Light-emitting component and preparation method thereof, light-emitting chip and display device

Abstract

The invention provides a light-emitting component and a preparation method thereof, a light-emitting chip and a display device.According to the light-emitting component, an attaching layer and a supporting part are arranged on a light-emitting unit and a color conversion unit, the supporting part makes contact with at least one of the color conversion unit and the light-emitting unit, and the attaching layer makes contact with the color conversion unit and the light-emitting unit; the box thickness between the light-emitting unit and the color conversion unit can be supported while the light-emitting unit and the color conversion unit are bonded, so that the inclination angle of the light-emitting unit relative to the color conversion unit is reduced, and the color cast problem caused by the fact that the inclination angle of the light-emitting unit relative to the color conversion unit is too large can be solved.

Description

Technical Field

[0001] The present invention belongs to the field of display technology, and in particular relates to a light-emitting component and a preparation method thereof, a light-emitting chip, and a display device. Background Art

[0002] With the development of display technology, LED display substrates have the advantages of pure chromaticity, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long life, impact resistance, wide viewing angle, stable and reliable operation, etc. LED display substrates will become the most advantageous new generation display media. Among them, LED display substrates include multiple LED light-emitting chips arranged in an array. The research and development of LED light-emitting chips, especially mini-LED and micro-LED light-emitting chips, has become an important topic in the display field. Summary of the invention

[0003] The present invention at least partially solves the existing color shift problem and provides a light-emitting component and a preparation method thereof, a light-emitting chip, and a display device.

[0004] In a first aspect, an embodiment of the present invention provides a light-emitting component, comprising: a light-emitting unit and a color conversion unit disposed on a light-emitting side of the light-emitting unit;

[0005] The light-emitting unit includes a light-emitting functional layer, which includes a first electrode, a first semiconductor layer and a light-emitting layer stacked along a first direction; the light-emitting unit also includes a second semiconductor layer, which is arranged on the light-emitting side of the light-emitting functional layer, and the second semiconductor layer includes a connecting portion, which is connected to the light-emitting functional layer; the light-emitting unit also includes a common electrode, which is connected to the second semiconductor layer;

[0006] The light-emitting component also includes a bonding layer and a support portion located between the light-emitting unit and the color conversion unit, wherein the support portion is arranged in contact with at least one of the color conversion unit and the light-emitting unit, and the bonding layer is arranged in contact with both the color conversion unit and the light-emitting unit.

[0007] Optionally, the supporting portion includes a first supporting area and a second supporting area; the first supporting area and the second supporting area are respectively arranged close to two opposite side edges of the light emitting unit.

[0008] Optionally, the support portion includes a first support layer and a second support layer, the first support layer is disposed in contact with the color conversion unit, and the second support layer is located on a side of the first support layer away from the color conversion unit;

[0009] In the thickness direction of the first supporting layer, a parallel projection area of ​​the first supporting layer on the color conversion unit is larger than a parallel projection area of ​​the second supporting layer on the color conversion unit.

[0010] Optionally, the light-emitting component further comprises a first substrate located on a side of the color conversion unit away from the light-emitting unit; the color conversion unit comprises:

[0011] A defining dam layer, wherein the defining dam layer has a plurality of opening areas;

[0012] A plurality of optical function parts are located inside the opening area and are arranged one-to-one with the opening area, and at least part of the optical function parts are used to convert the color of light entering the optical function parts;

[0013] A first encapsulation layer is located on a side of the definition dam layer away from the first substrate.

[0014] Optionally, the color conversion unit further includes:

[0015] a light shielding layer located between the first substrate and the defining dam layer, the light shielding layer comprising a plurality of light through holes, the plurality of opening areas being arranged in one-to-one correspondence with the plurality of light through holes, and an orthographic projection of the light through holes on the first substrate overlapping with an orthographic projection of the opening areas on the first substrate;

[0016] A filter unit is located between the first substrate and the optical functional part, and the orthographic projection of the filter unit on the first substrate overlaps with the orthographic projection of the corresponding light-through hole on the first substrate;

[0017] The filter units are arranged in one-to-one correspondence with the optical functional parts, and the orthographic projection of the filter units on the first substrate overlaps with the orthographic projection of the corresponding optical functional parts on the first substrate.

[0018] Optionally, the light emitted by the light-emitting functional layer is blue light or ultraviolet light;

[0019] The optical functional part includes: a first functional part for converting the light emitted by the light emitting functional layer into red light; a second functional part for converting the light emitted by the light emitting functional layer into green light; and a third functional part for converting the light emitted by the light emitting functional layer into blue light or maintaining the blue light state;

[0020] The plurality of filter units are arranged in one-to-one correspondence with the plurality of light-through holes;

[0021] The multiple filter units include: a first filter unit arranged corresponding to the first functional part, the first filter unit is a red color block or a red-green-transmitting and blue-reflecting filter film; a second filter unit arranged corresponding to the second functional part, the second filter unit is a green color block or a red-green-transmitting and blue-reflecting filter film; a third filter unit arranged corresponding to the third functional part, the third filter unit is a blue color block or a transparent layer.

[0022] Optionally, the light-emitting unit includes a plurality of the light-emitting functional layers, the second semiconductor layer includes an auxiliary part, at least a portion of the auxiliary part is located between adjacent connecting parts, the auxiliary part and the connecting part are an integral structure, and the common electrode is connected to the auxiliary part.

[0023] Optionally, the support portion includes a support portion body and a plurality of avoidance through holes, and the avoidance through holes are arranged in one-to-one correspondence with the light-emitting functional layers, so that the light emitted by the light-emitting functional layer enters the opening area through the avoidance through holes;

[0024] The support body is arranged around the avoidance through hole.

[0025] Optionally, the supporting portion body includes a first supporting layer and a second supporting layer, the first supporting layer is arranged in contact with the first encapsulation layer, and the second supporting layer is located on a side of the first supporting layer away from the first encapsulation layer;

[0026] In the thickness direction of the first supporting layer, a parallel projection area of ​​the first supporting layer on the color conversion unit is larger than a parallel projection area of ​​the second supporting layer on the color conversion unit.

[0027] Optionally, the auxiliary portion includes a first auxiliary portion connected to the common electrode, a second auxiliary portion located between two adjacent connecting portions or between the connecting portion and the first auxiliary portion, and a third auxiliary portion surrounding the first auxiliary portion, the second auxiliary portion and the connecting portion as a whole;

[0028] The common electrode comprises a first side and a second side which are arranged opposite to each other, and a third side and a fourth side which are arranged opposite to each other; the first side, the second side, the third side and the fourth side are all located in the third auxiliary portion;

[0029] The second supporting layer includes a plurality of first supporting units, and the first supporting units are distributed on the first side, the second side, the third side, and the fourth side.

[0030] Optionally, the second supporting layer further includes a plurality of second supporting units, and the second supporting units are located at positions corresponding to the first auxiliary part and / or the third auxiliary part.

[0031] Optionally, the first supporting unit and the second supporting unit are in the shape of at least one of a columnar table and a bar table.

[0032] Optionally, the projection shape of the second semiconductor layer on the first substrate is a rectangle;

[0033] The number of the connecting parts is 3, and the first auxiliary part and the 3 connecting parts are arranged in a 2*2 array.

[0034] Optionally, a thickness of the support portion in a thickness direction of the second semiconductor layer is between 0.5 micrometers and 3 micrometers.

