Multilayer stacked optical element using temporary and permanent bonding

Abstract

Systems and methods herein relate to using a silicon wafer, glass, or a device such as a substrate to form an optical device that includes stacked layers of optical elements. The optical elements discussed herein may be fabricated on a temporary or permanent substrate. In some examples, an optical device is fabricated to include a transparent substrate or device including a charge coupled device (CCD), or a complementary metal oxide semiconductor (CMOS) image sensor, a light emitting diode (LED), a micro LED ([mu] LED) display, an organic light emitting diode (OLED), or a vertical cavity surface emitting laser (VCSEL). The optical element can form an interlayer between the optical element layers, and the thickness of the interlayer can range from 1 nm to 3 mm.

Description

[0001] This application is a divisional application of the invention patent application with application number 201980028149.1. Technical Field

[0002] Embodiments of the present disclosure generally relate to optical devices and systems and methods for manufacturing optical device components. Background Art

[0003] Novel optical devices, including metasurfaces, can be patterned on one or both sides of transparent substrates and enable many optical device possibilities. However, conventional processing techniques, including optical lithography, require a minimum thickness for the glass substrate, and this thickness limit is not commercially viable for most optical devices of interest. The minimum substrate thickness limits processing options for subsequent thinning of the substrate when fabricating optical devices with elements on both the front and back surfaces of the substrate.

[0004] There are many problems to be solved in manufacturing novel optical devices on glass substrates, including metal contamination from the substrate to the lithography tool chuck, processing damage, glass transparency, metrology efficiency in the lithography tool, and other factors. For many optical applications, multiple layers of optical elements are used in optical devices to correct for aberrations. The use of multiple optical element layers can include patterning on the back side of the glass substrate to form a doublet. It can be achieved to join the doublet to another glass substrate to form a triplet, etc. This is a challenging process to perform cost effectively without damaging nano-sized features.

[0005] Further challenges in optical device fabrication include the fabrication of buffer layers up to several millimeters thick between optical elements. Conventional methods of optical element and structure fabrication can face manufacturing issues, including pattern alignment, which can make fabricating double-sided optical elements challenging.

[0006] Therefore, there remains a need for systems and methods for improved optical elements and methods of making improved optical elements. Summary of the invention

[0007] Embodiments of the present disclosure generally relate to optical devices including optical element layers and methods of forming optical devices. In one example, a method of forming an optical device includes the following steps: (a) forming a pattern in a target layer on a first substrate, wherein the pattern includes a plurality of islands separated by a plurality of grooves; and (b) forming a low refractive index material on top of the patterned target layer and in the plurality of grooves formed in the patterned target layer to form a first optical device. The method may further include the following steps: (c) forming an optical element layer stack on the first optical device by repeating steps (a) and (b) for multiple iterations.

[0008] In another example, a method for manufacturing an optical element includes the following steps: forming a first pattern in a first target layer, the first target layer is formed on a first substrate; forming a second pattern in a second target layer, the second target layer is formed on a second substrate. Then, the first pattern is bonded to a first side of a third substrate, the third substrate is formed of a transparent material, and the third substrate is about 10 μm thick to 3 mm thick. The method further includes the following steps: bonding a second pattern to a second side of the third substrate; peeling the first substrate from the first pattern; and peeling the second substrate from the second pattern.

[0009] In another example, a method of forming an optical element includes the following steps: forming a first pattern by imprinting a first target layer in a first position using a first pattern master stage, the first target layer being formed on a first side of a transparent substrate, wherein the transparent substrate is about 10 μm thick to about 3 mm thick. The method further includes the following steps: forming a second pattern by imprinting a second pattern in a second position on a second target layer formed on a second side of the transparent substrate using a second pattern master stage. The step of forming the second pattern in the second position includes: determining the second position in relation to the first pattern and aligning the second pattern master stage in the second position. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In accordance with the manner in which the above features of the present disclosure can be understood in detail, the present disclosure briefly summarized above may be more particularly described by reference to embodiments, some of which are illustrated in the accompanying drawings. It is noted, however, that the drawings illustrate only typical embodiments of the present disclosure and are therefore not to be considered limiting of its scope, as the present disclosure may admit to other equally effective embodiments.

[0011] Figure 1 The present invention is a flowchart of a method for manufacturing an optical device according to an embodiment of the present disclosure.

[0012] Figures 2A to 2I 1 is a series of partially schematic diagrams of cross-sections of optical element structures formed during the manufacture of an optical device according to an embodiment of the present disclosure.

[0013] Figure 3 4 is a partial schematic diagram of a cross section of an optical element structure according to an embodiment of the present disclosure.

[0014] Figure 4 The present invention is a flowchart of a method for manufacturing an optical element according to an embodiment of the present disclosure.

[0015] Figures 5A to 5F A series of partial schematic diagrams of cross-sections of optical element structures and optical element fabrication according to embodiments of the present disclosure.

[0016] Figures 6A to 6Cis a schematic diagram of a top view of an optical element structure according to an embodiment of the present disclosure.

[0017] Figures 7A to 7C is a schematic diagram of a bonding method during the manufacture of an optical device according to an embodiment of the present disclosure.

[0018] Figures 8A to 8B Schematic diagram of an optical element structure according to an embodiment of the present disclosure.

[0019] Fig. 9 Schematic diagram of an optical element structure formed on a device according to an embodiment of the present disclosure.

[0020] Fig.10 The present invention is a flowchart of a method for manufacturing an optical element according to an embodiment of the present disclosure.

[0021] Figures 11A to 11D is a cross-sectional view of an optical element structure according to an embodiment of the present disclosure, discussed together with operations of a method of manufacturing the optical element.

[0022] Fig.12 The present invention is a flowchart of a method for manufacturing an optical element according to an embodiment of the present disclosure.

[0023] Figures 13A to 13E is a cross-sectional view of an optical element structure according to an embodiment of the present disclosure, discussed together with operations of a method of manufacturing the optical element.

[0024] Fig.14 The present invention is a flowchart of a method for manufacturing an optical element according to an embodiment of the present disclosure.

[0025] Figures 15A to 15D is a cross-sectional view of an optical element structure according to an embodiment of the present disclosure, discussed together with operations of a method of manufacturing the optical element.

[0026] Wherever possible, identical reference numerals are used to designate identical elements that are shared among the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation. DETAILED DESCRIPTION

[0027] The systems and methods discussed herein may include mass production of optical devices that include double-sided and stacked optical element layers. As discussed herein, an "optical device" is a device configured to have a predetermined effect on light introduced therein. An optical device may include one or more optical element layers. An "optical element layer" includes one or more optical elements on which an encapsulation (filling) material may or may not be formed. The optical element layer discussed herein includes positive features that may be referred to as islands herein. Each island of the optical element layer is separated from an adjacent island by a negative feature, which is referred to as a groove herein. In some examples, a filling material may be used to fill the groove. Depending on the example, islands and grooves may be formed by high or low refractive index materials. The islands and grooves may have a variety of top views and cross-sectional dimensions, including polygonal, rounded, tapered, and combined geometries. The islands (and grooves) may be arranged in a sequential array, a random array, a patterned array, or a combination of the above in a top-to-bottom view. The optical element includes a single island or groove feature that each contributes to the optical response of light directed into the optical device.

