LED light emitting module and method for manufacturing the same

Abstract

The present invention discloses an LED light-emitting module and a method for manufacturing the same, comprising: a first substrate, a second substrate, an LED chip, a driver IC chip, a package and other electronic components, wherein the first substrate is arranged on the second substrate, the LED chip, the driver IC chip and other electronic components are arranged on the first substrate, and the package covers the LED chip, the driver IC chip, other electronic components, the first substrate and the second substrate; the package comprises a white package and a black package, the white package covers the first substrate, and the LED chip, the driver IC chip and other electronic components on the first substrate, and the black package covers the white package, the first substrate and the second substrate. The present invention adopts a package formed by combining black packaging glue with white packaging glue, which effectively reduces the cost while improving the light output effect.

Description

Technical Field

[0001] The present invention relates to the technical field of LED light emitting modules, and in particular to an LED light emitting module and a method for manufacturing the LED light emitting module. Background Art

[0002] In the context of the increasingly widespread application of high-power LED light-emitting modules, the integrated packaging of LED chips and driver IC chips is the future development trend. When packaging traditional high-power LED light-emitting modules, in order to ensure the light effect, all-white EMC plastic packaging shells are generally used. However, due to the large volume of the integrated packaging module, which is hundreds of times the volume of traditional LED lamp beads, the volume of its package body is also correspondingly large. If all white packaging glue is used for packaging, the cost will be greatly increased. If all black plastic packaging glue used in the field of traditional semiconductor devices is used, the light effect of LED will be seriously attenuated. Therefore, as the degree of packaging integration becomes higher and higher, how to effectively reduce costs while ensuring the light effect of LED light-emitting modules is a major problem that continues to be solved. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides an LED light-emitting module and a method for manufacturing the LED light-emitting module, which uses a packaging body formed by combining black packaging glue with white packaging glue to effectively reduce costs while improving light output effects.

[0004] The present invention provides an LED light-emitting module, the LED light-emitting module comprising: a first substrate, a second substrate, an LED chip, a driver IC chip, a packaging body and other electronic components, the first substrate is arranged on the second substrate, the LED chip, the driver IC chip and other electronic components are arranged on the first substrate, and the packaging body covers the LED chip, the driver IC chip, other electronic components, the first substrate and the second substrate;

[0005] The package includes a white package and a black package. The white package covers the first substrate, as well as the LED chip, the driver IC chip and other electronic components on the first substrate. The black package covers the white package, the first substrate and the second substrate.

[0006] Furthermore, a step structure is provided at the junction of the white encapsulation body and the black encapsulation body, and the black encapsulation body is overlapped on the white encapsulation body at the step structure.

[0007] Furthermore, the step structure includes a first step structure and a second step structure, and the height of the first step structure is higher than the height of the second step structure.

[0008] Furthermore, the height of the first step structure ranges from 0.2 mm to 0.5 mm;

[0009] The height of the second step structure ranges from 0.2 mm to 0.5 mm.

[0010] Furthermore, a light-collecting cavity is provided in the white package body, and the light-collecting cavity is provided above the LED chip.

[0011] Furthermore, a plurality of first grooves are provided on the first substrate, and the white package body fills the plurality of first grooves.

[0012] Furthermore, a plurality of second grooves are provided on the second substrate, and the white encapsulation body and / or the black encapsulation body fill the plurality of second grooves.

[0013] Furthermore, a plurality of pins are disposed on the side surface of the second substrate, and the first substrate is connected to the plurality of pins via welding wires.

[0014] Furthermore, the white encapsulation body covers the front surface and four side surfaces of the first substrate, and the black encapsulation body covers the front surface and three side surfaces of the second substrate except the side surface where the pins are arranged.

[0015] Furthermore, a chamfer is provided on the side surface of the black plastic package body, and the inclination angle of the chamfer is 5°-10°.

[0016] Furthermore, a test hole is provided on the packaging body, and the test hole is filled with transparent plastic sealing glue.