[0035] Optionally, the thickness of the first supporting layer in the thickness direction of the second semiconductor layer is less than 2 microns.

[0036] Optionally, the opening area includes a first opening surface close to the first substrate and a second opening surface away from the first substrate, and an orthographic projection of the support portion on the first substrate does not overlap with an orthographic projection of the second opening surface on the first substrate.

[0037] Optionally, the light emitting assembly further comprises: a dam layer; the dam layer is arranged around the outer periphery of the light emitting unit to block the light emitted from the light emitting unit to the periphery;

[0038] Optionally, the dam layer and the supporting portion are prepared integrally.

[0039] Optionally, a surface of the defining dam layer on one side close to the first encapsulation layer has a concave-convex portion, the concave-convex portion is an uneven surface of the defining dam layer, and the first encapsulation layer fills the concave-convex portion.

[0040] Optionally, the light emitting component further includes a grating structure; the grating structure is arranged on a side of the second semiconductor layer close to the bonding layer.

[0041] In a second aspect, an embodiment of the present invention further provides a light-emitting chip, which includes the light-emitting component as described above.

[0042] In a third aspect, an embodiment of the present invention further provides a display device, which includes the light-emitting chip and a driving substrate as described above, wherein the light-emitting chip array is arranged on the driving substrate.

[0043] In a third aspect, an embodiment of the present invention further provides a method for preparing a light-emitting component, which comprises:

[0044] preparing a support portion on at least one of a light emitting side of the light emitting unit and a light incident side of the color conversion unit;

[0045] placing bonding glue on at least one of the light emitting side of the light emitting unit and the light incident side of the color conversion unit;

[0046] The light emitting side of the light emitting unit and the light incident side of the color conversion unit are bonded to each other to achieve the alignment of the light emitting unit and the color conversion unit, and the bonding adhesive forms a bonding layer.

[0047] The present invention has the following beneficial effects:

[0048] The light-emitting component provided by the embodiment of the present invention, by providing a support portion and a bonding layer between the light-emitting unit and the color conversion unit, can use the support portion to support the light-emitting unit and the color conversion unit while aligning and bonding the two, thereby improving the uniformity of the box thickness between the color conversion unit and the light-emitting unit, reducing the inclination angle of the light-emitting unit relative to the color conversion unit, and further improving the color deviation problem caused by the excessive inclination angle of the light-emitting unit relative to the color conversion unit, improving the light output effect, and further improving the display effect of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0050] Figure 1 A top view parallel to the light emitting surface of the light emitting assembly provided according to some embodiments of the present disclosure;

[0051] Figure 2 for Figure 1 A cross-sectional view along the AA direction;

[0052] Figure 3 A top view parallel to the light emitting surface of the light emitting unit provided according to some embodiments of the present disclosure;

[0053] Figure 4 for Figure 3 A cross-sectional view along the BB direction;

[0054] Figure 5 Another cross-sectional view of a light emitting assembly provided according to some embodiments of the present disclosure;

[0055] Figure 6 is another cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure;

[0056] Figure 7 is another cross-sectional view of a light emitting assembly provided according to some embodiments of the present disclosure;

[0057] Figure 8 is another cross-sectional view of a light emitting assembly provided according to some embodiments of the present disclosure;

[0058] Fig. 9 A top view of the first supporting layer provided according to some embodiments of the present disclosure in a direction parallel to the light emitting surface of the light emitting unit;

[0059] Fig.10 Another top view of the first supporting layer provided according to some embodiments of the present disclosure in a direction parallel to the light emitting surface of the light emitting unit;

[0060] Fig.11 A top view of the second semiconductor layer provided according to some embodiments of the present disclosure in a direction parallel to the light emitting surface of the light emitting unit;

[0061] Fig.12 A top view of the second supporting layer provided according to some embodiments of the present disclosure in a direction parallel to the light emitting surface of the light emitting unit;

[0062] Fig.13 A flowchart of a method for preparing a light-emitting component according to some embodiments of the present disclosure;

[0063] Fig.14 A schematic diagram of the structure of an initial wafer provided according to some embodiments of the present disclosure;

[0064] Fig.15 A schematic diagram of the structure of a large plate of an initial joining plate provided according to some embodiments of the present disclosure;

[0065] Fig.16 It is a schematic structural diagram of an initial joining plate provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0066] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0067] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0068] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0069] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0070] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0071] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0072] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0073] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0074] In the color conversion LED display panel in the related art, a "double-layer bank" solution is usually used to solve the problem of color crosstalk between multiple LED light-emitting components and the problem of inconsistent color deviation of LED light-emitting components in different directions. Specifically, the "double-layer bank" solution is: the LED light-emitting component is embedded in the entire CF substrate, and the bank structure is set around the LED and in the non-display area of ​​the CF substrate to ensure that the light emitted laterally from the LED light-emitting component cannot leak from the side wall of the LED light-emitting component. However, since the LED light-emitting component and the CF substrate need to be bonded together with adhesive, it is easy to cause uneven thickness problems, causing the LED light-emitting component to tilt relative to the CF substrate, thereby causing the light emitted by the LED light-emitting component to tilt relative to the normal emission direction, and then causing color deviation after refraction through the CF substrate, affecting the display effect.

[0075] In order to solve the above technical problems, Figure 1 and Figure 2As shown, the present disclosure provides a light-emitting component 1, which includes: a light-emitting unit 11, a color conversion unit 12 arranged on the light-emitting side of the light-emitting unit 11, and a bonding layer 13 and a support portion 14 arranged between the light-emitting unit 11 and the color conversion unit 12.

[0076] The light-emitting unit 11 includes a light-emitting functional layer 111, and the light-emitting functional layer 111 includes a first electrode 1112, a first semiconductor layer 1111 and a light-emitting layer 1113 stacked along a first direction; specifically, Figure 2 As shown, the first direction is the direction from the light-emitting functional layer 111 to the color conversion unit 12; it can be understood that the first direction is parallel to the light-emitting direction of the light-emitting functional layer 111. Figure 1-Figure 4 As shown, the light-emitting unit 11 further includes a second semiconductor layer 112, which is disposed on the light-emitting side of the light-emitting functional layer 111; the second semiconductor layer 112 includes a connecting portion 1121, which is connected to the light-emitting functional layer 111, and the light-emitting unit 11 further includes a common electrode 113, which is connected to the second semiconductor layer 112. Specifically, the first electrode 1112 and the common electrode 113 can be used as an anode and a cathode, respectively, so that after the first electrode 1112 and the common electrode 113 are fed with current, the first semiconductor layer 1111, the light-emitting layer 1113, and the second semiconductor layer 112 therebetween are transported with holes and electrons, thereby stimulating the light-emitting layer 1113 to emit light.

[0077] For example, Figure 4 As shown, the common electrode 113 includes a first common electrode layer 1131 and a second common electrode layer 1132 sequentially stacked along a first direction; wherein the first common electrode layer 1131 is used to be electrically connected to an external wiring, and the second common electrode layer 1132 is electrically connected to the second semiconductor layer 112. The second common electrode layer 1132 can play a role in current expansion.

[0078] Exemplarily, the common electrode 113 may be a common cathode.