[0028] The optical devices contemplated herein may include lenses, dot matrix projectors or holographic projectors, color filters, and collimators, as well as the elements and components described above. In some examples, the optical devices discussed herein may be implemented as augmented reality devices. In order to manufacture broadband elements and other optical devices for short wavelength light, the nano-sized optical elements in the optical element layer may have a maximum dimension of, for example, less than about 100 nm. Alternative patterning methods may be used to pattern these structures. In some examples, nanoimprint lithography (NIL) or EUV lithography may be applied. In one embodiment, nanoimprint lithography may be applied to imprint a hard mask, and then directly etch features based on the hard mask imprint without performing hard mask etching. Further, nanoimprint lithography may be applied to form an optical element layer directly on a substrate. The systems and methods discussed herein are capable of consistently forming both: high aspect ratio features with an aspect ratio of 20:1 or higher, and low aspect ratio features with an aspect ratio of, for example, 1:1 to 1:3.

[0029] In one example, the optical device is manufactured without using a glass substrate. In another example, the optical device is manufactured to include a glass substrate. In one embodiment, a target layer formed on top of a silicon (Si) substrate is patterned and then transferred to a device or a transparent substrate. As discussed herein, a transparent substrate is a substrate that is optically transparent in a predetermined wavelength range (within the wavelength range in which the optical device is intended to operate). The target layer may be a low refractive index material or a high refractive index material, depending on the embodiment. The target layer may be a single layer or may include one or more stacked layers of the same or different components. The method herein may further include directly stacking the patterned target layer onto the completed device while the patterned target layer (if sliced, before slicing) is still on the original substrate. For example, the optical element layer may be directly stacked onto a completed charge coupled device (CCD), or a complementary metal oxide semiconductor (CMOS) image sensor, a light emitting diode (LED), a micro LED (μLED) display, an organic light emitting diode (OLED) or a vertical cavity surface emitting laser (VCSEL) substrate or other substrate. The method discussed herein is in the form of an integrated process.

[0030] In one example, the optical device discussed herein is formed to include a filling layer. The filling layer is formed between the optical elements of the optical element layer. The filling layer may include an interlayer to form a space between the optical element layers of the stacked optical element layer, which is a portion of the filling layer formed between and on top of the optical element layers. The filling layer can be designed for specific functions associated with multiple wavelengths. Therefore, the optical element layer discussed herein can be configured as an independent optical element layer or an interactive optical element layer. Nanoimprint lithography can also be applied to directly imprint a pattern of features on a substrate, followed by deposition of a filling material, which can involve inkjetting, slot die coating, spin coating, or forming an inter-element (optical element) material, resulting in low-cost processing. In alternative embodiments, CVD, PVD, or ALD can be applied to form the optical element layer and / or filling layer discussed herein. The shapes of the optical elements in the optical element layer of the optical device discussed herein range from simple geometric shapes such as circles, triangles, or polygons to complex shapes that can be a combination of multiple geometric shapes.

[0031] In another example, an optical device can be manufactured by imprinting a negative photolithographic pattern (tone) of a target layer of a functional device. The negative photolithographic pattern is a pattern of islands and grooves formed in the target layer, and the target layer can be a low refractive index material. Then, the groove filling material can be formed by atomic layer deposition (ALD) or chemical vapor deposition (CVD). If a low refractive index material is used for the target layer, a groove filling material such as amorphous silicon (a-Si), SiN, TiO2, GaP or other materials can be deposited in and / or on the groove to form an optical element of the optical element layer. In one example, a-Si or SiN can be used for a light wavelength band close to the IR range, and TiO2 can be used for a light wavelength band close to the visible light range. The groove filling material can be formed by spin coating (spinning-on), CVD, or ALD. Then, another low refractive index material layer can be formed on the filling layer, such as silicon dioxide, doped silicon dioxide, fluorinated polymer, or other suitable porous material. The low refractive index material layer can be used as an interlayer to separate the optical element layer (high refractive index material layer) to replace an additional transparent substrate.

[0032] In some examples, the low refractive index materials discussed herein are self-planarizing materials and are selected in part for this property because, in some embodiments, planar surfaces are used for optical element manufacturing. In other examples, chemical mechanical planarization (CMP) is used to achieve a predetermined flatness of one or more layers including the low refractive index layer. The flatness may be within a tolerance between 1 nm and 5 nm. In some examples, the flatness tolerance is 2 nm. In other examples, the flatness tolerance may be less than 1 nm or greater than 5 nm, depending on the optical device to be manufactured.

[0033] In other examples, a double-sided optical device is formed on a transparent substrate to separate optical elements of adjacent optical element layers. The transparent substrate may have a thickness of 10 μm to about 3 mm or more. In this example, each of the two target layers is formed on a different temporary substrate. Each target layer is patterned, and the patterning may occur sequentially or simultaneously or in an overlapping manner. Depending on the embodiment, each target layer may be a low refractive index or a high refractive index material. Optionally, each patterned target layer may be filled. Each patterned target layer is bonded to a third substrate. The third substrate may be a transparent substrate and used as an interlayer to separate the two patterned target layers. The patterned target layers can then be peeled off from each temporary substrate separately. In one example, a pattern master stage may be formed to create patterns in one or both target layers. An imprint master stage may be used to directly imprint the target layer and / or a hard mask for patterning. In one example, a first pattern master stage is used to form a first pattern in a first target layer, and a second pattern master stage is used to form a second pattern in a second target layer.

[0034] In another example, a target layer on a substrate is patterned on a single side using nanoimprint lithography (NIL). A fill material may be used to fill the pattern formed in the target layer, the pattern is bonded to a second substrate, and then separated from the original substrate. In another example, a first target layer on a first substrate and a second target layer on a second substrate are patterned. The first substrate and the second substrate are bonded together to form a layer with a thickness of 10 μm to 3 mm or more. The first substrate and the second substrate may be of similar thickness or different thickness. Depending on the embodiment, the target layer may be patterned by extreme ultraviolet lithography (EUV), nanoimprint lithography (NIL), and / or etching.

[0035] Figure 1 Flowchart of method 100 for manufacturing an optical device according to an embodiment of the present disclosure. In one embodiment, method 100 is a batch process involving the simultaneous manufacture of multiple substrates. At operation 102, a first layer, which may be a protective layer and / or a release layer, is formed on a first substrate (e.g., a silicon substrate or other substrate such as a polymer or other material that may be transparent within a predetermined wavelength range). In one example of method 100, glass is not used as a substrate. In one example, the substrate is a completed device, such as a CCD, CMOS, VCSEL, LED, or other structure used as a substrate on which the optical device discussed herein can be manufactured directly. That is, the optical device discussed herein can be manufactured in situ, in Figure 1 and 4 The first layer formed at operation 102 may be a protective layer formed of SiN, SiO2, or may be a peeling layer formed of a high temperature adhesive. In one example, the high temperature adhesive used can withstand a temperature of up to about 280 degrees Celsius. In some examples, the first layer formed at operation 102 is a combination of a protective layer formed on the substrate and a peeling layer formed on the protective layer.

[0036] At operation 104, a first target layer is formed on the lift-off layer. As discussed herein, the target layer may be a low or high refractive index material patterned via a variety of operations. The first target layer may be formed of a-Si, SiN, TiO2, GaP, or other materials suitable for the formation of a plurality of optical elements. At operation 106, the layer formed at operation 104 is patterned (etched) via a wet or dry etching operation to form a plurality of grooves to expose the lift-off layer formed at operation 102. After patterning the first target layer at operation 106, at operation 108, a plurality of low refractive index materials or a plurality of materials are formed on the patterned first target layer via CVD, ALD, PVD, or spin coating processes. Further in one embodiment, at operation 108, CMP is used to achieve a predetermined flatness, which may be 1 nm to 5 nm on the layer surface.