[0017] The present invention also provides a method for manufacturing an LED light-emitting module, the method being used to manufacture the above-mentioned LED light-emitting module, the method comprising:

[0018] Placing the LED chip, driver IC chip and other electronic components on the first substrate, and performing die bonding and wire bonding operations;

[0019] welding the first substrate to the second substrate;

[0020] Covering the LED chip, the driver IC chip and other electronic components on the first substrate with white packaging glue to form a white packaging body;

[0021] The white packaging body is coated with black packaging glue to form a black packaging body.

[0022] Furthermore, the step of placing the LED chip, the driver IC chip and other components on the first substrate and performing die bonding and wire bonding operations includes:

[0023] Mounting the LED chip, driver IC chip and other electronic components on the first substrate;

[0024] Perform reflow soldering to solder the LED chip, driver IC chip and other electronic components on the first substrate;

[0025] After soldering is completed, clean the flux set during reflow soldering;

[0026] Performing die bonding and wire bonding on the LED chip and the driver IC chip;

[0027] After the die bonding and wire bonding are completed, plasma cleaning is performed.

[0028] Furthermore, the step of coating the LED chip, the driver IC chip and other electronic components on the first substrate with white packaging glue to form a white packaging body comprises:

[0029] The LED chip, the driver IC chip and other electronic components are encapsulated with white encapsulation glue to form a white encapsulation body and a step structure;

[0030] Performing a pre-curing treatment on the white package body;

[0031] The white package body after the pre-curing treatment is subjected to surface treatment.

[0032] Furthermore, the white packaging glue is used to cover the LED chip, the driver IC chip and other electronic components to form a white package body, which includes:

[0033] A light-collecting cavity is formed above the light-emitting area of ​​the LED chip.

[0034] Furthermore, the step of coating the white encapsulation body with black encapsulation glue to form a black encapsulation body comprises:

[0035] The white package body, the first substrate and the second substrate are coated with black packaging glue, and are superimposed on the step structure to form a black package body;

[0036] Performing a pre-curing treatment on the black package;

[0037] The white package body and the black package body are post-cured.

[0038] The present invention provides an LED light-emitting module and a method for manufacturing the LED light-emitting module. By adopting a secondary plastic packaging process, white packaging glue is used for packaging around the light-emitting area of ​​the LED chip, and black packaging glue is used for packaging outside the white packaging glue. The packaging body formed by the black packaging glue and the white packaging glue can effectively reduce the cost while improving the light output effect. A step structure is provided to strengthen the bonding force between the white packaging body and the black packaging body, and a first groove and a second groove are provided to strengthen the bonding force between the packaging body and the substrate, thereby improving product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a first schematic diagram of the LED light-emitting module structure in the first embodiment of the present invention;

[0040] Figure 2 is a second schematic diagram of the LED light-emitting module structure in the first embodiment of the present invention;

[0041] Figure 3 is a third schematic diagram of the LED light-emitting module structure in the first embodiment of the present invention;

[0042] Figure 4 is a flow chart of a method for manufacturing an LED light-emitting module in Embodiment 2 of the present invention;

[0043] Figure 5 This is a flow chart of the LED light-emitting module in the second embodiment of the present invention for performing chip mounting, welding, die bonding, and wire bonding operations;

[0044] Figure 6 This is a flow chart of forming a white package body by one-time plastic encapsulation in the second embodiment of the present invention;

[0045] Figure 7 This is a flow chart of forming a black package body by secondary plastic packaging in the second embodiment of the present invention. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] In the present invention, it should be understood that terms such as "include" or "have" are intended to indicate the existence of features, numbers, steps, behaviors, components, parts or a combination thereof disclosed in the specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, behaviors, components, parts or a combination thereof exist or are added.