[0079] Exemplarily, the first electrode 1112 is made of an anode material such as indium tin oxide (ITO) or silver (Ag); the common electrode 113 is made of a cathode material such as an alloy metal; the first semiconductor layer 1111 is, for example, a P-type gallium nitride (GaN) layer; the light-emitting layer 1113 is, for example, a quantum well material (MQW) layer; and the second semiconductor layer 112 is, for example, an N-type gallium nitride layer.

[0080] For example, a current spreading layer may be disposed between the first electrode 1112 and the first semiconductor layer 1111. The material of the current spreading layer may be indium tin oxide (ITO), and its function is, for example, to facilitate the transmission of holes.

[0081] Exemplarily, the second semiconductor layer 112 may further include a buffer layer made of gallium nitride, which is disposed on a side of the second semiconductor 112 close to the bonding layer 13 and located on a side of the N-type gallium nitride layer away from the light-emitting functional layer 111 .

[0082] For example, Figure 2 and Figure 4 As shown, the side of the light-emitting functional layer 111 away from the second semiconductor layer 112 is also covered with an insulating protection layer 1114 to protect the light-emitting functional layer 111 and the second semiconductor layer 112 .

[0083] like Figure 2 As shown, the bonding layer 13 of the light emitting component 1 is arranged in contact with the color conversion unit 12 and the light emitting unit 11 to bond the color conversion unit 12 to the light emitting unit 11, thereby forming the light emitting component 1. It should be noted that the bonding layer 13 can allow the light emitted by the light emitting unit 11 to pass through, that is, the bonding layer 13 is light-transmissive, so as to ensure that the light emitting component 1 emits light normally. Exemplarily, the material of the bonding layer 13 is, for example, an organic adhesive material such as epoxy resin, so as to achieve the bonding of the color conversion unit 12 and the light emitting unit 11 by utilizing the bonding effect of the adhesive material.

[0084] like Figure 2 As shown, the support portion 14 of the light-emitting component 1 is arranged in the same layer as the bonding layer 13, and the support portion 14 is arranged in contact with at least one of the color conversion unit 12 and the light-emitting unit 11 to be supported between the color conversion unit 12 and the light-emitting unit 11, so that the box thickness between the color conversion unit 12 and the light-emitting unit 11 remains consistent, thereby reducing the inclination angle of the light-emitting unit 11 relative to the color conversion unit 12, thereby improving the color deviation problem caused by the excessive inclination angle of the light-emitting unit 11 relative to the color conversion unit 12, improving the light output effect, and thereby improving the display effect of the display device.

[0085] In some examples, such as Figure 5 As shown, the support portion 14 includes a first support area 14A and a second support area 14B. The first support area 14A and the second support area 14B are respectively arranged close to two opposite sides of the light-emitting unit 11 to provide a balanced support force between the light-emitting unit 11 and the color conversion unit 12 in the two side areas of the light-emitting unit 11, thereby improving the uniformity of the box thickness between the light-emitting unit 11 and the color conversion unit 12 in the central area corresponding to the light-emitting unit 11, thereby achieving the effect of improving the color deviation.

[0086] It is easy to understand that the thickness of the first supporting area 14A and the second supporting area 14B of the supporting portion 14 in the first direction are consistent, so that the box thickness at the corresponding positions of the two side areas of the light-emitting unit 11 is consistent, so that the relative surfaces of the light-emitting unit 11 and the color conversion unit 12 corresponding to the central area of ​​the light-emitting unit 11 are parallel, that is, the box thickness in the central area between the light-emitting unit 11 and the color conversion unit 12 is uniform.

[0087] Furthermore, in some preferred examples, the thickness of each position of the support portion 14 in the first direction is equal, so as to further ensure the uniformity of the box thickness between the light-emitting unit 11 and the color conversion unit 12, thereby further improving the color deviation problem of the light-emitting component 1.

[0088] In some examples, such as Figure 2 As shown, the support portion 14 includes a first support layer 141 and a second support layer 142. The first support layer 141 is disposed in contact with the color conversion unit 12, and the second support layer 142 is located on a side of the first support layer 141 away from the color conversion unit 12. In the thickness direction of the first support layer 141, the parallel projection area of ​​the first support layer 141 on the color conversion unit 12 is greater than the parallel projection area of ​​the second support layer 142 on the color conversion unit 12; specifically, as shown in FIG. Figure 2 As shown, the partial cross section of the support portion 14 is generally in a "T" shape, the relatively wider part of the "T" shape is the first support layer 141, and the relatively narrow part is the second support layer 142. Since the parallel projection area of ​​the second support layer 142 on the color conversion unit 12 is small, the second support layer 142 can easily pass through the bonding layer 13 and stably combine with it, and remain stable in the thickness direction of the first support layer 141, so that the second support layer 142 can support the first support layer 141 in the thickness direction of the first support layer 141; and since the parallel projection area of ​​the first support layer 141 on the color conversion unit 12 is large and is arranged close to the light incident side of the color conversion unit 12, the first support layer 141 can share the pressure applied to the color conversion layer to prevent the color conversion layer from being squeezed and deformed.

[0089] Or, in other examples, Figure 6 and Figure 7 As shown, the parallel projection sizes of the first supporting layer 141 and the second supporting layer 142 of the supporting portion 14 on the color conversion unit 12 are consistent, so that in the manufacturing process, the two can be integrally formed, thereby saving process steps and reducing process costs.

[0090] In some examples, such as Figure 2As shown, the light-emitting component 1 also includes a first substrate 15 located on the side of the color conversion unit 12 away from the light-emitting unit 11. The color conversion unit 12 includes a defining dam layer 121, a plurality of optical functional parts 122 and a first encapsulation layer 123. The defining dam layer 121 has a plurality of opening areas so that the light emitted by the light-emitting unit 11 can pass through the plurality of opening areas. The plurality of optical functional parts 122 are arranged in a one-to-one correspondence with the plurality of opening areas, and each optical functional part 122 is located in a corresponding opening area; at least part of the optical functional part 122 is used to convert the color of the light entering the optical functional part 122. The first encapsulation layer 123 is located on the side of the defining dam layer 121 away from the first substrate 15 to encapsulate the defining dam layer 121 and the plurality of optical functional parts 122, thereby protecting the defining dam layer 121 and the plurality of optical functional parts 122.

[0091] Exemplarily, the first substrate 15 is a glass substrate. Specifically, the first substrate 15 is transparent in the visible light band.

[0092] For example, Figure 2 As shown, the first encapsulation layer 123 can also encapsulate and define a side surface of the dam layer 121 close to the first substrate 15 , as well as encapsulate and define a peripheral surface of the dam layer 121 .

[0093] In some examples, the color conversion unit 12 further includes a light shielding layer 124 and a filter unit 125. The light shielding layer 124 is located between the first substrate 15 and the limiting dam layer 121; the light shielding layer 124 includes a plurality of light holes, and a plurality of opening areas are arranged one by one with the plurality of light holes, and the orthographic projection of each light hole on the first substrate 15 overlaps with the orthographic projection of the corresponding opening area on the first substrate 15, so that the light emitted through the plurality of opening areas can pass through the light holes and be emitted from the light emitting side of the light emitting component 1. The filter unit 125 is located between the first substrate 15 and the optical function part 122; the orthographic projection of the filter unit 125 on the first substrate 15 overlaps with the orthographic projection of the corresponding light hole on the first substrate 15. The filter unit 125 is arranged in a one-to-one correspondence with the optical functional part 122, and the orthographic projection of the filter unit 125 on the first substrate 15 overlaps with the orthographic projection of the corresponding optical functional part 122 on the first substrate 15, so that the light passing through the optical functional part 122 can enter the filter unit 125, and the filter unit 125 filters the light to obtain light of a specified color (or wavelength).

