will not be described in detail in the present invention.
[0050] Therefore, according to the electronic device of the embodiment of the present invention, by correspondingly setting the baffle 21 at the position of the first area 22 in the first flow channel 20, the baffle 21 is used to change the flow distribution of the coolant, so that the coolant can flow more to the first heat-generating component 70 which generates more heat, thereby effectively improving the heat exchange effect of the electronic device and improving the heat exchange efficiency.
[0051] According to an embodiment of the present invention, the first heat generating component 70 includes a plurality of power tubes, a gap is provided between two adjacent power tubes, and the barrier 21 is provided corresponding to the gap.
[0052] That is to say, Figure 7 and Figure 8 As shown, the first heat generating component 70 includes a plurality of power tubes, wherein a gap is formed between two adjacent power tubes, and the barrier 21 is arranged at a position corresponding to the gap. The barrier 21 changes the flow distribution of the coolant, so that the coolant flows more to the corresponding position of the first heat generating component 70 through the gap in a more targeted manner, thereby achieving effective heat dissipation of the first heat generating component 70 in the electronic device and improving the heat exchange efficiency of the electronic device.
[0053] In some specific embodiments of the present invention, the first heat generating component 70 includes at least one power module, each power module includes at least two power tubes, a gap is provided between two adjacent power tubes, and the barrier 21 is provided corresponding to the gap.
[0054] In other words, Figure 7 and Figure 8 As shown, the first heat generating component 70 includes at least one power module, each power module includes at least two power tubes, wherein a gap is formed between two adjacent power tubes, and the barrier 21 is arranged at a position corresponding to the gap. The flow distribution of the coolant is changed by the barrier 21, so that the coolant flows more to the corresponding position of the power tube more specifically through the gap, thereby achieving effective heat dissipation of the power tube in the electronic device and improving the heat exchange efficiency of the electronic device.
[0055] According to an embodiment of the present invention, the power module includes a housing, and the barrier 21 is disposed in the housing. The barrier 21 is inserted into the first flow channel 20 .
[0056] That is to say, Figure 2 As shown, the power module includes a shell, and a baffle 21 is arranged on the shell, and the baffle 21 can be inserted into the first flow channel 20, so as to change the flow distribution of the coolant in the first flow channel 20, so that the coolant flows more to the corresponding position of the power module more specifically, thereby achieving effective heat dissipation of the power tubes in the electronic device and improving the heat exchange efficiency of the electronic device.
[0057] According to one embodiment of the present invention, the first heat-generating component 70 includes a power tube, and the power tube includes a first tube 71 and a second tube 72. The heat generated by the first tube 71 is greater than that of the second tube 72. The barrier 21 is at least partially arranged at a position corresponding to the second tube 72 to allow more coolant to flow to the first tube 71.
[0058] In other words, see Figure 7 The first heat generating component 70 includes a power tube, and the power tube includes a first tube 71 and a second tube 72, wherein the heat generated by the first tube 71 is greater than that of the second tube 72. Figure 7 The rectangle with a larger area represents the first pipe 71 with a larger heat output, and the rectangle with a smaller area represents the second pipe 72 with a smaller heat output. The barrier 21 is at least partially disposed at a position corresponding to the second pipe 72, so that more coolant flows to the first pipe 71.
[0059] In the present invention, the first pipe 71 can be an IGBT (IGBT: Insulated Gate Bipolar Transistor) or a MOS tube with a relatively large heat generation. The MOS tube is a metal (metal)-oxide (oxide)-semiconductor (semiconductor) field effect transistor, or a metal-insulator (insulator)-semiconductor. The second pipe 72 can be a diode with a relatively small heat generation. The barrier 21 is arranged upstream of the diode so that the coolant can flow more to the IGBT or MOS tube. The present invention arranges the barrier 21 to divert the coolant in the first flow channel 20 in a targeted manner, and uses the barrier 21 to block the coolant at different positions, so that the coolant can be more targeted to dissipate heat to the parts with a relatively high heat generation such as the IGBT, so as to achieve the purpose of reducing the overall maximum junction temperature of the IGBT.
