Warp correction system and manufacturing system

Abstract

A warpage correction system includes a warpage correction device and a relay unit. The warpage correction device corrects warpage of the first molded substrate to manufacture a second molded substrate. The relay unit is disposed between a processing device outside the warpage correction device and the warpage correction device. The processing device processes the second molded substrate. The relay unit includes a first conveyance mechanism that receives the second formed substrate from the warpage correction device and conveys the second formed substrate to the processing device.

Description

Technical Field

[0001] The present invention relates to a warpage correction system and a manufacturing system. Background Art

[0002] Japanese Patent Publication No. 2014-192434 (Patent Document 1) discloses a marking device. The marking device includes a droplet ejection device and a substrate warpage correction device. In the marking device, after the warpage of the substrate is corrected by the substrate warpage correction device, the droplet ejection device marks the substrate (see Patent Document 1).

[0003] Prior art literature

[0004] Patent Document 1: Japanese Patent Publication No. 2014-192434

[0005] The warpage correction device for correcting the warpage of the formed substrate and the processing device for processing the formed substrate after the warpage is corrected are sometimes not integrally configured. In this case, for example, the formed substrate after the warpage is corrected is manually transported from the warpage correction device to the processing device. However, manual transport of the formed substrate is not necessarily efficient. Patent document 1 does not disclose a solution to this problem that occurs when the warpage correction device is independent of the processing device. Summary of the invention

[0006] The present invention is completed to solve this problem, and its purpose is to provide a warping correction system and a manufacturing system including the warping correction system. The warping correction system includes a warping correction device independent of a processing device, which facilitates the transfer of a formed substrate from the warping correction device to the processing device.

[0007] A warping correction system according to one aspect of the present invention includes a warping correction device and a relay unit. The warping correction device corrects the warping of a first formed substrate to manufacture a second formed substrate. The relay unit is arranged between a processing device outside the warping correction device and the warping correction device. The processing device processes the second formed substrate. The relay unit includes a first conveying mechanism that receives the second formed substrate from the warping correction device and conveys the second formed substrate to the processing device.

[0008] A manufacturing system according to another aspect of the present invention includes the above-mentioned warpage correction system and the above-mentioned processing device. The processing device includes a storage unit and a control unit. The storage unit stores the second formed substrate. The second formed substrate transported by the first transport mechanism is stored in the storage unit. The control unit determines whether the second formed substrate can be received in response to the storage state of the second formed substrate in the storage unit.

[0009] Effects of the Invention

[0010] According to the present invention, it is possible to provide a warp correction system including a warp correction device independent of a processing device and facilitating the transfer of a formed substrate from the warp correction device to the processing device, and a manufacturing system including the warp correction system. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 1 is a front view schematically showing a manufacturing system including a warpage correction system.

[0012] Figure 2 It is a perspective view schematically showing a warp correction device.

[0013] Figure 3 It is a top view schematically showing a warp correction device.

[0014] Figure 4 It is a diagram schematically showing a cross section in a state where the lower member and the upper member are closed.

[0015] Figure 5 It is a top view schematically showing the jig.

[0016] Figure 6 It is a front view schematically showing the clamp.

[0017] Figure 7 It is a schematic representation Figure 5 Figure VII-VII section.

[0018] Figure 8 It is a plan view schematically showing the first transport mechanism.

[0019] Fig. 9 It is a schematic representation Figure 8 Figure IX-IX section.

[0020] Fig.10 This is a flowchart showing the conveying operation of the second formed substrate from the warp correcting device to the cutting device.

[0021] Description of Reference Numerals

[0022] 1 manufacturing system; 5 warp correction system; 10 warp correction device; 20 cutting device; 30 relay unit; 100 first storage unit; 101 material box; 110 loading side track unit; 120 heating unit; 121, 131 lower component; 122, 132 upper component; 123, 124 heater; 130 cooling unit; 140 loading side track unit; 150 second conveying mechanism; 151, 154, 157 conveying mechanism; 152, 158 adsorption unit; 160 first control device; 161 first communication unit; 162 first control unit; 200 second control device; 201 second communication unit; 202 The second control unit; 210 the second receiving unit; 220 the angle tube; 300 the first conveying mechanism; 305 the bottom plate; 310 the relay rail; 320 the electric actuator; 321 the pusher; 330 the cover; 340 the first sensor; 341 the second sensor; 350 the clamp; 360 the first positioning component; 361, 371 the shaft; 362 the L-shaped component; 370 the second positioning component; 372 the positioning bolt; 373 the plate-shaped component; 380 the bearing component; 381 the fixing part; 382 the supporting part; C1, C2 the recessed parts; L1 the communication line; S1 the first formed substrate; S2 the second formed substrate; V1 the internal space. DETAILED DESCRIPTION

[0023] Hereinafter, an embodiment of an aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail with reference to the accompanying drawings. In addition, the same reference numerals are given to the same or corresponding parts in the figures, and their descriptions are not repeated. In addition, in order to facilitate understanding, each figure appropriately omits or exaggerates the schematic depiction of an object.

[0024] [1.Structure]

[0025] <1-1. Structure of manufacturing system>

[0026] Figure 1 1 is a front view schematically showing a manufacturing system 1 including a warp correction system 5 according to the present embodiment. In the drawings described in this specification, the X-axis and the Y-axis respectively indicate common directions.

[0027] like Figure 1 As shown, the manufacturing system 1 includes a warp correction system 5 and a cutting device 20. In the manufacturing system 1, a plurality of electronic components are manufactured by correcting the warp of a formed substrate and cutting the formed substrate having the warp corrected.

[0028] In the formed substrate, for example, a semiconductor chip fixed to a metal frame is sealed with resin. In such a formed substrate, warping may occur due to, for example, a difference in the thermal shrinkage rate of the metal frame and the thermal shrinkage rate of the resin. In the warp correction system 5, the warping of the formed substrate is corrected. In this specification, the formed substrate before the warping is corrected is also referred to as a "first formed substrate", and the formed substrate after the warping is corrected is also referred to as a "second formed substrate".