[0037] A plurality of low refractive index materials that may be applied at operation 108 may be formed from silicon dioxide, doped silicon dioxide, fluorinated polymers, nanoparticle films, or porous materials. The low refractive index materials discussed herein are in contrast to "high" refractive index materials, such as amorphous and crystalline silicon, silicon nitride, titanium dioxide, gallium phosphide, tantalum pentoxide, gallium nitride, sulfide materials, polymers, and other materials having suitable optical properties. It is contemplated that materials and combinations of materials may be used to form the fill layers and / or optical element layers discussed herein, and these materials may be selected based on the target optical properties of the optical device manufactured in method 100.

[0038] On the top of the target layer and in the groove (the groove is formed between the islands of the target layer, as shown below Figures 2A to 2I The low refractive index material formed at operation 108 is formed in (shown in ). The top surface of the low refractive index material can be parallel to the substrate. The layer can have various thicknesses up to about 10 microns or more. Operations 104 to 108 can be applied to form a single optical element layer. In other examples, operations 104 to 108 can be repeated for multiple iterations (cycles), and multiple iterations can apply the same or different materials, heights, and patterns. Depending on the example, stacked optical element layers can be formed from the same or different materials. The cycle (of operations 104 to 108) can be repeated 2 to 100 times to form multiple stacked optical element layers.

[0039] In one embodiment, a low refractive index material may be used for the fill layer and for encapsulating the optical elements of the optical element layer. The fill layer may be formed to include an interlayer extending above the top surface of the optical elements of the first optical element layer to separate the optical elements of the first optical element layer from the optical elements of the second optical element layer. Thus, the optical elements of different optical element layers do not touch. The lower the refractive index of the material used for the fill / encapsulation, the lower the aspect ratio of the nanostructures (patterned features) that make up each optical element. In one embodiment, the lower aspect ratio produces a thinner optical element layer, and faster and cleaner etching. Therefore, the systems and methods herein achieve a more efficient manufacturing process in terms of time, cost, and complexity. In another example, when the fill material has a high refractive index, the height of the optical element (and therefore the optical element layer) increases.

[0040] After forming a predetermined number of optical element layers via operations 104 to 108, an optical element structure having one or more optical element layers is formed at operation 110. As discussed herein, an optical element structure is a structure formed during various operations of optical device fabrication. The optical element structure may be a final optical device, or may be further processed via thermal, mechanical, or thermo-mechanical operations. In one example, after forming the optical element structure at operation 110, one or more processes may occur at operation 112. These operations at 112 may vary based on whether release and / or protective layers are used in fabrication and the end use of the optical device.

[0041] In one example, at operation 112A, a second substrate may be bonded to the low index layer and opposite the first substrate. Thereafter, at operation 112B, the first substrate is removed. The removal at operation 112B may be accomplished by etching, grinding, polishing, heat, or other operations, or a combination of operations designed to heat the adhesive release layer above a predetermined temperature. At operation 112C, the optical element structure may be further processed, including dicing and / or bonding to secondary structures, which may include transparent substrates or devices such as CCDs, CMOSs, VCSELs, LEDs, or other structures. In various embodiments, the processing or multiple processing at operation 112 may include stacking two or more optical element layers directly on the completed device while the optical element layers remain coupled to the substrate (from operation 102).

[0042] In another example, operations 104 to 110 may be performed on a target layer or layers formed on a finished device (e.g., CCD, CMOS, VCSEL, LED, or other device) used as a substrate. In this example, an optical element layer or layers are formed in situ on the device substrate. In this example, at operation 112, further operations (e.g., slicing) may occur. In examples where a peeling layer is not used, the first substrate is not removed via peeling. In various embodiments, the optical element layer may be permanently bonded to a permanent transparent substrate. The permanent transparent substrate may be formed of glass, polymer, or other materials suitable for a variety of applications. This assembly may then be sliced ​​into smaller optical devices. Each optical device may be combined with a final device, or may be bonded to an array of devices on a wafer or sheet as a wafer or sheet. For example, the optical element layer may be stacked on a substrate of a finished CCD device, CMOS image sensor, or VCSEL, which may be referred to as an "integration process." In one example, the first substrate is removed via a thermal operation that melts or degrades the peeling layer until both the peeling layer and the first substrate are removed from the optical element structure. For example, if a release material having a thermal impedance as high as 280 degrees Celsius is used, the substrate may be removed by heating the optical device structure above about 280 degrees Celsius to remove the substrate.

[0043] Figures 2A to 2I1 is a series of partially schematic diagrams of cross-sections of optical element structures formed during the manufacture of an optical device according to an embodiment of the present disclosure. Figure 2A A first substrate 202 is shown. In one example, the first substrate 202 may be referred to as a temporary substrate and may be formed of silicon. In alternative embodiments, the first substrate 202 may be a finished device, such as a CCD, CMOS, VCSEL, LED, or other suitable device structure. The first substrate 202 may be bonded to the first target layer 206 via a peeling layer 204. In an example where the first substrate 202 is a finished device, the peeling layer 204 may not be applied because the finished device is a permanent substrate. In one embodiment, glass is not used as the first substrate 202. In one embodiment, the peeling layer 204 may be a single layer of high temperature adhesive or a protective dielectric layer.

[0044] In other embodiments, Figure 2A Insert in ( Figure 2A-1 ), the substrate includes a peeling interlayer 204A on a first substrate 202 and a barrier interlayer 204B on top of the peeling layer opposite the substrate. The peeling interlayer 204A (or 204 when used as a single layer) may include glue or other adhesives, configured to withstand temperatures up to about 280 degrees Celsius and be 1nm to 100nm thick. In another example, not shown here, the peeling layer 204 may only include a dielectric layer of SiO2 or SiN that is 1nm to 100nm thick and is formed by PVD, CVD, or other deposition operations. In other examples, the peeling layer 204 may be greater than 100nm thick. In one embodiment, Figure 2A Can be matched to Figure 1 The first target layer 206 may include a variety of materials as discussed herein, such as a-Si, SiN, TiO2, or GaP.

[0045] Figure 2B exhibit Figure 2A The device further comprises a patterned (etched) first target layer 206. The first target layer 206 is patterned to have a plurality of negative features (referred to as a plurality of grooves 208A), and a plurality of positive features (referred to as a plurality of islands 208B). In one embodiment, Figure 2B The diagram shows Figure 1 106 in operation 106. Each of the plurality of islands 208B may have a width 208C when measured parallel to the first substrate 202. In one example, the width 208C of each of the plurality of islands 208B may vary within the optical element layer. Although the optical element is illustrated here as having a cross-section that is approximately square or rectangular in shape, it is contemplated that in other examples the optical element may include tapered sidewalls to form a trapezoidal cross-section (not shown).