[0094] In some examples, the light emitted by the light-emitting functional layer 111 is blue light or ultraviolet light. Exemplarily, the optical functional part 122 is made of, for example, a quantum dot material, which can emit light under the excitation of ultraviolet light or blue light.

[0095] like Fig.13As shown, the optical function part 122 includes a first function part, a second function part and a third function part; specifically, the first function part is used to convert the light emitted by the light-emitting function layer 111 into red light; the second function part is used to convert the light emitted by the light-emitting function layer 111 into green light; the third function part is used to convert the light emitted by the light-emitting function layer 111 into blue light or maintain the blue light state. A plurality of filter units 125 are arranged in a one-to-one correspondence with a plurality of light-through holes.

[0096] Exemplarily, the first functional part includes a red quantum dot material that converts light into red light; preferably, the first functional part also includes scattering particles for scattering light. Here, after the light emitted by the corresponding light-emitting functional layer is directed to the first functional part distributed in the corresponding opening area, the first light can be converted into red light by the red quantum dots, and the light and red light can be scattered by the scattering particles to ensure that more light can be converted into red light by the red quantum dots, and the emission angle of the converted red light can be larger, so as to ensure that the viewing angle of the light-emitting component is larger.

[0097] Exemplarily, the second functional part includes a green quantum dot material that converts light into green light; preferably, the first functional part also includes scattering particles for scattering light. Here, after the light emitted by the corresponding light-emitting functional layer is directed to the first functional part distributed in the corresponding opening area, the first light can be converted into green light by the green quantum dots, and the light and green light can be scattered by the scattering particles to ensure that more light can be converted into green light by the green quantum dots, and the emission angle of the converted green light can be larger, so as to ensure that the viewing angle of the light-emitting component is larger.

[0098] Exemplarily, the third functional part is used to convert light into blue light or maintain blue light emission. Exemplarily, when the light contains only blue light, the third functional part can be a transparent part or include blue quantum dots; wherein the transparent part is used for direct transmission of light, and the blue quantum dots can be used to convert the light into blue light with a wavelength different from that of the light. Preferably, the third functional part also includes scattering particles for scattering the light. Here, after the light emitted by the corresponding luminous functional layer is directed to the third functional part distributed in the corresponding opening area, the light can be scattered by the scattering particles to ensure that the blue light has a larger emission angle, thereby ensuring that the viewing angle of the light-emitting component integrated with this light-emitting component is larger. For example, when the light contains ultraviolet light, the third functional part includes blue quantum dots for converting the light into blue light, or the third functional part is simultaneously distributed with scattering particles for scattering the light and blue quantum dots for converting ultraviolet light into blue light.

[0099] Moreover, the plurality of filter units 125 include a first filter unit 125a, a second filter unit 125b and a third filter unit 125c; wherein the first filter unit 125a is a red color block or a red-green-reflecting blue filter film, and is arranged corresponding to the first functional portion to ensure that red light passes through; the second filter unit 125b is a green color block or a red-green-reflecting blue filter film, and is arranged corresponding to the second functional portion to ensure that green light passes through; the third filter unit 125c is a blue color block or a transparent layer, and is arranged corresponding to the third functional portion to ensure that blue light passes through.

[0100] Exemplarily, the red color resist can transmit red light and absorb light of other colors. In this way, the light emitted from the first functional part can be emitted after passing through the first filter unit, and the first filter unit can filter out light of other colors except red light to ensure that the blue light component in the light is filtered out.

[0101] Exemplarily, the red-green anti-blue filter film can allow the red light portion of the light emitted from the first functional part to pass through and reflect the blue light. In this way, the red light in the light can be emitted through the first filter unit, and the blue light can be reflected back to the first functional part by the first filter unit, so that the red quantum dots in the first functional part can excite the blue light into red light, thereby further improving the excitation efficiency of the red quantum dots.

[0102] Exemplarily, the green color resist can transmit green light and absorb light of other colors. In this way, the light emitted from the second functional part can be emitted after passing through the second filter unit, and the second filter unit can filter out light of other colors except green light to ensure that the blue light component in the light is filtered out.

[0103] Exemplarily, the above-mentioned red-green-transmitting and blue-reflecting filter film can allow the green light portion of the light emitted from the second functional part to pass through and reflect the blue light. In this way, the green light in the light can be emitted through the second filter unit, and the blue light can be reflected back to the second functional part by the second filter unit, so that the green quantum dots in the second functional part can excite the blue light into green light, thereby further improving the excitation efficiency of the green quantum dots.

[0104] For example, the blue color resist can transmit blue light and absorb light of other colors. In this way, the light emitted from the third functional part can be emitted after passing through the third filter unit, and the third filter unit can filter out light of other colors except blue light, so that the third filter unit transmits relatively pure blue light.

[0105] Exemplarily, since the first functional portion, the second functional portion and the third functional portion can all generate blue light, a transparent layer is used as the third filter unit to transmit the blue light.

[0106] In some examples, such as Figure 1 As shown, there are multiple light-emitting functional layers 111 in the light-emitting unit 11. The second semiconductor layer 112 includes an auxiliary portion 1122, at least part of which is located between adjacent connecting portions 1121, and the auxiliary portion 1122 makes the connecting portions 1121 an integrated structure; the common electrode 113 is connected to the auxiliary portion 1122; that is, the multiple light-emitting functional layers 111 are all connected to the entire second semiconductor layer 112, that is, the multiple light-emitting functional layers 111 share the same second semiconductor layer 112.

[0107] In a specific embodiment, reference Figure 1 The portion of the auxiliary portion 1122 located between adjacent connecting portions 1121 is connected to one connecting portion 1121 on one side and to another connecting portion 1121 on the other side.

[0108] In some examples, such as Fig.10 As shown, the support portion 14 includes a support portion body and a plurality of avoidance holes 143, and the avoidance holes 143 are arranged one by one with the light-emitting functional layer 111, so that the light emitted by the light-emitting functional layer 111 can enter the opening area through the avoidance holes 143. The support portion body is arranged around the avoidance holes 143 to block the light emitted obliquely from the light-emitting functional layer 111, and prevent the oblique light from being reflected into the second semiconductor layer 112 when encountering the limiting dam surface in the color conversion unit 12, thereby avoiding light crosstalk in the second semiconductor layer 112; and it can also prevent light from crosstalk inside the color conversion unit 12, thereby causing cross-color between the multiple filter units 125. It is easy to understand that the support portion 14 is made of a light-shielding material.

[0109] In some examples, the opening area defining the dam layer 121 includes a first opening surface close to the first substrate 15 and a second opening surface facing away from the first substrate 15; the orthographic projection of the support portion 14 on the first substrate 15 does not overlap with the orthographic projection of the second opening surface on the first substrate 15 to avoid blocking the normal emission of light emitted by the light-emitting unit 11.