[0048] It should also be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0049] Embodiment 1

[0050] Embodiment 1 of the present invention provides an LED light-emitting module, which includes: a first substrate, a second substrate, an LED chip, a driver IC chip, a packaging body and other electronic components, wherein the first substrate is arranged on the second substrate, the LED chip, the driver IC chip and other electronic components are arranged on the first substrate, and the packaging body covers the LED chip, the driver IC chip, other electronic components, the first substrate and the second substrate.

[0051] In an optional implementation of this embodiment, Figure 1 and Figure 2 As shown, Figure 1 A first schematic diagram of the LED light emitting module structure in the first embodiment of the present invention is shown. Figure 2 A second schematic diagram of the LED light emitting module structure in the first embodiment of the present invention is shown. Figure 1 and Figure 2 As shown, the LED light-emitting module includes a first substrate 1, a second substrate 2, and a package 5. The first substrate 1 is arranged on the second substrate 2, and the package 5 is coated on the first substrate 1 and the second substrate 2. For the convenience of displaying the structure, Figure 2 Compared to Figure 1 The difference is that the package body 5 is made transparent so that the structure inside the package body 5 can be presented.

[0052] In an optional implementation of this embodiment, Figure 3 As shown, Figure 3 A third schematic diagram of the LED light-emitting module structure in the first embodiment of the present invention is shown. Figure 3 It is a side sectional view, in which the package 5 includes a white package 51 and a black package 52, wherein the white package 51 covers the first substrate 1, and the LED chip 2 and the driver IC chip 3 arranged on the first substrate 1, and the black package 52 covers the white package 51, the first substrate 1 and part of the second substrate 2.

[0053] Specifically, the height of the highest point of the black encapsulation body 52 needs to be lower than the height of the highest point of the white encapsulation body 51 , or be flush with each other.

[0054] Furthermore, the black encapsulation body at least covers the white encapsulation body 51 and the first substrate 1 , and may cover a part or all of the second substrate 2 .

[0055] In an optional implementation of this embodiment, a step structure is provided at the junction of the white encapsulation body 51 and the black encapsulation body 52 , and the black encapsulation body 52 is overlapped on the white encapsulation body 51 at the step structure.

[0056] Specifically, Figure 3 As shown, the step structure includes a first step structure 61 and a second step structure 62 , and the relative position height of the first step structure 61 is higher than the relative position height of the second step structure 62 .

[0057] It should be noted that the first step structure and the second step structure are set here so that the black package body is superimposed on the white package body, which can strengthen the bonding strength between the black package body and the white package body and prevent them from falling off. More step structures can be set here according to actual needs, and the number of the step structures is at least two.

[0058] In an optional implementation of this embodiment, the height range of the first step structure 61 is 0.2mm-0.5mm, and the height range of the second step structure 62 is 0.2mm-0.5mm, which can be one or more values ​​of 0.2mm, 0.3mm, 0.4mm, and 0.5mm, and is set according to actual needs.

[0059] In an optional implementation of this embodiment, Figure 1 , 2 As shown in FIG. 3 , a light-gathering cavity 7 is provided in the white package body 51 , and the light-gathering cavity 7 is provided above the LED chip 3 .

[0060] Specifically, the light-focusing cavity 7 may be cylindrical or truncated cone-shaped with a wide top and a narrow bottom. The light-focusing cavity 7 is used to focus the light emitted by the LED chip 3 to improve the light-emitting effect.

[0061] Furthermore, the inner wall of the light-focusing cavity 7 is provided with a reflective material.

[0062] In an optional implementation of this embodiment, Figure 3 As shown, a first groove 81 is provided on the first substrate 1 , and the white encapsulation body 51 fills the first groove 81 .

[0063] Specifically, the first grooves 81 are used to be filled with the white encapsulation body 51 to strengthen the bonding force between the white encapsulation body 51 and the first substrate 1 . The number, length, width and depth of the first grooves 81 are set according to actual needs.

[0064] In an optional implementation of this embodiment, Figure 3As shown, a second groove 82 is provided on the second substrate 2 , wherein the white encapsulation body 51 fills the second groove 82 on the left side, and the white encapsulation body 51 and the black encapsulation body 52 simultaneously fill the second groove 82 on the right side.