[0029] As an example of a formed substrate, there can be cited a substrate on which a semiconductor chip is fixed or a substrate on which a lead frame is sealed with resin, and a substrate on which a capacitor, a resistor, etc. are sealed with resin. An example of a formed substrate is a BGA (Ball Grid Array) packaging substrate, an LGA (Land Grid Array) packaging substrate, a CSP (Chip Size Package) packaging substrate, an LED (Light Emitting Diode) packaging substrate, and a QFN (Quad Flat No-leaded) packaging substrate.

[0030] The warp correction system 5 includes a warp correction device 10 and a relay unit 30. The warp correction device 10 is configured to correct the warping of the first formed substrate S1 and manufacture the second formed substrate S2. The relay unit 30 is fixed to the warp correction device 10 and includes a first conveying mechanism 300 and a clamp 350. The warp correction device 10 is positioned relative to the cutting device 20 via the clamp 350. The first conveying mechanism 300 is configured to receive the second formed substrate S2 from the warp correction device 10 and convey the received second formed substrate S2 to the cutting device 20.

[0031] That is, the warp correction system 5 is configured to correct the warp of the first formed substrate S1, manufacture the second formed substrate S2, and convey the second formed substrate S2 to the cutting device 20. The second formed substrate S2 conveyed to the cutting device 20 is accommodated in a material box included in the second accommodation portion 210 of the cutting device 20. The warp correction device 10 and the relay unit 30 will be described in detail later.

[0032] The cutting device 20 is configured to separate the second formed substrate S2 into a plurality of electronic components by cutting the second formed substrate S2. In the cutting device 20, for example, the second formed substrate S2 placed on a cutting workbench (not shown) is cut by a rotating blade (not shown). Thus, a plurality of electronic components (cut products) are manufactured.

[0033] It is assumed that the relay unit 30 is not fixed to the warp correction device 10. In this case, there is no mechanism for conveying the second formed substrate S2 manufactured by the warp correction device 10 to the cutting device 20. In this case, for example, the second formed substrate S2 is manually conveyed from the warp correction device 10 to the cutting device 20. However, manual conveyance of the second formed substrate S2 is not necessarily efficient.

[0034] In the warp correction system 5 included in the manufacturing system 1, the first conveying mechanism 300 included in the relay unit 30 receives the second formed substrate S2 from the warp correction device 10, and conveys the received second formed substrate S2 to the cutting device 20. Therefore, according to the warp correction system 5, since the second formed substrate S2 is conveyed from the warp correction device 10 to the cutting device 20 by the first conveying mechanism 300, even if the warp correction device 10 is independent of the cutting device 20, the second formed substrate S2 can be easily conveyed to the cutting device 20.

[0035] The warp correction device 10 includes a first control device 160. The first control device 160 includes a first communication section 161 and a first control section 162.

[0036] The first communication unit 161 is configured to communicate with the second communication unit 201 (described later) included in the disconnecting device 20, for example, through the communication line L1. It is noteworthy that the first communication unit 161 does not necessarily have to communicate with the second communication unit 201 through the communication line L1, and can also communicate with the second communication unit 201 through wireless communication. In addition, the information communicated between the first communication unit 161 and the second communication unit 201 includes not only the signal described later, but also error information in the warping correction device 10 or the cutting device 20, size information of the object (first formed substrate S1) input to the warping correction device 10, condition information such as the heating time and the cooling time in the warping correction device 10, size information of the cutting object (second formed substrate S2) input to the cutting device 20, and processing condition information such as the cutting conditions in the cutting device 20. At least part of the information.

[0037] The first control unit 162 includes, for example, a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory). The first control unit 162 is configured to control the components in the warp correction device 10 and the relay unit 30 in response to information processing. The first control unit 162 controls the first conveying mechanism 300 based on the information acquired by the first communication unit 161, for example.

[0038] The cutting device 20 includes a second control device 200 . The second control device 200 includes a second communication unit 201 and a second control unit 202 .

[0039] The second communication unit 201 is configured to communicate with the first communication unit 161 included in the warp correction device 10 through the communication line L1. It should be noted that the second communication unit 201 does not necessarily need to communicate with the first communication unit 161 through the communication line L1, but may communicate with the first communication unit 161 through wireless communication.

[0040] The second control unit 202 includes, for example, a CPU, a RAM, and a ROM. The second control unit 202 is configured to control each component in the cutting device 20 in response to information processing. The second control unit 202 controls, for example, the second communication unit 201 to transmit information to the warp correction device 10 .

[0041] In the warp correction system 5, when preparations for conveying the second formed substrate S2 to the cutting device 20 are completed, a signal requesting reception of the second formed substrate S2 (hereinafter, also referred to as a "receiving request signal") is sent from the first communication unit 161 to the second communication unit 201. When there is enough free space in the material box contained in the second storage unit 210, a signal indicating that the second formed substrate S2 can be received (hereinafter referred to as a "receiving signal") is sent from the second communication unit 201 to the first communication unit 161. In response to receiving the receiving signal by the first communication unit 161, the first conveying mechanism 300 conveys the second formed substrate S2 to the cutting device 20.

[0042] Thus, in the manufacturing system 1, the second formed substrate S2 is conveyed from the warp correction device 10 to the cutting device 20 in consideration of the free space of the magazine included in the second receiving portion 210. Therefore, according to the manufacturing system 1, the second formed substrate S2 can be conveyed from the warp correction device 10 to the cutting device 20 at an appropriate timing. The operation of conveying the second formed substrate S2 from the warp correction device 10 to the cutting device 20 will be described in detail later.

[0043] <1-2. Structure of the warpage correction device>

[0044] Figure 2 1 is a perspective view schematically showing the warp correction device 10 according to the present embodiment. Figure 3 2 is a top view schematically showing the warpage correction device 10. Figure 2 and Figure 3 The warp correction device 10 is configured to correct the warp of the first formed substrate S1 and manufacture the second formed substrate S2.