[0110] In some examples, such as Fig.11 As shown, the auxiliary portion 1122 includes a first auxiliary portion 1122a connected to the common electrode 113, a second auxiliary portion 1122 located between two adjacent connecting portions 1121 or between the connecting portion 1121 and the first connecting portion 1121, and a third auxiliary portion 1122c surrounding the first auxiliary portion 1122a, the second auxiliary portion 1122, and the connecting portion 1121 as a whole.

[0111] The common electrode 113 includes a first side and a second side that are arranged opposite to each other, and a third side and a fourth side that are arranged opposite to each other; the first side, the second side, the third side, and the fourth side are all located at the third auxiliary portion 1122c. The second supporting layer 142 of the supporting layer includes a plurality of first supporting units 1421, and the first supporting units 1421 are distributed on the first side, the second side, the third side, and the fourth side to support the cell thickness in the area corresponding to each light-emitting functional layer 111, thereby ensuring that the cell thickness in the area corresponding to each light-emitting functional layer 111 is uniform, and further ensuring that the light emitted by each light-emitting functional layer 111 can be emitted along the normal light path without color deviation.

[0112] In some examples, the support portion body includes a first support layer 141 and a second support layer 142, the first support layer 141 is arranged in contact with the first encapsulation layer 123, and the second support layer 142 is located on the side of the first support layer 141 away from the first encapsulation layer 123; in the thickness direction of the first support layer 141, the parallel projection area of ​​the first support layer 141 on the color conversion unit 12 is greater than the parallel projection area of ​​the second support layer 142 on the color conversion unit 12.

[0113] Further, such as Fig.12 As shown, the second supporting layer 142 also includes a plurality of second supporting units 1422, and the second supporting units 1422 are located at corresponding positions of the first auxiliary portion 1122a and / or the third auxiliary portion 1122c, that is, the box thickness is supported in the peripheral area of ​​all light-emitting functional layers 111, thereby ensuring that the box thickness in the area at the edge of the light-emitting unit 11 is uniform, thereby ensuring that the light emitted at the edge of the light-emitting unit 11 can be emitted along the normal light path without color deviation.

[0114] like Fig. 9 As shown, the first support layer 141 can be a whole-surface support layer with multiple avoidance through holes 143 to minimize the possibility of the color conversion unit 12 being squeezed and deformed; the multiple first support units 1421 and second support units 1422 in the second support layer 142 can support the first support layer 141 in the form of "point" support, and can be stably combined with the bonding layer 13 to ensure that the entire support body stably supports the light-emitting unit 11 and the color conversion unit 12.

[0115] Alternatively, in some other examples, the first supporting layer 141 may be a partial layer structure located between a plurality of adjacent avoidance through holes 143. Fig.10 As shown, the parallel projection shape of the first supporting layer 141 on the color conversion unit 12 is, for example, a "cross" shape; however, in this case, the first supporting layer 141 can block light crosstalk between adjacent filter units 125, but cannot prevent lateral light leakage in the edge area of ​​the light-emitting unit 11.

[0116] This example does not impose too many restrictions on the shapes of the first support unit 1421 and the second support unit 1422, which can stably support the first support layer 141. Exemplarily, the shapes of the first support unit 1421 and the second support unit 1422 are at least one of a columnar platform or a bar platform.

[0117] In some examples, such as Fig.11 As shown, the projection shape of the second semiconductor layer 112 on the first substrate 15 is a rectangle. The number of the connecting parts 1121 is 3, corresponding to the three color filter units 125. The first auxiliary part 1122a and the three connecting parts 1121 are arranged in a 2×2 array, so that the projection shape of the light-emitting unit 11 on the plane where the first substrate 15 is located is generally rectangular, so as to facilitate cutting during the preparation process.

[0118] In some examples, the thickness of the support portion 14 and the bonding layer 13 in the first direction are consistent.

[0119] In some examples, the length of the support portion 14 in the thickness direction of the second semiconductor layer 112 is between 0.5 microns and 3 microns. Specifically, if the thickness of the support portion 14 is less than 0.5 microns, the support portion 14 is not easy to be formed during the manufacturing process, and the bonding layer 13 arranged on the same layer as the support portion 14 will have a problem of uneven thickness during the manufacturing process, thereby affecting the morphology of the final support portion 14 and the bonding layer 13; and if the thickness of the support portion 14 is greater than 3 microns, the bonding layer 13 will be too thick, resulting in a large distance from the light-emitting surface of the light-emitting unit 11 to the light-entering surface of the color conversion unit 12, thereby causing crosstalk of light in the bonding layer 13, which is easy to cause cross-color; and it is easy to understand that the closer the light-emitting surface of the light-emitting unit 11 is to the light-entering surface of the color conversion unit 12, the larger the light angle range that can be received, and conversely, if the distance from the light-emitting surface of the light-emitting unit 11 to the light-entering surface of the color conversion unit 12 is too large, the light angle range received by the color conversion unit 12 will be smaller, thereby causing the effective utilization rate of light to be reduced. It can be seen that the length of the support portion 14 in the thickness direction of the second semiconductor layer 112 is set within the above-mentioned size range, which can not only facilitate the molding of the support portion 14 and the bonding layer 13 during the manufacturing process, but also avoid the bonding layer 13 set on the same layer as the support portion 14 from being too thick, thereby reducing the risk of color crosstalk and improving the effective utilization of light.

[0120] In some preferred examples, the thickness of the support portion 14 in the thickness direction of the second semiconductor layer may range from 0.8 microns to 1.2 microns. Within this range, while further ensuring the molding of the support portion 14 and the bonding layer 13, the risk of crosstalk of light in the bonding layer 13 can be further reduced, the risk of cross-coloring can be reduced, and the effective utilization rate of light can be further improved.

[0121] In some examples, when the length of the support portion 14 in the thickness direction of the second semiconductor layer 112 is in the range of 0.5 microns to 3 microns, the thickness of the first support layer 141 in the thickness direction of the second semiconductor layer is less than 2 microns, so as to leave enough thickness for the second support layer 142 so that the second support layer 142 can provide enough supporting force; moreover, it can also prevent the partial bonding layer 13 on the same layer as the second support layer 142 from being too thin to cause uneven thickness.

[0122] Furthermore, since the first support layer 141 mainly serves to block the light emitted obliquely from the light-emitting functional layer 111, the minimum thickness of the first support layer 141 is negatively correlated with the light resistance of the material of the first support layer 141, that is, the stronger the light resistance of the material of the first support layer 141, the smaller the minimum thickness of the first support layer 141, and vice versa, the weaker the light resistance of the material of the first support layer 141, the thicker the minimum thickness of the first support layer 141. For example, when the material light resistance (OD) of the first support layer 141 is 4, its light transmittance is about 0.01%. If the processing accuracy allows, the preferred range of the thickness of the first support layer 141 in the first direction is about 1 micron. In this case, the first support layer 141 can not only block the light emitted laterally from the light-emitting functional layer 111, but also leave enough thickness for the second support layer 142 so that the second support layer 142 can provide enough support.