[0046] Figure 2CThe optical element structure including the first low refractive index layer 208 is shown. The first low refractive index layer 208 is formed on the top surface 206A of the island portion 208B and between the island portions 208B (for example, in the groove 208A). In one embodiment, the first low refractive index layer 208 extends a distance 210 above the top surface 206A of the first target layer 206. The distance 210 is the thickness (T 208 ). Accordingly, the first low refractive index layer 208 may include an interlayer because the distance 210 is used to separate the first target layer 206 (eg, optical element layer) from the subsequently stacked optical element layers. Figure 2C The structure can be similar to Figure 1 108 and may be referred to as first optical element layer 222. As discussed above, distance 210 may include an interlayer because this distance separates first optical element layer 222 from subsequently formed optical element layers. Filler material 210 may be adjusted (e.g., via material type and / or thickness) to a variety of distances within and between optical element layers to produce desired effects for single or multiple (double stack, triple stack, or more) optical device embodiments. First optical element layer 222 may be referred to as a single stack.

[0047] Figures 2D to 2G Diagram Figure 1 An example of an iteration of the loop of operations 104 to 108 in FIG. In one embodiment, Figure 2D A second target layer 212 formed on the fill material 210 is shown. Figure 2E A plurality of grooves 216A and a plurality of islands 216B formed on the second target layer 212 in response to patterning are shown. Figure 2F 2, the second low refractive index material forms the second low refractive index layer 214, which is formed in a similar manner to the first low refractive index layer 208. The structure formed by the second low refractive index layer 214 and the second target layer 212 may be referred to as a second optical element layer 224. The second low refractive index layer 214 may be formed to extend a distance 214A beyond the top 212A of the second target layer 212. In one embodiment, two different materials may be applied for each of the first target layer 206 and the second target layer 212.

[0048] In some examples (which may be combined with other examples and embodiments herein), different materials may be applied for each of the first low refractive index layer 208 and the second low refractive index layer 214. In one embodiment, the first optical element layer 222 may be configured for a first wavelength or a first range of wavelengths, and the second optical element layer 224 may be configured for a second wavelength or a second range of wavelengths. The first target layer 206 and the second target layer 212 may include the same or different patterns. Depending on the embodiment, each of the first target layer 206 and the second target layer 212 may have the same or different pattern attributes, including height (thickness), spacing, and material type. The combination of the first optical element layer 222 and the second optical element layer 224 may be referred to as a bi-stack.

[0049] In one embodiment, two different materials may be applied to each of the first target layer 206 and the second target layer 212. In another example that may be combined with other examples, two different materials may be applied to each of the first low refractive index layer 208 and the second low refractive index layer 214. In another embodiment, the same material may be applied to each of the first target layer 206 and the second target layer 212. In another example (which may be combined with other examples and embodiments), the same material may be applied to each of the first low refractive index layer 208 and the second low refractive index layer 214. Each of the first low refractive index layer 208 and the second low refractive index layer 214 has a thickness T 208 、T 214 . The thickness of each of the first low refractive index layer 208 and the second low refractive index layer 214 includes the distance that the low refractive index layer extends beyond the top surface of the optical element, respectively. For example, the first low refractive index layer 208 and the second low refractive index layer 214 extend from each of the top surfaces 206A and 212A by distances 210 and 214A, respectively, and the two distances can be the same or different distances. Therefore, each of the first optical element layer 222 and the second optical element layer 224 can be different heights. In another example, depending on the embodiment, each of the first optical element layer 222 and the second optical element layer 224 can be the same height. The extension of each filler layer beyond the optical element can be used as an interlayer to replace the glass substrate or to replace additional layers of other materials.

[0050] Figure 2G A third optical element layer 226 is shown formed of a third target layer 216 and a third low refractive index layer 218. The third low refractive index layer 218 may be formed of the same or different materials as the target layer and the low refractive index layer used in other optical element layers (e.g., the first optical element layer 222 and the second optical element layer 224). The third low refractive index layer 218 has a thickness T 218, which thickness includes a distance 218A that the third low refractive index layer 218 extends beyond the third target layer 216. Distance 218A can be the same or different than distances 210 and 214A, and optical element layers 222, 224, and 226 can be configured using a variety of thicknesses and thickness ratios, such as the ratio of the thickness of the optical element layer to the thickness of the low refractive index layer; or the dimensions within and between the optical element layers; or the dimensions within and between the filler layers, etc., to produce a desired effect. In one embodiment, each of distances 210, 214A, and 218A can be from about 1 micron to about 50 microns, and in some embodiments, can be 50nm to 2 microns, for example, if the optical element layers 222, 224, and / or 226 are configured to interact with light. The combination of the first optical element layer 222, the second optical element layer 224, and the third optical element layer 226 can be referred to as a triplet. In one example, at least one of the distances 210 , 214A, and 218A is less than 1 micron, and in other examples, at least one of the distances may be from about 50 nm to about 300 nm.

[0051] Although in Figures 2G to 2I In the embodiment, three optical element layers 222, 224, and 226 are shown. It is contemplated that in various embodiments, a single optical element layer (eg, Figure 2C ) or dual optical element layers (e.g. Figure 2F In other examples, four or more optical element layers may be stacked to form an optical device. 208 、T 214 , and T 218 Each of may be from about 100 nm to about 2 microns. In one embodiment, Figure 2G The overall thickness T of the optical device (which may include one or more stacked optical element layers) shown in OVERALL It can be from about 1 micron thick to about 2000 microns thick or thicker. In one embodiment, a color filter or interference filter or other optical filtering layer can be formed on the optical element layer stack, for example, on top of one or more optical element layers (e.g., first optical element layer 222, second optical element layer 224, or third optical element layer 226), depending on how many optical element layers are applied in the exemplary embodiment.

[0052] Figure 2GFurther illustrated is an example spacing 228 between optical elements formed in the first target layer 206. In an embodiment, the spacing 228 between optical elements may vary among and between optical elements formed in the first target layer 206 and among and between the target layers 206, 212, and 216. In one example, the spacing 228 between elements is greater than one wavelength in the encapsulation material (e.g., the first low refractive index layer 208), where the wavelength may be equal to a spacing 228 of about 1 micron. In one example, an IR optical device may be fabricated using a single optical element layer, a double stack, or a triple stack, or larger stacks. In another example, an RGB optical device may be fabricated using a single stack or double stack optical device. In another example, a white light or other broadband optical device may be fabricated from a double stack, a triple stack, or an optical device containing more than three optical element layers. In some examples, a white light optical device may be fabricated using a single optical element layer.

[0053] Figure 2H and 2I The transfer process for multiple optical element layers manufactured according to an embodiment of the present disclosure is illustrated. Figure 2H In the example, the second substrate 220 is bonded to the third optical element layer 226, which in this example may be referred to as the "top" or "outermost" optical element layer. The second substrate 220 may be made of glass, plastic, or other materials and may be optically transparent. Fig.2I In one example, the first substrate 202 is removed and the optical element structure may then be rotated. In one example, the structure may be rotated 180 degrees. In another example, the structure may be segmented into a plurality of separate elements. Other subsequent operations may be performed before, after, or without slicing or removing the first substrate 202, as discussed in detail herein.

[0054] Figure 3 FIG. 3 is a partial schematic diagram of a cross section 300 of an optical element structure according to an embodiment of the present disclosure. Figure 3 Display can be similar to Figures 2A to 2G , and a second portion 304 which is the same as the first portion 302. Figure 3306 of the first substrate 202 may be such that a plurality of individual optical devices may be formed by slicing such that each sliced ​​portion has a maximum diameter of 1 mm to 4 cm. In other examples, each sliced ​​portion may have a maximum diameter greater than 4 cm. Depending on the embodiment, the sliced ​​optical devices may be formed to be the same size or to be different sizes. Although the optical elements of the optical element layers 206, 212, 216 are shown as polygonal shapes, it is contemplated that in other examples, the optical elements may have a cross-sectional geometry including rounded, triangular, or polygonal shapes, or combinations thereof. Further, it is contemplated that the cross-sectional geometry may be tapered, angled, curved, or configured in a variety of geometries.