[0060] According to an embodiment of the present invention, in a direction perpendicular to the flow direction of the coolant, the first heat generating components 70 on both sides are inside the corresponding parts of the second region 23. A gap is formed on both sides of the second region 23, and at least part of the barrier 21 is provided at the position corresponding to the gap of the first region 22. The barrier 21 is used to block the coolant at different positions, so that the coolant can be more targeted to dissipate heat to the parts with higher heat generation such as the IGBT, so as to achieve the purpose of reducing the overall maximum junction temperature of the IGBT.
[0061] According to one embodiment of the present invention, Figure 3 As shown, the electronic device further includes: a flow channel cover plate 30, which is installed in the box body, and a first flow channel 20 is formed in the flow channel cover plate 30. The flow channel cover plate 30 is mainly used to control the connection position and size of the coolant to prevent the coolant from flowing in the box body.
[0062] According to one embodiment of the present invention, Figure 2 As shown, the baffle 21 is disposed in the flow channel cover plate 30, and the baffle 21 is used to block the coolant at different positions, so that the coolant can dissipate the heat of the power tubes with higher heat generation in a more targeted manner, thereby improving the heat dissipation efficiency.
[0063] According to one embodiment of the present invention, Figure 7 and Figure 8 As shown, the first flow channel 20 has a first water inlet 51 and a first water outlet 52, the first area 22 is close to the first water inlet 51, and the second area 23 is close to the first water outlet 52. When the coolant flows between the first water inlet 51 and the first water outlet 52, the flow distribution of the coolant in the second area 23 can be changed by the barrier 21, so that more flow flows to the corresponding position of the first heat-generating component 70, thereby improving the heat dissipation efficiency of the electronic device.
[0064] According to one embodiment of the present invention, Figure 5 , Figure 7 and Figure 8 As shown, the first area 22 is provided with a slope body 26 at the position of the first water inlet 51 , and the coolant is introduced into the first area 22 through the slope body 26 , thereby improving the efficiency of introducing the coolant into the first area 22 .
[0065] According to one embodiment of the present invention, Figure 7 and Figure 8 As shown, the width of the first area 22 gradually increases in the direction toward the second area 23, which slows down the flow rate of the coolant, ensures that the coolant is mixed more evenly, and improves the cooling efficiency.
[0066] In the present invention, the shape of the first area 22 of the first flow channel 20 can be adjusted differently according to different situations of entering the flow channel. Similarly, the baffles 21 on the flow channel cover plate 30 can also be adjusted to different positions, quantities and sizes according to different requirements for the rectification effect. Therefore, the design of the waterway structure designed before the second water inlet 53 and the first area 22 to adjust the flow state, the baffles 21 such as ribs and guide grooves, and the design of targeted diversion of the coolant entering the first flow channel 20 all fall within the protection scope of the present invention.
[0067] According to one embodiment of the present invention, the box body further includes a second flow channel 61 and a third flow channel 62 , the second water outlet 54 of the second flow channel 61 is connected to the first water inlet 51 of the first flow channel 20 , and the third flow channel 62 is connected to the first water outlet 52 of the first flow channel 20 .
[0068] That is to say, Figure 8As shown, the box body also includes a second flow channel 61 and a third flow channel 62. The box body has a first body 11 and a second body 12. The first body 11 is the upper half of the box body, and the second body 12 is the lower half of the box body (see Figures 1 to 6 ). The flow channel cover plate 30 is installed between the upper and lower parts of the box body, and is used to control the connection position and size of the coolant. The second water outlet 54 of the second flow channel 61 is connected to the first water inlet 51 of the first flow channel 20, and the third flow channel 62 is connected to the first water outlet 52 of the first flow channel 20. The coolant can be discharged through the third outlet 55 of the third flow channel 62. By controlling the flow channel cover plate 30, the coolant can flow from the second flow channel 61 to the first flow channel 20 and from the first flow channel 20 to the third flow channel 62 in a relatively limited space, so that the three-dimensional water channel and the plane water channel are interconnected in a smaller space, which greatly saves the size of the space occupied by the cooling system in the horizontal direction, and at the same time makes the coolant flow of the electronic control part in the first flow channel 20 unevenly distributed, thereby improving the efficiency of targeted heat dissipation.