[0123] In some examples, the proportion of the orthographic projection area of ​​the second support layer 142 in the direction of the first substrate 15 to the orthographic projection area of ​​the light emitting unit 11 in the direction of the first substrate 15 is 1500-4500 um. 2 / mm 2 The contact surface between the second support layer 142 and the light emitting unit 11 is 1500-4500 um. 2 / mm 2 . Within this range, the second support layer 142 can provide sufficient support force between the light-emitting unit 11 and the color conversion unit 12; and, since the material viscosity and fluidity of the bonding layer 13 are greatly affected by the external structure, the orthographic projection area of ​​the second support layer 142 in the direction of the first substrate 15 is set within the above-mentioned size range, so as to ensure that the second support layer 142 in contact with the bonding layer 13 is narrower, so as to achieve the "puncture" effect on the bonding layer, thereby promoting the material flow of the bonding layer 13, and then improving the uniformity of the thickness of the bonding layer 13. Accordingly, the thickness range of the above-mentioned second support layer 142 can be designed according to the thickness range of the above-mentioned support portion 14 and the thickness design range of the first support layer 141.

[0124] It should be noted that the thickness design of the support portion 14 also depends on the impact of light leakage on the severity of color shift.

[0125] Take the light emitting component 1 with a thickness of 1 micron for the laminating layer 13 and a thickness of 1 micron for the supporting part 14 as an example. After multiple actual measurements, the inventors found that when the color deviation data is reduced to 2%, the blue light leakage ratio needs to be reduced to 0.05%. In this case, the thickness of the second supporting layer 142 of the supporting part 14 can be designed to be 0.825 microns, thereby meeting the actual requirement of reducing the color deviation data to 2%.

[0126] In some examples, the thickness of the dam layer 121 in the first direction is defined to be in a range of 1 micrometer to 30 micrometers.

[0127] Furthermore, in some preferred examples, the thickness range of the dam layer 121 in the first direction is limited to 1um to 15um. In such a thickness design method, the thickness range of the optical functional part 122 arranged in the opening area of ​​the dam layer 121 in the first direction can also be 1um to 15um, so as to ensure the color conversion effect of the optical functional part 122 on light, and not make the optical functional part 122 too thick to affect the light transmittance, and can save the material of the optical functional part 122 and achieve the overall thinning effect of the color conversion unit 12.

[0128] In some examples, the light emitting component 1 further includes a dam layer 16. Figure 5 As shown, the dam layer 16 is disposed around the outer periphery of the light emitting unit 11 to block the light emitted from the light emitting unit 11 to the periphery to prevent light leakage from the periphery of the light emitting unit 11 .

[0129] In some examples, such as Figure 6 As shown, the dam layer 16 and the support portion 14 are integrally formed to save process costs. For example, the dam layer 16 and the support portion 14 are formed by a halftone process using the same mask, so that the dam layer 16 and the support portion 14 can be obtained using only one mask.

[0130] For example, Figure 6 As shown, part of the dam layer 16 also surrounds the periphery of the bonding layer 13. Furthermore, since the thickness of the dam layer 16 and the thickness of the light-emitting unit 11 are usually determined, the thickness design of the bonding layer 13 needs to take into account the thickness of the dam layer 16 and the thickness of the light-emitting unit 11; specifically, the bonding layer 13 cannot be too thick so that the dam layer 16 cannot surround the periphery of the light-emitting surface of the light-emitting unit 11. And because the thickness of the bonding layer 13 depends on the thickness of the support portion 14, the thickness of the support portion 14 must be at least 4 microns less than the thickness of the dam layer 16 to avoid affecting the dam layer 16 from blocking the peripheral light leakage of the light-emitting unit 11.

[0131] In some examples, such as Figure 5-7As shown, the dam layer 121 is defined on a side surface close to the first encapsulation layer 123 with a concave-convex portion 1211, and the concave-convex portion 1211 is an uneven surface of the dam layer 121 to avoid total reflection of light when reaching the surface of the dam layer 121, thereby reducing the occurrence of cross-color; the first encapsulation layer 123 is filled with the concave-convex portion 1211 to form an uneven convex morphology on the light-emitting surface of the first encapsulation layer 123 to destroy the waveguide emission of the light at the corresponding position, thereby further reducing the occurrence of cross-color of the light emitted from the waveguide of the encapsulation layer.

[0132] Exemplarily, the concavo-convex portion 1211 includes a plurality of grooves defined on the surface of the dam layer 12 .

[0133] For example, an ashing process may be used to form the plurality of grooves 1211 on a surface of the dam layer 121 that is adjacent to the first encapsulation layer 123 .

[0134] In some examples, such as Figure 8 As shown, the light-emitting component 1 also includes a grating structure 17; the grating structure 17 is arranged on a side of the second semiconductor layer 112 close to the bonding layer, that is, the light-emitting side of the second semiconductor layer 112; the grating structure 17 is configured to adjust the light emitted by the light-emitting unit 11 to be emitted within a preset angle range, thereby further avoiding crosstalk caused by oblique light.

[0135] Exemplarily, the grating structure 17 includes, for example, a grating body and a light-transmitting slit arranged in the grating body; wherein the grating body is, for example, made of the same material as the second semiconductor layer 112; and the light-transmitting slit is filled with an adhesive material that is the same as the material of the bonding layer 13. Specifically, the light-emitting angle of the light-emitting unit 11 can be limited by adjusting the periodic size of the grating body, the height in the thickness direction of the bonding layer, and the width of the light-transmitting slit. Specifically, the preparation method of the above-mentioned grating structure 17 is, for example: a plurality of grooves arranged in parallel are processed on the light-emitting side surface of the second semiconductor layer 112, and the plurality of grooves are used as the light-transmitting slits of the grating structure; a plurality of protrusions arranged in parallel are formed correspondingly between adjacent grooves, and the plurality of protrusions are used as the grating body structure; and, in the process of forming the bonding layer 13, the bonding layer material is filled into the plurality of light-transmitting slits, thereby forming the above-mentioned grating structure 17. Moreover, the grating structure 17 can make the interface between the second semiconductor layer 112 and the bonding layer 13 uneven, thereby reducing the total reflection of light at the interface between the second semiconductor layer 112 and the bonding layer 13 and reducing the risk of light crosstalk in the second semiconductor layer 112.

[0136] As another technical solution, the present disclosure also provides a method for preparing the light emitting component 1, such as Fig.13 As shown, it includes the following steps:

[0137] S1, preparing a support portion 14 on at least one of the light emitting side of the light emitting unit 11 and the light incident side of the color conversion unit 12;

[0138] S2, placing bonding glue on at least one of the light emitting side of the light emitting unit 11 and the light incident side of the color conversion unit 12;

[0139] S3, laminating the light emitting side of the light emitting unit 11 and the light incident side of the color conversion unit 12 to each other, so as to achieve the alignment of the light emitting unit 11 and the color conversion unit 12, and forming a laminating layer 13 with laminating glue.

[0140] Furthermore, in some examples, the following steps are also included before the above step S1:

[0141] S0. The light-emitting unit 11 and the color conversion unit 12 are manufactured separately and independently. After the light-emitting unit 11 and the color conversion unit 12 are formed, the color conversion layer unit and the initial chip wafer unit are aligned and bonded through the bonding layer 13 to form the light-emitting component 1.

[0142] The steps of forming the support portion are described below. As described above, the support portion 14 includes a first support layer 141 and a second support layer 142. Based on this, the support portion 14 has two structures: one is that the parallel projection area of ​​the first support layer 141 of the support portion 14 on the color conversion unit 12 is larger than the parallel projection area of ​​the second support layer 142 on the color conversion unit 12, and the other is that the parallel projection sizes of the first support layer 141 and the second support layer 142 of the support portion 14 on the color conversion unit 12 are consistent.