[0055] Figure 4 4 is a flow chart of a method 400 for manufacturing an optical element according to an embodiment of the present disclosure. In the method 400, at operation 402, a layer, which may be a peeling layer and / or a protective layer, may be formed on a substrate, as discussed above. At operation 404, a target layer may be formed on the peeling layer, and at operation 406, the target layer may be patterned to form a plurality of grooves to expose the peeling layer. The patterning at operation 406 may be performed via dry or wet etching or via a nanoimprint operation. At operation 408, a material (e.g., a-Si, SiN, TiO2, GaP, or other material) may be deposited in the plurality of grooves and across the top surface of the patterned target layer. At operation 410, for example, a plurality of remaining materials formed across the top surface of the optical element layer are removed to expose the optical element layer, while the grooves remain filled with material. At operation 412, after the plurality of remaining materials are removed at operation 410, a plurality of low refractive index materials are formed on the resulting planar surface. In some examples, at operation 412, CMP is used to achieve a predetermined flatness of the low refractive index material.

[0056] Operations 406 to 412 may be applied to form a single optical element layer. In other examples, operations 406 to 412 may be repeated for multiple iterations (loops) to form a stack of optical element layers. Each optical element layer of the stack may have the same or different optical element layer materials, heights, and patterns. If a filler material is included in one or more optical element layers of the stack, the filler material used for each filler layer may be the same or different low refractive index material. This cycle of operations 406 to 412 may be repeated 2 to 100 times to form a plurality of optical elements. After a predetermined number of optical element layers are formed via operations 406 to 412, an optical element structure is formed at operation 414, which may include one or more optical element layers. At operation 416, the optical element structure 414 may be further processed. In one example, at operation 416A, a second substrate may be bonded to the low refractive index layer and opposite to the first substrate, and subsequently at operation 416B, the first substrate is removed. The second substrate may be a transparent substrate or a device such as a CCD, CMOS, VCSEL, LED, OLED, or μLED.At operation 416C, the structure may be further processed, including dicing and / or bonding to secondary structures.

[0057] In various embodiments at operation 416, which may represent one or more operations, the optical element structure may be permanently bonded to another transparent substrate. After bonding, the structure may be sliced ​​into smaller elements and bonded to the final device separately, or the substrate may be bonded as a wafer or sheet to an array of devices on a wafer or sheet. For example, the optical element layer may be stacked on a substrate of a completed CCD device, CMOS image sensor, or VCSEL or other device. In another example, operations 406 to 412 may be performed on a completed device, such as a CCD, CMOS, VCSEL, LED, or other device, so that the optical element layer is formed in situ on the device. In this example, at operation 416, further operations may occur, such as slicing, but without using a peeling layer.

[0058] Figures 5A to 5F is a series of schematic diagrams of an alternative method of manufacturing an optical device according to an embodiment of the present disclosure. Figure 5A A substrate 502 is shown, which may be a silicon wafer on which a lift-off layer 504 is formed. The lift-off layer 504 may be similar to Figure 2A The peeling layer 204 in the embodiment of the present invention may include a barrier layer (not shown). The barrier layer may be a portion of the peeling layer 504 and may be formed between the adhesive portion of the peeling layer 504 and the target layer 506. In one example, the target layer 506 may be formed of a low refractive index material. In another example, the substrate 502 is a CCD, CMOS, VCSEL, LED, or other device suitable for a variety of applications, and an optical element is formed in situ on the substrate 502. Figure 4Operations 402 and 404 discussed in the above form Figure 5A device.

[0059] Figure 5B The target layer 506 is shown formed on the lift-off layer 504. The target layer 506 is etched to form a plurality of recesses 508A and islands 508B, as discussed above in operation 406. Figure 5C In the embodiment, a first optical element layer 510 may be formed on the target layer 506 and between the islands 508B and in the grooves 508A, similar to the discussion at operation 408. A portion of the first optical element layer 510 is removed (indicated by distance 512), such as Figure 5D As shown and discussed in operation 410 . Figure 5D Optical element height 526 is shown, and in some embodiments, optical element height 526 can range from about 400 nm to about 1500 nm. In alternative embodiments, optical element height 526 can be from 100 nm to 400 nm, and in other embodiments, optical element height 526 can be from 50 nm to 100 nm. As discussed herein, the optical element heights on the optical element layer are uniform, resulting in a flat top surface of the optical element layer.

[0060] Figure 5E The second filler layer 514 is shown formed on the first optical element layer 510 after removing a portion of the first optical element layer 510 as discussed at operation 410. Figure 4 412 in, and the second filler layer 514 may or may not include the same composition as the target layer 506. The second filler layer 514 may include an interlayer, and the interlayer, such as thickness and composition within and between optical element layer structures, may be adjusted to produce a desired effect. Figure 5E The structure in can be referred to as the first optical element layer 516. Fig. 5F Diagram Figure 5E The structure has an additional second optical element layer 524 formed on the first optical element layer 516. The second optical element layer 524 can be formed in a manner similar to the first optical element layer 516. The second optical element layer 524 includes a second optical element 520 and a third filling layer 518. The third filling layer 518 can be formed of a low refractive index material. Another filling layer 522 is formed on top of the second optical element 520 and the third filling layer 518. The top surface of the second optical element 520 is coplanar with the third filling layer 518. In one example, a-Si or SiN can be used for an optical wavelength band close to the IR range, and TiO2 can be used for an optical wavelength band close to the visible light range.

[0061] Figures 6A to 6C is a schematic diagram of a top view of an optical element structure according to an embodiment of the present disclosure. Figures 6A to 6Cis a schematic diagram of a top-down view of optical elements, showing only the view of the topmost optical element. Thus, the optical element layer located in the lower layer of the optical element layer stack may include the same Figures 6A to 6C The top layers shown in the discussion may be different configurations or the same configurations. Fig. 6A A first plurality of optical elements 704 is shown formed on a substrate 702. The first plurality of optical elements 704 are shown as having a top view cross-section with a circular or elliptical shape. The first plurality of optical elements 704 have vertical spacing 706 and horizontal spacing 708. Depending on the embodiment, one or both of the vertical spacing 706 and the horizontal spacing 708 may vary within and between the first plurality of optical elements 704. Although Fig. 6A 7 shows three rows 710 of optical elements, comprising the first plurality of optical elements 704, various embodiments may contain more or fewer rows with different spacings. The rows 710 may be spaced at equal intervals, or may be spaced at random intervals.