[0045] The warping correction device 10 includes a first accommodating portion 100, an inlet rail portion 110, a heating portion 120, a cooling portion 130, an outlet rail portion 140, and a second conveying mechanism 150. The second conveying mechanism 150 includes conveying mechanisms 151, 154, and 157. In addition, in the present embodiment, a structure is adopted in which a plurality of (specifically, two) first formed substrates S1 are processed at one time in the heating portion 120 and the cooling portion 130, respectively. However, a structure in which one first formed substrate S1 or more than three first formed substrates S1 are processed at one time in the heating portion 120 and the cooling portion 130, respectively, may also be adopted. In addition, Figure 2 In the figure, the second conveying mechanism 150 is omitted.

[0046] The first storage unit 100 includes, for example, a plurality of magazines 101 . The magazines 101 store a plurality of first formed substrates S1 . The first formed substrates S1 stored in the magazines 101 are supplied to the carry-in rail unit 110 .

[0047] The first formed substrate S1 supplied to the carrying-in side rail unit 110 is transported from the carrying-in side rail unit 110 to the heating unit 120 by the transport mechanism 151. The transport mechanism 151 includes, for example, a plurality of (for example, two) adsorption units 152. Each adsorption unit 152 holds the first formed substrate S1 by adsorbing one first formed substrate S1. The transport mechanism 151 holds a plurality of first formed substrates S1 by, for example, sequentially adsorbing the first formed substrates S1 sequentially supplied to the carrying-in side rail unit 110.

[0048] The heating unit 120 includes a lower member 121 and an upper member 122. The lower member 121 and the upper member 122 include heaters, respectively. The lower member 121 and the upper member 122 are opposite to each other in the up-down direction. A plurality of (e.g., two) first formed substrates S1 are arranged on the lower member 121. The lower member 121 is configured to rise and fall. As the lower member 121 rises, a portion of the upper surface of the lower member 121 (specifically, the peripheral upper surface) contacts the lower surface of the upper member 122, and the lower member 121 and the upper member 122 overlap.

[0049] Figure 4 1 is a diagram schematically showing a cross section of the lower member 121 and the upper member 122 in a closed state. Figure 4 As shown, by forming each recess C1 of the lower member 121 into a state closed by the upper member 122, a plurality of (two) rectangular parallelepiped internal spaces V1 are formed in the heating unit 120. Each internal space V1 is, for example, a closed space. Here, a closed space refers to a sealed space. In addition, the internal space V1 does not necessarily have to be a sealed space. The internal space V1, for example, can be a space surrounded by a recess that can accommodate the first formed substrate S1 and a cover that covers at least a portion of the recess.

[0050] The first formed substrate S1 is disposed in each of the plurality of internal spaces V1. Figure 4 The first formed substrate S1 is configured in such a manner that the black portion of the resin (black portion) is located on the lower side (the substrate portion is located on the upper side), but the first formed substrate S1 may be configured in such a manner that the resin portion is located on the upper side (the substrate portion is located on the lower side). The height H1 of each internal space V1 is, for example, longer than the thickness of the first formed substrate S1 in a state without warping. The first formed substrate S1 does not contact the upper member 122 and is not pressurized by the upper member 122, except in the case where excessive warping occurs. Therefore, in the state where the lower member 121 and the upper member 122 are closed, no force greater than necessary is applied to the first formed substrate S1.

[0051] When the lower member 121 and the upper member 122 are closed, the heaters 124 and 123 are located above and below the internal space V1, respectively. The internal space V1 is heated by the heaters 124 and 123. In addition, the first molded substrate S1 disposed in the internal space V1 is heated by the heaters 124 and 123. The resin portion of the first molded substrate S1 is softened by the heating.

[0052] The time for heating the first formed substrate S1 in the internal space V1 is, for example, the time required for the temperature of the internal space V1 to stabilize and substantially uniformly heat the entire area of ​​the first formed substrate S1. In addition, in order to keep the internal space V1 warm, the lower part 121 and the upper part 122 are closed except when the first formed substrate S1 is moved into the heating unit 120 and when the first formed substrate S1 is moved out of the heating unit 120.

[0053] In the warp correction device 10, the first formed substrate S1 is heated while being arranged in the internal space V1 of the heating unit 120. Therefore, according to the warp correction device 10, the heating efficiency of the first formed substrate S1 can be improved, for example, compared with the case where the upper part of the heating unit 120 is completely open. In addition, according to the warp correction device 10, since no force more than necessary is applied to the first formed substrate S1 when the first formed substrate S1 is heated, the possibility of damage to the first formed substrate S1 can be reduced.

[0054] In addition, in the warp correction device 10, the internal space V1 is formed in the closed state of the lower member 121 and the upper member 122. Therefore, according to the warp correction device 10, by releasing the closed state of the lower member 121 and the upper member 122, the first formed substrate S1 can be easily placed in the internal space V1 and taken out from the internal space V1.

[0055] In addition, according to the warping correction device 10, since the first formed substrate S1 is arranged in the recess C1, for example, when the lower component 121 is raised so that the lower component 121 and the upper component 122 overlap with each other, the possibility of the first formed substrate S1 deviating in the horizontal direction when the lower component 121 is raised or lowered can be reduced.

[0056] Refer again Figure 2 and Figure 3 The heated first formed substrate S1 is transported from the heating unit 120 to the cooling unit 130 by the transport mechanism 154. The transport mechanism 154 does not adsorb the first formed substrate S1, but mechanically holds the first formed substrate S1. This is to avoid leaving adsorption marks that may be generated by adsorbing and holding the resin portion of the heated and softened first formed substrate S1.