[0065] Specifically, the second groove 82 is used to be filled with the white package body 51 and / or the black package body 52 to strengthen the bonding force between the white package body 51 and the second substrate 2, and between the black package body 52 and the second substrate 2. The number, length, width and depth of the second grooves 82 are set according to actual needs.

[0066] In an optional implementation of this embodiment, a plurality of pin pins 21 are disposed on the side of the second substrate 2 , and the first substrate 1 is connected to the plurality of pin pins 21 based on welding wires.

[0067] Specifically, a connection pad is provided on the first substrate 1 , and the bonding wire connects the connection pad and the pin foot 21 .

[0068] In an optional implementation of this embodiment, the LED chip 1 is connected to the connecting pads on the first substrate 1 based on bonding wires.

[0069] In an optional implementation of this embodiment, the white encapsulation body 51 covers the front side and four side surfaces of the first substrate 1 , and the black encapsulation body 52 covers the front side and three side surfaces of the second substrate 2 except the side surface provided with pin pins.

[0070] Specifically, the black encapsulation body 52 also covers a portion of the back surface of the second substrate 2 close to the three side surfaces.

[0071] Furthermore, a corner cut structure is provided on the back side of the second substrate 2 , and the corner cut structure makes the height tolerance of the thickness of the black package body 52 on the back side of the second substrate 2 less than 0.02 mm.

[0072] In this embodiment, the packaging body is fully enclosed on the front side and half-enclosed on the back side, which can fully protect the first substrate and the components on the first substrate.

[0073] In an optional implementation of this embodiment, a chamfer is provided on the side surface of the black plastic package body 52, and the inclination angle of the chamfer is 5°-10°.

[0074] Preferably, the inclination angle of the chamfer is 8°.

[0075] It should be noted that chamfers are provided on the side surfaces of the black plastic package body 52 to facilitate demoulding.

[0076] In an optional implementation of this embodiment, a test hole is provided on the packaging body 5, and the test hole is filled with transparent plastic sealing glue.

[0077] Specifically, the test hole is used to test whether the LED light-emitting module is in a normal working state after packaging.

[0078] In an optional implementation of this embodiment, the first substrate 1 is a ceramic substrate, and the second substrate 2 is a metal substrate.

[0079] Specifically, electrical connection circuits are etched on the first substrate 1 for carrying the LED chip 2, the driver IC chip and other components. The second substrate 2 is used to carry the first substrate 1 and also plays a role in heat dissipation.

[0080] In an optional implementation of this embodiment, white encapsulation glue is used in the white encapsulation body 51, and black encapsulation glue is used in the black encapsulation body 52. ​​Both the white encapsulation glue and the black encapsulation glue are epoxy resin doped with silicon dioxide, and the doping ratios and particle sizes thereof are inconsistent.

[0081] Specifically, the smaller the particle sizes of the white encapsulating adhesive and the black encapsulating adhesive, the better.

[0082] In an optional implementation of this embodiment, the CTE values ​​of the white encapsulation glue and the black encapsulation glue need to be close, and the deviation needs to be ≤3.

[0083] Here, the thermal expansion coefficients of the white encapsulation glue and the black encapsulation glue need to be close or as consistent as possible. If the difference in thermal expansion coefficients between the two is large, the white encapsulation body and the black encapsulation body will peel off, resulting in insufficient bonding strength.

[0084] In an optional implementation of this embodiment, the flow value range of the white packaging glue is 95 cm-120 cm, and the flow value range of the black packaging glue is 75 cm-85 cm, and the flow value range is the flow length per unit time.

[0085] In an optional implementation of this embodiment, the difference in TG values ​​between the white encapsulating glue and the black encapsulating glue needs to be within 10°C. The TG value is the softening temperature at which the encapsulating glue changes from a solid state to a liquid state. At this temperature, the encapsulating glue changes from a brittle and fragile glass state to a soft and elastic rubber state.