[0062] Figure 6B A second plurality of optical elements 712 is shown formed on substrate 702. Second plurality of optical elements 712 are shown as having a top view cross section of a square or other polygonal shape. Second plurality of optical elements 712 have vertical spacing 714 and horizontal spacing 716 among and between adjacent optical elements 712 of each pair of plurality of optical elements 712. Each of vertical spacing 714 and horizontal spacing 716 may vary depending on the embodiment. Although in Figure 6B 4 shows four rows 718 of optical elements, various embodiments may contain more or fewer rows. Figure 6B 718 are shown as each of the four rows 718 of the second plurality of optical elements 712 being aligned along a shared axis, in an alternative embodiment, the alignment occurs along the vertical axis in the direction of the vertical spacing 714. In another example, the second plurality of optical elements 712 may be aligned along both horizontal and vertical positions (axes) to form a sequential array (not shown). In the sequential array example of optical elements, each optical element of the second plurality of optical elements 712 is spaced at equal intervals in both the horizontal spacing 716 and the vertical spacing 714. In various examples, the second plurality of optical elements 712 may have various polygonal or non-polygonal cross-sections and may include sharp edges or rounded edges or a combination thereof.

[0063] Figure 6CA third plurality of optical elements 720 are formed on a display substrate 702, wherein the third plurality of optical elements 720 have a top view cross-section of an irregular shape that varies among and between individual optical elements of the third plurality of optical elements 720. The third plurality of optical elements 720 have vertical spacing 722 and horizontal spacing 724 among and between the elements that vary depending on the embodiment. In one example, the vertical spacing 722 is non-uniform among and between the third plurality of optical elements 720. In another example, the horizontal spacing 724 is non-uniform among and between the third plurality of optical elements 720. In yet another example, both the vertical spacing 722 and the horizontal spacing 724 of the third plurality of optical elements 720 are non-uniform. Although in Figure 6C 4 shows four rows 726 of optical elements, various embodiments may contain more or fewer rows. Figure 6C 726, in an alternative embodiment, the alignment occurs along a vertical axis in the direction of vertical spacing 722. In another example, the third plurality of optical elements 720 may be aligned in both horizontal and vertical positions to form a sequential array (not shown), wherein each optical element 720 is spaced equidistantly in both horizontal spacing 724 and vertical spacing 722. The geometric shapes applied to the plurality of optical elements (including 708, 712, 720, and others) as discussed herein may be irregular shapes as well as triangular or other geometric shapes suitable for various embodiments. In some examples, the diameter of the optical elements varies within and between rows 726. In other examples, the diameter of each optical element 720 in a single row may vary within the row. Figures 6A to 6C The top view shown in is illustrative, and it is contemplated that other spacings of the optical elements are possible. For example, the spacing of the optical elements discussed herein may be varied to produce a sequential array with equidistant spacings among and between the optical elements, a random array with random spacings, or a patterned array with a repeating regular or irregular spacing pattern.

[0064] Figures 7A to 7C Schematic diagram of a bonding method for optical elements according to an embodiment of the present disclosure. Fig. 7AA first optical element structure 800A is shown, including an optical element layer stack 828 of a first optical element layer 802, a second optical element layer 804, and a third optical element layer 806. Each optical element layer 802, 804, and 806 includes a plurality of optical elements 812, 816, and 820, respectively. Each optical element layer 802, 804, and 806 further includes a low refractive index material layer 814, 818, and 822 formed on top of and in the grooves between each plurality of optical elements 812, 816, and 820. The third optical element layer 806 is formed on a substrate 808. In one example, the third optical element layer 806 has a layer 810 formed between the substrate 808 and the third optical element layer 806. As discussed herein, the layer 810 can be a protective layer, a release layer, or a combination thereof, and can be formed to have a thickness of 100 nm or greater. The optical element layer stack 828 has a top bonding layer 824 formed on the first optical element layer 802. The top bonding layer 824 has a thickness of 20 nm to 100 nm. The second substrate 830 has a second bonding layer 826 formed on the second substrate 830. As discussed above, the second substrate 830 can be a transparent substrate made of glass, polymer, or other materials suitable for a variety of applications.

[0065] Figure 7B A second optical element structure 800B is shown in which a second substrate 830 is bonded to the optical element layer stack 828. The second substrate 830 is bonded to the optical element layer stack 828 via a top bonding layer 824 and a second bonding layer 826 formed on the second substrate 830. Figure 7C The third optical element structure 800C is shown. The third optical element structure 800C is a structure in which the substrate 808 is removed from the second optical element structure 800B. Figures 7A to 7C 800C, three optical element layers 802, 804, and 806 are shown, and a fewer or greater number of optical element layers may be used depending on the embodiment. The second substrate 830 may be 100 microns to 500 microns or greater. In one example, after the second substrate 830 is bonded to the third optical element structure 800C, the second substrate 830 may be thinned from its original thickness, for example, from 500 microns to 100 microns, using CMP or other methods.

[0066] Figures 8A to 8B An optical element structure according to an embodiment of the present disclosure is shown. Fig. 8AA first optical element structure 900A is shown prior to assembly / stacking. The first optical element structure 900A includes a first optical element layer 906 formed on a substrate 908. The first optical element layer 906 is bonded via a layer 910, which may be formed of SiO2 or other materials. In other examples, layer 910 may be a release layer of a high temperature resistant adhesive. The second optical element layer 904 is bonded to the first optical element layer 906, and the third optical element layer 902 is bonded to the second optical element layer 904. The second substrate 916 may have a first bonding layer 914 and a second bonding layer 918 formed on both sides. In addition, the device 922 has a device bonding layer 920 formed thereon. The device 922 may include SiO2 having a thickness of 20nm to 10μm.

[0067] Figure 8B The second optical element structure 900B is shown. The second optical element structure 900B includes Fig. 8A 900A. The second optical element structure 900B shows a second substrate 916, which is bonded to the third optical element layer 902 via a top bonding layer 912 formed on the third optical element layer 902. In the second optical element structure 900B, the layer 910 and the substrate 908 are removed by, for example, etching, grinding, polishing, or other methods. In addition, a device 922 (such as a CMOS, CCD, VCSEL, or other device 922) is bonded to the second substrate 916 via a second bonding layer 918 and a device bonding layer 920 (each of which can include SiO2 with a thickness of 1nm to 100nm). The second substrate 916 can be 100 microns to 500 microns, and after the second substrate 916 is bonded to the second optical element structure 900B, the second substrate 916 can be thinned from the original thickness using CMP or other methods, for example from 500 microns to 100 microns.

[0068] Fig. 91 is a diagram of an optical element layer stack 1018. The optical element layer stack 1018 is bonded to a device 1016. In one example, the assembly 1000 of the optical element layer stack 1018 is bonded to a device 1016 (which may be a CMOS, CCD, VCSEL, or other device). The optical element layer stack 1018 is formed on a substrate 1008, which has a layer 1010 formed between the optical element layer stack 1018 and the substrate 1008. The layer 1010 may include a release layer or a protective layer or a combination thereof. The optical element layer stack 1018 is made of three optical element layers: a first optical element layer 1002, a second optical element layer 1004, and a third optical element layer 1006. In other examples, the optical element device may include more or fewer optical element layers than shown. Device 1016 is bonded to optical element layer stack 1018 via first bonding layer 1012 formed on first optical element layer 1002 and second bonding layer 1014 formed on device 1016. As discussed herein, optical element layer stack 1018 may be formed and then bonded to device 1016. In another example, optical element layer stack 1018 may be pre-formed and bonded to device 1016. In another example, optical element layer stack 1018 may be formed in situ on device 1016. In some examples, not shown herein, optical element layers may be formed on the outermost optical element layer, such as Fig. 9 A protective layer of filling material is formed on the first optical element layer 1002.