[0069] In the present invention, see Figure 7 and Figure 8 After the coolant flows to the barrier 21, it will be blocked by the barrier 21 and flow will be diverted to both sides of the barrier 21, forming a region with less fluid behind the barrier 21. Therefore, after the coolant flows through the barrier 21, it will tend to converge and flow directly behind the barrier 21. However, due to the blockage of the barrier 21, the flow directly behind the barrier 21 will be relatively reduced, and the flow will flow more to the part outside the blocking area of the barrier 21 (the extension of the part behind the barrier 21) under the trend of inertia, so as to adjust the flow to achieve the purpose of targeted heat dissipation of the part with higher heat generation.
[0070] In the present invention, if Figures 1 to 6 As shown, the flow channel cover plate 30, which is located between the upper half (first body 11) and the lower half (second body 12) of the box body and is used to separate and connect the upper and lower coolants, can be adjusted to a suitable shape according to the specific water channel structure of the upper and lower parts of the box body. The shape, size, thickness, direction, length of the flow channel cover plate 30 and the shape and area of the slope body 26 can be specifically set according to actual conditions.
[0071] According to an embodiment of the present invention, a containing space 80 is provided in the box body, the second flow channel 61 is a U-shaped flow channel and is arranged around the containing space 80 , and the containing space 80 is suitable for accommodating the second heat-generating component.
[0072] In other words, Figure 8As shown, an accommodating space 80 is provided in the box body, and the second flow channel 61 can be configured as a U-shaped flow channel, and the second flow channel 61 is arranged around the accommodating space 80. The accommodating space 80 is suitable for accommodating a second heat-generating component. A third water inlet 56 is also provided at the connecting position between the second flow channel 61 and the first area 22 and the second area 23 of the first flow channel 20. The second flow channel 61 can partially adopt a design of a large contact area and a narrow flow channel, so as to effectively increase the contact area between the coolant and the cooled component, improve the heat exchange effect, and complete the heat dissipation of the power supply part on a shorter flow path. The second heat-generating component can be at least one of an inductor, a transformer, a capacitor or a MOS module of the vehicle-mounted power supply.
[0073] According to one embodiment of the present invention, see Figure 8 The third flow channel 62 is spaced apart from the first flow channel 20 in the first direction, and the first direction is perpendicular to the extension plane of the first flow channel 20. After the coolant has completed the heat dissipation of the IGBT part, it directly flows into the third flow channel 62 through the first water outlet 52, so that the third flow channel 62 can overlap at an angle in the thickness direction, further reducing the space usage in the thickness direction.
[0074] In summary, according to the electronic device of the embodiment of the present invention, by setting the baffle 21 corresponding to the position of the first area 22 in the first flow channel 20, the baffle 21 is used to change the flow distribution of the coolant, so that the coolant can flow more to the first heat-generating component 70 which generates more heat, thereby effectively improving the heat exchange effect of the electronic device and improving the heat exchange efficiency.
[0075] Of course, for those skilled in the art, other structures and working principles of the electronic device are understandable and achievable, and will not be described in detail in the present invention.
[0076] According to the second aspect of the embodiment of the present invention, an electric assembly is provided, comprising the electronic device in the above embodiment. Since the electronic device according to the embodiment of the present invention has the above technical effects, the electric assembly according to the embodiment of the present invention should also have corresponding technical effects. That is, the electric assembly of the present invention can change the flow distribution of the coolant by adopting the electronic device, so that the coolant can flow more to the first heating component 70 with more heat, thereby effectively improving the heat exchange effect of the electric assembly and improving the heat exchange efficiency.