[0086] Preferably, the TG value of the white packaging glue is greater than the TG value of the black packaging glue, and the difference is within 10°C.

[0087] Here, several property parameters of the white encapsulation glue and the black encapsulation glue are set to limit the white encapsulation body and the black encapsulation body to ensure better combination.

[0088] It should be noted that in this embodiment, since the price of white packaging glue used for LED light-emitting modules is 5-8 times that of traditional black packaging glue, this embodiment adopts a solution of combining a white packaging body with a black packaging body. Compared with the all-white glue coating solution, the amount of white packaging glue used is reduced by 50%-80%, thereby greatly reducing the packaging cost.

[0089] Furthermore, in this embodiment, the light emitting area of ​​the LED chip uses a white package body packaging solution compared with the traditional full black plastic coating solution, and the comparison of the light effects is shown in Table 1.

[0090] Table 1

[0091]

[0092] It can be seen from the above table that when the LED light-emitting module with serial number 1 is tested, a test current of 1000mA is adopted. When a white package is adopted in the light-emitting area of ​​the LED chip, the luminous efficiency Φ is 82.98lm, and when a black package is adopted in the light-emitting area of ​​the LED chip, the luminous efficiency Φ is 50.65lm, and the luminous efficiency improvement ratio ΔΦ% is 64%. Similarly, for the LED light-emitting modules with serial numbers 2, 3, 4, 5, and 6, when a white package is adopted in the light-emitting area of ​​the LED chip compared with a black package, the luminous efficiency improvement ratio ΔΦ% is 65%, 65%, 62%, 62%, and 53%, respectively, and all have a significant improvement in luminous efficiency.

[0093] In summary, embodiment 1 of the present invention provides an LED light-emitting module, which adopts a secondary plastic packaging process, and uses white packaging glue to encapsulate around the light-emitting area of ​​the LED chip, and uses black packaging glue to encapsulate outside the white packaging glue. The packaging body formed by the black packaging glue and the white packaging glue has lower cost than the all-white glue packaging solution, and better light-emitting effect than the all-black glue packaging solution, which effectively reduces the cost and improves the light-emitting effect; and a step structure is provided to strengthen the bonding force between the white packaging body and the black packaging body, and a first groove and a second groove are provided to strengthen the bonding force between the packaging body and the substrate, thereby improving product reliability.

[0094] Embodiment 2

[0095] Embodiment 2 of the present invention provides a method for manufacturing an LED light-emitting module, which is used to manufacture the LED light-emitting module in Embodiment 1, and comprises: placing the LED chip, driver IC chip and other components on the first substrate, and performing die bonding and wire bonding operations; welding the first substrate to the second substrate; coating the LED chip and driver IC chip of the first substrate with white packaging glue to form a white packaging body; coating the white packaging body with black packaging glue to form a black packaging body.

[0096] In an optional implementation of this embodiment, Figure 4 As shown, Figure 4 The flowchart of the method for manufacturing the LED light-emitting module in the second embodiment of the present invention is shown, and the method comprises the following steps:

[0097] S401, placing the LED chip, driver IC chip and other electronic components on the first substrate, and performing die bonding and wire bonding operations;

[0098] In an optional implementation of this embodiment, Figure 5 As shown, Figure 5 The flowchart of the LED light-emitting module in the second embodiment of the present invention for performing chip mounting, welding, die bonding, and wire bonding operations includes the following steps:

[0099] S501, mounting the LED chip, driver IC chip and other electronic components on the first substrate;

[0100] In an optional implementation of this embodiment, SMT, namely surface mounting technology (SMT), is performed to mount the LED chip, driver IC chip and other electronic components in the LED light-emitting module on the first substrate.

[0101] S502, performing reflow soldering to solder the LED chip, the driver IC chip and other electronic components on the first substrate;

[0102] In an optional implementation of this embodiment, a reflow soldering operation is performed to melt the solder between the LED chip, the driver IC chip and other electronic components and the first substrate through heating and then solder them on the first substrate.