[0057] The cooling unit 130 includes a lower member 131 and an upper member 132. The lower member 131 and the upper member 132 each include a portion of a tubular flow path (not shown) in which a low-temperature heat medium supplied by a cooler circulates. The lower member 131 and the upper member 132 are opposed to each other in the up-down direction. A plurality of (for example, two) first formed substrates S1 are arranged on the lower member 131. The lower member 131 is configured to rise and fall. As the lower member 131 rises, the upper surface of the first formed substrate S1 arranged on the lower member 131 contacts the lower surface of the upper member 132, and the lower member 131 and the upper member 132 overlap with the first formed substrate S1 sandwiched therebetween. The first formed substrate S1 is pressurized by the lower member 131 and the upper member 132 in the state where the lower member 131 and the upper member 132 overlap in this manner. The first formed substrate S1 is cooled by the cooling unit 130 in the state where the lower member 131 and the upper member 132 are pressurized. Thus, the warping of the first formed substrate S1 is corrected, and the second formed substrate S2 is manufactured.

[0058] The second formed substrate S2 manufactured by cooling in the cooling unit 130 is transported from the cooling unit 130 to the carrying-out side rail unit 140 by the transport mechanism 157. The transport mechanism 157 includes, for example, a plurality of (for example, two) adsorption units 158. Each adsorption unit 158 ​​holds the second formed substrate S2 by adsorbing the second formed substrate S2. The transport mechanism 157 holds a plurality of second formed substrates S2 by, for example, sequentially adsorbing the second formed substrates S2 disposed on the lower member 131 of the cooling unit 130. The second formed substrate S2 transported to the carrying-out side rail unit 140 is carried out to the first transport mechanism 300 of the relay unit 30.

[0059] <1-3. Structure of relay unit>

[0060] As described above, the relay unit 30 includes the first conveying mechanism 300 and the clamp 350. First, the structure of the clamp 350 will be described, and then the structure of the first conveying mechanism 300 will be described.

[0061] Figure 5 3 is a top view schematically showing the jig 350 . Figure 6 It is a front view schematically showing the jig 350 . Figure 7 It is a schematic representation Figure 5 As described above, the warpage correction device 10 is positioned relative to the cutting device 20 via the fixture 350. Figure 6 and Figure 7 In the figure, the casters of the cutting device 20 or the legs of the supporting device are respectively indicated by dotted lines.

[0062] Reference Figure 5 , Figure 6 and Figure 7 The fixture 350 includes a first positioning member 360 , a second positioning member 370 and a bearing member 380 . The first positioning member 360 and the second positioning member 370 are respectively fixed to the warpage correction device 10 . On the other hand, the bearing member 380 is fixed to the cutting device 20 .

[0063] The first positioning member 360 is fixed by bolts to the lower end of the end on the side of the cutting device 20 in the X-axis direction and one end in the Y-axis direction (the front end of the warping correction device 10) in the warping correction device 10. The first positioning member 360 includes a shaft 361 and an L-shaped member 362. The shaft 361 is a rod-shaped member extending along the X-axis direction. The L-shaped member 362 includes two surfaces orthogonal to each other, and one surface is fixed to the warping correction device 10 by bolts. The shaft 361 is fixed to the other surface. That is, the shaft 361 is fixed to the warping correction device 10 via the L-shaped member 362.

[0064] The second positioning member 370 is fixed by bolts to the lower end of the end on one side of the cutting device 20 in the X-axis direction and the other end in the Y-axis direction (the rear end of the warping correction device 10) in the warping correction device 10. The second positioning member 370 includes a shaft 371, a positioning bolt 372, and a plate-like member 373. The shaft 371 is a rod-shaped member extending along the X-axis direction. The positioning bolt 372 is mounted on the front end of the shaft 371 and is configured to be telescopic relative to the shaft 371 in the X-axis direction. The plate-like member 373 is fixed to the warping correction device 10 by bolts, and the shaft 371 is fixed to the plate-like member 373. That is, the shaft 371 and the positioning bolt 372 are fixed to the warping correction device 10 via the plate-like member 373, respectively.

[0065] The bearing member 380 includes a fixing portion 381 and a supporting portion 382. The fixing portion 381 has a shape extending along the X-axis direction and is fixed to the angle tube 220 of the cutting device 20 by bolts. The fixing portion 381 has three surfaces respectively facing the upper surface and both side surfaces of the angle tube 220 extending along the X-axis direction. The fixing portion 381 is fixed to the angle tube 220 by bolts in a state where the three surfaces are respectively facing the upper surface and both side surfaces of the angle tube 220.

[0066] The support portion 382 is fixed to the lower end of the fixing portion 381. The support portion 382 has a shape extending along the X-axis direction. In the support portion 382, ​​a recess C2 is formed at the end on one side of the warping correction device 10. The front end of the shaft 361 is embedded in the recess C2. Thus, the position of the warping correction device 10 relative to the cutting device 20 in each direction of the X-axis direction and the Y-axis direction is determined.

[0067] In addition, when the front end of the shaft 361 is inserted into the recess C2, the position of the warping correction device 10 in the rotation direction with the front end of the shaft 361 as the rotation center is determined by adjusting the extension state of the positioning bolt 372. In this way, the first positioning member 360 and the second positioning member 370 are not fixed to the cutting device 20. In this embodiment, the extension state of the positioning bolt 372 is adjusted so that the warping correction device 10 and the cutting device 20 are parallel.

[0068] Figure 8 It is a plan view schematically showing the first transport mechanism 300 . Fig. 9 It is a schematic representation Figure 8 Figure IX-IX section.

[0069] Reference Figure 8 and Fig. 9 The first conveying mechanism 300 includes a bottom plate 305, a pair of relay rails 310, a pusher 321, an electric actuator 320, a first sensor 340 and a second sensor 341. The bottom plate 305 is a plate-shaped component extending along the X-axis direction. The pair of relay rails 310, the electric actuator 320 and the first sensor 340 are respectively fixed to the bottom plate 305.