[0143] Correspondingly, when the support portion 14 is prepared on the light-emitting side of the light-emitting unit 11, if the structure of the support portion 14 is the former, the above step S1 specifically includes:

[0144] S111: forming a second supporting layer 142 with a smaller size on the light-emitting side surface of the light-emitting unit 11, wherein the second supporting layer 142 includes a plurality of supporting units;

[0145] S112: forming a first supporting layer 141 on the second supporting layer 142, wherein the first supporting layer 141 has a plurality of avoidance through holes 143.

[0146] When the support portion 14 is prepared on the light-emitting side of the light-emitting unit 11, if the structure of the support portion 14 is the latter, the above step S1 specifically includes:

[0147] S121: A whole layer of support portion 14 is formed on the light-emitting side surface of the light-emitting unit 11, wherein the support portion 14 has a plurality of avoidance through holes 143.

[0148] When the support portion 14 is prepared on the light incident side of the color conversion unit 12, if the structure of the support portion 14 is the former, the above step S1 specifically includes:

[0149] S131: forming a first supporting layer 141 on the light-emitting side surface of the color conversion unit 12, wherein the first supporting layer 141 has a plurality of avoidance through holes 143;

[0150] S132 : forming a second supporting layer 142 with a smaller size on the first supporting layer 141 , wherein the second supporting layer 142 includes a plurality of supporting units.

[0151] When the support portion 14 is prepared on the light incident side of the color conversion unit 12, if the structure of the support portion 14 is the latter, the above step S1 specifically includes:

[0152] S141: A whole layer of support portion 14 is formed on the light incident side surface of the color conversion unit 12, wherein the support portion 14 has a plurality of avoidance through holes 143.

[0153] Exemplarily, the support structure may be prepared using a half-tone process.

[0154] The steps of forming the bonding layer 13 are described below. If bonding glue is placed on the light emitting unit 11 in the above step S2, the steps of forming the bonding glue layer on the light emitting unit 11 specifically include:

[0155] S211, providing a temporary substrate, and bonding the light emitting unit 11 to the temporary substrate, and the second semiconductor layer 112 is arranged away from the temporary substrate;

[0156] S212, coating an adhesive material layer on the surface of the light emitting unit 11 on the side away from the temporary substrate; that is, coating an adhesive material layer on the surface of the second semiconductor layer 112 on the side away from the temporary substrate;

[0157] Exemplarily, the adhesive material is an organic adhesive material such as epoxy resin, and the adhesive material layer can be formed by a steel screen printing process.

[0158] If a bonding adhesive is placed on the color conversion unit 12 in the above step S2, the step of forming a bonding adhesive layer on the color conversion unit 12 specifically includes:

[0159] S221, providing a temporary substrate, and bonding the color conversion unit 12 to the temporary substrate, and the first encapsulation layer 123 is arranged away from the temporary substrate;

[0160] S222, coating an adhesive material layer on the surface of the light emitting unit 11 on one side away from the temporary substrate; that is, coating an adhesive material layer on the surface of the first encapsulation layer 123 on one side away from the temporary substrate;

[0161] It is understandable that, in the process of preparing the light emitting unit 11, an initial wafer A is usually used for processing, specifically, Fig.14 As shown, the initial wafer A includes a plurality of light emitting units 11 arranged in an array. Fig.15 As shown, during the preparation of the color conversion unit 12, a large plate N including a plurality of color conversion units 12 arranged in an array is usually formed simultaneously. Therefore, before the color conversion unit 12 and the light-emitting unit 11 are aligned, a step of cutting the large plate N of the color conversion unit 12 is also included to form a plurality of initial aligned plates B; specifically, as shown in FIG. Fig.16 As shown, the initial bonded plate B includes a plurality of color conversion units 12 .

[0162] The following describes the steps of aligning the initial wafer A and the initial aligning plate B to finally form a single light-emitting component 1. Specifically,

[0163] S31, aligning the initial wafer A and the initial aligning plate B, so as to bond the initial wafer A and the initial aligning plate B through the adhesive material layer on one of the surfaces;

[0164] It is easy to understand that in order to ensure that the multiple light-emitting units 11 in the initial chip A and the multiple color conversion units 12 in the initial mating plate B can correspond to each other one by one, an initial chip A and an initial mating plate B with consistent unit distribution can be selected, and then in the above step S31, the edges of the initial chip A and the initial mating plate B can be overlapped to make the multiple light-emitting units 11 and the multiple color conversion units 12 correspond to each other one by one.

[0165] S32, removing the temporary substrate;

[0166] For example, the adhesive between the temporary substrate and the initial wafer A or between the temporary substrate and the initial bonding plate B can be debonded by irradiation with ultraviolet light to remove the temporary substrate and the adhesive.

[0167] S33, forming an initial light-emitting component board;

[0168] S35 , cutting the initial light-emitting component plate to obtain individual light-emitting components 1 .

[0169] Exemplarily, the projection of the bonding layer on the multiple light-emitting functional layers in the single light-emitting component 1 obtained after cutting covers the multiple light-emitting functional layers. That is, when the initial wafer A is prepared, the bonding layer therein is provided as a whole layer.

[0170] Exemplarily, the thickness of the first substrate 15 is reduced to 60 microns to 200 microns. The shape of the light-emitting component 1 formed in this way is close to a cube, so that the light-emitting component 1 is placed more firmly and is convenient for use in subsequent processes. Using a thicker initial first substrate 15 during the preparation of the light-emitting unit 11 is convenient for processing the chip structure.

[0171] As another technical solution, the present disclosure further provides a light-emitting chip, which includes the light-emitting component 1 described above.

[0172] As another technical solution, the present disclosure also provides a display device, including the above-mentioned light-emitting chip and a driving substrate; wherein the light-emitting chip array is arranged on the driving substrate; the driving substrate is used to electrically connect to the light-emitting component 1 in the light-emitting chip, and drives the light-emitting component 1 to emit light.

[0173] In some examples, the driving substrate in the display substrate includes a circuit layer, and the circuit layer includes, for example, a plurality of pad groups, and each pad group includes a plurality of pads that are separately arranged. Figure 1 As shown, the first electrode 1112 and the common electrode 113 of each light emitting component 1 are respectively electrically connected to a corresponding pad among the plurality of pads, so that the driving substrate can drive the corresponding light emitting component 1 to emit light, thereby achieving the effect of displaying an image.

[0174] Exemplarily, the display device provided by the embodiments of the present disclosure can be any device that displays whether it is moving (e.g., video) or fixed (e.g., still image) and whether it is text or image. More specifically, it is expected that the embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, cameras, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0175] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A light emitting component, characterized in that: include: A light-emitting unit and a color conversion unit arranged on the light-emitting side of the light-emitting unit; The light-emitting unit includes a light-emitting functional layer, which includes a first electrode, a first semiconductor layer and a light-emitting layer stacked along a first direction; the light-emitting unit also includes a second semiconductor layer, which is arranged on the light-emitting side of the light-emitting functional layer, and the second semiconductor layer includes a connecting portion, which is connected to the light-emitting functional layer; the light-emitting unit also includes a common electrode, which is connected to the second semiconductor layer; The light-emitting component also includes a bonding layer and a support portion located between the light-emitting unit and the color conversion unit, wherein the support portion is arranged in contact with at least one of the color conversion unit and the light-emitting unit, and the bonding layer is arranged in contact with both the color conversion unit and the light-emitting unit.