[0103] S503, cleaning the soldering flux set during reflow soldering;

[0104] In an optional implementation of this embodiment, after soldering is completed, the soldering flux disposed between the LED chip, the driver IC chip and other electronic components and the first substrate during reflow soldering is cleaned.

[0105] Specifically, the cleaning includes ultrasonic cleaning and plasma cleaning.

[0106] S504, performing die bonding and wire bonding on the LED chip and the driver IC chip;

[0107] In an optional implementation of this embodiment, the LED chip and the driver IC chip are subjected to die bonding and wire bonding operations, and the electrodes of the LED chip and the driver IC chip are connected to the connection pads of the first substrate based on the bonding wires.

[0108] S505: Perform plasma cleaning.

[0109] In an optional implementation of this embodiment, plasma cleaning is performed after the LED chip and the driver IC chip are die-bonded and wire-bonded.

[0110] S402, welding the first substrate to the second substrate;

[0111] In an optional implementation of this embodiment, the first substrate is welded to the second substrate, and the driver IC chip is connected to the pins of the second substrate based on welding wires.

[0112] S403, coating the LED chip, the driver IC chip and other electronic components on the first substrate with white packaging glue to form a white packaging body;

[0113] In an optional implementation of this embodiment, Figure 6 As shown, Figure 6 The flowchart of forming a white package body by one-time plastic encapsulation in the second embodiment of the present invention is shown, comprising the following steps:

[0114] S601, using white packaging glue to cover the LED chip, driver IC chip and other electronic components to form a white packaging body and a step structure;

[0115] In an optional implementation of this embodiment, white packaging glue is used to cover the LED chip, the driver IC chip and other electronic components to form a white packaging body.

[0116] Specifically, the white encapsulation glue at least surrounds the light emitting area of ​​the LED chip but does not cover the LED chip.

[0117] In an optional implementation of this embodiment, when forming the white package body, a plurality of step structures are formed. The number of the step structures is at least two and can be set according to actual design requirements. In this embodiment, a first step structure and a second step structure are formed.

[0118] In an optional implementation of this embodiment, a light-focusing cavity is formed above the light-emitting area of ​​the LED chip.

[0119] Specifically, when forming the white package body, a light-collecting cavity is formed above the light-emitting area of ​​the LED chip without being filled with white packaging glue, and a reflective material is disposed on the inner wall of the formed light-collecting cavity.

[0120] In an optional implementation of the present embodiment, before formally using white encapsulation glue to form a white encapsulation body, a pre-packaging operation is required, that is, the first mold is sealed empty and not used, and formal packaging is performed in the second mold. This can reduce the adhesion of the lubricating glue on the surface of the white encapsulation glue when the encapsulation mold is subsequently packaged, thereby reducing the waste of white encapsulation glue.

[0121] S602, performing a pre-curing treatment on the white package body;

[0122] In an optional implementation of this embodiment, the white package body is subjected to a pre-curing treatment by heating, and the pre-curing temperature is 150° C.-180° C. and the time is 120S-180S.

[0123] Here, the white package is pre-cured to preliminarily cure the white package, thereby preventing the white package from being mixed with the black package when the black package is subsequently formed, thereby effectively improving the cleanliness of the white package.

[0124] S603, performing surface treatment on the white package body after the pre-curing treatment.

[0125] In an optional implementation of this embodiment, plasma cleaning is performed on the white package body after the pre-curing treatment, which can be used to clean dust, impurities, etc. on the surface of the white package body.

[0126] In an optional implementation of this embodiment, after the surface treatment is completed, the surface roughness of the white package needs to be verified.

[0127] Specifically, when the surface dyne value of the white package is ≥40, it can be considered that the surface roughness of the white package meets the standard.