[0070] The pair of relay rails 310 extends along the X-axis direction and is arranged on the extension line of the discharge-side rail portion 140 of the warpage correction device 10. The front end of the pair of relay rails 310 on the cutting device 20 side is located near the second receiving portion 210 of the cutting device 20. The second formed substrate S2 manufactured in the warpage correction device 10 is conveyed from the discharge-side rail portion 140 to the pair of relay rails 310. The second formed substrate S2 is conveyed to the approximately central portion of the pair of relay rails 310 in the X-axis direction by, for example, a pusher (not shown) that conveys the second formed substrate S2 placed on the discharge-side rail portion 140 in the X-axis direction.

[0071] The pusher 321 is configured to move along the X-axis direction to convey the second formed substrate S2 placed on the relay rail 310 . The pusher 321 is attached to the electric actuator 320 .

[0072] The electric actuator 320 extends along the X-axis direction, and includes, for example, a ball screw, a motor driving the ball screw, and a linear guide rail (all not shown). The base of the pusher 321 is fixed to the moving part that moves along the X-axis direction by driving the ball screw. That is, the pusher 321 moves in the X-axis direction as the motor included in the electric actuator 320 is driven. The pusher 321 transports the second formed substrate S2 and accommodates the second formed substrate S2 in the material box included in the second accommodating part 210.

[0073] The first sensor 340 is disposed, for example, near the boundary between the unloading rail section 140 and the pair of relay rails 310. The first sensor 340 is configured to detect that the second formed substrate S2 is transferred from the warp correction device 10 to the first conveying mechanism 300. The detection signal of the first sensor 340 is transmitted to the first control unit 162 of the warp correction device 10.

[0074] The second sensor 341 is disposed near the end of the pair of relay rails 310 on the cutting device 20 side. The second sensor 341 is configured to detect that the second formed substrate S2 is transferred from the first conveying mechanism 300 to the second storage unit 210 of the cutting device 20. The detection signal of the second sensor 341 is sent to the first control unit 162 of the warpage correction device 10.

[0075] In the first conveying mechanism 300, the upper part is covered by a cover 330. The cover 330 is made of, for example, acrylic. For example, a pair of relay rails 310, a pusher 321, and an electric actuator 320 are arranged in a space surrounded by a base plate 305 and a cover 330. Specifically, the relay part 30 is arranged on the base plate 305 relative to the warping correction device 10 and the cutting device 20 which are arranged parallel to each other by the clamp 350, so that the pair of relay rails 310 of the first conveying mechanism 300 are connected in parallel to the carrying-out side rail part 140 of the warping correction device 10, and are connected to the position of the second accommodating part 210 where the cutting device 20 can be arranged. In this way, the first conveying mechanism 300 is not fixed to the cutting device 20.

[0076] [2.Action]

[0077] Fig.101 is a flowchart showing the operation of conveying the second formed substrate S2 from the warp correction device 10 to the cutting device 20. The process shown in the flowchart on the left is executed by the first control unit 162 of the warp correction device 10 after the first sensor 340 detects that the second formed substrate S2 has passed. The process shown in the flowchart on the right is executed by the second control unit 202 of the cutting device 20.

[0078] Reference Fig.10 , the first control unit 162 controls the first communication unit 161 to send a reception request signal to the cutting device 20 (step S100). The first control unit 162 determines whether a reception-enabled signal is received from the cutting device 20 through the first communication unit 161 (step S110). If it is determined that the reception-enabled signal is not received ("No" in step S110), the first control unit 162 waits until the reception-enabled signal is received.

[0079] On the other hand, if it is determined that the receiving signal is received ("Yes" in step S110), the first control unit 162 controls the electric actuator 320 to start conveying the second formed substrate S2 placed on the pair of relay rails 310 to the cutting device 20 (step S120). Thus, the pusher 321 starts conveying the second formed substrate S2.

[0080] The first control unit 162 determines whether a detection signal is received from the second sensor 341 via the first communication unit 161 (step S130). If it is determined that a detection signal is not received from the second sensor 341 (No in step S130), the first control unit 162 waits until a detection signal is received from the second sensor 341.

[0081] On the other hand, if it is determined that a detection signal is received from the second sensor 341 ("Yes" in step S130), the first control unit 162 controls the first communication unit 161 to send a signal indicating that the conveyance of the second formed substrate S2 to the cutting device 20 is completed (hereinafter also referred to as "conveying completion signal") (step S140). Thus, the conveyance of the second formed substrate S2 to the material box contained in the second receiving unit 210 of the cutting device 20 is completed.

[0082] Reference Fig.10 , the second control unit 202 determines whether a reception request signal is received from the warpage correction device 10 through the second communication unit 201 (step S200). If it is determined that the reception request signal is not received ("No" in step S200), the second control unit 202 waits until the reception request signal is received.

[0083] On the other hand, if it is determined that the reception request signal is received ("Yes" in step S200), the second control unit 202 determines whether there is a predetermined free space in any of the plurality of magazines included in the second receiving unit 210 (step S210). In addition, the predetermined free space is a predetermined space, which may be a space capable of accommodating one second formed substrate S2 or a space capable of accommodating a plurality of second formed substrates S2.

[0084] If it is determined that there is no predetermined free space in any of the magazines ("No" in step S210), the second control unit 202 waits until there is a predetermined free space in the magazine. In parallel with the process shown in the flowchart, the cutting device 20 performs a process of taking out the second formed substrate S2 from the second receiving section 210 and cutting the second formed substrate S2. By taking out the second formed substrate S2 from the second receiving section 210, the free space of the magazine contained in the second receiving section 210 becomes larger.

[0085] On the other hand, if it is determined in step S210 that there is a predetermined free space in any of the plurality of magazines ("Yes" in step S210), the second control unit 202 controls the second receiving unit 210 so that the magazine having the predetermined free space reaches the receiving position of the second formed substrate S2 (step S220). Then, the second control unit 202 controls the second communication unit 201 to send a receiving signal to the warpage correction device 10 (step S230).