[0069] Fig.10 11 is a flow chart of a method 1100 for manufacturing an optical element according to an embodiment of the present disclosure. Figures 11A to 11D is a cross-sectional view of an optical element structure, discussed in conjunction with the operations of method 1100. At operation 1102, shown at Fig.11A , patterning a first target layer 1202 on a first substrate 1204 to form a first pattern 1206. The first pattern 1206 includes a plurality of islands 1210. Each pair of adjacent islands of the plurality of islands 1210 is separated by a negative spacing (which may be referred to as a groove 1208). The first pattern 1206 may be formed by optical lithography and etching, or by nanoimprint lithography (NIL) and etching, or by directly imprinting the first target layer 1202. At operation 1104, optionally, a low refractive index material (not shown) may be used to fill the first pattern 1206, particularly the groove 1208 of the first pattern 1206.

[0070] At operation 1106, the Fig. 11B, patterning the second target layer 1212 formed on the second substrate 1222 to form a second pattern 1214. The second pattern 1214 includes a plurality of islands 1216, and each pair of adjacent islands of the plurality of islands 1216 is separated by a groove 1218. The second pattern 1214 may be formed by optical lithography and etching, or by nanoimprint lithography (NIL) and etching, or by directly imprinting the second target layer 1212. At operation 1108, optionally, a low refractive index material (not shown here) may be used to fill the second pattern 1214, in particular the groove 1218 of the second pattern 1214. In some examples, the low refractive index material is not used to fill the first pattern 1206 or the second pattern 1214. In some examples, the low refractive index material is used to fill the first pattern 1206 at operation 1104. In other examples, the low refractive index material is used to fill the second pattern 1214 at operation 1108. In a further example, each of the first pattern 1206 and the second pattern 1214 is filled with a low refractive index material at operations 1104 and 1108, respectively.

[0071] Fig. 11C 1 is a view of the optical element structure after operations 1110 and 1112. At operation 1110, the first pattern 1206 is bonded to the first side 1220A of the third substrate 1220. The third substrate 1220 can be formed of a transparent material, including glass, polymer, diamond, or other materials. Depending on the embodiment, the third substrate 1220 can be about 10 μm thick to 3 mm thick. At operation 1112, the second pattern 1214 is bonded to the second side 1220B of the third substrate 1220 and opposite the first pattern 1206.

[0072] At operation 1114, the first substrate 1204 and the second substrate 1222 are removed. Therefore, each of the first substrate 1204 and the second substrate 1222 may be referred to as a temporary substrate or a carrier substrate. Fig.11D The optical element structure after operation 1114 is shown. In some examples, not shown here, there may be a bonding material layer, also referred to as a peeling layer, similar to the peeling layer 204 discussed above. The peeling layer may be formed between the first target layer 1202 and the first substrate 1204, and / or between the second target layer 1212 and the second substrate 1222. The peeling layer may be an adhesive material or a heat-activated material (e.g., separates upon application of heat). The peeling layer may be used at operation 1114 to cause the first pattern 1206 and the second pattern 1214 to be separated from the first substrate 1204 and the second substrate 1222, respectively, via thermal, chemical, and / or mechanical means. At operation 1116, the peeling layer may be further processed. Fig.11DThe optical element structure in the embodiment of the present invention may be formed by annealing and / or adding (stacking) additional optical elements and transparent substrates. In one example, at operation 1116, at least operations 1102, 1106, 1110, 1112, and 1114 may be repeated in an iterative manner to form additional optical element layers.

[0073] Fig.12 is a flow chart of a method 1300 for manufacturing an optical element according to an embodiment of the present disclosure. Figures 13A to 13E 1 is a cross-sectional view of an optical element structure, discussed together with the operations of method 1300. At operation 1302, a first pattern 1402 is formed in a first target layer on a first surface 1404A of a first substrate 1404, such as Fig.13A The first pattern 1402 includes a plurality of grooves 1408 between islands 1406. The first pattern 1402 may be formed at operation 1302 using optical lithography and etching, NIL and etching, or direct imprinting.

[0074] At operation 1304, optionally, a low refractive index material 1410 is used to fill the plurality of grooves 1408 of the first pattern 1402, such as Fig. 13B . The low refractive index material 1410 may be a self-planarizing material such that after operation 1304, the top of the low refractive index material 1410 is coplanar with the tops of the plurality of islands 1406. At operation 1306, a second pattern 1412 is formed from a second target layer formed on a first surface 1414A of a second substrate 1414. Fig. 13C 14. The second pattern 1412 is shown in FIG. The second pattern 1412 includes a plurality of grooves 1416. Each groove of the plurality of grooves 1416 is formed between each pair of adjacent islands 1418. The plurality of grooves 1416 and the plurality of islands 1418 may have different widths, heights, and cross-sectional shapes. Although the plurality of islands 1418 are shown as being generally polygonal in cross-sectional view, other shapes may be used, such as rounded, triangular, or a combination thereof, and may be tapered, angled, curved, etc., depending on the geometry. The second pattern 1412 may be formed at operation 1306 using optical lithography and etching, NIL and etching, or direct imprinting.

[0075] At operation 1308, optionally, a low refractive index material 1420 is used to fill the second pattern 1412, such as Fig.13DAt operation 1310, one or both of the first substrate 1404 and the second substrate 1414 are planarized. In one example of operation 1310, each of the second side 1404B of the first substrate 1404 and the second side 1414B of the second substrate 1414 is planarized in one or more sub-operations. Next, at operation 1312, the second side 1404B of the first substrate 1404 is bonded to the second side 1414B of the second substrate 1414, as shown. Fig.13E . Thus, optional planarization at operation 1310 may result in bonding the first substrate 1404 to the second substrate 1414 at operation 1312. At operation 1314, further processing of the optical element structure may occur. Further processing at operation 1314 may include annealing, adding other optical element structures via stacking, slicing, or other operations.

[0076] Fig.14 is a flow chart of a method 1500 for manufacturing an optical element according to an embodiment of the present disclosure. Figures 15A to 15D is a cross-sectional view of an optical element structure, discussed in conjunction with method 1500. Fig.15A 1 is a cross-sectional view of a first transparent substrate 1604. The first transparent substrate 1604 may be formed of glass, polymer, diamond, or other optically transparent material or combination of optically transparent materials. A first target layer 1602 is formed on a first side 1604A of the first transparent substrate 1604. A second target layer 1606 is formed on a second side 1604B of the first transparent substrate 1604.

[0077] At operation 1502, a first master stage pattern is formed. The first master stage pattern can be used to imprint a pattern in a target layer on a substrate. The first master stage pattern can be formed at operation 1502 using a rigid material (e.g., silicon or a silicon-containing material) or from a less rigid material (including a low or high refractive index material). At operation 1504, the material used to form the first master stage pattern can be selected based on a number of factors, including the composition and material properties of the target layer to be imprinted. The first master stage pattern can be formed at operation 1502 by optical lithography and etching, NIL and etching, or directly imprinting the first master stage target layer. The first master stage pattern formed at operation 1502 is used to manufacture a first pattern 1622 at operation 1504. Fig. 15B 1608. The first pattern 1622 is shown in FIG. The first pattern 1622 includes a plurality of islands 1610 separated by grooves 1608. The plurality of islands 1610 extend from the first side 1604A of the first transparent substrate 1604. At operation 1506, optionally, a filling layer (not shown here) may be formed in the grooves 1608. The filling layer may be formed of a low refractive index material.