[0128] Furthermore, the dyne value is an indication of the roughness of the surface of the white package. The larger the dyne value, the higher the roughness. Here, the surface dyne value of the white package needs to be ≥40, so that when a black package is subsequently formed, the surface tension of the contact surface of the white package can be reduced on the step structure, thereby enhancing the bonding strength between the two.

[0129] S404 , coating the white packaging body with black packaging glue to form a black packaging body.

[0130] In an optional implementation of this embodiment, Figure 7 As shown, Figure 7The flowchart of forming a black package body by secondary plastic encapsulation in the second embodiment of the present invention is shown, comprising the following steps:

[0131] S701, using black packaging glue to cover the white packaging body, the first substrate and the second substrate, and superimpose them on the step structure to form a black packaging body;

[0132] In an optional implementation of this embodiment, a black packaging glue is used to cover the white packaging body, the first substrate and the second substrate, and overlapped on the first step structure and the second step structure to form a black packaging body.

[0133] Specifically, when the black encapsulation body is formed to cover the white encapsulation body, the black encapsulation body is overlapped on the white encapsulation body on the step structure. In this embodiment, the black encapsulation body is overlapped on the white encapsulation body on both the first step structure and the second step structure.

[0134] Here, it is considered to form a step structure when forming a white package, and to overlap the black package on the white package on the step structure when forming a black package. Compared with vertical bonding, the bonding force is stronger, which effectively improves product reliability.

[0135] S702, performing a pre-curing treatment on the black package;

[0136] In an optional implementation of this embodiment, the black package body is subjected to a pre-curing treatment by heating, and the pre-curing temperature is 150° C.-180° C. and the time is 120S-180S.

[0137] Here, the black package body is pre-cured to preliminarily cure the black package body to prevent the black package glue from flowing and deforming.

[0138] S703 , performing post-curing treatment on the white package body and the black package body.

[0139] In an optional implementation of this embodiment, the entire package body formed by the white package body and the black package body is subjected to a post-curing treatment by heating, and the post-curing temperature is 150° C.-180° C. and the time is 4 h-6 h.

[0140] Here, the package body is post-cured so that the package body is completely cured and formed.

[0141] In an optional implementation of this embodiment, after the package body is formed, a test hole is formed on the package body, and the packaged LED light-emitting module is tested based on the test hole.

[0142] A test hole is formed here to facilitate testing of the operation of the LED light-emitting module.

[0143] In an optional implementation of this embodiment, after the test is completed, the test hole needs to be insulated and moisture-proofed, and filled with transparent plastic glue to achieve water vapor and electrical isolation at the test hole position, effectively protecting product reliability.

[0144] In summary, embodiment 2 of the present invention provides a method for manufacturing an LED light-emitting module, and the manufacturing method is used to manufacture the LED light-emitting module in embodiment 1. By adopting a secondary plastic packaging process, white packaging glue is used for packaging around the light-emitting area of ​​the LED chip, and black packaging glue is used for packaging outside the white packaging glue. The packaging body formed by the black packaging glue and the white packaging glue can effectively reduce the cost while improving the light output effect; and a step structure is provided to strengthen the bonding force between the white packaging body and the black packaging body, and a first groove and a second groove are provided to strengthen the bonding force between the packaging body and the substrate, thereby improving product reliability.

[0145] A person of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, and the storage medium may include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc.

[0146] In addition, the embodiments of the present invention are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. An LED light-emitting module, characterized in that: The LED light-emitting module comprises: a first substrate, a second substrate, an LED chip, a driver IC chip, a packaging body and other electronic components, wherein the first substrate is arranged on the second substrate, the LED chip, the driver IC chip and other electronic components are arranged on the first substrate, and the packaging body covers the LED chip, the driver IC chip, other electronic components, the first substrate and the second substrate; The package includes a white package and a black package. The white package covers the first substrate, as well as the LED chip, the driver IC chip and other electronic components on the first substrate. The black package covers the white package, the first substrate and the second substrate.