[0086] The second control unit 202 determines whether a transport completion signal is received from the warp correction device 10 via the second communication unit 201 (step S240). If it is determined that the transport completion signal is not received (No in step S240), the second control unit 202 waits until the transport completion signal is received.

[0087] On the other hand, if it is determined that the conveyance completion signal is received ("Yes" in step S240), the process shown in the flowchart ends. Thus, the conveyance of the second formed substrate S2 to the material box included in the second receiving section 210 of the cutting device 20 is completed, and the second control section 202 can recognize that the conveyance of the second formed substrate S2 is completed.

[0088] In the warp correction system 5, in response to the first sensor 340 detecting the reception of the second formed substrate S2, a reception request signal is sent to the cutting device 20. Therefore, according to the warp correction system 5, since a signal requesting reception of the second formed substrate S2 is sent to the cutting device 20 before the second formed substrate S2 is conveyed to the cutting device 20, it is possible to convey the second formed substrate S2 in response to the status of the cutting device 20.

[0089] In addition, in the warpage correction system 5, in response to the first communication unit 161 receiving the reception-enabled signal from the cutting device 20, the first conveying mechanism 300 conveys the second formed substrate S2 to the cutting device 20. Therefore, according to the warpage correction system 5, since the second formed substrate S2 is conveyed after receiving the reception-enabled signal, the second formed substrate S2 can be conveyed to the cutting device 20 at an appropriate timing.

[0090] In addition, in the warpage correction system 5, in response to the second sensor 341 detecting the conveyance of the second formed substrate S2, a conveyance completion signal is sent to the cutting device 20. Therefore, according to the warpage correction system 5, the cutting device 20 can recognize that the conveyance of the second formed substrate S2 to the cutting device 20 is completed.

[0091] In addition, in the manufacturing system 1, it is determined whether the second formed substrate S2 can be received by the cutting device 20 in response to the storage state of the second formed substrate S2 in the second storage section 210 (the state of the free space in the magazine). Therefore, according to the manufacturing system 1, it is possible to appropriately determine whether the second formed substrate S2 can be received in the cutting device 20.

[0092] [3. Features]

[0093] As described above, in the warp correction system 5, the first conveying mechanism 300 included in the relay unit 30 receives the second formed substrate S2 from the warp correction device 10, and conveys the received second formed substrate S2 to the cutting device 20. Therefore, according to the warp correction system 5, since the second formed substrate S2 is conveyed from the warp correction device 10 to the cutting device 20 by the first conveying mechanism 300, even if the warp correction device 10 is independent of the cutting device 20, the second formed substrate S2 can be easily conveyed to the cutting device 20.

[0094] In addition, the warp correction system 5 is an example of the “warp correction system” in the present invention. The warp correction device 10 is an example of the “warp correction device” in the present invention, the relay unit 30 is an example of the “relay unit” in the present invention, and the first conveying mechanism 300 is an example of the “first conveying mechanism” in the present invention. The first control unit 162 is an example of the “first control unit” in the present invention, and the first communication unit 161 is an example of the “communication unit” in the present invention. The first sensor 340 is an example of the “first sensor” in the present invention, and the second sensor 341 is an example of the “second sensor” in the present invention. The pair of relay rails 310 is an example of the “pair of rails” in the present invention, and the pusher 321 is an example of the “conveying component” in the present invention.

[0095] The first receiving section 100 is an example of the "first receiving section" in the present invention, the heating section 120 is an example of the "heating section" in the present invention, and the cooling section 130 is an example of the "cooling section" in the present invention. The second conveying mechanism 150 is an example of the "second conveying mechanism" in the present invention. The second receiving section 210 is an example of the "second receiving section" in the present invention. The cutting device 20 is an example of the "processing device" in the present invention. The manufacturing system 1 is an example of the "manufacturing system" in the present invention.

[0096] [4. Other embodiments]

[0097] The concept of the above-described embodiment is not limited to the above-described embodiment. Hereinafter, an example of another embodiment to which the concept of the above-described embodiment can be applied will be described.

[0098] <4-1>

[0099] In the above embodiment, only one first conveying mechanism 300 is provided between the warp correction device 10 and the cutting device 20. However, the number of the first conveying mechanisms 300 is not limited thereto. For example, a plurality of first conveying mechanisms 300 may be provided between the warp correction device 10 and the cutting device 20. For example, a plurality of first conveying mechanisms 300 may be arranged in a manner that a plurality of first conveying mechanisms 300 are arranged in the Y-axis direction, or a plurality of first conveying mechanisms 300 may be arranged in a manner that a plurality of first conveying mechanisms 300 are arranged in the height direction. Thus, a plurality of second formed substrates S2 can be conveyed in parallel from the warp correction device 10 to the cutting device 20.

[0100] <4-2>

[0101] In the above embodiment, the second formed substrate S2 is transported from the warp correction device 10 to the cutting device 20. However, the transport destination of the second formed substrate S2 is not limited thereto. The second formed substrate S2 may be transported to, for example, a grinder that grinds the surface of the second formed substrate S2 or a laser marker that marks the surface of the second formed substrate S2. That is, the transport destination of the second formed substrate S2 may be a processing device that processes the second formed substrate S2.

[0102] <4-3>

[0103] In the above embodiment, the warpage amount of the second formed substrate S2 conveyed to the unloading side rail part 140 may also be measured. For example, a measuring unit for measuring the warpage of the second formed substrate S2 may also be provided near the unloading side rail part 140 to measure the warpage amount of the second formed substrate S2. The measuring unit may be constituted by, for example, a laser displacement meter. The laser displacement meter may move along the long side or short side direction of the second formed substrate S2 to measure the warpage amount of the second formed substrate S2. For example, it may also be configured such that: when the warpage amount of the second formed substrate S2 is less than the allowable value, the second formed substrate S2 is conveyed to the relay part 30, and when the warpage amount of the second formed substrate S2 exceeds the allowable value, the second formed substrate S2 is not conveyed to the relay part 30. For example, when the unloading side rail part 140 extends to the first receiving part 100 and the warpage amount of the second formed substrate S2 exceeds the allowable value, the second formed substrate S2 may be accommodated in the material box contained in the first receiving part 100.