[0078] At operation 1508, a second master stage pattern may be formed of a rigid material (e.g., silicon or a silicon-containing material) or of a less rigid material (including a low or high refractive index material). The second master stage pattern may be used to imprint a target layer on a substrate, and the second master stage pattern may include a different pattern than the first master stage pattern. Depending on the composition of the target layer to be imprinted at operation 1510, the second master stage pattern may be formed of a variety of materials. The second master stage pattern may be formed by optical lithography and etching, NIL and etching, or directly imprinting the second master stage target layer at operation 1508. At operation 1510, the second pattern master stage is aligned with the second target layer 1606 using the first pattern formed at operation 1506 as a reference point for alignment. At operation 1512, a second pattern 1626 is formed in the second target layer 1606. Fig. 15C The second pattern 1626 shown in FIG. 1 includes a plurality of islands 1616 extending from the second side 1604B of the first transparent substrate 1604. The islands 1616 are separated by grooves 1618. At operation 1514, optionally, a filling layer may be formed in the grooves 1618. The filling layer may be formed of a low refractive index material.

[0079] At operation 1516, the optical element structure may undergo further processing. The further processing at operation 1516 may include annealing, adding other optical element structures through stacking, slicing, or other operations. In one example of operation 1516, at least operations 1504, 1508, 1510, and 1512 may be repeated to form an optical element stack, such as Fig.15D As shown in . Fig.15D Included is a first transparent substrate 1604, a first pattern 1622, and a second pattern 1626 (formed in operations 1504 and 1508). Fig.15D The second transparent substrate 1620 is further included. The first side 1620A of the second transparent substrate 1620 includes a third pattern 1624. The second side 1620B of the second transparent substrate 1620 is bonded to the first side 1602A of the first pattern 1622. In some examples, the third pattern 1624 ( Fig.15D The third pattern 1624 may be formed by the first main stage, the second main stage, or a third main stage different from the first main stage and the second main stage.

[0080] Accordingly, the examples discussed herein can be used in a variety of combinations to manufacture stacked optical elements. Two or more optical elements can be manufactured via optical lithography or NIL and etching, and / or direct imprinting using a pattern master. The optical element can be manufactured on a temporary substrate that is bonded to the target layer and then removed after the patterned target layer is bonded to a permanent or carrier (second temporary) substrate. A filling layer comprising an interlayer can be used to separate the optical element layers from each other. The filling layer can extend beyond the top surface of the underlying optical element layer by a distance of about 1 nm to about 3 mm to form an interlayer portion of the filling layer. In other examples, the optical element can be manufactured on a permanent substrate that is a transparent substrate having various thicknesses up to about 3 mm.

[0081] Although various embodiments incorporating the teachings of the present invention have been shown and described in detail herein, those skilled in the art to which the invention pertains may readily devise numerous other varied embodiments that still incorporate the teachings.

Claims

1. An optical element layer stack, comprising: a substrate having a first side and a second side, the substrate comprising one of a CCD, CMOS, VCSEL, LED, OLED, and μLED component; and A first layer is formed on the first side of the substrate, the first layer including a plurality of island portions, wherein each of the plurality of island portions is spaced apart from each other and consists of an optical element layer. 2 . The optical element layer stack of claim 1 , further comprising a second layer formed on the second side of the substrate, the second layer comprising a plurality of island portions, each island portion being spaced apart from one another and consisting of an optical element layer.

3. The optical element layer stack of claim 1, wherein each of the plurality of island portions comprises a cross-sectional dimension selected from the group consisting of a polygonal geometry, a rounded geometry, a tapered geometry, or a combination thereof.

4. An optical element layer stack according to claim 1, wherein each of the plurality of island portions is arranged in one or more rows, each row being along one or more horizontal axes extending through and parallel to the first layer, wherein each of the one or more rows of the plurality of island portions are parallel to each other.

5. The optical element layer stack of claim 1, wherein the plurality of islands comprises an arrangement selected from the group consisting of a sequential array, a random array, a patterned array, or a combination thereof.

6. The optical element layer stack of claim 2, wherein the second layer is aligned with the first layer. 7 . The optical element layer stack according to claim 2 , further comprising a third layer formed on the first layer, the third layer comprising a plurality of third island portions, wherein each of the plurality of third island portions is spaced apart from each other and consists of an optical element layer. 8 . The optical element layer stack according to claim 7 , further comprising a fourth layer formed on the third layer, the fourth layer comprising a plurality of fourth island portions, wherein each of the plurality of fourth island portions is spaced apart from each other and consists of an optical element layer. 9 . The optical element layer stack according to claim 8 , further comprising a fifth layer formed on the second layer, the fifth layer comprising a plurality of fifth island portions, wherein each of the plurality of fifth island portions is spaced apart from each other and consists of an optical element layer. 10 . The optical element layer stack according to claim 9 , further comprising a sixth layer formed on the fifth layer, the sixth layer comprising a plurality of sixth island portions, wherein each of the plurality of sixth island portions is spaced apart from each other and consists of an optical element layer.

11. An optical element layer stack, comprising: a substrate having a first side, the substrate comprising one of a CCD, CMOS, VCSEL, LED, OLED, and μLED component; forming a first layer on the first side of the substrate, the first layer comprising a plurality of first island portions, wherein each of the plurality of first island portions is spaced apart from each other and consists of an optical element layer; and A second layer is formed on the first layer, the second layer including a plurality of second island portions, wherein each of the plurality of second island portions is spaced apart from each other and consists of an optical element layer.

12. The optical element layer stack of claim 11, wherein each of the plurality of first island portions and the plurality of second island portions comprises a cross-sectional dimension selected from the group consisting of a polygonal geometry, a rounded geometry, a tapered geometry, or a combination thereof.

13. The optical element layer stack of claim 11, wherein the second layer is aligned with the first layer.

14. The optical element layer stack of claim 11, wherein each of the plurality of first islands and the plurality of second islands comprises an arrangement selected from the group consisting of a sequential array, a random array, a patterned array, or a combination thereof. 15 . The optical element layer stack according to claim 11 , further comprising a third layer formed on the second layer, the third layer comprising a plurality of third island portions, wherein each of the plurality of third island portions is spaced apart from each other and consists of an optical element layer.

16. The optical element layer stack of claim 11, wherein the plurality of islands on the second layer are aligned to form a sequential array.

17. An optical element layer stack, comprising: a substrate having a first side and a second side, the substrate comprising one of a CCD, CMOS, VCSEL, LED, OLED, and μLED component; forming a first layer on the first side of the substrate, the first layer comprising a plurality of first island portions, wherein each of the plurality of first island portions is spaced apart from each other and consists of an optical element layer; and A second layer is formed on the second side of the substrate, the second layer including a plurality of second island portions, wherein each of the plurality of second island portions is spaced apart from each other and consists of an optical element layer.

18. The optical element layer stack of claim 17, wherein each of the plurality of first island portions and the plurality of second island portions comprises a cross-sectional dimension selected from the group consisting of a polygonal geometry, a rounded geometry, a tapered geometry, or a combination thereof.

19. The optical element layer stack of claim 17, wherein the second layer is aligned with the first layer.

20. The optical element layer stack of claim 17, wherein each of the plurality of first islands and the plurality of second islands comprises an arrangement selected from the group consisting of a sequential array, a random array, a patterned array, or a combination thereof.

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