2. The light emitting assembly according to claim 1, characterized in that: The supporting portion includes a first supporting area and a second supporting area; the first supporting area and the second supporting area are respectively arranged close to two opposite side edges of the light emitting unit.

3. The light emitting assembly according to claim 2, characterized in that: The supporting portion comprises a first supporting layer and a second supporting layer, the first supporting layer is arranged in contact with the color conversion unit, and the second supporting layer is located on a side of the first supporting layer away from the color conversion unit; In the thickness direction of the first supporting layer, a parallel projection area of ​​the first supporting layer on the color conversion unit is larger than a parallel projection area of ​​the second supporting layer on the color conversion unit.

4. The light emitting assembly according to claim 1, characterized in that: The light-emitting component further comprises a first substrate located on a side of the color conversion unit away from the light-emitting unit; the color conversion unit comprises: A defining dam layer, wherein the defining dam layer has a plurality of opening areas; A plurality of optical function parts are located inside the opening area and are arranged one-to-one with the opening area, and at least part of the optical function parts are used to convert the color of light entering the optical function parts; A first encapsulation layer is located on a side of the definition dam layer away from the first substrate.

5. The light emitting assembly according to claim 4, characterized in that: The color conversion unit also includes: a light shielding layer located between the first substrate and the defining dam layer, the light shielding layer comprising a plurality of light through holes, the plurality of opening areas being arranged in one-to-one correspondence with the plurality of light through holes, and an orthographic projection of the light through holes on the first substrate overlapping with an orthographic projection of the opening areas on the first substrate; A filter unit is located between the first substrate and the optical functional part, and the orthographic projection of the filter unit on the first substrate overlaps with the orthographic projection of the corresponding light-through hole on the first substrate; The filter units are arranged in one-to-one correspondence with the optical functional parts, and the orthographic projection of the filter units on the first substrate overlaps with the orthographic projection of the corresponding optical functional parts on the first substrate.

6. The light emitting assembly according to claim 5, characterized in that: The light emitted by the light-emitting functional layer is blue light or ultraviolet light; The optical functional part includes: a first functional part for converting the light emitted by the light emitting functional layer into red light; a second functional part for converting the light emitted by the light emitting functional layer into green light; and a third functional part for converting the light emitted by the light emitting functional layer into blue light or maintaining the blue light state; The plurality of filter units are arranged in one-to-one correspondence with the plurality of light-through holes; The multiple filter units include: a first filter unit arranged corresponding to the first functional part, the first filter unit is a red color block or a red-green-transmitting and blue-reflecting filter film; a second filter unit arranged corresponding to the second functional part, the second filter unit is a green color block or a red-green-transmitting and blue-reflecting filter film; a third filter unit arranged corresponding to the third functional part, the third filter unit is a blue color block or a transparent layer.

7. The light emitting assembly according to claim 4, characterized in that: The light-emitting unit includes a plurality of the light-emitting functional layers, the second semiconductor layer includes an auxiliary portion, at least a portion of the auxiliary portion is located between adjacent connecting portions, the auxiliary portion and the connecting portion are an integral structure, and the common electrode is connected to the auxiliary portion.

8. The light emitting assembly according to claim 7, characterized in that: The support portion includes a support portion body and a plurality of avoidance through holes, wherein the avoidance through holes are arranged in one-to-one correspondence with the light-emitting functional layers so that the light emitted by the light-emitting functional layers enters the opening area through the avoidance through holes; The support body is arranged around the avoidance through hole.

9. The light emitting assembly according to claim 8, characterized in that: The supporting part body comprises a first supporting layer and a second supporting layer, the first supporting layer is arranged in contact with the first packaging layer, and the second supporting layer is located on a side of the first supporting layer away from the first packaging layer; In the thickness direction of the first supporting layer, a parallel projection area of ​​the first supporting layer on the color conversion unit is larger than a parallel projection area of ​​the second supporting layer on the color conversion unit.

10. The light emitting assembly according to claim 8, characterized in that: The auxiliary part includes a first auxiliary part connected to the common electrode, a second auxiliary part located between two adjacent connecting parts or between the connecting part and the first auxiliary part, and a third auxiliary part surrounding the first auxiliary part, the second auxiliary part and the connecting part as a whole; The common electrode comprises a first side and a second side which are arranged opposite to each other, and a third side and a fourth side which are arranged opposite to each other; the first side, the second side, the third side and the fourth side are all located in the third auxiliary portion; The second supporting layer includes a plurality of first supporting units, and the first supporting units are distributed on the first side, the second side, the third side, and the fourth side.

11. The light emitting assembly according to claim 10, characterized in that: The second supporting layer further includes a plurality of second supporting units, and the second supporting units are located at positions corresponding to the first auxiliary part and / or the third auxiliary part.

12. The light emitting assembly according to claim 11, characterized in that: The first supporting unit and the second supporting unit are shaped like at least one of a columnar table and a bar table.

13. The light emitting assembly according to claim 10, characterized in that: The projection shape of the second semiconductor layer on the first substrate is a rectangle; The number of the connecting parts is 3, and the first auxiliary part and the 3 connecting parts are arranged in a 2*2 array.

14. The light emitting assembly according to any one of claims 1 to 13, characterized in that: The thickness of the support portion in the thickness direction of the second semiconductor layer is between 0.5 micrometers and 3 micrometers.

15. The light emitting assembly according to claim 14, characterized in that: The thickness of the first supporting layer in the thickness direction of the second semiconductor layer is less than 2 micrometers.

16. The light emitting assembly according to any one of claims 4 to 13, characterized in that: The opening area includes a first opening surface close to the first substrate and a second opening surface away from the first substrate, and an orthographic projection of the support portion on the first substrate does not overlap with an orthographic projection of the second opening surface on the first substrate.

17. The light emitting assembly according to claims 4-13, characterized in that: Also includes: The dam layer is arranged around the outer periphery of the light-emitting unit to block the light emitted from the light-emitting unit to the periphery.

18. The light emitting assembly according to claim 17, characterized in that: The dam layer and the supporting part are integrally prepared.

19. The light emitting assembly according to claim 4-13, characterized in that: A concavo-convex portion is provided on a surface of the defining dam layer on one side close to the first encapsulation layer. The concavo-convex portion is an uneven surface of the defining dam layer, and the first encapsulation layer fills the concavo-convex portion.

20. The light emitting assembly according to claim 4-13, characterized in that: It also includes a grating structure; the grating structure is arranged on a side of the second semiconductor layer close to the bonding layer.

21. A light-emitting chip, characterized in that: Comprising a light-emitting component as described in any one of claims 1-20.

22. A display device, characterized in that: It comprises the light-emitting chip as claimed in claim 21 and a driving substrate, wherein the light-emitting chip array is arranged on the driving substrate.

23. A method for preparing a light-emitting component, characterized in that: include: preparing a support portion on at least one of a light emitting side of the light emitting unit and a light incident side of the color conversion unit; placing bonding glue on at least one of the light emitting side of the light emitting unit and the light incident side of the color conversion unit; The light emitting side of the light emitting unit and the light incident side of the color conversion unit are bonded to each other to achieve the alignment of the light emitting unit and the color conversion unit, and the bonding adhesive forms a bonding layer.

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