[0104] The above is an exemplary description of the embodiments of the present invention. That is, the detailed description and the drawings are disclosed for the purpose of exemplary description. Therefore, the components described in the detailed description and the drawings may include components that are not necessary for solving the problem. Therefore, these non-essential components should not be directly regarded as necessary just because they are described in the detailed description and the drawings.

[0105] In addition, the above-mentioned embodiment is merely an example of the present invention in all aspects. The above-mentioned embodiment can be variously improved and changed within the scope of the present invention. That is, when implementing the present invention, a specific structure can be appropriately adopted corresponding to the embodiment.

[0106] [Note]

[0107] In this specification, various technical ideas including at least the following technologies are disclosed.

[0108] <Technique 1>

[0109] (constitute)

[0110] A warpage correction system comprising:

[0111] a warpage correction device for correcting the warpage of the first formed substrate to produce a second formed substrate; and

[0112] a relay unit disposed between a processing device outside the warp correction device and the warp correction device,

[0113] The processing device processes the second formed substrate.

[0114] The relay unit includes a first conveying mechanism that receives the second formed substrate from the warp correction device and conveys the received second formed substrate to the processing device.

[0115] (Effects, etc.)

[0116] In the warp correction system, the first conveying mechanism included in the relay unit receives the second formed substrate from the warp correction device and conveys the received second formed substrate to the processing device. Therefore, according to the warp correction system, since the second formed substrate is conveyed from the warp correction device to the processing device by the first conveying mechanism, even if the warp correction device is independent of the processing device, the second formed substrate can be easily conveyed to the processing device.

[0117] <Technique 2>

[0118] (constitute)

[0119] The warping correction system according to technique 1, wherein:

[0120] The warpage correction system further comprises:

[0121] A first control unit controls the first conveying mechanism; and

[0122] The first communication unit communicates with the processing device.

[0123] (Effects, etc.)

[0124] According to the warp correction system, since the second formed substrate is conveyed from the warp correction device to the processing device through the first conveying mechanism based on the use of the first control unit and the first communication unit, even if the warp correction device is independent of the processing device, the second formed substrate can be easily conveyed to the processing device.

[0125] <Technique 3>

[0126] (constitute)

[0127] The warping correction system according to technique 2, wherein:

[0128] The relay unit further includes a first sensor for detecting receipt of the second formed substrate from the warpage correction device,

[0129] The first control unit controls the first communication unit to transmit a signal requesting reception of the second formed substrate to the processing device in response to the first sensor detecting reception of the second formed substrate.

[0130] (Effects, etc.)

[0131] In the warpage correction system, in response to the first sensor detecting the reception of the second formed substrate, a signal requesting the processing device to receive the second formed substrate is sent. Therefore, according to the warpage correction system, since the signal requesting the reception of the second formed substrate is sent to the processing device before the second formed substrate is transported to the processing device, the second formed substrate can be transported in response to the status of the processing device.

[0132] <Technique 4>

[0133] (constitute)

[0134] The warpage correction system according to technique 2 or technique 3, wherein:

[0135] The first control unit controls the first conveying mechanism to convey the second formed substrate to the processing device in response to the first communication unit receiving a signal indicating that the second formed substrate can be received from the processing device.

[0136] (Effects, etc.)

[0137] In the warp correction system, in response to the first communication unit receiving a signal indicating that the second formed substrate can be received from the processing device, the first conveying mechanism conveys the second formed substrate to the processing device. Therefore, according to the warp correction system, since the second formed substrate is conveyed after receiving the signal indicating that the second formed substrate can be received, the second formed substrate can be conveyed to the processing device at an appropriate timing.

[0138] <Technique 5>

[0139] (constitute)

[0140] A warping correction system according to any one of Techniques 2 to 4, wherein:

[0141] The relay unit further includes a second sensor for detecting that the second formed substrate is conveyed to the processing device.

[0142] In response to the second sensor detecting the conveyance of the second formed substrate, the first control unit controls the first communication unit to transmit a signal indicating that conveyance of the second formed substrate to the processing device is completed to the processing device.

[0143] (Effects, etc.)

[0144] In the warpage correction system, in response to the second sensor detecting the conveyance of the second formed substrate, a signal indicating that the conveyance of the second formed substrate to the processing device has been completed is sent to the processing device. Therefore, according to the warpage correction system, the processing device can recognize that the conveyance of the second formed substrate to the processing device has been completed.

[0145] <Technique 5-2>

[0146] (constitute)

[0147] A warping correction system according to any one of Techniques 1 to 5, wherein:

[0148] The first conveying mechanism comprises:

[0149] a pair of rails for mounting the second formed substrate; and

[0150] The transporting member transports the second formed substrate placed on the pair of rails.

[0151] (Effects, etc.)

[0152] In the warp correction system, the second formed substrate received from the warp correction device is placed on a pair of rails, and the conveying member conveys the second formed substrate placed on the pair of rails to the processing device. Therefore, according to the warp correction system, since the second formed substrate is conveyed from the warp correction device to the processing device by the first conveying mechanism, even if the warp correction device is independent of the processing device, the second formed substrate can be easily conveyed to the processing device.

[0153] <Technique 6>

[0154] (constitute)

[0155] A warping correction system according to any one of Techniques 1 to 5, wherein:

[0156] The warping correction device comprises:

[0157] A first receiving portion for receiving the first formed substrate;

[0158] a heating unit, heating the first formed substrate;

[0159] a cooling unit that cools the first formed substrate while the first formed substrate is pressurized; and

[0160] The second conveying mechanism conveys the first formed substrate supplied from the first storage unit to the heating unit, and conveys the first formed substrate heated by the heating unit to the cooling unit.