2. The LED light-emitting module according to claim 1, characterized in that: A step structure is provided at the junction of the white encapsulation body and the black encapsulation body, and the black encapsulation body is overlapped on the white encapsulation body at the step structure.

3. The LED light-emitting module according to claim 2, characterized in that: The step structure includes a first step structure and a second step structure, and the first step structure has a higher position height than the second step structure.

4. The LED light-emitting module according to claim 3, characterized in that: The height of the first step structure ranges from 0.2 mm to 0.5 mm; The height of the second step structure ranges from 0.2 mm to 0.5 mm.

5. The LED light-emitting module according to claim 1, characterized in that: A light-collecting cavity is arranged in the white package body, and the light-collecting cavity is arranged above the LED chip.

6. The LED light-emitting module according to claim 1, characterized in that: A plurality of first grooves are arranged on the first substrate, and the white package body fills the plurality of first grooves.

7. The LED light-emitting module according to claim 1, characterized in that: The second substrate is provided with a plurality of second grooves, and the white encapsulation body and / or the black encapsulation body fill the plurality of second grooves.

8. The LED light-emitting module according to claim 1, characterized in that: A plurality of pins are disposed on the side surface of the second substrate, and the first substrate is connected to the plurality of pins via welding wires.

9. The LED light-emitting module according to claim 8, characterized in that: The white encapsulation body covers the front surface and four side surfaces of the first substrate, and the black encapsulation body covers the front surface and three side surfaces of the second substrate except the side surface where the pins are arranged.

10. The LED light-emitting module according to claim 1, characterized in that: The side surface of the black plastic package body is chamfered, and the inclination angle of the chamfer is 5°-10°.

11. The LED light-emitting module according to claim 1, characterized in that: The packaging body is provided with a test hole, and the test hole is filled with transparent plastic sealing glue.

12. A method for manufacturing an LED light-emitting module, characterized in that: The manufacturing method is used to manufacture the LED light-emitting module according to any one of claims 1 to 11, and the method comprises: Placing the LED chip, driver IC chip and other electronic components on the first substrate, and performing die bonding and wire bonding operations; welding the first substrate to the second substrate; Covering the LED chip, the driver IC chip and other electronic components on the first substrate with white packaging glue to form a white packaging body; The white packaging body is coated with black packaging glue to form a black packaging body.

13. The method for manufacturing an LED light-emitting module according to claim 12, characterized in that: The step of placing the LED chip, the driver IC chip and other electronic components on the first substrate and performing die bonding and wire bonding operations includes: Mounting the LED chip, driver IC chip and other electronic components on the first substrate; Perform reflow soldering to solder the LED chip, driver IC chip and other electronic components on the first substrate; After soldering is completed, clean the flux set during reflow soldering; Performing die bonding and wire bonding on the LED chip and the driver IC chip; After the die bonding and wire bonding are completed, plasma cleaning is performed.

14. The method for manufacturing an LED light-emitting module according to claim 12, wherein: The step of coating the LED chip, the driver IC chip and other electronic components on the first substrate with white packaging glue to form a white packaging body comprises: The LED chip, the driver IC chip and other electronic components are encapsulated with white encapsulation glue to form a white encapsulation body and a step structure; Performing a pre-curing treatment on the white package body; The white package body after the pre-curing treatment is subjected to surface treatment.

15. The method for manufacturing an LED light-emitting module according to claim 14, characterized in that: The white packaging glue is used to cover the LED chip, the driver IC chip and other electronic components to form a white packaging body, which includes: A light-collecting cavity is formed above the light-emitting area of ​​the LED chip.

16. The method for manufacturing an LED light-emitting module according to claim 14, characterized in that: The step of coating the white encapsulation body with black encapsulation glue to form the black encapsulation body comprises: The white package body, the first substrate and the second substrate are coated with black packaging glue, and are superimposed on the step structure to form a black package body; Performing a pre-curing treatment on the black package; The white package body and the black package body are post-cured.

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