[0077] Of course, for those skilled in the art, other structures of the electric assembly and its working principles are understandable and achievable, and will not be described in detail in the present invention.
[0078] According to the third aspect of the present invention, a vehicle is provided, comprising the electric assembly of the above embodiment. Since the electric assembly according to the embodiment of the present invention has the above technical effects, the vehicle according to the embodiment of the present invention should also have corresponding technical effects. That is, the vehicle of the present invention can change the flow distribution of the coolant by adopting the electric assembly, so that the coolant can flow more to the first heat-generating component 70 with more heat, thereby effectively improving the heat exchange effect of the vehicle and improving the heat exchange efficiency.
[0079] Of course, for those skilled in the art, other structures of the vehicle and their working principles are understandable and achievable, and will not be described in detail in the present invention.
[0080] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.
Claims
1. An electronic device, characterized in that: include: A box body is provided with a first flow channel, the first flow channel includes a first area and a second area, the first area is located upstream of the second area, a barrier is provided corresponding to the position of the first area, a first heat-generating component is provided at a corresponding position of the second area, the second area is used to dissipate heat for the first heat-generating component, and the barrier is used to change the flow distribution of the coolant in the second area so that more coolant flows to the corresponding position of the first heat-generating component.
2. The electronic device according to claim 1, characterized in that: The first heat generating component includes a plurality of power tubes, a gap is provided between two adjacent power tubes, and the barrier is provided corresponding to the gap.
3. The electronic device according to claim 1, characterized in that: The first heat generating component includes at least one power module, each of the power modules includes at least two power tubes, a gap is provided between two adjacent power tubes, and the barrier is provided corresponding to the gap.
4. The electronic device according to claim 3, characterized in that: The power module includes a shell, the baffle is arranged in the shell, and the baffle is inserted into the first flow channel.
5. The electronic device according to claim 1, characterized in that: The first heat-generating component includes a power tube, and the power tube includes a first tube and a second tube. The heat generated by the first tube is greater than that of the second tube. The baffle is at least partially arranged at a position corresponding to the second tube to allow more coolant to flow to the first tube.
6. The electronic device according to claim 1, characterized in that: In a direction perpendicular to the flow direction of the coolant, the first heat-generating components at both ends are inside the corresponding parts of the second area, and there are gaps on both sides of the second area. At least part of the barrier is provided at the position of the first area corresponding to the gap.
7. The electronic device according to claim 1, characterized in that: Also includes: A flow channel cover plate is disposed in the box body, and the first flow channel is formed in the flow channel cover plate.
8. The electronic device according to claim 7, characterized in that: The baffle is arranged in the flow channel cover plate.
9. The electronic device according to claim 1, characterized in that: The first flow channel has a first water inlet and a first water outlet, the first area is close to the first water inlet, and the second area is close to the first water outlet. When the coolant flows between the first water inlet and the first water outlet, the flow distribution of the coolant in the second area is changed by the barrier member so that more flow flows to the corresponding position of the first heat-generating component.
10. The electronic device according to claim 9, characterized in that: The first region is provided with a slope body at the position of the first water inlet, and the coolant is introduced into the first region through the slope body.
11. The electronic device according to claim 1, characterized in that: The width of the first region gradually increases in a direction toward the second region.
12. The electronic device according to claim 9, characterized in that: The box body further includes a second flow channel and a third flow channel. The second water outlet of the second flow channel is communicated with the first water inlet of the first flow channel. The third flow channel is connected with the first water outlet of the first flow channel.
13. The electronic device according to claim 12, characterized in that: An accommodating space is provided in the box body, the second flow channel is a U-shaped flow channel and is arranged around the accommodating space, and the accommodating space is suitable for accommodating a second heat-generating component.
14. The electronic device according to claim 12, characterized in that: The third flow channel is spaced apart from the first flow channel in a first direction, and the first direction is perpendicular to an extending plane of the first flow channel.
15. An electric assembly, characterized in that: An electronic device comprising any one of claims 1-14.
16. A vehicle, characterized in that: Includes the electric assembly as described in claim 15.
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