[0161] The heating section heats the first formed substrate in a state where the first formed substrate is arranged in an internal space formed in the heating section.

[0162] (Effects, etc.)

[0163] In the warp correction device included in the warp correction system, the first formed substrate is heated while being arranged in the internal space of the heating unit. Therefore, according to the warp correction system, for example, the heating efficiency of the first formed substrate can be improved compared with the case where the upper part of the heating unit is completely open. In addition, according to the warp correction system, since a force greater than necessary is not applied to the first formed substrate when the first formed substrate is heated, the possibility of damage to the first formed substrate can be reduced.

[0164] <Technique 7>

[0165] (constitute)

[0166] The warpage correction system according to technique 6, wherein:

[0167] The length of the internal space in the height direction is longer than the length of the first formed substrate in the height direction in a state where no warping occurs.

[0168] (Effects, etc.)

[0169] According to this warp correction system, since the length of the internal space of the heating unit in the height direction is greater than the thickness of the first formed substrate in a non-warped state, it is possible to prevent a situation in which a force greater than necessary is applied to the first formed substrate when heating the first formed substrate.

[0170] <Technique 8>

[0171] (constitute)

[0172] A warping correction system according to any one of Techniques 1 to 7, wherein:

[0173] The processing device includes a second receiving portion for receiving the second formed substrate.

[0174] The second formed substrate transported by the first transport mechanism is accommodated in the second accommodation portion.

[0175] (Effects, etc.)

[0176] In the warp correction system, the second formed substrate transported by the first transport mechanism is accommodated in the second accommodation section. Therefore, according to the warp correction system, since the second formed substrate is transported from the warp correction device to the processing device by the first transport mechanism and the second formed substrate is accommodated in the second accommodation section, even if the warp correction device is independent of the processing device, the second formed substrate can be easily accommodated in the second accommodation section.

[0177] <Technique 9>

[0178] (constitute)

[0179] A manufacturing system comprising:

[0180] The warpage correction system according to technique 8; and

[0181] The processing device,

[0182] The processing apparatus further includes a second control unit configured to determine whether the second formed substrate can be received in response to a storage state of the second formed substrate in the second storage unit.

[0183] (Effects, etc.)

[0184] In this manufacturing system, whether the second formed substrate can be received by the processing device is determined in response to the storage state of the second formed substrate in the second storage section. Therefore, according to this manufacturing system, it is possible to appropriately determine whether the second formed substrate can be received by the processing device.

[0185] <Technique 10>

[0186] (constitute)

[0187] A manufacturing system according to technique 9, wherein:

[0188] The processing device further includes a second communication unit that communicates with the warpage correction system,

[0189] When determining that the second formed substrate can be received, the second control unit controls the second communication unit to transmit a signal indicating that the second formed substrate can be received to the warp correction system.

[0190] (Effects, etc.)

[0191] In this manufacturing system, when it is determined that the processing device can receive the second formed substrate, a signal indicating that the second formed substrate can be received (receivable signal) is sent from the processing device to the warpage correction system. Therefore, according to this manufacturing system, the second formed substrate can be transported from the warpage correction system to the processing device only when the processing device can receive the second formed substrate.

Claims

1. A warpage correction system comprising: a warpage correction device for correcting the warpage of the first formed substrate to produce a second formed substrate; and a relay unit disposed between a processing device outside the warp correction device and the warp correction device, The processing device processes the second formed substrate. The relay unit includes a first conveying mechanism that receives the second formed substrate from the warp correction device and conveys the received second formed substrate to the processing device.

2. The warpage correction system according to claim 1, wherein: The warpage correction system further comprises: A first control unit controls the first conveying mechanism; and The first communication unit communicates with the processing device.

3. The warpage correction system according to claim 2, wherein: The relay unit further includes a first sensor for detecting receipt of the second formed substrate from the warpage correction device, The first control unit controls the first communication unit to transmit a signal requesting reception of the second formed substrate to the processing device in response to the first sensor detecting reception of the second formed substrate.

4. The warpage correction system according to claim 2 or claim 3, wherein: The first control unit controls the first conveying mechanism to convey the second formed substrate to the processing device in response to the first communication unit receiving a signal indicating that the second formed substrate can be received from the processing device.

5. The warpage correction system according to any one of claims 2 to 4, wherein: The relay unit further includes a second sensor for detecting that the second formed substrate is conveyed to the processing device. In response to the second sensor detecting the conveyance of the second formed substrate, the first control unit controls the first communication unit to transmit a signal indicating that conveyance of the second formed substrate to the processing device is completed to the processing device.

6. The warpage correction system according to any one of claims 1 to 5, wherein: The warping correction device comprises: A first receiving portion for receiving the first formed substrate; A heating unit, heating the first formed substrate; a cooling unit for cooling the first formed substrate while pressurizing the first formed substrate; and The second conveying mechanism conveys the first formed substrate supplied from the first storage unit to the heating unit, and conveys the first formed substrate heated by the heating unit to the cooling unit. The heating section heats the first formed substrate in a state where the first formed substrate is arranged in an internal space formed in the heating section.

7. The warpage correction system according to claim 6, wherein: The length of the internal space in the height direction is longer than the length of the first formed substrate in the height direction in a state where no warping occurs.

8. The warpage correction system according to any one of claims 1 to 7, wherein: The processing device includes a second receiving portion for receiving the second formed substrate. The second formed substrate transported by the first transport mechanism is accommodated in the second accommodation portion.

9. A manufacturing system comprising: The warpage correction system according to claim 8; and The processing device, The processing apparatus further includes a second control unit configured to determine whether the second formed substrate can be received in response to a storage state of the second formed substrate in the second storage unit.

10. The manufacturing system according to claim 9, wherein: The processing device further includes a second communication unit that communicates with the warpage correction system, When determining that the second formed substrate can be received, the second control unit controls the second communication unit to transmit a signal indicating that the second formed substrate can be received to the warp correction system.

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